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Light Sensor (AMS1, 3, 4)

Photo IC type
high sensitive light sensor
SENSOR
FEATURES TYPICAL APPLICATIONS
1. Built-in optical filter for spectral SMD and Through-hole types
response similar to that of the human
eye. 1. Brightness detection for LCD
2. Photocurrent is proportional to backlight control for LCD devices
illumination. (linear output) (LCD TVs, car navigation systems, and
3. Uses environmentally friendly mobile PCs).

Light sensors
SMD type Through-hole type
silicon chips. 2. Brightness detection for circuits in
residential lighting, lighting for
security, and automatic lighting for
bicycle.
3. Household applicances (day/night
energy savings for air conditioners
Chip type and electric hot water pots, etc.)
(2.0 × 1.25 × 0.55 mm) 4. Brightness detection for wall clocks
(.079 × .049 × .022 inch)
(radio clocks).

Chip type
1. Brightness detection for LCD
RoHS compliant backlight control for compact mobile
devices (mobile phones and PDAs).
2. Brightness detection for controlling
the keypad backlight in mobile
phones.

TYPES
Part No.
Type (shape) Photo current
Tape and reel package Baggage package
SMD type AMS104Y —
260 µA*
Through-hole type AMS302T AMS302
Chip type 20 µA* AMS402Y —
Standard packing: Tape and reel package SMD type: Carton: 3,000 pcs.; Case: 3,000 pcs.
Tape and reel package Through-hole type: Carton: 2,000 pcs.; Case: 2,000 pcs.
Baggage package Through-hole type: Carton: 500 pcs.; Case: 1,000 pcs.
Tape and reel package Chip type: Carton: 3,000 pcs.; Case: 3,000 pcs.
Notes: *Ev = 100 lx (Ev: Brightness, Fluorescent lamp is used as light source)
Tape and reel package is standard packaging style for SMD and chip types. (“Y” and “T” at end of part number indicate packaging type.)

RATINGS
1. Absolute maximum ratings (Measuring condition: ambient temperature: 25°C 77°F)
Item Symbol AMS104/AMS302 AMS402 Remarks
Reverse voltage VR –0.5 to 8 V –0.5 to 6 V —
Photocurrent IL 5 mA 1 mA —
Power dissipation P 40 mW 6 mW —
Operating temperature Topr –30 to +85°C –22 to +185°F –30 to +85°C –22 to +185°F Non-condensing at low temperatures
Storage temperature Tstg –40 to +100°C –40 to +176°F –40 to +100°C –40 to +176°F Non-condensing at low temperatures

2. Recommended operating condition


Item Symbol AMS104/AMS302 AMS402 Remarks
Minimum 1.5 V 1.5 V
Reverse voltage VR —
Maximum 6V 5.5 V

ASCTB242E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
Light Sensor (AMS1, 3, 4)
3. Electrical and optical characteristics (Measuring condition: ambient temperature: 25°C 77°F)
Item Symbol AMS104/AMS302 AMS402 Condition
Peak sensitivity wavelength — λp 580 nm 560 nm —
Minimum 9.1 µA 0.7 µA
AMS104/AMS302: VR = 5 V, EV = 5 lx*1
Photocurrent 1 Typical IL1 13 µA 1 µA
AMS402: VR = 3 V, EV = 5 lx*1
Maximum 16.9 µA 1.3 µA
Minimum 182 µA 14 µA
AMS104/AMS302: VR = 5 V, EV = 100 lx*1
Photocurrent 2 Typical IL2 260 µA 20 µA
AMS402: VR = 3 V, EV = 100 lx*1
Maximum 338 µA 26 µA
AMS104/AMS302: VR = 5 V, EV = 100 lx*2
Photocurrent 3 Typical IL3 500 µA 35 µA
AMS402: VR = 3 V, EV = 100 lx*2
AMS104/AMS302: VR = 5 V, EV = 0 lx
Dark current Maximum ID 0.3 µA 0.05 µA
AMS402: VR = 3 V, EV = 0 lx
Rise time Typical tr 8.5 ms 1.2 ms AMS104/AMS302: VCC = 5.0 V, VO = 2.5 V, RL = 5 kΩ
Switching time
Fall time Typical tf 8.5 ms 1.2 ms AMS104/AMS302: VCC = 3.0 V, VO = 1.5 V, RL = 5 kΩ
Light sensors

