The Egyptian International Journal of

Engineering Sciences and Technology
Vol. 21 (October 2016) 33–42

http://www.eijest.zu.edu.eg

Solid-State Recycling of Aluminum Alloy (AA-6061) Chips via Hot
Extrusion Followed by Equal Channel Angular Pressing (ECAP)
A. I. Selmy, M. I. Abd El Aal, A. M. El-Gohry, M. A.Taha*
Mechanical Design and Production Department, Faculty of Engineering, Zagazig University

ARTICLE INFO ABSTRACT

Article history:
Received: 27 April 2016 Aluminum alloy (AA-6061) chips were recycled using hot extrusion followed by
Received in revised form: equal channel angular pressing (ECAP) process at room temperature. AA-
28 May 2016 6061chips were cold compacted into billets, then extruded into rods under
Accepted: 1 June 2016
Available online: 22 July
extrusion ratio of 5.2 at different extrusion temperatures (ET). Finally, the rods
2016 were processed through ECAP die with inner angle Φ of 90°, and outer arc angle Ψ
of 32.8°, which impose strain ɛ of 1 per each pass up to different number of passes.
Keywords: The effects of the ECAP number of passes and extrusion temperature on the
AA-6061, microstructure and mechanical properties were fully investigated. Grain refinement
Solid state recycling
Hot extrusion were noted after the ECAP process. Moreover, the ECAPed samples revealed
ECAP higher mechanical properties than those of the extruded samples. The extrusion
Mechanical properties temperature (ET) and the number of the ECAP passes have an obvious effect on
Microstructure. both the microstructure and mechanical properties of the solid state recycled chips
samples.

1- Introduction without re-melting to avoid the troubles of
Aluminium alloy 6061 is one of the most extensively conventional method. Compared with conventional
used of the 6000 series aluminium alloys due to its recycling, the solid state recycling of aluminium
preferred properties, for example, medium to high scrap may result in 40% material, 26–31% energy
strength, good toughness ,excellent corrosion and16–60% labour savings [5]. In case of chips
resistance, and good workability. When aluminium produced from machining of semi-finished
products are manufactured a considerable amounts of aluminium products, it is very difficult to be recycled
scrap (chips and discards) are produced [1]. by conventional methods due to their elongated spiral
Recycling of scrap become a very economical shape, small size, surface contamination with oxides
method for producing materials because of the low and machining oil [6].
cost of recycled materials [2] .There are two primary Stern [7] recycled aluminium chips by solid state
methods of scrap recycling:- conventional and solid recycling through hot extrusion. Gronostajski et al.
state recycling [3]. The conventional technique [8-9] applied hot extrusion for the production of
requires melting of the scrap to be recycled. It is composites based on Al and AlCu4 alloy chips and
characterized by high energy consumption, high tungsten powder. A major advantage of this process
operating cost, and a large number of operations [4]. is that up to 95% of the primary material can be used
The solid state recycling is the recycling of scrap by avoiding metal loss during the re-melting process.

* Corresponding author. Tel.: +2-010-0224-6490;
E-mail address: eng_mohamed_2017@yahoo.com.

