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BSC Product Description

68P02909W01-A

MMM YYYY

PRELIMINARY - UNDER DEVELOPMENT


2008 Motorola, Inc.

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PRELIMINARY - UNDER DEVELOPMENT

MMM YYYY

Table
of
Contents

Contents

BSC Product Description


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2
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Position of the BSC in the GSM/GPRS Network . . . . . . . . . . . . . . . . . . . . . . . . .


Position of the BSC in the GSM/GPRS Network . . . . . . . . . . . . . . . . . . . . . . .
Functions of each NE in the GSM/GPRS Network . . . . . . . . . . . . . . . . . . . . . .

1-2
1-2
1-3

Preface. . . . . . . . .
Purpose . . . . . .
Product Version . .
Intended Audience .
Change History . .
Organization . . . .

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Chapter 1: Position of the BSC in the GSM/GPRS Network

Chapter 2: Introduction to the BSC


BSC Physical Structure . . . . . . .
Physical Structure of the BSC . .
Components of the BSC Cabinet .
BSC Software Structure . . . . . . .
Host Software . . . . . . . . . .
OMU Software . . . . . . . . . .
LMT Software . . . . . . . . . .
BSC Logical Structure . . . . . . . .

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2-2
2-2
2-3
2-6
2-6
2-7
2-7
2-9

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3-2
3-2
3-2
3-4
3-5
3-5
3-9
3-12

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4-2
4-2
4-3
4-4
4-4

Chapter 3: BSC Hardware Conguration


BSC Hardware Conguration . . . . . . .
BSC Subracks . . . . . . . . . . . . .
Installation Modes of the GTCS . . . .
Conguration Modes of BSC Subracks .
BSC Hardware Conguration . . . . . . .
BM/TC Separated . . . . . . . . . . .
BM/TC Combined . . . . . . . . . . .
A over IP . . . . . . . . . . . . . . . .

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Chapter 4: BSC TDM Switching Subsystem


Physical Structure of the BSC TDM Switching Subsystem
Inter-Subrack TDM Interconnections . . . . . . . .
Intra-Subrack TDM Interconnections . . . . . . . .
Logical Structure of the BSC TDM Switching Subsystem
TDM Switching Unit . . . . . . . . . . . . . . . . .

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68P02909W01-A
MMM YYYY

PRELIMINARY - UNDER DEVELOPMENT

Contents

TDM Access Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


TDM Processing Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4-5
4-5

Chapter 5: BSC GE Switching Subsystem


Physical Structure of the BSC GE Switching Subsystem
Inter-Subrack GE Interconnections . . . . . . . .
Intra-subrack GE interconnection . . . . . . . . .
Logical Structure of the BSC GE Switching Subsystem
Central Processing Unit . . . . . . . . . . . . . .
Network Unit . . . . . . . . . . . . . . . . . . .
Interface Unit . . . . . . . . . . . . . . . . . . .
Features of BSC GE Switching . . . . . . . . . . . . .

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5-2
5-2
5-3
5-4
5-4
5-4
5-5
5-6

Chapter 6: BSC Service Processing Subsystem


Physical Structure of the BSC Service Processing Subsystem
Logical Structure of the BSC Service Processing Subsystem.
CS Service Processing Subsystem . . . . . . . . . . . .
PS Service Processing Subsystem . . . . . . . . . . . .

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6-2
6-5
6-5
6-6

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7-2
7-3
7-3
7-3
7-3
7-4
7-4
7-4
7-4
7-5
7-5
7-5

Chapter 7: BSC Service Control Subsystem


Physical Structure of the BSC Service Control Subsystem
Logical Structure of the BSC Service Control Subsystem
Paging Control . . . . . . . . . . . . . . . . . . . .
System Information Management . . . . . . . . . .
Channel Assignment . . . . . . . . . . . . . . . . .
BTS Public Service Management. . . . . . . . . . .
Call Control . . . . . . . . . . . . . . . . . . . . .
PS Service Control . . . . . . . . . . . . . . . . . .
Handover and Power Control . . . . . . . . . . . .
Cell Broadcast Short Message Service . . . . . . . .
BTS Operation and Maintenance. . . . . . . . . . .
TC Resource Pool Management . . . . . . . . . . .

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Chapter 8: BSC Interface Processing Subsystem


Physical Structure of the BSC Interface Processing Subsystem
Logical Structure of the BSC Interface Processing Subsystem .
Abis Interface Processing Unit . . . . . . . . . . . . . . .
A Interface Processing Unit . . . . . . . . . . . . . . . .
Ater Interface Processing Unit . . . . . . . . . . . . . . .
Gb Interface Processing Unit . . . . . . . . . . . . . . .
Cb Interface Processing Unit . . . . . . . . . . . . . . .

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8-2
8-4
8-5
8-5
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8-6
8-6

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9-2
9-2
9-2
9-3
9-3
9-5
9-7

Chapter 9: BSC Clock Subsystem


BSC Clock Sources. . . . . . . . . . . . . . . . .
BITS Clock . . . . . . . . . . . . . . . . . . .
Line Clock . . . . . . . . . . . . . . . . . . .
BSC Clock Synchronization . . . . . . . . . . . .
BSC Clock Synchronization (BM/TC Separated)
BSC Clock Synchronization (BM/TC Combined)
BSC Clock Synchronization (A over IP) . . . .

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ii

68P02909W01-A

PRELIMINARY - UNDER DEVELOPMENT

MMM YYYY

BSC Product Description

Contents

Chapter 10: BSC Power Subsystem


Power Lead-In Part. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

10-2
10-4

Chapter 11: BSC Environment Monitoring Subsystem


BSC Power Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BSC Fan Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BSC Environment Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11-2
11-3
11-4

Chapter 12: OM of the BSC


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12-2
12-3
12-3
12-6
12-6
12-8
12-9
12-10
12-11
12-12
12-14
12-17

BSC CS Signal Flow . . . . . . . . . . . . .


Abis over TDM + A over TDM . . . . . .
Abis over TDM + A over IP. . . . . . . .
BSC PS Signal Flow . . . . . . . . . . . . .
BSC Signaling Flow . . . . . . . . . . . . .
Signaling Flow on the Abis Interface. . .
Signaling Flow on the A Interface . . . .
Signaling Flow on the Gb Interface . . .
BSC OM Signal Flow . . . . . . . . . . . . .
BSC OM Signal Flow (BM/TC Separated)
BSC OM Signal Flow (BM/TC Combined)
BSC OM Signal Flow (A over IP) . . . . .

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13-2
13-2
13-3
13-5
13-6
13-6
13-7
13-10
13-13
13-13
13-16
13-16

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14-2
14-2
14-2
14-4
14-4
14-4
14-6
14-7
14-9
14-9
14-9
14-10

OM Modes of the BSC . . . . . . . .


OM Functions of the BSC . . . . . .
BSC Security Management . . .
BSC Conguration Management .
BSC Data Conguration Modes .
BSC Conguration Data Types . .
BSC Data Check . . . . . . . . .
BSC Data Synchronization . . . .
BSC Performance Management .
BSC Alarm Management . . . . .
BSC Loading Management . . . .
BSC Upgrade Management . . .

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Chapter 13: BSC Signal Flow

Chapter 14: BSC Transmission and Networking


Transmission and Networking on the Abis Interface .
Transmission Modes on the Abis Interface . . . .
Abis over TDM . . . . . . . . . . . . . . . . . .
Transmission and Networking on the A Interface . .
Transmission Modes on the A Interface . . . . .
A over TDM . . . . . . . . . . . . . . . . . . .
A over IP . . . . . . . . . . . . . . . . . . . . .
Transmission and Networking on the Ater Interface .
Transmission and Networking on the Gb Interface. .
Transmission Modes on the Gb Interface . . . .
Gb over FR. . . . . . . . . . . . . . . . . . . .
Gb over IP . . . . . . . . . . . . . . . . . . . .

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68P02909W01-A
MMM YYYY

iii

PRELIMINARY - UNDER DEVELOPMENT

Contents

Chapter 15: BSC Technical Specications


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15-2
15-2
15-3
15-3
15-3
15-4
15-5
15-5
15-6
15-7
15-7
15-8
15-8
15-9
15-9
15-10
15-10
15-12
15-15
15-18
15-18
15-19
15-20
15-20

Appendix: Changes in BSC Product Description . . . . . . . . . . . . . . . . . . . . . . . . .


01(2008-05-19) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

A-1
A-1

BSC Capacity Specications . . . . . . . . . . . . . . . . . . . . . . .


. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BSC Engineering Specications . . . . . . . . . . . . . . . . . . . . .
Structural Specications . . . . . . . . . . . . . . . . . . . . . . .
Power Consumption Specications. . . . . . . . . . . . . . . . . .
Electrical Specications . . . . . . . . . . . . . . . . . . . . . . .
BSC Physical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . .
Transmission Interfaces of the BSC . . . . . . . . . . . . . . . . .
Clock Interfaces of the BSC . . . . . . . . . . . . . . . . . . . . .
BSC Reliability Specications . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BSC Clock Precision Requirements . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BSC Noise and Safety Compliance . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BSC Environment Requirements . . . . . . . . . . . . . . . . . . . . .
BSC Storage Requirements . . . . . . . . . . . . . . . . . . . . .
BSC Transportation Requirements . . . . . . . . . . . . . . . . . .
BSC Operating Environment Requirements . . . . . . . . . . . . .
Technical Specications of BSC Parts . . . . . . . . . . . . . . . . . .
Technical Specications of the GOMU . . . . . . . . . . . . . . . .
Technical Specications of the BSC Common Power Distribution Box
Technical Specications of the BSC High-Power Distribution Box . .
Technical Specications of the Fan Box . . . . . . . . . . . . . . .

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Appendix A:

iv

68P02909W01-A

PRELIMINARY - UNDER DEVELOPMENT

MMM YYYY

List
of
Figures

List of Figures

Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure

1-1: Position of the BSC in the GSM/GPRS network . . . . . . . . . . . . . . .


2-1: Physical structure of the BSC . . . . . . . . . . . . . . . . . . . . . . . .
2-2: Front view of the BSC cabinet . . . . . . . . . . . . . . . . . . . . . . . .
2-3: Structure of the host software . . . . . . . . . . . . . . . . . . . . . . . .
2-4: Structure of the OMU software . . . . . . . . . . . . . . . . . . . . . . .
2-5: LMT software structure . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-6: Logical structure of the BSC . . . . . . . . . . . . . . . . . . . . . . . . .
3-1: OM path between the GMPS and the main GTCS (in local GTCS mode) . . .
3-2: OM path between the GMPS and the main GTCS (in remote GTCS mode) . .
3-3: BSC minimum conguration (GTCS congured on the BSC side) . . . . . .
3-4: BSC minimum conguration (GTCS congured on the MSC side) . . . . . .
3-5: BSC maximum conguration (GTCS congured on the BSC side) . . . . . .
3-6: BSC maximum conguration (GTCS congured on the MSC side) . . . . . .
3-7: BSC maximum conguration (GTCS congured on the BSC side) . . . . . .
3-8: BSC maximum conguration (GTCS congured on the MSC side) . . . . . .
3-9: BSC minimum conguration . . . . . . . . . . . . . . . . . . . . . . . . .
3-10: BSC maximum conguration (E1 transmission used on the A interface) . .
3-11: BSC maximum conguration (STM-1 transmission used on the A interface)
3-12: BSC minimum conguration . . . . . . . . . . . . . . . . . . . . . . . .
3-13: BSC maximum conguration . . . . . . . . . . . . . . . . . . . . . . . .
4-1: TDM interconnections between GMPS and GEPS . . . . . . . . . . . . . .
4-2: TDM interconnections between GTCSs . . . . . . . . . . . . . . . . . . .
4-3: Intra-subrack TDM interconnections . . . . . . . . . . . . . . . . . . . .
4-4: Logical structure of the BSC TDM switching subsystem . . . . . . . . . . .
5-1: GE interconnection between the GMPS and the GEPS. . . . . . . . . . . .
5-2: GE interconnection between the GTCSs . . . . . . . . . . . . . . . . . . .
5-3: Intra-subrack GE interconnection . . . . . . . . . . . . . . . . . . . . . .
5-4: Logical structure of the BSC GE switching subsystem . . . . . . . . . . . .
6-1: Physical structure of the BSC service processing subsystem (1) . . . . . . .
6-2: Physical structure of the BSC service processing subsystem (2) . . . . . . .
6-3: Logical structure of the CS service processing subsystem . . . . . . . . . .
6-4: Logical structure of the PS service processing subsystem . . . . . . . . . .
8-1: Physical structure of the BSC interface processing subsystem. . . . . . . .
8-2: BSC interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9-1: Clock synchronization in the GMPS/GEPS (BITS clock) . . . . . . . . . . .
9-2: Clock synchronization in the GMPS/GEPS (line clock) . . . . . . . . . . . .
9-3: Clock synchronization in the GTCS . . . . . . . . . . . . . . . . . . . . .
9-4: BSC clock synchronization procedure (BITS clock source). . . . . . . . . .
9-5: BSC clock synchronization procedure (line clock source) . . . . . . . . . .
9-6: BSC clock synchronization procedure (BITS clock source). . . . . . . . . .
10-1: Power lead-in part (common power distribution box) . . . . . . . . . . . .
10-2: Power lead-in part (high-power distribution box) . . . . . . . . . . . . . .
11-1: Principle of power monitoring . . . . . . . . . . . . . . . . . . . . . . .
11-2: Fan monitoring principle . . . . . . . . . . . . . . . . . . . . . . . . . .
11-3: Environment monitoring mechanism . . . . . . . . . . . . . . . . . . . .

68P02909W01-A
MMM YYYY

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1-2
2-2
2-4
2-6
2-7
2-7
2-9
3-3
3-3
3-6
3-6
3-7
3-7
3-8
3-8
3-10
3-11
3-11
3-13
3-13
4-2
4-3
4-3
4-4
5-2
5-3
5-3
5-4
6-3
6-4
6-5
6-6
8-2
8-4
9-3
9-4
9-5
9-6
9-7
9-8
10-2
10-3
11-2
11-3
11-4
v

PRELIMINARY - UNDER DEVELOPMENT

List of Figures

Figure 12-1: Network topology of the BSC OM . . . . . . . . . . . . . . . . . . . . . . . .


Figure 12-2: Principle of the ofine data conguration . . . . . . . . . . . . . . . . . . . .
Figure 12-3: Principle of the online data conguration . . . . . . . . . . . . . . . . . . . .
Figure 12-4: Procedure of the BSC data consistency check . . . . . . . . . . . . . . . . . .
Figure 12-5: BSC data synchronization procedure . . . . . . . . . . . . . . . . . . . . . .
Figure 12-6: BSC performance management process . . . . . . . . . . . . . . . . . . . . .
Figure 12-7: Alarm management process of the BSC . . . . . . . . . . . . . . . . . . . . .
Figure 12-8: Working principle of the alarm box . . . . . . . . . . . . . . . . . . . . . . .
Figure 12-9: BSC loading process (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 12-10: BSC loading process (2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 12-11: BSC loading process (3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 13-1: CS signal ow (1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 13-2: CS signal ow (2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 13-3: CS signal ow (5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 13-4: PS signal ow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 13-5: Protocol stack on the Abis interface (Abis over TDM) . . . . . . . . . . . . . .
Figure 13-6: Signaling Flow on the Abis Interface (Abis over TDM) . . . . . . . . . . . . . .
Figure 13-7: Protocol stack on the A interface (A over TDM) . . . . . . . . . . . . . . . . .
Figure 13-8: Signaling ow on the A interface (A over TDM) (BM/TC separated) . . . . . . .
Figure 13-9: Signaling ow on the A interface (A over TDM) (BM/TC combined) . . . . . . .
Figure 13-10: Protocol stack on the A interface (A over IP) . . . . . . . . . . . . . . . . . .
Figure 13-11: Signaling ow on the A interface (A over IP) . . . . . . . . . . . . . . . . . .
Figure 13-12: Protocol stack on the Gb interface . . . . . . . . . . . . . . . . . . . . . . .
Figure 13-13: Signaling ow on the Gb interface . . . . . . . . . . . . . . . . . . . . . . .
Figure 13-14: OM signal ow (GTCS congured on the BSC side) . . . . . . . . . . . . . . .
Figure 13-15: OM signal ow (GTCS congured on the MSC side) . . . . . . . . . . . . . .
Figure 13-16: BSC OM signal ow (BM/TC combined) . . . . . . . . . . . . . . . . . . . . .
Figure 13-17: BSC OM signal ow (A over IP) . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 14-1: E1-based TDM networking on the Abis interface . . . . . . . . . . . . . . . . .
Figure 14-2: STM-1-based TDM networking on the Abis interface . . . . . . . . . . . . . . .
Figure 14-3: E1-based TDM networking on the A interface (1). . . . . . . . . . . . . . . . .
Figure 14-4: E1-based TDM networking on the A interface (2). . . . . . . . . . . . . . . . .
Figure 14-5: STM-1-based TDM networking on the A interface (1). . . . . . . . . . . . . . .
Figure 14-6: STM-1-based TDM networking on the A interface (2). . . . . . . . . . . . . . .
Figure 14-7: IP networking on the A interface . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 14-8: E1-based networking on the Ater interface (GTCS congured on the BSC side) .
Figure 14-9: E1-based networking on the Ater interface (GTCS congured on the MSC side) .
Figure 14-10: STM-1-based networking on the Ater interface (GTCS congured on the MSC
side) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 14-11: E1-based FR networking on the Gb interface . . . . . . . . . . . . . . . . . .
Figure 14-12: FE/GE-based IP networking on the Gb interface . . . . . . . . . . . . . . . .

