COLAE Seminar Vanfleteren

Stretchable Electronics for
Smart Textiles
J. Vanfleteren
IMEC – UGent/CMST
Technology Park Building 914-A,
B-9052 Gent-Zwijnaarde, BELGIUM
http://tfcg.elis.ugent.be/ or http://www.cmst.be/
Jan.vanfleteren@elis.ugent.be
Contents
• Introduction – options for comfortable

electronics
• Stretchable Mould Interconnect (SMI)
technologies
• Reliability / technology improvement
• Textile integration and washability
• Applications
• Conclusions and outlook
Jan Vanfleteren Gent, April 25, 2012

COLAE Seminar © imec/restricted 2012 2
Contents

electronics
technologies
• Applications

Introduction
• Wearable and implantable systems require

lightweight, comfortable, conformable versions of
electronics and sensor systems  conventional large
rigid PCB’s are not acceptable
(Philips)

Introduction
2 facts to take into account for development of

wearable and implantable circuits :
• Fact #1 : In industrial environment : electronic

circuits are produced and assembled on flat
substrates (rigid or flex)
• Fact #2 : Demand for complex systems requires
the use of COTS (components-off-the-shelf) like
commercial IC’s : microcontrollers, memory,
display drivers, radio chips, etc.

Introduction – options for comfortable electronics
Option#1 : Small area flat substrates
Requires :
• Miniaturisation & high density integration

• Use of 3rd dimension of the substrate
(Oticon)
(multilayer, embedded & stacked Together with
components, folded flex) KULeuven
• Possible embedding in 3D shaped

biocompatible material
Implantable pressure sensor

Option#2 : non-flat substrates
Case#2a : application allows/requires compact, non-flat

assemblies :
• from flat to cylindrical or conical shape : possible to use flexible
circuits
• 3D integration for surface minimization
UTCP
T. Torfs, FS2,
App. Sess. 3

Option#2 : non-flat
substrates
Case#2a : application
allows/requires compact, non-flat
assemblies :
• from flat to any other shape (e.g.
spherical : stretchable circuits
necessary; e.g. spherical camera
sensor, (J. Rogers group, Beckman
Institute, U. Illinois)

Option#2 : non-flat substrates

Case#2b : application requires large area,
distributed electronics, e.g. displays & signage,
sensor arrays
• at least flex  cylindrical or conical shape
• preferably stretchable circuit  arbitrary shape
Stretchable circuit = (compact) rigid/flex

functional islands with stretchable interconnects
Unobtrusive
circuits
Flat substrates :
small area
Non-flat
substrates
SMI
UTCP
Small area Large area
Flex Stretch
Stretch Flex
(Use as functional islands in stretchable circuits)

Contents

electronics
technologies
• Applications

Stretchable electronics
• Start from conventionally packaged sensors and electronic

components, not available in flexible / elastic format  circuits
with advanced functionality possible
• Individual components or rigid/flexible component islands
connected by stretchable wiring

Introduction - Stretchable wiring options
• Conductive polymers : conductivity 3 orders of
magnitude lower than metallic conductors
– Intrinsic conductive polymers (PEDOT, PANI, Polypyrrole,…)
– Stretchable insulating polymers with conductive fillers (e.g. Ag
filled silicones)
• Nanotechnology based materials : e.g. Metal
Rubber™ of Nanosonic Inc. (www.nanosonic.com) :
– Self-assembled nanocomposite material
– Electrical resistance 5x10-6 Ω·cm
(Cu : 1.7 x 10-6 Ω·cm)
– Max. elongation : 200%
– Still extremely expensive
• Metallic conductors
– Highest conductivity
– Lowest cost
– Standard use in PCB industry
Our choice
But : metals not intrinsically stretchable ??

