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DIE ATTACH
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Engr Deorex David Navaja
DEFINITION
Die Attach (also known as Die Mount or Die Bond) is the process of attaching the silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of the semiconductor package. There are two common die attach processes, i.e., adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and die attach tools to mount the die.
12/12/2009
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Engr Deorex David Navaja
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Engr Deorex David Navaja
The adhesive is first dispensed in controlled amounts on the die pad or cavity. The die for mounting is then ejected from the wafer by one or more ejector needles.
12/12/2009
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Engr Deorex David Navaja
While being ejected, a pick-andplace tool commonly known as a 'collet' then retrieves the die from the wafer tape and positions it on the adhesive. All of the above steps are done by special die attach equipment or 'die bonders'
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Engr Deorex David Navaja
The mass of epoxy climbing the edges of the die is known as the die attach fillet. Excessive die attach fillet may lead to die attach contamination of the die surface. Too little of it may lead to die lifting or die cracking.
12/12/2009
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Engr Deorex David Navaja
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Engr Deorex David Navaja
A gold preform is placed on top of the cavity while the package is being heated. When the die is mounted over this gold preform, Si from the die backside diffuses into the gold preform, forming Au-Si alloy. As more Si diffuses into the gold preform, the Sito-Au ratio of the alloy increases, until such time that the eutectic ratio is achieved.
12/12/2009
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Engr Deorex David Navaja
The Au-Si eutectic alloy has 2.85% of Si and melts at about 363 degrees C. Thus, the die attach temperature must be reasonably higher than this temperature to achieve the eutectic melting point. At this point, the alloy melts, attaching the die to the cavity.
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Engr Deorex David Navaja
To optimize the die attachment, the operator 'scrubs' the die into the eutectic alloy for even distribution of the die attach alloy. Eventually the diffusion of silicon atoms into the gold preform exceeds the eutectic limit, and the die attach alloy begins to solidify once again. The package is then allowed to cool down to completely solidify the eutectic alloy and complete the die attach process.
12/12/2009
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Engr Deorex David Navaja
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Engr Deorex David Navaja
12/12/2009
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Engr Deorex David Navaja
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Engr Deorex David Navaja
X-ray photo of large epoxy die attach voids; Au-Si eutectic voids are more visible during x-ray inspection because of the higher density of Au-Si
12/12/2009
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Engr Deorex David Navaja
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Engr Deorex David Navaja