r IHS Markit © A ANSUTIA6O7-C-2015, sonvcns tot GusamcaTons ‘APPROVED: NOVEMBER 6.2015 TIA STANDARD Generic Telecommunications Bonding and Grounding (Earthing) for Customer Premises TIA-607-C November 2015 (Revision of TIA-607-B) ‘TELECOMMUNICATIONS INDUSTRY ASSOCIATION tiaonline.orgNOTICE TIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for their particular need. The existence of such Standards and Publications shall not in any respect preclude any member or non-member of TIA from manufacturing or selling products not conforming to such Standards and Publications. 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General... Conductors... Labels. TAA Telecommunications entrance room or space... 7.1.2 Distributor rooms TAS — Computer 00M... 7.4.4 — Cabinets and racks... 7.4.5 — Metalic pathways 7.1.6 — Structural metal a 20 7.2 Primary bonding busbar (PBB)... 221 7.24 General asec peace 7.2.2 Bonds 10 the PBB ....urnnnnnen wt 7.2.3 Connections to the PBB... a 7.3 Secondary bonding busbar (SBB). cares tiga| 7.34 General : saa eiseeeearseare 1] 7.3.2. Bonds {othe SBB......... é 22 7.3.3. Connections to the SB... rc) 7.4 Rack bonding busbar (RBB) J. ee 23 7.44 General... : 23 7.42 Bonds to the RBB 23 7.4.3 Connections to the RBB. 23 7.5 Conductors . 75.1 General eee a 7.5.2 Bend radius and included angle...» Haan 753. Telecormunications bonding conductor (TEC). 7.5.4 — Telecommunications bonding backbone (TBB). 7.5.5 Backbone bonding conductor (BBC) nn. 25 7.5.6 Coupled bonding conductor (CBC) .. « ae)ANSITIA-607-C 7.5.7 Bonding conductors for connections to the mesh-BN or RB... ion DB 7.5.8 Telecommunications equipment bonding conductor (TEBC) Seen] 75.8.1 General... 26 7.58.2 Separation poet 27 7.6 Bonding equipment cabinets/equipment racks to the TEBC... 27 7.7 Structural bonding of equipment cabinetslequipment racks eee eee 7.8 Supplementary bonding networks... 29 TBA M@SH-BNec nn 30 7.8.2 Mesb-IBN. eee ee eee eons 7.8.3 Bonding conductor for connections to the supplementary bonding network .....32 7.9 Administration 8 EXTERNAL GROUNDING 8.1 Grounding resistance 8.1.1 Minimum requirements 8.1.2 Enhanced requirements... 8.2 Grounding electrode system design unnennns 82.1 General Soil resistivity testing. Low resistance. Potential equalization... 82.5 Design configuration... 9 PERFORMANCE AND TEST REQUIREMENTS. 94 Two-point groundicontinuity testing. 9.2 Grounding electrode system testing 9.2.1 Three-pole fal-of-potential method ..roresrns 35 eeeees 922 —Clamp-on test meter 7 87 9.3 Soil resistivity testing 2038 93.1 General 38 9.3.2 Four-point method...... ee ‘| 8B 93.24 Generale 38 93.2.2 — Test procedure. ‘Annex A (informative) BONDING METHODS, Annex B (informative) GROUNDING ELECTRODES B.1 General iitANSIITIA-607-C B2 Ground rods, B.3_ Electrolytic ground rods B.4 Ground plate electrodes. B5 Wire mesh 5.6 Concrete encased electrode B.7 Ground ring electrodes .... B.8 Ground radial electrodes. B.9 Enhanced grounding materials 8.10 Grounding conductors... ‘Annox C (informative) TOWERS AND ANTENNAS.. CA General ae C2 Grounding electrode system C24 Extemal groundin €.22 Bonding busbars. ©23 Grounding systems. C231 Type 1 sites...... ©2.3.2 Type 2 sites... ©.24 Tower grounding C241 Guyed metallic 10WEFS..nnnne See eee C.2.4.2 — Self-supporting metallic tOWErS ne unninnnninnnnesimnneinnnnnneese dS ©.24.3 Wooden structures (poles) .nnesnone seer ©.2.5 Building!shelter and outdoor cabinet grounding 56 €.26 Rooftop sites grounding system... €.2.6.1 Down conductors: €.2.6.2 Roof conductors... cee ‘ C.2.7 Transmission line grounding at antenna locations... 60 €.28 Ancillary objects requiring bonding and grounding... 2.8.1 Fence grounding ©.2.8.2 Generators, C283 Satelite dishes. f €.29 Internal bonding and grounding ... 2.8.1 Components. 2.9.2 _ Installation svnnttnnnseeeee 2.8.3 Bonding to the external ground electrode system .. RReREBae wvANSUTIA-607-C ‘Annex D (informative) TELECOMMUNICATIONS ELECTRICAL PROTECTION. 86 ‘Annex E (informative) ELECTRICAL PROTECTION FOR OPERATOR-TYPE EQUIPMENT POSITIONS : 87 Annex F (informative) CROSS REFERENCE OF TERMS ... 69 ‘Annex G (informative) BIBLIOGRAPHY. List of Figures Figure 1 - Relationship between relevant TIA standards .....00snnnsnue x Figure 2 — Elements of generic cabling topology... 3 Figure 3 - Illustrative example of a mutt-story large building... it Figure 4 ~ llustrative example of a single story large building 12 Figure 5 ~ lustrative example of a smaller building 42 Figure 6 — Example PBB... : nL Figure 7 — Example SB... 15 Figure 8 Label for boring and grounding conductors. eee 17 Figure 9 ~ Example of three methods to bond equipment and racks. ee eee ta. Figure 10 ~ illustration of bend radius and included angle. esac Figure 11 ~ Bonding to the service equipment (power) ground se Figure 12~ Example TEBC to rack bonding conductor connection... 26 Figure 13 - Example of a TEBC routed on Cable tr8Y..cnnnnnnnnens Figure 14 ~ Illustration of connection point to a rack from @ TEBC ss asaeteeoa Figure 16 — Illustration of a bond connection from a cabinet to the cabinet door : Figure 16 - A mesh-BN with equipment cabinets, frames, racks and CBN bonded together....30 Figure 17 — A mesh-IBN having a single point of connection... 82 Figure 18 — Illustration of test instrument connections... 37 Figure 19 — Four-point method | 38 Figure 20 — Example of multiple test locations 40 Figure 21 — Recommended resistivity table layout wl Figure 22 — Ilustrative views of typical ground rods eaeeaeeaateeatetiAa| Figure 23 — Iilustrations of @ vertical and horizontal electrolytic ground rod sel Figure 24 - Illustrative view of a concrete-encased electrode 45 Figure 25 - Illustrative view of a ground radial electrode. 46 gure 26 = Musalve exarple of ground enhancement materials swrounding a grounding conductor and a ground rods .. i Figure 27 ~ illustrative example view of a site grounding electrode system, 48 Figure 28 — illustration of a parallel ground rod installetion.. evenness 50 vANSITIA-607-C Figure 29 — Illustration of a guyed tower grounding example.. Figure 30 — Illustration of guy wire grounding. Figure 31 — Illustration of a monopole tower grounding example. sienna A Figure 32 Illustrative view of a wooden pole grounding example S 55 Figure 33 — Illustrative view of a cabinet grounding SYSt@M..scnsnenneiesenenseses see 5B Figure 34 — Iustrative rooftop tower example... eeneruer a Figure 25 — Hustrave view of rootinounted antenna mast grounding with @ supplemental grounding electrode system area oe: Figure 26 ~ tlusralve view of semouifed antenna grounding using copper strap doan CONAUCOE ern 7 60 Figure 37 — Illustration of a fence bonding example... see eaaeaete 62 Figure 38 — Illustrative view of a fence fabric and deterrent wiring bonding example......0.....63 Figure 39 — Illustrative view of a generator grounding example....r:nmn nn sen Figure 40 — Electrical protection for operator-type equipment positions 68 List of Tables Table 1 ~ TBB/BCC conductor size vs length... serene I Table 2 Stoke distance. : ae ooo 36 ‘Table 3 - Cross reference of terms... 69 viANSIITIA-607-C FOREWORD (This foreword is not considered part of this Standard) This Standard was developed by TIA Subcommittee TR-42.16. Approval of this Standard This Standard was approved by TIA Subcommittee TR-42.16, TIA Engineering Committee ‘TR-42, and the American National Standards Institute (ANSI). ANSITIA reviews standards every 5 years. At that time, standards are reaffirmed, withdrawn, or revised according to the submitted updates. Updates to be included in the next revision should be sent to the committee chair or to ANSITIA. Contri 9 organizations More than 60 organizations within the felecommunications industry (Including manufacturers, ‘consultants, end users, and other organizations) contributed their expertise to the development of this Standard Documents superseded This Standard supersedes ANSI/TIA-607-B dated September, 2011, and its addenda Significant technical changes from the previous edition Significant changes from the previous edition include: ‘+The contents of Addendum 4 (external grounding) and Addendum 2 (structural metal) were incorporated ‘+ References were updated. ‘+ Terms were changed to harmonize with ISO/IEC 30129 (see annex E). Illustrative example added for single story large building, ‘+ Recommendations for bonding connections for separately derived systems added. ‘+ Added component and design requirements for rack bonding busbars. + Added minimum bend radius and included angle requirements for bonding conductors, ‘+ Clarified that a backbone bonding conductors needs to be, at a minimum, the same size as the largest telecommunications bonding backbone to which itis connected. ‘+ Expanded the list of conductors that are required to green and clarified that the require- ment applies only to insulated conductors. + Added recommendation for minimum 0.6 m (2 ft) grid spacing for mesh bonding net- works. ‘+ Added requirement that patch panels for shielded cabling be bonded. ‘+ Clarified that bonding requirements apply to all metallic telecommunications pathways. ‘+ Added requirement that exothermic two-hole lugs be listed. Annexes ‘There are six annexes to this Standard. Annexes A through F are informative and not consid- ‘eted a part of this StandardANSITIA-607-C Relationship to other TIA standards and documents The following are related standards regarding various aspects of structured cabling that were developed and are maintained by Engineering Committee TIA TR-42. An ilustrative diagram of the ANSUTIA-568 Series relationship to other relevant TIA standards is given in figure 1. + Generic Telecommunications Cabling for Customer Premises (ANSUTIA-568.0-D) * Commercial Building Telecommunications Cabling Standard (ANSIITIA-568.1-D) + Balanced Twisted-Pair Telecommunications Cabling and Components Standard {ANSITIA-568-C.2) + Optical Fiber Components Standard (ANSITIA-568-C.3) + Broadband Coaxial Cabling and Components Standard (ANSWTIA-568-C.4) * Telecommunications Pathways and Spaces (ANSTIA-569-D) + Residential Telecommunications Infrastructure Standard (ANSUTIA-570-C) + Administration Standard for Telecommunications Infrastructure (ANSI/T1A-606-8) + Customer-Owned Outside Plant Telecommunications infrasiructure Standard (ANSIITIA-758-8) + Structured Cabling Infrastructure Standard for inteligent Building Systems (ANSITIA-862-8) + Telecommunications Infrastructure Standard for Data Centers (ANSWTIA-942-A) + Telecommunications Infrastructure Standard for Industrial Premises (ANSVTIA-1005-A) + Healthcare Facility Telecommunications infrastructure Standard (ANSVTIA-1179) + Telecommunications Infrastructure Standard for Educational Facilities (ANS\/T1A-4966) vilANSITIA-607-C ‘Common Premises Cabling & ‘Standards: Standards ‘Component Standards ANSITIA-568.0 ANSI/TIA-$68.1 ANSITIA-568.2 (Generic) (Commercial) (Balanced twisted-| ait) ANSITIA-589 ANSITIA-570 ANSI/TIA-568.3 (Pathways and (Residential) (Optical fiber) spaces) ANSITIA-606 ANSITIA-942 ANSITIA-$68.4 (Administration) (Data centers) (Broadband coaxial) ANSITIA-607 ANSITIA-1005 (Bonding and (Industrial) grounding Fearthing)) ANSITIA-758 ANSUTIA179, (Outside plant) (Healthcare) ANSITIA-862 ANSITTIA-4966 (intelligent (Educational) building systems) Figure 1 - Relationship between relevant TIA standards Introduction Telecommunications, as used in this Standard, refers to the transmission of all forms of infor- mation (¢.g., voice, data, video, security, audio, industrial, building control). Telecommunications ‘equipment used to support these wide varieties of systems that rely on the electronic transport of information require an effective building infrastructure. This infrastructure encompasses spaces, pathways, cables, connecting hardware, and a bonding and grounding system. For reli- able operation of any telecommunications equipment or system, bonding and grounding (earth- ing) is essential - regardless of the cabling technology or media. This Standard focuses on the bonding and grounding portion of this infrastructure. ixANSITIA-607-C NOTE -The North American term “grounding” that is used in this Standard Is equivalent to the intemational term “earthing.” The bonding and grounding approach in this Standard is intended to work in concert with prem- ises cabling, equipment, spaces and pathways specified within the TIA Engineering Committee TR-42. The requirements specified in this Standard in conjunction with a basic understanding of bonding and grounding concepts and methodologies will aid in achieving a reliable solution when applied to