Stretchable wiring – out of plane deformation of
metal interconnects
• Deposition of Cr/Au conductors

on pre-stretched Silicone
(S. Lacour, Princeton University,
New Jersey, USA)

Stretchable wiring – out of plane deformation of
metal interconnects
• Lacour et al. (Princeton),
IEEE Proceedings, August
2005)
•

2D metallic springs – in plane deformation of
metallic interconnects
• Stretchability, while
maintaining sufficient
conductivity, obtained by
meander-shaped fine-line
metallic conductors - “2D
springs”
• Mechanical Modelling :
Stress under deformation
(stretching) dependent on :
– Wave shape (moderate)
– Wave amplitude
(moderate)
– Line width (drastic)
“multitrack” “horseshoe” shaped conductors

2D metallic springs – in plane deformation of
metallic interconnects
Overmoulding of pattern
plated Au tortuous wires
(Source : D. Gray et al.,
Johns Hopkins University,
Baltimore, MD, USA)
expensive process
(evaporated silver
sacrificial layer, batch
processing (no reel-to-
reel capabilities)
“MID” = Moulded
Interconnection
Device

CMST’s MID based processes overview
Acronym Full Name Properties

Circuit fabrication and component
assembly on sacrificial flex or rigid
SMI Stretchable Mould Interconnect
substrate; stretchability introduced at
the end of the process
Start from elastic substrate;
SCB Stretchable Copper Board circuit fabrication and component
assembly on this substrate
Technology ID Name
SMI-1 Plated conductor technology
SMI-2 Peelable substrate technology
SMI-3 Laser structured conductor technology
SCB-1 Stretchable substrate technology

CMST’s MID (Mould Interconnect Device) processes
overview
Common technology properties :
• Key features :
– Meander shaped interconnections
– Moulding technology
– Stress relief (rigid/flex/stretch transistions)
• Processes close to industrial printed circuit
manufacturing  use conventional leadfree solder
assembly process (250-260 degC)
• Completely embedded circuits
– Washability
– Implantability

SMI-1 : plated conductor technology
• (a) pattern plating of

Flexible base material
(a)
Meander shaped wiring meander shaped metal
components wiring on metallic sacrificial
(b)
substrate (e.g. Au plating on
Cu foil)
Underfill, adhesive
Local stiffener
(c)
• (b) mount components
Elastic carrier
• (c) mold/cast stretchable
substrate material (silicone /
(d) poly-urethane)
• (d) remove sacrificial
substrate (wet etch)
(e)
• (e) optionally mount
additional components
• (f) apply second layer of
(f)
stretchable material for
complete embedding
• All processing (including
(a) component assembly (b)) is done
Meander shaped wiring
Flexible base material
components
on non-stretchable substrate,
similar to flex assembly
(b)
Underfill, adhesive
• completely embedded circuits
Local stiffener possible (immersion in liquids,
implantation)
(c) • potential to produce non-planar
Elastic carrier (e.g. cylindric) circuits (by
bending Cu foil + components
before moulding)
(d)
• Process applicable for
• Any platable metal stack (Au,
(e) Ni/Cu/Ni/Au, Pt,..)
• Any liquid, curable stretchable
materials (silicones (Dow
Corning), polyurethanes,...)
(f) • Back-etch of Cu sheet not
environmentally friendly

Stretchable materials selection
Dowcorning Way of # components Remarks Cure Elongation Young’s Viscosity Extra

type application (%) Modulus (Pa.s) products
(MPa) needed
Sylgard 184 Used in literature
Sylgard 186 2 as a stretchable 15’ @150°C 160 1,9 3,9
dielectric
Silastic Spinning base/curing agent Designed for * Dowcorning

MDX-4210 Casting 10:1 MEDICAL 15’ @100°C 470 60 360 medical fluid
Moulding device
encapsulation =>lower
viscosity
WL-5150 Low- 37,6 160 0,45

Spinning 1 Photopatternable temperature-
Store @ -15°C curable
WL-5351 7,4 370 0,1
JCR6224 Printing 1 BLACK 60’ @150°C 3,0 270

Store @ -20°C
• Suppliers of silicone materials : DOW Corning, Nusil

• From stretchability point of view : Sylgard and Silastic are
the most interesting DOW Corning materials

Moulding technology for polymer substrates
a) Injection of polymer to embed the first face
of system on cupper foil
a b) Etching of the cupper substrate
c) Injection of the bottom layer of polymer
d) Unmolding the stretchable system

Mould Design
The areas where the

components are, are
thicker to make them
locally less
stretchable.

