eMBMS XCAP Analysis

MOP
NEO-RF
April 2017

2016 Samsung Electronics. All Rights Reserved. Confidential and Proprietary.

 XCAP Analysis
Analysis in X-CAP comprises of below parts:
Finding issues through Map
Tabular Analysis
Graphical Analysis
Layer 3 analysis (Logging message)

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 Model Preparation (1/5)
First step of XCAP analysis to create model from the
drive test log file.
Model can created as shown below:

Click on this
Icon to create a
new model

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 Model Preparation (2/5)
Select the log file (s). Select Separate if models need to be
created separately or select merge to combine all the log files.
Sampling Rate has to be set to All every time.
Model Name can be given for multiple files merged into single
model
Multiple has to be selected and dragged to right hand side as
shown below.

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 Model Preparation (3/5)
Click the settings button before clicking the Open button.
In that options, select Model.
Here you can give the path where model needs to be saved.
After setting the path, you can start for model preparation by
clicking Open

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 Model Preparation (4/5)
After clicking Open, model preparation will start as shown
below.
Once the model is prepared, it will be displayed in model tab.

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 Model Preparation (5/5)
Multiple models will be visible when we click the model tab as
seen below.

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 XCAP KPIs (1/2)
Before we proceed for analysis, we need to know the
below KPIs for eMBMS:
EARFCN/Band
PCI
RSRP
SINR
PMCH SNR
PMCH BLER
PMCH Throughput
Cell ID Information (eNB ID)
RRC State
These all KPIs will be available in the tree shown in
subsequent slides
First step is to select Table/Map/Graph as per
requirement

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 XCAP KPIs (2/2)
1. EARFCN/Band
2. PCI
3. RSRP 6
4. SINR
5. PMCH SNR 2
6. PMCH BLER
5
7. PMCH Throughput
3
8. Cell ID Information (eNB ID)
9. RRC State

7
4

1 8
9

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 Analyzing issues through Map (1/3)
Below are sample plots which we can get through XCAP and then
exported and plotted on Google Earth.
From this plot, we can identify the exact location/eNB to troubleshoot
the issue.
Sample analysis is shown below

PMCH Throughput
Band Distribution

UE latched to 850 band as seen in red highlighted area as ENB-4236 is down.

At the same time, PMCH Throughput is not seen at all which can be seen from plot.
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 Analyzing issues through Map (2/3)
Below are sample plots which we can get through XCAP and then
exported and plotted on Google Earth.
From this plot, we can identify the exact location/eNB to troubleshoot
the issue.
Sample analysis is shown below

PMCH SNR PMCH BLER

Highlighted area shows poor SNR and High PMCH BLER which can be due to poor
coverage or this can also be due to any site not configured with eMBMS
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 Analyzing issues through Map (3/3)
Below are sample plots which we can get through XCAP and then
exported and plotted on Google Earth.
From this plot, we can identify the exact location/eNB to troubleshoot
the issue.
Sample analysis is shown below
PMCH
EARFCN RSRP
2 SNR

1
3

6
5

Point no. 1: Incorrect SIB15 configuration at ENB-4731

Point no. 2 & 3: eMBMS not configured at ENB-4716 and 4948
Point no.4: eMBMS not configured at newly integrated site of RCP ENB-4734
Point no. 5: eMBMS not configured at ENB-1507
Point no. 6: eMBMS not configured at Small Cell - 131458
Band change was mainly contributed by either I-MLB (to 1800/850) or Idle mode band change (to 2300 2 nd carrier)
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 Tabular Analysis
Below KPIs are mainly required to understand and do bin
by bin analysis
Average values can be used for report purpose

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 Graphical Analysis
Sample graphical analysis for the same KPIs as discussed in previous
slide
eMBMS stopped working (No PMCH Throughput) for the PCIs as
highlighted
We can also whether it has stopped due to Band/EARFCN change

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 Layer 3 Analysis (1/5)
Layer 3 messages help us to understand insight details of the
call (whether it is voice/data or eMBMS)
To check the layer 3 messages, click on logging messages as
shown below.
Logging messages will be seen as below

Detailed
window

Logging
message

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 Layer 3 Analysis (2/5)
For eMBMS analysis, below messages are the most important
one.

SIB2: This message will help to check the eMBMS configuration is

present at that cell or not.

SIB13: This message will provide mbsfn area information along with
some other eMBMS
parameters

SIB15: This is configured on both 2300 (20MHz) as well as non-

eMBMS bands. This message when checked on 2300 (20MHz) will
provide info related to SA ID. When checked on other bands, it
gives info related to EARFCN configured with eMBMS and SA ID.

MbsfnAreaConfiguration: This message contains the PMCH Info.

Also it helps us to understand that device was actively watching
eMBMS. This message
repeats continuously till the UE has eMBMS app running.

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 SIB2: Service Availability to check eMBMS

Service Availability:
Check Unicast service status.
Check whether LSMR eMBMS Status is equipped or unequipped .
Check SIB-2 parameter for eMBMS Info available at bottom to confirm eMBMS service
status. (Snapshot shown below)

eMBMS equipped
case

No eMBMS
Info

eMBMS
Unequipped case

Most important point:

Only 2300 (20MHz) EARFCN will have eMBMS services.
So if UE is on other EARFCNs, eMBMS configuration will not be found 17
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 SIB13
This message will provide mbsfn area info along with some
other eMBMS parameters
This message will only be present if eMBMS is configured at
cell level

MBSFN Area
ID is 101 in
this case

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 SIB15
This is configured on both 2300 (20MHz) as well as non-eMBMS
bands. This message when checked on 2300 (20MHz) will
provide info related to SA ID. When checked on other bands, it
gives info related to EARFCN configured with eMBMS and SA
ID.

Non-
2300
eMBMS
(20MHz EARFCN
)

EARFCN
which is
configured
SA ID Info
with eMBMS
and SA ID
Info

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 MbsfnAreaConfiguration
This message contains the PMCH Info.
Also it helps us to understand that device was actively
watching eMBMS. This message repeats continuously till the
UE has eMBMS app running.

Multiple MBSFN
Area
configuration
messages

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Copyright and Confidentiality
Copyright 2016, SAMSUNG Electronics Co., Ltd. SAMSUNG Electronics reserves the right to make
changes to the specifications of the products detailed in this document at any time without notice and
obligation to notify any person of such changes. Information in this document is proprietary to SAMSUNG
Electronics Co., Ltd. No information contained here may be copied, translated, transcribed or duplicated
by any form without the prior written consent of SAMSUNG Electronics.