SPM 169 Suo Halt and Hass

HALT & HASS
- when and how is it relevant?

An introduction to HALT & HASS focusing on
classical HALT

Susanne Otto, DELTA

Photo of the jet by Fototjenesten, Flyvestation lborg

June 2004
SPM's sekretariat
DELTA Dansk Elektronik,
Lys & Akustik
Venlighedsvej 4
DK-2970 Hrsholm
Telefon: 72 19 40 00
Fax: 72 19 40 01
www.delta.dk/spm
Sammenslutningen
for Plideligheds- og
Miljteknik
SPM-169
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SPM

Society for Reliability and Environmental Testing

SPM is an independent organisation consisting of about 100 company members in
Scandinavia.
SPM initiates and finances unprejudiced investigations of common interest for its members mainly in
the field of reliability and testing of electronic components and materials.
NOTE: The report must not be reproduced without the written approval of the Society for Reliability and
Environmental Testing (SPM).
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Table of contents
1. Summary..................................................................................................................... 4
2. Introduction................................................................................................................ 5
2.1 Purpose of the project .................................................................................................. 5
2.2 The outline of the project ............................................................................................. 5
2.3 Introduction to HALT & HASS................................................................................... 6
3. HALT & HASS in comparison with conventional test strategies.......................... 9
3.1 Characterisation of tests ............................................................................................... 9
3.2 Test specimen............................................................................................................... 9
3.3 Test conditions ........................................................................................................... 11
3.4 Monitoring of test specimen ...................................................................................... 13
3.5 The new tests.............................................................................................................. 13
3.6 Conventional tests ...................................................................................................... 17
3.7 Test matrix - overview............................................................................................... 26
3.8 Comparison of conventional and new tests................................................................ 26
4. Failure analysis an important tool....................................................................... 29
4.1 Failure analysis Conventional and in relation to HALT......................................... 29
5. Case studies............................................................................................................... 35
5.1 DC/DC converter supplied by Terma A/S for use in aircrafts................................... 37
5.2 Adapto BTE (Behind The Ear) hearing aid supplied by Oticon A/S......................... 47
5.3 Ultrasound scanner electronics from B-K Medical A/S ............................................ 55
5.4 Modules for BeoSound 1 and BeoSound 3000 from Bang & Olufsen A/S............... 68
6. Survey of results ....................................................................................................... 82
7. Guidelines ................................................................................................................. 83
7.1 Guideline for introduction of HALT & HASS .......................................................... 83
7.2 Guideline for selection of HALT exposures .............................................................. 86
7.3 Guideline for design of HASS cycle.......................................................................... 88
8. Discussion and conclusion ....................................................................................... 90
Annex 1 Literature references .92
Annex 2 DELTA HALT facilities ......95
Annex 3 Case study - DC/DC converter for use in jet fighters supplied by
Terma A/S - detailed test log, Cooling of power module,
vibrations tests performed according to MIL-STD-810F ............98
Annex 4 Case study - CQ-6263 Adapto BTE hearing aid supplied by
Oticon A/S - detailed test log .....106
Annex 5 Case study - Ultrasound scanner 2120 EXL supplied by
B-K Medical A/S - detailed test log ...115
Annex 6 Case study Modules for BeoSound 1 and BeoSound 3000
supplied by Bang & Olufsen A/S detailed test log147
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1. Summary
HALT & HASS is an exciting new test philosophy which has gained great interest from
a large number of companies in Scandinavia within the last couple of years. Some
companies have already performed HALT while others are still discussing whether it is
relevant to perform a HALT.
These companies are faced with the question on when and how HALT & HASS is
relevant for them.
The project gives an introduction to HALT & HASS by describing the test strategies and
relating them to other test and analysis strategies. However, the main focus is on the
practical part demonstrating the application of HALT on a number of different products
for very different applications. The presentation of the cases includes all practical
aspects of a HALT e.g. criteria for selection of test specimen, function test and function
test set-up, selection of HALT exposures, fixation of test specimen, summary of testing
and results as well as comments and conclusion. The majority of the cases has involved
classic HALT i.e. HALT with thermo-mechanical exposures. The conclusions drawn
from the case studies have lead to the formulation of guidelines regarding implemen-
tation of HALT & HASS, selection of HALT conditions and design of a HASS cycle
from HALT results.
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2. Introduction
2.1 Purpose of the project
HALT & HASS is an exciting new test philosophy which has gained great interest from
a large number of Scandinavian companies within the last couple of years. Some
companies have already performed HALT while others are still discussing whether it is
relevant to perform a HALT.
These companies are faced with the question on when and how HALT & HASS is
relevant for them. They need answers to the following questions:
What is there to gain from HALT & HASS?
How do HALT results compare to field failures?
How does HALT & HASS fit in with other test and analysis method?
Which HALT & HASS exposures are relevant?
How to come from HALT to HASS?
How to get started?
The purpose of this project is to give these companies an input to decision making on
when and how HALT & HASS is relevant for their product and the company by
answering these questions.
2.2 The outline of the project
This project gives an introduction to HALT & HASS by describing the test strategies and
relating them to other test strategies. Further, a description of failure analysis in relation
to HALT is given.
However, the main focus is on the practical part demonstrating the application of HALT
on a number of different products for very different applications. The presentation of the
cases includes all the practical aspects of a HALT e.g. criteria for selection of test speci-
mens, function test and function test set-up, selection of HALT exposures, fixation of
test specimen, summary of testing and results as well as comments and conclusion. The
majority of the cases have involved classic HALT i.e. HALT with thermo-mechanical
exposures. However, also bounce and sweat exposures have been included. The
conclusions drawn from the case studies have lead to the formulation of answers to the
questions asked initially.
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Thus the project falls into three parts:
1) The theoretical part where HALT & HASS is described and related to a number of
other test and analysis strategies.
2) Case studies demonstrating HALT in practical terms on test specimens supplied
by SPM-members and the HALT/HASS ERFA-group in particular.
3) Formulation of guidelines regarding implementation of HALT & HASS, selection
of HALT conditions and design of a HASS cycle from HALT results.
2.3 Introduction to HALT & HASS
HALT (Highly Accelerated Life Testing) and HASS (Highly Accelerated Stress
Screening) are an interesting test philosophy originally developed in the US by Gregg
Hobbs some 30 years ago. It has finally spread and gained support in Europe over the
last 5 - 10 years.
HALT & HASS find and rectify potential failures in products at the earliest possible
stage. The result is more reliable products, more satisfied customers, reduced warranty
and service costs and shorter time-to-market.
HALT is a research and development tool, which efficiently points out the failures
related to the design of the product. Whereas HASS is a tool for pointing out the failures
related to the production process.
HALT is not a means of predicting actual life time for products even if Life form part
of HALT. It would be more appropriate for HALT to be an acronym for Highly
Accelerated Limit Testing. However, that is not the way it is.
During HALT the product is exposed to a number of test conditions selected based on
the relevant failure mechanisms of the product. There is no standard procedure.
Typical conditions or classic HALT conditions are extremely high and low temperatures,
fast temperature change (up to 60C/min. measured on the product), vibration and
temperature change combined with vibration. However, voltage variations, humidity,
shocks and combinations of humidity and temperature as well as any other conceivable
condition leading to relevant failures may be utilised. The product is exposed to the
conditions or combination of these in steps of increasing stress. The stress level is
increased in steps well beyond specification limits of the product.
Efficiency is achieved by testing at extreme levels. In this way, failures are detected
within few hours rather than after weeks of traditional testing or several years in the
field. The test conditions are in no way intended to simulate the use environment.
The function of the product is constantly monitored, failures are detected and analysed.
The stress level at which failure occurs is of no relevance. The only interesting point is
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whether the failure mechanism is relevant or not. In case the failure is relevant it should
be corrected.
HASS testing procedure is designed on the basis of the limits identified by HALT. A
typical procedure consists of rapidly induced temperature transitions combined with 6-
axis vibration. Tests are of short duration ideally lasting just a few minutes. It is critical
to ensure sufficient lifetime remaining in the product after screening, and that all induced
failures are identified. Otherwise the end customers will discover them later.
Failure analysis on the failed samples is an important component of HALT & HASS in
determining whether a given failure is relevant. An appreciation of the mechanism
behind the failure increases the chances of choosing the right solution. Failure analysis
can also reveal failures not found by the functional screening process.
It is the HALT & HASS process i.e. the testing in combination with failure analysis and
the improvement process that results in enhanced products, see fig. 2.1 below.

