IntelliSuite Tutorial PDF

RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
Lecture 2
IntelliSuite Tutorial
Sazzadur Chowdhury, Ph.D.

Electrical and Computer Engineering
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Overview
IntelliSuite is a MEMS design and verification tool

The software can simulate actual steps in a fabrication
process to develop a 3-D model of a MEMS device
The developed 3-D model can then be used to perform 3-D
simulations such as
Electrostatic, Mechanical, Thermal or Coupled thermo-
electro-mechanical simulations using finite element analysis
method
Microfluidics
Electromagnetic
Electrokinetics
Packaging
System level simulation
Macro-model extraction
http://www.intellisensesoftware.com

MEMS Process Simulation Design Flow
Wafer
Deposition Lithography Etch
3-D Model

MEMS 3-D Model

Behavior Simulation Concept
Fab. Proc. Manual 3-D

Simulation Builder
Load Meshing
3-D Model
Boundary Analysis
Condition Options
Behavior
Pattern

MEMS Simulation Objectives
To investigate a materials physical characteristics for

suitability of its use in a particular device based on a specific
deposition method
Selection of a deposition or etching method for a material to
obtain a desired device geometry
To optimize the process steps
Check for process compatibility
To simulate the 3-D model of the device for behavior

IntelliSuite Overview
IntelliFab
IntelliMask
Mematerial
3-D Builder
Thermoelectromechanical Analysis
Microfluidics and BioMEMS
AnisE (Anisotropic Etch Simulation)
Technical Reference

IntelliFab: Getting Started

Start
IntelliSuite
Intellifab

IntelliFab
File
Process
Database
Construct
Simulation

Adding a Fabrication Process Step

Building a Process Table

3-D Visualization
Construct
Visualize
Scale
Sequence once
Cross-section

Database
This option allows you to add

process steps to the currently
open database.
New materials are added to
MEMaterial
Deposition, Etching, Bond, Mask, Substrate,

Electroplating, Doping, Liftoff Metalization, or Clean.

Process Steps
Bonding
Definition
Deposition
Doping
Electroplating
Etch
Sacrifice
Laser Ablation
(Ablation is the
process of
removing material
by vaporization or
disintegration.

IntelliMask
Single Mask
Multilayer Mask
Convert (DXF, GDSII)
The IntelliSuite GDSII file converter provides several options.
Users can convert all cells, or just selected cells, of a multi-cell
multi-level *.gds file into multi-layer *.msk files. A multi-layer
*.msk file will be generated for each selected cell, and also for
each sub cell of the selected cell

GDS Cell Tree After Conversion
IntelliSuite Masks can be exported to GDSII format for fabrication

IntelliMask Features
Manhattan geometry
Non-Manhattan Geometry
Cartesian Co-ordinate
Polar Coordinate
Switch layers
Mask Editor Tool Bar

Grids and Layers
Keyboard Entry

Mematerial
Mematerial is a powerful, easy-to-use simulation tool for the

mechanical, electrical, and optical modeling of thin films
deposited on silicon substrates.
Applications include the design of:
Microsensors and microactuators
Integrated circuits
Device packaging
Other silicon microstructures
The software presents data on the properties of materials in
two- and three dimensional graphs as well as in tables
All data are experimentally verified
New values can be predicted using interpolation and
extrapolation

Mematerial
Parameter Graphs
Mematerial
Window
Single Parameter
of interest
Parameter
Window Two parameter of
interest

Mematerial: Data Manipulation

3D Builder
2-D area 3-D Area

Elements Construction
Gaps and overlaps cannot

exist anywhere along the
common edge when a
continuous structure is
modeled.
The adjacent edges either
must both be straight, or
they must have compatible
curvatures.

Mesh Refinement

ThermoelectricalMechanical Module

Analysis Option

Analysis Options: Static Analysis
Stress/Displacement
Heat Transfer
Heat Transfer / Thermal Stress
Thermal Electrical
Thermal Electrical / Thermal Stress
ThermoElectroMechanical Relaxation
Electrostatic
Electrostatic Force vs. Displacement

Relaxation Method
Domain 1
f1( x1( i 1 ) , x2( i ) ,....., xm( i ) ) 0
Domain 2
f 2 ( x1( i 1 ) , x2( i 1 ) ,....., xm( i 1 ) ) 0
Domain m
f m ( x1( i 1 ) , x2( i 1 ) ,....., xm( i 1 ) ) 0
i=i+1
No Yes
Converged

Analysis Options: Frequency Analysis
Static Stress
Heat Transfer / Thermal Stress
ThermoElectroMechanical Relaxation

