GUL - DER - ZXSDR B8200 Product Description

ZXSDR B8200 Product Description
UniRAN 14/GUL Multi-Mode


Version Date Author Reviewer Notes
First release. It supports 3GPP R11, BPN2

are introduced, CCE1/SA/SE support GUL
Dong Chen Yong, Yang
V1.00 2015-12-25 multi-mode, 32 dry contacts are available,
Chuanghong Xu, Xin Shengli
CCE1 UMTS CNBAP processing
capability=3000/s.
Dong Chen Yong, Yang
V1.10 2016-03-30 Add FS5A/PM5.
Chuanghong Xu, Xin Shengli
2016 ZTE Corporation. All rights reserved.

ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used
without the prior written permission of ZTE.
Due to update and improvement of ZTE products and technologies, information in this document is subjected to
change without notice.
ZTE Confidential & Proprietary 1

TABLE OF CONTENTS
1 Overview ............................................................................................................ 5
1.1 Introduction .......................................................................................................... 5
1.2 Benefits................................................................................................................ 5
1.3 Application Scenarios .......................................................................................... 6
2 Product Architecture ......................................................................................... 8

2.1 Physical Structure ................................................................................................ 8
2.2 Hardware Structure .............................................................................................. 9
2.2.1 Control & Clock Board (CC) ................................................................................. 9
2.2.2 Baseband Processing Board .............................................................................. 13
2.2.3 Fabric Switch Board (FS) ................................................................................... 18
2.2.4 Site Alarm Board (SA/SE) .................................................................................. 20
2.2.5 Universal Ethernet Switch Board (UES) ............................................................. 22
2.2.6 Universal Clock Interface Board (UCI/UCI-C)..................................................... 23
2.2.7 Tower mounted Amplifier control Module (TAM) ................................................ 24
2.2.8 Power Module (PM) ........................................................................................... 25
2.2.9 Fan Array Module (FAM) .................................................................................... 26
2.3 Software Architecture ......................................................................................... 27
2.4 Functionality....................................................................................................... 28
3 Technical Specifications ................................................................................. 30

3.1 Physical Indices ................................................................................................. 30
3.2 Capacity Indices ................................................................................................ 30
3.3 Power Indices .................................................................................................... 31
3.3.1 Power Supply..................................................................................................... 31
3.3.2 Power Consumption........................................................................................... 31
3.4 Interface Indices ................................................................................................ 31
3.5 Environment Indices .......................................................................................... 33
3.6 Electromagnetic Compatibility Indices ................................................................ 33
3.7 Reliability Indices ............................................................................................... 33
4 Configurations Principles ............................................................................... 35
5 Glossary ........................................................................................................... 37
2 ZTE Confidential & Proprietary

FIGURES
Figure 1-1 B8200 in the GSM/UMTS/LTE Network ............................................................. 5

Figure 1-2 B8200 Application Scenario ............................................................................... 7
Figure 2-1 Baseband Unit -- ZXSDR B8200 ........................................................................ 8
Figure 2-2 B8200 Hardware Structure ................................................................................ 9
Figure 2-3 CC Panel ........................................................................................................... 9
Figure 2-4 UBPG/UBPG3 Panel ........................................................................................13
Figure 2-5 BPK_e1/BPK_e/BPK_d Panel ..........................................................................14
Figure 2-6 BPL1A/BPL1/BPN0A/BPN0 Panel ....................................................................15
Figure 2-7 BPN2 Panel ......................................................................................................17
Figure 2-8 FS Panel ...........................................................................................................18
Figure 2-9 SA Panel...........................................................................................................20
Figure 2-10 SE Panel.........................................................................................................21
Figure 2-11 UES Panel ......................................................................................................22
Figure 2-12 UCI/UCI-C Panel ............................................................................................23
Figure 2-13 TAM Panel ......................................................................................................24
Figure 2-14 PM Panel ........................................................................................................25
Figure 2-16 FAM Panel ......................................................................................................26
Figure 2-17 B8200 Software Structure ...............................................................................27
TABLES
Table 2-1 Board List of ZXSDR B8200................................................................................ 8

Table 2-2 Key Indices of CC Boards ..................................................................................10
Table 2-3 CC2/CC16B Panel Interfaces.............................................................................11
Table 2-4 CCE1 Panel Interfaces.......................................................................................11
Table 2-5 Key Indices of BPK_e1/BPK_e /BPK_d ..............................................................14

Table 2-6 Key Indices of BPL1A/BPL1/BPN0A/BPN0 ........................................................16