telecormmunications installations, Several sources of bonding and grounding information exist within the telecommunications in- dustry. For example, the NEC® specifies requirements regarding the safety aspects of bonding and grounding of equipment and systems. Yet another example is that of ATIS 0600318, Elec- trical Protection Applied to Telecommunications Network Plant at Entrences to Customer Struc- tures or Buildings, which provides information on bonding and grounding to support electrical protection considerations. Purpose ‘The purpose of this Standard is to enable and encourage the planning, design, and instalation ‘of generic telecommunications bonding and grounding systems within premises with or without prior knowledge of the telecommunications systems that will subsequently be installed. While primarily intended to provide direction for the design of new buildings, this Standard may be Used for existing building renovations or retroft treatment. Design requirements and choices are provided to enabie the designer to make informed design decisions. Stewardship ‘Telecommunications infrastructure affects raw material consumption. The infrastructure design and installation methods also influence product life and sustainability of electronic equipment life cycling. These aspects of telecommunications infrastructure impact our environment, Since building life cycles are typically planned for decades, technological electronic equipment up- grades are necessary. The telecommunications infrastructure design and installation process magnifies the need for sustainable infrastructures with respect to building life, electronic equip- ment life cycling and considerations of effects on environmental waste. Telecommunications designers are encouraged fo research local building practices for a sustainable environment and conservation of fossil fuels as part of the design process. Specification of criteria Two categories of criteria are specified; mandatory and advisory. The mandatory requirements are designated by the word “shall,” advisory requirements are designated by the words "should,” "may," of "desirable," which are used interchangeably in this Standard, Mandatory criteria generally apply to protection, performance, administration and compatibility; they specify the minimally-compliant requirements. Advisory or desirable criteria are presented when their attainment will enhance the general performance of the cabling system in all its can- templated applications, ‘A note in the text, table, or figure is used for emphasis or offering informative suggestions, or providing additional information,ANSI/TIA-607-C Metric equivalents of United States customary units The dimensions in this Standard are metric or United States customary with approximate con- versions to the other. Life of this Standard This Standard is a living document. The criteria contained in this Standard are subject to revi- sions and updating 2s warranted by advances in building construction techniques and telecom- munications technology. xANSI/TIA-607-C 4 SCOPE This Standard specifies requirements for a generic telecommunications bonding and grounding infrastructure and its interconnection to electrical systems and telecommunications systems. ‘This Standard may also be used as a guide for the renovation or retrofit of existing systems. 2 NORMATIVE REFERENCES ‘The following standards contain provisions which, through reference in this text, constitute pro- visions of this Standard. At the time of publication, the editions indicated were valid, All stand- ards are subject to revision, and parties to agreements based on this Standard are encouraged to investigate the possibilty of applying the most recent editions of the standards indicated be- low. ANSI and TIA maintain registers of currently valid national standards published by them. ‘+ ANSINECAVBICSI 607-2011, Standard for Telecommunications Bonding and Grounding Planning and installation Methods for Commercial Buildings + ANSITIA-608-B, 2012, Administration Standard for Telecommunications Infrastructure + ATIS 0600313-2013, Electrical Protection for Telecommunications Central Offices and Similar Type Facilities + ATIS 0600318-2010, Electrical Protection Applied to Telecommunications Network Plant at Entrances to Customer Structures or Buildings = ATIS 0600221-2010, Telecommunications — Electrical Protection For Network Operator- Type Equipment Positions * ATIS 0600333-2013, Grounding And Bonding Of Telecommunications Equipment * ATIS 0600334-2013, Electrical Protection OF Communications Towers And Associated Structures * IEEE C2-2012, National Electrical Safely Code® (NESC*) * IEEE 1100-2005, Recommended Practice for Powering and Grounding Electronic Equipment + ITU-T Recommendation K.27 1998, Protection against Interference — Bonding Configu- rations and Earthing inside a Telecommunication Building ‘+ NFPA 70-2014, National Electrical Code” (NEC) + NFPA 780-2014, Standard for the Installation of Lightning Protection SystemsANSITIA-607-C 3 DEFINITIONS, ACRONYMS AND ABBREVIATIONS, UNITS OF MEASURE 34 General For the purposes of this Standard, the following definitions, acronyms, abbreviations and units of measure apply. 3.2 Definitions access floor: A system consisting of completely removable and interchangeable floor panels that are supported on adjustable pedestals or stringers (or both) to allow access to the area be- neath, access provider: The operator of any facility that is used to convey telecommunications sig- nals to and from a customer premises. administration: The method for labeling, identification, documentation and usage needed for installation, moves, additions and changes of the telecommunications infrastructure. backbone: A facility (e.g., pathway, cable or bonding conductor) for Cabling Subsystem 2 and Cabling Subsystem 3, backbone bonding conductor: A telecommunication bonding connection which interconnects telecommunications bonding backbones (formerly known as the grounding equalizer) ‘bonding: The joining of metallic parts to form an electrically conductive path. bonding conductor: A conductor thet joins metallic parts to form an electrically conductive path, bonding network (telecommunications): A set of interconnected conductive structures that provides a low impedance path for the associated telecommunications infrastructure, building backbone: 1) Pathways or cabling between telecommunications service entrance rooms, equipment rooms, telecommunications rooms, or telecommunications enclosures within a building. 2) Cabling for interconnecting telecommunications spaces from the telecommunica- tions entrance facility to a horizontal cross-connect within @ building, cabinet: A container that may enclose connection devices, terminations, apparatus, wiring, and equipment. cable: An assembly of one or more insulated conductors or optical fibers, within an enveloping sheath. cable sheath: A covering over the optical fiber or conductor assembly that may include one or ‘more metallic members, strength members, or jackets. cabling: A combination of all cables, jumpers, cords, and connecting hardware. Cabling Subsystem 1: Cabling from the equipment outlet to Distributor A, Distributor B, or Dis- tributor C. Cabling Subsystem 2: Cabling between Distributor A and either Distributor B or Distributor {if Distributor B is not implemented). Cabling Subsystem 3: Cabling between Distributor 8 and Distributor C. Note ~ See figure 2 below for an illustration of the generic cabling topology for Cabling Subsystem 4, Cabling Subsystem 2, Cabling Subsystem 3, Distrib- 2ANSITIA-607-C utor A, Distributor B, Distributor C, an optional consolidation point and the equipment outlet. Cabling subsystems do not include equipment cords. Legend: DA] Distributor A @ [DB] istibutor 8 Distributor © © Equipment outet Optional consolidation point ® ——— Optional tie cabling Cabing Subsystem 1 cable Cabling Subsysiem 2 cable Cabling Subsystem 3 cable NOTE - All elements shown represent cables and connecting hardware, not spaces or pathways, Figure 2 - Elements of generic cabling topology campus: The buildings and grounds having legal contiguous interconnection. coaxial cable: A telecommunications cable consisting of a round center conductor surrounded by a dielectric surrounded by a concentric cylindrical conductor (shield) and an optional insulat- ing sheath, common bonding network: The set of metallic components that are interconnected to form the principle means for effectively bonding equipment inside a building to the grounding electrode system, compression connection: A means of permanently bonding a conductor to a connector by Permanently deforming the connector using a compression tool. 3ANSITIA-607-C computer room: An architectural space whose primary function is to accommodate data pro- cessing equipment. conduit: 1) A raceway of circular cross-section. 2) A structure containing one or more ducts connecting hardware: A device providing mechanical cable terminations consolidation point: A connection facilty within Cabling Subsystem 1 for interconnection of cables extending from bullding pathways to the equipment outlet. cord: 1) An assembly of cord cable with a plug on one or both ends. 2) An assembly of optical fiber cable with a connector on each end. cord cable: A cable used to construct patch, work area, and equipment cords . customer premises: Building(s), grounds and appurtenances (belongings) under the control of the customer. Distributor A: Optional connection facility in a hierarchical star topology that is cabled between the equipment outlet and Distributor B or Distributor C. Distributor B: Optional intermediate connection facility in @ hierarchical star topology that is ca- bled to Distributor C. Distributor C: Central connection facility in a hierarchical star topology. distributor room: An enclosed architectural space designed to contain Distributor A, Distributor B or Distributor C. earth: See ground. earthing: See grounding. electromagnetic interference: Radiated or conducted electromagnetic energy that has an un- desirable effect on electronic equipment or signal transmissions. entrance facility (telecommunications): An entrance to a building for both public and private network service cables (including wireless) including the entrance point of the building and con- finuing to the entrance room or space. entrance point (telecommunications): The point of emergence for telecommunications ca- bling through an exterior wall a floor, or from a conduit entrance room or space (telecommunications): A space in which the joining of inter or intra building telecommunications cabling takes piace. NOTE — An entrance room may also serve ¢s a distributor room, equipment cord: see cord. Jutermost connection facility in @ hierarchical ster topology. equipotential bonding: Bonding between metallic components to achieve a substantially equal potential exothermic weld: A method of permanently bonding two metals together by a controlled heat reaction resulting in a molecular bond. arid A collection of adjacent calls.ANSUTIA-607-C ground: A conducting connection, whether intentional or accidental, between an electrical cir- cuit (e.g,, telecommunications) or equipment and the earth, or to some conducting body that serves in place of earth. grounding: The act of creating a ground, ‘grounding electrode: A conductor, usually a rod, pipe or plate (or group of conductors) in di- rect contact with the earth for the purpose of providing a low-impedance connection to the earth, grounding electrode conductor: The conductor used to connect the grounding electrode to the equipment grounding conductor, or to the grounded conductor of the circuit at the service ‘equipment, or at the source of a separately derived system grounding electrode system: One or more grounding electrodes that are connected together. infrastructure (telecommunications): A collection of those telecommunications components, excluding equipment, that together provide the basic support for the distribution of information within a building or campus. listed: Equipment included in a list published by an organizetion, acceptable to the authority having jurisdiction, that maintains periodic inspection of production of listed equipment, and ‘whose listing states either that the equipment or material meets appropriate standards or has been tested and found suitable for use in a specified manner. mechanical connection: A reversible means of connecting a conductor to a connector through the use of a set screw or other bolt and nut device. mesh bonding network: A bonding network to