VII.

Colloidal Processes

7.2 Tape Casting p g

Professor W. J. Wei Dept. Mat. Sci. Eng. National Taiwan University

Ref. 1. J. R. Reed, 1 J R Reed Chapter 25 and 26 2. , 13

http://www.mse.nthu.edu.tw/ jhjean/ http://www.mse.nthu.edu.tw/~jhjean/ resource.htm

What is Tape Casing ? Tape Casing?

The tape casting (doctor blade process) is p g( p ) -a shape forming technique, which produces thin flat sheets. -a doctor blade to conrol a moving ceramic slurry. -a bi d system offer enough ' binder t ff h 'green strength strength' t th' th Punching and Printing on Tapes Lamination Binder-burn-out (BBO) steps Sintered.

Tape Casting Equipment

http://drm.kist.re.kr/cerapedia/ process/jgl003.html

Multi-layer Assembly of MLCC (passive chips) or ceramic/metal module

Formulation of Tape Casting

Powder + solution (water or organic solvent) + binder di bi d + dispersant + de-foamer + plasticizer +homogenizer t d f l ti i +h i

Binder and Plasticizer for Tape Casting

Effect of Binder Content

Effect of Binder: -potential

B. Bitterlich and J. G. Heinrich, J. Euro. Ceram. Soc. 22(2002) 2427~2434 C.A. Gutierrez and R. Moreno, J. Euro. Ceram. Soc. 20(2000) 1527~1537

Adsorption Isotherms of Polymeric Additives Ad ti I th fP l i Additi

0,2 m Alumna powder with BET area: 11.2 m2/gm, in MEK/toluene Plateau coverage: PVB = 3.46 MFO = 2.31
mg m2

mg

m2

Binders: PVB(B79 and B76) M W B79 = 65000, B76 = 105000 M.W 65000 Dispersants: Mahatan Fish Oil (MFO) M.W=2000-3000

Tape Forming Fundamentals

a combination of pressure-driven flow and shear-driven flow pressure driven shear driven

Y. T. Chou, Fluid flow model for ceramic tape casting, J. Am. Ceram. Soc., 70 [10] C-280-C-282 (1987)

Effect of Casting Variables (the forces)

the ratio of pressure force to viscous force, ,

Thickness vs Tape Casting Velocity vs.

At various viscosity! High viscosity is insensitive to elocity!

Critical Tape Casting Factors: CCR & Gap

critical casting rate is 5mm/s below C.C.R. the shearing is very low, and the viscosity of slurry is , y y high.

the thickness and density didnt change at constant casting speed

Gap Size in Tape Casting p p g

Tape Th hickness (mm) s

Blade Gap 1.2 mm Blade Gap 0.4 mm Blade G 0 2 Bl d Gap 0.25 mm

Casting Speed (mm/s) Fig. Plot of the green tape thickness obtained at different casting speeds for three different blade gaps.
Ref: A.I.Y. Tok et al., Tape casting of high dielectric ceramic composite substrates for microelectronics application, Journal of Materials Processing Technology 89-90 (1999) 508-512

Thickness vs. Gap and Speed p p

Blade Speed 5 mm/s Blade Speed 10 mm/s Blade Speed 20 mm/s

Tape Th hickness (mm) s

Blade Gap (mm) Fig. Plot of the green tape thickness obtained at different blade gaps for g p three different casting speeds.

Defects in Tape: cavity on surface

Green tape

Binder burn-out

Sintered tape

Defects in Tape: Non-uniform Shrinkage

5 cm

(0,Y)

(X,0) Casting Direction

Four main stabilization treatment Bake: 2 h at 120oC in flowing air. Thermal cycling: -5oC for 30 min, then 120oC for 30 min, 4 times. S l t exposure: saturated toluene vapor for 1 h at room Solvent t t dt l f t temperature, then simple bake. Humidity: 24 h at 100% RH, 80oC, then 24 h at 80oC in flowing air. Aging : 23oC, 50% RH

Directional Linear Aging Shrinkage of Green Tapes

Treatment Solvent-based Untreated Bake Thermal cycle y Solvent Humidity X : 0.92 0.30 0 30 0.25 0.25 0.15 0 15 Y : 0.71 0.27 0 27 0.27 0.27 0.14 0 14 Shrinkage % Aqueous-based X : 0.40 0.28 0 28 0.40 0.40 0.17 0 17 Y : 0.31 0.32 0 32 0.36 0.44 0.21 0 21

*After 35 days o ag g te of aging

Microstructure of surface vs. bottom

Aqueous q Aqueous Bottom Surface

Organic: bottom

surface 3 m

10 m

Cross-Sectional Microstructures
Laminated Sintered

1mm Laminated by compression at room temperature y p p Green tape sintered at 1800C/60min No single layer can be distinguished after laminated and sintered

MLCC: Engineering of Ceramic Tape

Ref: http://www.tactilecomponents.com/ ceramicacapacitor.htm

Properties of Cofired multilayer Ceramic Capacitor (MLCC)

Important Properties
1. Slip viscosity (mPas) 2. Green density (g/cm3) 3. States (thickness, etc.) of the tape 4. Microstructure of green tapes 5. Tensile strength (kPa), for example 6. 6 Sintered density (g/cm3) 7. Microstructure of sintered tapes 8. Dielectric 8 Di l t i permititivity and di i ti f t (%) ititi it d dissipation factor

Tensile Strength and Strain-to-Failure of Tape

*Effect of plasticizer for tape properties

Summary
Multi-layer structure and tape process are most popular and important process for electronic l di f l i components (e.g. L-C-R); Processing parameters are extremely complex; g p The manufacturing has faced the competition from the field of silicon industry (system on chip, SOC). Adapt several technologies from thin film processes and inject-printing.