33

few studies have been performed on improving the properties of recycled products using ECAP. Ying et al. the cold pressing parameters. cyclic extrusion compression (CEC) [15] and friction extrusion [16] have been reported. Suzuki et al.2‫׃‬1. SPD processes introduce 2. While. which directly influence applying one pass ECAP.26 0. In case of in improvement of recycled material properties.329 Balance through a special die [17].Chemical composition of the AA6061 aluminum alloy. Gronostajski et al. of oxide contaminants. and results in the formation of an ultra-fine grained then hot extruded at three different temperatures microstructure with grain sizes below 1μm and grain (350. high pressure torsion (HPT) [14]. [19] investigated the solid state recycling of AZ91 Mg alloy machining chips through the process of cold compaction. 1mm However. hot compaction. it is necessary to ARL 3460 Metals Analyzer. It is capable of refining bulk materials with coarse Table 2. investigate the influence of extrusion extrusion ratio (ER) = 6. grain structures.SPD Cylindrical billets with diameter 11 mm and 90 mm processing methods that can introduce large strain length were cut from the extruded rods for ECAP such as equal-channel angular pressing (ECAP) [13].48 0.25.A. [10] compacted the AA-6061 chips and followed by hot extrusion at various extrusion ratios 2. [11] examined the The material used in this work (as received) was relationship between the extrusion ratio and aluminium alloy AA6061 rod. hot 34 . I. [1] proposed a list of compaction. feasibility of recycling of AA-6061chips by cold and Second. boundaries of high misorientation angles [12] . Fogagnolo et al. The cutting conditions used in chips production. extrusion and single pass ECAP. ECAP is a novel technique able Table 1.051 0. several studies on solid-state recycling of mm×1 mm were prepared by dry turning of the as- machining chips using severe plastic deformation received rod under cutting conditions shown in Table (SPD) have been conducted. It was introduced and patented by Segal in 1977 [18]. 88 m/min 1mm/rev. 425 and 500 0C) with extrusion ratio of 5. Results were attributed to the dispersion temperature.Experimental work and temperatures. the recycled workpiece the mechanical properties of the extruded profiles. provided by ALU mechanical properties of hot extruded machining Misr Company. cold compacted at room temperature. to introduce heavy shear strain into the processed material without changing the cross-section of the Si Mg Fe Cu Mn others Al workpiece during the multi-passes of deformation 0. investigate the capability of ECAP process hot compaction followed by hot extrusion. process. extrusion and ECAP. / Solid-state recycling of aluminum alloy (AA-6061) chips via hot extrusion followed by equal channel angular pressing (ECAP) Furthermore. up to now. After and elimination of porosity. composition of the AA6061 rod analysed by optical In order to meet the increasing demand of Al alloys emission spectroscopy using a Thermo Scientific with high mechanical properties. the The critical issues in the process of consolidation of extruded cast workpiece showed superior strength aluminium chips are sound bonding between chips and ductility compared to the recycled ones. The chips were placed in a die with a diameter of ultra large plastic strain into bulk metals which 25 mm. The factors contributing the mechanical properties of the average grain size was proven to be much smaller chip-based extruded profiles involving the size of compared to cast AZ91 alloy processed by extrusion chip.85 0. in case of cold temperature and number of ECAP passes on the compaction the extrusion ratio must higher than 25 in microstructures and mechanical properties of the AA- order to obtain sound bonding. of strain is needed in order to break oxide layers on The objectives of this research are first. The machined chips enhance the properties of recycled materials. Nakanishi et al. extrusion ratio and rate of extrusion. showed higher strength but lower ductility compared From the metallurgical point of view a certain level to the cast billet processed under the same conditions.8 0. [6] investigated the chips through hot extrusion followed by cold ECAP. with average dimensions L x W x T of 37 mm×2 Recently. there was sufficient chip bonding at Third. Table 1 presents the chemical chips of AZ91 magnesium alloy. so ECAP can be applied for solid Cutting speed Feed Depth of cut state recycling of Al machining chips to get materials with high mechanical properties. After hot extrusion. investigate the chips’ surface and to achieve sound bonding the feasibility of solid state recycling of AA-6061 between chips. 6061 chips solid state recycled. Selmy et al.