which all associated equipment (e.g., cabinets, frames, racks, trays, pathways) are connected using a bonding grid, which is connected to ‘multiple points on the common bonding network. mesh isolated bonding network: A mesh bonding network that has a single point of connec- tion to either the common bonding network or another isolated bonding network. patch cord: A cord used to establish connections on a patch panel. patch panel: A connecting hardware system that facilitates cable termination and cabling ad- ‘ministration using patch cords. pathway: A facility for the placement of telecommunications cable. primary bonding busbar: A busbar placed in a convenient and accessible location and bond- ed, by means of the telecommunications bonding conductor, to the buildings service equipment (power) ground (formerly known as the telecommunications main grounding busbar). primary protector: The protector located at the building telecommunications entrance point. primary protector grounding conductor: The conductor connecting the primary protector to ground, protector: A device consisting of one or more protector units and associated mounting assemn- blies intended to limit abnormal voltages or currents on metallic telecommunications circuits. rack: Supporting frame equipped with side mounting rails to which equipment and hardware are mounted. rack bonding busbar: A busbar within a cabinet, frame or rack. rack bonding conductor: Bonding conductor from the rack or rack bonding busbar to the tele- ‘communications equipment bonding conductor.ANSUTIA-607-C. secondary bonding busbar: A common point of connection for telecommunications system ‘and equipment bonding to ground, and located in the distributor room (formerly known as the telecommunications grounding busbar) secondary protector: A device that protects against electrical transients passed through the primary protector or generated within the customer premises. sheath: See cable sheath. shield: 1) A metallic layer placed around a conductor or group of conductors. 2) The cylindrical ‘outer conductor with the same axis as the center conductor that together form a coaxial trans- mmission line. sleeve: An opening, usually circular, through the wall, ceiling, oF floor to allow the passage of cables. soil resistivity: The measure of a sols ability to retard the conduction of an electric current, ‘space (telecommunications): An area used for housing the installation and termination of tek ‘ecommunications equipment and cable. splice: A joining of conductors, meant to be permanent. ‘supplementary bonding grid: A sel of conductors or conductive elements formed into a grid or provided as a conductive plate that is part of a bonding network. star topology: A topology in which telecommunications cables are distributed from a central point. telecommunications: Any transmission, emission, or reception of signs, signals, writings, im- ages, and sounds, that is, information of any nature by cable, radio, optical, or other electro- magnetic systems. telecommunications bonding backbone: A conductor that interconnects the primary bonding busbar to the secondary bonding busbar. telecommunication bonding conductor: A conductor that interconnects the telecommunica- tions bonding infrastructure to the building's service equipment (power) ground (formerly known as the bonding conductor for telecommunications).. telecommunications equipment bonding conductor: A conductor that connects the primary bending busbar or secondary bonding busbar to equipment racks or cabinets. telecommunications infrastructure: See infrastructure (telecommunications). unit bonding conductor: A bonding conductor from equipment or a patch panel to a rack bonding conductor or a rack bonding busbar. wire: An individually insutated solid or stranded metallic conductor. work area cord: See cord. 3.3. Acronyms and abbreviations ac alternating current ACEG alternating current equipment ground AHI authority having jurisdiction ANSI American National Standards Institute 6ATIS AWG BBC BN cBc cBN cp de EMI ENT EO ESD Foc HVAC lacs IBN lec Iso ite Tut mesh-8N mesh-IBN NEC? NECA ESC” NFPA NRTL. PBB Pou BB. RBC RF sBB SBG ANSITIA-607-C. ‘Aliance for Telecommunications Industry Solutions American Wire Gauge backbone bonding conductor bonding network coupled bonding conductor ‘common bonding network consolidation point direct current electromagnetic interference electrical nonmetallic tubing ‘equipment outlet electrostatic discharge Federal Communications Commission heating, ventilation and air conditioning Intemational Annealed Copper Standard isolated bonding network Intemational Electrotechnical Commission Intemational Organization for Standards information technology equipment Intemational Telecommunication Union - Telecommunication sector mesh bonding network mesh isolated bonding network National Electrical Code® National Electrical Contractors Association National Electrical Safety Code® National Fire Protection Association nationally recognized testing laboratory primary bonding busbar power distribution unit rack bonding busbar rack bonding conductor radio frequency ‘secondary bonding busbar supplementary bonding gridANSI/TIA-607-C. SPC 788, TBC TEBC Ter TA usc single point connection telecommunications bonding backbone telecommunications bonding conductor telecommunications equipment bonding conductor telecommunications entrance facility Telecommunications Industry Association unit bonding conductor 3.4 Units of measure ‘ohms-m, centimeter feet, foot inch thousand circular mils, kilometer meter millimeter ohms-centimeter voltANSITIA-607-C. 4 REGULATORY 4.1 National requirements This Standard is intended to conform to the National Electrical Code® (NEC®; NFPA-70) and the National Electrical Safety Code* (NESC®; IEEE C2). 42 Local code requirements This Standard does not replace any code, either partially or wholly. Local code requirements shall be followed. The local code requirements should be reviewed with the local authority hav- ing jurisdiction (AH4). The review should confirm the currently adopted code and edition and any ‘exceptions to the code that are adopted by the governing authority (the AH). If no code has been adopted locally, consuit with the fire marshal's office to determine what agency is respon sible for code enforcement in that geographic area,ANSITIA-607-C 5 OVERVIEW OF TELECOMMUNICATIONS BONDING AND GROUNDING SYSTEMS. 5.1 General The basic principles, components, and design of telecommunications bonding and grounding infrastructure specified in this Standard shall be followed amongst buildings of ciffering designs and structures, NOTE ~The requirements in this Standard differ from utlity service provider re- Quirerments, which are specified in ATIS 0600313. ATIS 0600313 specifications support a robust level of service appropriate to a service provider. Users of this Standard are encouraged to refer to ATIS 0600313 where robust service re- quirements exist Bonding and grounding systems within a building are intended to have one electrical potential This is achieved to a large extent by following the requirements and guidelines in clauses 6 and 7 of this standard. For an enhanced bonding infrastructure that facilitates a greater degree of equipotential bonding, the supplementary bonding infrastructure specifications in clause 7.8 should be used. While the bonding and grounding of the electrical service entrance is outside the scope of this ‘Standard, coordination between electrical and telecommunications bonding and grounding sys- tems is essential for the proper application of this Standard. For example, electrical room and associated electrical panelboard(s) are not part of the telecommunications infrastructure, but they are depicted in this Standard because they are integral to the telecommunications bonding and grounding system. See 7.2.1, 7.2.2, 7.3.1 and 7.3.2 for more information regarding bonding to electrical panelboards. When installed, the lightning protection system should meet the requirements of the authority having jurisdiction (AHW). ‘Where a tower or antenna is installed, the installation shall meet the bonding and grounding re- guirements of ATIS 0600334. See annex B for information regarding bonding and grounding of towers and antennas. 5.2 Overview of the telecommunications bonding infrastructure 5.24 General ‘Within a building (see illustrative examples figure 3, figure 4 and figure 5), the generic telecom- munications bonding infrastructure originates at the electrical entrance facility ground and ex- tends throughout the building, It includes the following major components: a) primary bonding busbar (PBB); ) telecommunications bonding conductor (TBC); ‘and may also include the following: ©) telecommunications bonding backbone (TBB): 4) secondary bonding busbar (SBB); and, ) backbone bonding conductor (BBC). ‘These telecommunications bonding components are intended to work with a building's tele- ‘communications pathways and spaces, installed cabling, and administration system. 10ANSITIA-607-C ‘deconmurcaions [LEGEND onsngeonaicer” | 7 req) | — VL! Paneboars SS eae cae eee can Figure 3 - Illustrative example of a multi-story large building "1ANSITIA-607-C Tdecormuntations bonding conductor Bc) tetical centance | faci Primary boning busbar (PBB) ‘Secondary boning busbar (S88) Distibtor “Teecommunications === enance fact (TER) — — Boning conductor ‘slaboed ‘ses — (7 faa? TTT Teecoreuricators | = — = Se pee ; | AM sae i i rvice equipment Secs etea rece a ae V7 mewn crindigenacie te = aio wene ming cand asta Figure 5 - Illustrative example of a smaller bi 5.2.2 Primary bonding busbar (PBB) ‘The PBB serves as the dedicated extension of the building grounding electrode system for the telecommunications infrastructure. The PBB also serves as the central attachment point for the TBB(s) and equipment. See 6.2.1 and 7.2. 5.2.3. Telecommunications bonding conductor (TBC) The TBC bonds the PBB to the service equipment (power) ground. See 6.3.3 and 7.5.2. 12ANSITIA-607-C. 5.2.4 Telecommunications bonding backbone (TBB) ‘The TBB is a conductor that interconnects all SBBs with the PBB. The intended function of a TBB is to reduce or equalize potential differences. A TBB is not intended to serve as a ground fault current return path. The TBB originates at the PBB, extends throughout the building using the telecommunications backbone pathways, and connects to the SBBs in distributors. See 6.3.2 and 7.5.4, 5.2.5 Secondary bonding busbar (SBB) ‘The SBB is the bonding connection point for telecommunications systems and equipment in the area served by a distributor. See 6.2.2 and 7.3. 5.2.6 Backbone bonding conductor (BBC) When there are multiple TTBs, the BBC is employed to interconnect them through the associat- ed busbars, either on the same floor in a multi-story building or in the same general area of a single story building. See 6.3.4 and 7.5.8. 13.ANSITIA-607-C 6 TELECOMMUNICATIONS BONDING COMPONENTS ~ 61 Gen ‘This clause specifies components of the telecommunications bonding infrastructure. Where the word “listed” is used as a requirement for a component, the component shall be listed to the ap- plicable standards) through a nationally recognized testing laboratory (NRTL). 6.2 Busbars 6.2.1 Primary bonding busbar (PBB) ‘The PBB shall: a) be a busbar provided with holes for use with correctly matched listed lugs and hardware; b) be made of copper, or copper alloys having a minimum of 95% conductivity when an- nesled as specified by the International Annealed Copper Standard (IACS); ©) have minimum dimensions of 6.35 mm (0.25 In) thick x 100 mm (4 in) wide and variable in length; and, d) be listed. See 7.2.1 for instalation requirements. Figure 6 illustrates an example of a PBB. Hole spacing, size and pattern may vary. 46mm mm (Bin) -(8/IBiny 13mm 11 mm dia, (7/16 in), typ ye, | ypdia in) (1-178 in) in) (7116 iny typ Mounting holes, typ vp Figure 6 ~ Example PBB 6.2.2 Secondary bonding busbar (SBB) The S8B shall: a)_be a busbar provided with holes for use with correctly matched listed lugs and hardware; b) be made of copper, or copper alloys having a minimum of 95% conductivity when an- neeled as specified by the IACS; ©) have minimum dimensions of 6.35 mm (0.25 in) thick x 50 mm (2 in) wide and variable in length; and, 4) be listed, See 7.3.1 for installation requirements. 14ANSI/TIA-607-C Figure 7 illustrates an example of a SBB. Hole spacing, size and pattern may vary, ohn Te Tana Figure 7 — Example SBB 6.2.3 Rack bonding busbar (RBB) ‘The RB shal: a) have a minimum cross-sectional area equal to a 6 AWG wire; and, b) be listed, ‘See 7.4.1 for installation requirements. See figure 9 for examples of the use of rack bonding busbars. 