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1.3 The values stated in SI units are to be regarded as 3.1.2 thermal conductance (C)—the time rate of heat flux
standard. The additional values are mathematical conversions through a unit area of a body induced by unit temperature
to inch-pound units that are provided for information only and difference between the body surfaces.
are not considered standard. 3.1.2.1 average temperature of a surface—the area-
1.4 This standard does not purport to address all of the weighted mean temperature of that surface.
safety concerns, if any, associated with its use. It is the 3.1.2.2 average (mean) temperature of a specimen (disc
responsibility of the user of this standard to establish appro- shaped)—the mean value of the upper and lower face tempera-
priate safety and health practices and determine the applica- tures.
bility of regulatory limitations prior to use. 3.1.3 thermal conductivity (l)—(of a solid material)—the
2. Related Documents time rate of heat flow, under steady conditions, through unit
area, per unit temperature gradient in the direction perpendicu-
2.1 ASTM Standards:2 lar to the area:
1
3.1.3.1 apparent thermal conductivity—when other modes
This test method is under the jurisdiction of ASTM Committee E37 on Thermal
of heat transfer through a material are present in addition to
Measurements and is the direct responsibility of Subcommittee E37.05 on Thermo-
physical Properties. conduction, the results of the measurements performed in
Current edition approved Aug. 15, 2011. Published September 2011. Originally accordance with this test method will represent the apparent or
approved in 1993. Last previous edition approved in 2006 as E1530 – 06. DOI: effective thermal conductivity for the material tested.
10.1520/E1530-11.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or 3.1.4 thermal resistance (R)—the reciprocal of thermal con-
contact ASTM Customer service at service@astm.org. For Annual Book of ASTM ductance.
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website. 3.2 Symbols:
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
at 30°C at 30°C
VespelA Polyimide 0.4 20 500
VespelA Polyimide 0.4 10 250
VespelA Polyimide 0.4 1 25
Polyethylene 0.2 1 50 10.2 Coat both surfaces of a calibration specimen with a
Polyethylene 0.2 0.5 25 very thin layer of a compatible heat transfer compound or place
Polyethylene 0.2 0.1 5
Pyroceram 9606B 4 20 50
a thin layer of elastomeric heat-transfer medium on it to help
Pyroceram 9606B 4 10 25 minimize the thermal resistance at the interfaces of adjacent
Pyrex 7740B Glass 1 20 200 contacting surfaces.
Pyrex 7740B Glass 1 10 100
Pyrex 7740B Glass 1 1 10 10.3 Release the compressive load on the specimen stack,
304 Stainless 14 20 14 open the test chamber, and insert the calibration specimen.
Steel
304 Stainless 14 10 7 Care must be taken to ensure that all surfaces are free of any
Steel foreign matter.
A
Vespel is a product and trademark of DuPont, Wilmington, DE. 10.4 Close the test chamber and clamp the calibration
B
Pyrex 7740 and Pyroceram 9606 are products and trademarks of Corning Glass
Co. specimen in position between the plates at the recommended
compressive load of 0.28 MPa.
f1(T) = temperature dependent value of N, W·m-1·K-1 or Btu· in.·h-1·ft-2·°F-1. Include details of the calcu-
f2 (T) = temperature dependent value of Ro, and lation method used (for manual instruments, omit for auto-
T = test temperature. mated systems);
11.2.3.3 The values of Rs and l of the test specimen are 12.1.8 The specimen’s mean temperature and the direction
calculated automatically, once T1, T2 and Q have been mea- and orientation of thermal transmission through the specimen,
sured. Results are accurate provided that the test temperatures since some bodies are not isotropic with respect to thermal
fall within the limits used during calibration, and that Rs does conductivity;
not fall outside the calibration range obtained with the refer- 12.1.9 Designation of model/make in case a commercial
ence specimens. device is used.
12.1 Report the following information: 13.1 Precision—An interlaboratory study, summarized in
12.1.1 Complete identification and description of material Annex A3, involving four organizations and three materials
and specimen including any conditioning procedure; having different thermal conductivity values in the applicable
12.1.2 Details of reference specimen materials used for range of the test method has shown that a precision of 65 %
calibration; can be attained on a single specimen. If the specimen is in the
12.1.3 Details of temperatures of appropriate surfaces, form of two pieces clamped together, the precision is 67 %.
guard and ambient, °C (°F); 13.2 Bias—Based on comparison with measurements made
12.1.4 Applied load, Pa (psi); by an absolute method, there is no significant bias when
12.1.5 Specimen thickness, mm (in.); measurements are made on single specimens.
12.1.6 Mean temperature, °C (°F);
12.1.7 Measured thermal resistance to the nearest whole 14. Keywords
number in practical units, 10-4 m2·K·W-1 or h·ft2·°F·Btu-1 and 14.1 heat flow meter; heat flux transducer; thermal conduc-
derived thermal conductivity to the second significant figure in tance; thermal conductivity; thermal resistance; thin specimen
ANNEXES
(Mandatory Information)
A1.1 This technique involves evaluation of the thermal NOTE A1.2—If the specimens show a low thermal resistance value
resistance of thin specimens by testing them stacked, providing when tested in one or two layers, but they have the tendency to stick to
each other under compression, minimizing the thermal resistance between
that the thermal resistance of the interface between the layers them, higher numbers of layers can be tested (for example, four, five, six,
is negligibly small. This assumption is valid for most flexible seven, and so forth).