FIG. 2.1 The HALT & HASS process.
HALT is seen as a supplement to conventional qualification testing.
The benefits of HALT & HASS are:
Huge savings in warranty and service costs
Shorter time-to-market
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Confidence and insight when introducing new products
Large and known strength margins to operational stress
Possibility of investigating field failures
Product is mature and free from teething troubles when entering production
Reduced rework in production
Failures practically never occur when product is in use
Customer requirements satisfied
Originally HALT & HASS was used for high volume products or small volume and high
value products. Now, all types of product developing companies will gain benefit from
HALT & HASS. A number of technologies and industries are already employing HALT
& HASS. These include space technology, the military, aviation, telecommunication,
information technology, medico, automotive, sensor devices, measuring and electronic
control devices.
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3. HALT & HASS in comparison with conventional test strategies
3.1 Characterisation of tests
The conventional universe of tests is described here in order to serve as basis for a
comparison with the new tests, HALT & HASS.
The description of the tests considers the following subjects:
Test specimen
Test conditions
Monitoring of test specimen
3.2 Test specimen
The types of product considered are equipment type products or subassemblies of such
products. This means end-user products or functional modules thereof made of electrical,
mechanical, electromechanical or electronic hardware. These products usually have a
high degree of complexity, which also makes testing them rather complex.
Microelectronics and microsystems are included, but discrete semiconductors and
components like resistors, capacitors and networks are excluded.
How the actual items of the product are selected for test depends on the purpose of the
test. Different selections characterised according to the stage in the creation process are
described in the following sections.
3.2.1 Development samples
The product may be tested in its very early stage of development. The objects tested
range from breadboards to fully functional mock-ups. The purpose of such tests may be
to check the capability of principal solutions, circuit details or structural details to yield
questionable parts of the products intended performance. Test in this phase is an
iterative process alternating with the design activities. The test conditions in this phase
are normally focused on those critical for the performance parameter in question. The
monitoring may be anything from simple check of survival to detailed measurements.
3.2.2 Prototypes
A step further in the development process, the product design has been defined and the
first physical realisations made. A substantial part of its circuits and structural parts is
typically handmade without the final tooling. The purpose of test in this phase is to
obtain a complete picture of all aspects of the product's performance in all situations of
its life in use. The test conditions in this phase are often contractually defined and they
intend to cover all situations of the product life. The monitoring is designed to cover all
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functional and survival parameters. This kind of test is often referred to as qualification
test, type approval test or design verification test.
3.2.3 Pilot production items
At this step of development, not only the product, but also the manufacturing process is
defined, and the first product samples are made using the final tooling and the final
production processes. The traditional purpose of test in this phase is to make sure that no
part of the products performance has been lost during the transformation from
development to production. The test conditions and the monitoring are often a subset of
those from the prototype test. As integrated product development is now more and more
common that the production processes are developed parallel to the product design, and
the transition from prototype to pilot production item becomes gradual. This kind of test
may also be contractually defined and serve as criterion for start of delivery.
3.2.4 All production items
The performance of the production items is a function of the ingoing materials and
components. These elements may be checked for defects before entering the production
process, but according to the circumstances also, or alternatively, after some of the
production process steps. This calls for a simple functional test without environmental
stress. Another reason for test at this step is to speed up the production maturing process.
After the completion of the development of the product and the production processes, the
production processes will normally not be perfectly implemented right from the
beginning. Typically they mature during the first period of production and the product
quality gradually becomes better. In order to facilitate this maturing process, all
manufactured items may be tested in a screening process. The test conditions will be
focused on those able to reveal latent defects introduced by inadequate production
processes. The monitoring is designed to detect the failures originating from the latent
defects precipitated as patent defects. Since the test conditions involve environmental
stress, this kind of test is often referred to as environmental stress screening. Another
name is burn in, because an early form of the test involved heat as the sole environ-
mental stress.
3.2.5 Production items according to sample plan
The production process is subject to change due to influence from many sources. These
changes may be intentionally introduced or they may just happen without notice. Any
kind of tests as described above in sections 3.1.2 through 3.1.4 will therefore be useful as
part of the production control tool to keep the process on track when performed on
samples of running production. The test conditions can be anything from zero stress to
accelerated stress. The monitoring may be concentrated on a few carefully selected
indicator parameters, however, it will normally be focussed on key operational
parameters.
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3.3 Test conditions
The test conditions are a combination of the functional conditions of the product, the
environmental conditions and the time. Although not completely independent, these 3
elements can be said to make up the 3 dimensions of test conditions.
3.3.1 Reference test
A reference test is a test with emphasis on attributes concerning functional input and
output parameters. The purpose of a reference test is to obtain a measure for the
functional capability or performance of the product. It may be made under ideal zero-
stress conditions in order to obtain a measure for the best possible product performance.
(By zero-stress is meant no other stresses than induced by the functional parameters
themselves). It may also be made during or between exposures of an environmental or
endurance test (see sections 3.3.2 and 3.3.3 below). Reference test can be considered as a
1-dimensional test.
3.3.2 Environmental test
An environmental test is a test with emphasis on a products ability to maintain a wanted
functional attribute when exposed to environmental stress. The traditional philosophy is
to consider stress levels so high that the probability of reaching or exceeding them in
actual use is low. Anyhow, the levels are not substantially exceeding those which could
occur. Since the probability of 2 or more environmental stress types reaching this high
level at the same time is extremely low, this kind of test is usually made by exposing the
product to 1 environmental parameter at a time. Since these high levels of environmental
stress do not occur very often, the duration connected to their occurrence is considered to
be short. The time for the product to be exposed to each environmental parameter during
test is therefore also relatively short. It is usually set to somewhat longer than judged to
be necessary in order to reach stable conditions.
Some environmental parameters are known to produce special effects when applied in
combination. The classic example is condensation of water and water accumulation in
hollow spaces caused by high relative humidity in combination with change of
temperature. Even in these cases, the test time is related more to obtaining the special
effects looked for than to obtain some kind of simulation of duration-related phenomena
of the use period.
In other words, environmental test provides information of a products ability, in
condition as new, to maintain a wanted attribute when exposed to expected
environmental stress. The attributes are monitored by functional tests before, during
and/or after the environmental exposure. Environmental test can be considered as a two-
dimensional test.
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3.3.3 Endurance test
An endurance test is a test with emphasis on the products ability to maintain a wanted
attribute during time combined with all kinds of stresses occurring from operation,
manipulation and environment. The effect of these stresses is an accumulation in time of
damage to the product. If the accumulated damage reaches a sufficiently high level, the
product fails. Endurance test can be performed straight away by just using the product.
This means non-accelerated endurance test. Since this leads to a test time comparable to
the real intended product life, it is desirable to obtain some kind of acceleration. To this
effect, the test exposures may be time-accelerated or stress level accelerated. Both
methods contain large uncertainties, however, it should be kept in mind that the
acceleration factor established by either method refers to some normal use conditions,
which themselves are rather difficult to define precisely. Endurance test can be
considered as a 3-dimensional test.
3.3.3.1 Non-accelerated endurance test
This kind of test has the very great advantage that it can be performed as a field test in
real use environment and by real users. It therefore requires little or no analysis of use
conditions, design of test conditions and complex test equipment. The long test time,
however, is a major drawback, and makes the test little useful.
3.3.3.2 Time-accelerated endurance test
During the life of a product, it will meet a complex stress situation made up of many
types of stress. These stresses can be described by a number of environmental and
operational parameters acting in combination. The levels and combinations of these
parameters vary over time. Due to this variation, the time history will in most cases
contain periods of time where the stress levels are low compared to other periods where
stress levels are high. During periods of high stress, the accumulation of damage takes
place at a higher rate than during periods of low stress. Time acceleration can thus be
achieved by neglecting the periods of low stress where the damage accumulation is
insignificant. The stress levels of the remaining periods are then reproduced in the test
conditions with representative severities and combinations. Since it is normally
important to know the point of time when the test item eventually fails, the test
environment is designed to reproduce small portions of product life at a time. These
small portions - test cycles - are then repeated several times. The acceleration factor
obtainable by this method is typically limited to 5 - 20 times. This is the most important
drawback of this method.
3.3.3.3 Stress level accelerated endurance test
If the accumulation of damage due to the effect of all environmental parameters involved
- separately and in combination - is known as a function of time and stress level, stress
level acceleration is useful. First, the accumulated damage during a normal product life is
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calculated by integration for all stress parameters - alone and in combination -
calculating the summation of differentials of damage accumulation multiplied with
differentials of time. Then, a test condition with accelerated stress levels is selected,
which - by the same calculation - gives the same damage accumulation in the desired
shorter time. A number of empirical formulas giving the relationship between damage
accumulation rate and parameter severity exist (see ref. [16] section 7.2 and ref. [17]
chapter 2). They are all of exponential type, so that an additive increment of stress level
corresponds to the multiplication of damage accumulation rate by a factor. The
acceleration factor obtainable by this method can be very high. The drawback is that it
requires a very detailed knowledge of the product and its failure mechanisms. Otherwise
the choice of acceleration function is pure guesswork.
3.4 Monitoring of test specimen
The attributes to be monitored and the method of monitoring depend on the details of the
actual test and the product tested, especially the attributes, for which information is
sought. The more principal considerations are related to the continuity or time of
monitoring. This is generally done in 2 ways:
1) Monitoring before and after exposure is used when the only information desired is
the permanent effect of the test condition on the test specimen. In other words,
whether the test specimen has suffered permanent damage from the test condition.
2) Monitoring during exposure is used when the information desired relates to a
temporary effect of the test condition on the test specimen. In other words, whether
the test specimen has exceeded some operating limit due to the test condition.
3.5 The new tests
HALT
The acronym stands for Highly Accelerated Life Test (see ref. [16]: "Accelerated
reliability engineering. HALT and HASS". Gregg K. Hobbs. Wiley & Sons Ltd, 2000;
and ref. [17]: "HALT, HASS & HASA Explained. Accelerated Reliability Techniques."
Harry W. McLean. American Society for Quality, 2000). It is a test technique that
evolved around 1970 at Hewlett-Packard under the names Design Ruggedization and
STRIFE (STRess plus lIFE).
The idea is simple: Apply stresses to a product in excess of its design specification to
generate failures, find the root cause of each failure and eliminate them by design
improvements. When this is done during the original design of the product, it will result
in a much more reliable product.
The basic idea has appeared under different names: DOE (Design Of Experiments) has
been used by Motorola in support of their well known 6 sigma concept. Other acronyms
appearing are TAF (Test Analyse and Fix) and RGT (Reliability Growth Test).
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The background philosophy for this kind of test is entirely different from the traditional
test philosophy.
Traditionally, test is seen as a measurement instrument to measure some quality para-
meters of a product (either a value or go/no-go). In order to optimise this measuring
instrument, the focus has been on the ability of test methods to detect the intended
quality parameter and obtaining a measure for it with reasonable accuracy and
reproducibility without spending too much time and money.
HALT, however, is a tool to improve the quality of a product by finding and eliminating
weak points, both in the design and in the production processes. This process of
improving is iterative. It stops when margins between breakdown limits and operating
conditions are the largest reasonably possible. In order to optimise this tool, the focus is
on finding the weak points relevant for real use and introduce redesign or process change
to eliminate them without spending too much time and money.
This changed philosophy implies:
1) The test must find operation limits and destruction limits. The stress levels for each
parameter and combination of parameters are therefore successively increased
until, first: cease of operation, second: permanent destruction.
2) When one limit of a certain stress parameter or a combination has been identified,
the test must go for the next higher limit of the same. This continues until failure
analysis (4) indicates that failures are irrelevant. In order to do this, the foregoing
failures can be temporarily fixed by replacement and protection of parts.
3) Combinations of environmental stress parameters must be used because they are
more destructive than one parameter at a time. Extreme temperature and
temperature change are therefore combined with random vibration (all frequencies
at the same time) and 6-axis excitation (3 translations and 3 rotations at the same
time).
4) All failures must be analysed and the following questions answered:
A: Is it possible that it could happen in real use?
B: How can its root cause be eliminated?
5) The root cause for all failures for which answer A is yes, has to be eliminated
according to answer B. The margin between the product specification limit and in
the first hand the operation or destruction limit shall not be considered. The
purpose of the HALT process is to extend these limits as far as possible.
6) The HALT process continues until the failure analysis (4) shows that the failures
precipitated are irrelevant for real use and fundamental limits of the involved
materials processes and technologies are approached.
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7) When the root cause of all relevant failures has been eliminated by proper design
and process corrections and these changes are implemented, a re-HALT will be
appropriate. If this re-HALT shows persisting problems due to inadequate
corrections, another re-HALT may be necessary. The process does not stop until
sufficiently great margins (6) have been achieved.
The fact that HALT is aiming on improving products instead of measuring their
performance implies that it concentrates more about analysing the relevance of failures
than considering the relevance and reproducibility of stress exposures. It is of no
importance how a failure occurs, however, it is extremely important if the same failure
might occur in real use.
Both ref. [16] and [17] describe a possible theoretical choice of a number of different
types of stress exposure. When it comes to the descriptions of the practical performance
of HALT, the choice narrows to extreme temperature, fast change of temperature and
vibration.
Since the main focus is on failures, failure analysis is very important. You could say that
the lack of reproducibility has been replaced by analysis of failures for relevance.
Expedient and accurate failure analysis is essential for the successful management of
HALT.
HASS
The acronym stands for Highly Accelerated Stress Screening. Ref. [16]: "Accelerated
reliability engineering. HALT and HASS". Gregg K. Hobbs. Wiley & Sons Ltd, 2000;
and [17]: "HALT, HASS & HASA Explained. Accelerated Reliability Techniques".
Harry W. McLean. American Society for Quality, 2000.
Also this idea is simple: The field reliability of a product can be improved by finding and
removing the weakest members before they are shipped.
The basic idea appeared already between 1950 and 1960 under the name burn-in and
was later referred to as ESS (Environmental Stress Screening) or even EESS (Enhanced
Environmental Stress Screening). The trend has been to shorten screening time by
increasing the stress level. An advanced form of burn-in has been given the descriptive
name HARASS (Highly Accelerated Rapid Airflow Stress Screening).
The background philosophy for the simplest version of this kind of test is to find the
weak members of a lot and avoid shipping them without spoiling the good ones and
spent too much time and money.
More sophisticated programs also contained a closure of the loop by identifying root
causes and correcting production processes. Further optimisation of the time under stress
based on the number of failures found has been used in order to save time (see ref. [11]:
IEC 61163-1).
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A major drawback of this method has always been the time. (Early burn-in specifi-
cations required 168 hours without argument). In connection with HALT, however, it has
been possible to introduce HASS with a dramatic increase of stress levels and thus
reduction of stress exposure time to minutes.
The HASS philosophy implies:
1) Choose an efficient detection screen and fault detection system. It is catastrophic if
weaknesses turned into failures by the stress exposure remain undetected. The
customer will find them. Detection screens and the coverage of fault detection
systems are extremely important (see ref. [16] chapters 3.1.1 and 8).
2) Select stress levels reasonably below the levels used at HALT. Just how close
seems to be a matter of experience. Ref. [17] page 44 recommends the use of
seeded samples to prove that the stress is sufficient, however, ref. [16] chapter 3.13
advises against the use of seeded samples.
3) Run a test to demonstrate the safety of the chosen HASS profile. This is done by
running HASS on the same specimen for a number of times. Ref. [16] says 20.
Ref. [17] says minimum 10 but recommends 30 to 50. It is important that this is
done on all positions of the HASS fixture because levels will vary in different
places.
4) Optimise the HASS cycle by checking that it is able to find weaknesses in one pass
by running 3 to 5 cycles on each production item for a certain period. If the first
cycle does not catch the majority of the failures, then tune the levels and run (3)
again. Ref. [16] contains a logic diagram on page 117 explaining the optimisation
process.
5) Run your production through the HASS cycle. If the production processes through
time comes within statistical control and the fallout is sufficiently low, consider
switching to HASA (Highly Accelerated Stress Audit). This is simply HASS on a
sample basis. Ref. [17] chapter 4 deals with the considerations.
Basically the same stress exposures are used as in HALT. The levels are just reduced. As
in HALT, fairly wide tolerances on stress levels are accepted. The issue of uniformity
and repeatability is approached in an empirical way. If the optimised HASS cycle (4) can
find failures in first pass and still remain safe (3) then it is OK no matter how different
the stress levels of different fixture positions may be.
The focus on failures rather than on exposures is also seen by the emphasis given to
proper detection of the failures precipitated by the so-called precipitation screen. It is
recognition of the fact that if failures remain undetected, they will be passed over directly
to the customer who certainly will find them shortly after starting the use of the new
product. In this way, the failures have not been removed, but just moved.
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In connection with detection of failures, the concepts detection screen and
discriminator have been introduced.
A detection screen is an environmental exposure that takes into account the fact that the
failures precipitated are often not stable, but of an intermittent nature. It reflects the well-
known situation that we have all tried: Tapping the product with a screwdriver handle to
find the failure that has just disappeared as we started measuring. A recommended
detection screen consists of so-called tickling vibration in combination with slow change
of temperature.
The discriminator is a set of measurements that allow you to detect abnormal behaviour
and sort the defective ones from the good ones. The selection of the right discriminator is
also a very important part of the successful managing of HASS.
3.6 Conventional tests
The most commonly used test standards are described in the following:
EN / IEC 60068
This standard contains fundamental information of environmental testing procedures,
and severities of test. It contains five parts described below. Most of these IEC standards
are also issued by CELELEC as EN-standards with the same number as the IEC. There
are no technical differences and the following refers solely to the IEC, since this is the
complete series.
IEC 60068-1
Ref. [1]: International standard IEC 60068: Environmental testing Part 1: General and
guidance.
This part of the standard defines general concepts used in connection with environmental
test designed to assess the ability of specimens to perform under expected conditions of
transportation, storage and all aspects of operational use. It also prescribes various
atmospheric conditions for measurements, tests and for reference use.
IEC 60068-2
Ref. [2]: International standard IEC 60068: Environmental testing Part 2: Tests.
This part of the standard contains a great number of sub-parts from IEC 60068-2-1 to
IEC 60068-2-78 providing standard test procedures to determine the suitability of
components, equipment or other articles to withstand specified conditions.
Most of these tests are environmental stress tests with emphasis on characteristics
possibly influenced by environmental stress of a certain high level.
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A few of the tests are stress level accelerated endurance tests with emphasis on
characteristics possibly influenced during time by environmental stress at accelerated
level, e.g. IEC 60068-2-66 test Cx and 67 test Cy with water vapour. Other examples
are the corrosion tests for salt mist IEC 60068-2-11 test Ka and 52 test Kb, and for
corrosive gases 42 test Kc for sulphur dioxide, 43 test Kd for hydrogen sulphide and
60 test Ke for mixed gas.
The standard does not deal much with the relationship between natural conditions and
test conditions. The main emphasis is to specify test conditions so that their effects on
the tested products are reproducible. Therefore many of the tests can be used both in
connection with environmental stress tests, time accelerated endurance tests and stress
level accelerated endurance tests.
IEC 60068-3
This part of the standard contains sub-parts from IEC 60068-3-1 to IEC 60068-3-7
providing the background information and guidance for the test conditions in IEC 60068-
2. Some parts also deal specifically with test equipment. IEC 60068-3-5 deals with the
conformation of the performance of temperature chambers and 6 with combined
temperature / humidity chambers. IEC 60068-3-7 specifies how to make measurements
in temperature chambers with heat dissipating load. These documents do not directly
specify test conditions in the present context.
IEC 60068-4
This part of the standard contains summaries of the test conditions in IEC 60068-2
intended for specification writers. This document does not directly specify test
conditions in the present context.
IEC 60068-5
This part of the standard contains a guide on drafting of test methods as those in IEC
60068-2.
IEC 60721
This standard deals with classification of environmental conditions for electrotechnical
products. The purpose is to form a basis for both product specifications and for test
specifications. It contains the four parts described below.
IEC 60721-1
Ref. [3]: International standard IEC 60721: Classification of environmental conditions
Part 1: Environmental conditions and their severities.
19

