Documentos de Académico
Documentos de Profesional
Documentos de Cultura
compliant
ST Series:
t#JMBUFSBMUSJHHFSJOHEFWJDF
t(MBTTQBTTJWBUFE
junctions
Schematic Symbol
t&QPYZ4.QBDLBHF
(DO-214)
t)JHIUFNQFSBUVSF
TPMEFS
bonded die attachment
t8JEFWPMUBHFSBOHF
selections
HTM/HT Series:
t-POHUFSNSFMJBCJMJUZ
t.*/*.&-'%0USJHHFS
package
t1BSBNFUFSTUBCJMJUZ
t3FMJBCMFCBSSJFSBHBJOTU
junction contamination
Applications
DIACs are used to trigger Triacs and SCRs in phase control
circuits for lamp dimming, universal motor speed control,
and heat control. They are used also for triggering
transistors in solid state ballast lighting controls.
ITRM
Parameter
Test Conditions
120PPS, TA 40C
pulse width = 10 S
Min
Max
2
1.5(*)
Unit
A
TS
-40
+125
TJ
-40
+125
See Product
Selector Table
mW
PD(AV)
TA = -40C to +40C
337
Revised: July 9, 2008
DIACs
Symbol
Description
Test Conditions
Min
Max
Unit
Breakover/Trigger Voltage
See Product
Selector Table
See Product
Selector Table
+VBO to -VBO
2(Note 1)
Breakback Voltage(Note 4)
VBB (DYN)
VBO to V10mA
VBO to V
15
10
(*)
6mA
120 PPS
Breakover Current
IBO
15
Product Selector
Package Availability
Part Number
VBO
MINIMELF
DO-35
DO-214
MIN
MAX
XX-32
HT-32
ST-32
27V
37V
XX-32A/ 5761
HT-32A
28V
36V
HTM-32B
HT-32B
ST-32B
30V
34V
XX-34B
HT-34B
ST-34B
32V
36V
XX-35
HT-35
ST-35
30V
40V
XX-36A/ 5762
HT-36A
ST-36A
32V
40V
XX-36B
HT-36B
ST-36B
34V
38V
XX-40
HT-40
ST-40
35V
45V
XX-60
HT-60
56V
70V
XX-32B/ 5761A
Thermal Resistances
Symbol
RR(J-L)
RR(J-A)
Description
Junction to Lead
Junction to Ambient
Test Conditions
Value
Unit
DO-35
100
C/W
DO-214
65*
C/W
MINIMELF
75
C/W
Free-Air
DO-35
278
C/W
338
Revised: July 9, 2008
Resistive Load
3.3 k
Triac
MT2
200 k
120 V ac
60 Hz
MT1
Diac
0.1 F
100 V
10
5.0
3.0
2.0
HT-32x, -34x, -35, -36x, -40
HT-5761, -5761A, -5762
ST-32x, -34x, -35, -36x, -40
HTM-32B
1.0
0.5
0.3
0.2
0.1
HT-60
0.05
Safe Operating
Area
0.03
0.02
.01
.005
.003
.002
.001
1
6 10
20
40 60 100
200
400
1000
2000
4000
10000
DIACs
6%
4%
VBO Change -- %
2%
0%
-2%
-4%
-6%
-8%
-40
-20
20
40
60
80
100
120
140
339
Revised: July 9, 2008
100 k
*
D.U.T.
RL
VC
CT
0.1 F
IL
120 V rms
60 Hz
20
1%
250
200
150
V
35
e)
vic
De
l(
ica
Typ
100
50
.01
.02
.03
.04
.05
.06
.07
.08
.09
.10
Soldering Parameters
Pre Heat
150C
200C
60 190 secs
Pb Free assembly
5C/second max
5C/second max
217C
60 150 seconds
260 C
20 40 seconds
Ramp-down Rate
5C/second max
8 minutes Max.