6.3 Conductors 6.3.4 General Al bonding conductors shall be cooper and may be insulated. When conductors are insulated, they shall be listed for the application. The bonding conductors shall not decrease in size as the ‘bonding path moves closer to the termination point of the grounding electrode system. 6.3.2 Sizing the telecommunications bonding backbone (TBB) ‘The minimum TBB conductor size shall be a 6 AWG. The TBB should be sized at 2 kemil per linear foot of conductor length up to a maximum size of 750 kemil. See table 1. Improved bonding performance at high frequencies can be achieved by using structural metal in place of or in addition to a TBB as sized in this clause. See 6.3.5. 18ANSITIA-607-C Table 1 —TBB/BCC conductor size vs length TBBIBBC linear length Conductor size mi (ft) (awe) tess than 4 (13) 6 4-6 (14—20) 6-8(21-26) 8— 10 (27-33) 10-13 (34-41) 13 ~ 16 (42 ~52) 16 = 20 (53 ~ 66) 20-26 (67-84) 26 — 32 (85— 105) 32 — 38 (106 — 125) 250 keri 36-46 (126-150) | 300 kemil 46 — 53 (181 — 175) 350 kemnil 5376 (176 — 250) ‘500 kori 76 ~ 91 (251 — 300) 600 kemil Greater than 91 (301) 750 kemil 6.3.3. Sizing the telecommunications bonding conductor (TBC) ‘The TAC shall be, as a minimum, the same size as the largest TBB. 6.3.4. Sizing the backbone bonding conductor (BBC) ‘The BC shall be, as a minimum, the same size as the largest TBB to which itis connected, 6.3.5. Use of structural metal 6.3.5.1 General When structural metal is bonded to the building’s grounding electrode system it may be used in place of a TBB, a BBC or both. Before utizing structural metal in place of a TBB or a BBC, building plans (inoluding as-buitts as applicable) and specifications shall be reviewed to ensure the structural metal is electrically continuous or can be made so. Additionally, the two point con- tinuity test as described in 9.1, or equivalent, should be performed on the structural metal to ver- ify electrical continuity and acceptable resistance along the paths used as bonding conductors. Concrete reinforcing steel shall not be used as a TBB or a BBC. 6.3.5.2 Connections to the PBB/SBB ‘The bonding conductor from the structural metel to the PBB or SBB shall be sized according to table 1. Additionally, this conductor should be no smaller than any conductor that comprises the telecommunications bonding backbone system. Bonds to structural metal shall be made using listed exothermic welding, listed compression, or listed mechanical connectors and shall be ac- 16ANSI/TIA-607-C cessible, Bonds to the PBB or S8B shall be made es specified in 7.2.2 and 7.3.2, respectively Components to be connected to the PBB or SBB shall be as specified in 6.2.1 and 6.2.2, re- spectively 64 Connectors All bonding connectors shall be listed for the application, NOTE — Connectors are listed for the application (e.g., above ground, direct bur- ied), ‘The surface of all bonding connectors used on a PBB and an SBB shall be of 2 material that provides an electrochemical potential of <300 mV between connector and bonding busbar. 6.5 Identification 6.5.1 Conductors Where insulated, the TBC and each TSB, BBC, TEBC, RBC and UBC, shall be green, green with yellow stripe, or marked with a distinctive gréen color, 65.2 Labels Labe's shall include the information depicted in figure 8. IF THIS CONNECTOR OR CABLE IS LOOSE OR MUST BE REMOVED, PLEASE CALL THE BUILDING TELECOMMUNICATIONS. MANAGER Figure 8 — Label for bonding and grounding conductors 7ANSITIA-6O7-C 7 DESIGN REQUIREMENTS 74 General Metallic sheaths of outside plant cables entering a facility shall be bonded to ground as close as practical to the point of entrance according to manufacturer's instructions. Where the building backbone telecommunications cabling incorporates a shield or metallic member, this shield or metallic member shall be bonded to the primary bonding busbar (PBB) or the secondary bonding busbar (SBB) where the cables are terminated or where pairs are “bro- ken out” from the cable sheath. When secondary protection is provided, the secondary protector grounding conductor (or termi- nial) shall be connected to the nearest PBB or SBE using the shortest practical path. Grounding through the equipment alternating current (ac) power cord does not meet the intent of this Standard. It is intenced that the information technology equipment (ITE) be provided 2 supplementary and specific ground path for the equipment over and above the required ac or direct current (de) power ground path, While the ac or de powered equipment typically has a power cord that contains a grounding/bonding wire, the integrity of this path to ground cannot be easily verified. Rather than relying wholly on the ac or de power cord grounding/bonding wire, it is desirable that equipment be grounded in a verifiable “supplementary” manner as described in this Standard. NOTE - Many types of equipment do not require individual bonding conductors and as such do not have an attachment point for bonding condiuctors. Equipment that does not have attachment points for bonding conductors may be bonded ef- ther through the equipment rail or the power cord. Refer to the manufacturer's documentation for guidelines. Metallic pathways under 1 m (3 ft) in length (e.g,, wall and floor sleeves, J-hooks) are not re- quired to be bonded. Additionally, this Standard does not require bonding of the steel bars of a reinforced concrete building. ‘See ANSI/NECA/BICSI-607 for installation information on telecommunications bonding and grounding, 7.1.4 Telecommunications entrance room or space The telecommunications entrance room or space is the entrance point within a building where: a) the telecommunications facilities enter, b) the joining of campus and building backbone facities takes place; and, ©) the grounding of these facilities is accomplished. ‘The entrance room or space may also include antenna cable entrances (see annex 8), and electronic equipment serving telecommunications functions. Itis desirable that all utilities enter the building in close proximity to each other. 74.2. Distributor rooms Each distributor room shall contain either a PBB or a minimum of one SBB. Distributor A and Distributor 8 shall contain a minimum of one SBB. The PBB and the SBB shall be located within the distributor room so as to provide the greatest flexibility and accessibility for telecommunica- 18ANSUTIA-607-C. tions system bonding (minimizing practical lengths and number of bends of bonding conductors to the SBB), 743 Computer rooms, Each computer room shall contain a SBB (or PBB when specified in the design) and should also contain a supplementary bonding network that is bonded to the SBB or PBB. This supplemen- {ary bonding network may be in a form as identified in 7.8 but is typically a mesh-bonding net- work (mesh-BN). The ITE may also be arranged into certain segregated “functional system blocks” of either mesh-BN, mesh isolated bonding network (mesh-IBN), or other form of bonding network (BN), within the same room. The supplementary bonding conductor network shall be bonded to the room's PBB or SBB. The BN may also provide for electromagnetic shielding in varying degrees based upon its design and installation. ‘A recommended augmentation to a BN (especially a mesh-BN) is a supplementary bonding arid (S8G). Upon installation and connection of the SBG to the BN (primary components are cabi- nets, racks and frames), the SBG becomes part of the overall BN. The SBG typically covers the entire computer room or a local area within 2 room, The minimum density of the bonding grid shall be 3 m (10 ft) centers or one that corresponds to the computer room cold-or-hot aisles and the aisles running perpendicular to the cold-and-hot aisles. For better high-frequency performance or fower impedance a minimum spacing of 0.6 m 2 ft)is recommended. 7.1.4 Cabinets and racks Metallic enclosures, including telecommunications cabinets and racks, shall be bonded to the mesh-BN, SBB, or PBB using a minimum sized conductor of 6 AWG. Cabinets, racks, and other enclosures shall not be bonded serially; each shall have their own dedicated bonding conductor to the mesh-BN, SBB, PBB or TEBC, Equipment containing metallic parts and patch panels for shielded cabling in cabinets and racks shall be bonded to the telecommunications bonding system in accordance with the manufactur fer instructions. Where instructions are not given, all bonding conductors that connect these stalled products shall be a minimum sized conductor of 12 AWG. Rack bonding busbars (RBBs) are recommended for cabinets and racks that need fo support multiple unit bonding conductors, ‘There are three methods to bond the equipment located in the equipment rack or cabinet to the telecommunications bonding system, see figure 9. ‘When an RBB is used as the bonding means within @ rack or cabinet, the rack or cabinet shall be bonded to the RBB. When there is no RBB, and the equipment is bonded through individual unit bonding conductors to an RBC, the rack or cabinet shall be bonded to the RBC. Rack isolation pads should be provided when racks are installed on conductive surfaces (e.9., steel-reinforced concrete slabs). ‘Cabinets and racks with DC powered equipment may require that the RBB be isolated from the cabinet. In this case, the cabinetiack and RBB would each have their own 6 AWG or larger bonding conductor to the mesh-BN, SBB, or PBB, 19ANSUTIA-607-C LZ Tico eer got EB Iemralmpcnt Tepreuneaao—— Sosa onan | ‘ocatcun icc er eae ie xample-A* Erame“8° amp c Figure 9 - Example of three methods to bond equipment and racks 7.8 Metallic pathways In order to limit the potential difference between telecommunications pathways or between tele- ‘communications pathways and power pathways, all metallic telecommunications pathways shall be bonded to the PBB or SBB. Additionally, to achieve the objectives of potential equalization, cable tray sections shall be bonded together and shall be bonded to the PBB or SBB. 74.6 Structural metal Where structural metal is accessible and in the same room as the PBB/SBB, the PBB/SBB shall bbe bonded to structural metal using @ minimum sized conductor of 6 AWG. When practical, be- cause of shorter distances and where horizontal steel members are permanently electrically bonded to vertical column members, the PBB/SBB may be bonded to these horizontal members in lieu of the vertical column members. When the structural metal is external to the room, but readily accessible, it should be bonded to the PBBISBB using a minimum sized conductor of 6 AWG. Structural metal should be tested to verify its conductivity to earth NOTE — Modern building construction techniques will bond structural metal to the main ac power entrance or another grounding source. Ensure that when working in existing buildings that the structural metal is bonded to a suitable ground source (@.., electrical power grounding electrodefs], building ground ring). 20ANSU/TIA-607-C 7.2 Primary bonding busbar (PBB) 7.24 General ‘The length of the PBB is not specified within this Standard. It is desirable that the busbar be electrotin-plated for reduced contact resistance. The busbar shall be clesned and an anti- oxidant should be applied prior to fastening connectors to the busbar. ‘The desirable location of the PSB is in the telecommunications entrance room or space. Typi- cally, there should be a single PBB per building NOTE For buildings with more than one electrical service entrance, each of which serves telecommunications equipment, the user is urged to consult with a licensed engineer for guidance on locating the PBB. ‘The PBB shall be as close as practical to the panelboard (electrical power panel) and shall be installed to maintain clearances required by applicable electrical codes. A practical location for the PBB is to the side of the panelboard (where provided). The vertical location of the PBB should be determined by considering whether the bonding conductors are routed in an access floor or overhead cable support. Its placement should provide for the shortest and straightest practical routing of the telecommunications bonding conductor (TBC) and the primary protector grounding conductor (see annex C for more information on telecommunications electrical pro- tection — primary protector grounding). Additionally, the PBB shail be insulated from its support using an insulator that is listed for the purpose by a nationally recognized testing laboratory (NRTL). A minimum of 50 mm (2 in) separation from the wall is recommended to allow access to the rear of the busbar. ‘When a panelboard for telecommunications equipment is not installed in the telecommunica- tions entrance room or space, the PBB should be located near the backbone cabling and asso- ciated terminations. in addition, the PBB should be located so that the TBC is as short and straight as practical. The PBB should serve telecommunications equipment that is located within the same room or space. The PBB serves as the central bonding busbar for the telecommunications bonding in- frastructure. it also serves as the bonding busbar for equipment located in the telecommunica- tions entrance room or space. 