The Pb – Sn Phase Diagram

Load Platen Speed**

Surface Abrasive Size lb. (N) (rpm) Time (min.)
240
CarbiMet® Paper 240-grit SiC* 4 (18) 1

CarbiMet® Paper 320-grit SiC* 4 (18) 240 1

CarbiMet® Paper 400-grit SiC* 4 (18) 240 1
CarbiMet® Paper 600-grit SiC* 4 (18) 240 1
MicroCloth® pad 5-mm Al2O3 4 (18) 150 7
MicroCloth® pad 1-mm Al2O3 4 (18) 150 5

Dendritic -Pb face-centered cubic MicroCloth® pad 0.3-mm Al2O3 4 (18) 150 4
dendrites of cast pure lead, Pollack’s 0.05-mm MasterPrep®
Pure Sn, as-polished, polarized light;
reagent, DIC
MicroCloth® pad
Alumina
4 (18) 150 3 twinned -Sn (tetragonal) grains
0.05-mm MasterMet®
MicroCloth® pad - VibroMet® 2  60
Colloidal Silica

*Coat the SiC paper with paraffin wax; use water as a coolant
Reproduced courtesy of ASM International ** Use contra rotation and a low head speed for best results

Cast Pb – 10% Sn; fine precipitates of
-Sn in a -Pb matrix; Pollack’s
reagent
The binary Pb-Sn phase diagram has been studied for over 100 years and is a classic eutectic. Lead (Pb) has an atomic number of 82
and a high density. Its crystal structure is face-centered cubic (fcc). At 50 C, 2% Sn is soluble in Pb and at the eutectic temperature,
183 C, the maximum solubility of Sn in -Pb is 19%. The melting point of pure Pb is 327.46 C. Tin (Sn) has an atomic number of 50
and exists in the  form at room temperature. -Sn has a tetragonal crystal structure. At room temperature, there is almost no solubility
of Pb in Sn and at the eutectic temperature, 183 C, there is a maximum solubility of 2.5% Pb in -Sn. The eutectic reaction,
L  -Pb + -Sn, occurs at 61.9% Sn and at 183 C. The shape of the eutectic Pb constituent varies from lamellar to spheroidal with
Sn as the continuous phase, as shown in the examples below.
High-purity Pb and Sn are very difficult metallographic subjects and the alloys of Pb and Sn are somewhat easier to prepare, but still Pb – 90% Sn, as polished, polarized
rather difficult. The above table lists our preferred preparation procedure. Vibratory polishing is essential for best results. Pollack’s light; B-Sn dendrites with mechanical
reagent (100 mL water, 10 g citric acid, 10 g ammonium molybdate) is one of the best etchants for Pb and Pb-Sn alloys; 2% nital is a twins and an -Pb and -Sn eutectic
good etch for pure tin.

Cast Pb – 20% Sn, as-polished: -Pb
dendrites (white) and -Pb - -Sn
eutectic (dark)
Pb – 40% Sn, Pollack’s etch; -Pb
dendrites (white) and an -Pb/-Sn
eutectic
Pb – 60% Sn, Pollack’s etch, BF; near
eutectic microstructure of -Pb and -Sn
Pb-61.9 % Sn, slow cool, 2% nital etch,
Pb – 80% Sn, Pollack’s etch; note the
BF; -Pb/-Sn eutectic matrix
mechanical twins in -Sn dendrites
and the -Pb/-Sn eutectic

Pb – 30% Sn, as-polished; -Pb
dendrites and an -Pb/-Sn eutectic
Pb – 60% Sn, Pollack’s etch, DIC; near Pb – 61.9 % Sn eutectic, as above but Pb-70% Sn, Pollack’s etch, polarized
Pb – 50% Sn, Pollack’s etch; dark -Pb eutectic microstructure of -Pb and -Sn DIC; -Pb/-Sn eutectic
dendrites and a fine -Pb/-Sn eutectic light; primary -Sn dendrites (with
twins) and the -Pb/-Sn eutectic

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