Universidad Autónoma de Nuevo León

Facultad de Ingeniería Mecánica y Eléctrica

Proyecto de electrónica digital

Samuel Abdiel Villeda Balderas

1866411

Semestre Agosto-diciembre

Catedrático Alejandro Pérez González

Cd. Universitaria, octubre 15 del 2022

 INTRODUCCION

Este proyecto que es el PIA tratara de una alarma de incendio, que beneficia a
quien la tenga ya que avisa si hay fuego, es un aparato preventivo, en este
proyecto se mostrara la realización de este su simulación como estará compuesto
y así, estar compuesto por compuertas, leds, pines etc… también se dará a
conocer en que se puede aplicar.

APLICACIÓN
Esta alarma de incendios se puede aplicar en distintos lugares como lo es una
bodega, un restaurant, locales, centros comerciales etcétera..., y se puede
modificar en distintas maneras, en este momento se explicará el como se diseño
este proyecto que contiene dos compuertas lógicas una and y otro or.
El circuito de control para una alarma contra incendios tendrá las siguientes
características tiene la opción de ser activada de forma manual desde un
interruptor el cual siempre dispara la alarma son esos interruptores que vemos en
algunos edificios que si uno lo oprime inmediatamente se dispara la alarma sin
que ningún otro sensor esté activado también este sistema contraincendios
adicionalmente tiene un sensor de humo y uno de temperatura los cuales disparan
para la alarma solo si los dos están accionados, que ocurre yo no puedo disparar
la alarma contra incendios si sólo estoy detectando a uno ya que puede ser una
falsa alarma sólo porque alguien está fumando, o tampoco puedo disparar si solo
se ve una alta temperatura ya que puede ser un día muy caluroso el lugar donde
este pues caluroso o el calor se centre ahí, puede ser una falla del sistema aire
acondicionado que regula la temperatura de adentro pero realmente no hay un
incendio así que en el diseño debe tener en cuenta que disparó la alarma sólo si
los sensores de humo y temperatura están activados, al mismo tiempo o si alguien
manualmente active el interruptor de contra incendios, si llega a estar en un
restaurante que suelen ser lugares donde es más probable un incendio ya que se
utiliza el fuego pues obvio a medidas de prevención pero nos centraremos en las
alarma, si el humo llegara a escaparse de la cocina la alarma no se accionaria ya
que pues solo es el humo de la cocina, también la alarma debe estar un poco
retirada de lo que es la cocina o mas que nada el detector, porque?, ya que al
estar trabajando con fuego, pues este genera calor y la temperatura sube, eso
ocasionaría una falsa alarma por temperatura entonces tendría que estar un poco
alejado de la cocina aunque pues tampoco es viable un detector normal aunque
sin ningún problema se puede poner, lo mas viable seria una alarma solamente
manual, para evitar falsas alarmas, también tomando encuenta que se debe poner
a una altura prudente ya que siempre hay niños curiosos que intentaran activarla,
ya sea para hacerse el gracioso o simple curiosidad, también teniendo en cuenta
que debe estar en un lugar estratégico, se podrían conectar varias alarmas
simultaneas, ya sea en la caja otro obviamente en la cocina, en un muro donde los
meseros o comensales lo puedan activar etcétera. Ya por ultimo pues existe
también la posibilidad de calibrar lo que son los sensores en una cocina para que
ya a cierta temperatura pues se accionen.
Bueno para terminar esto también esta abierto a mejoras ya se a agregando
funciones como comandos de voz para ciertas personas a cargo, una alarma por
medio del celular, ya sea que la alarma emita el sonido y una narración que les
vaya indicando a las personas por donde pueden retirarse, su salida de
emergencia más cercana etc.
Aquí podemos apreciar un diagrama de una cafetería y donde van ubicadas las
alarmas contra incendios, salida de emergencia, extintores etc.

Este circuito esta optimizado con compuertas lógicas y trataremos de optimizarlo

lo más posible para no ocupar tantas compuertas eso lo veremos en el circuito y
así al momento de hacerlo en físico sea más fácil el armado y el costo sea bajo.
Para este proyecto utilizamos dos compuertas que serán la:
Compuerta AND 7408

Compuerta OR 7432
DIAGRAMA DEL CIRCUITO

CIRCUITO
Lo primero que hice es ver cuantas variables voy a tener A B C Z
Tengo lo que es la variable A que será la alarma manual, 0 0 0 0
después tengo la variable B que es la de humo, después 0 0 1 0
tengo una variable C que es la de temperatura, tengo que 0 1 0 0
las combinaciones que se pueden realizar son la 2^3, que 0 1 1 1
me da un total de 8 combinaciones la cuales son las que 1 0 0 1
se muestran en la tabla y la Z seria la alarma activada 1 0 1 1
Tenemos que el interruptor manual siempre dispara la 1 1 0 1
alarma entonces tenemos que la salida del interruptor 1 1 1 1
manual siempre tiene que estar en 1
Después tenemos los sensores de humo y temperatura
así, donde la alarma solo se accionaria si los 2 están activados, entonces si mi A,
B, C están en ceros no se acciona la alarma, si lo se acciona el de temperatura no
seria posible ya que no cumple la condición de que estén accionados los 2 y seria
igual con el de humo si solo esta accionado el de humo pasaría como 0 ya que no
cumple la condición de que estén accionados los 2, después tenemos que si el de
humo y temperatura están accionados la alarma se accionaria ya que si cumple la
condición de esta y así que daría mi tabla.
Dando como resultado que cuando mis salidas estén en 0 no se tomaría en cuenta
y solo se tomaría en cuanta las salidas de 1 y veremos si están activados o
desactivados los sensores, si están en 0 cero se negaría y si esta en uno pasa
directo.
Así que tenemos que de la fila 4 a la 8 se tomarían en cuenta para sacar nuestra
ecuación para programarlo con compuertas lógicas
Tenemos que nuestra fila 4 seria= A negada por B directa por C directa
Nuestra fila 5 seria= A directa por B negada por C negada
Nuestra fila 6 seria= A directa por B negada por C directa
Nuestra fila 7 seria= A directa por B directa por C negada
Nuestra fila 8 seria= A directa por B directa por C directa
Quedando nuestra ecuación de la siguiente manera