This document lists environmental parameters and a limited number of their severities
within the range of conditions met by electrotechnical products when being transported,
stored, installed and used. It forms the basis for selection of severity levels but does not
directly specify test conditions in the present context.
IEC 60721-2
Part 2: Environmental conditions appearing in nature.
This document presents fundamental properties, quantities for characterisation and
classifications of environmental conditions relevant for electrotechnical products. It
forms the basis for selection of parameters and severity levels but does not directly
specify test conditions in the present context.
IEC 60721-3
Part 3: Classification of groups of environmental conditions and their severities.
This document establishes classes of environmental conditions and their severities,
covering the extreme (short-term) conditions, which may be met by a product when
being transported, installed, stored, and used. Separate groups of classes are given for
different product applications (e.g. weather-protected stationary, mounted in ground
vehicles, transportation). The classes also take into account the degree of restriction of
the use of the product from the very restricted condition (e.g. in temperature controlled
rooms) to unrestricted conditions. They form the basis for selection of parameters and
severity levels but do not directly specify test conditions in the present context.
IEC 60721-4
Ref. [6]: Draft standard IEC 60721: Classification of environmental conditions Part 4-
0: Guidance for the correlation and transformation of the environmental classes of IEC
60721-3 and the environmental tests of IEC 60068-2- Introduction. (104/143/CDV).
This document gives recommendations for - environmental tests to be chosen to
demonstrate the capability of a product to function or survive satisfactorily as specified
in the relevant specification when subjected to the climatic and dynamic conditions given
by IEC 60721-3. It gives guidance for selection of tests but does not directly specify test
conditions in the present context.
IEC 60605
This standard deals with equipment reliability testing. It contains three parts described
below.
20