Table 2-7 BPL1A/BPL1/BPN0A/BPN0 Panel interfaces .....................................................16
Table 2-8 Key Indices of BPN2 ..........................................................................................17
Table 2-9 BPN2 Panel interfaces .......................................................................................18
Table 2-10 Key Indices of FS boards .................................................................................19
Table 2-11 FS Panel Interfaces .........................................................................................20
Table 2-12 SA Panel Interfaces .........................................................................................21
Table 2-13 SE Panel Interfaces .........................................................................................22
Table 2-14 UES Panel Interfaces .......................................................................................22
Table 2-15 UCI/UCI-C Panel Interface ...............................................................................23
Table 2-16 TAM Panel Interfaces.......................................................................................24
Table 2-17 PM Panel Interfaces .........................................................................................26
Table 3-1 Physical Indices .................................................................................................30
Table 3-2 BS8200 Capacity ...............................................................................................30
Table 3-3 B8200 Power Supply .........................................................................................31
Table 3-4 ZXSDR B8200 Power consumption ...................................................................31
Table 3-5 ZXSDR BS8200 Interface Indices ......................................................................31
Table 3-6 B8200 Working Environment Characteristics .....................................................33
Table 3-7 ZXSDR B8200 Electromagnetic Compatibility Characteristics............................33
Table 3-8 B8200 Reliability Characteristics ........................................................................34
Table 4-1 B8200 Configuration ..........................................................................................35

1 Overview
1.1 Introduction
This document provides a high level description of the distributed baseband processing
Unit (BBU) ZXSDR B8200 (hereinafter B8200) that used in ZTE multi-mode wireless
solutions.
The baseband unit B8200, can be inserted into the integrated macro base station, or
connected to RRU in distributed base station. It is responsible for processing the
baseband signals. Based on ZTE SDR platform, it supports GSM, UMTS and FDD LTE
single-mode or multi-mode by software configuration. It enables operators to deploy one
unified radio access network rather than independent GSM, UMTS or LTE network,
which brings simplicity and convenience with low CAPEX and OPEX. Figure 1 shows the
position of the ZXSDR B8200 in the typical multi-mode network.
Figure 1-1 B8200 in the GSM/UMTS/LTE Network
This document is structured as follows. Chapter 1 provides an overview of the

characteristics of B8200, its key benefits and application scenarios. Chapter 2 gives the
architecture, functionality, services and multi-system cooperation. Chapter 3 covers
system capabilities, and chapter 4 introduces configuration principles of each kind of
boards used in B8200.
1.2 Benefits
Multi-mode Baseband Unit

B8200 supports all kinds of wireless access technologies simultaneously, including

GSM, UMTS and LTE, which share the common control function and transmission
totally. It fully satisfies operators need with the minimum hardware change.
Large Capacity
To adapt to the rapid expansion of network development and the prosperity of

multi-mode network, the latest BBU boards are released with higher processing
capacity. The capacity indices of new boards surpass legacy ones, including RRC
connected user number, cell number and data throughput. The increase in the
board capacity improves the overall capacity of BBU. In addition, the new boards
can be used together with the legacy ones, which provide flexibility during upgrade.
Plug-in Design for Shelf, Zero Footprint, Convenient Deployment
B8200 adopts Plug-in design with 19-inch, 2U in height and 8.75 kg (with full
configuration) in weight. It can be conveniently mounted on the wall, ground, or in
the 19-inch rack, etc.
Flexible Networking
B8200 provides GE/FE interfaces and IP networking. It supports RRU in different

networking modes, like star and chain networking to satisfy the requirements of
operators in different environments and under different transmission conditions.
1.3 Application Scenarios
As the baseband processing unit, B8200 is widely used in ZTE series of base stations,
including indoor macro BS of ZXSDR BS8800, outdoor macro BS of ZXSDR
BS8900A/BS8900B, distributed BS of ZXSDR BS8700 and outdoor compact BS of
ZXSDR BS8906.
Typical application scenarios of B8200 are shown in the following figure.

Figure 1-2 B8200 Application Scenario
RRU Installation
RRU
B8200 Accommodation
B8200

2 Product Architecture
2.1 Physical Structure
The following figure shows the hardware appearance of B8200.
Figure 2-1 Baseband Unit -- ZXSDR B8200
1 3 4
1. Power module (PM) 2. Site alarm board (SA) 3. Fabric switch board (FS) 4. Baseband processing
board (BP) 5. Fan array module (FAM) 6. Control & clock board (CC)
The baseband unit consists of control & clock board, fabric switch board, baseband
processing board, site alarm board, site alarm extension board (optional), universal
Ethernet switch (optional), tower mounted amplifier control module (optional), power
module, and fan module.
Table 2-1 Board List of ZXSDR B8200
Board Name Function Description

CC2/CC16B/CCE1 Control & Clock Board
FS3/FS3A/FS5/CR0 Fabric Switch Board
UBPG/UBPG3 Universal Baseband Processing board for GSM
BPK_e1/BPK_e/BPK_d Base band Processing board for UMTS
BPL1A/BPL1/BPN0A/BPN0 Base band Processing board for LTE
BPN2 Baseband Processing board for GUL multi-mode
SA Site Alarm Board
SE Site alarm Extension Board
UES Universal Ethernet Switch Board