ECAP was carried out at room temperature for multiple passes until the specimen was cracked or broken. the billets extruded at 425 0C and 500 0C were cracked and broken after 5 passes and 7 passes respectively as shown in Fig. 5. The relative density of processed samples at different conditions was measured experimentally using Archimedes’ principle. The samples were further mechanically ground using SiC emery papers (grit 500. 2 and 3 respectively. The billets extruded at 350 0C were hardly damaged after 1 ECAP pass and totally broken after 2 passes as shown in Fig. The solid state recycling process stages are shown in Fig. Hot extrusion die (a) complete assembly drawing (b) half repeated 3 times for each condition and the average section assembly (c) out fitted.The extrusion and ECAP dies are shown in Fig. Fig. Solid state recycling stages (a) initial AA-6061 chips (b) cold compacted sample (c) hot extruded sample (d) ECAPed samples. 3. 4. 1 . 21 (October 2016) 33–42 The ECAP die had a channel angle of 90° and a curvature angle of 32. Fig. ECAPed sample at extrusion temp 350 0C (a) After 1 pass (b) After 2 passes. 1000. and 2400 for 180 sec each) and finally polished with Al2O3 suspensions. 35 . density was calculated at each condition. EIJEST Vol. For experimental tests. 5. samples with a length of 20 mm were cut off from the middle part of the extruded and ECAPed rods. ECAP die (a) complete assembly drawing (b) out fitted. 1.b.4.8°. Fig. On the other side. The density measurement was Fig. 2. ECAPed sample (a) Extruded at 450 0C and ECAPed up to 5 passes (b) Extruded at 500 0C and ECAPed up to 7 passes. Fig.

6. oxide layer is partially broken. The relative first.9%) was achieved after one pass. The individual chips is weak as it will be seen from boundaries between chips are distinguished from microstructure investigation. work. examined before ECAP using light optical In fact. The tensile test was carried out up to failure at room temperature using LR300K (300 kN) universal testing machine. 96. increased on the initial ECAP passes until reaching a involving high compressive and shear forces at high maximum value and after that there isn’t any temperature. the sample extruded at 425 oC.2 Bonding quality of recycled samples 3. shows the optical microscopic The relative density of the compacted sample was photomicrograph of the cold compacted chips 2. All tensile tests were repeated three times for each condition and the average of three measurements was reported.1 Relative density measurements Fig. extensive applied loading of 100 gf and a dwell time of 15 sec nucleation of voids is expected. 3.06.24].33x10-4 s-1at room temperature.Results and Discussion 3. The relative density of extruded Selmy et al. the size of porosities is were etched using killer’s reagent. However. temperature. Tensile tests were performed at an initial strain rate of 8.7 gm/cm3) and 7% are compaction at room temperature. (99.4. there must be a high plastic strain to break down density of the extruded samples increased to 96. High compacting pressure of 2000 MPa These observations are in a good agreement with the used in this work is higher compared with previous low relative density of the compacted sample. 7. specially. which will limit the at room temperature using Buehler Micromet 5100 improvement in relative density [23. On the other hand. therefore it was applied to obtain improvement in relative density. Furthermore.Hot extrusion. Fig. After scanning electron microscope (SEM). 20-21]. and ECAPed samples after different number of Aluminium has the capability of forming an oxide passes are shown in Fig. More ECAP passes will Vickers microhardness was measured under an decrease the amount of porosities but. it will prevent the Also. 6. The increasing extrusion temperature (ET). similar observations of voids and visible Fogagnolo [6].A. the maximum relative density compacted chips [26]. voids compaction process is conducted at room can be observed between the boundaries of the chips. I. this value of each other indicating that sound bonding of the chips average density is higher as compared with the work is not yet complete. Furthermore. The surface of the porosities. The machined chips were consolidated after theoretical density (2. suitable High extrusion temperature enables plastic flow of conditions of high pressure and temperature to material to fill voids and make the sample fully dense achieve complete welding of the chips together. the bonding between chips exhibited some breaking and bonding. Two criteria must be fulfilled to specimens. device microhardness tester equipped with a Vickers indenter. Selmy et al. The second. While after imposed during ECAP improve the consolidation ECAP.511 gm /cm3 which represents 93% of the sample. in which maximum relative density chips boundaries in the case of compacted chips of achieved after cold compaction is ~ 92% of the alumimium or magnesium chips were obtained by theoretical density. Relative density of recycled samples. it was examined using FEI INSPECT S50 process and increase the relative density [22].7-8. decreased to a great extent. / Solid-state recycling of aluminum alloy (AA-6061) chips via hot extrusion followed by equal channel angular pressing (ECAP) The microstructures of extruded samples was relative density (99. the additional consolidation process. For the sample complete consolidation of the recycled AA-6061 extruded at 500 oC. and there is a need for an of other researchers [1. Similar observations were obtained by Moreover. the results show that the relative density chips from perfect welding [29]. For hot extruded layer on the surface. [25-29]. the relative density increased with guarantee sound bonding between chips [29]. the clean metal-to-metal contact.8%) was achieved after 2 passes. Specimens the first ECAP pass. large shear strain and hydrostatic pressure microscopy on Zeiss Axio Imager.425 and 500 oC respectively. the oxide layer on the surface of the chips to obtain 99. Tensile test specimens were fabricated parallel to extrusion direction by turning in accordance with ASTM-B557. the maximum 36 . If the [9].8% at ET of 350.