IEC 60605-1
Ref. [7]: International standard IEC 60605: Equipment reliability testing part 1:
General requirements.
This standard provides general principles as well as specific recommendations on
procedures for equipment reliability compliance and determination testing. Reliability
compliance test is referred to as an experiment used to show whether or not the reliability
characteristic of an item meets its stated reliability requirements. Reliability
determination test is referred to as an experiment used to determine the value of a
reliability characteristic of an item. Both kinds of test can be performed as either
laboratory tests or field tests.
The standard does not directly specify test conditions in the present context.
IEC 60605-2
Ref. [8]: International standard IEC 60605: Equipment reliability testing part 2: Design
of test cycles.
This document applies to the design of operating and environmental test cycles referred
to in 8.1 and 8.2 of IEC 60605-1: Equipment reliability testing part 1: General
requirements. 8.1 states some general considerations for the choice of test conditions. 8.2
goes more in details concerning operating and environmental test conditions. Here it is
stated that: The operating and environmental test conditions shall, whenever possible,
cover the range of operating and environmental conditions prevailing during actual field
use. In general, acceleration of the test by increasing the stress levels with respect to field
use should not be applied.
The method enables the design of test conditions for endurance test with some
acceleration of test time versus real use time. This acceleration can be accomplished by
reproducing only that part of the use conditions imposing a considerable stress on the
item and omitting the conditions of low stress.
IEC 60605-3
Ref. [9]: International standard IEC 60605: Equipment reliability testing part 3:
Preferred test conditions.
This part consists of several sub-parts, containing preferred test conditions for various
types of equipment:
1) Indoor portable equipment - Low degree of simulation
2) Equipment for stationary use in weather protected locations - High degree of
simulation
21

3) Equipment for stationary use in partially weather protected locations - Low degree
of simulation
4) Equipment for portable and non-stationary use - Low degree of simulation
5) Ground mobile equipment - Low degree of simulation
6) Outdoor transportable equipment - Low degree of simulation
All of these standards specify test conditions for endurance test that intends to simulate,
in a higher or lower degree, the actual conditions for use. They have not been designed
with the intention of accelerating the test time in relation to real time of use.
IEC 61000
This standard deals with electromagnetic compatibility. This compatibility has two sides:
susceptibility and emission. The issue of susceptibility test is in principle a kind of
environmental stress test. The stress parameter in question is just an electromagnetic
field, which may influence some characteristics of the product under test. The issue of
emission can be seen as an unwanted function and considered a kind of reference test.
The standard contains 6 parts described below.
IEC 61000-1
This part of the standard defines general concepts in connection with the application and
interpretation of fundamental definitions and terms. There are two sub-parts. They do not
directly specify test conditions in the present context.
IEC 61000-2
This part of the standard deals with emission of various kind of electromagnetic
disturbances. There are 10 sub-parts. They all specify reference tests independent of
environmental stress.
IEC 61000-3
This part of the standard deals with emission of electromagnetic disturbances related to
electrical power supply lines in low voltage, medium voltage and high voltage power
systems. There are 8 sub-parts. They all specify reference tests independent of
environmental stress.
IEC 61000-4
This part of the standard deals with susceptibility to various kinds of electromagnetic
disturbances. There are 21 sub-parts. They all specify environmental tests with emphasis
on product characteristics possibly influenced by electromagnetic stress of a certain high
level.
22

IEC 61000-5
This part of the standard deals with protection against various kinds of electromagnetic
disturbances. There are 6 sub-parts dealing with installation and mitigation guidelines.
They do not directly specify test conditions in the present context.
IEC 61000-6
This part of the standard deals with susceptibility to and emission of various kinds of
electromagnetic disturbances. There are 4 sub-parts.
IEC 6100-6-1, -2, and -5 deal with immunity tests for residential, industrial and power
station environments. They specify environmental tests with emphasis on product
characteristics possibly influenced by electromagnetic stress of a certain high level.
IEC 6100-6-4 deals with emission of electromagnetic disturbances in an industrial
environment and specifies reference tests independent of environmental stress.
IEC 61014
Ref. [10]: International standard IEC 61014: Programmes for reliability growth.
This standard specifies requirements and gives guidelines for the exposure and removal
of weaknesses in hardware and software items for the purpose of reliability growth. It
applies when called for in the specification or when it is known that the design is
immature and is unlikely to meet the requirements of a compliance test without
improvement. It deals with basic concepts, management, planning, testing, failure
analysis, corrective techniques and mathematical modelling.
It contains a description of testing by stressing with a general reference to Ref. [7], [8] or
[9]. The following statement, however, is also found: -, but in order to stimulate failures
as quickly as possible the most severe environment and intensive use permitted by the
design specification should be employed.
This standard can be used in connection with endurance test.
IEC 61163-1
Ref. [11]: International standard IEC 61163: Reliability stress screening part 1:
Repairable items manufactured in lots.
This document describes reliability stress screening and reliability growth programmes
as both aiming at improvements in the reliability found by the user. The growth
programme is referred to as a development activity and not dealt with any further.
Reliability stress screening is described as having the purpose to detect and remove
flaws; it is part of the production process, and should not be relied upon to reveal
inadequacies in design.
23

The procedure for the choice of stress conditions are:
1) List possible weaknesses likely to give early failures taking into account the design
and manufacturing process of the item and the expected field conditions.
2) Group weaknesses in three groups:
A) Those, which cost-effectively can be removed by design or process
modifications.
B) Those, which cost-effectively can be removed by some kind of inspection
during production.
C) Remaining weaknesses.
Only the weaknesses of group C constitute the flaws that can be removed by
reliability stress screening.
3) Consider the flaws and evaluate the stresses, which are most likely to develop
these flaws into failures.
4) Select among the stresses identified the most efficient conditions including their
sequence and/or combinations.
5) For each stress condition, evaluate the maximum stress level, which can be used
without overstressing any component in the item under consideration.
The time during which the items are to be stressed depends on the failures occurring. The
standard contains a procedure to determine a failure-free period that the item must show
before being accepted.
This standard considers stress accelerated endurance test.
MIL-STD-810F
Ref. [12]: US military standard MIL-STD-810F: Environmental engineering
considerations and laboratory tests.
The primary emphasis is: To tailor the items environmental design and test limits to the
conditions that the specific material will experience throughout its service life, and
establishing laboratory test methods that replicate the effects of environments on material
rather than trying to reproduce the environments themselves.
The F revision has been expanded significantly up front to explain how to implement
the environmental tailoring process throughout the material acquisition cycle. It is
written for three basic types of users:
Material acquisition managers. Ensuring that material will function as required in
intended operational environments.
24

