Encapsulats M0 / MS

Cada tipus dencapsulat te un rang de n de patilles

Encapsulats In- line: tp 8 - 20 patilles ( 56 mx )----------- thd
Encapsulats Small Outline: tp 24 36 patilles ( pins )----- smd
Encapsulats Quad: tp 64 200 patilles ------------------------ smd
Encapsulats Array: > 200 patilles -------------------------------- smd

El pas ( pitch ) varia des de 0.1 ( DIP ) fins 0.010 en encapsulats dalta
densitat de pins

En el disseny de PCBs normalment es treballa en mil ( mil.lsimes de

pulsada ).
0.05 = 50mil = 1.27 mm
0.1 = 100 mil= 2.54 mm
0.2 = 200 mil= 5.08 mm

Encapsulats - DIP
TH STANDARD
DUAL-IN-LINE PACKAGE DIP
IPC-7251 Naming Convention for DIP
DIP + Lead Span + W + Lead Width + P + Pitch + L + Body Length + H + Height + Q + Pin Qty
Example:
DIP762W46P254L927H533Q8P_JEDEC_MS-001BA
DIP Through Hole Plastic Dual In Line Package Family
762 Lead Span Nominal = 7.62mm (0.300inch)
W46 Lead Width = 0.46mm
P254 Pitch = 2.54m (0.1inch)
L927 Body Length = 9.27mm
H533 Height = 5.33mm
Q8 Pin Qty = 8
JEDEC_MS-001BA Standard Package Name (added by pcb-3d.com)