Use of solder mask for component assembly
1,5 mm Component
Solder or ICA
Solder Mask (not removed)
0,5 mm Plated stretchable

Silicone
interconnection
• component assembly compatible / identical
to standard flex circuit assembly
• low level stress at component assembly
sites
8 lead SMD packaged temperature sensor

assembled using adhesives and embedded in
PDMS (Dow Corning Silastic)
SMI-1 Demonstrators
Operating blue LED under 35%

stretching
Stretch test of operating elastic

circuit
SMI-1 Demonstrators
Stretchable thermometer
Real-time temperature measurement

Drawbacks of SMI-1 :
• Etching of (thick) uniform Cu sacrificial substrate

• Shorts between component pads when mounting
components :
– Impossible to assemble charged battery
– Impossible to check circuit functionality and to perform
repair

SMI-2 : Peelable Substrate Technology
• Elimination of conducting Lamination

sacrificial substrate : use
polyimide (PI) flex or FR4 type Lithography + wet etch
carrier subsrate instead of
metal foil Assembly
• No more plating of the
conductors  standard PCB
Cu Embedding I
• Process close to PCB
manufacturing and component
assembly practices (use of Peeling
lead-free solder)
• Need for high-T temporary
bonding adhesive
(withstanding 250degC solder
process)
copper Embedding II
wax
carrier
PDMS, PU
component

SMI-2 demonstrators
• Inductive link (with

KULeuven/ESAT/MICAS)
• 70micron Cu to ensure
sufficient high Q-factor
• Water-proof operation (>
2 months)

SMI-3 : Laser structured conductor technology
Standard flex
copper
PI + Cu
PI
wax
ceramic Laser cutting
silicone
component Removal of
residues
• Very fast
prototyping Assembly +
Molding I
technology
• Cu on polyimide
Molding II
carrier  high
reliability
• Industrialization of
residue removal
step ? Seems
difficult
After laser cutting After residue removal

SMI-3 demonstrators
• Normally processed single-sided flex with

laser cut stretchable interconnects
• Fully functional stretchable wrist watch
inlcuding
• TI Microcontroller
• Rigid 4 x 7 segment TN LCD
• Pushbuttons
• Battery
• Passive components
• Lifetime : 1 year (battery)
Stretchable watch (master thesis T. Vervust)

SMI-3 demonstrators
2nd Approach :
• “perforated flex” :
“stretchabilisation” of
standard flexible circuit
• No real stretchable
interconnects
• Less deformable, more
reliable than 1st
approach
• 7 x 8 LED matrix,
driven by single chip
(charlieplexing)

SCB-1 : Stretchable substrate technology
(a) • Rough copper base substrate

(18 μm thick) (a)
(b) • Spinning silicone (as thin as
few 10s of microns) (b)
• Patterning the Cu (c)(d)
(c) • Component assembly (now
on stretchable substrate) (e)
(d) • Conventional PCB
manufacturing and
component assembly flow
(e)
• use of high T stretchable
material necessary to allow
(f) use of vapour phase reflow
and SAC solder (260° C
copper max.) for component
photoresist assembly
Silicone
component

SCB-1 demonstrators
Copper TW-TW
Spinned silicone
Polyimide foil (no adhesion to cured silicone)
Patterned meanders and

functional island in copper Soldered components Final system
(Ni/Au plating)

Comparison of the process flows
Lab Conductor
Potential indutrial Min. conductor
Technology Name throughput thickness
throughput speed pitch (micron)
speed (micron)
Plated conductor
SMI-1 slow (plating) slow (plating) 4 to 7 30
technology
Peelable substrate
SMI-2 fast fast 17, 35, 70 100
technology
Laser structured slow (laser
SMI-3 very fast 9, 12, 17, 35… 50
conductor technology structuring)
Stretchable substrate
SCB-1 fast fast 17, 35, 70 100
technology
Potential
indutrial Test before Rework before Rework after
Technology Name
throughput embedding embedding embedding
speed
Plated conductor
SMI-1 slow (plating) not possible not possible not possible
technology
Peelable substrate
SMI-2 fast possible possible not possible
technology
Laser structured slow (laser
SMI-3 possible possible not possible
conductor technology structuring)
Stretchable substrate possible, but
SCB-1 fast possible not possible
technology more difficult