Environmental engineering specialists (EES) who assist combat and material
developers to tailor their designs to environmental stresses/constraints expected
during the service life of the material.
Community analysts, engineers and facility operators working with evaluation,
design and test by focusing on tailored designs and tests.
The document is in two parts:
Part one Environmental engineering program guidelines
Part two Laboratory test methods
The standard deals with the relationship between natural conditions and test conditions.
It also specifies test conditions so that their effects on the tested products are
reproducible. They are used in connection with environmental stress tests.
MIL-STD-883E
Ref. [13]: US military standard MIL-STD-883E: Test method standard, microcircuits.
This document specifies uniform methods, controls and procedures for testing
microelectronic devices. This includes monolithic, multichip, film and hybrid
microcircuits, microcircuit arrays, and the elements from which the circuits and arrays
are formed. In this connection, it specifies suitable conditions obtainable in the
laboratory and at the device level, which give test results equivalent to the actual service
conditions existing in the field, and to obtain reproducibility of the results of the tests.
The standard defines absolute maximum ratings as those not to be exceeded under any
measurable or known service or conditions. It allows testing ratings to exceed these
limits in determining device performance or lot quality, provided that the test has been
determined to be non-destructive and precautions are taken to limit device breakdown
and avoid conditions that could cause permanent degradation. These testing ratings are
intended to apply to short-term, stress-accelerated storage, burn-in and life tests.
The test conditions are partly environmental tests and partly stress level accelerated
endurance tests.
NORMIC D6-3
Ref. [14]: NORMIC D6-3: Environmental classification of microsystems and
introduction to qualification testing.
This document contains:
A general introduction and guidance to testing.
A grouping of microsystems based on product types and application areas.
25

An environmental classification corresponding to the grouping.
A selection of tests applicable to the environmental classes defined.
Compared to the other test standards described in section 2.2 of the standard mentioned
this document brings in no new material. The environmental classification is based on
IEC 60721-3 and the selection of tests is based on IEC 60068-2. It is mainly intended for
environmental tests.
JESD22
Ref. [15]: JESD22 series. This is one of several series of documents issued by the
JEDEC Solid State Technology Association.
The JESD22 series specifies a great number of tests of very different type for
semiconductor devices.
A few of these tests are reference tests with emphasis on characteristics independent of
environmental stress, for example physical dimensions (JESD22-B100-A), external
visual (JESD22-B101), coplanarity for SMD (JESD22-B108).
Some of the tests are environmental tests with emphasis on characteristics possibly
influenced by environmental stress of a certain high level, for example ESD (JESD22-
A114-B, JESD22-A115-A and JESD22-C101-A), vibration (JESD22-B103-A),
mechanical shock (JESD22-B104-B and JESD22-B110).
Most of the tests are stress level accelerated endurance tests with emphasis on
characteristics possibly influenced during time by environmental stress at accelerated
level. The stress level accelerated endurance tests are especially used for the climatic
environmental influence parameters, for example high temperature (JESD22-A103-B
and JESD22-A108-B), change of temperature (JESD22-A100-B, JESD22-A104-B,
JESD22-A105-B, JESD22-A106-A, JESD22-A113-B and JESD22-B106-B), high
temperature in combination with high humidity (JESD22-A101-B, JESD22-A102-C,
A110-B, JESD22-A118, and JESD22-A120).
26

3.7 Test matrix - overview
TABLE 3.1 Test matrix
Test conditions Test specimen
Development
samples or
prototypes
Pilot production
items
All of production
items
Production items
according to
sample plan
Reference test IEC 60068-1
IEC 61000-2
IEC 61000-3
IEC 61000-6-4
IEC 60068-1
IEC 61000-2
IEC 61000-3
IEC 61000-6-4
JESD22
IEC 60068-1
JESD22
IEC 60068-1
JESD22
Environmental test IEC 60068-2
IEC 61000-4
IEC 61000-6-1
IEC 61000-6-2
IEC 61000-6-5
MIL-STD-810F
NORMIC D6-3
IEC 60068-2
IEC 61000-4
IEC 61000-6-1
IEC 61000-6-2
IEC 61000-6-5
MIL-STD-810F
MIL-STD-883E
NORMIC D6-3
JESD22
IEC 60068-2
MIL-STD-883E
JESD22
Non-accelerated
endurance test
IEC 60605-2
IEC 60605-3
IEC 61014

Time-accelerated
endurance test
IEC 60068-2
IEC 60605-2
IEC 61014
IEC 60068-2
IEC 60605-2
IEC 61014

Stress level
accelerated
endurance test
IEC 60068-2
IEC 61014
HALT
IEC 60068-2
IEC 61014
IEC 61163-1
MIL-STD-883E
JESD22
HALT
HASS
IEC 60068-2
IEC 61163-1
HASS
IEC 60068-2
MIL-STD-883E
JESD22
HASA
3.8 Comparison of conventional and new tests
From the test matrix in section 3.7, it appears which conventional test may be
comparable to the new tests. Not all tests within the same box are comparable. It is not
sufficient that test conditions and test specimen are the same. Also the purpose of the test
must be the same. This does not appear, since the matrix has been made only 2-dimen-
sional. The possible comparisons are discussed below.
27

3.8.1 Conventional vs. HALT
Possible comparisons are:
IEC 60068-2: Reproducible environmental tests for general use.
IEC 61014: No specific test, but a scheme for improving product quality.
MIL-STD-883E: Environmental tests and stress level accelerated endurance tests
for discriminating product quality.
JESD22: Reference tests, environmental tests and stress level accelerated
endurance tests for discriminating product quality.
As HALT mainly can be characterised as a stress level endurance test for improving
product quality, it is seen that none of the conventional tests are directly comparable.
Only IEC 61014 for reliability growth test has a similar approach. Since this does not
deal with stress levels, the HALT must be considered as a fundamental change in test
philosophy.
Therefore, even though the philosophy behind HALT is quite logical, it takes
information to change the minds of involved test personnel. In the earlier days, the
criterion for a successful test was no or at least few failures. As to HALT, the criterion
for a successful test is now a lot of relevant failures that is possible to remove.
In conventional testing, specification limits have always been considered a kind of holy
numbers that under no circumstances were to be exceeded. Specification limits,
however, do not reflect fundamental physical limits, but merely a trade-off between
stress and lifetime taking some unavoidable imperfections of the physical realisations
into account.
The equipment fails when the accumulated damage has reached a critically high level.
For mechanical stress, the fatigue damage accumulated is described by Miners criterion
(ref. [16] page 16):
D NS

D is a measure of the fatigue damage accumulated,
N is the number of stress cycles,
S is a measure of the stress level,
is a constant depending on the material (usually ranging from 8 to 12).
From this expression it is clear that a certain critical level of accumulated damage can be
reached either by many cycles of low stress or by few cycles of high stress.
28

It is logical that failures are the knowledge source of possible improvements. With
Miners criterion in mind you may also be able to convince yourself logically that the
high stress levels used in HALT just reducing the waiting time. Nevertheless it takes
time to learn to love the failures as sources of knowledge and overstress as a time and
cost saver.
3.8.2 Conventional vs. HASS
Possible comparisons are:
IEC 60068-2: Reproducible environmental tests for general use.
IEC 61163-1: Stress level accelerated endurance test for improving production processes.
As HASS mainly can be characterised as a stress level accelerated endurance test for
improving production processes, it is seen that it is directly comparable to IEC 61163-1.
In reliability stress screening according to IEC 61163-1, specification limits were also
considered as a kind of holy numbers. HASS allows you to go much further than
anybody would dare in the conventional approach, if only you do it in a very short time.
Taking into account that the accumulation of damage is a function of both stress level
and time, also the HASS philosophy is quite logical. Anyhow, it is difficult to learn not
to be afraid of spoiling good hardware by overstressing the products. However, the
danger is not in taking it over the specifications. The danger is in not being able to
detect the failures. You may have an efficient precipitation screen turning all
imperfections into failures without taking any significant portion of life out of the
product. If you are not able to detect these failures, not only will you miss the object of
HASS, but you will also make things worse. The customer will find the failures shortly
after starting the use of the product and will perceive an even worse quality than if HASS
had not been performed.
HASS is therefore more than the precipitation screen formed by the stress exposure. A
proper detection screen and a measuring system capable of discriminating between the
good and the bad ones are equally important for the efficiency and much more important
in order to avoid accidents.
29

4. Failure analysis an important tool
4.1 Failure analysis Conventional and in relation to HALT
4.1.1 Introduction
Failure analysis of the failed samples is an important component of HALT & HASS in
determining whether a given failure is relevant. An appreciation of the mechanism
behind the failure increases the chances of choosing the right solution. Failure analysis
can also reveal failures not found by the functional screening process.
In this chapter a brief introduction to the method and purpose of conventional failure
analysis is presented. Subsequently, new aspects of the failure analysis in relation to
HALT & HASS are outlined.
A more detailed understanding of failure and yield analysis methods and techniques can
be found in e.g. [18].
4.1.2 Classical failure analysis
First of all the purpose of any failure or yield analysis is to be able to correct the failure
and prevent it from occurring again. In order to be able to do this in an efficient manner
the failure analysis has to conclude on the failure mechanism and the root cause.
The typical object for analysis could be a field failure, production failure or a failed part
from all kinds of prototype testing, qualification tests, etc.
In most situations the occurrence of failure will be seen as a problem that just has to be
fixed in the best way e.g. without or at least with a minimum of redesign or shift of
materials/components. However, the earlier a failure/weakness is identified the easier the
results may be used directly to improve design, material/component selection and to
optimise the production processes.
In order to give a brief introduction to the method of failure analysis the main steps of
the analysis are presented. Examples of results of different kind of analysis will be
included. Information on application of some of the most important failure analysis
techniques is presented in annex 2.
The first step includes characterisation of the failure and the historical data based on
information gained by the client. The process of asking the client the right questions can
roughly be grouped into the following categories:
1) The history of the failed and possible reference devices
2) Characterisation of the failure
30

It is essential to analyse the acquired answers and maybe add more questions if the
gained information does not fully characterise the failure.
Furthermore, it is also important at this first step of the analysis to make a thorough
registration of received failed and reference devices (lot no., serial no., manufacturer,
etc).
It should be kept in mind that to decide on the failure mechanism should not be based on
this initial information solely. This could lead to loss of important evidence in the
subsequent analysis by directing the choice of analysis techniques and narrow ones
attention towards one possible cause of failure. This initial information should only be
seen as the first important piece of the puzzle.
The second step is to cover non-destructive tests and analysis.
Typically this starts with an external visual inspection by use of optical microscopes.
Subsequently electrical characterisation of the failure is performed (dependent on the
degree of testing performed by the client). Other non-destructive tests included here
could be X-ray inspection, SAM (Scanning Acoustic Microscope), IR-microscope and
for semi/hermetic devices - also leak testing.