7.2.2 Bonds to the PBB ‘When a panelboard is located in the same room or space as the PBB that panelboard's alternat- ing current equipment ground (ACEG) bus (when equipped) or the panelboard enclosure shall be bonded to the PBB. ‘The primary protector grounding conductor shall be connected to the PBB. This conductor is intended to conduct lightning and ac fault currents from the telecommunication primary protec- tors. A minimum of 0.3 m (1 ft) separation shail be maintained between this conductor and any dc power cables, switchboard cable, or high frequency cables, even when placed in metal con- duit ‘When the cutside plant cables in the telecommunications entrance room or space incorporate a cable shield isolation gap, the cable shield on the building side of the gap shall be bonded to the PBB. All metallic pathways for telecommunications cabling located within the same room or space as the PBB shall be bonded to the PBB. However for metallic pathways containing bonding con- 24ANSITIA-607-C ductors where the pathway is bonded to the bonding conductor, no additional bond to the PBB is required. 7.2.3 Connections to the PBB The connections of the TBC and the telecommunications bonding backbone (TBB) to the PBB shall utiize exothermic welding, listed compression two-hole lugs, or listed exothermic two-hole lugs. The connection of conductors for bonding telecommunications equipment and telecommunica- tions pathways to the PBB shall utlize exothermic welding, listed compression two-hole lugs, or listed exothermic two-hole lugs. 7.3 Secondary bonding busbar (SBB) 7, The length of the SBB Is not specified within this Standard. It is desirable that the busbar be electrotin-plated for reduced contact resistance. The busbar shall be cleaned and an anti- oxidant should be applied prior to fastening connectors to the busbar. The SBB shall be as close as practical to the panelboard and shall be installed to maintain clearances required by applicable electrical codes. A practical iocation for the SBB is to the side of the panelboard (where provided). The vertical location of the SBB should be determined by considering whether the bonding conductors are routed in an access floor or overhead cable support. Additionally, the SBB shall be insulated from Its support using an insulator that is listed for the purpose by a NRTL. A minimum of 50mm (2 in) separation from the wall is recommend ed to allow access to the rear of the busbar. When @ panelboard for telecommunications equipment is not installed in the same room or space as the SBB, that SBB should be located near the backbone cabling and associated ter- minations. The bonding conductor between a TBB and an SBB shall be continuous and routed in the shortest practical straight-line path. Multiple SB8s may be installed within the same Distributor to aid in minimizing bonding conduc- tor lengths and minimizing terminating space. 4 General 7.3.2. Bonds to the SBB Where a panelboard is located in the same room or space as the SBB that panelboard’s ACEG bus (when equipped) or the panelboard enclosure shall be bonded to the SBB. When a panelboard for telecommunications equipment is not in the same room or space as the ‘SBB, that SBB should be bonded to the panelboard that feeds the distributor. ‘The TBBs and other SBBs within the same space shall be bonded to the SBB with a conductor the same size as the TBB. In all cases, multiple SBBs within a room shail be bonded together with a conductor the same size as the TBB or with splice bars, Where a backbone bonding conductor (BBC) is required, it shall be bonded to the SBB. All metallic pathways for telecommunications cabling located within the same room or space as the SBB shall be bonded to the SBB. However, for metallic pathways containing bonding con- ductors where the pathway is bonded to the bonding conductor, no additional bond to the SBB is required. 22ANSUTIA-607-C 7.3.3 Connections to the SBB ‘The connection of the TBB to the SBB shall utilize exothermic welding, listed compression two- hole lugs, or listed exothermic two-hole lugs. ‘The connection of conductors for bonding telecommunicetions equipment and telecommunica- tions pathways to the SBB shall utilize exothermic welding, listed compression two-hole lugs, or listed exothermic two-hole lugs. 7.4 Rack bonding busbar (RBB) 7.4.41 General The length of the RBB is not specified in this Standard. The busbar shall be cleaned and a compatible anti-oxidant should be applied prior to fastening connectors to the busbar. The RBB shall be installed horizontally or vertically on the rack using insulators which provide a minimum of 19 mm (0.75 in) separation. 7.4.2 Bonds to the RBB ‘The RBB shall be bonded to either the rack bonding conductor or to the telecommunications equipment bonding conductor and to the rack. 7.4.3 Connections to the RBB ‘The connection of the rack bonding conductor or the telecommunications equipment bonding Conductor to the rack shall utilize exothermic welding, listed compression two-hole lugs, or listed exothermic two-hole lugs. The unit bonding conductor should be connected to the RBB using a listed compression con- ‘actor ane to the grounding post ofthe telecommunications equipment if provided 7.5 Conductors 7.5.1 General Bonding conductors for telecommunications should not be placed in ferrous metallic conduit. If it is necessary to place bonding conductors in ferrous metalic conduit the conductors shall be bonded to each end of the conduit using a grounding bushing or using a minimum sized con- Guctor of 6 AWG at both ends of the conduit, 7.5.2. Bend radius and included angle Bends of bonding conductors terminating at the PBB or SBB shall have a minimum inside bend radius of 200 mm (8 in), At other locations, bends in bonding conductors should be made with the greatest practical inside bend radius. A minimum bend radius of 10 times the bonding con- ductor diameter is recommended. In all cases, 2 minimum included angle of 90° shall be used. See figure 10 for illustrations of bend radius and included angle. 23ANSITIA-607-C Bend radius 90° minimum Figure 10 — Illustration of bend radius and included angle 7.5.3 Telecommunications bonding conductor (TBC) The TBC shall bond the PBB to the service equipment (power) ground. Figure 11 schematically depicts this connection to the service equipment (power) ground Electrical ertrance Telecommurications 7 facility — = — - entrance facility 7 | | | ‘ak i ae St eS Sn J ‘Telecommuricatons Grounding bending conductor eecrode (TBC) ‘system — — ~ Outside the scope of his Standard Within the scope of this Standara Figure 11 - Bonding to the service equipment (power) ground 7.8.4 Telecommunications bonding backbone (TBB) The type of building construction, building size, general telecommunications requirements, and the configuration of the telecommunications pathways and spaces should be considered when designing the TBB. Specifically, the design of a TBB shall a) be connected to the PBB; b) be consistent with the design of the telecommunications backbone cabling system (e.g., follow the backbone pathways); ©) permit multiple TBBs as necessary (e.g., multiple distributors per floor; see figure 2); 24ANSITIA-607-C 4) be continuous from the PBB to the furthest SBB to which itis connected (i.e., not be dai- sy-chained from busbar to busbar); and, €) minimize, to the extent practical, the lengths of the TBB(s). TSB conductors shail be protected from physical and mechanical damage. The TBB conductors should be installed without splices, however, where splices are necessary, the number of splic- es should be minimized. Spices shall be accessible and be located in telecommunications spaces. Joined segments of a TBB shall be joined by means of a listed exothermic weld, listed irreversible compression-type connectors, of equivalent. All joints shall be adequately supported and protected from damage. Metallic cable shield(s) or any metal pathway for cable (e.g., conduit) shall not be used as a ‘TBB nor shall water piping systems be used as @ TBB 7.8.5 Backbone bonding conductor (BBC) Whenever two or more TBBs are used within a multistory building, the TBBs shall be bonded together with a BBC at the top floor and at a minimum of every third floor in between to the low- est floor level (see figure 3). Whenever two or more TBBs are used within a large single-story building, the TBBs shall be bonded together with a BBC at the location farthest from the PBB and at a maximum distance of every 10 m (33 ft) back to the PBB, 7.8.6 Coupled bonding conductor (CBC) CBCs provide protection against electromagnetic interference (EM!) through close proximity and ‘may be integral to the cabling system. The CBC: a) may be part of a cable's shield; b) may be separate conductors that are tie wrapped to communication cables; and, ©) are typically sized at 10 AWG, although 6 AWG is recommended 7.5.7 Bonding conductors for connections to the mesh-BN or RBB Bonding conductors used to bond components to the mesh-BN or RBB shall a) be stranded copper conductors; b) be neatly routed and no longer than practical to bond the component to the mesh-BN or RBB; ©} be secured at no greater than 0.9 m (3 ft) intervals; d)_not be routed so as to create a tripping hazard or impair access to equipment; €) not be attached with any method that could damage the conductors; )_be listed as suitable for bonding applications; 9) be available for use in the space in which they will be placed hh) have a green jacket or green jacket with yellow stripe, or where bare conductors are de- ployed, they shall be supported by standoff insulators at intervals no greater than 0.6 m (2 fi or be contained in electrical nonmetallic tubing (ENT). Bare bonding conductors shall not be in contact with metallic surfaces or other conductors that are not part of the telecommunications bonding system; |) be installed using low-emission listed exothermic welds, where exothermic welds are specified and within @ room with electronics; and, 25ANSITIA-607-C |) where placed in ferrous metallic conduit that is greater than 0.9 m (3 fi), be bonded to each end of the conduit using a grounding bushing or with a minimum sized conductor of 6 AWG, 7.5.8 Telecommunications equipment bonding conductor (TEBC) 7.5.8.1 General ‘The TEBC connects the PBB/SBB to equipment racks/cabinets. More than one TEBC may be installed from the PBB/TBG (e.g.,.a separate TEBC per rack). The TEBC shall be a continuous copper conductor that is sized not less than a 6 AWG or as the largest size equipment ground- ing conductor in the ac branch power circuit(s) serving the racks/cabinet lineup. NOTE ~ Cable shields, metal conduit, cable runway or ladder, or any other me- tallic cable pathway do not satisfy the requirements for a TEBC. Connections to the TEBC shall be made with listed irreversible compression connectors, suita- ble for multiple conductors, and with the rack bonding conductors (RBCs) routed toward the PBBISBB, see figure 12. The TEBCs may be routed within cable trays, on the outside of ladder rack, tray supported at no greater than 0.9 m (3 ft) intervals, or along equipment platforms, see figure 13. Examples of ac- ceptable means of supporting the TEBCs include the use of lay-in lugs, cable brackets, and other brackets designed for this purpose. ‘An alternative method to running TEBCs overhead is to route them under an access floor. All requirements set forth for running the bonding conductors specified in this Standard shall apply, Irreversible compression connection TEBC (Telecommunications equipment bonding conductor) Rack bonding conductor Figure 12 - Example TEBC to rack bonding conductor connectionANSVTIA-607-C cae ny boning induc. Tye at exh Secon conecion pie qupmen' onde ‘enducer (E80 To PBBISBB Figure 13 - Example of a TEBC routed on cable tray 7.8.8.2 Separation TEBCs shall be separated a minimum of 50.8 mm (2 in) from conductors of other cable groups such as power or telecommunications cables. For example, TEBC’s may be suspended 50 mm. (2 in) under or off the side of a cable tray. An exception may be when conductors are grouped together to enter or exit a cabinet or enclosure. Grouping only at this point is acceptable, pro- vided the conductors are suitably separated on either side of the opening, TEBCs shall be separated from ferrous material by a distance of at least 50 mm (2 in) where achievable, or be effectively bonded to the ferrous material 7.8 Bonding equipment cabinets/equipment racks to the TEBC. The TEBC shall be connected to the cabinetslequipment racks, to an RBC or to a verti- calfhorizontal RBB, Each cabinet or equipment rack shall have a suitable connection point to which the bonding conductor can be terminated. Properly sized listed two-hole compression lugs or listed terminal blocks with two internal hex screw or equivalent torque characteristics shall be used at this connection point. See figure 14. 