Comparison of the process flows (2)
Technology Name Special features / issues

very fine pitch possible
Plated conductor
SMI-1 battery integration difficult
technology
lots of waste (Cu substrate back-etch)
Peelable substrate need for high-T temporary bonding adhesive to avoid
SMI-2
technology process instability during solder assembly
Laser structured
SMI-3 Cu meanders still on PI carrier; high reliability expected
conductor technology
Stretchable substrate
SCB-1 limited to high-T elastic carrier materials
technology
Favourite technology, in terms of the state of technology development and

potential industrialisation :
SMI-2 : Peelable substrate technology
(SMI-3 (“perforated flex”) also used for fast prototyping)

Contents

electronics
technologies
• Applications

Reliability tests : uniaxial stretching
2 types of « stretchability » tests :
• 1-time stretchability (stretch until
failure, i.e. loss of electrical connection)
• Cyclic stretching (more relevant for
actual use)
Relevant cases :
• Reliability of stretchable interconnects
• Reliability of transition component /
component island to stretchable
interconnect
Measurements
• Electrical resistance
Reliability test vehicle (with
or without interposer)

1-time stretchability
W : track
width
L : track
period
0
3 type of “horseshoes” :
R = 900 µm
H = 0 => H0 SMI-3 technology
H = 30deg => H30 W <= R/10
H = 45deg => H45

Reliability tests : Cyclic uniaxial stretching
Elongation
20%
cycle
10s Time
• 3000 cycles until conductor break
for
– SMI-3 technology (laser cut Cu on PI)
– Track width W = 100µm
Ω – Meander length L = 800µm
– Horseshoe angle = 30
– 20% elongation
• SMI-2 (pure Cu) behave worse
Instron 5543

• Cyclic uniaxial stretch tests on SMI-2 samples

• Meander radius = 700m, metal track width = 100m
• Period of stretch & release cycle = 2s
• Monitoring of electrical continuity of stretchable interconnection lines

Measurements
End of life
SMI-3 (Cu on
PI)
Ag filled PDMS
shunt

Lifetime of a stretchable interconnect
Ongoing experiment
1000000
Interconnect lifetime (# cycles)

100000
10000
1000 y = 2E+06x-3.061
100
1 10 % strain 100
• Lifetime decreases with % strain to the power 3

• At 10% strain : lifetime of 2500 cycles
• At 2.5% : 500 000 cycles exceeded, test still ongoing
• At lower strains (< 5%) : lifetime exceeds this law
Reliability : failure modes and solutions
1) Crack formation and propagation

 avoid plastic deformation
by use of other metals
 optimize meander design,
based on FEM modeling
 reduce crack propagation
with PI support
2) Buckling :
 reduce width of meander track
(planned)
 Support meander with PI

Reliability enhancement : Multitrack design
“Twirl” shape
Reliability enhancement by providing bridges

Reliability enhancement : Multitrack design
Non-lethal break
20% deformation 60% deformation

Reliability enhancement : component and
meander support for SMI-2
Straight tracks on component island:
when stretched, a lot of stress is induced in
the copper wiring, which breaks.
metal Components on pads of stretch interconnects:

when stretched, a lot of stress is on the solder
metal
joints and pads, which break.
B Polyimide supporting the component island

protecting the straight tracks and soldered
joints
Polyimide supporting the stretchable copper
support
conductors
metal
support
Temporary support Strong and flexible
during process Polymer
Flexible support
for functional
Temporary adhesive Islands and
during process. meanders
Melts when heated.
Standard
PCB
process

Flexible functional Stretchable

island interconnection
Rigid carrier Wax Adhesive layer

Completely embedded
in stretchable material

Reliability enhancement : rigid-flex-stretch
transition improvements
– Flexible supporting islands:
– Better transition between rigid interposers
and stretch connections
– Better transition between SMD components

and stretch connections
– Better transition from flex to stretch:

patterning supporting polyimide and copper
– Stretchable conductors:
– Support of stretchable conductors by
polyimide

– Molding improvement:
– Gradual transition (fillet) between thicker and thinner parts
Less local stress concentration at interface

Interposer integrated Rigid-flex-stretch transition
Single layer:
Molding improved
multilayer interposer can be mounted

4 samples TM1-v1 5 samples TM1-v2

# Cycles to failure
• cyclic strain of
10% @ 1% strain
rate
• supported
component islands
• non-supported
meanders Large spread