FIG. 4.1 X-ray micrograph showing voids in solder joints of a BGA.
void
31

FIG. 4.2 SAM micrograph showing disbonding at the die paddle and tape.
X-ray does not only provide information on possible failures, melted wire bondings,
delaminations, etc, but also evaluation construction information can be gained. This is
important information in relation to the next step of the analysis the destructive
physical analysis.
Based on the results gained from the analysis of step 1 and 2 the first plan for the next
level of the analysis must be developed.
When proceeding to the third step of the analysis, which is the DPA (Destructive
Physical Analysis), care should be taken not to eliminate important evidence and not to
introduce new failures. The DPA is divided into 2 parts:
1) The failure site has to be located or verified (if already located by non-destructive
testing).
2) Further analysis of the failure site in order to decide on the actual failure
mechanism.
This third step of the analysis may be very complex and may consist of several different
analyses.
Examples of relevant analysis are:
Decapsulation and subsequent internal visual inspection
Hot-spot analysis
Voltage contrast analysis
Step-by-step cross-sectioning
Step-by-step delamination of a die
Examination by scanning microscope
EDX (Energy Dispersive analysis of X-ray) analysis.
32

FIG. 4.3 Optical micrograph showing cracking problem of a multilayer
ceramic capacitor.

FIG. 4.4 SEM micrograph showing a cracked capacitor on a semiconductor
(cross-section).
33

FIG. 4.5 Example of an EDX spectrum.
The fourth and final step of the analysis is to conclude on the failure mechanism
involved, the root cause of it and recommendations for corrective actions.
4.1.3 Failure analysis in relation to HALT - what is the difference?
First of all: All found failures are seen as a positive results because it gives the
possibility to improve the product design or the production process and that is the whole
purpose of performing the HALT test. It should be stressed that it is recommended to
perform the test as early as possible in the development process. This could be a sub-
module level in order to improve design, material/component selection and/or production
processes with the minimum of costs.
There is no difference in the general method used and analysis techniques chosen when
analysing failures occurred during a HALT test. Except for the time spectra it is
important for the failure analyst to be on the spot to be able to analyse failures
occurred during testing before they are modified. Some types of failures are necessary to
be fixed in order to be able to continue the test and to find all relevant weaknesses.
For every failure found it should be decided whether it is relevant to make corrective
actions on this or is it irrelevant to the actual field service of the tested product. At first
this correlates very well to the classical approach where the goal of a failure analysis is
to relate the failure mechanism to the stress conditions applied so that the risk of failure
in other situations can be estimated. However, in this process it is important to
remember that failure, which has been accelerated by vibration in the HALT test, may
34

occur in the actual field life but it will here be accelerated by another parameter. This
means that the failure mechanism must be found and then the possibility of the
occurrences of this mechanism and not the type and degree of applied stress must be
evaluated in relation to the products real field life.
One type of failures that may be omitted is the ones that occur because some material
properties change dramatically when temperature exceeds specific values. This can be
permitted if the test temperature before failure is still sufficiently higher than what is
suspected to be the temperature during product field life.
In literature on HALT it is generally recommended to improve the design/process based
on all observed failures as far as it is economically reasonable.
Besides the actual failure analysis it is recommended to include a thorough visual
inspection supplemented by DPA on identified critical parts of the product after ended
HALT test. Information gained during this analysis could add valuable information to the
performed failure analysis that only includes actual failures observed during the HALT
test.
Due to the nature of the HALT test it is not possible to correlate the applied stress to
lifetime of the product and it is therefore not always possible to decide whether observed
wear or degradation should be expected due to normal wear-out e.g. of the solder joints.
However, this analysis can expose weak points not pinpointed by the electrical/-
functional tests performed during the HALT test and furthermore the obtained results
may be used in comparison between a new design/process and an old assembly (with
known lifetime and HALT test results).

35

5. Case studies
This chapter presents practical case studies. The purpose of the case studies was to
demonstrate the application of HALT on a number of different products for very
different applications. The presentation of the cases includes all the practical aspects of a
HALT e.g. criteria for selection of test specimens, function test and function test set-up,
selection of HALT exposures, fixation of test specimen, summary of testing and results
as well as comments and conclusion.
The case studies involved HALT on different test specimens supplied by SPM-members
mainly members of the HALT ERFA group. The test specimens were selected in order
to give an idea of the large variety of products on which it is relevant to perform HALT
as well as fulfilling the objective of this project. The number and variety of products are
under no circumstances exhaustive.
The test specimens included the following very different applications:
A DC/DC converter for use in jet fighters supplied by Terma A/S
A hearing aid supplied by Oticon A/S
Electronics for a ultra sound scanner supplied by B-K medical A/S
Parts for a radio supplied by Bang & Olufsen A/S
The test specimens were exposed to a variety of HALT sequences in order to gather
information regarding:
Relevant HALT sequences both classical HALT i.e. including thermo-mechanical
exposures and customised HALT sequences with e.g. bounce and corrosion
Failures found during HALT in comparison with field failures.
Comparison between HALT and other reliability advancing methods e.g. testing,
and analysis.
A procedure for planning and performing HALT for the first time.
An overview of the case studies can be found in the test plan in table 5.1.
36

TABLE 5.1 Test plan.
Test specimen Supplied by Classical HALT /
Customised HALT
Purpose
DC/DC converter Terma A/S Classical HALT Comparison with other quality
advancing methods
Hearing aid Oticon A/S Customised
HALT
Evaluation of relevant HALT
exposures other than classic
HALT and comparison with
field failures
Electronics for
ultrasound scanner
B-K Medical A/S Classical HALT Comparison with field failures
Parts for radio Bang & Olufsen Classical HALT Comparison with other quality
advancing methods
The planning of the involvement of the companies supplying the case studies was as
follows:
Initial meeting between all relevant people in the company supplying the case and
DELTA in order to plan the testing.
Performance of actual testing.
Issue of test-log.
Modification and re-HALT when applicable.
Issue of updated test-log.
Final meeting between relevant people in the company supplying the case and
DELTA summing up the results of the testing, drawing conclusions and discussing
comments.
Commenting on the draft report. The companies had the right of veto regarding the
inclusion of material in the description of the individual cases.
37

5.1 DC/DC converter supplied by Terma A/S for use in aircrafts
5.1.1 Test specimen
The first case demonstrated classic HALT on a military (MIL) product with the aim of
evaluating HALT against other quality advancing methods. MIL products are special in
that respect that they are normally analysed and tested very extensively combined with
the fact that they are produced in small lot sizes.
Terma A/S wanted to include this particular product in the project as it represented a
generic module for both MIL and other applications i.e. not entirely a MIL product.
Further, it included a process which was new to Terma A/S namely the bonding of the
printed circuit board onto the frame by heat conductive adhesive.
The test specimen was a DC/DC converter module which is applicable for several
products at Terma A/S, including a Tactical Data Unit used in various aircrafts such as
helicopters, fighter and transport aircrafts. The Tactical Data Unit is part of a self-
protection system that enhances the aircraft survivability. The system reduces the pilot
workload as much as possible and enables him to choose the best response to a threat,
thereby achieving maximum self-protection and minimal reaction time. The DC/DC
converter is shown in fig. 5.1.

FIG. 5.1 DC/DC converter.
38

The DC/DC converter was approx. 100 mm by 50 mm. It was supplied via a multi
connector. Further, the converter was equipped with internal temperature sensors. These
were planned to be bypassed prior to the testing in order to avoid unintentional close
down of the test specimens during high temperatures testing.
The converter was mounted in the chassis by means of 2 wedgelock fasteners, which also
acted as heat conductors between converter and chassis.
5.1.2 Purpose of HALT
Terma A/S has experienced that their customers are beginning to require HALT. Thus,
they wanted to evaluate HALT in order to decide whether to include it in the Terma A/S
requirements. Further, Terma A/S wanted to evaluate a new process e.g. the bonding
process. It is new to Terma A/S to bond the printed circuit board onto the frame by
means of heat conductive adhesive, Dow Corning SE-4450.
The purpose of the HALT was to evaluate HALT against other quality advancing
methods as well as a tool for finding failures not found otherwise.
In accordance with Terma A/S procedures the DC/DC converter has been exposed to a
number of quality advancing methods i.e.:
In-house design guidelines (Finite Element Modelling (FEM) was not performed
due to the size of the module).
Calculations of cooling of power module via adhesive to mounting flanges (see
annex 3).
MTBF-calculations.
Qualification testing; vibration i.e. random vibration, and Gunfire vibration
according to MIL-STD-810F (see annex 3).
ESS, i.e. temperature cycling.
5.1.3 Description of HALT
The product is a newly designed product i.e. no records of possible field failures. The
inspection of the product led to believe that the majority of relevant failure mechanisms
would be thermo-mechanical and secondly humidity induced. Thus it was decided to
perform a classic HALT with an option for humidity.
39

The sequence of the HALT was as shown schematically in fig. 5.2. Humidity exposure
was omitted in the cause of testing.