UCI Universal Clock Interface
TAM Tower mounted Amplifier control Module
PM Power Module
FAM Fan Array Module
2.2 Hardware Structure
B8200 hardware architecture is shown in Figure 2-2.
Figure 2-2 B8200 Hardware Structure
Baseband Unit
Antenna
Baseband
Processing
FS
CPRI
(Optional RRU/RSU
for LTE)
SA/
E1
SE CC
Radio Unit
GE/FE
Control Signaling
Clock
Data
B8200 can be configured in GSM/UMTS/LTE single mode or multi-mode.
2.2.1 Control & Clock Board (CC)
CC is the control & clock board, used for control and management of baseband unit,
providing Ethernet and system clock. There are mainly 3 types of CC boards in order to
meet different application requirements, illustrated in the following figures.
Figure 2-3 CC Panel
CC2:

CC16B:
CCE1:
Note: The boards are differentiated by the label attached on the panel, not included in the above
figures. The product you receive is subject to the actual object.
Their key indices are specified in the following table.
Table 2-2 Key Indices of CC Boards
CC Type CC2 CC16B CCE1

Mode G/U single mode G/U/L single mode or GUL multi-mode or
or dual-mode multi-mode LTE single mode
UMTS CNBAP 400/s 1500/s 3000/s

Processing
Capability
LTE N/A 10800 10800

Processing RRC_connected users RRC_connected users
Capability UL: 900Mbps/ DL: UL: 1.8Gbps/ DL:
900Mbps 3.6Gbps
Note: 1. The above table describes the maximum hardware capability. The actual capability is up to
the licenses configured. 2. There is the GPS module embedded in CC16B/CCE1 but not in CC2.
The panel interfaces are specified in the following table.

Table 2-3 CC2/CC16B Panel Interfaces
Interface Name Description
External communication port, connected to external

EXT
receiver for clock synchronization or cascading.
Connected to GPS signal interface, or 2 MHz BITS signal

REF
interface.
USB (CC16B only) Used for software upgrade
Ethernet interface for Abis/Iub/S1/X2, self-adaptive

TX RX
100M/1000M optical interface.

ETH0
10M/100M/1000M electrical interface.
Ethernet interface used for cascading, debugging or local

DEBUG/CAS/LMT
maintenance, adapting interface of 10M/100M/1000M.
Note: Interfaces of ETH0 and TX RX are mutually exclusive.
Table 2-4 CCE1 Panel Interfaces

ETH0
10M/100M/1000M electrical interface.
Ethernet interface used for cascading, adapting interface

ETH1
of 10M/100M/1000M electrical interface.
Ethernet interface used for debugging or local

DEBUG/LMT
maintenance, adapting interface of 10M/100M/1000M.

TX ETH2 RX

TX ETH3 RX
Connected to GPS signal interface, or 2 MHz BITS signal

REF
interface.
USB Used for software upgrade
External communication port, connected to external

EXT
receiver for clock synchronization or cascading.
Their main functions are listed as follows:

Accomplishes LTE control plane protocol processing, including S1AP, X2AP, RRC,
etc.
Supports Ethernet switching function and implements data switching for service and
control flow within the system
Processes Abis/Iub/S1/X2 interface protocol
Manages software versions of boards and programmable components, and

supports local and remote software upgrade
Reads various hardware management marks in the system, including the rack
number, backplane type number, slot number, board function type, board version,
and board function configuration mark
Monitors, controls and maintains the base station system with LMT interface
Supervises the running status of each board within the system
Supports primary/slave switchover
Synchronizes with various external reference clocks, including IEEE1588, GPS

clock and the clock provided by BITS(2MHz2Mbits). The CC can select one
according to the actual configuration
Generates and delivers the clock signal demanded by each part
Provides GPS receiver interface and manages the GPS receiver
Provides a real-time clock for system operation and maintenance and calibrates the
real-time clock
Supports MicroTCA protocol based module management function
Supports 2 CC boards for different modes: one for GU dual-mode and the other for
LTE mode
In addition, CC16B/CCE1 has the following functions:
Supporting Synchronous Ethernet clock

Providing USB interface for software upgrade
2.2.2 Baseband Processing Board
There are 3 categories of baseband processing boards in order to meet different

application requirements:
1. UBPG /UBPG3
Both UBPG and UBPG3 are GSM baseband processing boards, processing the physical
layer protocol and frame protocol specified by 3GPP, illustrated in the following figure.
Figure 2-4 UBPG/UBPG3 Panel
Note: The boards are differentiated by the label attached at the left-bottom corner, not included in
the above figures. The product you receive is subject to the actual object.
UBPG supports 12 TRXs and UBPG3 supports 24 TRXs. Their main functions are listed
as follows:
Supports rate adaptation, channel coding, interleaving, encryption, TDMA shock

burst generation, GMSK/8PSK modulation, and IQ baseband digital signals output
Supports uplink IQ data receiving, receiver diversity combination, digital

demodulation (GMSK&8PSK, equilibrium), decryption, deinterleaving, demodulator,
rate adaptation, and transmits signals from GE Ethernet interfaces to CC board for
processing
Synchronizes radio link and processes transmission frame
Measures parameters required in power control and handover
Supports diversified transmission and receiving
Communicates with CC via Ethernet interface