8 µm for samples extruded at Figure. The observations of non-sufficient bonding that there is more grain refinement as compared to between chips at extrusion ratio lower than 25 extruded sample. it is noticed that grain size was between chips. of 350 0C contain unbounded chip boundaries and compaction and extrusion processes [32]. (c) ET=500 oC. Similar observations was obtained by P. EIJEST Vol.2 µm. 425 and 500 oC respectively as shown in Table. The plastic chip boundaries act as natural barriers between grains strain and conditions of temperature and pressure and prevent grain growth so fine grains is obtained were not sufficient to break down the oxide layer [20]. [30]. 4 passes. Additionally.6]. photomicrographs of the chip extruded and ECAPed 3. 9 (b). of the ET up to 500 0C the quality of bonding between the chips was improved and the micro voids were completely disappeared as shown in Fig. 8. 3. 13. more of chips boundaries were broken and the bonding between chips was improved as shown in Fig. It was noted that the extruded samples at ET severe plastic strain imposed during machining. 10. 0 passes (c) ET = 425oC. 0 passes. Optical microscopic photomicrograph of cold compacted consisted of finer grains as compared to as-received sample (white arrows indicate chip boundaries and red arrows specimen as shown in Fig. Furthermore. the oxide layers prevented increased with increasing ET.7 and 15. With the increase agree with other work [20]. Optical microscopic photomicrographs of (a) as-received and extruded samples (b) ET= 350oC. size decreased with increasing the number of ECAP 37 . The bonding quality increased with increasing temperature which confirms the results obtained by To study the effect of ECAP passes on the Hasse et al. [20] and Ceretti et al. (b) ET = 500 oC. 8 (b). Optical microscopic photomicrograph of recycled samples (a) ET = 350 oC.8 shows the optical microscopic 350. Therefore. Fig. SEM micrographs of ECAPed samples after down the oxide layer and chips boundaries are still 2. It is noticed observed. The fine-grained microstructure is caused by samples. The grain size indicate void between chips). 4 and 6 passes are shown in Fig. the sample is subjected to severe plastic deformation resulting in severe shear strains when passing repeatedly through the die corner. In addition. micro size voids as shown in Fig. the recycled samples Fig. 9. 8(c) and (d). Therefore. the microstructure of the extruded samples at 425 and plastic strain was not enough to completely break 500 oC. These results are in sound bonding between chips [26]. [31]. Luo et al. On the other hand. 8 (a). 4 passes and (d) ET = 500 oC.9.3 Microstructure evaluation The microstructure of the as-received sample is composed of coarse-grained structure with grain size of 48. (c) . Fig. However. it is noticed that grain confirms the results obtained in previous work [3. is 10. 7. 21 (October 2016) 33–42 During the ECAP process.