FIG. 5.2 The sequence of the HALT performed on the DC/DC converter.
Further, infrared thermography was performed as a supplement to HALT in order to
evaluate the cooling of the printed circuit board via frame to mounting flanges as well as
the temperature distribution of the DC/DC converter.
The actually recorded temperature and vibration log is shown in fig. 5.3. The complete
HALT lasted 3 days as can be seen below.

Low temperature characterisation
-40C and down in steps of 10C
High temperature characterisation
+70C and up in steps of 15C, 10C, 5C
Temperature cycling
LOL - HOL, 20 cycles
Vibration characterisation
in steps of approx. 10 grms
Combined temperature cycling and vibration
40

E501018 C Overall temperature and vibration log
-100
-50
0
50
100
150
12-05-2003 00:00 12-05-2003 12:00 13-05-2003 00:00 13-05-2003 12:00 14-05-2003 00:00 14-05-2003 12:00 15-05-2003 00:00
Date, time
T
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40
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l
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AIR-TEMP PV
PTC PV
Control

FIG. 5.3 The recorded temperature and vibration log.
Terma A/S supplied 3 modules for the testing. The first 2 modules were tested mounted
in the cabinet, whereas the last module was tested clamped directly to the vibrator plane
without the motherboard and the cabinet in order to eliminate possible failures
originating from the motherboard. The cabinet provided a rigid fixture, to which it was
simple to connect. The cabinet with the DC/DC converter weighed approx 1.5 kg. Fig.
5.4 shows the DC/DC converter when mounted in the HALT chamber.

FIG. 5.4 The DC/DC converter mounted in the HALT chamber. Mounted via its
cabinet (left) and the DC/DC converter clamped to the vibration plane via a
mounting plate (right).
41

The function test during HALT consisted of loading by load resistors on the 4 voltage
outputs of the DC/DC converter. 4 of the voltage outputs were monitored by means of
multi meters whereas 2 of the voltage outputs were monitored by means of oscilloscope.
See fig. 5.5 for the function test set-up.

FIG. 5.5 The function test set-up.
The complete test log can be found in annex 3. The table 5.2 below summarises the
HALT.
42

TABLE 5.2 Summary of HALT of DC/DC converter performed for Terma A/S.
Exposure Remark
LOTL
-70C (start-up)
-76C (operation)
Lower Operational
Temperature Limit.
LDTL Not found
Lower Destruct Temperature
Limit
Low temperature
Weakness Start-up unstable
UOTL +125C
Upper Operational
Temperature Limit.
UDTL Not found
Upper Destruct Temperature
Limit
High temperature
Weakness 12 V disappeared
OVL
Approx. 30 grms (loose
screw), 60 grms (unstable
voltages)
Operational Vibration Level
VDL Approx. 60 grms Vibration Destruct Level
Vibration
Weakness Further examination required
Temperature cycling
(-70C/+125C,
4-10 min. dwell
> 20 cycles)
Weakness Not found
Combined vibration and
temperature
40, 50 and 60 grms,
-70C/ +125C
Weakness
V59, V53, R104 fell off.
Problems regarding the 5
VDC

After a general visual inspection performed at DELTA the conclusion was that there
were found weaknesses, which can be seen in table 5.3. However, it was recommended
that a thorough visual inspection should be performed on all test specimens in order to
uncover other potential weaknesses. Table 5.3 also includes Terma A/S' information
regarding relevance, possible cause and corrective actions as informed during the final
meeting.
43

TABLE 5.3 Weaknesses found during HALT.
Relevance Possible cause Action Weakness found
Yes No (e.g. reference to failure report, etc.).
Unstable start-up of 5V and
3.3V (low temperatures)
X
The characteristics started to change
ripple occurred probably due to limit
of technology.
None
12V disappeared
(high temperatures)
X
Internal temperature limit causing
shut-down, planned to be bypassed.
None
Loose PCB screw
(vibration)
X
The screw might not be tightened
from the beginning.
Locktight
Voltages dropped
(high levels of vibration)
X
Current sense transformer failed due
to hand soldering near 70 Cu which
drained the soldering heat. The
components were designed for vapour
phase soldering.
Review of
production
procedures
V59 and V63 fell off X
Successive failure caused by the
above.
Review of
production
procedures
R104 fell off X
Further
examination
required
Failure during combined tem-
perature cycling and vibration
X
Further
examination
required

The infrared thermography showed that the temperature distribution was OK. It also
helped in identifying the cause of failure when the current sense failed. This lead the
MOSFET transistor controlling the PWM to fail leaving the diodes and rectifiers ON
permanently. Further, comparing the infrared thermogram taken before and after the
HALT revealed elevated temperatures of 2 pins of the connector coupling. The
temperature rise was caused by fretting of the connectors due to a poor test set-up.

44

FIG. 5.6 Infrared thermogram of the component side of the DC/DC converter.
Normal operation.

FIG. 5.7 Infrared thermogram of the component side of the DC/DC converter.
Failure mode.

45

FIG. 5.8 Infrared thermogram of the lead side of the DC/DC converter. Failure mode.
High temperature seen near the diode and rectifier.

FIG. 5.9 Infrared thermogram showing the elevated temperatures of 2 pins of the
connector coupling due to fretting.
46

5.1.4 Comparison with other quality advancing methods and conclusion
The purpose of the HALT performed for Terma A/S was to evaluate HALT against other
quality advancing methods as well as a tool for finding failures not found otherwise.
In the following HALT is compared with the other quality advancing methods utilised by
Terma A/S on this or similar projects.
The in-house design guidelines ensure that in the first place the design is in accordance
with good design practice. The design guidelines include formulas for calculation of
maximum displacement within the frequency range for various leaded components. It
should be noted that the present printed circuit board is more rigid than usual due to the
frame and the gluing process replacing the normal heat sink compound. Further, it is
normal practice at Terma A/S to support large components by glue. Design failures
found during HALT are to be transferred into design guidelines in the future. Thus the
methods support each other, rather than excluding one another.
Calculations of the cooling of the power module performed by Terma A/S (see annex 3)
showed a negligible temperature rise over the flange from the frame to chassis. This was
verified by the infrared thermography.
MTBF-calculations were performed according to MIL-HDCK-217, Notice 2, the use
environment, 55C and 30,000 h inhabited fighter. Presently, the HALT does not provide
any figures for the MTBF or the life time.
Terma A/S performed qualification including random vibration and gunfire vibration i.e.
sine-on random according to MIL-STD-810F. The qualification testing verified the
ability of the test specimen to withstand the level of testing. No failures were found
during these tests though the testing was quite severe. Generally, except the odd loose
screw very few weaknesses were found during vibration testing.
Further, the qualification did not give any indication of the margin. The HALT showed
that the 3 test specimens were similar with design margins way beyond the qualification
limits.
The ESS performed on similar products included one temperature cycle from -40C to
+71C at a rate of 10C/min. and 45 min. of cold soak at -40C and 1 h dwell at +71C
and then back to ambient. Generally, very few weaknesses were found during ESS.
Thus, Terma A/S concluded that HALT was a valuable supplement to the quality
advancing methods normally performed by Terma A/S. It provided a measure of the
design margins. Further, it highlighted potential failures and workmanship failures which
were not found by any of the other methods.
47

5.2 Adapto BTE (Behind The Ear) hearing aid supplied by Oticon A/S
5.2.1 Test specimen
This case demonstrated customised HALT on a medical product with the aim of
evaluating HALT with other exposures than "classic" HALT. Medical products are
special in that respect that the requirements are very severe as it has to be verified that
they are safe for humans to use.
Oticon A/Swanted to include this particular product in the project as it represented a
product which Oticon A/S knew very well both with respect to testing and information
from the field. Oticon A/Shad experimented accelerating various tests in particular a
corrosion test i.e. the sweat test.
The test specimen was a hearing aid called Adapto BTE. The hearing aid is shown in fig.
5.10.