vi

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12-2
12-7
12-8
12-10
12-11
12-11
12-13
12-14
12-15
12-16
12-16
13-2
13-3
13-3
13-5
13-6
13-7
13-8
13-8
13-9
13-9
13-10
13-11
13-11
13-13
13-15
13-16
13-17
14-2
14-3
14-5
14-5
14-5
14-5
14-6
14-7
14-7

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14-8
14-9
14-10

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List
of
Tables

List of Tables

Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table

1: Product Version . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1: Functions of each NE in the GSM/GPRS network . . . . . . . . .
2-1: Components of the BSC . . . . . . . . . . . . . . . . . . . . . .
2-2: Components in the BSC Cabinet . . . . . . . . . . . . . . . . .
3-1: Recommended conguration of the BSC . . . . . . . . . . . . .
3-2: Recommended conguration of the BSC . . . . . . . . . . . . .
3-3: Recommended conguration of the BSC . . . . . . . . . . . . .
8-1: Physical entities of the BSC interface processing subsystem . . .
12-1: Denitions of the BSC user authorities . . . . . . . . . . . . .
12-2: BSC logs . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15-1: Capacity specication of the BSC . . . . . . . . . . . . . . . .
15-2: Structural specications . . . . . . . . . . . . . . . . . . . . .
15-3: Power consumption specications . . . . . . . . . . . . . . . .
15-4: Power supply and EMC specications of the BSC . . . . . . . .
15-5: Specications of the external transmission interfaces of the BSC
15-6: Specications of the internal transmission interfaces of the BSC
15-7: Specications of the clock interfaces of the BSC . . . . . . . .
15-8: Reliability specications of the BSC . . . . . . . . . . . . . . .
15-9: Clock specications of the BSC . . . . . . . . . . . . . . . . .
15-10: Specications of the noise and safety compliance of the BSC .
15-11: Climatic requirements (storage) . . . . . . . . . . . . . . . .
15-12: Requirements for physically active materials (storage) . . . . .
15-13: Requirements for chemically active materials (storage) . . . .
15-14: Mechanical stress requirements (storage) . . . . . . . . . . .
15-15: Climatic requirements (transportation). . . . . . . . . . . . .
15-16: Requirements for physically active materials (transportation) .
15-17: Requirements for chemically active materials (transportation) .
15-18: Mechanical stress requirements (transportation). . . . . . . .
15-19: Temperature and humidity requirements . . . . . . . . . . . .
15-20: Other requirements . . . . . . . . . . . . . . . . . . . . . .
15-21: Requirements for physically active materials (operating). . . .
15-22: Requirements for chemically active materials (operating) . . .
15-23: Mechanical Stress Requirements . . . . . . . . . . . . . . . .
15-24: Hardware conguration specications of the GOMU . . . . . .
15-25: Performance specications of the GOMU. . . . . . . . . . . .
15-26: Technical specications of the BSC power distribution box. . .
15-27: Technical specications of the BSC high-power distribution box
15-28: Technical specications of the fan box . . . . . . . . . . . . .

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68P02909W01-A
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2
1-3
2-2
2-5
3-9
3-12
3-14
8-2
12-4
12-5
15-2
15-3
15-3
15-4
15-5
15-6
15-6
15-7
15-8
15-9
15-10
15-11
15-12
15-12
15-13
15-14
15-14
15-14
15-15
15-16
15-16
15-16
15-17
15-18
15-18
15-19
15-20
15-21

vii

PRELIMINARY - UNDER DEVELOPMENT

List of Tables

viii

68P02909W01-A

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About
This
Manual

BSC Product Description

What is covered in this manual?

Background information

Related information

68P02909W01-A
MMM YYYY

PRELIMINARY - UNDER DEVELOPMENT

Preface

Preface

Purpose
This document describes the structure, components, and working principles of the Base Station
Controller (BSC) in terms of hardware, software, and logic. It also describes the transport and
networking, signal ows, and technical specications of the BSC.

Product Version
The following table lists the product version related to this document.

Table 1

Product Version

Product Name
Horizon RAN controller

Model
BSC

Intended Audience
This document is intended for:

Network planners

System engineers

Field engineers

Change History
For changes in the document, refer to Appendix: Changes in BSC Product Description on
page A-1.

Organization
1. Author Comment:
This part autogenerated in source documentMay nee to be recreated by Cut and
paste

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Chapter

1
Position of the BSC in the GSM/GPRS
Network

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Position of the BSC in the GSM/GPRS Network

Chapter 1: Position of the BSC in the GSM/GPRS Network

Position of the BSC in the GSM/GPRS Network

In the Global System for Mobile communications (GSM) / General Packet Radio Service (GPRS)
network, the BSC is located between the Base Transceiver Station (BTS) and the Mobile
service Switching Centre(MSC). The BSC performs the following functions: radio resource
management, BTS management, power control, and handover control.

Position of the BSC in the GSM/GPRS Network


Figure 1-1 shows the position of the BSC in the GSM/GPRS network.

Figure 1-1 Position of the BSC in the GSM/GPRS network

BTS: base transceiver


station

BSC: base station


controller

PSTN: public
switched telephone
network

SGSN: serving GPRS


support node

AUC: authentication
center

HLR: home location


register

MSC: mobile service


switching center

VLR: visitor location


register

ISDN: integrated
services digital
network

1-2

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BSC Product Description

Functions of each NE in the GSM/GPRS Network

Functions of each NE in the GSM/GPRS Network


Table 1-1 describes the functions of each NE in the GSM/GPRS network.

Table 1-1
NE

Functions of each NE in the GSM/GPRS network


Description of Functions

BTS

The BTS performs the following functions: power control, handover


control, transmission and reception of radio signals, coding/decoding of
the signals on the Um interface, and encryption/decryption of the signals
on the Um interface.

BSC

The BSC performs the following functions: BTS management, radio


resource management, connection management, power control, and
handover control.

SGSN

The SGSN performs the following functions: data packet transmission,


network congestion detection, network status detection, and network
management.

MSC

The MSC performs the following functions: call control, route selection,
radio resource allocation, mobility management, location registration,
handover control, bill statistics and collection, and service coordination
between the mobile switching network and the PSTN.

VLR

The VLR stores the temporary information about the MSs.

AUC

The AUC stores the information about the private keys of MSs, and
authenticates the validity of the MSs.

HLR

The HLR is a database used for managing MSs. It stores the following
information: MS subscription information, location of each MS, MSISDN,
and IMSI.

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Functions of each NE in the GSM/GPRS Network

Chapter 1: Position of the BSC in the GSM/GPRS Network

1-4

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Chapter

2
Introduction to the BSC

This section describes the physical, logical, and software structures of the BSC.
2. Author Comment:
This part autogenerated in source documentMay nee to be recreated by Cut and
paste

68P02909W01-A
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2-1

PRELIMINARY - UNDER DEVELOPMENT

BSC Physical Structure

Chapter 2: Introduction to the BSC

BSC Physical Structure

This section describes the physical structure of the BSC, including the cabinet, cables, LMT
PC, and alarm box.

Physical Structure of the BSC


Figure 2-1 shows the physical structure of the BSC.

Figure 2-1 Physical structure of the BSC

LMT: Local Manager

PDF: Power Distribution Frame

Table 2-1 lists the components of the BSC.

Table 2-1 Components of the BSC


Component

Description

GSM BSC
Control
Processing Rack
(GBCR)

The GBCR provides switching and processes services


for the BSC. One GBCR is congured in a BSC.

GBCR

GSM BSC
Service

The GBSR processes various services for the BSC.


The number of GBSRs to be congured depends

GBSR

Refer to...

Continued

2-2

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BSC Product Description

Table 2-1

Components of the BSC Cabinet

Components of the BSC (Continued)

Component

Description

Refer to...

Processing Rack
(GBSR)

on the trafc volume. Zero to three GBSRs can be


congured.

BSC Cables

BSC cables are classied into the Ethernet cable,


optical cable, and trunk cable. The number of
BSC cables to be congured depends on actual
requirements.

BSC Cables

BSC LMT

The LMT is a computer that is installed with the


LMT software package and is connected to the OM
network of the NEs. It is mandatory for the BSC.

LMT-Related
Denitions

Alarm box

The alarm box can generate audible and visual


alarms. It is mandatory for the BSC.

User manual
delivered with
the alarm box

Components of the BSC Cabinet


Figure 2-2 shows the front view of the BSC cabinet.

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Components of the BSC Cabinet

Chapter 2: Introduction to the BSC

Figure 2-2 Front view of the BSC cabinet

2-4

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BSC Product Description

Components of the BSC Cabinet

Table 2-2 describes the components in the BSC cabinet.

Table 2-2 Components in the BSC Cabinet


BSC Subrack

Description

Refer to...

GSM Main Processing


Subrack (GMPS)

The GMPS is congured in the GBCR.


Each BSC must be congured with one
GMPS.

GMPS

GSM Extended
Processing Subrack
(GEPS)

The GEPS is congured in the GBCR or


GBSR. The BSC can be congured with
zero to three GEPSs.

GEPS

GSM TransCoder
Subrack (GTCS)

The GTCS is congured in the GBCR or


GBSR. The BSC can be congured with
zero to four GTCSs.

GTCS

Power distribution box

Each cabinet must be congured with


one power distribution box.

BSC Common
Power
Distribution Box

BSC High-Power
Distribution Box

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BSC Software Structure

Chapter 2: Introduction to the BSC

BSC Software Structure

The software of the BSC has a distributed architecture. It is classied into the host software,
Operation and Maintenance Unit (OMU) software , and LMT software.

Host Software
The host software runs on various service boards. It consists of the operating system,
middleware, and application software. Figure 2-3 shows the structure of the host software.

Figure 2-3

Structure of the host software

Operating system
The operating system adopted in the BSC is VxWorks, which is an embedded real-time
operating system.

Middleware
The Distributed Object-oriented Programmable Realtime Architecture (DOPRA) and
Platform of Advanced Radio Controller (PARC) middleware ensures that the upper-level
application software is independent of the lower-level operating system. The middleware
enables software functions to be transplanted between different platforms.

Application software
Different boards are congured with different types of application software. The
application software is classied into radio resource processing software, resource control
plane processing software, BTS management software, and conguration management
and maintenance software.

2-6

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BSC Product Description

OMU Software

OMU Software
The operation maintenance unit (OMU) software runs on the GSM Operation and Maintenance
Unit (GOMU) to perform the operation and maintenance of the BSC. Figure 2-4 shows the
structure of the OMU software.

Figure 2-4

Structure of the OMU software

Operating system
The OMU software runs on the Linux operating system.

Middleware
The DOPRA middleware ensures that the upper-level application software is independent
of the lower-level operating system. Thus, the middleware enables software functions to be
transplanted between different platforms.

Application software
The application software performs the functions of different logical entities in the GOMU.

LMT Software
The LMT software, which consists of the operating system and application software, runs on the
LMT computer. Figure 2-5 shows the structure of the LMT software.

Figure 2-5 LMT software structure

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LMT Software

Chapter 2: Introduction to the BSC

Operating system
The LMT runs on the Windows 2000 Professional, Windows XP Professional, or Microsoft
Windows Vista Professional operating system.

Application software
The application software provides access to operation and maintenance of the BSC. The
application software consists of the BSC Local Manager, BSC Online Help, Motorola
Service Manager, Motorola Local Manager, Performance Browser tool, and Convert
Management System.

NOTE
The BSC Local Manager provides a graphic user interface (GUI) for performing
operation and maintenance. The Motorola Local Manager is also called the
MML command client, which provides MML commands for the users. Both of
them support the maintenance and data conguration of the BSC and the BTSs
connected to the BSC.MML: Human-Machine Language (formerly Man-Machine
Language)

2-8

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BSC Product Description

BSC Logical Structure

BSC Logical Structure

Logically, the BSC system consists of the Time Division Multiplex (TDM) switching subsystem,
GE switching subsystem, service processing subsystem, service control subsystem, interface
processing subsystem, clock subsystem, power subsystem, and environment monitoring
subsystem.
Figure 2-6 shows the logical structure of the BSC.

Figure 2-6

Logical structure of the BSC

The interface processing subsystem provides the Gb interface to enable the communication
between the BSC and the SGSN.
The interface processing subsystem supports different transmission modes over the A interface:

When the IP transmission is used, the A interface enables the communication between
the BSC and the Media Gateway (MGW).

When the TDM transmission is used, the A interface enables the communication between
the BSC and the MSC/MGW.

The interface processing subsystem of the BSC cannot support the two transmission modes
simultaneously.

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BSC Logical Structure

Chapter 2: Introduction to the BSC

2-10

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MMM YYYY

Chapter

3
BSC Hardware Conguration

The GOMU is the operation and maintenance entity of the BSC.


3. Author Comment:
This part autogeneratedd in source documentMay nee to be recrated by Cut and
paste

68P02909W01-A
MMM YYYY

3-1

PRELIMINARY - UNDER DEVELOPMENT

BSC Hardware Conguration

Chapter 3: BSC Hardware Conguration

BSC Hardware Conguration

This section describes three types of BSC subracks, two installation modes of the GTCS, and
three combination modes of BSC subracks.

BSC Subracks
The BSC subracks can be classied into the following types:

GMPS

GEPS

GTCS

Generally, both the GMPS and GEPS are referred to as the BM subrack, and the GTCS is
referred to as the TC subrack.
Both the BM subracks and the TC subracks have two interconnection modes.

Inter-Subrack TDM Interconnections


The inter-subrack TDM interconnections between one BM subrack and another BM
subrack and between one TC subrack and another TC subrack are established through
the inter-GTNU cables. For details, refer to Physical Structure of the BSC TDM Switching
Subsystem on page 4-2.

Inter-Subrack GE Interconnections
The GSCUs in the BM subracks or in the TC subracks are connected in star topology. The
subrack located in the center of the star topology is referred to as the main subrack, and
the subracks connected to the main subrack are referred to as extension subracks. For the
inter-subrack GE interconnection of BM subracks, the GMPS must be the main subrack,
and the GEPS must be the extension subrack. For the inter-subrack GE interconnection of
TC subracks, any TC subrack can be the main subrack, and the other TC subracks must
be extension subracks. For details, refer to Physical Structure of the BSC GE Switching
Subsystem on page 5-2.

Installation Modes of the GTCS


The GTCS can be congured on the BSC side and on the MSC side. If the GTCS is installed on
the BSC side, the installation mode is referred to as local GTCS. If the GTCS is installed on the
MSC side, the installation mode is referred to as remote GTCS.

In local GTCS mode, the GSCU in the main GTCS is connected to the GSCU in the GMPS
through the crossover cable. Figure 3-1 shows the OM path between the GMPS and the
main GTCS in this case.

In remote GTCS mode, the GTCS is installed in an independent GBSR and does not share a
cabinet with the GMPS/GEPS. In addition, the GSCU in the main GTCS is not connected
to the GSCU in the GMPS. Figure 3-2 shows the OM path between the GMPS and the
main GTCS in this case.

3-2

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MMM YYYY

BSC Product Description

Installation Modes of the GTCS

Figure 3-1 OM path between the GMPS and the main GTCS (in local GTCS mode)

Figure 3-2 OM path between the GMPS and the main GTCS (in remote GTCS mode)

As shown in Figure 3-1, when OM is performed on the local GTCS, the OM information is
carried by the GE link between the GSCU in the GMPS and the GSCU in the main GTCS. The
transmission rate is fast.
As shown in Figure 3-2, when OM is performed on the remote GTCS, the OM information is
carried by the E1 link between the GEIUT/GOIUT in the GMPS and the GEIUT/GOIUT in the
main GTCS. The transmission rate is slow.
The application scenarios of the local GTCS and remote GTCS are as follows: If the distance
between the GSCU in the GMPS and the GSCU in the main GTCS exceeds the maximum length
of a crossover cable, the remote GTCS should be congured. Otherwise, the local GTCS should
be congured. For example, the crossover cable can be made on site and its maximum length is
100 m. If the distance between the GMPS and the main GTCS exceeds 100 m, the remote GTCS
should be congured. Otherwise, the local GTCS should be congured.

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Conguration Modes of BSC Subracks

Chapter 3: BSC Hardware Conguration

Conguration Modes of BSC Subracks


The BSC subracks support the following conguration modes:

BM/TC separated
In BM/TC separated conguration mode, the BSC consists of the GMPS/GEPS and GTCS.
The GTCS can be congured on the BSC side or on the MSC side.
Characteristics: In this conguration mode, the GTCS can be congured exibly. The GTCS
can be congured in an independent GBSR on the MSC side, thus saving the transmission
resources between the BSC and the MSC. The GTCS can be congured on the BSC side
and share a cabinet with other subracks.

BM/TC combined
In BM/TC combined conguration mode, the TC function is performed by the GMPS or
GEPS. When the TC is congured in the GMPS, the subrack is still referred to as the GMPS.
When the TC is congured in the GEPS, the subrack is still referred to as the GEPS. In
BM/TC combined conguration mode, the TC function is performed by the GDPUX.
Characteristics: Compared with the BM/TC separated conguration mode, the BSC in
BM/TC combined conguration mode has a high density of integration. In addition, when
the capacity is the same, the BSC in BM/TC combined conguration mode has fewer
cabinets and subracks.

A over IP
In A over IP conguration mode, the BSC consists of the GMPS/GEPS and is not congured
with the GTCS. In this case, layer 2 of the A interface protocol stack uses IP, and the TC
function is performed by the MGW. Thus, the GTCS is not required.
Characteristics: In A over IP conguration mode, the BSC has few cabinets and subracks.