materials, such as: plastics, rubber, papers, and so forth, having A1.3.2 If the thermal resistance values of one or two
relatively low thermal conductivity values. specimens tested together are considerably lower than the
minimum value of the instrument’s calibration range, the
A1.2 Several specimens have to be cut from the material to
specimens have to be stacked on a reference material and tested
be tested, all of them having the same cross section with the
together with it. It is recommended that one of the reference
instrument’s stack.
materials used for the instrument’s calibration should be
A1.3 One or two stacked specimens have to be tested first, considered for this particular application.
to evaluate if the thermal resistance falls within the calibration A1.4 Upon completion of the tests, determine the thermal
range of the instrument. resistance (Rs) of each set of specimens using an appropriate
NOTE A1.1—No thermal compound or oil should be used between the data reduction method, in accordance with Section 11. Plot the
layers of specimens or between the specimens and the instrument. Since
the thermal resistance of these interfaces will be considered negligible, the
thermal resistance (Rs) versus the specimen thickness (total
number of specimens stacked should be reduced to the minimum thickness of the stacked specimens, not including the thickness
necessary. Testing up to five or six layers is usually sufficient. of the reference material, if used). The slope of the line
obtained is the inverse of the thermal conductivity of the
A1.3.1 If the thermal resistance values of one or two material tested.
specimens tested together fall within the instrument’s calibra-
tion range, the testing process should continue by testing three, A1.5 Due to the compressibility of the specimens, in situ
four, and five layers of materials, stacked. It is recommended to thickness measurement and compression limiting stop capa-
have at least four different numbers of layers of material tested. bilities are mandatory requirements for the instrument used.
A2.1 When the materials to be tested are liquids or pastes, A2.4 Liquids should not be tested at temperatures that
special holders or cells have to be used for containing the generate high vapor pressures, since this would disturb the
specimen inside the test chamber. It is important that the cells one-dimensional heat flow theory on which this test method is
are manufactured in such a way that the thickness of the based.
specimen is well defined and constant during the test. This is
particularly important in cases when the measurements are A2.5 A frequent application in which cells are used for
performed at elevated temperatures and the material’s thermal containing the specimen, is performing tests on materials that
expansion during the test becomes unavoidable. The cells would undergo a melting process during the test. The specimen
should have provisions for eliminating the excess material as is initially in solid state, and becomes liquid as the test
the specimen expands, maintaining the specimen’s thickness temperature increases. This particular application needs a cell
still constant. that would fit the solid specimen perfectly and would hold the
specimen, as it becomes liquid, maintaining its constant
A2.2 The instrument has to be specially calibrated with
thickness all throughout the test and allowing the excess of
reference materials placed inside the cells, before performing
liquid to be eliminated from the cell, without interfering with
the tests.
the instrument.
A2.3 Special care has to be taken to avoid convection
currents occurring in the liquid specimens. For this reason,
liquids should be tested using the thinnest possible specimen
that would allow performing the measurement within the
instrument’s operating range.
A3.1 An interlaboratory comparison was carried out on thick specimens stacked together. Separate measurements were
three different molding compounds by four organizations under made by one organization on other larger specimens cut from
the auspices of Semiconductor Equipment and Materials the same samples using an absolute method of measurement of
Institute, Inc. The four organizations involved were Fiberite thermal conductivity.
Corp.; Holometrix, Inc.; Hysol Division of Dexter Corp.; and
Plaskon Electronic Materials, Inc. A3.3 The results obtained are summarized in Table A3.1.
A3.2 The four materials were described as low, L; medium TABLE A3.1 Thermal Conductivity, W·m-1·K-1, of Four Molding
M; and high, H, thermal-conductivity molding compounds, Compounds
respectively. Measurements using the guarded heat flow meter 12-mm thick
2 samples, 6-mm Absolute
method were carried out at approximately 40°C on 12-mm Organization thick each Method
materials, measurements were also carried out on two 6-mm A 0.605 1.24 1.83 0.590 1.14 — — — —
B 0.594 1.24 2.00 0.570 1.19 — 0.60 1.27 1.97
C 0.624 1.31 1.92 0.611 1.22 — — — —
D 0.592 1.25 1.94 0.577 1.20 — — — —
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