Analysis Options: Dynamic Analysis
Stress / Disp. (Direct Integration)

Stress / Disp. (Mode Based)
Heat Transfer Transient
Thermal Electrical Transient
Stress / Disp. / Squeezed Film (Direct Integration)
Stress / Disp. / Electrostatic (Direct Integration)
Stress / Disp. / Electrostatic (Mode Based)
Stress / Disp. / Electrostatic / Squeezed Film (Direct Integration)

Analysis Options: Macro-Model
Rigid Body Variables

Spring Constants
Squeezed Film Damping Variables
Capacitance
Capacitance vs. Displacement
Mechanical Reduced Order Modeling
ElectroMechanical Reduced Order Modeling

Loads
Several types of loads can be applied in the

ThermoElectroMechanical Analysis module: Temperature,
Pressure, Displacement, Heat Convection, Heat Flux,
Acceleration, Coriolis Force, Voltage, Current, and Charge
Density.
Loads can be applied on a face or a node
Amplitude vs Time
Amplitude vs Frequency

Boundary
Fixed
YZ Fixed
XY fixed
XZ fixed
X fixed
Y Fixed
Z Fixed
Free
Attach spring, etc.

Load-Boundary Application Example
0 V DC 1 Pascal
Fixed Boundary
Fixed Boundary 12 V DC
PECVD Nitride, Au and Ti layers are removed

4 lateral faces of the diaphragm are X, Y, Z fixed
Nitride Backplate and wafer faces are X, Y, Z fixed

Mesh
Automesh
User Defined mesh
Mechanical mesh
Electrical mesh

Result
Displacement
Deformed shape
Stress components Node value
Stress invariants Node curve
Potential 2-d plot- Mechanical
Electrical field 2-D plot-
Current density Electromechanical
Capacitance
Charge density
Pressure
Natural frequency
Mode animation
Macromodel

Layout: Die Size
Click
Construction
Layout
Die size
Die Size Entry Window

Electrostatic Comb Drive Example
Courtesy: Sandia Laboratory
An electrostatic comb drive is a kind of resonator that is actuated

electrostatically.
The movement of the free comb due to electrostatic excitation
changes the capacitance among the comb fingers, which is
sensed and used to drive some other micro structure

Comb Drive Construction: Begin
Click
Construction
Show Palette

Step 1
Substrate Definition
Click
Definition
Geometry
Si
Czochralski
The OpSet window pops up and data

can now be entered in the OpSet
window

Substrate Definition OpSet Window
Change parameters
as necessary
Click
Add process
Add process
The OpSet window
disappears, and first
step is entered into
the Process Table.
The Process
Construction Palette
remains on the
screen
OpSet Window
Step 2: Substrate Clean Up
Click
Etch
Element
Si
Clean
Click
Process
Piranha
Add Process
Add Process
Piranha: A solution of H2SO4 and H2O2 at 1200 C

Result of 2nd Step
The wafer is cleaned and the 2nd step is

added to the process construction table
Click
Construction
Visualize
Visualizer window pops up
Click
Visualize
All
A 3-D model of the structure is
displayed. Using middle or right mouse
button adjust a suitable view angle.

Step 3
Silicon Dioxide Deposition
Click
Process
Deposition
Construction
Compounds Palette
SiO2
Thermal
Time_dep (enter 600)

H20 pp (enter 10)
t-film (entert_685)
t_etch( enter 685) OpSet
t_after (enter 0) Window
Entry
Add Process
Add Process

Step 4
Silicon Nitride Deposition
Click
Deposition
Compounds
Si3N4
PECVD
t_film (enter 1000)
Add Process
Add Process
This layer protects the wafer during subsequent processing

Step 5
Cleaning After Plasma Deposition
Click
Etch RCA: A solution of
Element NH4OH:H2O2:H2O
Si
Clean
Process
RCA
Add Process
Add Process
This cleaning step is

necessary because
diffusion cannot follow
plasma deposition

Step 6
Polysilicon Layer Deposition
Click
Deposition
Compounds
PolySi
LPCVD
t_film (enter 2000)
Add Process
Add Process

Step 7
Aluminum Contact Deposition
Click
Deposit
Element
Al
Sputter
Process
Ar-Ambient
Add Process
Add Process

Step 8
Photoresist Deposition
Click
Deposition
Polymers
PR-S1800
Spin
Add Process
Add Process
PR-S1800 series is a positive photoresist.