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BSC Hardware Conguration

BSC Hardware Conguration

The BSC is congured with the GOMU, which enables the communication between the BSC and
the LMT. The number of BSC cabinets and BSC subracks varies with the capacity requirements
for the BSC.

NOTE

BM: Basic Module

TC: Transcoder
4. Author Comment:
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paste

BM/TC Separated
In the BM/TC separated mode, the BSC is congured with the active and standby GOMUs, and
the BM and TC are congured in different subracks. This section describes the maximum,
minimum, and recommended congurations.

Minimum Conguration
In the minimum conguration, the BSC is congured with one GMPS and one GTCS. In this
case, the BSC supports 512 TRXs and 3840 speech channels.
The number of cabinets to be congured varies with the location of the GTCS.

When the GTCS is congured on the BSC side, a minimum of one cabinet must be
congured, as shown in Figure 3-3.

When the GTCS is congured on the MSC side, a minimum of two cabinets must be
congured, as shown in Figure 3-4.

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BM/TC Separated

Chapter 3: BSC Hardware Conguration

Figure 3-3 BSC minimum conguration (GTCS congured on the BSC side)

Figure 3-4

BSC minimum conguration (GTCS congured on the MSC side)

Maximum Conguration
The maximum conguration of the BSC is achieved through capacity expansion from its
minimum conguration. One BSC supports up to 2048 TRXs and 15360 speech channels. In
maximum conguration, the number of cabinets to be congured varies with the transmission
modes used on the A interface.
When E1 transmission is used on the A interface, the BSC can be congured with one GMPS,
three GEPSs, and four GTCSs in maximum conguration. The number of cabinets to be
congured varies, depending on the location of the GTCS.

When the GTCS is congured on the BSC side, a maximum of three cabinets can be
congured, as shown in Figure 3-5.

When the GTCS is congured on the MSC side, a maximum four cabinets can be
congured, as shown in Figure 3-6.

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BSC Product Description

Figure 3-5

BM/TC Separated

BSC maximum conguration (GTCS congured on the BSC side)

Figure 3-6 BSC maximum conguration (GTCS congured on the MSC side)

When STM-1 (SDH Transport Module -1) transmission is adopted on the A interface, the BSC
can be congured with one GMPS, three GEPSs, and two GTCSs in maximum conguration.

When the GTCS is congured on the BSC side, a maximum of two cabinets can be
congured, as shown in Figure 3-7.

When the GTCS is congured on the MSC side, a maximum of three cabinets can be
congured, as shown in Figure 3-8.

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BM/TC Separated

Figure 3-7

Chapter 3: BSC Hardware Conguration

BSC maximum conguration (GTCS congured on the BSC side)

Figure 3-8 BSC maximum conguration (GTCS congured on the MSC side)

Recommended Conguration
Table 3-1 lists the recommended conguration of the BSC. You can choose the appropriate
conguration based on the actual requirements.

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BSC Product Description

BM/TC Combined

Table 3-1 Recommended conguration of the BSC


Number of Cabinets
Number of
TRXs

GTCS
Congured on
the BSC Side

GTCS
Congured on
the MSC Side

1 GMPS + 1
GTCS

512

The E1 or STM-1
transmission is used
on the Abis/Ater
interface. The E1
transmission is used
on the A interface.

1 GMPS + 1
GTCS

512

The E1 or STM-1
transmission is used
on the Abis/Ater
interface. The STM-1
transmission is used
on the A interface.

1 GMPS + 1
GEPS + 2 GTCS

1 024

The Abis and Ater


interfaces use E1 or
STM-1 transmission
while the A interface
uses E1 transmission.

1 GMPS + 1
GEPS + 1 GTCS

1 024

The E1 or STM-1
transmission is used
on the Abis/Ater
interface. The STM-1
transmission is used
on the A interface.

1 GMPS + 3
GEPS + 4 GTCS

2 048

The E1 or STM-1
transmission is used
on the Abis/Ater
interface. The E1
transmission is used
on the A interface.

1 GMPS + 3 x
GEPS + 2 GTCS

2 048

The E1 or STM-1
transmission is used
on the Abis/Ater
interface. The STM-1
transmission is used
on the A interface.

Conguration

Remarks

BM/TC Combined
In the BM/TC combined mode, the BSC is congured with the active and standby GOMUs, and
the BM and TC are congured in the same subrack. This section describes the maximum,
minimum, and recommended congurations.

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BM/TC Combined

Chapter 3: BSC Hardware Conguration

Minimum Conguration
In minimum conguration, the BSC is congured with one GMPS, as shown in Figure 3-9.

Figure 3-9

BSC minimum conguration

In minimum conguration, the number of TRXs that can be congured varies with the
transmission modes used on the A interface.

If the E1 transmission is used on the A interface, the BSC minimum conguration supports
256 TRXs.

If the STM-1 transmission is used on the A interface, the BSC minimum conguration
supports 384 TRXs.

Maximum Conguration
The maximum conguration of the BSC is achieved through capacity expansion from its
minimum conguration. One BSC supports up to 2,048 TRXs and 15,360 speech channels. In
the maximum conguration, the number of cabinets and subracks to be congured varies with
the transmission modes used on the A interface.

If E1 transmission is used on the A interface, the BSC can be congured with one GMPS
and three GEPSs in maximum conguration. In this case, the BSC supports up to 1,792
TRXs. See Figure 3-10.

If STM-1 transmission is used on the A interface, the BSC can be congured with one
GMPS and two GEPSs in maximum conguration. In this case, the BSC supports up to
2,048 TRXs. See Figure 3-11.

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BM/TC Combined

Figure 3-10 BSC maximum conguration (E1 transmission used on the A interface)

Figure 3-11 BSC maximum conguration (STM-1 transmission used on the A


interface)

Recommended Conguration
Table 3-2 lists the recommended conguration of the BSC. You can choose the appropriate
conguration based on the actual requirements.

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A over IP

Chapter 3: BSC Hardware Conguration

Table 3-2 Recommended conguration of the BSC


Number of
Cabinets

Conguration

Number of
TRXs

Remarks

1 GMPS

256

The E1 or STM-1
transmission is used on
the Abis interface. The E1
transmission is used on the
A interface.

1 GMPS

384

The E1 or STM-1
transmission is used on
the Abis interface. The
STM-1 transmission is used
on the A interface.

1 GMPS + 1 GEPS

512

The E1 or STM-1
transmission is used on
the Abis interface. The E1
transmission is used on the
A interface.

1 GMPS + 1 GEPS

1,024

The E1 or STM-1
transmission is used on
the Abis interface. The
STM-1 transmission is used
on the A interface.

1 GMPS + 2 GEPS

1,024

The E1 or STM-1
transmission is used on
the Abis interface. The E1
transmission is used on the
A interface.

1 GMPS + 2 GEPS

2,048

The E1 or STM-1
transmission is used on
the Abis interface. The
STM-1 transmission is used
on the A interface.

1 GMPS + 3 GEPS

1,792

The E1 or STM-1
transmission is used on
the Abis interface. The E1
transmission is used on the
A interface.

A over IP
In the A over IP mode, the BSC is congured with the active and standby GOMUs, and IP
transmission is used on the A interface. This section describes the maximum, minimum, and
recommended congurations.

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BSC Product Description

A over IP

Minimum Conguration
In the minimum conguration, the BSC is congured with one GMPS. In this case, the BSC
supports 512 TRXs and 3,840 speech channels. See Figure 3-12.

Figure 3-12 BSC minimum conguration

Maximum Conguration
The maximum conguration of the BSC is achieved through capacity expansion from its
minimum conguration. In the maximum conguration, the BSC is congured with one GMPS
and two GEPSs, as shown in Figure 3-13. In this case, the BSC supports up to 2,048 TRXs
and 15,360 speech channels.

Figure 3-13 BSC maximum conguration

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A over IP

Chapter 3: BSC Hardware Conguration

Recommended Conguration
Table 3-3 lists the recommended conguration of the BSC. You can choose the appropriate
conguration based on the actual requirements.

Table 3-3 Recommended conguration of the BSC


Number of
Cabinets

Conguration

Number of
TRXs

Remarks

1 GMPS

512

The E1, STM-1 transmission


is used on the Abis interface.
The FE/GE transmission is
used on the A interface.

1 GMPS + 1
GEPS

1,280

The E1, STM-1 transmission


is used on the Abis interface.
The FE/GE transmission is
used on the A interface.

1 GMPS + 2
GEPS

2,048

The E1, STM-1 transmission


is used on the Abis interface.
The FE/GE transmission is
used on the A interface.

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Chapter

4
BSC TDM Switching Subsystem

The Time Division Multiplexing (TDM) switching subsystem performs data exchange in the
circuit switched (CS) domain.
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Physical Structure of the BSC TDM Switching Subsystem

Chapter 4: BSC TDM Switching Subsystem

Physical Structure of the BSC TDM Switching Subsystem

The BSC TDM switching subsystem consists of the GTNU, GDPUX, interface boards, backplane
in the subrack, and interconnected cables between subracks.

Inter-Subrack TDM Interconnections


Inter-subrack TDM interconnections are classied into two types:

TDM interconnections between the GMPS and the GEPS


The TDM interconnections between the GMPS and the GEPS are established through
inter-GTNU cables, as shown in Figure 4-1.

TDM interconnections between the GTCSs


In BM/TC separated conguration mode, the TDM interconnections between the GTCSs
exist. The TDM interconnections between the GTCSs are also established through
inter-GTNU cables, as shown in Figure 4-2.

Figure 4-1 TDM interconnections between GMPS and GEPS

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BSC Product Description

Figure 4-2

Intra-Subrack TDM Interconnections

TDM interconnections between GTCSs

In BM/TC separated conguration mode, the GMPS/GEPS communicates with the GTCS over
the Ater interface. In this case, there are no inter-subrack TDM interconnections between the
GMPS/GEPS and the GTCS.
The BSC supports the TDM interconnections of up to four subracks. The combination of the
four subracks is as follows:

One GMPS and three GEPSs

Four GTCSs

Intra-Subrack TDM Interconnections


Figure 4-3 shows the intra-subrack TDM interconnections of the GMPS/GEPS/GTCS.

Figure 4-3

Intra-subrack TDM interconnections

As shown in Figure 4-3, the GTNU works in active/standby mode. The other boards in the
subrack communicate with the active and standby GTNUs through the TDM paths of the
backplane.

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Logical Structure of the BSC TDM Switching Subsystem

Chapter 4: BSC TDM Switching Subsystem

Logical Structure of the BSC TDM Switching Subsystem

Logically, the BSC TDM switching subsystem consists of the TDM switching unit, TDM access
unit, and TDM processing unit.
Figure 4-4 shows the logical structure of the BSC TDM switching subsystem.

Figure 4-4

Logical structure of the BSC TDM switching subsystem

TDM Switching Unit


The functions of the TDM switching unit are performed by the GTNU. The TDM switching
unit supports 128K 128K TDM switching. It provides CS data switching links in the BSC to
implement the TDM switching between the GTNU and the backplane. Each route of the TDM
switching has a bandwidth of 64 kbit/s.

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BSC Product Description

TDM Access Unit

TDM Access Unit


The functions of the TDM access unit are performed by the GEIUA/GOIUA, GEIUB/GOIUB,
GEIUT/GOIUT. Each board supports 32K 32K TDM switching. Each board provides two LVDS
high-speed serial ports to enable the TDM switching between the port on the board panel and
the backplane. As shown in Figure 4-4, the TDM switching between the GMPS/GEPS and the
GTCS is performed by the GEIUT/GOIUT in each subrack.

TDM Processing Unit


The functions of the TDM processing unit are performed by the GDPUX. The TDM processing
unit supports 16K 16K timeslot switching. Each GDPUX provides two LVDS high-speed
serial ports to enable the TDM switching between the digital signal processing (DSP) module
in the GDPUX and the backplane.

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TDM Processing Unit

Chapter 4: BSC TDM Switching Subsystem

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Chapter

5
BSC GE Switching Subsystem

The Gigabit Ethernet (GE) switching subsystem performs the GE switching and packet switching
of the signaling and OM information in the BSC.
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Physical Structure of the BSC GE Switching Subsystem

Chapter 5: BSC GE Switching Subsystem

Physical Structure of the BSC GE Switching Subsystem

The BSC GE switching subsystem consists of the backplane of the subrack, GSCU, and
inter-GSCU Ethernet cables.

Inter-Subrack GE Interconnections
Inter-subrack GE interconnections are classied into two types:

GE interconnection between the GMPS and the GEPS


The GMPS serves as the main subrack, and a maximum of three GEPSs serve as extension
subracks. The GMPS and the GEPSs are connected in the star topology through Ethernet
cables between the GSCUs, as shown in Figure 5-1.

GE interconnection between the GTCSs


One GTCS works as the main subrack, and a maximum of three GTCSs work as extension
subracks. The GTCSs are connected in the star topology through the GSCUs, as shown
in Figure 5-2.

Figure 5-1 GE interconnection between the GMPS and the GEPS

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BSC Product Description

Figure 5-2

Intra-subrack GE interconnection

GE interconnection between the GTCSs

When GTCSs are congured on the BSC side, the GSCU in the GMPS communicates with the
GSCU in the main GTCS through the inter-GSCU Ethernet cables. When the GTCS is congured
on the MSC side, the GMPS communicates with the main GTCS over the Ater interface. In this
case, the GE interconnection between the GMPS and the main GTCS is not established.

Intra-subrack GE interconnection
The intra-subrack GE interconnection refers to the GE interconnection between the
active/standby GSCU and the other boards in the same subrack, as shown in Figure 5-3.

Figure 5-3 Intra-subrack GE interconnection

The GE switching between the active/standby GSCU and the other boards is performed through
the path on the backplane.

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Logical Structure of the BSC GE Switching Subsystem

Chapter 5: BSC GE Switching Subsystem

Logical Structure of the BSC GE Switching Subsystem

Logically, the BSC GE switching subsystem consists of the central processing unit, network
unit, and interface unit.
Figure 5-4 shows the logical structure of the BSC GE switching subsystem.

Figure 5-4

Logical structure of the BSC GE switching subsystem

Central Processing Unit


The functions of the central processing unit are performed by the GSCU. The central processing
unit performs the following management functions of the GE switching subsystem: initialization,
conguration, maintenance, test, fault management, port trunking management, and switchover
management.

Network Unit
The functions of the network unit are performed by the GSCU. The network unit performs the
Media Access Control (MAC) address learning, address entry adding, address entry deleting, GE
line rate switching, L2 unicasting and broadcasting, and port trunking.

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BSC Product Description

Interface Unit

Interface Unit
The functions of the interface unit are performed by the GSCU. The interface unit receives and
transmits Ethernet packets.

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Features of BSC GE Switching

Chapter 5: BSC GE Switching Subsystem

Features of BSC GE Switching

This section describes the features of the BSC GE switching.


The GE switching has the following features:

The GSCU and other boards are interconnected in the star topology. In other words, the
communication of any two boards should pass through the GSCU.

The GSCU supports the centralized and non-blocking line-rate Layer 2 (L2) switching.

The GSCU provides 60 GE ports, which support 60 Gbit/s line-rate switching.

The ports on the GSCU support port trunking.

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Chapter

6
BSC Service Processing Subsystem

The BSC service processing subsystem performs voice coding/decoding and rate matching.
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Physical Structure of the BSC Service Processing Subsystem

Chapter 6: BSC Service Processing Subsystem

Physical Structure of the BSC Service Processing


Subsystem

Physically, the BSC service processing subsystem consists of the GDPUP and GDPUX.
The number of congured GDPUPs and the number of congured GDPUXs depend on the
trafc volume of CS services and PS services.

The GDPUP processes PS services. It can be congured in slots 08 - 11 in the GMPS


and in slots 08 - 13 in the GEPS.

The GDPUX processes CS services. It can be congured in slots 08 - 11 in the GMPS, in


slots 0003, 08 - 13, and 14 - 27 in the GEPS, and in slots 0003 and 0813 in the GTCS.
In different conguration modes of the BSC subracks, the GDPUX performs different
functions:
In BM/TC separated conguration mode, the GDPUX congured in the GMPS/GEPS
performs IP packet-TRAU conversion and forwarding; the GDPUX congured in the
GTCS performs voice coding/decoding and rate matching.
In BM/TC combined conguration mode, the GDPUX performs IP packet-TRAU
conversion, voice coding/decoding, and rate matching.
In A over IP conguration mode, the GDPUX performs IP packet-TRAU conversion
and forwarding.

Based on the conguration modes of the BSC subracks, the BSC service processing subsystem
comprises different components:

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BSC Product Description

Physical Structure of the BSC Service Processing Subsystem

In BM/TC separated conguration modethe BSC service processing subsystem comprises


the GDPUXs and GDPUPs in the GMPS/GEPS, and the GDPUXs in the GTCS, as shown
in Figure 6-1.

Figure 6-1 Physical structure of the BSC service processing subsystem (1)

In BM/TC combined or A over IP conguration mode, the BSC service processing


subsystem comprises the GDPUP and GDPUX in the GMPS/GEPS, as shown in Figure 6-2.

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Physical Structure of the BSC Service Processing Subsystem

Chapter 6: BSC Service Processing Subsystem

Figure 6-2 Physical structure of the BSC service processing subsystem (2)

NOTE
The GDPUX/GDPUP consists of 22 DSP modules. After being loaded with different
software, the GDPUX/GDPUP performs different functions:

Voice coding/decoding and rate matching


The voice coding/decoding and rate matching functions are performed by the
GDPUX. In BM/TC separated conguration mode, the GDPUX is congured in
the GTCS. In BM/TC combined conguration mode, the GDPUX is congured in
the GMPS/GEPS.