• Failure mechanisms : breaking of supporting PI layer, Cu plastic
deformation
• Combination meander narrowing / thickness transition to be
Failure modes :
optimised
Meanders (m): Position on crossection:
M T W B
Interposer connection:
- Base (B):
- Thin buckle (T)
- Wide buckle (W)

Polyimide as mechanical meander support
Photodefinable polyimide significantly improves lifetime

COLAE Seminar © imec/restricted 2012
Thin-film based SMI with double-sided PI meander
support
Cyclic strain : 10%

Strain rate : 10%/s
Lifetime > 500’000
cycles (4 tracks, 2
with PI and 50nm
TiW/200nm Au
same pattern, 2
with wider PI
support)

Meander circuit design
• Meanders designed as
Theoretical stretchability “horseshoes” =
in meander direction connected circular
Theoretical stretchability
perpendicular to meander segments
direction • Best stress distribution
along the line
• Theoretical stretchability
determined by α
Meander circuit design
W : track Preliminary design rules :

width
• W/R < 0.1
• Practical stretchability 
0.1*theoretical
stretchability (H=0…45deg)
• W : determined by
technology, determines
also minimum R
• Application determines
required practical
stretchability, this
determines horseshoe
L : track
angle
period

Contents

electronics
technologies
• Applications

Textile integration
Interconnection: Principle
Copper pad, free of silicone
Stretchable test sample Interconnect different stretchable modules

with interconnection pads with: stitched conductor, embroidered wire,
conductive ribbon,…

Textile integration: procedure

63
Textile integration:
Screenprinting PDMS gluing layer
Dow Corning 9600 textile glue
PDMS type Viscosity (centipoise)
9601 280000
9600 490000
184 4575
186 66700
Screenprinting done @ Centexbel

64
Textile integration:
Screenprinting PDMS gluing layer
Viscosity
Silicone (centipoise)
186 66700
9601 280000
No silicone on backside
Lamination of silicone sheet (186) on textile via silicone layer of 9601

65
Textile integration: Demonstrators
7x8 led matrix on a T-shirt

66
Technology extensions – textile integration
Molding allows creation of breathable zones (textile integration)

Textile integration: Interconnection
Stitched conductive yarn (done @ Centexbel Verviers)
Stitched conductive yarn : Shieldex (PA + Ag)
Stitched contactpad
Sealed with silicone
(Mechanical and water

protection)

68
Soldered electric wire
Soldered
Electric wires
Sealed with silicone

69
Soldering + sealing

70
Finished samples

71
Textile integration : washability
Complete
embedding creates
potential for
washability

JL-73

Purpose: Reliability of solder contacts of SMD components on flexible islands
Mechanical test: washing
10cm - On flexible substrate (lasercut)
- Daisy chain of 0 Ohm resistors:

0603 and 0402 package
- Dummy IC’s with daisy chain:

TSSOP 28 and QFN 32
- Contact pads P1 to P43 to detect

broken contacts in the chain
- Contact pads are accessible for

measurement trough openings in
silicone

JL-74
Sample details: package types & measurement points
Reference sample Optimized sample
FR4 stiffeners underneath

TSSOP and QFN
components

JL-75
Testsamples and
test overview
 For every test, 6 samples (5 optimized + 1 reference sample)

 Test effect of using protective bag during washing
 Test reproducability of results
JL-76
1) Chain status after 25 cycles (woven, in bag) – reference sample:
2) Chain status after 25 cycles (woven, no bag) – reference sample:

JL-77
Failure analysis of reference sample:
Crack in solder & copper Delamination
Failure on TSSOP leads

JL-78
1) Chain status after 25 cycles (woven, in bag) - Optimized design:

JL-79
1) Woven, in bag
Both for optimized design
Better with protective bag !
2) Woven, no bag

JL-80
1) Woven, in bag
Both for optimized design
3) Woven, in bag
Reproducible

JL-81
Failure analysis of optimized design:
Corners of flex sticking out of PDMS encapsulation

Cracks in flex of resistor chains
Folding of flex (dummy IC islands)

- Partner restricted COLAE
PTW OCT. 2011 - HUMAN ++ Seminar © imec/restricted 2012 81
JL-82
1) Chain status after 25 cycles (knitted, in bag) - Optimized design:
No measurements at t=0
 early failures might be
due to assembly
No failures after 25 washing cycles !