Reads all the hardware management identifiers, including the backplane type
number, slot number, board function type, board version, board function
configuration identifier, and the CPU serial number
2. BPK_e1/BPK_e/BPK_d
BPK_e1, BPK_e and BPK_d are all UMTS baseband processing boards, processing the
physical layer protocol and frame protocol specified by 3GPP, illustrated in the following
figure.
Figure 2-5 BPK_e1/BPK_e/BPK_d Panel
They provide the same functions but with different CE, cell processing capability and
data throughput. The key indices are specified in the following table.
Table 2-5 Key Indices of BPK_e1/BPK_e /BPK_d
Board BPK_e1 BPK_e BPK_d

CSs 6 6 12
CE No. DL192CE/UL19 DL384CE/UL384CE DL768CE/UL768CE

2CE
Data DL129.6Mbps/ DL259.2Mbps/ DL518.4Mbps/

Throughput UL34.5Mbps UL69Mbps UL138Mbps
Note: The above table describes the maximum hardware capability. The actual capability is up to
the licenses configured.

Achieves downlink baseband signal processing, including downlink data coding,

multiplexing, rate adaptation, channel mapping, spread spectrum and scrambling
power regulation and channel compositing
Achieves uplink baseband signal processing, including uplink data RAKE receiving,
demodulator, and transmits data to lub interface for processing
Supports A-RAKE receiving and UL interface cancellation
Supports radio link synchronization and frame processing
Measures parameters required in power control and handover
Supports softer handover and carrier diversity
Communicates with the CC via the Ethernet interface
Reads all the hardware management identifiers, including the backplane type
number, slot number, board function type, board version, board function
configuration identifier, and the CPU serial number
3. BPL1A/BPL1/BPN0A/BPN0
BPL1A/BPL1/BPN0A/BPN0 are all LTE baseband processing boards, processing the
physical layer protocol and frame protocol specified by 3GPP, illustrated in the following
figure.
Figure 2-6 BPL1A/BPL1/BPN0A/BPN0 Panel
BPL1A/BPL1:
BPN0A/BPN0:

They provide the same functions but with different CPRI interfaces, cell processing
capability and data throughput. The key indices are specified in the following table.
Table 2-6 Key Indices of BPL1A/BPL1/BPN0A/BPN0
Board BPL1A BPL1 BPN0A BPN0
CPRI Interfaces 3 pairs 3 pairs 6 pairs 6 pairs
RRC_connected 3600 3600 3600 3600

Users
Cells (20MHz, 3 6 3 6
2T2R/2T4R)
Cells (20MHz, 4T4R) N/A 3 N/A 3
Data Throughput DL450Mbps/ DL600Mbps/ DL450Mbps/ DL600Mbps/

UL225Mbps UL300Mbps UL225Mbps UL300Mbps
Table 2-7 BPL1A/BPL1/BPN0A/BPN0 Panel interfaces
Board Type Interface Description
3 pairs of CPRI optical/electrical interfaces,

BPL1A/BPL1 TX0 RX0 ~ TX2 RX2
connected to RRU/RSU

BPN0A/BPN0 TX0 RX0 ~ TX5 RX5
Processes physical layer protocol

Provides uplink/downlink I/Q signal
Supports MAC, RLC and PDCP protocol
4. BPN2
BPN2 is a GSM/UMTS/LTE multi-mode baseband processing board, integrating all the

functions provided by the G/U/L single mode BP boards. It can be configured as G/U/L
single mode or multi-mode, illustrated in the following figure.
Figure 2-7 BPN2 Panel
They provide the same functions but with different processing capabilities. The key
indices are specified in the following table.
Table 2-8 Key Indices of BPN2
Board BPN2
CPRI Interfaces 6 pairs
GSM 72 TRXs
12 CSs(1024CEs)
UMTS
DL 518.4Mbps/UL 138Mbps
12 2T2R/2T4R Cells or 6 4T4R Cells

LTE 7200 RRC_connected Users
DL 1200Mbps/UL 600Mbps
12 TRXs + 12 CSs(768CEs)
GU dual-mode
GL dual-mode 36 TRXs + 6 Cells

Board BPN2
UL dual-mode 6 CSs(512CEs) + 6 Cells
12 TRXs + 6 CSs(256CEs) + 6 Cells

GUL multi-mode
24 TRXs + 3 CSs(128CEs) + 6 Cells
Table 2-9 BPN2 Panel interfaces
Board Type Interface Description

BPN2 TX0 RX0 ~ TX5 RX5
2.2.3 Fabric Switch Board (FS)
FS is fabric switch board which provides the optical interface between BBU and RRU and
processes the IQ signal. There are 5 types of FS boards, illustrated in the following
figure.
Figure 2-8 FS Panel
FS3:
FS3A:
FS5:

FS5A:
CR0:
Their key indices are specified in the following table.
Table 2-10 Key Indices of FS boards
FS Type FS3 FS3A FS5 FS5A CR0

