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IBM TSM User Forum 2009

IBM System Storage


Neues zu Disk, SVC und Tape
Manuel Schweiger
IT Specialist
IBM TSM User Forum 2009

Agenda

Disk DS8700 Announcement


SVC
Tape

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IBM TSM User Forum 2009

IBM System Storage DS8700 Announcement (R5.0)

Key Dates
Announce date October 20, 2009
GA date October 23

Release 5.0 key messages


Performance:
Availability & Resiliency
Flexibility & Scalability
Security
Investment Protection

Performance, resiliency, and security to satisfy the worlds most demanding clients

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IBM TSM User Forum 2009

Introducing the New DS8700

The Next Chapter in IBMs Flagship Disk Platform


Whats New Why Move to DS8700
Performance
Up to over 150% performance boost with new IBM POWER6-based controllers
New, faster PCI Express (PCI-E) internal fabric enables much higher performance and
scalability
Almost 70% faster ASIC on the device adapters
Increased FlashCopy performance in every metric
Increased SSD performance on sequential reads
Availability
Single model, scalable via concurrent upgrade of all components
Shorter service windows with faster concurrent microcode updates
Better than 99.999% availability
Investment Protection and Scalability
DS8700 architecture allows for future expansion of additional controllers and future 8Gb Host
Adapters
Future features, such as SSD optimization and M/GM Multiple Session coming soon
Management
Simplified management and application-aware FlashCopy
Security
Full Disk Encryption enhancements address PCI-DSS compliance

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IBM TSM User Forum 2009

Changing from DS8000 to Follow-on

ChangeinI/O
DS8700
PCIecableI/Oattach
structure

ChangeinI/O
DS8000
structure
RIOI/Oattach NewI/O
attach

P6
P5 server
P5 P6 P6

P5
P5 RIO RIO

P6 P6

Disks
Disks

s
ble
NewIObaysaredirectlyconnectedtotheserversviapointto

a
4.7GhzP6570x2

Iec
pointPCIecables.

PC
Cache32384GB
IOTowersnolongersharecommonloops,theyconnect 4Gb/sFC/FICON
directlytoeachserverviaseparatecablesandlinkcards. 2Gb/sdiskarray
TheservertoservercommunicationpathcontinuestouseRIO,
butisnowisolatedfromIOtraffic.
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IBM TSM User Forum 2009

Proven Server-Based Architecture

New IBM POWER6 processor complex offers


Exceptional performance
Up to over 150% performance improvement for sequential workloads
Up to 100% performance improvement for random workloads

Improved Reliability, Availability, Serviceability

Higher Scalability
Enables higher scalability through POWER6 design, increased cache
size (384 GB), and higher RAS

Greater Energy efficiency


Over 50% more IOPS/Watt

Allthesebenefitswithminimalchangestoexistingfirmwareandcodebase
whichtranslatestohighersystemreliabilityandinformationavailability

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IBM TSM User Forum 2009

New PCI-Express Internal Fabric


Enabling future growth
Performance
PCI-E fabric increases data throughput, especially for sequential workloads

Availability
PCI-E fabric reduces the impact of hardware failures

Scalability
Scale internal bandwidth by adding additional data links or "lanes

Flexibility and upgradability


PCI fabric enables single DS8700 model with flexibility to fit customer requirements
Concurrent upgradability of all components from small to large configurations

Loweracquisitioncostsbyenablingnondisruptiveupgradesfrombase2waymodeltofull
blown4waymodel!

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IBM TSM User Forum 2009

Summary - DS8700 (2-way/4 way base frame)


242x model 941

HMC new laptop

P6 (POWER 6) Servers

Feature specified 2-way/4-way


2-way processor memory size 32GB-128GB
4-way processor memory size 32GB-384GB
Power Supplies 4-way required for expansion frame models

I/O Drawers (slightly larger at 5U)


4GB features only (no 2GB/ no ESCON)
Drawers attached via PCI-E switch
New Host Attachment and
Device Adapter features (PCI-E)
Batteries

Familiar Layout

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IBM TSM User Forum 2009

DS8700 (4-Way with two expansion frames, Rear view)