27ANSVTIA-607-C Figure 14 - Illustration of connection point to a rack from a TEBC. 7.7 Structural bonding of equipment cabinets/equipment racks For a welded cabinet/equipment rack, the welded construction serves as the method of bonding the structural members of the cabinet/rack together. For a bolted cabinetlequipment rack, bonding continuity cannot be assumed through the use of normal frame bolts used to build or stabilize equipment cabinets and racks. Bonding hardware, such as bolts, washers, nuts and screws, specifically designed to accomplish integral bonding of the cabinet and rack assembly, frame and support, and tested to mest applicable NRTL re- quirements are an acceptable bonding means. However, if bolts, nuts and screws for cabinet and rack assembly and support are not specifically designed for bonding purposes, the paint shall be removed from all bonding contact areas. In any case, removal of the paint from all bonding contact areas is recommended. All detachable, metallic parts of equipment cabinets (e.g. frame, door, side panel, top pane!) shall be bonded, either directly by means of bonding jumpers or through the cabinet frame, to the connection point on the cabinet where the cabinet bonding conductor connects to the cabi- net When a detachable, metallic part of an equipment cabinet is connected by a bonding jumper, the jumper shall be @ minimum sized conductor of 12 AWG stranded, high strand count, insulat- ‘ed copper conductor with green or green with yellow stripe jacket, Also, the bonding jumper should have an easily visible quick connect to facilitate detaching and aitaching the panel or door. See Figure 15, 28ANSITIA-607-C Figure 15 - Illustration of a bond connection from a cabinet to the cabinet door 7.8 Supplementary bonding networks The supplementary bonding network is in addition to the infrastructure bonding network speci- fied in clause 6. The supplementary bonding network provides for a greater degree of equipo- tential bonding to that provided by the required bonding conductors. Supplementary bondi networks are always bonded to the CBN within the building. Equipotential bonding may help mit- igate issues caused by steady-state and transient voltages and currents generated by lightning, power systems, power circuit ground faults and EMI ‘Supplementary bonding networks are described in detail in ITU-T K.27, ATIS 0800333 and IEEE 1100 and identified for ITE as the following primary topologies: a) mesh-BN ~ Generally, the default topology as most ITE has intra/inter intentional and Unintentional metallic interconnections. A mesh-BN augments the CBN by increasing the local density of conductors and functions by attempting to diversify and limit the radio frequency (RF) capture-loop area of the current paths such that the current density on any conductor or conductive loop is reduced to an acceptable level. NOTE - IEEE 1100 uses the terms “mesh common bonding network” (M-CBN) “signal reference grid” (SRG) and “mesh-BN' as somewhat interchangeable, de- pending on application and context. However, within this Standard, the term mesh-BN is used, b)_mesh-isolated bonding network (IBN) ~ Generally can be described as a mesh-BN func- tional system block that is arranged into a single point bonding entity that is isolated from the CBN except for at one controlled location — a single point connection (SPC). The IBN topology is known to provide high robustness to building lightning and power fault cur- rents. The star topology is amenable to “current mapping” for troubleshooting within the IBN, The IBN topology functions by attempting to block extraneous currents (such as 29ANSI/TIA-607-C_ lightning) from flowing within the CBN and then entering and traversing through the IBN. = This topology is especially robust to transients occurring in the CBN. ©) Star IBN ~ An IBN deployed into a star network instead of a mesh network. 7.8.1 Mesh-BN ‘A mesh-BN is a bonding network to which all associated equipment cabinets, frames and racks and cabling pathways are bonded together as well as at multiple points to the CBN (see figure 16). Figure 16 - A mesh-BN with equipment cabinets, frames, racks and CBN bonded together If the mesh-BN is constructed from flat conductors, the mesh-8N should be prefabricated of minimum 0.4 mm (0.0159 in; 26 gauge) x 50 mm (2 in) wide copper strips with all crossings and Joined sections properly welded.ANSITIA-607-C ‘Where the mesh-BN is constructed from bare round wire, the conductors shall be @ minimum sized conductor of 6 AWG copper conductors joined together via exothermic welding, brazing, listed compression connectors, of listed grounding clamps at each of the crossing points. If the mesh-BN is constructed using the access-floor pedestals, the flooring system shall be electrically continuous, The mesh-BN shail be bonded together no further than every 3.7 m (12 )) (approximately 6 pedestals) in each direction using a minimum sized conductor of 6 AWG copper and listed pedestal grounding clamps. Bonding is recommended at least every 2.4 m (8 ft) (approximately 4 pedestals) in every direction. ‘The mesh-BN shall have the following connections: @) 6 AWG or larger bonding conductor to the PBB or SBB in the computer room: b) 6 AWG or larger bonding conductor to each ITE cabinet and rack — cabinets and racks shall not be bonded serially; ©) A bonding conductor to the ground bus for each power distribution unit (PDU) or panel board serving the room, sized per NEC 250.122 and per manufacturers’ recommenda tions; 4) 6 AWG or larger bonding conductor to heating, ventilating, and air-conditioning (HVAC) equipment ~ Each piece of HVAC equipment shall be bonded individually to the mesh- BN: ®) 6 AWG or larger bonding conductor to each structural metal column in the computer room; f) 6 AWG or larger bonding conductor to each metallic cable tray and cable runway in the room they may be bonded in series; 9) 6 AWG or larger bonding conductor to each metallic conduit, water pipe, metallic air duct in the room ~ they may be bonded in series; h) 6 AWG or larger bonding conductor to every 4 to 6 access floor pedestal in each direc- tion. 7.8.2 Mesh-IBN ‘A mesh-IBN is a mesh-fopology bonding network that has a SPC to either the CBN or another IBN (see figure 17). The mesh-IBN is typically limited to a restricted area within a building such as in a computer room. The mesh-IBN is not typical (but can be utilized) for a commercial envi- ronment or computer room but is recognized and sometimes utilized in the access provider cen- tral office and computer room. The primary benefit ofthe IBN is the blocking of building currents, ‘such as lightning and power faults, from entering into the IBN. NOTE - Other topoiogical versions of IBNs (such as “star’ and “sparse-mesh’) are described in ITU-T K.27 and IEEE 1100. ‘The mesh-IBN components such as associated equipment cabinets, frames, racks and cabling pathways are insulated from the CEN except for one controlled SPC location to the CBN. The ‘SPC location applies to all bonding conductors (including power circuits) entering or exiting the mesh-IBN. Due to isolation from the CBN, except at the controlled SPC, the mesh-IBN is said to be “isolated” from the CBN. For a mesh-16N, an under-access-floor, the SB is typically only directly connected to the serv- ing PBB or SBB in order to not violate'the isolation requirements for the mesh-IBN. An above cabinet/rack SBG can be more easily incorporated where desirable into the mesh-IBN by means of insulating devices between the bonding grid and any nearby CBN components. 34ANSITIA-607-C To PBB or SBB Figure 17 — A mesh-IBN having a single point of connection 7.8.3. Bonding conductor for connections to the supplementary bonding network Bonding conductors used to bond components to the supplementary bonding network shall: @) be copper conductors; b) be neatly routed in as straight a line as practical and be no longer than required to bond the component to the supplementary bonding network; ¢) be secured at no greater than 0.9 m (3 ft) intervals; 4) not be routed so as fo create a tripping hazard or impair access to equipment; ‘@) not be attached with any method that could damage the conductors; f) be listed as suitable for bonding/grounding applications; 9) 28 available for use in space in which they will be placed, have a green jacket or green jacket with yellow stripe, or where bare conductors are deployed, they shall be support- ed by standoff insulators at intervals no greater than 0.6 m (2 f) or be contained in elec- trical non-metallic tubing (ENT). Bare bonding conductors shall not be in contact with metallic surfaces that are not part of the telecommunications bonding system; h) be installed using low-emission listed exothermic welds, where exothermic welds are specified end within a room with electronics; and, ’)_ where placed in ferrous metallic conduit that is greater than 0.9 m (3 ft), be bonded to each end of the conduit using a grounding bushing or with a minimum 6 AWG conductor. 7.9 Administration Each telecommunications bonding conductor shall be labeled at its points of termination. Labels shall be located on conductors as close as practical to their points of termination in a readable position. Refer to ANSV/TIA-606-B for additional labeling requirements. 32ANSITIA-607-C. 8 EXTERNAL GROUNDING 8.1 Grounding resistance 8.1.1. Minimum requirements The requirements of this clause are met by the use of an NFPA 70 compliant groundi trode system. ‘The grounding electrode system shall be designed to have a resistance of 25 ohms or less for a single grounding electrode. If 25 ohms cannot be achieved or maintained throughout the year with a single grounding electrode, then the grounding electrode shall be augmented by at least one additional grounding electrode. One should take into account the soil resistance due to seasonal fluctuations. It is recommended to use two grounding electrodes as the minimum in- stallation, even if 25 ohms is achieved with a single grounding electrode. 9 elec 8.1.2 Enhanced requirements The grounding electrode system for sites that are critical in nature (e.g., public safety facilites, military installations, data centers, web hosting facilities, central offices) shall be designed to have a resistance of 10 ohms or less, preferably § ohms or loss. The grounding electrode sys- tem design should take into account seasonal fluctuations such as moisture and temperature. 82 — Grounding electrode system design 8.24 General A telecommunications grounding electrode system is supplemental and connected to the struc- lure's electrical grounding electrode system. Whereas the primaty purpose of the electrical grounding electrode system is safety, the telecommunication’s grounding electrode system is intended to provide enhanced equipment protection and system performance. ‘Adequate design measures should be taken to obtain a low resistance grounding electrode sys- tem. Poor soil conditions or limited space may make this difficult to achieve. Potential equaliza- {ion is of greater importance than low resistance. Proper design methods should focus on estab- lishing an equal potential ground plane, which has the lowest practicable ground resistance. 8.2.2 Soil resistivity testing Soil resistivity tests shall be conducted for all sites prior to the design of the grounding electrode system. See 9.3. 