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Metal X+1
Defocus Metal
n
Hotspot Checking
Built-in or foundry-defined
hotspot rules
Custom hotspot scripting
RC Extraction Interfaces
EDA tools (RC extraction)
Generic thickness export file
7 2012 Cadence Design Systems, Inc. Cadence confidential.
VCMP Simulation Flow: Serial Run
Initial Setup
Setup
VMP, Techmap & Working Directory Specify TSMC DDK
Specify TSMC DDK
Process File (.enc file) Load Design DB
Library File (.so file)
do_extraction
Load Design Data
GDS / OASIS Geometry extraction
do_prediction
Run Geometry Extraction CMP prediction
save_psgdb
Run Prediction
Save Results View Results Run Hotspot Fix Export Prediction .......
Hint Generation for RC Extraction Interface
Initial Setup
Setup
VMP, Techmap & Working Directory
Specify TSMC DDK
Specify TSMC DDK Load Design DB
Process File (.enc file)
Library File (.so file) do_simulation
Load Design Data
GDS / OASIS
Geometry extraction
CMP prediction
Run Simulation save_psgdb
Save Results View Results Run Hotspot Fix Export Prediction .......
for RC Extraction Interface
Hint Generation
Initial Setup
TSMC DDK
CCP Software
Cadence CMP Predictor
TSMC DDK
CCP Software
Cadence CMP Predictor
TSMC DDK
CCP Software
Cadence CMP Predictor
TSMC DDK
CCP Software
Cadence CMP Predictor
TSMC DDK
CCP Software
Cadence CMP Predictor
Copper thickness
The distance from the top of the copper to the bottom of the etched trench. This includes the
barrier thickness at the bottom of the trench.
ILD thickness (Inter Layer Dielectric thickness)
The distance from the top of the dielectric to the top of the capping/etch stop layer immediately
below the dielectric.
ILD height (Inter Layer Dielectric height)
The distance from the top of the dielectric to the bottom of the etched trench.
Surface height
The density weighted average of the copper and oxide heights referenced from the top of the
density weighted surface to the bottom of the M1 etch stop layer.
Hotspots Check
VCMP computes two (2) Hotspots
Dishing Hotspots (Called R4 hotspots in CCP)
Depth of Focus Hotspots (Called R5 Hotspots in CCP)
Thickness Variation
Note: For BEOL (back end-of line) process, dishing is the difference between
the ILD height in the space and the copper height in the trench, within the grid
of interest.
Some publications use the term step-height instead of dishing. The term step-height is more
generic than dishing. It refers to the height difference between any two neighboring points.
No
Layout Optimization
Halo with different contexts