Built-in PCU
The functions of the PCU are performed by the GDPUP, which is congured in
the GMPS/GEPS.

Voice format conversion

The voice format conversion function is performed by the GDPUX congured in


the GMPS/GEPS.
At present, all the DSP modules in one GDPUX/GDPUP must be loaded with the same
software. Therefore, they perform the same functions.

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BSC Product Description

Logical Structure of the BSC Service Processing Subsystem

Logical Structure of the BSC Service Processing


Subsystem

Logically, the BSC service processing subsystem consists of the CS service processing subsystem
and PS service processing subsystem. The functions of the CS service processing subsystem are
performed by the CS digital signal processing (DSP) module in the GDPUX. The functions of the
PS service processing subsystem are performed by the PS DSP module in the GDPUP.

CS Service Processing Subsystem


The functions of the CS service processing subsystem are performed by the CS DSP module in
the GDPUX. Figure 6-3 shows the logical structure of the CS service processing subsystem.

Figure 6-3

Logical structure of the CS service processing subsystem

Take the transmission of speech signals from the BSC to MSC as an example. The DSP performs
the following operations:
1.

Receives speech signals from the TDM switching module through the Ater interface

2.

Performs Tandem Free Operation (TFO) and voice enhancement of the speech signals

3.

Encodes/decodes the speech signals

4.

Converts the data format of the speech signals

5.

Transmits the processed speech signals to the TDM switching module through the A
interface, and then transmits the signals to the MSC

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PS Service Processing Subsystem

Chapter 6: BSC Service Processing Subsystem

PS Service Processing Subsystem


The functions of the PS service processing subsystem are performed by the PS DSP module in
the GDPUP. Figure 6-4 shows the logical structure of the PS service processing subsystem.

Figure 6-4 Logical structure of the PS service processing subsystem

The following takes the transmission of PS signals from the BSC to the SGSN as an example.
When IP transmission is used on the Abis interface and on the Gb interface, the service
processing procedure of the PS DSP module is as follows:
1.

The PS DSP module in the GDPUP receives the PTRAU frames from the BTS.

2.

The PS DSP module adjusts the order of PTRAU frames and eliminates jitter.

3.

The PTRAU frames are switched to the GFGUG by the GSCU, and then are transmitted to
the SGSN over the Gb interface.

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Chapter

7
BSC Service Control Subsystem

The BSC service control subsystem provides the cell broadcast short message service, and
performs BTS OM and TC resource pool management.
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Physical Structure of the BSC Service Control Subsystem

Chapter 7: BSC Service Control Subsystem

Physical Structure of the BSC Service Control


Subsystem

This section describes the components of the BSC service control subsystem.
The components of the BSC service control subsystem are as follows:

GXPUM and GXPUT congured in the GMPS/GEPS

GOMU

GSCU congured in the GTCS

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BSC Product Description

Logical Structure of the BSC Service Control Subsystem

Logical Structure of the BSC Service Control Subsystem

The BSC service control subsystem performs the following functions: paging control, message
management, channel assignment, BTS public service management, call control, packet service
control, handover and power control, cell broadcast short message service, and TC resource
pool management.

Paging Control
The GXPUM/GXPUT performs the following paging control functions:

Sends paging messages from the A and Gb interfaces to the BSC

Sends the paging messages to the specied cells

System Information Management


The GXPUM/GXPUT performs the following system information management functions:

Constructs various system information according to the GSM protocols and sends it
to cells or MSs

Initiates a procedure for sending CS or PS system information in the following situations:


conguration of BSC data in online mode, change in the BTS management state, initiation
of requests from the BTS, or restoration of the Radio Signaling Link(RSL)

Channel Assignment
The GXPUM performs the following channel assignment functions:

Assigns radio channels for CS services and PS services

Performs dynamic conversion between TCHs and PDCHs

NOTE

TCH: Trafc Channel

PDCH: Packet Data CHannel

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BTS Public Service Management

Chapter 7: BSC Service Control Subsystem

BTS Public Service Management


The GXPUM performs the BTS public service management functions such as BTS conguration
management and BTS state management.

The BTS conguration management is responsible for the conguration and query of
the BTS data. It performs functions such as initial conguration, dynamic conguration,
dynamic adjustment of channel types, and BTS initialization management. It also performs
resetting, blocking, and unblocking of the logical objects of a BTS.

The BTS state management is responsible for channel state synchronization, Operation
and Maintenance Link (OML) transmission state synchronization, Transceiver (TRX)
mutual aid, and BTS resource check.

Call Control
The GXPUM/GXPUT performs the CS call control functions such as call establishment, call
release, and call handover.

PS Service Control
The GXPUM/GXPUT performs the following PS service control functions:

Requests and releases a PDCH, checks PS service resources, controls and broadcasts PS
system information

Establishes PS transmission paths between the BSC and the BTS, and performs dynamic
conversion between PDCHs and TCHs

Handover and Power Control


The GXPUM/GXPUT performs the following handover and power control functions:

Initial processing of measurement reports


It includes the functions of interpolation, ltering, and prediction.

Cell sorting and handover decision


The cell sorting is classied into basic cell sorting and adjustment based on network
characteristics. The handover decision is classied into forced handover decision, directed
retry decision, handover candidates query decision, emergency handover decision,
common handover decision, and performance handover decision.

Power Control
Power control functions are implemented through the signal level dual-threshold power
control algorithm, signal quality dual-threshold power control algorithm, power control
compensation algorithm, and power control comprehensive decision algorithm.

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BSC Product Description

Cell Broadcast Short Message Service

Cell Broadcast Short Message Service


The GXPUM enables the cell broadcast short message service. The GXPUM processes the cell
broadcast short message service as follows:

The GXPUM obtains cell information and sends it to the CBC.

Upon reception of the broadcast request message from the CBC, the GXPUM saves and
schedules the message, and then sends it to the BTS.

BTS Operation and Maintenance


The operation and maintenance of the BTS is performed by the GOMU. The specic operations
are the BTS routine maintenance, BTS alarm management, BTS software management, and
BTS test management.

TC Resource Pool Management


The TC resource pool of the BSC supports various types of services. For example, one TC
resource pool supports Full Rate (FR) calls, Enhanced Full Rate (EFR) calls, and Half Rate
(HR) calls. The TC coding/decoding resources used for one service type, however, belong
to one resource pool.
The GSCU in the GTCS or the GXPUM in the GMPS/GEPS performs the following TC resource
pool management functions:

Automatically detects faulty TC resources and allocates available TC resources for new
calls, thus improving system reliability.

Allocates TC resources based on the CPU usage of DSP units so that the call congestion
rate caused by faulty TC resources is reduced

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TC Resource Pool Management

Chapter 7: BSC Service Control Subsystem

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Chapter

8
BSC Interface Processing Subsystem

The BSC interface and signaling processing subsystem processes the signaling on the BSC
interfaces.
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Physical Structure of the BSC Interface Processing Subsystem

Chapter 8: BSC Interface Processing Subsystem

Physical Structure of the BSC Interface Processing


Subsystem

The BSC interface processing subsystem consists of the interface boards and the GXPUM.
Figure 8-1 shows the physical structure of the BSC interface processing subsystem.

Figure 8-1

Physical structure of the BSC interface processing subsystem

Table 8-1 shows the physical entities of the BSC interface processing subsystem.

Table 8-1 Physical entities of the BSC interface processing subsystem


Board Type

Board Name

Abis interface boards

GEIUB: provides E1 electrical ports

GOIUB: provides the STM-1 optical port

GEIUA: provides E1 electrical ports

GOIUA: provides STM-1 optical ports

GFGUA: provides FE/GE electrical ports

A interface boards

Continued

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BSC Product Description

Physical Structure of the BSC Interface Processing Subsystem

Table 8-1 Physical entities of the BSC interface processing subsystem (Continued)
Board Type

Board Name

GOGUA: provides GE optical ports

GEIUT: provides E1 electrical ports

GOIUT: provides STM-1 optical ports

GFGUG: provides E1 electrical ports

GEPUG: provides STM-1 optical ports

Ater interface boards

Gb interface boards

Cb interface board

GXPUM: provides FE electrical ports

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Logical Structure of the BSC Interface Processing Subsystem

Chapter 8: BSC Interface Processing Subsystem

Logical Structure of the BSC Interface Processing


Subsystem

Logically, the BSC interface processing subsystem consists of the following units: Abis interface
processing unit, A interface processing unit, Ater interface processing unit, Gb interface
processing unit, and Cb interface processing unit.
Figure 8-2 shows the BSC interfaces.

Figure 8-2

BSC interfaces

As shown in Figure 8-2, the BSC is connected to the MSC/MGW over the A interface, to the
BTS over the Abis interface, to the SGSN over the Gb interface, and to the CBC over the Cb
interface. The GMPS/GEPS is connected to the GTCS over the Ater interface.

NOTE
When the BM and TC are congured in different subracks, they communicate with
each other over the Ater interface.

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BSC Product Description

Abis Interface Processing Unit

Abis Interface Processing Unit


The BSC and the BTS communicate with each other over the Abis interface. The Abis interface
processing unit performs the following functions:

Provides E1 electrical ports, STM-1 optical ports.

Receives and transmits the signaling and trafc signals between the BSC and the BTS

Converts internal protocols

Forwards signaling to the service control subsystem

Forwards trafc signals to the service processing subsystem

A Interface Processing Unit


The BSC and the MSC/MGW communicate with each other over the A interface. The A interface
processing unit performs the following functions:

Provides E1 electrical ports, STM-1 optical ports, FE/GE electrical ports, and GE optical
ports.

Receives and transmits signaling and trafc signals between the BSC and the MSC/MGW

Converts internal protocols

Performs the IP protocol processing if IP transmission is used over the A interface, and
performs the MTP2 protocol processing if the BM and the TC are congured in the same
subrack.

Forwards the signaling from the core network to the GE switching subsystem

Forwards the trafc signals from the core network to the GE switching subsystem or
to the TDM switching subsystem

Ater Interface Processing Unit


When the BM and TC are congured in different subracks, they communicate with each other
over the Ater interface. The Ater interface processing unit performs the following functions:

Provides E1 electrical ports and STM-1 optical ports.

Receives and transmits signaling and trafc signals between the BM subrack and the
TC subrack

Processes the MTP2 protocol

Forwards signaling to the GE switching subsystem

Forwards trafc signals to the TDM switching subsystem

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Gb Interface Processing Unit

Chapter 8: BSC Interface Processing Subsystem

Gb Interface Processing Unit


The BSC provides the Gb interface to enable the communication between the BSC and the
SGSN. The Gb interface processing unit performs the following functions:

Provides E1 electrical ports and FE/GE electrical ports.

Receives and transmits signaling and trafc signals between the BSC and the SGSN

Processes the signaling according to the FR/IP protocol

Forwards signaling and trafc signals to the GE switching subsystem

Cb Interface Processing Unit


The BSC and the CBC communicate with each other over the Cb interface. The Cb interface
processing unit performs the following functions:

Provides FE/GE electrical ports

Receives and transmits the signaling between the BSC and the CBC

Forwards signaling to the GE switching subsystem

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Chapter

9
BSC Clock Subsystem

The BSC clock subsystem consists of the GGCU and the clock processing unit in each subrack.
The clock subsystem provides the reference clock for the BSC and BTS.

NOTE
The Gb interface board is the GEPUG, the GEPUG extracts the line clock signals
from the Gb interface. Then, the GEPUG uses the extracted signals to implement
synchronization with the SGSN.If the GEIUB/GOIUB is used on the Abis interface, it
extracts clock signals from its backplane and provides the clock signals for the BTS.
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BSC Clock Sources

Chapter 9: BSC Clock Subsystem

BSC Clock Sources

The BSC can use two clock sources: Building Integrated Timing Supply System (BITS) clock and
line clock. Each clock source either has one backup source or does not have any backup.

BITS Clock
The BSC extracts the BITS clock signals from a BITS device. There are two types of BITS clock
signals: 2 MHz and 2 Mbit/s clock signals. BITS clock signals have two inputs: BITS0 and
BITS1. The BSC extracts the BITS clock signals from the clock input ports on the GGCU panel.
The clock signals serve as reference clocks for the GSM Main Processing Subrack (GMPS) /
GSM Extended Processing Subrack (GEPS).

NOTE

BITS0 and BITS1 correspond to the CLKIN0 and CLKIN1 ports on the GGCU
panel respectively.

The 2 Mbit/s clock source has a higher anti-interference capability than the 2
MHz clock source.

When IP transmission is used over the A interface, the BSC can use only the
BITS clock.

Line Clock
Line clock is the 8 kHz clock extracted over the A interface by the GTCS. The line clock has two
inputs: LINE0 and LINE1.
Based on the conguration modes of the BSC subracks, the BSC uses different methods to
obtain the line clock, which are described as follows:

In BM/TC separated conguration mode, the GTCS extracts the line clock signals from the
A interface. The GGCU extracts the line clock signals from the Ater interface, and then
distributes clock signals to the GMPS/GEPS.

In BM/TC combined conguration mode, the GMPS extracts the line clock signals from the
A interface. Then, the clock signals are transmitted to the GGCU through the backplane.

In A over IP conguration mode, the BSC cannot use the line clock.

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BSC Product Description

BSC Clock Synchronization

BSC Clock Synchronization

This section describes the clock synchronization of the BSC subracks.

NOTE
The GEPUG is used on the Gb interface, the GEPUG extracts the line clock signals
from the Gb interface. Then, the GEPUG uses the line clock signals to implement
synchronization with the SGSN.
11. Author Comment:
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BSC Clock Synchronization (BM/TC Separated)


This section describes the clock synchronization in the GMPS/GEPS and GTCS.

Clock Synchronization in the GMPS/GEPS


The clock signals in the GMPS/GEPS are provided by the GGCU. The GGCU either extracts
BITS clock signals from the BITS clock equipment or extracts line clock signals from the Ater
interface.

Figure 9-1 shows the clock synchronization in the GMPS/GEPS when the GGCU extracts
BITS clock signals from the BITS clock equipment.

Figure 9-2 shows the clock synchronization in the GMPS/GEPS when the GGCU extracts
line clock signals from the Ater interface.

Figure 9-1 Clock synchronization in the GMPS/GEPS (BITS clock)

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BSC Clock Synchronization (BM/TC Separated)

Chapter 9: BSC Clock Subsystem

Figure 9-2 Clock synchronization in the GMPS/GEPS (line clock)

As shown in Figure 9-1 and Figure 9-2, the procedure for processing clock signals in the
GMPS/GEPS is as follows:
1.

If the clock source is the BITS clock, the BITS clock signals are transmitted to the GGCU
through the GGCU panel. If the clock source is the line clock signals, the line clock signals
are transmitted to the GEIUT/GOIUT in the GMPS over the Ater interface, and then
transmitted to the GGCU through the backplane.

2.

The clock signals are phased-locked in the GGCU. Then, the 8 kHz clock signals are
generated.
In the GMPS, the 8 kHz clock signals are transmitted from the GGCU to the GSCU
through the backplane.
The 8 kHz clock signals are transmitted from the GGCU panel in the GMPS to the
GSCU in the GEPS through a Y-shaped clock cable.

3.

The GSCU in the GMPS/GEPS transmits the 8 kHz clock signals to the other boards in
the GMPS/GEPS through the backplane.

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BSC Product Description

BSC Clock Synchronization (BM/TC Combined)

Clock Synchronization in the GTCS


The GTCS extracts line clock signals from the A interface. Figure 9-3 shows the clock
synchronization in the GTCS.

Figure 9-3

Clock synchronization in the GTCS

The clock signals in the GTCS are processed in the following manner:
1.

The GTCS extracts line clock signals through the A interface. The line clock signals are
processed by the GEIUA/GOIUA, and then the 8 kHz clock signals are generated.

2.

The backplane in the GTCS transmits the 8 kHz clock signals to the GSCU in the GTCS.
Then, the GSCU transmits the 8 kHz clock signals to the other boards in the GTCS.

3.

The GEIUT/GOIUT in the main GTCS extracts the 8 kHz clock signals from the backplane,
and then transmits the clock signals to the GMPS.

BSC Clock Synchronization (BM/TC Combined)


This section describes the clock synchronization in the GMPS/GEPS.

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BSC Clock Synchronization (BM/TC Combined)

Chapter 9: BSC Clock Subsystem

Clock Synchronization in the GMPS/GEPS (BITS Clock Source)


Figure 9-4 shows the clock synchronization in the GMPS/GEPS that uses the BITS clock source.

Figure 9-4 BSC clock synchronization procedure (BITS clock source)

The clock signals in the GMPS/GEPS are processed in the following manner:
1.

The BITS clock signals are transmitted to the GGCU through the GGCU panel.

2.

After the BITS clock signals are phase-locked by the GGCU, 8 kHz clock signals are
generated.
In the GMPS, the 8 kHz clock signals are transmitted from the GGCU to the GSCU
through the backplane.
The 8 kHz clock signals are transmitted from the GGCU panel in the GMPS to the
GSCU in the GEPS through a Y-shaped clock cable.

3.

The GSCU in the GMPS/GEPS transmits the 8 kHz clock signals to the other boards in
the GMPS/GEPS through the backplane.

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BSC Product Description

BSC Clock Synchronization (A over IP)

Clock Synchronization in the GMPS/GEPS (Line Clock Source)


Figure 9-5 shows the clock synchronization in the GMPS/GEPS that uses the line clock source.

Figure 9-5

BSC clock synchronization procedure (line clock source)

The clock signals in the GMPS/GEPS are processed in the following manner:
1.