Notes: *1. Fluorescent lamp is used as light source. Ev = Brightness


*2. CIE standard illuminant ‘A’ is used as light source.
*3. Measuring method for switching time.

Cathode IF
White LED AMS∗∗∗ VR AMS104/AMS302: 2.5V
VCC AMS402: 1.5V
90%
IF Anode
VO
10%
RL VO
tr tf

REFERENCE DATA
1. Power dissipation vs. ambient temperature 2. Relative sensitivity vs. wavelength 3. Dark current vs. ambient temperature
characteristics characteristics characteristics
Reverse voltage: 3V (AMS402), 5V (AMS104, Reverse voltage: 3V (AMS402), 5V (AMS104,
AMS302) AMS302)
Ambient temperature: 25°C 77°F
50 1.0 10
AMS402 AMS402
45 AMS104·AMS302 0.9
AMS104·AMS302
Power dissipation, mW

40 0.8 Human spectral 1


Relative sensitivity

Dark current, µA

35 0.7
30 0.6 0.1
25 0.5
20 0.4 0.01
15 0.3
10 0.2 0.001 AMS402
AMS104·AMS302
5 0.1
0 0 0.0001
0 20 40 60 80 100 300 400 500 600 700 800 900 1000 1100 20 40 60 80 100
Ambient temperature, °C Wavelength, nm Ambient temperature, °C

4. Photocurrent vs. brightness characteristics 5. Relative photocurrent vs. ambient 6. Relative photocurrent vs. reverse voltage
Light source: Fluorescent lamp temperature characteristics characteristics
Reverse voltage: 3V (AMS402), 5V (AMS104, Light source: Fluorescent lamp, Brightness: 100 lx Light source: Fluorescent lamp, Brightness: 100 lx
AMS302) Reverse voltage: 3V (AMS402), 5V (AMS104, Ambient temperature: 25°C 77°F
Ambient temperature: 25°C 77°F AMS302)

10000 1.4 1.2

1.0
Relative photocurrent

Relative photocurrent

1000
Photocurrent, µA

1.2
0.8
100

1.0 0.6
10
0.4
AMS402
0.8
1 AMS402 AMS104·AMS302 AMS402
0.2
AMS104·AMS302 AMS104·AMS302

0.1 0.6 0
1 10 100 1000 10000 -40 -20 0 20 40 60 80 100 0 1 2 3 4 5 6 7 8
Brightness, lx Ambient temperature, °C Reverse voltage, V

ASCTB242E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
Light Sensor (AMS1, 3, 4)
7. Switching time vs. resistive load
characteristics
Light source: White LED
Power voltage: 3V (AMS402), 5V (AMS104, AMS302)
Resistive load voltage: 1.5V (AMS402),
2.5V (AMS104, AMS302)
Ambient temperature: 25°C 77°F
100
Switching time, ms

10

Light sensors
AMS402 tr
AMS402 tf
AMS104·AMS302 tr
AMS104·AMS302 tf
0.1
0.1 1 10 100 1000
Resistive load, kΩ

DIMENSIONS (mm inch) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e

1. SMD type (0.2)


(.008) Recommended mounting pad
CAD Data 4 3
0.25 (Top view)
.010

(0.1)
(.004)
2.2 3.2 0.8 2.8
.087 .126 .031 .110

1 4 0.25
.010
1 2.0 2 0.6
Amplifier .079 .024
1.27
2 3 1 Anode: – .050
2 Anode: –
12 Anode 1.0
.039 3 Cathode: +
34 Cathode 4 Cathode: +
0.3 0.05 DETECTION AREA
.012 .002
0.3
.012
1.27
Terminal thickness: t=0.125
.050 General Tolerance: ±0.1 ±.004