JL-83
1) Chain status after 25 cycles (knitted, not in bag) - Optimized design:
No failures after 25 washing cycles !

Contents

electronics
technologies
• Applications

Stretchable electronics applications
Stretchable electronics useful only if
• Application requires large surface with electronic

components or modules, distributed over the area
or
• Circuit is too large and must be partitioned in

single flex/rigid modules which are then
connected with stretchable interconnects

Examples :
• Lighting, and especially LEDs

– Wearable signage : leisure (party shirt), safety (signage in jackets for
road workers, bikers,…), advertising (the modern sandwich man),
– advanced lighting : atmospheric lighting in interior (upholstery,
curtains, walls, etc.)
• Large area arrays with distributed sensors
– Pressure sensors in mattress
• Body area sensor networks, and especially movement
sensors
– Fall detection
– orientation tracking, body posture tracking for : gaming &
entertainment (advanced Wii), music & dance performances,
revalidation, sports, medical applications (epileptic seizure detection)

Smooth
Philips EC-STELLA demonstrator: fitness monitor flex-stretch transition
Flexible islands for

interposers
PI + copper Soldermask applied

Philips Activity Monitor
Functional boards mounted on flexible islands Molded demonstrator using Sylgard 186 PDMS
Functionality of circuit tested before molding Fully Functional demo, The system includes a
wireless link, a rechargeable battery circuit and
Developed in EU Project Stella accelerometers for activity detection.

Verhaert EC-STELLA demonstrator: baby monitor Smooth
flex-stretch transition
Temporary flex connector
Polyimide
Copper
Soldermask Respiration sensor connections
Flexible island
Smooth
flex-stretch transition Buzzer connections
Embedded in Sylgard 186 by casting

SMI Demonstrators
Verhaert Baby breathing demonstrator
The demonstrator contains 79 components, 2 rubbery rulers and a buzzer.
The rubbery rulers are integrated in the moulded device acting as sensors for the breathing detection.
Developed in EU Project Stella

SMI Demonstrators
Party Shirt (5x10 full color led matrix)
Including wireless communication

SMI Demonstrators
Party Shirt (5x10 full color led matrix)
Fully integrated in T-shirt

Contents

electronics
technologies
• Applications

Conclusions and outlook
• Stretchable circuits were developed, based on

meander shaped high-conductance Cu interconnects
and liquid injection moulding technology
• The technology is to a large extent compatible with
standard PCB circuit fabrication and assembly
technology
• The feasibility of stretchable circuitry was proven by
mechanical reliability tests and functional
demonstrators
• Textile integration is feasible; washability up to 25
cycles proven for test samples on knitted substrates

Conclusions and outlook
• Industrialisation of the technology requires a chain of companies

with various competences :
• Printed Circuit Board Manufacturers
• Electronic assembly companies
• Polymer processing specialists (moulding, …)
• Textile integrators (confection)
• End users
• Technology has reached the level of maturity to start building this
chain

Acknowledgements
• EC-IST-FP6-IP-”STELLA” (STretchable ELectronics for Large Area

applications) (contract nr. 028026)
(http://www.stella-project.eu/)
• EC-IST-FP7-CA-”Systex” (co-ordination action on intelligent textile systems
(since 05/2008) (http://www.systex.org/)
• Flemish IWT-SBO-”BioFlex” : Biocompatible Flexible and Stretchable
Electronics circuits (http://tfcg.elis.ugent.be/projects/bioflex/)
• Belgian TAP2-”SWEET” : Stretchable and Washable Electronics for
Embedding in Textiles (http://tfcg.elis.ugent.be/projects/sweet/)
• EC-IST-FP7-IP-Place-It – “Platform for Large Area Conformable Electronics
by InTegration” (since 02/10)
(http://www.place-it-project.eu/)
• EC-IST-FP7-IP-PASTA – “Integrating Platform for Advanced Smart Textile
Applications” (starting 10/2010)