the microhardness of AA-6060 recycled samples was decreased with increasing number of passes. received sample and cold compacted chip was 59 HV Grain size 425 13. more plastic strain is imposed so the extruded at 500 oC at the same number of passes. 2. 103. The average grain size measurements are The amount of plastic strain introduced depends on shown in Table 3. hot ECAP process decreased the Fig. ---. 4 and 6 passes respectively.1 3.5 110 microhardness of the extruded samples decreased 350 85 ---.5 and 110 HV after 1. In previous work by Haase [20]. Effect of ECAP process on the grain size and mechanical properties of recycled samples. grain size after ECAP processing.5 349 403 increase of ET. AA-6060 chips was recycled through hot extrusion with ER of 8. after 6 recycled samples through hot extrusion followed by passes.75 HV after 4 passes.7 4. The process was conducted at temperatures of 450 and 550 oC.9 13.6 For the samples extruded at 425 oC. This can explained by the 425 116 230.However. 10. refinement is obtained [33-34]. after extrusion from 42 to 41HV. I.75 and 82. 94.75 74.It is noticed that as 425 43 80. [38]. / Solid-state recycling of aluminum alloy (AA-6061) chips via hot extrusion followed by equal channel angular pressing (ECAP) passes. ---- UTS from 49 HV to 41 HV. and 98. ---- Microhardness and compaction processes [37]. the decrease in microhardness can be related to any voids in the investigated specimen.75 HV after 1.3 13.9 HV respectively.5 103. ---- Elongation to microhardness with increasing ET was obtained in 425 9. ---. The microhardness of 4 passes (d) ET=500 oC. the sample is subjected to grains with high angle boundary. The higher hardness of (μm) compacted chips relative to that of the as received 500 15. after 2 passes (c) ET=425 oC. In contrast with the trend observed in this work. sub-grains are generally divided into equiaxed fine During the ECAP process. The microhardness of the as 350 10.7 followed by hot ECAP in the same die. 11. the microhardness increased from 41 HV before ECAP to 82. 2 and 3 passes respectively. the 500 41 94. A. after 2 passes (b) ET=500 oC. Selmy et al. ---. ---. When applying more extruded at 425 oC is always smaller than samples ECAP passes. Also in future work by Haase et al.The average grain size of samples the number of ECAP passes.5.4 Microhardness (oC) (Hot 2 4 6 extrusion) The influence of ECAP number of passes and ET on 350 the microhardness of recycled samples were Quality of Weak Improvement of chips evaluated and compared with Hasse et al.66 ---.02 2. SEM photomicrographs of ECAPed samples (a) ET=425 microhardness of recycled samples through hot o C.8 347. cold ECAP is significantly higher than samples 38 .28 2. similar observation Number of ECAP passes was obtained with other works [33. It is found that the initial grain size has significant effect on the final Table 3. [20] as 425 bonding bonding welding 500 shown in Fig. 80.9 ---. 500 13.8 ---- (MPa) increase of the grain size and recovery due to 500 133 288. The drastic increase of microhardness after ECAP up to 3 passes is due to the work hardening that is caused by the formation of sub-micrometer ordered grains and the increase of dislocation density occurring with the shear deformation in the initial grain interior [36] .4 11. therefore grain severe shear strains.7 14.6 11.8 5. after 4 passes and (e) ET=500 oC.25.46 sample is due to imposed plastic strain during turning 350 49 ---. 35-36]. For the samples extruded at 500 oC. Then decreased to 74. ---. Similar trend of decreasing 350 4.75 ---- (HV) the ET increased from 350 to 500 oC.2 ---- failure% other work [20].4 ---. ET 0 Properties 3. the microhardness increased from 43 HV before ECAP to 76.