NondisruptiveMES
offirstexpansion
frame

Capableofbeing
extendedto5frames

Expansionframe
withIOdrawersmust
bemodel94E

ExpansionFrames
withoutIOdrawers
canbeeither94E/92E

94E/92EPosition2(#0341) 94EPosition1(#0340) 941Base


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IBM TSM User Forum 2009

IBM POWER and DS8700 Reliability and Resiliency

The IBM POWER processor has been behind the success of IBM
enterprise storage beginning with the Enterprise Storage Server
(Shark) in 1999
Benefit: a steady, 10-year lineage of RAS improvements!
1999-4 2004-6 2007-9 FUTURE

POWER PC / POWER POWER5 POWER6 POWER xxx

65 nm
90 nm
130 nm
180 nm 130 nm 4.7GHz Core

2.2GHz 2.2GHz 4.7GHz


1.9 1.5+
Core Core L2 Cache
1.5 GHz 1.5 GHz GHz GHz L2 Cache Advanced
Core
1+ GHz
Core
1+ GHz
Core Core
Shared L2 System Features
Advanced
System Features
DS8XXX
Core Core Distributed
Shared L2 Switch
Shared L2
Distributed Switch
Distributed Switch Distributed Switch DS8700
Shared L2 DS8000
Distributed Switch DS8000 Turbo
ESS
Chip Multi Processing
(Shark)
- Distributed Switch
- Shared L2
Dynamic LPARs (32)

Binary Compatibility

DS8700leveragestheDS8000shighlyreliablecodebase!
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IBM TSM User Forum 2009

Improved and Simplified Management


GUI enhancements

New System
Summary Panel
Overview tab displays system
configuration and real-time
performance data for a 5 minute
sampling interval

Updated
every
60sec.

Number of racks shown matches


racks in the storage unit

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IBM TSM User Forum 2009
System Summary Panel Overview Tab

Hardware Explorer tab shows


system hardware and a mapping
between logical configuration
objects and drives (e.g., drives
belonging to an extent pool or
array)

R5 Real images show exactly what


.0 bays are populated with what
devices

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IBM TSM User Forum 2009

Announcement Summary

The DS8700 announcement introduces the most advanced model in


IBMs DS8000 lineup with up to over a 150% boost in performance.
This new hardware refresh not only offers much higher performance,
it also builds on the DS8000s unrivaled reputation for reliability and
investment protection by maintaining its IBM POWER-based
architecture over generations of new models.

This release underscores the commitment to our flagship enterprise


disk platform and enables us continue providing an ideal combination
of optimized performance, scalability, reliability, and value that our
most demanding customers expect from IBM.

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IBM TSM User Forum 2009

Agenda

Disk DS8700 Announcement


SVC v5 Announcement
Tape

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IBM TSM User Forum 2009

New SVC 2145-CF8 Storage Engine

New SVC engine based on IBM System x3550M2 server


Intel Xeon 5500 2.4 GHz quad-core processor
Triple cache size to 24GB (with future growth possibilities)
Four 8Gbps FC ports
Bandwidth twice that of the Model 8G4
Expect double MB/s and up to double IOPS
of Model 8G4
Significant price/performance improvement
Enables support of more demanding and larger configurations with fewer SVC
engines
Support for Solid State Drives (up to four per SVC node) enabling scale-out
high performance SSD support with SVC
New engines may be intermixed in pairs with other engines in SVC clusters
Mixing engine types in a cluster results in VDisk throughput characteristics of the
engine type in that I/O group
Cluster non-disruptive upgrade capability may be used to replace older
engines with new CF8 engines

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IBM TSM User Forum 2009

SVC Configurations With 2145-CF8

Minimum Maximum
Configuration Configuration
(One I/O Group) (Four I/O Groups)
Cache 48GB 192GB

8Gb Fiber Channel 8 32


Ports
1Gb iSCSI Ports 4 16

SSDs 1 32

Mirrored SSD 146GB (two SSDs) 2.4TB


Capacity
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IBM TSM User Forum 2009

SVC Software Version 5

Support for iSCSI server attachment

Replication enhancements including Multiple Cluster Mirror, increased number


of remote copy relationships, and Multi-Target Reverse FlashCopy
Supports consolidated disaster recovery site servicing more than one production location
Enables larger configurations to be protected with up to 8192 MM/GM relationships
FlashCopy targets may be used almost immediately as restore points enabling faster
recovery