2. Through-hole type
(0.17)
CAD Data (.007) 1 Anode: –
2 Cathode: +
DETECTION AREA

5.0±0.2 dia.
.197±.008 dia.
5.8 dia.
(1.0) .228 dia.
(.039)

4.3±0.2
.169±.008 Max. 1.5
Max. .059
9.1
.358
1.0
.039
(1.0)
(.039)

1 Amplifier 2
Max. 1.0
Max. .039
34±3
1.339±.118
1 Anode
2 Cathode

1
2

(2.5)
(.098)

2-0.5
2-.020
(2.54)
(.100) General Tolerance: ±0.5 ±.020

ASCTB242E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
Light Sensor (AMS1, 3, 4)
3. Chip type (0.30)
(.012)
CAD Data 1 (0.23) Recommended mounting pad
(.009)
2 (Top view)
1 Anode
1.25
.049 2 Cathode (0.6) (0.6)
(.024) (.024)
DETECTION AREA
(0.58) 1.45
(.023) .057 (1.2)
2.0 (.047)
.079
0.55 (2.4)
.022 (.094)
Mark for indicating orientation (0.17)
1 Amplifier 2 (.007)

1 Anode (–)
2 Cathode (+)
1.2
Light sensors

.047 General Tolerance: ±0.1 ±.004

SAFETY PRECAUTIONS
Be sure to obey the following in order to • Connect terminals correctly by verifying • For an impotant and serious application
prevent injuries and accidents. the pin layout with the specifications in terms of safety, add protection circuit
• Do not use the sensors under diagram or other instructions. or any other protection method.
conditions that exceed the range of its Erroneous connections may lead to
specifications. It may cause unexpected operating errors,
overheating, smoke, or fire. overheating, smoke, or fire.

CAUTIONS FOR USE


1. Applying stress that exceeds the 4) Devices and equipment used in 3) Storage under extreme conditions will
absolute maximum rating assembly should also be grounded. cause soldering degradation, external
If the voltage or current value for any of 5) When packing printed circuit boards appearance defects, and deterioration of
the terminals exceeds the absolute and equipment, avoid using high-polymer the characteristics. The following storage
maximum rating, internal elements will materials such as foam styrene, plastic, conditions are recommended:
deteriorate because of the excessive and other materials which carry an • Temperature: 0 to 30°C 32 to 86°F
voltage or current. In extreme cases, electrostatic charge. • Humidity: Less than 60% R.H.
wiring may melt, or silicon P/N junctions 6) When storing or transporting sensor, (Avoid freezing and condensing)
may be destroyed. the environment should not be generated • Atomosphere: No harmful gasses such
Therefore the design should ensure that static electricity (for instance, the as sulfurous acid gas, minimal dust.
the absolute maximum ratings will never humidity should be between 45 and *When mounting with solder, if thermal
be exceeded, even momentarily. 60%), and sensor should be protected stress is applied to sensors that have
2. Deterioration and destruction using conductive packing materials. absorbed moisture, the moisture will
caused by discharge of static 3. Just after supplying voltage, please vaporize, swelling will occur, and the
electricity note that current in the sensor will be inside of the package will become
This phenomenon is generally called not constant until internal circuit stressed. This may cause the package
static electricity destruction. Static stability. surface to blister or crack. Therefore,
electricity generated by various factors 4. Storage please take caution and observe the
flows through the terminal and occurs to The sensors are transparent plastic soldering conditions in the following
destroy internal elements. To prevent packages. They are sensitive to moisture section.
problems from static electricity, the and come in moisture-proof packages.
following precautions and measures Observe the following cautions when
should be taken when using your device. storing.
1) Person handling sensor should wear 1) After the moisture-proof package is
anti-static clothing and should be unsealed, take the sensors out of storage
grounded through protective resistance as soon as possible (within 1 week
of 500 kΩ to 1 MΩ. 30°C 86°F/60% R.H.).
2) A conductive metal sheet should be 2) If the devices are to be left in storage
placed over the work table. Measuring for a considerable period after the
instruments and jigs should be grounded. moisture-proof package has been
3) When using soldering irons, either use unsealed, it is recommended to keep
irons with low leakage current, or ground them in another moisture-proof bag
the tip of the soldering iron. (Use of low- containing silica gel (within 3 months at
voltage soldering irons is also the most).
recommended.)