reaches 71% and 98.6 % after 1 pass. The increase of the UTS can be number of ECAP passes are shown in Figs. 230.2 % after 1. In addition. Influence of ET and number of passes on (a) UTS (b) surface of metal and ensures good contact and elongation to failure.4 % to 13. bonding between individual chips [22].7% and 14. 12. Influence of ET and ECAP number of passes on ECAP process to 198.4 % before the ECAP to 10.5 Tensile test values are observed to increase from 133 MPa to The variation of ultimate tensile strength (UTS) and 263. While in case of sample extruded at 500 oC. (a) attributed to the grain refinement and the work . 2 microhardness of recycled samples. Similar observation were reached by other authors in previous work [3. Same behaviour chip samples were significantly increased with of the increase of the UTS with the increase of the increasing ET. 12. The increase of elongation to failure can be related to the improvement of bonding between the chips during the ECAP process in which the extensive shear deformation breaks up the oxide films on the chips surfaces. The UTS values are observed to increase from 116 MPa before the Fig. 349 and 403 MPa after 1.3 % 12.20. It can be noted that the elongation to failure increased from 9.12 (a). 13.(b). elongation to failure increases from 4. Besides that. and 4 passes respectively for sample extruded at 425 o C.9%. the formation of sub-grains during the first pass of the ECAP process has an effect on increasing the strength [39].6% after 2. 3 and 4 passes respectively in the case of sample extruded at 425 oC.5. UTS increases from 85 to 133 MPa number of passes was observed in the case of with increasing ET from 350 to 500 oC. it has a close relation to the annihilation kinetics of extrinsic grain boundary dislocation introduced by 39 . 2. So that it yields fresh and clean Fig. 21 (October 2016) 33–42 recycled through hot extrusion followed by hot Similar observation were also noted in the case of ECAP. 2. 11. 288. EIJEST Vol. 25].8 MPa after 1.6 % with increasing extrusion temperature (ET) from 350 to 500 oC. 4 and 6 elongation to failure % of recycled samples with passes respectively. minimize the porosities in recycled material as proved previously. Increasing ER. Then increased to 11. 4 and 6 passes.4 %. The increase in UTS is more significant after the first pass. and improve the quality of bonding between individual chips and consequently ultimate tensile strength and elongation of the recycled specimen increases. The UTS is found to increase with the increase of the number of passes for both samples extruded at 425 and 500 oC as shown in Fig. 11. In case of sample extruded at 500 oC. the elongation to failure is observed to decrease from 14. UTS and elongation to failure of the extruded hardening during the ECAP process.3 % before the ECAP to 8.8 and 347.4% and 13.9. the UTS 3. It has been established that the strain imposed by the first ECAP pass has a strong effect on the breakdown and refinement of the initial microstructure [24]. processing AA-6061alloy through ECAP [33].4% for samples extruded at 425 and 500 oC respectively.