Z= A.B.C+ A.B.C+ A.B.C+ A.B.C+ A.B.C

Al realizar este proyecto empezamos con la tabla de verdad para poder realizarlo
Este es el circuito de la ecuación que sacamos conforme a lo que queríamos
realizado
Donde se muestra activando la alarma manual

aquí se muestra activando la de humo, donde no activa la alarma

Aquí se muestra activando la de temperatura, donde no activa la alarma

Y por ultimo se muestra activando la de temperatura y humo, donde se dispara la

alarma
Después podemos aplicar algebra Booleana para simplificarlo
Quedando como:

Z= A.B.C+ A

Aquí veremos a la activación manual, donde se dispara la alarma

Después vemos como activamos la de humo y no activa la alarma

después vemos como activamos la de temperatura y no activa la alarma

Después se ve como se activa la de humo y temperatura, donde se activa la
alarma

Después de veo que se puede simplificar mas con lo que es mapas de Karnaugh
Utilizando la tabla que tenemos
Empezamos realizando el mapa de Karnaugh que quedaría
de la sig. Manera
A B C Z
0 0 0 0 AB
0 0 1 0 00 01 11 10
0 1 0 0 C
0 1 1 1
1 0 0 1 0 0 0 1 1
1 0 1 1
1 1 0 1
1 1 1 1 1 0 1 1 1
Entonces utilizando la tabla de verdad pasamos el resultado cuando haya dado 1
Tenemos la fila 4 que dice AB= 0, C=1, entonces en el mapa de Karnaugh se
pondría un 1, yo lo entendí como tipo coordenadas, claro esta que no es así, pero
yo así me refiero en un concepto mas local
Después en la fila 5 dice que AB=10, C=0, entonces se agrega el 1
Después en la fila 6 dice que AB=10, C=1, entonces se agrega el 1
Después en la fila 7 dice que AB=11, C=0, entonces se agrega el 1
Después en la fila 8 dice que AB=11, C=1, entonces se agrega el 1
Y en los que nos dio 0 identificamos igual y lo agregamos
Antes de sacar la ecuación reducida agrupamos los en grupos mas grandes que
encuentre en cuadro adyacente, deben corresponder elevado a la n, entonces
seria 2^n=1, 2, 4,
Entonces empezamos formando un grupo de 2 que encerré en color rojo y
después formamos un grupo de 4 reutilizando uno que ya tengo que encerré en
verde

Entonces la ecuación
quedaría de la siguiente
manera
En el primer grupo de rojo
debemos ver que variables
permanecen igual entonces
vemos que C=1 en el grupo
encerrado en rojo la variable
no cambia entonces
bajaríamos C, después en lo
encerrado en verde vemos
que la A=0 y después
cambia a 1 así que la
desechamos, entonces por ahora quedaría Z=BC, después se le agrega la suma y
cambiamos de grupo de color verde hacemos lo mismo vemos que la variable C=1
en la parte inferior si da 1 y en cambio en la parte superior si cambia así que se
desecha, después tenemos que la variable esta en 1 y cambia 0 por consecuencia
se desecha, y la variable a esta en 1 y no cambia así que bajaría a la ecuación,
donde la ecuación quedaría de la siguiente manera:

Z=BC+A
Entonces el circuito quedaría de la siguiente manera:

Después se muestra donde la alarma manual esta encendida

Después activamos la de humo y la alarma no se activa

Después activamos la de temperatura y la alarma no se activa

Después activamos la de humo y temperatura, donde la alarma al cumplir la

condición se activa

Aquí damos por terminado el como se creo el circuito de esta alarma de incendio
donde claro siempre hay lugar para mejoras, ya sea una alarma por aplicación de
celular, agregarle sonido dando indicaciones a las personas por donde y como
deben evacuar, que el control sea más practico etc. También se debe prever
varias cosas como el mantenimiento de estas, ya sea de la activación manual que
está en las paredes para que no se active sola por desgaste y se baje solo el
interruptor o hacerlo un poco más dura para que la fuerza promedio no pueda
bajarla, también con un interruptor de voz donde podeos activar la alarma manual,
claro dando reconocimiento de voz de distintas personas seleccionadas y distintas
maneras que se le pueden agregar o mejorar.
También aquí hay un ejemplo en MultiSIM del circuito
Aquí tenemos que al activar la alarma manual se activa la alarma

Aquí tenemos que al activar el sensor de humo no se activa la alarma

Aquí tenemos que al activar el sensor de temperatura no se activa la alarma

Después aquí tenemos que, al activar el sensor de humo y temperatura, se activa

la alarma

Todo esto es el circuito en MultiSIM

SIMULACION
Simulación del proyecto
Ahí vemos el cómo se armó, pues empezamos colocando los leds y colocando un
cableado a cada uno de ellos desde la parte positiva donde pasan mis 5V a la
parte positiva del led que es la patita larga después debajo de cada led
conectamos el Push button entrando por una patita para que salga de la patita
contraria del que se conectó, después de agregar el Push button a cada led,
agregamos lo que son la 3 resistencia, 1 para cada Push button a la tierra, antes
de cablear todo agregamos las compuertas and y or que faltan y el led, agregamos
las compuerta and a la misma altura de los interruptores cableando la pata 14 a
los 5 VCC y la pata 7 a la tierra como se muestra en la tabla de esta compuerta
que podemos observar a continuación:

Después a la misma altura conectamos nuestra compuerta or y la cableamos

como la and a los 5 VCC en la pata 14 y en la 7 a tierra

Después de que se conecto colocamos la resistencia saliendo de la pata 3 a la

pata positiva del led que se coloca saliendo del or unos 3 espacios hacia la
derecha donde la pata negativa se conecta a la tierra
Después de haber conectado todos mis componentes cableamos todo, empiezo
cableando pos encimita de la resistencia de la alama manual a la pata 1 de la
compuerta or, después cableamos el segundo Push button a la pata 1 de la
compuerta AND, después del tercer Push button a la pata 2 de la compuerta AND,
después cableamos la salida de la AND que seria en la pata 3 a la pata 2 de la
compuerta or, después la ultima resistencia se agrega a de la pata 3 de la
compuerta or hacia afuera donde se conecta la LED de la pata positiva en la
resistencia y la patita negativa la tierra y ya quedaría listo nuestro circuito y así
queda en la simulación:

Aquí se aprecia como al accionar el botón de humo no se dispara la alarma de

incendio y así evitar una falsa alarma

Aquí se aprecia como al accionar el botón de temperatura no se dispara la alarma

de incendio y así evitar una falsa alarma

Al momento que se acciona los dos botones que son de humo y temperatura se
puede observar que se dispara la alarma de incendio
Simulación del proyecto donde se aprecia que al presionar el botón de la alarma
manual se dispara la alarma

TABLA DE DATOS DE COMPONENTES

COMPONENTE VOLTAJE ESPECFICACION
2 led verde Voltaje de 1,6V • Diámetro de la cápsula:
VDC 5mm.
Se componen por: • Color de la cápsula:
Led de humo Verde.
Led de • Consumo de corriene:
temperatura 15mA.