ASCTB242E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
Light Sensor (AMS1, 3, 4)
5. Recommended soldering 2) The soldered position on leads should 8. Transportation
conditions not be closer than 3mm .118inch to the Extreme vibration during transport will
<SMD/Chip type> molding resin of this sensor. warp the lead or damage the sensor.
1) Recommended condition 6. Notes for mounting Handle the outer and inner boxes with
(1) IR (Infrared reflow) soldering method 1) Temperature rise in the lead portion is care.
highly dependent on package size. 9. Avoid using the sensor in
T3
If multiple different packages are environments containing excessive
T2
mounted on the same board, please amounts of steam, dust, corrosive
T1 check your board beforehand in an actual gas, or where organic solvents are
product, ensuring that the temperature of present.
the solder area of the sensor terminals 10. Lead forming and cutting of
t1 t2 falls within the temperature conditions of through-hole type
item 5. 1) Lead forming must be done at normal
T1 = 150 to 180°C 302 to 356°F
2) If the mounting conditions exceed the temperature before soldering

Light sensors
T2 = 230°C 446°F
recommended solder conditions in item 2) The bent and cut position on leads
T3 = 250°C 482°F or less
5, resin strength will fall and the should not be closer than 3mm .118inch
t1 = 60 to 120 s or less
mismatching of the heat expansion to the base of leads.
t2 = 30 s or less
coefficient of each constituent material 3) Lead forming and cutting must be
(2) Soldering iron method
will increase markedly, possibly causing done while fixing the base of leads.
Tip temperature: 350 to 400°C 662 to
cracks in the package, disconnections of 4) Avoid mounting with stress at the base
752°F
bonding wires, and the like. For this of leads.
Wattage: 30 to 60 W
reason, please inquire with us about
Soldering time: within 3 s
whether this use is possible.
*We don’t recommend soldering iron
7. Cleaning solvents compatibility
method for chip type.
We recommend dip cleaning with an
2) Do not do flow soldering.
organic solvent for removal of solder flux
<Through-hole type>
etc. If you cannot avoid using ultrasonic
1) Recommended condition
cleansing, please ensure that the
(1) Double wave soldering method
following conditions are met, and check
T2 beforehand for defects.
• Frequency: 27 to 29 kHz
T1
• Ultrasonic power: No greater than
0.25W/cm2
• Cleaning time: No longer than 30 s
t2 t3 • Cleanser used: Asahiklin AK-225
t1
• Other:
T1 = 120°C 248°F Submerge in solvent in order to prevent
T2 = 260°C 500°F or less the PCB and sensors from being
t1 = 120 s or less contacted directly by the ultrasonic
t2+t3= 6 s or less vibrations.
(2) Soldering iron method Note: Applies to unit area ultrasonic power for
Tip temperature: 350 to 400°C 662 to ultrasonic baths.