G/U G/U G/U/L G/U/L When LTE
single single single single is included
Mode mode or mode or mode or mode or and Cloud
dual-mod dual-mod multi-mode multi-mode Radio (CR)
e e is required
Max. CSs,
working with one 6 12 12 12 12
UMTS BP board
Max. CSs,
working with
30 48 54 54 54
UMTS BP
boards per BBU

CPRI Interface 1.2288/2.45 1.2288/2.45 1.2288/2.45

1.2288/2. 1.2288/2.
Data Rate 76/3.072/6. 76/3.072/6. 76/3.072/6.
4576 4576
(Gbps) 144 144/9.8304 144/9.8304
Table 2-11 FS Panel Interfaces
TX0 RX0 to TX5 RX5 6 pairs of optical/electrical interfaces, connected to RRU/RSU
ETH (CR0 only) 10GE Ethernet interface, connected to BBU
Receives the signal from the rear board in the downlink and retrieves the data and
timing.
Multiplexes the received data and retrieves I/Q signal
Supports I/Q mapping in the downlink and multiplexes I/Q signal to the optical
signals
Receives the I/Q in uplink and de-multiplexes/maps into I/Q signal
Transmits the multiplexed I/Q signal to baseband processing board
Exchanges the CPU interface signaling through HDLC interface with RU module
2.2.4 Site Alarm Board (SA/SE)
1. Site Alarm Board (SA)
SA is a site alarm board, illustrated in the following figure.
Figure 2-9 SA Panel

Note: The product you receive is subject to the actual object.
There are two types of SA boards with different number of interfaces, as specified in the
following table.
Table 2-12 SA Panel Interfaces
Interface Name SA0 SA3
- 8 E1/T1 interfaces 4 E1/T1 interfaces
6+2 dry contacts (6 input, 2 14+2 dry contacts (14 input, 2

bidirectional) bidirectional)
1 RS485 interface 1 RS485 interface
The SA has the following functions:
Provides E1/T1 transmission interfaces
Provides site alarm monitoring interfaces
Provides FAM's alarm and rate control
Supports signal monitoring and interface lightning protection
The last E1 used for E1 transmission or BITS-2MHz/BITS-2Mbps clock input
2. Site alarm Extension Board (SE)
SE is site alarm extension board, and shares the bottom-right slot with baseband
processing board. It is used to extend the interface number if SA cannot fulfill the
requirements. The SE panel is illustrated in the following figure.
Figure 2-10 SE Panel

There are two types of SE boards with different number of interfaces, as specified in the
following table.
Table 2-13 SE Panel Interfaces
Interface Name SE0 SE2

- 8 E1/T1 interfaces 4 E1/T1 interfaces
6+2 dry contacts (6 input, 2 14+2 dry contacts (14 input, 2

bidirectional) bidirectional)
The SE board provides the following functions:
E1/T1 transmission interfaces
Site alarm monitoring interfaces
2.2.5 Universal Ethernet Switch Board (UES)
UES is used for synchronized Ethernet and the panel is illustrated in the following figure.
Figure 2-11 UES Panel
Description of UES panel interfaces is specified in the table below:
Table 2-14 UES Panel Interfaces
X1 ~ X2 The electrical interfaces for cascaded connection.
X3/UPLINK A compatible electrical interface for both cascaded connection

and uplink connection for link aggregation.

UPLINK An electrical or optical interface.
X4/UPLINK A compatible optical interface for both cascaded connection and

uplink connection for link aggregation.
UES has the following functions:
Supports L2 Ethernet switch
Supports synchronous Ethernet clock
2.2.6 Universal Clock Interface Board (UCI/UCI-C)
UCI is the RGPS clock interface board. There are two types of UCI boards: UCI and
UCI-C. UCI/UCI-C panel is illustrated in Figure 2-12.
Figure 2-12 UCI/UCI-C Panel
Description of UCI/UCI-C panel interfaces is shown in the following table:
Table 2-15 UCI/UCI-C Panel Interface
TX RX 125Mbps optical interface, connected to RGPS equipment for

signal import. TX RX is only available on UCI.
EXT HDMI interface, providing 1PPS+TOD clock signal for the CC

board in the same BBU.
REF GLONASS/GPS antenna interface, only available on UCI-C.

Reserved on UCI.
DLINK0 HDMI interface, providing 2 outputs of 1PPS+TOD signals for CC

boards in other BBUs.