Led azul Voltaje de 3,2V a • Corriente: 20 mA

4V • Milicandelas: 4900
Se compone • Longitud de
como: onda: 475nm
Alarma encendida
• Angulo: 20 ~ 30°

led rojo Voltaje de 2V a • Longitud de onda:

2.4V 630 nm
se compone por: • Corriente: 20 mA
Activación de • Milicandelas: 120
alarma manual • Ángulo de visión: 45 °
• Voltaje en directo
(típico): 2V
• Temperatura de
soldadura: <
260°C/<5s

Push button Voltaje 120 • Funciona como

VDC/ 200 VAC contacto
Se compone por: normalmente
S1 Manual abierto (NA).
S2 Temperatura • Infinito número de
S3 Humo aplicaciones.
• Aguanta hasta 50
A.
• Tamaño muy
reducido.
• 4 pines amigables
para usar en el
protoboard.

4 resistencias de Voltaje de 0,25w ±5% • Resistencias de

1 Kohm 300v
metal con una
precisión de +-5%
Se componen por: de tolerancia.
R1
• Potencia
R2
R3 nominal: 1/4 W
R4 • Máxima tensión
nominal: 300 V
• Resistencia: 1K
Ohm

U1 Voltaje de • Numero de circuitos:

Compuerta AND alimentación: 4
NUMERO: 4,75VDC a • Rango de
SN74LS08N 5.25VDC temperatura de
operación segura:
0ºC ~ 70ºC
• Rango de
temperatura de
almacenamiento: -
65ºC ~ 150ºC
• Encapsulado: 14DIP

U2 Voltaje de o Tipo de la lógica:

Compuerta OR alimentación: Puerta OR
NUMERO: 4,75 VDC a o Salida de corriente: 8
SN74LS32N 5,25 VDC mA
o N º de Entradas: 2
o Rango temperatura de
funcionamiento: 0 ° C
a +70 ° C
o Tipo de familia: LS
o Encapsulado DIP
o 14 pines

DATASHET DE CADA COMPONENTE

 TLDR5800
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Vishay Semiconductors
High Intensity LED, Ø 5 mm Clear Package
FEATURES
• Exceptional brightness
(IVtyp = 2500 mcd at IF = 20 mA)
• Narrow viewing angle (ϕ = ± 4°)
• Low forward voltage
• 5 mm (T-1¾") clear package
• Very high intensity even at low drive currents
19223 • Deep red color
• Categorized for luminous intensity
DESCRIPTION
• Outstanding material efficiency
This LED contains the double heterojunction (DH) GaAlAs on
GaAs technology. • Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
This deep red LED can be utilized over a wide range of drive
current. It can be DC or pulse driven to achieve desired light
APPLICATIONS
output.
• Bright ambient lighting conditions
A clear 5 mm package is used to provide an extremely high
light intensity of more than 2000 mcd at a very narrow • Battery powered equipment
viewing angle. • Indoor and outdoor information displays
• Portable equipment
PRODUCT GROUP AND PACKAGE DATA
• Telecommunication indicators
• Product group: LED
• General use
• Package: 5 mm
• Product series: standard
• Angle of half intensity: ± 4°

PARTS TABLE
LUMINOUS INTENSITY WAVELENGTH FORWARD VOLTAGE
(mcd) at IF (nm) at IF (V) at IF
PART COLOR TECHNOLOGY
(mA) (mA) (mA)
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
TLDR5800 Red 1000 2500 - 20 - 648 - 20 - 1.8 2.2 20 GaAIAs on GaAs
TLDR5800-AS12Z Red 1000 2500 - 20 - 648 - 20 - 1.8 2.2 20 GaAIAs on GaAs

ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)

TLDR5800
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage (1) VR 6 V
DC forward current IF 50 mA
Surge forward current tp ≤ 10 μs IFSM 1 A
Power dissipation PV 100 mW
Junction temperature Tj 100 °C
Operating temperature range Tamb -40 to +100 °C
Storage temperature range Tstg -55 to +100 °C
Soldering temperature t ≤ 5 s, 2 mm from body Tsd 260 °C
Thermal resistance junction/ambient RthJA 350 K/W
Note
(1) Driving the LED in reverse direction is suitable for a short term application

Rev. 1.9, 16-Mar-15 1 Document Number: 83004

For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 TLDR5800
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Vishay Semiconductors

OPTICAL AND ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

TLDR5800, RED
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Luminous intensity IF = 20 mA IV 1000 2500 - mcd
Dominant wavelength IF = 20 mA λd - 648 - nm
Peak wavelength IF = 20 mA λp - 650 - nm
Angle of half intensity IF = 20 mA ϕ - ±4 - deg
Forward voltage IF = 20 mA VF - 1.8 2.2 V
Reverse current VR = 6 V IR - - 10 μA
Junction capacitance VR = 0 V, f = 1 MHz Cj - 50 - pF

LUMINOUS INTENSITY CLASSIFICATION

GROUP LUMINOUS INTENSITY (mcd)
STANDARD MIN. MAX.
EE 1000 2000
FF 1350 2700
GG 1800 3600
HH 2400 4800
II 3200 6400
KK 4300 8600
LL 5750 11 500
MM 7500 15 000
NN 10 000 20 000
Note
• Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %.
The above type numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each
bag (there will be no mixing of two groups in each bag).
In order to ensure availability, single brightness groups will not be orderable.
In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one
bag. In order to ensure availability, single wavelength groups will not be orderable.

TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

60 10 000
Tamb ≤ 85 °C
50
IF - Forward Current (mA)

tp/T = 0.01
IF - Forward Current (mA)

1000 0.02
40 0.05
0.1
30 100

20 1
10 0.5 0.2
10

0
0 20 40 60 80 100 1
0.01 0.1 1 10 100
96 11489 Tamb - Ambient Temperature (°C)
95 10025 tp - Pulse Length (ms)

Fig. 1 - Forward Current vs. Ambient Temperature for AlInGaP Fig. 2 - Forward Current vs. Pulse Length

Rev. 1.9, 16-Mar-15 2 Document Number: 83004

For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 TLDR5800
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Vishay Semiconductors

0° 10° 20° 10
30°

IV rel - Relative Luminous Intensity

IV rel - Relative Radiant Intensity

red

ϕ - Angular Displacement
40° 1
1.0

0.9 50°
0.1
0.8 60°

70°
0.7
80°
0.01
0.1 1 10 100
0.6 0.4 0.2
95 10016 IF - Forward Current (mA)
95 10022

Fig. 3 - Relative Luminous Intensity vs. Angular Displacement Fig. 6 - Relative Luminous Intensity vs. Forward Current

1.2 2.4
red red

IV rel - Relative Luminous Intensity

Irel - Relative Luminous Intensity

1.0 2.0

0.8 1.6

0.6 1.2

0.4 0.8

0.2 0.4
IFAV = 10 mA, const.
0 0
600 620 640 660 680 700 10 20 50 100 200 500 IF (mA)
95 10018 - Wavelength (nm) 95 10262 1 0.5 0.2 0.1 0.05 0.02 tP/T

Fig. 4 - Relative Intensity vs. Wavelength Fig. 7 - Relative Luminous. Intensity vs.
Forward Current/Duty Cycle

100 2.0
red
IV rel - Relative Luminous Intensity

red
IF - Forward Current (mA)

1.6

1.2
10

0.8

0.4

1 0
1 1.5 2 2.5 3 0 20 40 60 80 100
95 10014 VF - Forward Voltage (V) 95 10015 Tamb - Ambient Temperature (°C)

Fig. 5 - Forward Current vs. Forward Voltage Fig. 8 - Relative Luminous Intensity vs. Ambient Temperature

Rev. 1.9, 16-Mar-15 3 Document Number: 83004

For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 TLDR5800
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Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters

C A

± 0.15
Ø 5.5
Parabolic lens
(4.9)

± 0.15

± 0.3
7.7

< 0.7
± 0.3

8.7
12.7
± 0.55
35.7

Ø 5 ± 0.15 Area not plane

1.1 ± 0.25
1 min.

technical drawings
according to DIN
+ 0.15 + 0.15 specifications
0.5 - 0.05 0.5 - 0.05

Drawing-No.: 6.544-5310.01-4 2.54 nom.

Issue: 4; 19.05.09
95 11476

TAPE DIMENSIONS in millimeters

±1 ±2
12.7 ± 1
0.3 ± 0.2
9 ± 0.5
12 ± 0.3
+1
- 0.5
18

Angle φ = α / 2

0.9 max.
Ø 4 ± 0.2
+ 0.6
2.54 - 0.1

5.08 ± 0.7 6.35 ± 0.7

12.7 ± 0.2
Measure limit over 20 index-holes: ± 1
9511389
Reel
(Mat.-no. 1764)
Quantity per:
1000

94 8172

Option Dim. “H” ± 0.5 mm

AS 17.3
Explanation
12 - cathode leaves first
21 - anode leaves first

Rev. 1.9, 16-Mar-15 4 Document Number: 83004

For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 TLDR5800
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Vishay Semiconductors
AMMOPACK TAPE

Tape feed

Diodes: anode before cathode

Phototransistors: emitter before collector
Code 21
Adhesive tape

Identification label
Label Reel
Diodes:
cathode before anode
C Phototransistors:
collector before emitter
Code 12
Paper

A
Tape
B 94 8671
94 8667-1

Fig. 9 - Tape Direction Fig. 10 - LED in Tape

Note
• The new nomenclature for ammopack is e.g. ASZ only, without
suffix for the LED orientation. The carton box has to be turned to
the desired position: “+” for anode first, or “-” for cathode first.
AS12Z and AS21Z are still valid for already existing types, BUT
NOT FOR NEW DESIGN.

Rev. 1.9, 16-Mar-15 5 Document Number: 83004

For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

Material Category Policy

Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.

Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.

Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.

Revision: 02-Oct-12 1 Document Number: 91000

 深 圳 市 昱 申 科 技 有 限 公 司
CHINA YOUNG SUN LED TECHNOLOGY CO., LTD.
TEL: (86) 755-28079401 28079402 28079403 28079404 28079405
FAX: (86) 755-28079407 E-mail: info@100LED.com Web: www.100LED.com

Light Degradation in mcd: (I F=20mA)

Hours Light Degradation in mcd after Different Hours

Colors 216 Hrs 360 Hrs 792 Hrs 1104 Hrs 1992 Hrs 2328 Hrs
Red 1.52% -1.22% -3.10% -4.68% -5.72% -8.27%
Yellow -1.71% -2.97% -5.93% -8.13% -8.90% -11.10%
Blue 3.13% -0.33% -3.84% -8.23% -21.32% -24.92%
Green -8.02% -9.78% -14.25% -17.37% -20.79% -22.30%
Hours 48 Hrs 168 Hrs 336 Hrs 528 Hrs 744 Hrs 1008 Hrs
Cool White 5.28% 3.36% -1.15% -3.84% -8.66% -11.24%
Pure White 6.83% 4.11% -0.73% -4.25% -9.76% -12.63%
Warm White 1.51% -2.19% -7.59% -10.53% -13.58% -14.98%

Mechanical Dimensions:

.All dimension are in mm, tolerance is +0.2mm unless otherwise noted

.An epoxy meniscus may extend about 1.5mm down the leads.
.Burr around bottom of epoxy may be 0.5mm Maximum

Unit: mm

.Viewing Angle Drawing

0

30 30

60 60

100 75 50 25 0 25 50 75 100

Address: 5/F, Building B, Anzhilong Indl., Qinghua East Road., Longhua Town, Shenzhen CHINA. 518109
ONE HUNDRED LED
PERFECT LED
 深 圳 市 昱 申 科 技 有 限 公 司
CHINA YOUNG SUN LED TECHNOLOGY CO., LTD.
TEL: (86) 755-28079401 28079402 28079403 28079404 28079405
FAX: (86) 755-28079407 E-mail: info@100LED.com Web: www.100LED.com

Packing Information:

.1. Anti-static bag

.200 - 500pcs per bag

.With 1 little bag of drier inside

Unit: mm

.30 - 40 bags per box

.15-20K pcs per box

.0.45Kg/K

Middle Box

Anti-static Tube Packaging Information:

Unit: mm

.60 pcs per tube.

