Documentos de Académico
Documentos de Profesional
Documentos de Cultura
Pa d
0.592(15.0)
0.539(13.7)
d e
n ange
0.524(13.3)
t
0.116(3.0)
e
Ex e R
0.093(2.4)
0.413(10.5) 0.342(8.7)
lta g Mounting Pad Layout
0.374(9.5) 0.327(8.3)
Vo 0.091(2.3)
0.067(1.7)
0.366(9.3)
0.116(3.0)
0.343(8.7) 0.413(10.5)
0.093(2.4)
0.406(10.3) 0.374(9.5)
Dimensions in
0.382(9.7)
inches and (millimeters)
LEAD 1 0.150(3.8)
0.138(3.5) 0.366(9.3)
0.098(2.5) 0.126(3.2)
0.343(8.7)
0.197(5.0)
0.185(4.7) 0.606(15.4)
0.583(14.8)
0.028(0.7)
0.016 (0.4) Min. 0.020(0.5) *Patent #s:
4,980,315
0.098(2.5)
5,166,769
LEAD 2/METAL HEATSINK 0.059(1.5) 5,278,095
Maximum Ratings and Thermal Characteristics (TC = 25C unless otherwise noted)
Parameter Symbol Value Unit
Peak pulse power dissipation with 10/1000s waveform 6600
PPPM W
10/10,000s waveform 5200
Steady state power dissipation PD 8.0 W
(1)
Peak pulse current with a 10/1000s waveform IPPM See Table 1 A
Peak forward surge current, 8.3ms single half sine-wave IFSM 700 A
Typical thermal resistance junction to case RJC 0.90 C/W
Operating junction and storage temperature range TJ, TSTG -55 to +175 C
Note: For all types maximum VF = 1.8V at IF = 100A measured on 8.3ms single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum
Ratings and
Characteristic Curves (TA = 25C unless otherwise noted)
Load Dump Power Characteristics
Power Derating Curve (10ms Exponential Waveform)
8.0 6,000
5,000
4,000
4.0 3,000
2,000
2.0
1,000
0 0
0 50 100 150 200 25 50 75 100 125 150 175
TA = 25C
Pulse width (td) is defined as
Input Peak Pulse Current %
IPP
50 Half Value
2
td
0 1,000
0 10 20 30 40 10 100
Time, ms (t) Pulse Width (ms) 1/2 IPP Exponential Waveform
RJA
10
RJC
1
0.1
0.01
0.01 0.1 1 10 100
t Pulse Width (sec.)