The GMPS extracts line clock signals over the A interface. The line clock signals are
processed by the GEIUA/GOIUA, and then 8 kHz clock signals are generated.

2.

In the GMPS, the 8 kHz clock signals are transmitted to the GGCU through the backplane.
After being phase-locked by the GSCU, the 8 kHz clock signals are transmitted to the
other boards in the GMPS.

3.

The 8 kHz clock signals are transmitted from the GGCU to the GSCU in each GEPS. Then,
the GSCU in each GEPS forwards the clock signals to the other boards in the GEPS.

BSC Clock Synchronization (A over IP)


This section describes the clock synchronization in the GMPS/GEPS.

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BSC Clock Synchronization (A over IP)

Chapter 9: BSC Clock Subsystem

In A over IP conguration mode, the BSC cannot use the line clock. Figure 9-6 shows the clock
synchronization in the GMPS/GEPS that uses the BITS clock source.

Figure 9-6 BSC clock synchronization procedure (BITS clock source)

The clock signals in the GMPS/GEPS are processed in the following manner:
1.

The BITS clock signals are transmitted to the GGCU through the GGCU panel.

2.

The BITS clock signals are phased-locked in the GGCU. Then, the 8 kHz clock signals
are generated.
In the GMPS, the 8 kHz clock signals are transmitted from the GGCU to the GSCU
through the backplane.
The 8 kHz clock signals are transmitted from the GGCU panel in the GMPS to the
GSCU in the GEPS through a Y-shaped clock cable.

3.

The GSCU in the GMPS/GEPS transmits the 8 kHz clock signals to the other boards in
the GMPS/GEPS through the backplane.

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Chapter

10
BSC Power Subsystem

The BSC power subsystem adopts dual-circuit redundancy and point-by-point monitoring
solution, which is highly reliable. The BSC power subsystem comprises the power lead-in
part and the power distribution part.

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Power Lead-In Part

Chapter 10: BSC Power Subsystem

Power Lead-In Part

The power lead-in part leads the power from the DC power distribution cabinet to the power
distribution boxes of the BSC cabinet. The power lead-in part consists of the DC power
distribution cabinet, power distribution box, and cables between them. At present, the BSC
supports two types of power distribution box: common power distribution box and high-power
distribution box. Figure 10-1 and Figure 10-2 show the power lead-in parts of the two types
of power distribution box.

Figure 10-1

Power lead-in part (common power distribution box)

NOTE
The DC power distribution cabinet and the upstream DC power distribution panel
are not regarded as the BSC equipment.

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BSC Product Description

Power Lead-In Part

Figure 10-2 Power lead-in part (high-power distribution box)

The working principle of the power lead-in part is as follows:

The DC power distribution cabinet provides each BSC cabinet with two separate 48 V
inputs, one route for RTN connection, and one route for PGND connection.

Typically, the two routes of power inputs work concurrently. If one route fails, the other
route supplies power alone to ensure the stable running of the system. You can repair one
faulty route of the two routes when the power is normally supplied, keeping the reliability
and availability of the power subsystem at an optimum level.

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Power Distribution Part

Chapter 10: BSC Power Subsystem

Power Distribution Part

The power distribution part distributes power from the power distribution box to various parts
in the cabinet. It comprises the power distribution box, power distribution switches, and various
parts in the cabinet.
The working principle of the power distribution part is as follows:

The power distribution box provides lightning protection and overcurrent protection for
the two 48 V inputs. It then supplies two groups of power to the parts in the BSC. The
cabinet operates in the power range - 40 V to - 57 V.

The power distribution box monitors each route of power in real time. Upon detection of
abnormal power supply, the power distribution box reports relevant alarms to the LMT.

The power distribution differs within different types of cabinet.


For details on the power distribution in the GBCR, refer to Connections of Power
Cables and PGND Cables in the GBCR.
For details on the power distribution in the GBSR, refer to Connections of Power
Cables and PGND Cables in the GBSR.

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Chapter

11
BSC Environment Monitoring Subsystem

The BSC environment monitoring subsystem comprises the power distribution box and the
environment monitoring parts in each subrack. The environment monitoring subsystem
monitors and adjusts the power supply, the speed of the fans, and the working environment.
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BSC Power Monitoring

Chapter 11: BSC Environment Monitoring Subsystem

BSC Power Monitoring

The BSC power monitoring function involves monitoring the power supply of each BSC subrack
in real time, reporting the operating status of the power supply, and generating alarms in the
case of exceptions.
Figure 11-1 shows the principle of power monitoring.

Figure 11-1 Principle of power monitoring

The power monitoring process is as follows:


1.

The monitoring board in the power distribution box monitors the operating status of the
power distribution box. The RS485 serial cable routes the monitoring signals to the
subrack that is connected with the serial cable.

2.

The monitoring signals are sent to the GSCU in the subrack through the serial bus on
the backplane.

3.

The GSCU processes and reports the monitoring information. When an exception occurs,
the GSCU generates an alarm and sends alarm information to the GOMU. The GOMU then
sends the alarm information to the LMT and OMC-S/T.

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BSC Product Description

BSC Fan Monitoring

BSC Fan Monitoring

The BSC fan monitoring function involves monitoring the operating status of the fans in real
time and adjusting the speed of the fans based on the temperature in the subrack.
The BSC uses the all-in-one design to integrate the fan box into the subrack. Figure 11-2 shows
the fan monitoring principle.

Figure 11-2 Fan monitoring principle

The fan monitoring process is as follows:


1.

The fan control unit monitors the operating status of the fans in the fan box. The RS485
serial cable leads the monitoring signals to the subrack.

2.

The monitoring signals are sent to the GSCU in the subrack through the serial bus on
the backplane.

3.

The GSCU processes and reports the monitoring information. When an exception occurs,
the GSCU generates an alarm and sends alarm information to the GOMU. The GOMU then
sends the alarm information to the LMT and OMC-S/T.

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BSC Environment Monitoring

Chapter 11: BSC Environment Monitoring Subsystem

BSC Environment Monitoring

The BSC environment monitoring involves monitoring the temperature, humidity, and operating
voltage of the BSC that is congured with the EMU. When exceptions occur, the EMU reports
environment alarms to the LMT or OMC-S/T. Each cabinet can be congured with a maximum of
one EMU.
Figure 11-3 shows the environment monitoring mechanism.

Figure 11-3 Environment monitoring mechanism

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BSC Product Description

BSC Environment Monitoring

The alarm monitoring process is as follows:


1.

The sensors monitor the environment and send the monitoring signals to the EMU.

2.

The EMU sends the monitoring signals to the connected subrack.

3.

The monitoring signals are sent to the GSCU in the subrack through the serial bus on
the backplane.
If the subrack is an extension GTCS, the monitoring signals are sent from the GSCU in
the extension GTCS to the GSCU in the GMPS through the GSCU in the main GTCS.
If the subrack is a GEPS or the main GTCS, the monitoring signals are sent to the
GSCU in the GMPS.

4.

The GSCU in the GMPS processes the monitoring signals and reports the monitoring
information. When an exception occurs, the GSCU generates an alarm and sends the
alarm information to the GOMU. The GOMU then sends the alarm information to the
LMT or OMC-S/T.

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BSC Environment Monitoring

Chapter 11: BSC Environment Monitoring Subsystem

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Chapter

12
OM of the BSC

You can maintain the BSC in different OM modes.


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OM Modes of the BSC

Chapter 12: OM of the BSC

OM Modes of the BSC

OM tasks can be performed on the BSC on two OM terminals: LMT and OMC-S/T.
The OM modes of the BSC are as follows:

LMT
The LMT is used to maintain the BSC. It communicates with the BSC through a LAN
switch or through remote dialing.

OMC-S/T
The OMC-S/T is used to maintain the BSC. The BSC serves as a network element to access
the OMC-S/T.

Figure 12-1 shows the network topology of the BSC OM (in BSC Hardware Conguration on
page 3-5).

Figure 12-1 Network topology of the BSC OM

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BSC Product Description

OM Functions of the BSC

OM Functions of the BSC

The OM functions of the BSC are as follows: security management, conguration management,
performance management, alarm management, and loading management.
14. Author Comment:
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BSC Security Management


The BSC security management involves authority management, log management, and inventory
management.

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BSC Security Management

Chapter 12: OM of the BSC

Authority Management
The BSC authority management regulates the operation authority of the users (LMT users or
OMC-S/T users) that log in to the BSC. When users log in to the BSC, they actually log in to the
GOMU of the BSC. The BSC users are classied into the following types:

Domain users: These user accounts are created, changed, authenticated, and authorized
on the OMC-S/T. Domain users can manage the BSC after logging in to the BSC on the
LMT (BSC Local Manager or MML command client) or after logging in to the OMC-S/T
server through the OMC-S/T client.

Internal user: There is a default account admin, which has the rights to perform all the
operations. This account cannot be deleted.

External users: The external users are classied into ve levels. The users of different
levels form different functional groups. The users can perform only the operations dened
in their functional groups. The GOMU veries and controls the operation authority of
the external users. Table 12-1 denes the authority of the external users that belong to
different functional groups.

Table 12-1 Denitions of the BSC user authorities


Level

Authority

Guest

Browse data

User

In addition to the authority granted to the User, User can perform OM of


the equipment, alarm management, and performance management.

Operator

In addition to the authorities granted to the User, Operator can perform


data conguration for the equipment.

Administrator

Administrator has the highest operation authority. It can manage other


users.

Custom

The authority of this user is dened by the Administrator.

Security management also includes NE operation time management. It limits the operation
time of users by date, week, and time segment. Users can carry out operations only in the
predened time limit.

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BSC Product Description

BSC Security Management

Log Management
Log management records and saves the operations performed by an operator and the running
information of the BSC. It also helps in analyzing and locating faults.
Table 12-2 lists the logs that are recorded when the BSC is running.

Table 12-2 BSC logs


Type

Description

Running log

Records the operating information about the system, such as board


reset information

Operating log

Records the information about operation and maintenance performed


by users

Debugging log

Records the information about the analysis and location of internal faults

LastWords log

Records the primary information such as timers before system failure.


The information is used to locate and analyze faults, such as abnormal
system restart.

CHR log

Records the information on calls and dot trace

BTS log

Records the information on the faults that occur while the BTS is
running and the related debugging information

Frequency scan
log

Records the information on cell frequency scan

The BSC log management involves the following functions:

Querying log les


To view specied log information in the GOMU by setting the querying conditions.

Uploading log les


To upload the log les in the GOMU to a specied FTP server by setting the uploading
parameters.

Saving log les


To save specied running, operating, debugging logs in the GOMU by setting the
parameters of the log les.

Saving the logs stored in the buffer to the log le by force


To obtain the latest log information by saving the logs stored in the buffer to the log le.

NOTE
The GOMU saves the log information in the buffer. When the log information
reaches the specied limit or the current time reaches the log record period,
the GOMU records the log le.

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BSC Conguration Management

Chapter 12: OM of the BSC

Inventory Management
Inventory management is a process in which the BSC inventory information les and BTS
inventory information les are exported and uploaded. Using this function, you can learn
the physical and logical congurations of the BSC and BTS through the OMC-S/T. Both the
BSC inventory information and the BTS inventory information contain the descriptions of the
following items:

Equipment

Connection

Modules

Congurations

Peer equipment

Host version

Cabinets

Subracks

Boards and the Flash electronic labels of the boards

Slots

Ports

Antennas

BSC Conguration Management


The BSC conguration management involves managing the data congurations of the BSC
and of the related BTSs on the LMT. The LMT consists of the BSC Local Manager and the
MML command client.
15. Author Comment:
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paste

BSC Data Conguration Modes


The BSC data conguration is performed on the LMT (BSC Local Manager or MML command
client). Two data conguration modes can be used: ofine data conguration and online data
conguration.

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BSC Product Description

BSC Data Conguration Modes

Ofine Data Conguration


Ofine data conguration is performed when the communication between the LMT and the
GOMU is not established.
Figure 12-2 shows the principle of the ofine data conguration on the BSC Local Manager.

Figure 12-2

Principle of the ofine data conguration

The procedure for the ofine data conguration on the BSC Local Manager is as follows:
1.

Perform data conguration on the BSC Local Manager, and check that the data is integral
and accurate by using the auto check function of the LMT.

2.

Save the conguration data on the hard disk with a *.dat le.

3.

Send the *.dat le to the GOMU database by performing the Load and Restore operation
on the LMT. Then, activate the conguration data of each service board.

NOTE
At present, the MML command client does not support ofine data conguration.
Ofine data conguration does not occupy the network bandwidth and it is easy and fast to
operate; thus, it applies to initial network operation and network upgrade.

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BSC Conguration Data Types

Chapter 12: OM of the BSC

Online Data Conguration


Online data conguration is performed when the communications between the GOMU and the
relevant BSC boards are established. On the LMT, you can modify the data conguration of
the BSC and the related BTSs. In online data conguration, the congured data takes effect
immediately.
Figure 12-3 shows the principle of the online data conguration.

Figure 12-3

Principle of the online data conguration

The procedure of the online data conguration in the BSC Local Manager is as follows:
1.

You can issue conguration commands to the conguration module of the GOMU through
the LMT.

2.

On receiving the conguration commands, the conguration module sends the


conguration data to the database of a specied service board and writes the conguration
data in the database of the GOMU.

After you log in to the BSC through the BSC Local Manager and perform data congurations,
other users are forbidden to perform data congurations simultaneously. In case that multiple
LMTs have accessed the GOMU and one LMT has performed data conguration, the rest LMTs
will detect the data changed in the GOMU and prompt you to update the local data to keep the
consistency of the data between the LMTs and the GOMU.
After you log in to the BSC through the MML command client and run conguration commands
in succession, other users are allowed to perform data congurations simultaneously. After you
log in to the BSC through the MML command client and run conguration commands in batch,
other users are forbidden to perform data congurations simultaneously.

BSC Conguration Data Types


Based on the system requirements and the location for saving the data, the BSC conguration
data is classied into different types.

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BSC Product Description

BSC Data Check

The BSC conguration data is classied into LMT conguration data, and GOMU conguration
data in terms of the data location.

LMT conguration data


In ofine conguration mode, you can congure the BSC data by using the data
conguration wizards, and then save the conguration data in the LMT memory. You can
save the conguration data by backing up the local data.

GOMU conguration data


The data, saved in the database of the GOMU memory, provides the basis for the operation
of the GOMU. After dynamic conguration, the GOMU updates the data in the GOMU
memory database.

Based on system requirements, the BSC conguration data is classied into the minimum
conguration data and the dynamic conguration data.

Minimum conguration data


The minimum conguration data is provided by the system automatically and is saved in
the directory Local Manager\software version\Cfg\SysData. The congured data is the
minimum conguration data for the normal operation of the LMT in ofine mode. The
minimum conguration data of the GOMU is mini_Cfg_lmt12.DAT and mini_Cfg_lmt0.DAT
respectively.

Dynamic conguration data


The dynamic conguration data is generated on the GOMU when you perform
congurations on the LMT in online mode.

NOTE
The les in the directory \Local Manager\software version\Cfg\SysData are
mandatory for the normal operation of the LMT. The les cannot be modied or
deleted.

BSC Data Check


The BSC data check consists of the data validity check and data consistency check.

BSC Data Validity Check


The BSC data validity check function is used to check whether conguration commands comply
with the conguration rules and the related syntactic rules.
The BSC data validity check is performed on the basis of the following aspects: whether a
conguration complies with the conguration rules and whether an MML script le complies
with the syntactic rules. When a conguration is performed or an MML command is run, the
BSC performs data validity check. If the check result shows that the conguration is incorrect
or the MML command does not run properly, the BSC terminates the conguration or the
running of the command. At the same time, a warning message is displayed.

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BSC Data Synchronization

Chapter 12: OM of the BSC

BSC Data Consistency Check


The BSC data consistency check consists of the following aspects:

Check of the data consistency between the active and standby GOMUs
If the BSC is congured with the active and standby GOMUs, the data on the active GOMU
must be the same as that on the standby GOMU, thus ensuring the reliability of the BSC. If
the active GOMU is faulty, the standby GOMU takes over the work of the active GOMU
after an active/standby switchover.

Check of the data consistency between the GOMU and the other boards
If the data on a service board is inconsistent with that on the GOMU, the system cannot
run stably. In addition, some data congured on the LMT cannot take effect on the host.
Figure 12-4 shows the procedure of the BSC data consistency check.

Figure 12-4 Procedure of the BSC data consistency check

The procedure of the BSC data consistency check is as follows:


1.

You can issue a data consistency check command to the GOMU on the LMT.

2.

The GOMU analyzes the parameters of the command and checks whether the data in the
board database is consistent with that in the GOMU database.

3.

When the comparison is complete, the GOMU generates a result le and sends it to the
LMT.

BSC Data Synchronization


If a data consistency check nds that the data is inconsistent, the BSC data synchronization is
enabled to synchronize the data on each board with the data stored in the GOMU database.

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BSC Product Description

BSC Performance Management

If a data consistency check nds that the data is inconsistent, you can perform synchronization
operations on the LMT to ensure the data consistency. The data on each board should be
consistent with the data in the GOMU database; the data on the standby GOMU should be
consistent with the data on the active GOMU. Figure 12-5 shows the BSC data synchronization
procedure.

Figure 12-5

BSC data synchronization procedure

The BSC data synchronization procedure is as follows:


1.

You can issue a synchronization command to the GOMU on the LMT.

2.

The GOMU analyzes the parameters of the command and synchronizes the data on each
board with the data in the GOMU database.

3.