.25 Tubes per layer.
.35 Layers per carton
.875 Tubes per carton.
.52.5K pcs maximum in one carton
.20-23Kg per carton

Middle Box

Address: 5/F, Building B, Anzhilong Indl., Qinghua East Road., Longhua Town, Shenzhen CHINA. 518109
ONE
ONEHUNDRED
HUNDREDLED
LED
PERFECT
PERFECTLED
LED
 深 圳 市 昱 申 科 技 有 限 公 司
CHINA YOUNG SUN LED TECHNOLOGY CO., LTD.
TEL: (86) 755-28079401 28079402 28079403 28079404 28079405
FAX: (86) 755-28079407 E-mail: info@100LED.com Web: www.100LED.com

Code System:

YSL-R341Y3D-D2 .1. Company Code, short for Young Sun

.2. Code for LED series.

1 2 3 456 7 8 9 10
.3. Code for LED Type.
R: Round B: Bullet C: Columnar O: Oval
H: Helmet Q: Square V: Concave P: Pagoda
S: Strawhat D: Special

.5. Code for Lead Frame of LED .4. Code for LED Lens Type.

.6. Code for Lead Frame Code of LED

.7. Code for Wavelength Color
.8. Code for Lens color
C: Water Clear W: White Diffused D: Color Diffused T: Color Transparent

.9. Code for Viewing Angle

A: 1-10 B: 10-20 C: 20-30 D: 30-40 E: 40-60 F: 60-90 G: 90-120 H: >120

.10. Luminous Intensity Grade:

1: 1-50mcd 4: 200-300mcd 7: 800-1000mcd 10: 2000-3000mcd 14: 10000-13000mcd
2: 50-100mcd 5: 300-500mcd 8: 1000-1500mcd 11: 3000-5000mcd 15: 13000-15000mcd
3: 100-200mcd 6: 500-800mcd 9: 1500-2000mcd 12: 5000-8000mcd 16: 15000-20000mcd
13: 8000-10000mcd 17: 20000~mcd
Warrantee:

. In order to make the LEDs lifespan longer, please set the input Current below 20mA.

. Electrical & Optical Characteristics consistency of same items all shippments.

Notes:

. Please use LEDs based on our datasheet.

. LED is senstive to statics, be sure your equipments are anti-static when you use our
LEDs.
. Pay more attention to your heat dissipation system when you use it, the better heat
dissipation, the longer LED lifespan.

Address: 5/F, Building B, Anzhilong Indl., Qinghua East Road., Longhua Town, Shenzhen CHINA. 518109
ONE HUNDRED LED
PERFECT LED
HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75
Red, Green and Blue
5 mm Standard Oval LEDs

Data Sheet

Description Features
These Precision Optical Performance Oval LEDs are • Well defined spatial radiation pattern
specifically designed for full color/video and passenger • High brightness material
information signs. The oval shaped radiation pattern
and high luminous intensity ensure that these devices • Available in red, green and blue color
are excellent for wide field of view outdoor applications – Red AlInGaP 626 nm
where a wide viewing angle and readability in sunlight – Green InGaN 530 nm
are essential. The package epoxy contains UV inhibitor to – Blue InGaN 470 nm
reduce the effects of long term exposure to direct sunlight.
• Superior resistance to moisture
Applications • Standoff and non-standoff Package
• Full Color Signs • Tinted and diffused
• Typical viewing angle 40° x100°
Package Dimensions
Package Drawing A

1.02 MEASURED AT BASE OF LENS.

MAX. 0.50 ±0.10
0.040 3.80
0.70 SQ. TYP.
MAX. 0.020 ±0.004 0.150
0.028

5.20
0.204

CATHODE LEAD
1.00 2.54
MIN.
7.00 25.00 0.039 0.10
MIN.
0.275 0.984

Package Drawing B
1.30 ± 0.20 0.50 ± 0.10 MEASURED AT BASE OF LENS.
10.80 ± 0.50 SQ TYP.
0.051 ± 0.008 0.020 ± 0.004
0.425 ± 0.020 3.80 ± 0.20
0.70 MAX. Refer to Note 1 0.150 ± 0.008
0.028
5.20 ± 0.20
0.205 ± 0.008

CATHODE LEAD 1.00 MIN. 2.54 ± 0.30

7.00 ± 0.20 24.00 MIN. 0.039 0.10 ± 0.012
0.276 ± 0.008 0.945
1.02 MAX.
0.040 Note 1. This dimension does not apply to Red LED

Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide

Color and Dominant Luminous Intensity Iv (mcd) Typical

Part Number Wavelength λd (nm) at 20 mA [1,2,5] Viewing Package Draw-
Typ [3] Min Max Standoff Angle (°) [4] ing
HLMP-HG74-XY0DD Red 626 1660 2400 No 40 x 100 A
HLMP-HG75-XY0DD Red 626 1660 2400 Yes B
HLMP-HM74-34BDD Green 530 4200 6050 No A
HLMP-HM75-34BDD Green 530 4200 6050 Yes B
HLMP-HM74-34CDD Green 530 4200 6050 No A
HLMP-HM75-34CDD Green 530 4200 6050 Yes B
HLMP-HB74-UVBDD Blue 470 960 1380 No A
HLMP-HB75-UVBDD Blue 470 960 1380 Yes B
HLMP-HB74-UVCDD Blue 470 960 1380 No A
HLMP-HB75-UVCDD Blue 470 960 1380 Yes B
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%.

Part Numbering System

HLMP – H x xx – x x x xx

Packaging Option
DD: Ammopack

Color Bin Selection

0 : Full Distribution
B : Color Bin 2 & 3
C : Color Bin 3 & 4

Maximum Intensity Bin

Refer to Device Selection Guide

Minimum Intensity Bin

Refer to Device Selection Guide

Standoff/Non Standoff
74: Non Standoff
75: Standoff

Color
G : Red
M : Green
B : Blue

Package
H: 5 mm Standard Oval 40° x 100°

2
Absolute Maximum Ratings
TJ = 25° C
Parameter Red Green/ Blue Unit
DC Forward Current [1] 50 30 mA
Peak Forward Current 100 [2] 100 [3] mA
Power Dissipation 120 114 mW
LED Junction Temperature 130 110 °C
Operating Temperature Range -40 to +100 -40 to +85 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Derate linearly as shown in Figures 4 and 8.
2. Duty Factor 30%, frequency 1 KHz.
2. Duty Factor 10%, frequency 1 KHz.