DLINK1 HDMI interface, providing 2 outputs of 1PPS+TOD signals for CC

boards in other BBUs.
2.2.7 Tower mounted Amplifier control Module (TAM)
TAM is used for tower mounted amplifier control when TMA is needed. Panel of TAM is
shown as following figure.
Figure 2-13 TAM Panel
The panel interfaces are specified in the table below.
Table 2-16 TAM Panel Interfaces

TA0 DC output voltage channel 0
The TAM has the following functions:
Supports working status detection of tower amplifier and reports alarm signals to
CC board

Provides power on and off for tower amplifier with +28V, +12V or +13V power
supply
Realizes the communication with CC board
Implements conversion, protection and filtering of power supply
Provides anti-lightning for power supply circuit
Implements software remote downloading and current threshold setting
2.2.8 Power Module (PM)
PM is the power module, including PM3 and PM5. PM5 has 50% more power supply
than PM3 for full configuration of new high power consumption boards, shown in the
following figure.
Figure 2-14 PM Panel
PM3:
PM5:

Table 2-17 PM Panel Interfaces
MON Debugging interface, RS232 interface
-48V/-48VRTN -48V input
ON/OFF (PM3 only) Power switch, turning on/off 12V power to/from BBU
The PM has the following functions:
Provides 16 internal interfaces for +12 V, +13V or +28V load power;
Provides 16 internal interfaces for +3.3 V management power;
Supports EMMC management;
Supports measurement and protection of input over-voltage/under-voltage;
Supports output over-current protection and load power management.
2.2.9 Fan Array Module (FAM)
FAM is fan array module. Its panel is illustrated in the following figure.
Figure 2-15 FAM Panel

The FAM has the follows functions:
Monitors and controls system temperature;
Monitors, controls, and reports the fan state.
2.3 Software Architecture
The software architecture of the ZXSDR B8200 can be divided into three layers:
Application software layer
Platform software layer
Hardware layer
Figure 2-16 B8200 Software Structure
GSM/UMTS/LTE Application Software
LMT SCS OAM DBS BRS

NOP
OMC-B OSS
Linux
Hardware (BSP)
The application software layer provides functions as follows:
RNLC (radio network layer control) provides common and dedicated radio resource
management and control functions for control plane
RNLU (radio network layer user) provides user plane function

SCHEDULER (scheduler sub-system) provides uplink/downlink MAC scheduling
PHY (physical layer) provides PHY function
The SDR platform software provides the functions of Operation Support Sub-system
(OSS), Operating And Maintenance (OAM), Data Base Sub-system (DBS), Bearer
Sub-system (BRS) and System Control Sub-system (SCS):
OSS is the support layer in this entire framework, which is a hardware independent
platform for running software and provides basic functions like scheduling, timer,
memory management, communication, sequencing control, monitoring, alarming
and logging.
OAM provides the configuration, alarm and performance measurement function for
base station.
DBS is the database system.
BRS provides the IP communication function for inter-board and inter-network

elements.
SCS provides the power control and system management function.
Board Support Package (BSP) is the software closely connected with the board
hardware and supports Real Time Operation Support Sub-system (RT OSS) to work on
the board.
2.4 Functionality
B8200 implements the following basic functions on Abis/Um/Uu/S1/X2 and O&M

interfaces:
Channel coding and decoding
Channel multiplexing and de-multiplexing
Baseband resource pooling function
Measurement and report

Power control
Spatial multiplexing, transmit diversity and receive diversity
Synchronization
Operation and Maintenance
DTX

3 Technical Specifications
3.1 Physical Indices
Table 3-1 Physical Indices
Item Indices
Size (H*W*D) (mm) 88.4*482.6*197
Weight (kg) 8.75 (full configuration)
3.2 Capacity Indices
Table 3-2 BS8200 Capacity
Mode Capacity BBU Configuration
1CC16B+4BPN2+1UBPG3+1FS+2PM+
GSM 312 TRXs
1SA
54 CSs
1CC16B+4BPN2+1BPK_e+1FS+2PM+1
UMTS 4480 CEs UL/4480 CEs DL
SA
621 Mbps UL /1000 Mbps DL
36x20MHz cells (2T2R/2T4R)
LTE 10800 RRC_connnected users 1CCE1+3BPN2+2PM+1SA
1.8Gbps UL/3.6Gbps DL
Note: 1. CC16B board supports GE/FE interface and thus limits the total data throughput to
1000Mbps in the physical layer (900Mbps in application layer for LTE single mode). 2. The above
table describes the maximum hardware capacity. The actual capacity is up to the licenses
configured.3. GUL multi-mode capacity can be calculated according the capacity of the configured
CC boards and BP boards.

3.3 Power Indices
3.3.1 Power Supply
B8200 power supply is shown in the following Table.
Table 3-3 B8200 Power Supply
Power Options Description

DC: -48 V (-57 V -40 V DC) Supported by integrated PM modules
The power supply is already certified for the following markets.
3.3.2 Power Consumption
The power consumption depends on traffic load, configuration and environment

temperature. The following table provides power consumption of typical configuration.
Table 3-4 ZXSDR B8200 Power consumption
Items Power Consumption (W)
12 TRXs/1 UBPG 70
24 TRXs/1 UBPG3 75
6CS/3 BPK_e/BPK_e1 85
12CS/1 BPK_d 105
3 cells/1 BPL1 120
6 cells/1 BPN0 90
24 TRXs + 3 CSs(128CEs) + 6 Cells /1 BPN2 125
12 TRXs + 6 CSs(256CEs) + 6 Cells/1 BPN2 125
3.4 Interface Indices
Table 3-5 ZXSDR BS8200 Interface Indices
Interface Item Indices Type Standard