It is a proprietary chemical from Shipley
Corporation, MA, USA. Main ingredients
are: (1) Propylene glycol methyl ether
acetate (70%), (2) A Novalac resin (20%),
and (3) diazonapthoquinone (1-10%)

Step 9
First Mask Definition
Click
Definition
Mask
UV
Contact
Mask Number (enter 1)
Process
Suss
Add Process
Add Process

Mask Definition OpSet Window
Mask No.
(Must be a
unique
numerical
value)
Click
Layout
twice to
invoke
the
Mask
Editor

Mask Editor: First Mask

Step 10
Photoresist Pattern
Click
Etch
Polymers
PR-S1800
Wet
Process: 1112A (solvent)
t_etch (enter 990000)
Add Process
Add Process

Step 11
Aluminum Etch
Click
Etch
Element
Al
Wet
Process
PAN
Add process
Add process
PAN Phosphoric+Acetic+Nitric Acid

Step 12
Photoresist Strip
Click
Etch
Polymers
PR-S1800
Wet
Process: 1165 (solvent)
Add Process
Add Process

Step 13
2nd Photoresist Deposition
Click
Deposition
Polymers
PR-S1800
Spin
Add Process
Add Process

Step14
2nd Mask Definition
Click
Definition
Mask
UV
Contact
Mask Number (enter 2)
Process
Suss
Add Process
Add Process
This mask patterns the polysilicon layer

Mask Editor: Second Mask

Step 15
Photoresist Etch
Click
Etch
Polymers
PR-S1800
Wet
Process: 1112A (solvent)
Add Process
Add Process

Step 16
Polysilicon Plasma Etch
Click
Etch
Compound
Poly Si
Dry
Process
SF6-Plasma
T_etch (enter 990000)
Add Process
Add Process

Step 17
Photoresist Strip
Click
Etch
Polymers
PR-S1800
Wet
Process: 1165 (solvent)
Add Process
Add Process

Step 18
Nitride Etch
Click
Etch
Compound
Si3N4
Wet
Process
Sacrifice
t_etch (enter 1e6)
Add Process
Add Process
Phosphoric acid
(70% concentrated)

Step 19
Silicon Dioxide Etch
Click
Etch
Compound
SiO2
Wet
Process: BOE(solvent)
Add Process
Add Process
Buffered Oxide Etch (BOE) is a

5:1 mixture of NH4F and HF
Step 20
Substrate Sacrificial Etch
Click
Etch
Element
Si
Wet
Process
Sacrifice
t_etch (enter 1e6)
Add Process
Add Process

Comb Drive 3-D model
Complete Process table 3_D Model

IntelliSuite Fabrication Simulation Example
Conceptual Drawing IntelliSuite Fabrication

Simulation Result Cross-section

IntelliSuite Fabrication Simulation Example
Conceptual Drawing IntelliSuite Fabrication

Simulation Result Cross-section

Intellisuite Fabrication Simulation of an

Electromagnetic Microactuator

IntelliSuite Simulation Result of Electrostatic Pressure

due to a Bias Voltage

IntelliSuite Simulation Result of Displacement due to

Electrostatic Pressure due to a Bias Voltage

Animation of a Diaphragm Vibration for an Acoustical

Wave at 1 kHz at 1 Pascal

IntelliSuite Dynamic Analysis Example
Transient Response of a Diaphragm

Vibration for an Acoustical Wave at 1kHz at
1 Pascal
IntelliSuite Dynamic Analysis Example
Resonant peak
for first
vibrational
mode
Mode based steady state analysis

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RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR

Sazzadur Chowdhury, Ph.D.

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

IntelliSuite is a MEMS design and verification tool

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

MEMS Process Simulation Design Flow

Deposition Lithography Etch

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

MEMS 3-D Model

Fab. Proc. Manual 3-D

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

MEMS Simulation Objectives

To investigate a materials physical characteristics for

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

IntelliFab: Getting Started

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Adding a Fabrication Process Step

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Building a Process Table

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

This option allows you to add

Deposition, Etching, Bond, Mask, Substrate,

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

GDS Cell Tree After Conversion

IntelliSuite Masks can be exported to GDSII format for fabrication

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Mask Editor Tool Bar

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Grids and Layers

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Mematerial is a powerful, easy-to-use simulation tool for the

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Mematerial: Data Manipulation

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

2-D area 3-D Area

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Gaps and overlaps cannot

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Analysis Options: Static Analysis

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Analysis Options: Frequency Analysis

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Analysis Options: Dynamic Analysis

Stress / Disp. (Direct Integration)

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Analysis Options: Macro-Model

Rigid Body Variables

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Several types of loads can be applied in the

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

06-88-435 Microelectromechanical Systems (MEMS) Summer 2011

Load-Boundary Application Example