Electrical / Optical Characteristics

TJ = 25° C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage VF V IF = 20 mA
Red 1.8 2.1 2.4
Green 2.8 3.2 3.8
Blue 2.8 3.2 3.8
Reverse Voltage [3] VR V
Red 5 IR = 100 μA
Green and Blue 5 IR = 10 μA
Dominant Wavelength [1] λd nm IF = 20 mA
Red 618 626 630
Green 523 530 535
Blue 464 470 476
Peak Wavelength λPEAK nm Peak of Wavelength of Spectral
Red 634 Distribution at IF = 20 mA
Green 521
Blue 464
Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to-Pin
Luminous Efficacy [2] ηV lm/W Emitted Luminous Power/
Red 218 Emitted Radiant Power
Green 538
Blue 65
Notes:
1. The dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is
the luminous efficacy in lumens/watt.
3. Indicates product final testing condition. Long term reverse bias is not recommended.

3
AlInGaP Red
1 100

0.8 80

FORWARD CURRENT - mA
RELATIVE INTENSITY

0.6 60

0.4 40

0.2 20

0 0
550 600 650 700 0 1 2 3
WAVELENGTH - nm FORWARD VOLTAGE - V
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage

5.0 60

IF MAX - MAXIMUM FORWARD CURRENT - mA

4.5
RELATIVE LUMINOUS INTENSITY

50
4.0
(NORMALIZED AT 20mA)

3.5 40
3.0
2.5 30
2.0
1.5 20
1.0 10
0.5
0.0 0
0 20 40 60 80 100 0 20 40 60 80 100
DC FORWARD CURRENT-mA TA - AMBIENT TEMPERATURE - °C
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature

4
InGaN Green and Blue
1.0 100
BLUE
0.9
0.8 80

FORWARD CURRENT - mA
RELATIVE INTENSITY

0.7
GREEN
0.6 60
0.5
0.4 40
0.3
0.2 20
0.1
0.0 0
380 430 480 530 580 630 0 1 2 3 4 5
WAVELENGTH - nm FORWARD VOLTAGE - V
Figure 5. Relative Intensity vs Wavelength Figure 6. Forward Current vs Forward Voltage

3.5 35

IF - MAXIMUM FORWARD CURRENT - mA

3.0 30
(NORMALIZED AT 20mA)

2.5 Green 25
RELATIVE INTENSITY

2.0 20
Blue
1.5 15

1.0 10
0.5 5
0.0 0
0 20 40 60 80 100 120 0 20 40 60 80 100
FORWARD CURRENT-mA TA - AMBIENT TEMPERATURE - °C

Figure 7. Relative Intensity vs Forward Current Figure 8. Maximum Forward Current vs Ambient Temperature

6
RELATIVE DOMINANT WAVELENGTH-nm

4
2

0
Blue
-2

-4
Green
-6

-8
0 20 40 60 80 100 120
FORWARD CURRENT-mA

Figure 9. Relative Dominant Wavelength vs Forward Current

5
 1.0 1.0
Red
0.8 0.8 Green
Blue
NORMALIZED INTENSITY

NORMALIZED INTENSITY
0.6 0.6

0.4 0.4

Red
0.2 Green 0.2
Blue
0.0 0.0
-90 -60 -30 0 30 60 90 -90 -60 -30 0 30 60 90
ANGULAR DISPALCEMENT (°) ANGULAR DISPALCEMENT (°)
Figure 10. Radiation pattern-Major Axis Figure11. Radiation pattern-Minor Axis

10 0.5
Green 0.4 Green
Red Red

FORWARD VOLTAGE SHIFT-V

Blue 0.3
(NORMALIZED AT TJ = 25°C)

Blue
RELATIVE LIGHT OUTPUT

0.2
0.1
1
0
-0.1
-0.2
-0.3
0.1 -0.4
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
TJ -JUNCTION TEMPERATURE TJ -JUNCTION TEMPERATURE
Figure12. Relative Light Output vs Junction Temperature Figure13. Forward Voltage Shift vs Junction Temperature

Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) VF Bin Table (V at 20 mA)
Intensity (mcd) at 20 mA Bin ID Min Max
Bin Min Max VD 1.8 2.0
U 960 1150 VA 2.0 2.2
V 1150 1380 VB 2.2 2.4
W 1380 1660 Notes:
1. Tolerance for each bin limit is ±0.05 V
X 1660 1990 2. VF binning only applicable to Red color.
Y 1990 2400
Z 2400 2900
1 2900 3500
2 3500 4200
3 4200 5040
4 5040 6050
Tolerance for each bin limit is ±15%

6
Red Color Range Blue Color Bin Table
Min Max Min Max
Dom Dom Bin Dom Dom
618.0 630.0 x 0.6872 0.3126 0.6890 0.2943 2 464 468 x 0.1374 0.1766 0.1699 0.1291
y 0.6690 0.3149 0.7080 0.2920 y 0.0374 0.0966 0.1062 0.0495
Tolerance for each bin limit is ± 0.5 nm 3 468 472 x 0.1291 0.1699 0.1616 0.1187
y 0.0495 0.1062 0.1209 0.0671
Green Color Bin Table 4 472 476 x 0.1187 0.1616 0.1517 0.1063
Min Max y 0.0671 0.1209 0.1423 0.0945
Bin Dom Dom Tolerance for each bin limit is ± 0.5 nm
2 523 527 x 0.0979 0.1450 0.1711 0.1305
Note:
y 0.8316 0.7319 0.7218 0.8189
1. All bin categories are established for classification of products.
3 527 531 x 0.1305 0.1711 0.1967 0.1625 Products may not be available in all bin categories. Please contact
your Avago representative for further information.
y 0.8189 0.7218 0.7077 0.8012
4 531 535 x 0.1625 0.1967 0.2210 0.1929
y 0.8012 0.7077 0.6920 0.7816
Tolerance for each bin limit is ± 0.5 nm