Do not exceed
280C
tP
TP
Temperature
Reow Condition
Ramp-up
TL
tL
TS(max)
Ramp-do
Ramp-down
Preheat
TS(min)
tS
25
time to peak temperature
340
Revised: July 9, 2008
Time
Physical Specications
Reliability/Environmental Tests
Terminal Finish
Body Material
Test
High Temperature
Voltage Blocking
Temperature Cycling
Lead Material
Temperature/
Humidity
Design Considerations
Low-Temp Storage
Thermal Shock
MIL-STD-750, M-1056
10 cycles; 0C to 100C; 5-min dwell
time at each temperature; 10 sec (max)
transfer time between temperature
Autoclave
Resistance to
Solder Heat
Solderability
Lead Bend
Burn-in
Dimensions
B
.002 E-F
Inches
Millimeters
Min
Typ
Max
Min
Typ
Max
0.125
0.134
0.142
3.18
3.40
3.61
0.066
0.068
0.070
1.68
1.73
1.78
0.012
0.018
0.020
0.30
0.46
0.51
0.063
1.60
Dimension
A
(Note 1)
(Note 2)
(Note 1)
Inches
Millimeters
Min
Max
Min
Max
0.060
0.090
1.530
2.280
0.015
0.381
D (TYP.)
0.165
3.430
4.190
0.018
0.022
0.458
0.558
1.000
25.400
Notes:
1. Package contour optional within dimensions A and C. Slugs, if any, shall be included
within this cylinger but shall not be subject to
the minimum limit of Dimention A.
2. Lead diameter is not controlled in this zone to allow for ash, lead nish build-up and
minor irregularities other than slugs.
B
E
TYP.
0.135
341
Revised: July 9, 2008
DIACs
F
L
A
E
Inches
Dimension
TC / T LTEMPERATURE
MEASUREMENT POINT
2.80
(.110)
2.00
(.079)
2.00
(.079)
Millimeters
Min
Max
Min
0.140
0.155
3.56
Max
3.94
0.205
0.220
5.21
5.59
0.077
0.083
1.96
2.11
0.166
0.180
4.22
4.57
0.036
0.063
0.91
1.60
0.066
0.083
1.67
2.11
0.004
0.008
0.10
0.20
0.077
0.086
1.96
2.18
0.043
0.053
1.09
1.35
0.008
0.012
0.20
0.30
0.039
0.049
0.99
1.24
Packing Options
Part
Number
Quantity
Marking
Package
Weight/
Unit
Packing
Mode
Base
Quantity
Reel
Box
HTM-xxxRP
MINIMELF
0.040g
5000
2500
HT-xxxRP
DO35
0.150g
5000
5000
HT-xxx
DO35
0.150g
Bulk
5000
5000
STxxx
DO214
0.075g
2500
2500
ST-xxxRP
342
Revised: July 9, 2008
0.472
(12.0)
0.36
(9.2)
0.315
(8.0)
0.059 DIA
(1.5)
Cover tape
12.99
(330.0)
Dimensions
are in inches
(and millimeters).
0.49
(12.4)
Direction of Feed
DO-35
2.063
(52.4)
DIACs
10.0 - 14.0
(254.0 - 356.0)
0.956
(24.3)
Direction of Feed
0.252
(6.4)
Dimensions
are in inches
(and millimeters).
0.197
(5.0)
343
Revised: July 9, 2008
4mm
8mm
5.8mm
4mm
177.8mm
13mm Abor
Hole Diameter
9.4mm
DIRECTION OF FEED
x T M xxxx xx
Package Type:
H = DO-35 (with leads) or
MINIMELF (no leads)
S = DO-214
Device Type:
T = DIAC
Package Type Designator:
M: MINIMELF
(surface mount version without leads)
Packaging:
Blank = Bulk Pack
RP = Reel Pack
DO-214:
Voltage Range:
32= 27V to 37V
32A/5761= 28V to 36V
32B/5761A= 30V to 34V
34B= 32V to 36V
35= 30V to 40V
36A/5762= 32V to 40V
36B= 34V to 38V
40= 35V to 45V
60= 56V to 70V
344
Revised: July 9, 2008