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, strain
gauge signal.
FIG. 2. Scheme of the SGTC circuit. SO, sinusoidal
oscillator; CB, current booster; Vcc, Vcc, supply
voltages; RZ, resistive zeroing network Co, coarse; Fi,
ne; CZ, capacitive zeroing network; R, 120 preci-
sion resistors; SG, active strain gauge; CPR, calibration
precision resistance; TC, T-type thermocouple Cu,
copper, Con, constantan; V
, T
, strain and temperature
composite signal; V
T,
, thermoelectric voltage signal
with spurious ac components.
194 Rev. Sci. Instrum., Vol. 72, No. 1, January 2001 Cappa, Marinozzi, and Sciuto
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Bridge ac carrier amplier manufacturer in order to obtain a
measuring frequency range from 0 to about 250 Hz at 1
dB. Modulus and phase balance is achieved, respectively, by
means of resistive and capacitive CZ zeroing networks.
The strain gauge SG is three wire connected by means of
two copper Cu and one constantan Con leads, forming a
T-type thermocouple junction TC. The choice for a T-type
thermocouple was made to allow easy soldering of the leads
to the SG base tabs with usual techniques.
As shown in Figs. 2 and 3, strain and temperature volt-
age signals, addressed respectively as V
, T
and V
T,
, are
available between points A and B and between C and B, that
are assumed at like temperatures. With reference to Fig. 3,
the signal V
, T
, i.e., the 8 kHz carrier amplitude modulated
strain signal, is differentially amplied and high pass ltered
to remove offsets and thermoelectric signals. The carrier ref-
erence CR, after a proper phase shift, drives the synchro-
nous demodulator SD
11
to extract the strain voltage V
.
Temperature signal V
T,
is buffered B
12
and low pass l-
tered to eliminate little residual carrier components origi-
nated along the thermocouple copper wire resistance. Before
differential amplication,
13
an electronic cold junction com-
pensation ECJ is performed
14
in order to provide the volt-
age V
T
corresponding to the T-type thermocouple self-
generated voltage between 0 C and the SGTC temperature.
Furthermore, as indicated in Fig. 2, a calibration preci-
sion resistance
15
CPR was introduced into the WB in order
to allow the determination of measuring system sensitivity in
practical applications.
Finally, the proposed scheme can be easily adapted to
feed multiple SGTC parallel channels and minimize the ex-
perimental complexity on large-scale tests. To this aim, there
would be no need for scheme modication but only an ad-
equate choice and dimensioning of the supply electronic
components would be necessary.
III. PERFORMANCE EVALUATION
For the experimental verication of the viability of the
proposed method and the evaluation of the proposed device
metrological performances, the SGTC has been applied on a
steel specimen 150 mm30 mm2.5 mm mounted on a
specically designed device, similar to that described in Ref.
5, in order to a apply strain variations, b verify its perfor-
mances in actual installation resembling a eld situation, i.e.,
with environmental uctuations, and c estimate actual ac-
curacy in strain and temperature evaluation. In order to have
strain and temperature reference values disposable, another
strain gauge and a K-type foil thermocouple FTC were
bonded in the same reduced test area of the cited steel speci-
men, see Fig. 4. In particular, the 120 nominal resistance
strain gauge and the SGTC were placed at the same section
in order to submit them at the same bending moment. The
strain gauge was connected by means of a classic three wires
connection to a static digital strain meter,
16
able to provide
analog output signal proportional to the measured reference
strain value
r
, to be compared to that measured by the
SGTC
SGTC
. Actual test area temperature T
r
, taken as a
reference, was measured by means of the electronically
compensated
17
FTC bonded near the measurement spot.
All voltage signals, i.e., reference strain provided by the
digital strain meter
r
, the SGTC output and the test tem-
perature area T
r
, were picked up by a 16 bit analog to digital
converter
18
and an antialiasing lter controlled via a personal
computer and processed by a specic software able to evalu-
ate strain and temperature actual values.
Preliminary tests were performed to point out the depen-
dence of the apparent strain on the circuitry environment
temperature. Test results outlined an overall temperature co-
efcient of about 0.3 m/m/C mainly due to the WB bal-
FIG. 3. Scheme of SGTC conditioning circuit. SG, ac-
tive strain gauge; V
, T
, strain and temperature compos-
ite signal; V
T,
, thermoelectric voltage signal with spu-
rious ac components; PS, phase shifter; IA,
instrumentation amplier; B, buffer amplier; HPF,
high pass lter; LPF, low pass lter; ECJ, electronic
cold junction compensation; CR, carrier reference; In,
input modulated strain signal; SD, synchronous de-
modulator; V