Avago Color Bin on CIE 1931 Chromaticity Diagram

1.000

0.800

Green 2 3 4

0.600
Y

0.400

Red

0.200
Blue
4
3 2
0.000
0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800
X

7
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59 mm. Soldering
the LED using soldering iron tip closer than 1.59 mm
might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave Manual Solder
Soldering [1, 2] Dipping
Pre-heat temperature 105° C Max. – size for LED component leads.
Preheat time 60 sec Max –
Peak temperature 260° C Max. 260° C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
• Wave soldering parameters must be set and main-
tained according to the recommended temperature
and dwell time. Customer is advised to perform daily
check on the soldering profile to ensure that it is always
conforming to recommended soldering conditions.
8
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ AllnGaP high brightness LED are using high
efficiency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 260° C and
the solder contact time does not exceeding 5 sec. Over-stressing the
LED during soldering process might cause premature failure to the
LED due to delamination.
Avago Technologies LED configuration
CATHODE ANODE
InGaN Device AlInGaP Device
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
LED component Plated through
lead size Diagonal hole diameter
0.45 x 0.45 mm 0.636 mm 0.98 to 1.08 mm
(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED

260° C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
TEMPERATURE (° C)

Flux: Rosin flux

Solder bath temperature: 255° C ± 5° C

105° C Max (maximum peak temperature = 260° C)

Dwell time: 3.0 sec - 5.0 sec

(maximum = 5 sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)

Ammo Packs Drawing

6.35 ±1.30 12.70 ±1.00
0.25 ±0.0512 0.50 ±0.0394

CATHODE

20.50 ±1.00
0.8071 ±0.0394

9.125 ±0.625
0.3593 ±0.0246

18.00 ±0.50
0.7087 ±0.0197

Ø 4.00 ±0.20 TYP

A A 0.1575 ±0.008
12.70 ±0.30
0.50 ±0.0118
0.70 ±0.20 VIEW A-A
0.0276 ±0.0079

Note: All dimensions in millimeters (inches)

9
Packaging Box for Ammo Packs

FROM LEFT SIDE OF BOX

ADHESIVE TAPE MUST BE
FACING UPWARDS.

LABEL ON THIS
SIDE OF BOX

ANODE LEAD LEAVES

THE BOX FIRST. 

Note: For InGaN device, the ammo pack packaging box contain ESD logo

Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

(1P) Item: Part Number STANDARD LABEL LS0002

RoHS Compliant
e3 max temp 260C
(1T) Lot: Lot Number (Q) QTY: Quantity

LPN: CAT: Intensity Bin

(9D)MFG Date: Manufacturing Date BIN: Refer to below information

(P) Customer Item:

(V) Vendor ID: (9D) Date Code: Date Code

DeptID: Made In: Country of Origin

10
(ii) Avago Baby Label (Only available on bulk packaging)

RoHS Compliant
Lamps Baby Label e3 max temp 260C
(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity

C/O: Country of Origin

Customer P/N: CAT: Intensity Bin

Supplier Code: BIN: Refer to below information

DATECODE: Date Code

Acronyms and Definition:

BIN: Example:
(i) Color bin only or VF bin only (i) Color bin only or VF bin only
(Applicable for part number with color bins but without BIN: 2 (represent color bin 2 only)
VF bin OR part number with VF bins and no color bin) BIN: VB (represent VF bin “VB” only)
OR (ii) Color bin incorporate with VF Bin
(ii) Color bin incorporated with VF Bin BIN: 2VB
(Applicable for part number that have both color bin VB: VF bin “VB”
and VF bin) 2: Color bin 2 only

DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-2725EN - April 24, 2012
 Tactile Switches 6mm×6mm Top Push
General
■Features
・Crisp clicking by tactile feedback
・Prevent flux rise by insert-molded terminal
・Ground terminal is attached
・Snap-in mount terminal

■Dimensions (Unit : mm) With ground terminal

Without ground terminal
6 6

0 .7
0 .7

a c
a c
4 .5

4 .5
6

4 .1
b d
b d
D IA . D IA .
(3 .5) (3 .5)

0 .3
■Circuit Diagram
a a c
c
■Circuit
h

h
MOVING CONTACT MOVING CONTACT
Diagram
3 .5

3 .5
b d
1 .8

1 .8
b d
3 .5

3 .5
0 .3
■ Recommended Mounting 0 .7
■ Recommended Mounting
6 .5 0 .3
7 .9
Hole Dimensions 6 .5
Hole Dimensions
7 .9 6.5±0.1
4.5±0.1

4.5±0.1
4-1±0.05 DIA.

5-1±0.05 DIA.
4.1±0.1
6.5±0.1

■Specifications
Item Specification Unit Note
Operating Temperature Range -20～ +70 ℃
Storage Temperature Range -40～ +85 ℃
Type of Operation Tactile Feedback
Circuit Configuration Push-On Momentary, 1 pole-1 throw
Power Rating MAX 50mA 24VDC
Contact Resistance MAX 100 mΩ
Insulation Resistance 100MΩ Min. at 100VDC
Dielectric Withstanding Voltage 250VAC for 1 minute
Contact Bounce MAX 5 ms
0.98±0.49 N A type
Operating Force
1.57±0.49 N B type
MIN 0.10 N A type
Return Force
MIN 0.49 N B type
Travel 0.25 +0.2/-0.1 mm
■Model Designation
KSMC6 1 2 A

Operation Force
h (mm)
Mount Height
Terminal Option 1 4.3
(1:Without ground terminal, 2:With ground terminal) 2 5
3 7
Model No. 4 9.5

5/29/2007 HOKURIKU *Details are subject to change without notice.

1
 Tactile Switches 6mm×6mm Top Push
Operating Force 2.55N
■Features
・Crisp clicking by tactile feedback
・Prevent flux rise by insert-molded terminal
・Ground terminal is attached
・ Snap-in mount terminal
・
■Dimensions (Unit : mm)
Without ground terminal With ground terminal
6 6

0 .7
0 .7

a c
a c
4 .5

4 .5
6

4 .1
b d
b d
D IA . D IA .
(3 .5) (3 .5)

0 .3
■Circuit Diagram
a a c
c
■Circuit
h

h
MOVING CONTACT MOVING CONTACT
Diagram
3 .5

3 .5
b d
1 .8

1 .8
b d
3 .5

3 .5
■ Recommended Mounting
■ Recommended Mounting
0 .3 0 .7
Hole Dimensions
6 .5 Hole Dimensions 0 .3 6.5±0.1
7 .9 6 .5
4.5±0.1

4.5±0.1
7 .9
4-1±0.05 DIA.