Once the update is complete, the GOMU sends the synchronization result to the LMT.

BSC Performance Management


The BSC performance management involves collecting, analyzing, and querying performance
data.
The performance measurement results generated within the latest 15 days will be stored by
the BSC and those beyond the latest 15 days will be deleted.
Figure 12-6 illustrates the BSC performance management process.

Figure 12-6

BSC performance management process

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BSC Alarm Management

Chapter 12: OM of the BSC

By default, the BSC performance management process is as follows:


1.

You can register a measurement task and specify the object, time, and item attributes of
the task on the OMC-S/T client.

2.

Based on the measurement task, the OMC-S/T server modies the measurement task
le, sends it to the GOMU, and issues a command to activate the modied measurement
task le.

3.

Based on the modied measurement task le, the GOMU noties service boards to collect
data based on the new requirements. The GOMU receives the measurement results from
the service boards and saves them as les.

4.

The GOMU noties the OMC-S/T server of the measurement results and uploads the
les to the OMC-S/T server. The OMC-S/T server processes the les and saves them to
the database.

5.

Based on the measurement task registered by the OMC-S/T client, the OMC-S/T server
extracts the relevant results from the database, calculates them, and sends them to the
OMC-S/T client.

BSC Alarm Management


The BSC alarm management involves monitoring the operating status of the BSC and reporting
alarm information in real time. Therefore, appropriate measures can be taken in time.

BSC Alarm Management


The BSC alarm management has the following functions:

Alarm ltering
The BSC can lter the repetitive fault alarms, recovery alarms, and event alarms.

Alarm shielding
Operators can shield an alarm by alarm ID. Alternatively, they can shield a specic alarm
or all alarms of a cell, BTS, or board by setting alarm shielding conditions, thus reducing
the number of reported derivative alarms.

Alarm alert
When a fault alarm occurs, the BSC can notify the operators by Email, icon ash, phone,
short message, terminal sound, audible and visual indication of alarm box.

Alarm information processing


You can browse alarm information in real time, query history alarm information, and handle
alarms based on the handling suggestions available from the online help of the BSC. The
BSC can store 100, 000 pieces of history alarm information generated in the latest 90 days.

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BSC Product Description

BSC Alarm Management

BSC Alarm Management Mechanism


The alarm management process consists of alarm generation, alarm reporting, and alarm
handling. Figure 12-7 shows the alarm management process of the BSC.

Figure 12-7 Alarm management process of the BSC

Each board detects and reports alarms to the GOMU automatically. The GOMU classies these
alarms into different levels and sends them to the LMT or to the OMC-S/T server. You can
manage the alarms using the LMT or the OMC-S/T client.
The alarm management module of the GOMU performs the following functions:

Alarm storage
The alarm management module of the GOMU stores the alarms reported by each board in
the GOMU alarm database.

Alarm processing
The alarm management module of the GOMU processes the operation commands from the
LMT or OMC-S/T client. There commands include querying active alarms, querying alarm
logs, and modifying alarm conguration items.

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BSC Loading Management

Chapter 12: OM of the BSC

Driving of the Alarm Box


The alarm box generates audible and visual alarms. The red, orange, yellow, and green alarm
indicators on the alarm box corresponds to the critical, major, minor, and warning alarms.
Different alarm severity levels have different alarm sounds. Figure 12-8 shows the working
principle of the alarm box that is connected to the LMT.

Figure 12-8

Working principle of the alarm box

The alarm box is connected to the LMT, GOMU or OMC-S/T through the serial port. When an
alarm is reported, the alarm forward management module in the LMT instructs the alarm box
to generate an audible and visual alarm. You can stop alarm sounds, disable alarm indicators,
and reset the alarm box through the LMT.

NOTE
One LMT can be connected to only one alarm box.

BSC Loading Management


The BSC loading management involves managing the process of loading programs or data les
to boards after the BSC subracks are started or restarted.

BSC Loading System


The GOMU, the GSCU in the GMPS, and the GSCU in the main GTCS play important roles
during the BSC loading process.

The GOMU serves as the center of the entire BSC loading management process. The
loading and power-on of the GOMU are independent of other boards. The GOMU processes
the loading control requests of the GSCU in the GMPS.

The GSCU in the GMPS serves as the subcenter of the BSC loading management process.
It processes the loading control requests of the service boards in the GMPS and GEPS.
If the OM link between the GMPS and the main GTCS is normal, the GSCU in the GMPS
processes all the loading control requests from the service boards in all the GTCSs.

The GSCU in the main GTCS serves as the subcenter of the GTCS loading management
process. If the OM link between the GMPS and the main GTCS is disconnected, the GSCU
in the main GTCS processes all the loading control requests from the service boards in
all the GTCSs.

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BSC Loading Management

BSC Loading Process


The BSC loading process varies with the combination modes of BSC subracks and with the
location of the GTCS.

In BM/TC separated conguration mode, the GTCS is congured on the BSC side. For the
BSC loading process in this case, see Figure 12-9.

In BM/TC separated conguration mode, the GTCS is congured on the MSC side, and the
OM link on the Ater interface serves as the loading path. For the BSC loading process in
this case, see Figure 12-10.

Figure 12-11 shows the BSC loading process in BM/TC combined or A over IP conguration
mode.

Figure 12-9 BSC loading process (1)

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BSC Loading Management

Chapter 12: OM of the BSC

Figure 12-10 BSC loading process (2)

Figure 12-11 BSC loading process (3)

Assume that in BM/TC separated conguration mode, the GTCS is congured on the BSC side,
as shown in Figure 12-9. In this case, the BSC loading process is described as follows:

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BSC Product Description

1.

BSC Upgrade Management

After the GSCU in the GMPS is started, it broadcasts the BOOTP request to the GOMU.
If the GOMU is communicating with the LMT, it processes the request.
If the GOMU is not started or does not communicate with the LMT, the GSCU in the
GMPS loads program les from the Flash.

2.

After receiving the BOOTP request, the GOMU writes the Load Key, IP address, and version
information into the BOOTP acknowledge message, which is then transmitted to the GSCU.

3.

On receiving the BOOTP acknowledgement message, the GSCU in the GMPS loads the
program les and data les according to the Load Key.

4.

The GSCU in the GMPS forwards the BOOTP requests from other boards in the GEPS or
GTCS to the GOMU.

5.

After receiving the BOOTP requests, the GOMU sends acknowledgment messages to the
other boards.

6.

On receiving the acknowledgement messages, the other boards load the program les
and data les according to the Load Keys.

7.

The BSC loading process is complete.

BSC Upgrade Management


The BSC can be upgraded to a later version. The BSC upgrade management involves the
management of the procedures for upgrading the OMU software, LMT software, and patch
software. The BSC supports two upgrade modes: remote upgrade and local upgrade.

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BSC Upgrade Management

Chapter 12: OM of the BSC

The BSC upgrade process is as follows:


1.

Backing up the data conguration le


Back up the data conguration le on the LMT before upgrade.

2.

Upgrading the LMT software of the BSC


Install the latest LMT software.

3.

Upgrading the OMU software on the GOMU


Uninstall the running OMU software, install the latest OMU software, and then start
the OMU software.

4.

Restoring data
On the LMT, load the data conguration le that is backed up before upgrade.

5.

Upgrading the board software


Load software to the boards in the GMPS, GEPS, and GTCS. The operation order is as
follows: GMPS, GTCS that matches the GMPS, GEPS, and GTCS that matches the GEPS.

6.

Upgrading the level-2 BIOS of the board


On the LMT, load the latest BIOS les from the GOMU to the boards.

7.

Upgrading patch software


On the LMT, load, activate, and run patch software.

8.

Upgrading software license


On the LMT, upgrade and activate the software license.

NOTE
If no patch software needs to be upgraded, you can skip this step during the
BSC upgrade.

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Chapter

13
BSC Signal Flow

The BSC signal ow consists of the CS service signal ow, PS service signal ow, signaling
ow, and OM signal ow.
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BSC CS Signal Flow

Chapter 13: BSC Signal Flow

BSC CS Signal Flow

After a CS call is established, the MS and the network communicate with each other. In this
case, the signal ow is referred to as the CS signal ow. The method of processing the BSC
CS signal ow varies with the transmission modes adopted on the A interface, and also varies
with the combination modes of BSC subracks.

NOTE
For details on the transmission modes on the A interface, refer to Transmission and
Networking on the A Interface on page 14-4.

Abis over TDM + A over TDM


The TDM transmission is used on both the A interface, and the BM and the TC are congured in
different subracks. For the BSC CS signal ow in this case, see Figure 13-1.

Figure 13-1

CS signal ow (1)

As shown in Figure 13-1, the CS signal ow in the uplink is as follows:


1.

The uplink CS signals are sent from the BTS to the GEIUB/GOIUB in the GMPS/GEPS.

2.

The CS signals are demultiplexed in the GEIUB/GOIUB. One CS signal uses a 64 kbit/s
timeslot and is transmitted to the GEIUT/GOIUT through the GTNU.

3.

The CS signals are multiplexed in the GEIUT/GOIUT. One full-rate CS signal uses a 16
kbit/s sub-timeslot, and one half-rate CS signal uses an 8 kbit/s sub-timeslot. The CS
signals are then transmitted to the GEIUT/GOIUT in the GTCS over the Ater interface.

4.

The CS signals are de-multiplexed in the GEIUT/GOIUT of the GTCS. One CS signal uses a
64 kbit/s timeslot and is transmitted to the GDPUX through the GTNU.

5.

The GDPUX performs voice coding/decoding and rate matching on the CS signals, which
are converted into 64 kbit/s PCM signals. The 64 kbit/s PCM signals are transmitted to
the GEIUA/GOIUA through the GTNU, and then are transmitted to the MSC over the A
interface.

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Abis over TDM + A over IP

The TDM transmission is used on the A interface, and the BM and the TC are congured in the
same subrack. For the BSC CS signal ow in this case, see Figure 13-2.

Figure 13-2

CS signal ow (2)

As shown in Figure 13-2, the CS signal ow in the uplink is as follows:


1.

The uplink CS signals are sent from the BTS to the GEIUB/GOIUB in the GMPS/GEPS.

2.

The CS signals are de-multiplexed in the GEIUB/GOIUB. One CS signal uses a 64 kbit/s
timeslot and is transmitted to the GDPUX through the GTNU.

3.

The GDPUX performs voice coding/decoding and rate matching on the CS signals, which
are converted into 64 kbit/s PCM signals. The 64 kbit/s PCM signals are transmitted to
the GEIUA/GOIUA through the GTNU, and then are transmitted to the MSC over the A
interface.

Abis over TDM + A over IP


The TDM transmission and IP transmission are used on the Abis interface and A interface
respectively. For the BSC CS signal ow in this case, see Figure 13-3.

Figure 13-3

CS signal ow (5)

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Abis over TDM + A over IP

Chapter 13: BSC Signal Flow

As shown in Figure 13-3, the CS signal ow in the uplink is as follows:


1.

The uplink CS signals are sent from the BTS to the GEIUB/GOIUB in the GMPS/GEPS.

2.

The CS signals are de-multiplexed in the GEIUB/GOIUB. One CS signal uses a 64 kbit/s
timeslot and is transmitted to the GDPUX through the GTNU.

3.

The GDPUX converts the CS signals into RTP frames, compresses the redundant
information, eliminates jitter, and handles delay.

4.

The GSCU transmits the CS signals to the GFGUA/GOGUA, which are then transmitted
to the MGW over the A interface.

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BSC PS Signal Flow

BSC PS Signal Flow

After a PS communication is established, the MS and the network communicate with each other.
In this case, the signal ow is referred to as the PS signal ow.
When the TDM transmission is used on the Abis interface. For the BSC PS signal ow in this
case, refer to Figure 13-4.

Figure 13-4 PS signal ow

The PS signal ow on the uplink is as follows:


1.

The packet data is sent from the BTS to the GEIUB in the GMPS/GEPS. The packet data
uses one to four 16 kbit/s sub-timeslots on the Abis interface, depending on the modulation
and coding scheme, such as CS1-CS9 or MCS1MCS9.

2.

The GEIUB transmits the packet data to the GTNU. After receiving the data, the GTNU
transmits the signals to the GDPUP.

3.

The GDPUP performs format conversion, and then transmits the data to the GEPUG/GFGUG
through the GSCU.

4.

The GEPUG/GFGUG processes the packet data at layer 1 and at a part of the NS layer on
the Gb interface. Then, the packet data is transmitted to the SGSN over the Gb interface.

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BSC Signaling Flow

Chapter 13: BSC Signal Flow

BSC Signaling Flow

The BSC signaling ow consists of the signaling ow on the Abis interface, A interface, and Gb
interface.
17. Author Comment:
This part autogeneratedd in source documentMay nee to be recrated by Cut and
paste

Signaling Flow on the Abis Interface


This section describes the signaling folw on the Abis interface.

NOTE
The GXPUM originates and terminates all the signaling ows of the BSC.
The TDM transmission is used on the Abis interface. For the signaling ow on the Abis interface
in this case, see Figure 13-5.

Figure 13-5 Protocol stack on the Abis interface (Abis over TDM)

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Signaling Flow on the A Interface

Figure 13-6 shows the signaling ow on the Abis interface.

Figure 13-6 Signaling Flow on the Abis Interface (Abis over TDM)

The signaling ow on the Abis interface is as follows:


1.

The signaling is transmitted to the GEIUB/GOIUB in the GMPS/GEPS over the Abis
interface. Then, the signaling is transmitted to the GSCU.

2.

The GSCU transmits the signaling to the GXPUT/GXPUM.

3.

The GXPUT/GXPUM processes the signaling according to the LAPD and RR protocols. The
GXPUM processes the signaling according to the BTSM protocol.

Signaling Flow on the A Interface


The protocol stack and signaling ow on the A interface vary with the transmission modes on
the A interface.
The A interface is the logical interface between the BSC and the MSC. The BSC internal signaling
ow from the A interface varies, depending on the signaling protocols used on the A interface.

Signaling Flow on the A Interface (A over TDM)


When TDM transmission is used on the A interface, the E1 or STM-1 transmission is used
on the physical layer. The transmission on the data link layer complies with the SS7 MTP2
protocol. The transmission on the network layer complies with the MTP3 and SCCP protocols.
The transmission on the application layer complies with the BSSAP protocol and the layer-3
protocols on the Um interface. Figure 13-7 shows the protocol stack on the A interface.

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Signaling Flow on the A Interface

Figure 13-7

Chapter 13: BSC Signal Flow

Protocol stack on the A interface (A over TDM)

The BSC internal signaling ow from the A interface varies with the conguration modes of the
BSC subracks.

Figure 13-8 shows the BSC internal signaling ow in the BM/TC separated conguration
mode.

Figure 13-9 shows the BSC internal signaling ow in the BM/TC combined conguration
mode..

Figure 13-8 Signaling ow on the A interface (A over TDM) (BM/TC separated)

As shown in Figure 13-8, the BSC internal signaling ow from the A interface is as follows:
1.

In the GMPS/GEPS, the GXPUM/GXPUT processes the signaling according to the MTP3,
SCCP, and BSSAP protocols. The GEIUT processes the signaling according to the MTP2
protocol.

2.

The signaling is transparently transmitted in the GTCS, and then is transmitted to the
MSC over the A interface.

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Signaling Flow on the A Interface

Figure 13-9 Signaling ow on the A interface (A over TDM) (BM/TC combined)

As shown in Figure 13-9, the BSC internal signaling ow from the A interface is as follows:
1.

In the GMPS/GEPS, the GXPUM/GXPUT processes the signaling according to the MTP3,
SCCP, and BSSAP protocols.

2.

The GEIUA/GOIUA processes the signaling according to the MTP2 protocol. Then, the
signaling is transmitted to the MSC over the A interface.

Signaling Flow on the A Interface (A over IP)


If IP transmission is used on the A interface, the E1 or STM-1 transmission is used on
the physical layer. The transmission on the data link layer complies with the SigTRAN
M3UA/SCTP/IP protocols. The transmission on the network layer complies with the SS7 SCCP
protocol. The transmission on the application layer complies with the DATP and BSSAP
protocols. Figure 13-10 shows the protocol stack on the A interface.

Figure 13-10 Protocol stack on the A interface (A over IP)

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Signaling Flow on the Gb Interface

Chapter 13: BSC Signal Flow

Figure 13-11 shows the signaling ow on the A interface.

Figure 13-11

Signaling ow on the A interface (A over IP)

The BSC internal signaling ow from the A interface is as follows:


1.

In the GMPS/GEPS, the GXPUM/GXPUT processes the signaling according to the BSSAP,
SCCP, SCTP, and M3UA protocols. Then, the signaling is transmitted to the GFGUA/GOGUA
through the GSCU.

2.

The GFGUA/GOGUA processes the signaling according to the IP protocol. Then, the
signaling is transmitted to the MSC through the A interface.

Signaling Flow on the Gb Interface


This section describes the protocol stack and signaling ow on the Gb interface.

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BSC Product Description

Signaling Flow on the Gb Interface

The Gb interface is the logical interface between the BSC and the SGSN. The E1 or FE/GE
transmission is used on the physical layer. The transmission on the data link layer complies with
the NS protocol, and the sub NS layer of the NS protocol complies with the FR or IP protocol.
The transmission on the application layer complies with the BSSGP protocol. Figure 13-12
shows the protocol stack on the Gb interface.

Figure 13-12

Protocol stack on the Gb interface

Figure 13-13 shows the signaling ow on the Gb interface.

Figure 13-13

Signaling ow on the Gb interface

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Signaling Flow on the Gb Interface

Chapter 13: BSC Signal Flow

The BSC internal signaling ow from the Gb interface is as follows:


1.