8.2.3 Lowresistance The single largest factor impacting grounding electrade system resistance is soil resistivity Therefore, it is imperative to have this measurement before designing the grounding electrode system, Of secondary importance are the soil physical characteristics and the area available for installation. Soll resistivity varies with the composition of the soil (@.g., clay, sand, gravel), depth of the soil (e.g., stratification of soil compositions), soil temperature, and the amount of moisture ccontent in the soil. Once the soil resistivity values have been determined using the 4 point test- ing method (see 9.3.2), and the soil physical characteristics and area available have been de- termined, an effective grounding electrode system can be designed. it is possible to estimate ground resistance by performing simple calculations. However, software design tools are the 33ANSITIA-607-C most common means of designing grounding electrode systems due to their ability to model soil conditions in detail 8.2.4 Potential equalization Where telecommunications equipment is distributed throughout a structure and may be inter- connected by metallic links, the minimally required grounding system (Section 3.1.2) may not be adequate. Facilities with advanced requirements (see Section 3.1.3) or distributed equipment will benefit from the addition of a building perimeter ground loop. The ground loop shall be: a) constructed with a minimum of a 2 AWG solid tinned copper conductor (4/0 AWG stranded is preferred); b) buried at least 75 cm (30 in) deep, and at least 15 cm (6 in) below the frost line: ©) located at least 1 m (3 ft) from the building wall, preferably beyond the drip fine; and 4) located no more than 2 m (6 ft) from the building wall Ground rods used in conjunction with the building perimeter ground loop shall be listed, at least 3m (10 ft) in length, and at least 16 mm (0.625 in) nominal in diameter. Ground rod spacing be- tween any two ground rods should be at least the sum of their driven lengths. ‘The ground loop shall be connected to stee! colurnns around the perimeter of the structure at intervals averaging not more than 18 m (60 ft) Where separately derived electrical systems are present, they should be bonded to the same ‘ground ting electrode, Test wells should be provided fo give access to the ground loop for future ground festing pur- poses. 8.2.5 Design configuration There are multiple grounding electrode system configurations available to the designer such as ‘ground loop conductors, radials and ground grids. Soil resistivity, soll physical characteristics ‘and area will be the determining factor when choosing the configuration. Ground rods are the most common form of electrode because they can be driven into the earth with limited excava- tion and backfiling. However, there are also different types of electrodes that can lower the re- sistivity of the grounding electrode system such as electrolytic ground rods and low resistance backfill material. it is common to combine these different options, depending upon the soil con- ditions, in an electrode system installation. See Annex B for details related to the different types of electrodes available. Annex C provides grounding details specific to towers and antennas. Regardless of the grounding design configuration, all grounding electrodes for a given facilty shall be bonded into a single grounding electrode system. In addition, underground metallic pip- ing within 2 m (6 ft of the building perimeter shall be bonded to the grounding electrode system,ANSUTIA-607-C 9 PERFORMANCE AND TEST REQUIREMENTS 9.1 Two-point groundicontinuity testing This procedure will help determine if there is an acceptable level of resistance between any point in the telecommunications bonding system and the building's electrical grounding elec- trode system. The test is performed using an earth ground resistance tester that is configured for a continuity test, otherwise known as a two-point test or a “dead earth” test. ‘The earth ground resistance tester generates a specific alternating current (ac) test current; this current is less susceptible to the influences of stray currents in the grounding system. This makes the ground resistance test a more accurate testing device than a standard volt-ohm- rmiliammeter. Prior to two-point ground testing, a visual inspection shall be performed to verify that the bond- ing system is installed according to the guidelines in this Standard. Due to the possibilities of ‘ground faults traveling through the telecommunications bonding system, a voltage test should be perlormed prior to conducting the two-point continuity test and verified with the test equip- ment manufacturers instructions, Consult with other contractors to ensure other electrical work does not interfere with this test. ‘The test is typically performed by connecting one test lead fo the nearest building's electrical ‘grounding electrode and the other test lead to a specific point on the telecommunications bond- ing system such as the PBB. This same test can also verify continuity between any two points of the telecommunications bonding system such as between the PBB and a SBB. It is recommended that this test be performed in the following areas: 8) PBB/SBB to the electrical ground in Distributors b) PBBISBB to the structural metal (if present) ©) PBB to SBB 4) Structurai metal (if present) to the electrical ground. In order for this test to be valid it should be done before the telecommunications equipment is installed otherwise parallel paths may invalidate test results. ‘The recommended maximum value for resistance between any point in the telecommunications bonding system and the building's electrical grounding electrode system is 100 millichms. In the case of long TB and BBC conductor runs, the resistance of the conductor shall be factored into the total resistance. For example 1km of a 2/0 AWG conductor has a resistance of 0.2028 ohms. (0.05180 chms per 1000 ft). 9.2 Grounding electrode system testing 9.2.1 Three-pole fall-of-potential mothod The three-pole falloF-potential measurement method measures the ability of an earth ground system, or individual electrode, to dissipate energy from a site. The test instrument manufactur- rs instructions shall be followed when making a three-pole fall-of potential resistance meas- urement. ‘Typically, the measurement method involves disconnecting the earth electrode from its connec- tion to the site, placing two earth stakes in the soil in a direct line away from the earth electrode ‘and connecting the test instrument cords. 35ANSUTIA-607-C WARNING — Connecting and removing connections to a bonding and grounding system could have hazardous consequences. ‘The distance between the stakes and the ground electrode may vary depending upon the test Instrument instruction, A general stake distance is given in table 2 and illustrated in Figure 18. A known energy potential is generated by the instrument between the outer stake and the earth electrode. The drop in potential is measured between the inner stake and the earth electrode. To test the accuracy of the results, and to ensure that the ground stakes are outside the spheres of influence, reposition the inner stake (probe) 1 m (3 ft) in either direction and take @ fresh measurement, If there is a significant change in the reading (30 %), increase the distance between the ground rod under test, the inner stake (probe) and the outer stake (auxiliary ground) until the measured values remain fairly constant when repositioning the inner stake (probe). Table 2 Stake distance Depth of ground electrode | Distance toinner stake | Distance to the outer stake 2m. 15m eteieecean Onin 3m 20m 30m em 25m 40m 10m 30m ~ 50m 36ANSIITIA-607-C Figure 18 — Illustration of test i \strument connections. 9.2.2 Clamp-on test meter ‘The manufacturer's instructions shall be followed when using the clamp-on test instrument when making a ground resistance measurement. The instrument has a transmitter and receiver built into a split core head that allows the instrument to clamp onto the ground under test. The in- ‘strument can be used in multi-grounded systems without disconnecting the ground under test. However, the clamp-on test instrument should not be used in the following situations: 2) to commission new grounds, as they will not likely be connected to the utility power sup- ply, and hence no return path exists for the test current; 37ANSITIA-607-C b) to measure soll resistivity (electrical conductivity properties of the soil) this requires the use of a four-terminal tester (see 9.3.2): ©) to test any complex ground system where a metallic loop exists; test current will return through metal and not be forced into the soil. These include systems such as ring grounds, counterpoise, substation grounds, and various other multiple interconnected ground systems; and 4) to perform any test where a client or third party require conformance to a reference standard: the clamp-on test method has not been incorporated into any independent standard. Before taking a clamp-on ground resistance measurement, ensure that the meter is calibrated. ‘Once calibrated, attach the clamp to the electrade to be measured and read the ground re- sistance from the display. 9.3 Soil resistivity testing 9.3.1 General Soil resistivity testing measures a volume of soil to determine its conductivity. The soil composi- tion, moisture content, and temperature affect soil resistivity. Additionally, the resistivity of the soil will vary geographically, and at different soil depths. ‘There are several testing methods that can be utlized to measure soil resistivity from taking soll samples for lab testing to a number of different methods that provide the best indication of con- ditions at the sits. The most common method utilized for measuring soil resistivity is the four- point method using the equally spaced Wenner arrangement 9.3.2.1 General ‘The manufacturer's instructions shall be followed when using the four-point test instrument when making a soil resistivity measurement. The test instrument uses four terminals to make this measurement. Four stakes are driven into the earth, all at depth B and spaced (in a straight line) at equal distance intervals A. The test current | is passed between the two outer stakes (C1 and C2), and the potential V is measured between the lwo inner stakes (P1 and P2). The re- sistance ‘can then be calculated using Ohm's law. Figure 19 shows an example of the four-point ‘method. 38ANSITIA-607-C. ae 4 ‘ [+ + | 9 | 1 | Figure 19 - Four-point method 9.3.2.2 Test procedure ‘The conditions at the site should be noted including weather and soil conditions. The weather history for the three days prior to testing should also be included in the test documentation. A series of readings should be taken at various stake spacings and locations around the site (see figure 20). ‘The test results should be reported in a data table format as represented in figure 21. This will provide a set of resistivity values which, when plotted against pin spacing, indicates whether there are distinct layers of different soil or rock; and gives an idea of their respective resistivities and depth. The results can be used to develop a model of the soil resistivity at the site. Many designers take an average of the readings and use formulas for uniform soil to calculate the resistance of ‘a ground electrode system design. Computer programs are available to the designer that can create more sophisticated mult-layer soll models for analysis of the ground electrode system, 39ANSI/TIA-607-C. First location | Second location ~ | Third location: Fifth location: a Fourth location: ai Figure 20 - Example of multiple test locations 40ANSITIA-607-C. Soil Resistivity Data Site: Figure 21 - Recommended resistivity table layout aANSITIA-607-C ‘Annex A (informative) BONDING METHODS This annex is informative and is not part of this Standard. Bonding connections are made by means of listed exothermic welds, listed irreversible com- pression connectors, or listed mechanical connectors xothermic welding is a method of making permanent welded electrical connections without ex- temal power, such as electricity or gas. Itis an exothermic chemical reaction (exothermic means to release heat). The temperature of the molten metal created during the reaction is sufficient to fuse the metal of the conductors, resutting in @ welded molecular bond, Exothermic welding can bbe used to produce welded connections of copper to copper and copper to steel. The advantage of exothermic connections over compression and mechanical connections is that exothermic connections produce a molecular bond with all the strands of the conductors, while compression ‘or mechanical connectors do not. All underground connections are made following manufacturer recommendations with the exothermic welding process that use the proper mold and weld metal materials, A listed irreversible compression connection is made by using specific fittings and a high ton- nage compression tool. These connections are considered maintenance free; however they may not be when used underground, When making a listed irreversible compression connec- tion, all surfaces should be properly cleaned and the components property sized for the conduc- tors being bonded. Mechanical connections are only to be used above ground and in areas where itis impractical to use either an exothermic or irreversible high compression connection, When making @ me- chanical connection, all surfaces should be property cleaned and the components tightened to the correct torque rating of the hardware. Additionally, the correct material is used s0 as not to form a galvanic couple. 