7 MPa to 194. elongation to failure % of hot extrusion followed by ECAP process instead of samples extruded at 425 and 500 oC is nearly the using hot extrusion only. Then. elongation to Al7075/Al. [20]. leads to improvement in same. . Z. 92.4%) at the vol. 1945. no. Atzori. the difference is found to decreases with increasing number of ECAP passes. While 40 . Matuszak. 792-795. it is noticed that the UTS of samples was not sufficient to break down the oxide layers extruded at 500 oC is always higher compared with between individual chips. M. U.4.4 % before the ECAP and Compounds. two phase material. (1991): 1379-1384. While the plastic strain those of samples extruded at 425 oC. 60. 1999.4 %) and decreased from 14. Matuszak. the [6] J. W. Martinez. vol. the plastic stain Up to 3 passes. The difference oxide layers and guarantee sound bonding. Tekkaya. Matuszak. strength. the UTS values were observed to increase from 162.S Patent 2. As compared with work of Hasse et al.4 % to 24 % (40%) after 4 passes for sample [1] J.752. pp.” Journal of materials processing recycled samples through cold ECAP is significantly technology. the quality of bonding was increased passes. 1. Biermann. 106. H. vol. pp. [7] M. efficient in recycling and producing high strength PA.7 MPa after two Furthermore. WARRENDALE. it saves Processing Technology. Becker. no. “The recycling of metals temperature. Cold ECAP is conducted at room [5] J. Paydar and R. vol.5 MPa (4) The superior mechanical properties of the samples before the ECAP process to 173. no.A. 1996.8 recycling. E. Similar trend was observed in case of elongation to failure. pp.(USA).” Journal of materials processing (1) Hot extrusion is effective techniques to produce technology. (3) Recycling of aluminium machining chips through Also after 4 passes. elongation to failure increased from 14 % before the ECAP process to 23.5%) after 4 passes with the microstructure characterization showing fine for sample extruded at 450 and 550 oC respectively.43]. Cold ECAP is more trimmings by conform process. the energy required for heating. Selmy et al. N. 2000. 35-41. 395-399. Furthermore. the UTS of aluminum chips.” MINERALS. A. Z. 719-722. Matuszak. % to 13. 209. vol. J. [4] G. same number of passes for samples extruded at 425 [2] Z. 7. vol. vol. / Solid-state recycling of aluminum alloy (AA-6061) chips via hot extrusion followed by equal channel angular pressing (ECAP) severe plastic deformation and the number of cold ECAP process slightly increased the relative dislocations necessary to deform the ultra-fine grain density. higher than those of recycled through hot ECAP. (2) For the extrusion ratio ER = 5. the UTS is nearly the same. 2003. recycled samples with high relative density. Fogagnolo. 2009. Furthermore. “Direct recycling of aluminium chips into extruded products. 1.7 % (. While after 4 imposed through ECAP was sufficient to break the passes. no.8 % (70%) and References from 14. Gronostajski. 34-39. 2009. D. Marciniak and A.3 [3] A. Sherafat.” Journal of Materials Processing Technology.8%) and extruded through the ECAP die were in accordance from 166. Simón and M. M. uniform grains and improvement of chips welding. elongation to failure confirmed this conclusion. The investigations carried out on solid state recycling “Production of composites on the base of AlCu4 alloy chips. Lazzaro and C. D. ductility and hardness. “Method for treating aluminum or aluminum alloy scrap”. pp. ECAP. Pantke.” Journal of materials processing technology. M. Stern. “Recycling of aluminium alloy and bonding quality achieved through hot ECAP is aluminium matrix composite chips by pressing and hot significantly better than cold ECAP and the results of extrusion. 64. “New extruded at 450 and 550 oC respectively. 4.2 % (40.” Journal of materials processing technology.” Journal of Materials fine microstructure is obtained. However. E. H.2 MPa (16. METALS & MATERIALS SOC (TMS).2 %) after 4 passes for samples Hammer and K. by recycling Al7075 alloy chips using powder metallurgy route. H. Marciniak and A. 487.2. the UTS increased from 116 to 347. “Hot profile extrusion of AA-6060 extruded at 425 and 500 oC respectively. Schikorra. 1. with the increase of the number of passes. Gronostajski and A. of AA-6061 through hot extrusion followed by cold no. allowed to obtain the following conclusions. Kaczmar. B. 3343-3350. M.391. Ebrahimi. 1997. process to 13. 149-156. A. MPa (~200%) and 133 to 349 MPa (162. H. Furthermore. pp. [40. “Fabrication of and 500 oC respectively.” Journal of Alloys failure increased from 9. 1. Marciniak and A. between the UTS values is 57. pp. “Recycling of aluminium According to these observations.6 MPa (6. I. pp. 143. In the methods of aluminium and aluminium-alloy chips present work. therefore the grain growth due to high by plastic deformation: an example of recycling of temperature applied in hot ECAP is eliminated and aluminium and its alloys chips. Gronostajski.Conclusions [8] J. Gronostajski. Ruiz-Navas. [9] J. materials.

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