The signaling is transmitted to the GMPS/GEPS over the Gb interface.


If the sub NS layer of the NS protocol complies with the FR protocol, the Gb interface
board is the GEPUG. If the sub NS layer of the NS protocol complies with the IP protocol,
the Gb interface board is the GFGUG.

2.

The GSCU transmits the signaling to the GXPUM.

3.

The GXPUM processes the signaling according to the NS and BSSGP protocols.

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BSC Product Description

BSC OM Signal Flow

BSC OM Signal Flow

The BSC OM signal ow is initiated when you operate and maintain the BSC. The BSC OM signal
ow varies with the combination modes of the BSC subracks.
18. Author Comment:
This part autogenerated in source documentMay nee to be recreated by Cut and
paste

BSC OM Signal Flow (BM/TC Separated)


The BSC OM signal ow (BM/TC separated) refers to the signal ow that is generated when OM
is performed on the BSC and when the BM and TC are congured in different subracks.
The BSC internal OM signal ow varies with the installation position of the GTCS.

GTCS Congured on the BSC Side


The GTCS is congured on the BSC side. For the OM signal ow in the BSC in this case, see
Figure 13-14.

Figure 13-14 OM signal ow (GTCS congured on the BSC side)

As shown in Figure 13-14, the OM signal ow in the BSC is as follows:

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BSC OM Signal Flow (BM/TC Separated)

Chapter 13: BSC Signal Flow

OM signal ow in the GMPS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the GSCU in the
GMPS. The GSCU then transmits the OM signal to the service boards that require
maintenance.

OM signal ow in the GEPS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the GSCU in the
GMPS. The GSCU then transmits the OM signal to the GSCU in the GEPS.

c.

In the GEPS, the GSCU transmits the OM signal to the service boards that require
maintenance.

OM signal ow in the GTCS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the GSCU in the
GMPS. The GSCU then transmits the OM signal to the GSCU in the main GTCS.

c.

In the main GTCS, the GSCU transmits the OM signal to the service boards that
require maintenance. Alternatively, the GSCU in the main GTCS transmits the OM
signal to the GSCU in an extension GTCS. Then, in the extension GTCS, the GSCU
transmits the OM signal to the service boards that require maintenance.

GTCS Congured on the MSC Side


The GTCS is congured on the MSC side. For the OM signal ow in the BSC in this case,
see Figure 13-15.

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BSC Product Description

BSC OM Signal Flow (BM/TC Separated)

Figure 13-15 OM signal ow (GTCS congured on the MSC side)

As shown in Figure 13-15, the OM signal ow in the BSC is as follows:

OM signal ow in the GMPS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the GSCU in the
GMPS. The GSCU then transmits the OM signal to the service boards that require
maintenance.

OM signal ow in the GEPS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the GSCU in the
GMPS. The GSCU then transmits the OM signal to the GSCU in the GEPS.

c.

In the GEPS, the GSCU transmits the OM signal to the service boards that require
maintenance.

OM signal ow in the GTCS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the


GEIUT/GOIUT in the GMPS. Then, the GEIUT/GOIUT in the GMPS transmits the OM
signal to the GEIUT/GOIUT in the main GTCS through the Ater interface.

c.

In the main GTCS, the GSCU transmits the OM signal to the service boards that
require maintenance. Alternatively, the GSCU in the main GTCS transmits the OM
signal to the GSCU in an extension GTCS. Then, in the extension GTCS, the GSCU
transmits the OM signal to the service boards that require maintenance.

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BSC OM Signal Flow (BM/TC Combined)

Chapter 13: BSC Signal Flow

BSC OM Signal Flow (BM/TC Combined)


The BSC OM signal ow (BM/TC combined) refers to the signal ow that is generated when OM
is performed on the BSC and when the BM and TC are congured in the same subrack.
Figure 13-16 shows the OM signal ow in the BSC in BM/TC combined conguration mode.

Figure 13-16

BSC OM signal ow (BM/TC combined)

As shown in Figure 13-16, the OM signal ow in the BSC is as follows:

OM signal ow in the GMPS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the GSCU in the
GMPS. The GSCU then transmits the OM signal to the service boards that require
maintenance.

OM signal ow in the GEPS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the GSCU in the
GMPS. The GSCU then transmits the OM signal to the GSCU in the GEPS.

c.

In the GEPS, the GSCU transmits the OM signal to the service boards that require
maintenance.

BSC OM Signal Flow (A over IP)


The BSC OM signal ow (A over IP) refers to the signal ow that is generated when OM is
performed on the BSC and when the IP transmission is used on the A interface.

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BSC Product Description

BSC OM Signal Flow (A over IP)

Figure 13-17 shows the OM signal ow in the BSC in A over IP conguration mode.

Figure 13-17 BSC OM signal ow (A over IP)

As shown in Figure 13-17, the OM signal ow in the BSC is as follows:

OM signal ow in the GMPS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the GSCU in the
GMPS. The GSCU then transmits the OM signal to the service boards that require
maintenance.

OM signal ow in the GEPS


a.

The OM signal is transmitted from the LMT or the OMC-S/T to the GOMU.

b.

After being processed by the GOMU, the OM signal is transmitted to the GSCU in the
GMPS. The GSCU then transmits the OM signal to the GSCU in the GEPS.

c.

In the GEPS, the GSCU transmits the OM signal to the service boards that require
maintenance.

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BSC OM Signal Flow (A over IP)

13-18

Chapter 13: BSC Signal Flow

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Chapter

14
BSC Transmission and Networking

This section describes various transmission and networking modes between the BSC and other
NEs.
19. Author Comment:
This part autogeneratedd in source documentMay nee to be recrated by Cut and
paste

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Transmission and Networking on the Abis Interface

Chapter 14: BSC Transmission and Networking

Transmission and Networking on the Abis Interface

This section describes the networking between the BSC and the BTS.

Transmission Modes on the Abis Interface


The TDM transmission mode is used on the Abis interface. Abis over TDM indicates that the
TDM transmission is used on the Abis interface. In this case, the Abis interface board is the
GEIUB/GOIUB, and the transmission network between the BSC and the BTS is the Synchronous
Digital Hierarchy (SDH) / Plesiochronous Digital Hierarchy (PDH) network.

Abis over TDM


In Abis over TDM networking mode, the Abis interface board in the BSC is the GEIUB/GOIUB,
which provides E1 ports and STM-1 ports.

Figure 14-1 shows the E1-based TDM networking on the Abis interface.

Figure 14-2 shows the STM-1-based TDM networking on the Abis interface.

Figure 14-1

E1-based TDM networking on the Abis interface

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BSC Product Description

Abis over TDM

Figure 14-2

STM-1-based TDM networking on the Abis interface

NOTE
If the BTSs connected to the BSC are distributed on different PDH/SDH rings,
additional Add Drop Multiplexer (ADM) / Digital Cross Connect System (DXC) devices
should be used.
Advantages: The networking mode features maturity, exible QoS (Quality of Service), and
security. Telecom operators can make full use of the SDH/PDH transmission network resources.
Disadvantages: Compared with the IP transmission networking mode, the cost of this
networking mode is high.

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Transmission and Networking on the A Interface

Chapter 14: BSC Transmission and Networking

Transmission and Networking on the A Interface

This section describes the transmission and networking between the BSC and the MSC/MGW.

Transmission Modes on the A Interface


The following transmission modes can be used on the A interface:

A over TDM
A over TDM indicates that the TDM transmission is used on the A interface. In this case,
the A interface board is the GEIUA/GOIUA, and the transmission network between the BSC
and the MSC/MGW is the SDH/PDH network.

A over IP
A over IP indicates that layer 3 of the A interface protocol stack uses the IP protocol. In
this case, the A interface board is the GFGUA/GOGUA, and the transmission network
between the BSC and the MGW is the IP network.

A over TDM
In A over TDM networking mode, the A interface board in the BSC is the GEIUA/GOIUA, which
provides E1 ports and STM-1 ports. The A over IP networking mode varies with whether the TC
function is performed by the BSC.

E1 Transmission on the A Interface


The TC function is performed by the BSC. For the networking mode in this case, see
Figure 14-3.
The TC function is performed by the MGW. For the networking mode in this case, see
Figure 14-4.

STM-1 Transmission on the A Interface


The TC function is performed by the BSC. For the networking mode in this case, see
Figure 14-5.
The TC function is performed by the MGW. For the networking mode in this case, see
Figure 14-6.

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BSC Product Description

A over TDM

Figure 14-3 E1-based TDM networking on the A interface (1)

Figure 14-4 E1-based TDM networking on the A interface (2)

Figure 14-5 STM-1-based TDM networking on the A interface (1)

Figure 14-6 STM-1-based TDM networking on the A interface (2)

Advantages: The networking mode features maturity, exible QoS, and security. Telecom
operators can make full use of the SDH/PDH transmission network resources.
Disadvantages: Compared with the IP transmission networking mode, the cost of this
networking mode is high.

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A over IP

Chapter 14: BSC Transmission and Networking

A over IP
If IP transmission is used on the A interface, the TC function is performed by the MGW.
In A over IP networking mode, the A interface board in the BSC is the GFGUA/GOGUA, which
provides FE/GE electrical ports and GE optical ports. See Figure 14-7.

Figure 14-7 IP networking on the A interface

Advantages: This networking mode provides large-capacity bandwidth and reliable transmission
on the A interface. It also supports the evolution from GSM networks to IP networks.
Disadvantages: The BSC must be connected to dedicated MGW.

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BSC Product Description

Transmission and Networking on the Ater Interface

Transmission and Networking on the Ater Interface

This section describes the transmission and networking between the BM subrack and the
TC subrack.
When the BM and the TC are congured in different subracks, they communicate with each
other over the Ater interface. The Ater interface supports only the TDM networking mode.
Based on the installation positions of the GTCS, several transmission and networking modes
can be used on the Ater interface.

The GTCS is congured on the BSC side, and the E1 transmission is used on the Ater
interface. For the networking on the Ater interface in this case, see Figure 14-8.

The GTCS is congured on the MSC side, and the E1 transmission is used on the Ater
interface. For the networking on the Ater interface in this case, see Figure 14-9.

The GTCS is congured on the MSC side, and the STM-1 transmission is used on the Ater
interface. For the networking on the Ater interface in this case, see Figure 14-10.

Figure 14-8 E1-based networking on the Ater interface (GTCS congured on the
BSC side)

Figure 14-9 E1-based networking on the Ater interface (GTCS congured on the
MSC side)

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Transmission and Networking on the Ater Interface

Chapter 14: BSC Transmission and Networking

Figure 14-10 STM-1-based networking on the Ater interface (GTCS congured on


the MSC side)

14-8

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BSC Product Description

Transmission and Networking on the Gb Interface

Transmission and Networking on the Gb Interface

This section describes the transmission and networking between the BSC and the SGSN. Two
transmission modes can be used on the Gb interface: Gb over FR and Gb over IP.

Transmission Modes on the Gb Interface


The following transmission modes can be used on the Gb interface:

Gb over FR
Gb over FR indicates that the Frame Relay (FR) protocol is used on the sub NS layer of the
Gb interface protocol stack. In this case, the Gb interface board is the GEPUG, and the
transmission network between the BSC and the SGSN is the FR network.

Gb over IP
Gb over IP indicates that the IP protocol is used on the sub NS layer of the Gb interface
protocol stack. In this case, the Gb interface board is the GFGUG, and the transmission
network between the BSC and the SGSN is the IP network.

Gb over FR
In Gb over FR networking mode, the transmission network between the BSC and the SGSN is
the FR network. The Gb interface board in the BSC is the GEPUG, which provides E1 ports,
as shown in Figure 14-11.

Figure 14-11 E1-based FR networking on the Gb interface

Advantages: The networking mode features maturity and can make full use of the existing FR
network.
Disadvantages: The bandwidth on the Gb interface is insufcient, so large-capacity
requirements of data services cannot be met.

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Gb over IP

Chapter 14: BSC Transmission and Networking

Gb over IP
In Gb over IP networking mode, the transmission network between the BSC and the SGSN is
the IP network. The Gb interface board in the BSC is the GFGUG, which provides FE/GE ports,
as shown in Figure 14-12.

Figure 14-12 FE/GE-based IP networking on the Gb interface

Advantages: Compared with the FR networking mode, the bandwidth on the Gb interface in
the IP networking mode is greatly increased, thus reducing the costs of network construction
and OM.
Disadvantages: The transmission in Gb over IP networking mode is less reliable than that
in Gb over FR networking mode.

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Chapter

15
BSC Technical Specications

The BSC technical specications consist of the capacity specications, engineering


specications, physical port specications, reliability specications, clock precision
specications, noise and safety compliance, and environment specications.
20. Author Comment:
This part autogeneratedd in source documentMay nee to be recrated by Cut and
paste

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BSC Capacity Specications

Chapter 15: BSC Technical Specications

BSC Capacity Specications

The BSC capacity specications consist of CS service capacity specications and PS service
capacity specications.
Table 15-1 lists the capacity specications of the BSC.

Table 15-1

Capacity specication of the BSC


Value

Specication
Maximum number of BTSs

2,048

Maximum number of cells

2,048

Maximum number of TRXs

2,048

BHCA

3,500,000

Maximum number of subscribers

650,000

Maximum trafc volume

13,000 Erl

Maximum number of PDCHs that can be


congured

15,360

Maximum number of TBFs supported by a


PDCH

Uplink: 7

Downlink: 8

EDGE RTT specication

200 ms

Throughput on the Gb interface

512 Mbit/s

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BSC Product Description

BSC Engineering Specications

BSC Engineering Specications

The BSC engineering specications consist of the structural specications, power consumption
specications, and electrical specications.

Structural Specications
Table 15-2 lists the structural specications of the BSC.

Table 15-2 Structural specications


Value

Specication
Cabinet standard

IEC60297 standard and IEEE standard

Cabinet outline dimensions

2,200mm (height) 600mm (width) 800mm (depth)

Available cabinet space


height

46 U

Weight of the cabinet

Empty cabinet 150 kg; cabinet in full conguration


350 kg

Load-bearing capability of
the equipment room

450 kg/m2

Power Consumption Specications


Table 15-3 lists the power consumption specications of the BSC.

Table 15-3 Power consumption specications


Recommended Conguration

512 TRXs

1,024 TRXs

1,536 TRXs

2,048 TRXs

Power Consumption (Ater


over STM-1, Abis over E1,
Excluding the GTCS)

700 W

1,080 W

1,360 W

1,530 W

Power Consumption (A over


STM-1, Abis over E1, BM/TC
Combined)

890 W

1,510 W

1,950 W

2,325 W

Power Consumption (A over


E1, Abis over E1, BM/TC
Combined)

1,325 W

2,320 W

3,250 W

3,340 W

NOTE

GTCS: GSM TransCoder Subrack

BM: Basic Module

TC: Transcoder

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Electrical Specications

Chapter 15: BSC Technical Specications

Electrical Specications
Table 15-4 describes the power supply and electromagnetic compatibility (EMC) specications
of the BSC.

Table 15-4

Power supply and EMC specications of the BSC


Value

Specication
Power supply

-48 V DC

EMC

Complies with the ETSI EN 300 386 V1.3.2 (2003-05)

15-4

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BSC Product Description

BSC Physical Interfaces

BSC Physical Interfaces

The BSC physical interfaces consist of the transmission interfaces and clock interfaces.

Transmission Interfaces of the BSC


The BSC has external transmission interfaces and internal transmission interfaces. Table 15-5
lists the specications of the external transmission interfaces, and Table 15-6 lists the
specications of the internal transmission interfaces.

Table 15-5

Specications of the external transmission interfaces of the BSC

Transmission
E1

STM-1

FE

GE

Board or
Equipment

Connector

Remarks

GEIUA

DB44

The GEIUA provides four E1 ports, which


carry 32 E1 links and are used for the TDM
transmission on the A interface.

GEIUB

DB44

The GEIUB provides four E1 ports, which


carry 32 E1 links and are used for the TDM
transmission on the Abis interface.

GEPUG

DB44

The GEPUG provides four E1 ports, which


carry 32 E1 links and are used for the FR
transmission on the Gb interface.

GOIUA

LC/PC

The GOIUA provides an STM-1 port, which


carries 63 E1 links. It is used for the TDM
transmission on the A interface.

GOIUB

LC/PC

The GOIUB provides an STM-1 port, which


carries 63 E1 links. It is used for the TDM
transmission on the Abis interface.

GFGUA

RJ45

The GFGUA provides eight FE ports, which


are used for the IP transmission on the A
interface.

GFGUG

RJ45

The GFGUG provides eight FE ports, which


are used for the IP transmission on the Gb
interface.

LAN switch

RJ45

The LAN switch provides 24 FE ports.

GFGUA

RJ45

The GFGUA provides two GE electrical


ports, which are used for the IP transmission
on the A interface.

GFGUG

RJ45

The GFGUA provides two GE electrical


ports, which are used for the IP transmission
on the Gb interface.

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Clock Interfaces of the BSC

Chapter 15: BSC Technical Specications

Table 15-5 Specications of the external transmission interfaces of the BSC


(Continued)
Board or
Equipment

Transmission

GOGUA

Remarks

Connector
RJ45

The GOGUA provides two GE optical ports,


which are used for the IP transmission on
the A interface.

Table 15-6 Specications of the internal transmission interfaces of the BSC


Board or
Equipment

Transmission

Remarks

Connector

E1

GEIUT

DB44

The GEIUT provides four E1 ports, which


carry 32 E1 links and are used for the TDM
transmission on the Ater interface.