New 64-bit SVC software base


Supports all SVC engines available since October 2005 (8F2, 8F4, 8G4, 8A4, CF8)

Cache management enhancements


Improves throughput up to 15% for existing systems, especially for write I/Os

Available for existing customers with current subscription and support at no


charge
Nondisruptive upgrade from SVC software 4.3.1

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IBM TSM User Forum 2009

Multiple Cluster Mirroring Configuration Rules


Max 4 clusters connected by partnerships either directly or indirectly
All must be at 5.1 even if a cluster is only in one partnership

B C A C

A A B C D
B D
D
Unsupported configuration: 5 clusters in a connected set

A B C D E
A VDisk can only be in one MM or one GM relationship
A FlashCopy target cannot be a MM or GM source

Enables Metro and Global Mirror relationships between up to four SVC clusters
Three site Metro-Global Mirror like DS8K not supported
Replication of a VDisk to multiple sites not supported
IBM TSM User Forum 2009

Thin Provisioning Enhancements: Zero Detect

When using Virtual Disk Mirroring to copy from a fully-allocated virtual disk
to a space-efficient (thin provisioned) virtual disk, SVC will not copy blocks
that are all zeroes
Disk space is not allocated for unused space or formatted space that is all zeroes

When processing a write request, SVC will detect if all zeroes are being
written and will not allocate disk space for such requests
Helps minimize disk space used for space-efficient virtual disks
Helps avoid space utilization concerns when formatting vdisks
Supported only on Model CF8 storage engines

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IBM TSM User Forum 2009

High Availability Storage Solution


SVC Stretched Cluster

Uninterruptible storage failover


RZ(A) RZ(B) between two datacenters
Host Host

If location (A) fails, (B) can


VM VM
Host Failover Host work with the same virtual
HDDs and vice versa.

Great for VMware


FCLongWave
Signaldistanz(10km)
environments
SVC1nodeA SVC1nodeB Virtual machine moves with
VMotion
Vdisk moves with SVC
LUN1 LUN1'
IBM TSM User Forum 2009

SAN Volume Controller Version 5


Supported Environments
Microsoft HP-UX 11i Linux IBM N series GW
IBM AIX NetApp
IBM Novell Windows Sun Tru64 (Intel/Power/zLinux) IBM 1024
z/VSE NetWare VMware Hyper-V Solaris OpenVMS SGI IRIX RHEL Apple V-Series BladeCenter
vSphere 4 IBM i 6.1 SUSE 11 Mac OS IBM TS7650G Hosts

New New

New New
Point-in-time Copy
Native iSCSI 8Gbps SAN fabric
Full volume, Copy on write SAN
New
256 targets,
Continuous Copy
New
Incremental, Cascaded, Reverse Metro/Global Mirror
Space-Efficient, FlashCopy Mgr Multiple Cluster Mirror
New
SAN SAN
Entry Edition SSD Volume Controller Space-Efficient Virtual Disks
Volume Controller
New New
New New New Virtual Disk Mirroring

IBM IBM IBM IBM Hitachi HP EMC Sun NetApp NEC Fujitsu Pillar
Lightning MA, EMA
ESS, DS XIV N series MSA 2000, XP
CLARiiON StorageTek FAS iStorage Bull EternusAxiom
Thunder CX4-960
FAStT DS3400 DCS9550 TagmaStore EVA 6400, 8400 StoreWay 3000
DS4000 DCS9900 AMS 2100, 2300, 2500 Symmetrix 8000 Models 2000 & 1200
DS5020, DS3950 WMS, USP 4000 models 600 & 400
DS6000
DS8000
21 For the most current, and more detailed, information please visit ibm.com/storage/svc and click on Interoperability.
IBM TSM User Forum 2009

Agenda

Disk DS8700 Announcement


SVC v5 Announcement
Tape DeDup VTL TS7650

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IBM TSM User Forum 2009

TS7650 Criteria

1. Data-agnostic factoring of up to 25x


2. Enterprise Class inline performance +1000MB/s
3. Unmatched scalability: 1 PB physical data
4. 100% data-integrity during de-dupe process
5. Simple, non-disruptive deployment
6. Software-only solution: hardware agnostic

