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Metodología
El siguiente plan de trabajo será implementado para alcanzar los objetivos específicos
descritos en la sección 1.3. El plan de trabajo está dividido en tareas y subtareas (T), hitos
(H) y entregables (E).
Se realizará un análisis general del estado del arte de los centros de datos basados en
FPGAs para la aceleración de servicios y reducción del consumo energético, dicho
estudio permitirá determinar los requerimientos a ser cubiertos por el nodo a ser diseñado
en este proyecto. Esta tarea se divide en las siguientes subtareas:
E1.1. Revisión del estado de la tecnología de los centros de datos basados en FPGAs
para la aceleración de servicios y reducción del consumo eléctrico.
T2.2. Definición del algoritmo para el nodo de aceleración KVS de alto rendimiento.
Basados en los resultados de las simulaciones realizadas en la tarea T2.1, se
seleccionará el algoritmo más apropiado para el nodo de aceleración, teniendo como
criterios de selección la eficiencia energética y el rendimiento (% de aceleración).
Se revisarán los diferentes flujos de datos presentes en los servidores KVS para su
posterior caracterización y modelado de forma tal que se pueda evaluar las
características del nodo en diferentes contextos de datos.
T3.2. Modelado y simulación de los diferentes flujos de datos. Una vez se han
caracterizado los diferentes flujos de datos se realiza el modelado del mismo en
Matlab/Simulink de manera que se puedan simular diferentes situaciones o contextos de
datos de los servidores KVS y así poder determinar y comprobar el funcionamiento del
nodo en presencia de diferentes flujos de información.
E3.2. Reporte comparativo entre los flujos de datos modelados (simulación) y los flujos de
datos reales.
zcu106: https://www.xilinx.com/products/boards-and-kits/zcu106.html
https://www.xilinx.com/products/boards-and-kits/1-qvqxu5.html
https://www.xilinx.com/products/boards-and-kits/1-5of5cm.html
https://www.xilinx.com/products/boards-and-kits/1-1177caw.html
T4.3. Simulation of topologies and selected devices, and performance analysis. The
model developed in T2.1, T2.2, T4.1 and T4.2 will be completed with the model of the
devices characterized in T3.3 and T3.4, as well as with the control and modulation
strategies studied in T4.1 and T4.2. The resulting model will be simulated in
Matlab/Simulink to verify that the requirements set by a standard vehicle are met.
H4.1. Model of the multiphase system, including a reliable model of the motor.
H4.4. Novel fault tolerant control algorithms for multiphase drive systems.
E4.1. Simulation models of propulsion systems having modulation and control solutions.
TAREA 5: Análisis y simulación de las diferentes interfaces de lógica reconfigurable
en nodos aceleradores de hardware.
T6.1.2 Esquemático
T6.2.1 Fabricación del PCB en una empresa especializada que cumpla con las
especificaciones requeridas
T6.3 Validación HW
- Power ok
- Memorias ok
- Líneas de alta velocidad ok
Parallel to the development of the converter, the integral design of each firing board will be
addressed, i.e. the interface between the control board and the power module. Because of
the higher switching frequencies, SiC- and GaN-based driver boards are different from
their conventional counterparts aimed at Si-based IGBTs. These differences make it
necessary to particularize the design, which will be done as follows:
T6.1. Analysis of the driver topologies of power semiconductors. This subtask will
analyze the various driver topologies, bearing in mind aspects as: a) Protections:
protections against overvoltages and overcurrents caused by parasitic elements present in
the circuits will be analyzed; then, it will be studied whether to incorporate external
protections (in addition to the built-in internal protections already present). b) Dead-time:
The ability of the driver to introduce a dead time in order to have to incorporate or not an
additional external circuit that takes care of it will be considered. c) Isolation: Depending on
the application specifications, the required isolation between high-voltage and low-voltage
zones will be taken into account. d) Number of channels: some drivers are able to fire just
one device, whereas other drivers can fire two or even three. e) Output current: it may be
necessary to incorporate current-amplifying stages that guarantee the fast switching of the
devices, thus avoiding excessive switching losses.
T6.3. Simulation and design of protection systems. This subtask will perform
simulations of the protection circuits, such as "desaturation protection", "active Miller
clamping", "active clamping", "gate clamping", etc. These protections will be merged with
those that are likely to be already present in the selected drivers (UVLO, overtemperature,
suppressor of glitches produced by electromagnetic noise, etc.). The simulation will
consider the semiconductors themselves, operating frequencies, parasitic effects of the
converter, etc. The protection systems will be designed according to the simulation results
obtained.
T6.4. Component selection for the driver stage. Considering the requirements of each
firing stage, the following components will be selected: a) Isolated drivers (as a function of
the switching frequency of the application, propagation times, consumption, output current
values, power per modulation period to be delivered to the semiconductor gates, intrinsic
protections of the integrated circuit, etc.); b) Isolated DC / DC sources; c) Fault-processing
circuits; d) Ancillary circuitry for dead-time generation (if the topology of the converter so
requires); e) Design of auxiliary circuitry for the correct operation of the input supplies of
isolated DC / DC sources, drivers, etc. so that the semiconductors operate in safe
switching zones and out of the linear area; e) Design of auxiliary circuitry for the
acquisition of voltage, current and temperature values provided by the respective sensors.
T6.5. Design, manufacturing and validation of printed circuit boards. In the design of
power modules, the printed circuit board (PCB) constitutes a critical element from four
perspectives: electrical, thermal, electromagnetic and reliability. The characteristics
imposed in this type of electronic design makes it necessary to thoroughly study and
model the PCB, so that all such four aspects can be evaluated and traded off. From an
electrical point of view, not only must the electrical connectivity be guaranteed, but the
model must also provide accurate information on the introduced parasitic elements
(capacitive and inductive), effects such as irregular current density distribution, e.g. skin
effect, and others. Then, the generated PCB model will also make it possible to determine
the thermal and electromagnetic behavior of the circuit. Finally, it is important to point out
that the required manufacturing processes will not be standard yet, since the techniques
and materials involved differ from those of normal consumer electronics, and are critical in
the reliability of the design. Therefore, an exhaustive study of such processes is required,
which will influence the design solutions adopted.
H6.1. Design, manufacturing and validation of a specific driver board aimed at WBG
devices.
E6.2. Simulation model of the power module and driver PCB set using ADS.