STM-1

GOIUT

LC/PC

The GOIUT provides an STM-1 port, which


carries 63 E1 links. It is used for the TDM
transmission on the Ater interface.

GE

GOMU

RJ45

The GOMU provides three GE ports.

GSCU

RJ45

The GSCU provides ten FE ports, which are


used for the GE interconnection between
subracks.

TDM

GTNU

DB14

TDM high-speed serial port is used for the


connection between the GTNUs in different
subracks.

LVDS

GGCU

RJ45

The GGCU provides 10 LVDS high-speed


serial ports for the transmission of clock
signals between subracks.

Clock Interfaces of the BSC


Table 15-7 lists the specications of BSC clock interfaces.

Table 15-7 Specications of the clock interfaces of the BSC


Port

Board Name

Remarks

Connector

Input port for synchronized


clock signals

GGCU

SMB male
connector

Receives one 2.048 MHz


clock signal or 2.048 Mbit/s
code stream signal

Output port for synchronized


clock signals

GGCU

RJ45

Transmits 8 kHz clock


signals to the GSCU

Input port for reference


clock

GSCU

RJ45

Receives 8 kHz clock signals


from the GGCU

15-6

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BSC Product Description

BSC Reliability Specications

BSC Reliability Specications

The reliability specications of the BSC consist of the system availability in typical conguration,
Mean Time Between Failures (MTBF), success rate of the switchover of the active and standby
boards, Mean Time To Repair (MTTR), and entire equipment yearly repair rate.
Table 15-8 describes the reliability specications of the BSC.

Table 15-8

Reliability specications of the BSC


Value

Specication
System availability in typical conguration

99.9998%

MTBF

409,387 h

Success rate of the switchover of the active


and standby boards

99%

MTTR

1h

Entire equipment yearly repair rate

1.0%

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BSC Clock Precision Requirements

Chapter 15: BSC Technical Specications

BSC Clock Precision Requirements

The BSC clock specications consist of the clock precision, pull-in range, maximum frequency
offset, and initial maximum frequency offset.
Table 15-9 describes the clock specications of the BSC.

Table 15-9 Clock specications of the BSC


Value

Specication
Clock precision

4.6 10-6

Pull-in range

4.6 10-6

Maximum frequency offset

2 10-8/day

Initial maximum frequency offset

1 10-8

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BSC Product Description

BSC Noise and Safety Compliance

BSC Noise and Safety Compliance

The noise level and safety requirements of the BSC comprise specications pertaining to noise
control and the requirements that the BSC should meet.
Table 15-10 describes the specications of the noise and safety compliance of the BSC.

Table 15-10 Specications of the noise and safety compliance of the BSC
Value

Specication
Noise

< 7.2 bels (sound power level); The BSC meets the
requirements specied in ETS 300 753 / ISO 7779
< 65 dBA (sound pressure level); The BSC meets the
requirements specied in GR-63-Core / ANSI S1.4-1983

Security

The BSC complies with the following specications:

UL 60950

EN 60950

IEC 60825

GB 4943-2000

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BSC Environment Requirements

Chapter 15: BSC Technical Specications

BSC Environment Requirements

The BSC must comply with the environment requirements in terms of storage, transportation,
and operation.
21. Author Comment:
This part autogenerated in source documentMay nee to be recreated by Cut and
paste

BSC Storage Requirements


This section describes the requirements related to climate, waterproong conditions, biological
environment, air purity, and mechanical stress during the BSC storage.

Climatic Requirements
Table 15-11 lists the climatic requirements related to the indoor storage environment of the BSC.

Table 15-11

Climatic requirements (storage)


Value

Specication
Temperature

-40 to +70

Temperature change rate

1/min

Relative humidity

10% to 100%

Altitude

5,000 m

Air pressure

70106 kPa

Solar radiation

1,120 W/s2

Thermal radiation

600 W/s2

Wind speed

30 m/s

Waterproong Requirements
The waterproong requirements related to the indoor storage environment of the BSC are
as follows:

It should be stored indoors.

Water should not accumulate on the ground or endanger the packing case.

The equipment should be kept away from possible water leakages, such as auto
re-protection device and air conditioner.

If you have to place the equipment outdoors, ensure that:

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BSC Product Description

BSC Storage Requirements

The packing case is intact.

Waterproong measures are taken appropriately to prevent rainwater from damaging the
packing case.

Water does not accumulate on the ground or endanger the packing case.

The packing case is not exposed to direct sunlight.

Biological Environment Requirements


The biological environment requirements related to the indoor storage environment of the
BSC are as follows:

The environment should not be conducive to the growth of fungus or mildew.

There should not be rodents, such as rats.

Air Purity Requirements


The air purity requirements related to the indoor storage environment of the BSC are as follows:

There should not be explosive, conductive, magneto-conductive, or corrosive dust in the air.

The density of physically active materials should comply with the requirements listed
in Table 15-12.

The density of chemically active materials should comply with the requirements listed
in Table 15-13.

Table 15-12 Requirements for physically active materials (storage)


Physically Active Material

Unit

Density

Suspended dust

mg/m3

5.00

Falling dust

mg/m3.h

20.0

Sand

mg/m3

300

NOTE

Suspended dust: diameter 75 um

Falling dust: 75 um diameter 150 um

Sand: 150 mm diameter 1000 mm

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BSC Transportation Requirements

Chapter 15: BSC Technical Specications

Table 15-13 Requirements for chemically active materials (storage)


Unit

Chemically Active Material

Density

SO2

mg/m3

0.30

H2S

mg/m3

0.10

NO2

mg/m3

0.50

NH3

mg/m3

1.00

Cl2

mg/m3

0.10

HCI

mg/m3

0.10

HF

mg/m3

0.01

O3

mg/m3

0.05

Mechanical Stress Requirements


Table 15-14 lists the mechanical stress requirements related to the indoor storage environment
of the BSC.

Table 15-14 Mechanical stress requirements (storage)


Item

Sub Item

Sinusoidal vibration

Unsteady impact

Specications

Offset

7.0 mm

Accelerated speed

20.0m/s2

Frequency range

2 Hz to 9 Hz

9 Hz to 200 Hz

Impact response spectrum II

250 m/s2

Static payload

5 kPa

NOTE

Impact response spectrum refers to the maximum acceleration response curve


generated by the equipment under specied impact excitation. Impact response
spectrum II means that the duration of semi-sine impact response spectrum
is 6 ms.

Static payload refers to the capability of the equipment in package to bear the
pressure from the top in normal pile-up method.

BSC Transportation Requirements


This section describes the transportation requirements of the BSC in terms of climate,
waterproong, biological environment, air purity, and mechanical stress.

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BSC Transportation Requirements

Climatic Requirements
Table 15-15 lists the climatic requirements for transporting the BSC.

Table 15-15

Climatic requirements (transportation)

Item

Requirement

Temperature

-40 to +70

Temperature change rate

3/min

Relative humidity

5% to 100%

Altitude

5,000 m

Air pressure

70106 kPa

Solar radiation

1,120 W/s2

Thermal radiation

600 W/s2

Wind speed

30 m/s

Waterproong Requirements
Before transporting the equipment, ensure that:

The packing case is intact.

Waterproong measures are taken appropriately to prevent rainwater from damaging the
packing case.

Water is not accumulated inside the transportation vehicle.

Biological Environment Requirements


Before transporting the equipment, ensure that:

The environment is not conducive for the growth of fungus or mildew.

There should not be rodents, such as rats.

Air Purity Requirements


In transporting the equipment, ensure that:

There should not be explosive, conductive, magneto-conductive, or corrosive dust in the air.

The density of physically active materials should comply with the requirements listed
in Table 15-16.

The density of chemically active materials should comply with the requirements listed
in Table 15-17.

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BSC Transportation Requirements

Chapter 15: BSC Technical Specications

Table 15-16 Requirements for physically active materials (transportation)


Physically Active Material

Unit

Density

Suspended dust

mg/m3

No requirement

Falling dust

mg/m3.h

3.0

Sand

mg/m3

100

NOTE

Suspended dust: diameter 75 um

Falling dust: 75 um diameter 150 um

Sand: 150 mm diameter 1000 mm

Table 15-17 Requirements for chemically active materials (transportation)


Unit

Chemically Active Material

Density

SO2

mg/m3

0.30

H2S

mg/m3

0.10

NO2

mg/m3

0.50

NH3

mg/m3

1.00

Cl2

mg/m3

0.10

HCI

mg/m3

0.10

HF

mg/m3

0.01

O3

mg/m3

0.05

Mechanical Stress Requirements


Table 15-18 lists the mechanical stress requirements for transporting the BSC

Table 15-18 Mechanical stress requirements (transportation)


Item
Sinusoidal
vibration

Random
vibration

Sub Item

Specications

Offset

7.5 mm

Accelerated
speed

20.0m/s2

40.0m/s2

Frequency
range

2 Hz to 9 Hz

9 Hz to 200 Hz

200 Hz to 500
Hz

Spectrum
density of
accelerated
speed

10m2/s3

3m2/s3

1 m2/s3

Continued

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BSC Operating Environment Requirements

Table 15-18

Mechanical stress requirements (transportation) (Continued)

Item

Sub Item

Unsteady
impact

Specications

Frequency
range

2 Hz to 9 Hz

Impact response
spectrum II

300m/s2

Static payload

10 kPa

9 Hz to 200 Hz

200 Hz to 500
Hz

NOTE

Impact response spectrum refers to the maximum acceleration response


curve generated by the equipment under specied impact excitation.
Impact response spectrum II means that the duration of semi-sine impact
response spectrum is 6 ms.

Static payload refers to the capability of the equipment in package to bear


the pressure from the top in normal pile-up method.

BSC Operating Environment Requirements


The operating environment requirements of the BSC involve climate, waterproong, biological
environment, air purity, and mechanical stress.

Climatic Requirements
Table 15-19 and Table 15-20 list the requirements for operating the BSC.

Table 15-19 Temperature and humidity requirements


Temperature

Relative humidity

Long-term

Short-term

Long-term

Short-term

0 to +45

-5 to +55

5% to 85%

5% to 95%

NOTE

The temperature and humidity are measured 1.5 m above the oor and
0.4 m in front of the equipment, without protective panels in front of and
behind the cabinet.

Short-term operation refers to the continuous operations within 96 hours


or accumulated operations of not more than 15 days a year.

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BSC Operating Environment Requirements

Chapter 15: BSC Technical Specications

Table 15-20 Other requirements


Item

Specications

Altitude

4,000 m

Air pressure

70106 kPa

Temperature change rate

3/min

Solar radiation

700 W/m2

Thermal radiation

600 W/m2

Wind speed

5 m/s

Biological Environment Requirements


The working environment of the BSC should meet the following air purity requirements:

The environment should not be conducive for the growth of fungus or mildew.

There should not be rodents, such as rats.

Air Purity Requirements


The working environment of the BSC should meet the following air purity requirements:

There should be no explosive, conductive, magneto-conductive, or corrosive dust in the air.

The density of physically active materials should comply with the requirements listed
in Table 15-21.

The density of chemically active materials should comply with the requirements listed
in Table 15-22.

Table 15-21 Requirements for physically active materials (operating)


Physically Active
Material
Dust particles

Unit
Particles/m3

Density
3104 (There is no visible dust within
three days.)

NOTE
Dust particles: diameter 5 mm

Table 15-22 Requirements for chemically active materials (operating)


Unit

Chemically Active Material

Density

SO2

mg/m3

0.20

H2S

mg/m3

0.006

NH3

mg/m3

0.05

Cl2

mg/m3

0.01

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BSC Operating Environment Requirements

Mechanical Stress Requirements


Table 15-23 describes the mechanical stress requirements for operating the BSC.

Table 15-23

Mechanical Stress Requirements

Item

Sub Item

Sinusoidal
vibration

Unsteady
impact

Specications

Offset

3.5 mm

Accelerated speed

10.0m/s2

Frequency range

2 Hz to 9 Hz

9 Hz to 200 Hz

Impact response
spectrum II

100 m/s2

Static payload

NOTE

Impact response spectrum refers to the maximum acceleration response


curve generated by the equipment under specied impact excitation.
Impact response spectrum II means that the duration of semi-sine impact
response spectrum is 6 ms.

Static payload refers to the capability of the equipment in package to bear


the pressure from the top in normal pile-up method.

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Technical Specications of BSC Parts

Chapter 15: BSC Technical Specications

Technical Specications of BSC Parts

The technical specications of the BSC parts consist of the specications of the GOMU, power
distribution box, and fan box.
22. Author Comment:
This part autogenerated in source documentMay nee to be recreated by Cut and
paste

Technical Specications of the GOMU


The hardware conguration and performance specications of the GOMU consist of the
specications of dimensions, power supply, power consumption, weight, operating temperature,
and operating relative humidity.
Table 15-24 lists the hardware conguration specications of the GOMU.

Table 15-24 Hardware conguration specications of the GOMU


Value

Specication
Dimensions

366.7 mm 220 mm

Power supply

Two routes of -48 V DC with redundancy conguration


(provided by the backplane of the subrack)

Power Consumption

90 W

Weight

3.5 kg

Temperature in long-term
operation

-5 to +40

Temperature in short-term
operation

0 to +50

Relative humidity in
long-term operation

5% to 85% RH

Relative humidity in
short-term operation

5% to 95% RH

Table 15-25 lists the performance specications of the GOMU.

Table 15-25 Performance specications of the GOMU


Specication
Initial backup time of the
GOMU

Value
Less than 30 minutes
The initial backup time of the GOMU
refers to the initial time for backing up the script les. This
parameter is related to the le size and the difference
between the les in the active and standby GOMUs.
Continued

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Technical Specications of the BSC Common Power Distribution Box

Table 15-25 Performance specications of the GOMU (Continued)


Value

Specication
Switchover time between the
active and standby GOMUs

2 to 3 minutes\
The switchover time between the active and standby
GOMUs refers to time between the switchover request is
accepted and the switchover operation is complete. The
switchover time consists of the following segments:

Switchover negotiation time

Stopping process time

Start time of the new active GOMU

Technical Specications of the BSC Common Power Distribution


Box
The technical specications of the BSC power distribution box consist of the input specications
and output specications.
Table 15-26 describes the technical specications of the BSC power distribution box.

Table 15-26

Technical specications of the BSC power distribution box

Item

Sub Item

Input
specications

Output
specications

Specication

Rated input voltage

-48 V DC

Input voltage

-40 V DC to -57 V DC

Input mode

Two -48 V DC inputs

Maximum input current

Two inputs, each of which has a


maximum input current of 100 A

Rated output voltage

-48 V DC

Output voltage

-40 V DC to -57 V DC

Independent output

Six groups of independent power


output: Each group consists of one
48 V output and one RTN output.
The output of current is controlled
by a switch, which performs
short-circuiting functions. When
the total current of the six groups
of power output is smaller than
100 A, the maximum current of
each power output is 70 A.

Output protection specications

The current at the overcurrent


protection point is 87.5 A. You
need to restore the default value
manually.

Rated output power

4,800 W in hot backup mode

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Technical Specications of the BSC High-Power Distribution Box

Chapter 15: BSC Technical Specications

Technical Specications of the BSC High-Power Distribution Box


The technical specications of the BSC high-power distribution box consist of the input
specications and output specications.
Table 15-27 lists the technical specications of the BSC high-power distribution box.

Table 15-27 Technical specications of the BSC high-power distribution box


Item

Sub Item

Input
specications

Output
specications

Specication

Rated input voltage

-48 V DC or -60 V DC

Input voltage

-40 V DC to -72 V DC

Input mode

Two groups of power inputs: A and B. Group


A consists of the power inputs A1 + A2 and
A3. Group B consists of the power inputs B1 +
B2 and B3. Each group has one to two -48 V
DC/-60 V DC power inputs.

Maximum input
current

The maximum rated input current of each route


is 100 A.

Rated output voltage

-48 V DC or -60 V DC

Output voltage

-40 V DC to -72 V DC

Independent output

Two groups of power outputs: A and B. Each


group has one to three -48 V DC/-60 V DC
power outputs. The maximum rated output
current of each output is 50 A and that of each
group is 100 A.

Output protection
specications

The current at the overcurrent protection point


is 70 A. You need to restore the default value
manually.

Rated output power

9,600 W (Two groups of power outputs: A and


B. Each group has two -48 V DC power outputs.)

NOTE

For group A, power inputs A1 + A2 correspond to power outputs A1 - A8, and


power input A3 corresponds to power outputs A9 - A10. Similarly.

For group B, power inputs B1 + B2 correspond to power outputs B1 - B8, and


power input B3 corresponds to power outputs B9 - B10.

Technical Specications of the Fan Box


The technical specications of the fan box consist of the height, voltage, maximum power
consumption, temperature, and fan speed related to the fan box.
Table 15-28 lists the technical specications of the fan box.

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Technical Specications of the Fan Box

Table 15-28

Technical specications of the fan box


Value

Specication
Height

2 U (1 U = 44.45 mm)

Input voltage

-60 V DC to -42 V DC

Maximum power
consumption

150 W

Temperature

-5 to +55 (basic requirement)

Fan speed

The speed of the fans can be adjusted from 50% to 100%.

NOTE
When the BSC is powered on, when a subrack is reset, or when the BSC is upgraded,
the fans in all the subracks run at full speed and the alarm LEDs on all the boards
ash in a short period. These symptoms show normal status of the system during the
BSC startup.

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Chapter 15: BSC Technical Specications

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Appendix

Appendix: Changes in BSC Product Description

This section decribes the changes in the BSC Product Description.

01(2008-05-19)
This is the initial commercial release.

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