5-1±0.05 DIA.
4.1±0.1
6.5±0.1

■Specifications
Item Specification Unit Note
Operating Temperature Range -20～ +70 ℃
Storage Temperature Range -40～ +85 ℃
Type of Operation Tactile Feedback
Circuit Configuration Push-On Momentary, 1 pole-1 throw
Power Rating MAX 50mA 24VDC
Contact Resistance MAX 100 mΩ
Insulation Resistance 100MΩ Min. at 100VDC
Dielectric Withstanding Voltage 250VAC for 1 minute
Contact Bounce MAX 5 ms
Operating Force 2.55± 0.69 N
Return Force MIN 0.49 N
Travel 0.25 +0.2/-0.1 mm

■Model Designation
KSM06 1 2 C h (mm)
Operation Force 1 4.3
2 5
Mount Height
3 7
Terminal Option
4 9.5
(1:Without ground terminal, 2:With ground terminal)
Model No

5/29/2007 HOKURIKU *Details are subject to change without notice.

2
 SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

PRODUCTION DATA information is current as of publication date. Copyright  1988, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 SN5408, SN54LS08, SN54S08
SN7408, SN74LS08, SN74S08
QUADRUPLE 2-INPUT POSITIVE-AND GATES
SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5

 PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
JM38510/08003BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/08003BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/08003BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/31004B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
JM38510/31004B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
JM38510/31004BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/31004BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/31004BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/31004BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/31004SCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/31004SCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/31004SDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/31004SDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SN54LS08J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54LS08J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54S08J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54S08J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN7408N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7408N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7408N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7408N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS08D ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08D ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DBR ACTIVE SSOP DB 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DBR ACTIVE SSOP DB 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08J OBSOLETE CDIP J 14 TBD Call TI Call TI

Addendum-Page 1
 PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
SN74LS08J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS08N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74LS08N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74LS08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS08NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74LS08NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74LS08NSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08NSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08D ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08D ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74S08J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74S08N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74S08N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74S08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S08NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74S08NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC

Addendum-Page 2
 PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
(RoHS)
SN74S08NSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08NSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54LS08FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54LS08FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54LS08J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS08J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS08W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS08W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S08FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54S08FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54S08J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S08J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S08W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S08W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 3
 MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

NO. OF A B
18 17 16 15 14 13 12
TERMINALS
** MIN MAX MIN MAX

0.342 0.358 0.307 0.358

19 11 20
(8,69) (9,09) (7,80) (9,09)
20 10 0.442 0.458 0.406 0.458
28
(11,23) (11,63) (10,31) (11,63)
21 9
B SQ 0.640 0.660 0.495 0.560
22 8 44
(16,26) (16,76) (12,58) (14,22)
A SQ
23 7 0.739 0.761 0.495 0.560
52
(18,78) (19,32) (12,58) (14,22)
24 6
0.938 0.962 0.850 0.858
68
(23,83) (24,43) (21,6) (21,8)
25 5
1.141 1.165 1.047 1.063
84
(28,99) (29,59) (26,6) (27,0)
26 27 28 1 2 3 4

0.020 (0,51) 0.080 (2,03)

0.010 (0,25) 0.064 (1,63)

0.020 (0,51)
0.010 (0,25)

0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)

0.028 (0,71) 0.045 (1,14)

0.022 (0,54) 0.035 (0,89)
0.050 (1,27)

4040140 / D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38
0,65 0,15 M
0,22
28 15

0,25
0,09
5,60 8,20
5,00 7,40

Gage Plane

1 14 0,25

A 0°–ā8° 0,95
0,55

Seating Plane

2,00 MAX 0,05 MIN 0,10

PINS **
14 16 20 24 28 30 38
DIM

A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90

A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:

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Mailing Address: Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

Copyright  2005, Texas Instruments Incorporated

 PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2005

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
5962-9557401QCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
5962-9557401QDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
5962-9557401QDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
JM38510/30501BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30501BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30501BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30501BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30501SCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30501SCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30501SDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30501SDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SN5432J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN5432J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54LS32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54LS32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54S32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54S32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN7432N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN7432N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 1
 PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2005

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
no Sb/Br)
SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS32J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS32N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74LS32N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32D ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)

Addendum-Page 2
 PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2005

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
SN74S32N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74S32N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU Level-NC-NC-NC
(RoHS)
SN74S32NSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSR ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ5432J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ5432J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ5432W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ5432W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54LS32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS32W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS32W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S32FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54S32FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54S32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S32J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S32W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S32W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

Addendum-Page 3
 PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2005

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 4
 MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

NO. OF A B
18 17 16 15 14 13 12
TERMINALS
** MIN MAX MIN MAX

0.342 0.358 0.307 0.358

19 11 20
(8,69) (9,09) (7,80) (9,09)
20 10 0.442 0.458 0.406 0.458
28
(11,23) (11,63) (10,31) (11,63)
21 9
B SQ 0.640 0.660 0.495 0.560
22 8 44
(16,26) (16,76) (12,58) (14,22)
A SQ
23 7 0.739 0.761 0.495 0.560
52
(18,78) (19,32) (12,58) (14,22)
24 6
0.938 0.962 0.850 0.858
68
(23,83) (24,43) (21,6) (21,8)
25 5
1.141 1.165 1.047 1.063
84
(28,99) (29,59) (26,6) (27,0)
26 27 28 1 2 3 4

0.020 (0,51) 0.080 (2,03)

0.010 (0,25) 0.064 (1,63)

0.020 (0,51)
0.010 (0,25)

0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)

0.028 (0,71) 0.045 (1,14)

0.022 (0,54) 0.035 (0,89)
0.050 (1,27)

4040140 / D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38
0,65 0,15 M
0,22
28 15

0,25
0,09
5,60 8,20
5,00 7,40

Gage Plane

1 14 0,25

A 0°–ā8° 0,95
0,55

Seating Plane

2,00 MAX 0,05 MIN 0,10

PINS **
14 16 20 24 28 30 38
DIM

A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90

A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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