42ANSIITIA-607-C. Annex B (informative) GROUNDING ELECTRODES This annex is informative and is not part of this Standard. BA General Grounding electrodes connect electrical systems and equipment to earth, Grounding electrodes may be ground rods, metal plates, concrete encased electrodes, ground rings, electrolytic ground rods, the metal frame of the building or structure, and metal underground water pipes. Metallic underground gas piping is not used as a grounding electrode, but is bonded on the cus- tomer side of the meter (see NFPA-70 [NEC®] and NFPA-780), B.2- Ground rods Ground rods should be constructed from copper clad steel, solid copper, hot-dipped galvanized ‘steel or stainless steel and be listed by a nationally recognized testing laboratory (NRTL). The. rods should be a minimum of 2.4 m (8 ft) in length and 12.7 mm (0.5 in) in diameter. For areas highly prone to lightning, a minimum rod length of 3 m (10 ft} should be used. Ground rods ‘should not have a non-conductive coating. Typical ground rods are illustrated in figure 22. = Figure 22 - Illustrative views of typical ground rods 4BANSITIA-607-C B.3 Electrolytic ground rods Electrolytic ground rods are available in vertical and horizontal configurations (see figure 23) and in various lengths, typically 3 m (10 ft) fo 6 m (20 ft) but may be longer. Electrolytic ground rods are constructed of 54 mm (2.125 in) diameter hollow (tube) copper or stainless steel. This ‘tube is filled with a mixture of hygroscopic electrolytic salts; typically 60-percent sodium chloride and 40-percent calcium chloride. Electrolytic grounds rods help lower soil resistance by absorb- ing moisture out of the air and forming an electrolytic solution within the tube, then leaching out the rod into the surrounding soil. Additionally, the rod is encased in a conductive non-corrosive carbon based backfill material Listed electrolytic ground rods should be considered for use where standard ground rods do not produce an acceptable grounding electrode system resistance. Unacceptable grounding elec- trode system resistance may be found at sites where there is high soil resistivity, (ie., above 25 000 ohms-om), areas with limited space or areas where the grounding electrode system is covered by non-porous materials such as concrete or asphall. In all cases, manufacturer rec- ‘ommendations should be followed when installing electrolytic ground rods. Breatherholes {Exothermie connection Covered cn Hen dilige veep vse ae oss 2 AWG mirimum ‘copper conductor Figure 23 — titustrations of a vertical and horizontal olectrolytic ground rod B.4 Ground plate electrodes Ground plate electrodes are constructed from copper having a minimum thickness of 1.5mm (0.06 in) or from steel having @ minimum thickness of 6.35 mm (0.25 in). A listed ground plate electrode should be installed a minimum of 0.75 m (2.5 ft) below grade and below permanent moisture level if practical. If soil conditions do not allow the ground plate elec- trode to be buried at this depth, they should be buried as deep as practical. Ground plate electrodes should only be used if soll conditions prohibit the use of standard ground rods, or they are specifically engineered into the grounding electrode system B.5 Wire mesh Wire mesh is typically fabricated from solid copper or copper clad steel wire, ranging from 6 AWG to 12 AWG. The wires are brazed together in a grid form with spacing between conduc- tors ranging from 50 mi (2 in) through 1.2 m (4 ft). All joints should be silver brazed or equiva- lent Listed wire mesh should be used where ground rod electrodes cannot be driven or are ineffec- tive because of soil conditions or where itis desirable to establish a superior ground plane. 44ANSI/TIA-607-C B.6 Concrete encased electrode A concrete encased electrode is an electrode encased by at least 50 mm (2 in) of concrete and located horizontally or vertically near the bottom of a concrete foundation or footing that is in direct contact with the earth. It consists of at least 6 m (20 ft) of one or more bare or zinc galva- nized or other electrically conductive coated steel reinforcing bars or rods of not less than 12.7 mm (0.5 in) diameter or of at least 6 m (20 ft) of bare copper conductor not smaller than 4 AWG. (See figure 24), La 4 AW copper wie ome / ‘ezmnpsin cesar ae (typical) ae raee minimum Figure 24 - Illustrative view of a concrete-encased electrode Side view End view B.7 Ground ring electrodes Ground ring electrodes encircle the building or structure and are in direct contact with the earth ‘They should be installed to a minimum depth of 0.75 m (2.5 ft) below grade or below the frost line, whichever is deeper. The ground ring conductor should be 2 AWG or larger bare, solid, tinned or un-tinned copper conductor. For areas with high lightning events, larger conductors such as 1/0 AWG or larger should be considered. Stranded conductors should be used with these larger sizes; finned conductors are recommended. Ground ring electrodes may also incorporate the use of driven ground rods. B.8 Ground radial electrodes Radial conductors should be a bare tinned or untinned copper conductor, minimum 2 AWG. There should be a minimum of three conductors of different lengths; equally spaced from one another as much as practical, The minimum length of each radial should be 7.6 m (25 ft) and a maximum of 24.4 m (80 ft). Radial grounding conductors should be installed in direct contact with the earth and should be installed to a minimum depth of 0.75 m (2.5 ft) below grade or be- low the frost line, whichever is deeper. Radial grounding conductors may also incorporate the use of driven ground rods. Radial grounding conductors should be installed horizontally in the ground and radiate away from the building or structure (see figure 25). 45ANSITIA-607-C 81m (80 f) mimimum between tower and bualeing (preferred) Figure 25 — Illustrative view of a ground radial electrode B.9 Enhanced grounding materials Enhanced grounding materials are high conductivity materials, which lower ground system re- sistance in high resistance soil conditions. These materials should be manufactured from a high quality relatively sulfur-free carbon source. Many lower grade carbons contain sulfur which is very corrosive especially when encased in concrete. Enhanced grounding materials should be environmentally safe and approved by the authority having jurisdiction (AF). Enhanced grounding materials should be considered for use around ground rod electrodes and grounding electrode rings in high soil resistance conditions (see figure 26). 48ANSITIA-607-C. Figure 26 - Illustrative example of ground enhancement materials surrounding a ground ing conductor and a ground rods B.10 Grounding conductors Grounding conductors are used to connect equipment or the grounded circuit of a wiring system to a grounding electrode or a grounding electrode system, These conductors should connect grounding electrodes together, form buried ground rings and connect objects to the grounding electrode system. Grounding conductors may be solid, stranded, tinned, or un-tinned and may be bare or insulated. Above ground conductors should be jacketed with green or green with yel- low striping insulation, Unless otherwise stated, all below-ground ground electrode conductors should be a bare solid Copper conductor not smaller than 2 AWG. Bare stranded copper conductor not smaller than 1/0 AWG, tinned conductors is recommended. When installing grounding electrode conductors, they should be installed in one continuous length without splices unless using listed exothermic connections or listed irreversible compres- sion-type connectors. The conductor runs should be as short and straight as practical. Bends in the conductor should be made toward the ground location. See 7.6.2 for information on ri mum bend radii and included angles. 47ANSI/TIA-607-C Annex (informative) TOWERS AND ANTENNAS This annex is informative and is not part of this Standard. CA General ‘This clause describes specific electrical protection considerations for antenna support structures (towers). 2 Grounding electrode system 6.2.1 External grouni 9 Figure 27 illustrates an example view of a tower and antenna site grounding electrode system, Figure 27 — Illustrative example w of a site groun 1g electrode system €.2.2. Bonding busbars The purpose of a bonding busbar is to provide convenient bonding points for various elements of a telecommunications system and ancillary support apparatus. There are several types of bonding busbars: ) External bonding busbar ‘The purpose of the external bonding busbar is to provide convenient termination points for the sheath (shield) of antenna transmission lines and other telecommunications ca- bles prior to their entry into a building or shelter. 48ANSITIA-607-C. b) Internal bonding busbar The purpose of the intemal bonding busbar is to provide convenient termination points on all metalic items within a building or shelter in an effort to provide potential equaliza- tion. ©) Tower bonding busbar ‘The purpose of the tower bonding busbar is to provide a convenient termination point on the tower for multiple transmission lines with metallic sheaths (i.e. coaxial cable) Bonding busbars are sized to meet immediate application requirements while taking into con- sideration future growth, The external bonding busbar is installed at the point where the antenna transmission lines and other telecommunications cables enter the building or shelter. It is connected directly to the grounding electrode system using 2 AWG or larger bare, solid or stranded, tinned or un-tinned Copper conductor. This conductor is installed in a direct manner with no sharp bends or narrow loops. Larger conductor sizes such 2s 4/0 AWG are recommended in high lightning prone are- as. Connection of the grounding electrode conductor to the external bonding busbar is by a listed exothermic connection or listed irreversible compression connection. The tower bonding busbar is installed below the transmission line ground kits, near the area of the tower at the point where the antenna transmission lines extend from the tower to the build- ing oF shelter. It is connected to the tower grounding electrode system with a 2 AWG or larger bare, solid tinned copper conductor. For reduced impedance to earth, the tower bonding busbar is directly bonded to the tower, thereby utiizing the tower as the down conductor. Care is also taken to select the proper materials so as to prevent a dissimilar metal reaction. To maintain equal potential between the transmission ines and the tower, busbars are installed at the top and bottom of the tower, providing termination points for bonding the transmission lines cable shields to the tower. If the tower is greater than 60 m (200 ft) in height, busbars are installed every 15 m (50 f), they are bonded to the tower and to the transmission line cable shields. ©.2.3 Grounding systems C234 Type sites ‘Type 1 sites are considered non-critical to the operation of the telecommunications system. NOTE - The owner of the telecommunications equipment or the authority having jurisdiction (AH) determines whether the site is Type 1 of Type 2. Type 1 sites may not have a tower on the site, may be located in a commercial office or resi- dence, and may not be part of a larger system, Type 1 sites should have a grounding system resistance of 25 ohms of less. If 25 ohms or less cannot be achieved with one grounding elec- trode, another ground electrode should be installed no closer than 1.8 m (6 ft) (see figure 28). It is recommended (o install at least two grounding electrodes even if the 25 ohms objective is achieved with one. In the case of new construction the reinforcing stee! in the foundation should bbe bonded to the grounding electrade system. 49