Abis/Iub ITU G.703/G.704

E1/T1 8 pairs DB44
(CC2/CC16B) ANSI T1.403
1
10M/100M/1000M 10/100/1000BASE-
electrical RJ45 T IEEE 802.3
Auto-Negotiation. compatible
Abis/Iub/S1/X2 Ethernet Auto-MDI/MDIX
(CC2/CC16B) (either or) 1000BASE-LX
IEEE 802.3
1 1000M optical
SFP (LC) compatible,
Or 1 100M optical
100BASE-FX IEEE
802.3 compatible
2
10M/100M/1000M 10/100/1000BASE-
electrical RJ45 T IEEE 802.3
Auto-MDI/MDIX
Abis/Iub/S1/X2 10GBASE-SR,10G
Ethernet BASE-SW,10GBAS
(CCE1)
E-LR,10GBASE-L
2 10G optical
W IEEE 802.3
Or 2 1000M SFP (LC)
compatible,
optical
1000BASE-LX
IEEE 802.3
compatible
1
Cascading,
10M/100M/1000M 10/100/1000BASE-
Debugging or
Ethernet electrical RJ45 T IEEE 802.3
Local
Maintenance
Auto-MDI/MDIX
6 pairs
/FS/BPN0A/BPN0
Baseband Electrical
/BPN2 SFP (LC) CPRI
/Radio /Optical
3 pairs
/BPL1A/BPL1
GPS TX/RX Port

Clock GPS 1 SMA
NMEA 0183 V3.0

Dry 32 pairs (8,16 or

Monitor DB44 N/A
contacts 24 pairs optional)
External EXT 1 RS485/RS2

N/A
32
3.5 Environment Indices
Table 3-6 B8200 Working Environment Characteristics
Item Requirement
Temperature -20 to +55C
Relative Humidity 5% to 95%
Protection classification Compliant with IP20
ETSI EN 300 386

Emission and Immunity
ETSI TS 125 113
5 ; earth resistance can be less than 10 in

Ground lightning-less area with less than 20 lightning storms a
year.
Mechanical vibration ETSI 300019-1-4 ClassM4.1
3.6 Electromagnetic Compatibility Indices
Table 3-7 ZXSDR B8200 Electromagnetic Compatibility Characteristics
Item Requirement
Anti-static protection Capable of protecting against a contact discharge of
6000V, Air discharge of 8000V.
Surge anti-interference 2000V between lines and ground.
3.7 Reliability Indices
The reliability of the ZXSDR B8200 system conforms to the national military GJB/Z299B
Electronic Equipment Reliability Estimation Manual and the IEC TR62390 standard.

The Reliability characteristics vary at different configurations. The reliability indices are
calculated based on typical configuration supporting GUL multi-mode, listed in table 3-8.
Table 3-8 B8200 Reliability Characteristics
Item Value
MTBF 240,000 hours
MTTR 0.5 hour
Availability index 99.999792%
Down duration 1.095 min/year

4 Configurations Principles
B8200 is the baseband unit of macro base station, which is composed of the following
boards: CC, BP, FS, SA/SE, UES, TAM, PM, FAM, etc. Configuration principles of these
boards are described in the following table:
Table 4-1 B8200 Configuration
Board Configuration Principles

Refer to table 2-2 for the key indices of CC boards. At least 1 board
is configured by default.
CC
Maximally 2 boards can be configured for GU and LTE respectively
or 1+1 backup.
UBPG 12 GSM TRXs/board. Maximally 5 boards can be configured.
UBPG3 24 GSM TRXs/board. Maximally 5 boards can be configured.
Refer to table 2-5 for the key indices. Maximally 5 boards can be
BPK_e1
configured.
BPK_e
configured.
BPK_d
configured.
BPL1A
BP configured.
BPL1
configured.
BPN0A
configured.
BPN0
configured.
BPN2
configured.
Refer to table 2-10 for the key indices of FS boards. At least 1

FS board is configured by default for G/U mode. FS is optional in LTE
single mode configuration. Maximally 2 boards can be configured.

Refer to table 2-12 for the interfaces of the 2 types of SA boards.

SA
It is configured by default.
Refer to table 2-13 for the interfaces of the 2 types of SE boards. It

SE is configured only when the requirements of dry contacts or E1/T1
exceed SA capacity.
4 electrical and 2 optical Ethernet interfaces per board.

UES
It is configured when L2 Ethernet switch is required.
1 optical interface and 3 HDMI interfaces per board.

UCI is configured for connecting to the remote device when remote
UCI transportation of GPS signal is required and the optical RGPS
solution is adopted.
UCI-C is configured in the GLONASS system.
6 DC outputs with customized voltage per board.

TAM
It is configured for tower amplifier control when TMA is needed.
At least 1 board is configured by default.

PM
Maximally 2 boards can be configured for 1+1 backup.
FAM It is configured by default.
Note: The above table describes the maximum hardware capacity. The actual capacity is up to the
licenses configured.