Recent publications
• J. Fjelstad et al. “Stretchable Circuits”, in “Flexible Circuit Technology”, 4th edition,
BR Publishing, Seaside, USA, Chapter 13, pp. 478-513, November 2011.
• J. Vanfleteren et al., “Printed circuit board technology inspired stretchable circuits”
MRS Bulletin, Vol.37, pp.254-260 , March 2012.
• T. Vervust et al., “Integration of stretchable and washable electronic modules for
smart textile applications”, J. Textile Institute, 05 Mar 2012, 12 pages.
• Y.-Y. Hsu et al., "The effects of encapsulation on deformation behavior and failure
mechanisms of stretchable interconnects", Thin Solid Films, Vol. 519, No. 7, pp.
2225-2234, Jan. 2011.
• R. Verplancke et al. “Thin-film stretchable electronics Technology based on
meandering interconnections: fabrication and mechanical performance”, J.
Micromech. Microeng., Vol.22, No1, published online December 8, 2011.
• Y.-Y. Hsu at al., “Polyimide-Enhanced Stretchable Interconnects: Design,
Fabrication, and Characterization”, IEEE Trans. Electr. Dev., Vol. 58, No. 8, pp.
2680-2688, August 2011.
• Patents / patent applications : #US 7,487,587 B2 (February 10, 2009), #EP 1 746
869 B1 (July 27, 2011), #US 2009 0107704 A1 (April 30, 2009), #WO
2010/086416 A1 (August 5, 2010), #WO 2010/086033 A1 (August 5, 2010), #WO
2010/086034 A1 (August 5, 2010),
Thank you for your attention
Questions ?


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Stretchable Electronics for

• Introduction – options for comfortable

Jan Vanfleteren Gent, April 25, 2012

• Introduction – options for comfortable

Jan Vanfleteren Gent, April 25, 2012

• Wearable and implantable systems require

Jan Vanfleteren Gent, April 25, 2012

2 facts to take into account for development of

• Fact #1 : In industrial environment : electronic

Jan Vanfleteren Gent, April 25, 2012

Option#1 : Small area flat substrates

• Miniaturisation & high density integration

components, folded flex) KULeuven

• Possible embedding in 3D shaped

Implantable pressure sensor

Option#2 : non-flat substrates

Case#2a : application allows/requires compact, non-flat

Jan Vanfleteren Gent, April 25, 2012

Jan Vanfleteren Gent, April 25, 2012

Option#2 : non-flat substrates

Stretchable circuit = (compact) rigid/flex

(Use as functional islands in stretchable circuits)

• Introduction – options for comfortable

Jan Vanfleteren Gent, April 25, 2012

• Start from conventionally packaged sensors and electronic

Jan Vanfleteren Gent, April 25, 2012

But : metals not intrinsically stretchable ??

• Deposition of Cr/Au conductors

Jan Vanfleteren Gent, April 25, 2012

Jan Vanfleteren Gent, April 25, 2012

“multitrack” “horseshoe” shaped conductors

Jan Vanfleteren Gent, April 25, 2012

Acronym Full Name Properties

Jan Vanfleteren Gent, April 25, 2012

Common technology properties :

Jan Vanfleteren Gent, April 25, 2012

• (a) pattern plating of

Jan Vanfleteren Gent, April 25, 2012

Dowcorning Way of # components Remarks Cure Elongation Young’s Viscosity Extra

Silastic Spinning base/curing agent Designed for * Dowcorning

WL-5150 Low- 37,6 160 0,45

JCR6224 Printing 1 BLACK 60’ @150°C 3,0 270

• Suppliers of silicone materials : DOW Corning, Nusil

Jan Vanfleteren Gent, April 25, 2012

Jan Vanfleteren Gent, April 25, 2012

The areas where the

Jan Vanfleteren Gent, April 25, 2012

Solder Mask (not removed)

0,5 mm Plated stretchable

8 lead SMD packaged temperature sensor

Operating blue LED under 35%

Stretch test of operating elastic

Real-time temperature measurement

• Etching of (thick) uniform Cu sacrificial substrate

Jan Vanfleteren Gent, April 25, 2012

• Elimination of conducting Lamination

Jan Vanfleteren Gent, April 25, 2012

• Inductive link (with

Jan Vanfleteren Gent, April 25, 2012

After laser cutting After residue removal

• Normally processed single-sided flex with

Stretchable watch (master thesis T. Vervust)

Jan Vanfleteren Gent, April 25, 2012