752°F
Wattage: 30 to 60 W
Soldering time: within 3 s

11. The following shows the packaging format


1) SMD type tape and reel (mm inch)
Type Tape dimensions Dimensions of tape reel

21.0±0.8 dia. 11.4±1.0


.827±.031 dia. .449±.039

Anode side Direction of 1.5 +0.1


−0 dia.
picking .059+.004
−0 dia.
Device
0.2±0.05 mounted 4.0±0.1 2.0±0.1 1.75±0.1 178±2 dia.
.008±.002 on tape .157±.004 .079±.004 .069±.004 2.0±0.5 7.008±.079 dia.
.079±.020

Light sensor
8.0±0.2
NaPiCa .315±.008 60±0.5 dia.
SMD type 2.362±.020 dia.
AMS104Y 3.5±0.1
3.6±0.1 .138±.004
1.5±0.3 .142±.004 4.0±0.1 1.0±0.1 dia.
.059±.012 .157±.004 .039±.004 dia.
2.4±0.1
.094±.004
Cathode side
13.0±0.5 dia.
Note) When picked from 1 and 4-pin side .512±.020 dia.
(Please inquire for tape and reel packaging with 2-pin and 3-pin on the 9.0±0.3
.354±.012
pull-out side.)

ASCTB242E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
Light Sensor (AMS1, 3, 4)
2) Through-hole type tape and reel (mm inch)
Type Tape dimensions

Symbol Symbol Dimensions Remarks


12.7±0.3
Feed hole pitch P0
Anode side Cathode side .500±.012
P2 P 12.7±1.0
∆p ∆h Product interval pitch P
.500±.039
6.35±1.3
Product distance P2
.250±.051
Product bottom 20.5±1.0
H
distance .807±.039

W2
2.54±0.5

H
Lead interval F
.100±.020
L

W1
0±1.0

W0
Product slant ∆h
0±.039

W
Light sensor
Light sensors

NaPiCa 0±1.0
Product tilt ∆p
Through-hole 0±.039
type 18.0 +1.0
−0.5
AMS302T P0 F Tape width W
D0

.709 +.039
−.020

Note: Zigzag tape style is used. 13.0±0.3


Holding tape width W0
.512±.012
9.0 +0.75
−0.5
Feed hole position W1
.354 +.030
−.020

0 to 0.5
Holding tape distance W2
0 to .020
3.8±0.2
Feed hole diameter D0
.150±.008
0.5±0.2 Included holding
Tape thickness t
.020±.008 tape thickness
Defective product
L Max.: 11.0 .433
cutoff position

3) Chip type tape and reel (mm inch)


Type Tape dimensions Dimensions of tape reel

21.0±0.8 dia. 11.4±1.0


.827±.031 dia. .449±.039
Direction of
picking 1.5 +0.1
−0 dia.
.059+.004
−0 dia.
Anode side Device
mounted 4.0±0.1 2.0±0.1 1.75±0.1
0.2±0.05 on tape .157±.004 .079±.004 .069±.004 2.0±0.5 178±2 dia.
.008±.002 .079±.020 7.008±.079 dia.

Light sensor
8.0±0.2
NaPiCa .315±.008 60±0.5 dia.
Chip type 2.362±.020 dia.
AMS402Y 2.25±0.1
.089±.004 3.5±0.1
0.9±0.3 .138±.004
.035±.012 ±0.1 ±0.1
4.0 0.8 dia.
Cathode side 1.5±0.1 .157±.004 .031±.004 dia.
.059±.004
13.0±0.5 dia.
.512±.020 dia.
9.0±0.3
.354±.012

Light Sensor NaPiCa terminology


Term Symbol Explanation
Reverse voltage VR The applied voltage between the cathode and anode.
Photocurrent IL The current that flows between the cathode and anode when light is applied.
Power dissipation P The electric power loss that occurs between the cathode and anode.
The workable ambient temperature range at which normal operation is possible under the condition of a
Operating temperature Topr
prescribed allowable loss.
Storage temperature Tstg The ambient temperature range at which the sensor can be left or stored without applying voltage.
Peak sensitivity wavelength λp The wavelength of light at which sensitivity is at its maximum.
Dark current ID The current between the cathode and anode when reverse voltage is applied during darkness.
Rise time tr Time required for the output waveform to rise from 10% to 90% when light is applied.
Fall time tf Time required for the output waveform to fall from 90% to 10% when light is cut.

ASCTB242E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e

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