Mostelementsofnewdatabackeduptoday
Nootherdedupetechnologymeetsallthesecriteria!
alreadyexistinpreviousbackups

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IBM TSM User Forum 2009

NewDataStream Repository

Memory
Resident
Index

FCSwitch TS7650G Disk


Arrays

Backup
Servers

Filtereddata

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IBM TSM User Forum 2009

TS7650G - ProtecTIER De-Duplication Gateway

FCSwitch
TS7650Gx2

2NodeCluster
Backup
BackupServers Arrays

Active-active true clustered nodes Highcapacity,highlyscalable


High performance (1000MB/s sustainable) Easilymanageable
Highly available twonodesworkingtogether
onerepository
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IBM TSM User Forum 2009

Differences between TS7650 and TSM DeDup


Which solution is the best for me?

InlineProcessing(TS7650)

BackupServer ProtecTIERVT TapeLibrary Truck

DeDupe SLAisMet

8:00PM 2:00AM 8:00AM 8:00PM

PostProcessing(TSM)

DeDupe
Overlap
BackupServer TSM(andotherVTL) TapeLibrary Truck

DeDupe DeDupe
IBM TSM User Forum 2009

Hash Based Approach (TSM)

1. Slicedataintochunks(fixedorvariable)

A B C D E

2. GenerateHashperchunkandsave
Ah Bh Ch Dh Eh

3. SlicenextdataintochunksandlookforHashMatch

A B C D E

4. Referencedatapreviouslystored

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IBM TSM User Forum 2009

HyperFactor Approach (TS7650)

1. Lookthroughdataforsimilarity

NewDataStream

1. Readelementsthataremostsimilar
2. Diffreferencewithversionwilluseseveralelements

ElementA ElementB ElementC

3. Matchesfactoredoutuniquedataaddedtorepository

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IBM TSM User Forum 2009

Differences between TS7650 and TSM DeDup


Which solution is the best for me?

TSM DeDup
Diskpool < 6TB
and/or no VTL needed

TS7650
Diskpool > 6TB
High Performance needed
VTL wanted

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IBM TSM User Forum 2009

Trademarks and Disclaimers

IBM Corporation 1994-2009. All rights reserved.


References in this document to IBM products or services do not imply that IBM intends to make them available in every country.

Trademarks of International Business Machines Corporation in the United States, other countries, or both can be found on the World Wide Web at
http://www.ibm.com/legal/copytrade.shtml.

Intel, Intel logo, Intel Inside, Intel Inside logo, Intel Centrino, Intel Centrino logo, Celeron, Intel Xeon, Intel SpeedStep, Itanium, and Pentium are trademarks or registered
trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both.
Microsoft, Windows, Windows NT, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both.
UNIX is a registered trademark of The Open Group in the United States and other countries.
Java and all Java-based trademarks are trademarks of Sun Microsystems, Inc. in the United States, other countries, or both.
Other company, product, or service names may be trademarks or service marks of others.

Information is provided "AS IS" without warranty of any kind.

The customer examples described are presented as illustrations of how those customers have used IBM products and the results they may have achieved. Actual
environmental costs and performance characteristics may vary by customer.

Information concerning non-IBM products was obtained from a supplier of these products, published announcement material, or other publicly available sources and
does not constitute an endorsement of such products by IBM. Sources for non-IBM list prices and performance numbers are taken from publicly available information,
including vendor announcements and vendor worldwide homepages. IBM has not tested these products and cannot confirm the accuracy of performance, capability, or
any other claims related to non-IBM products. Questions on the capability of non-IBM products should be addressed to the supplier of those products.

All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

Some information addresses anticipated future capabilities. Such information is not intended as a definitive statement of a commitment to specific levels of performance,
function or delivery schedules with respect to any future products. Such commitments are only made in IBM product announcements. The information is presented here
to communicate IBM's current investment and development activities as a good faith effort to help with our customers' future planning.

Performance is based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput or performance that any
user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage
configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput or performance improvements
equivalent to the ratios stated here.

Photographs shown may be engineering prototypes. Changes may be incorporated in production models.
IBM TSM User Forum 2009

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