5 Glossary
Abbreviations Full Characteristics
rd
3GPP 3 Generation Partnership Project
BP Baseband Processing
BBU Base Band processing Unit
BITS Building Integrated Timing Supply

BPL Baseband Processing Board for LTE
BPL1 Baseband Processing Board for LTE type1
BSP Board Support Package
CAPEX Capital Expenditure
CC Control & Clock module
CPRI Common Public Radio Interface
DBS Data Base Sub-system
DL Downlink
DTX Discontinuous transmission
EUTRAN Evolved Universal Mobile Telecommunications System
FAM Fan Module
FE Fast Ethernet
FS Fabric Switch board
GE Gigabit Ethernet
GPS Global Positioning System
GSM Global System for Mobile communications
HSPA+ HSPA Evolution
LMT Local Maintenance Terminal
LTE Long Term Evolution
MDLSD MAC Downlink Schedule
MicroTCA Micro Telecommunications Computing Architecture
MIMO Multi Input Multi Output
MTBF Mean Time Between Failures
MTTR Mean Time To Recovery
MULSD MAC Uplink Schedule
OAM Operating Administration and Maintenance

Abbreviations Full Characteristics

OFDMA Orthogonal Frequency Division Multiple Access
OPEX Operation Expenditure
OSS Operation Support Sub-system
PHY Physical Layer
PM Power Module
RNLC Radio Network Layer Control Plane
RNLU Radio Network Layer User Plane
RRU Remote Radio Unit
SA Site Alarm Board
SC-FDMA Single Carrier Frequency Division Multiple Access

SDR Software Defined Radio
SE Site Alarm Extension board
UE User Equipment
UL Uplink
UTRAN UMTS Terrestrial Radio Access Network
WCDMA Wideband Code Division Multiple Access
WiMAX Worldwide Interoperability for Microwave Access

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ZXSDR B8200 Product Description

UniRAN 14/GUL Multi-Mode

ZXSDR B8200 Product Description

First release. It supports 3GPP R11, BPN2

2016 ZTE Corporation. All rights reserved.

ZTE Confidential & Proprietary 1

2 Product Architecture ......................................................................................... 8

3 Technical Specifications ................................................................................. 30

4 Configurations Principles ............................................................................... 35

2 ZTE Confidential & Proprietary

Figure 1-1 B8200 in the GSM/UMTS/LTE Network ............................................................. 5

Table 2-1 Board List of ZXSDR B8200................................................................................ 8

Table 2-5 Key Indices of BPK_e1/BPK_e /BPK_d ..............................................................14

ZTE Confidential & Proprietary 3

Table 2-6 Key Indices of BPL1A/BPL1/BPN0A/BPN0 ........................................................16

4 ZTE Confidential & Proprietary

Figure 1-1 B8200 in the GSM/UMTS/LTE Network

This document is structured as follows. Chapter 1 provides an overview of the

Multi-mode Baseband Unit

ZTE Confidential & Proprietary 5

B8200 supports all kinds of wireless access technologies simultaneously, including

To adapt to the rapid expansion of network development and the prosperity of

Plug-in Design for Shelf, Zero Footprint, Convenient Deployment

B8200 provides GE/FE interfaces and IP networking. It supports RRU in different

1.3 Application Scenarios

Typical application scenarios of B8200 are shown in the following figure.

6 ZTE Confidential & Proprietary

Figure 1-2 B8200 Application Scenario

ZTE Confidential & Proprietary 7

2.1 Physical Structure

The following figure shows the hardware appearance of B8200.

Figure 2-1 Baseband Unit -- ZXSDR B8200

Table 2-1 Board List of ZXSDR B8200

Board Name Function Description

FS3/FS3A/FS5/CR0 Fabric Switch Board

UBPG/UBPG3 Universal Baseband Processing board for GSM

BPK_e1/BPK_e/BPK_d Base band Processing board for UMTS

BPL1A/BPL1/BPN0A/BPN0 Base band Processing board for LTE

BPN2 Baseband Processing board for GUL multi-mode

SA Site Alarm Board

SE Site alarm Extension Board

UES Universal Ethernet Switch Board

8 ZTE Confidential & Proprietary

UCI Universal Clock Interface

TAM Tower mounted Amplifier control Module

FAM Fan Array Module

2.2 Hardware Structure

B8200 hardware architecture is shown in Figure 2-2.

Figure 2-2 B8200 Hardware Structure

B8200 can be configured in GSM/UMTS/LTE single mode or multi-mode.

2.2.1 Control & Clock Board (CC)

Figure 2-3 CC Panel

ZTE Confidential & Proprietary 9

figures. The product you receive is subject to the actual object.

Their key indices are specified in the following table.

Table 2-2 Key Indices of CC Boards

CC Type CC2 CC16B CCE1

UMTS CNBAP 400/s 1500/s 3000/s

LTE N/A 10800 10800

The panel interfaces are specified in the following table.

10 ZTE Confidential & Proprietary

Table 2-3 CC2/CC16B Panel Interfaces

Interface Name Description