FIG. 5.10 Adapto BTE hearing aid.
Oticon A/S was interested in HALT but found that "classic" HALT did not fit well with
the relevant failure mechanisms of their product. The failure mechanisms of primary
interest were corrosion and mechanical failures originating from drops.
Oticon A/S wanted to evaluate relevant customised HALT exposures - i.e. bounce and
corrosion. First of all, failure mechanisms experienced from the field seemed to point
towards different thing of which corrosion and mechanical failures originating from
drops were of primary interest. They also wanted to see if it was possible to design an
accelerated corrosion/sweat test lasting less than a week reducing the present test time
significantly. Finally, they wanted to compare weakness found during HALT with field
48

failures in order to evaluate the relevance of the failures as well as to evaluate HALT as a
method.
Oticon A/S had performed a number of environmental tests both as part of product
development and qualification of the product e.g.:
Qualification tests
Dry heat
Temperature shock
Damp heat, steady state
Sweat (both as standard Oticon in-house procedure and extended i.e. 3 times normal
duration)
Free fall
ESD
Based on the considerations described in section 5.1.2 it was decided to include bounce
and sweat in the HALT sequence. It consisted of:
1) Vibration characterisation by bounce.
2) Preconditioning by bounce and sweat exposure.
The bounce exposure is very effective in case of light plastic encapsulated test
specimens, which are typically experiencing failures related to mechanical impact from
all possible angles.
This also solves the problem that this type of product is difficult to fixture securely to the
HALT vibration table during exposure to very high vibration levels.
The sequence of the HALT was as shown schematically in fig. 5.11.
The duration of the sweat exposure and the temperature/humidity cycling was longer
than normally seen in HALT. This is due to the nature of the failure mechanism.
49

FIG. 5.11 The sequence of the HALT performed on the Adapto BTE hearing aid.
It was decided to use an artificial sweat which is widely used within the medical industry
in Denmark and is referred to as DIN 53160 sweat. It had the following specification:
Sweat solution: 1 litre distilled water
5 gram NaCl
5 gram Dinatriumfosfat
Acetic acid (to reach the specified ph value, approx. 3 ml)
pH: 4.7
Oticon A/S supplied 10 hearing aids for the testing. The function test during HALT
included the following steps:
1) Programming in technical setting
2) Current consumption mA@1.3 V
3) Electrical/mechanical test with service software tool
4) Listening with press and twist
5) Visual check.
All steps were performed initially, whereas steps 3 - 5 were performed after each of the
exposures.
Fig. 5.12 shows the function test set-up.

Vibration characterisation,
bounce
Pre-conditioning
by bouncing
Sweat exposure
24h@40C/50C/60C/70C/80C
96 h@40C
Reference

HALT
50

Fig. 5.13 shows the Adapto BTE hearing aids ready for the bounce exposure. Where the
hearing aids were lying loose and lifting from the vibration table during the exposure.

FIG. 5.13 The Adapto BTE hearing aid ready for bounce exposure.
During the sweat test the test specimens were placed on a plate in an excicator with the
sweat solution in the bottom. The entire set-up was placed in a room at
+40C/+50C/+60C/+70C. The air inside the excicator was changed every hour (see
also fig. 5.14 below). The test specimens were unpowered during the exposure. A func-
tional test and a visual inspection were performed after recovery.
51

FIG. 5.14 The test specimens in the excicator during the sweat exposure.
The complete test log can be found in annex 4. The table below summarises the HALT.
5.2.4 Test results
TABLE 5.4 Summary of HALT of Adapto BTE hearing aid performed for Oticon A/S.
Exposure Remark
OVL 5.0 g Operational Vibration Level
VDL 12.5 g Vibration Destruct Level
Vibration - bounce
Weakness
Function failure and
mechanical failures

OSL 40C, 24 hours Operational sweat/temperature level
SDL 80C, 24 hours

Sweat/temperature destruct level Sweat/temperature
Weakness Function failure

After a visual inspection the conclusion performed by Poul Hilding Andersson, Oticon
was the weaknesses shown in table 5.5. The table also includes Oticon's information
regarding relevance, possible cause and corrective action.

5
2

Relevance Possible cause Actions / Comments
Observations Photos
found in
fig. 5.14
Yes No
Stay in assembly shell breaks
off/shells separate
1 x Overstress during bounce/bump Failure type not seen by free fall test.
Observed as field failure by service
department.
VC wheel falls into instrument and
cannot rotate
- x Consecutive failure from broken stay Failure type not seen by free fall test.
department.
Wire for telecoil breaks off 2 x Insufficient stress relief. Failure type not seen by free fall test. Never
observed as field failure. Single strand wires
are generally wear at solder joints.
PCB tracks break in flex zone 3 x Lack of flexibility/insufficient stress relief Failure type seen occasionally from rough
handling of instruments in service. Not seen
as field failure. No corrosion seen in
connection with broken track. Possibly a
consecutive failure from broken telecoil
wires.
Litze wire for microphone breaks 4 x Insufficient stress relief. Failure type not seen by free fall test. Never
observed as field failure. Possibly a
consecutive failure from broken telecoil
wires.
Compensation loop on telecoil
loosens
2 x Insufficient stress relief. Adhesive type too
inflexible.
Failure type not seen by free fall test.
department. Also seen during development
phase as critical assembly detail.
MT0 switch fails/function failure - x Failure is most likely related to thermal
overstress (80C) of the amplifier.
Failure is not considered as relevant based on
field failure data for this instrument. MT0
switch is found to be mechanically ok.
Battery drawer opens and battery
may fall out
- x Holding force for battery drawer too low
to withstand bump forces.
Not considered as failure. Design choice wrt.
user requirements.
Microphone fails - x Possibly damaged when instrument was
opened for inspection.
Failure cause not determined.
T
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Photo 3 Photo 4

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54

5.2.5 Failure analysis after exposure to artificial sweat
A failure analysis was performed after the exposure to artificial sweat at various
temperatures. The failure analysis consisted of external and internal optical inspection by
stereo microscope with enlargement up to 40 times. The results of the visual inspection
are shown in annex 4.
In general it could be concluded that no corrosion/migration were observed. Salt residues
were present inside the samples.
5.2.6 Evaluation of exposures and conclusion
The purpose of the HALT performed for Oticon A/S was to evaluate customised HALT
exposures - i.e. bounce and corrosion. They also wanted to see if it was possible to
design an accelerated corrosion/sweat test. Further, they wanted to compare weakness
found during HALT with field failures in order to evaluate the relevance of the failures
as well as to evaluate HALT as a method.
The Adapto BTE hearing aids were exposed to characterisation with bounce and pre-
conditioning with bounce and sweat. The testing revealed a number of mechanical
failures originating from the bounce test. Investigations on the part of Oticon A/S
revealed that a number of the failures found were seen in the field or during service but
not in the free fall test performed as part of the qualification testing. Thus, HALT with
the bounce exposure may be considered as a useful supplement to the testing already
performed by Oticon A/S.
The sweat exposure with the DIN 53160 sweat did not lead to any significant failures
other than some was considered to be related to the high temperature. Thus, the first
attempt to design an accelerated corrosion test was unsuccessful. It is generally accepted
to be difficult to accelerate failures related to corrosion.
However, later failure analysis of the corrosion of field returns by means of EDX was
performed on field samples in order to evaluate the composition of the artificial sweat
use for the sweat exposure. The failure analysis revealed aggressive chloride (NaCl and
KCl) in the corrosion on the printed circuit board and the switch, whereas Na, Ka and
Oxide i.e. bases were found on the other specimens.
Thus it was suggested that future testing should include the evaluation of sweat with the
2 following compositions suggested by Oticon A/S; 1 solution comprising the same ions
as sweat and 1 solution with a significantly higher concentration:
Sweat solution 1: 1 litre distilled water
9 gram NaCl
9 gram Dinatriumfosfat (Na
2
HPO
4
12H
2
O)
Approx. 3 ml. 90% lactic acid (to reach the specified ph value)
pH: 5.0
55

Sweat solution 2: 1 litre distilled water
50 gram NaCl
50 gram Dinatriumfosfat (Na
2
HPO
4
12H
2
O)
80% acetic acid (to reach the specified ph value)
pH: 5.0
Further, it was suggested to expose open samples. This exposure will be performed as
part of the next HALT project "Generalisation of HALT".
5.3 Ultrasound scanner electronics from B-K Medical A/S
5.3.1 Test specimen
The test specimen demonstrated HALT on yet another medical product with the aim of
evaluating HALT by comparison with field failures.
The test specimen was a cassette for the ultrasound scanner type 2102 EXL from B-K
Medical A/S. An ultrasound scanner is showing differences in acoustical impedance as
2D-images. The present scanner was designed to perform non-inversive diagnosis of the
soft parts of the human body for e.g. urology, gynecology, obstetric, etc. or even as part
of surgery in order to see what was happening before, during and after operation.
B-K Medical A/S wanted to include the cassette in the project as it is the back bone of a
product family. Further, it has been in the field for 2-3 years. Thus, B-K Medical A/S has
extensive information from the field.
The ultrasound scanner is shown in fig. 5.16.
56

FIG. 5.16 Ultrasound scanner 2120 EXL.
The cassette consists of 3 large printed circuit boards approx. 300 mm x 400 mm and a
SMPS (Switch Mode Power Supply).
B-K Medical A/S also wanted to include a small embedded PC. The PC was accessory to
the scanner. The purpose of the testing was to find weak points of the embedded PC.
This was particularly interesting as it might be implemented on a large number of
systems. However, it was a fairly new product which was only released approx. half a
year prior to the testing. Thus, B-K medical A/S had very limited field experience of the
PC. However, it was decided to withdraw the PC from the testing in case it became a
showstopper.
A successful introduction of a portable scanner following a HALT has made B-K
Medical experienced and convinced HALT users. It is company policy to perform HALT
on all new products.
However, B-K Medical A/S wanted to evaluate HALT as a tool by comparing the
failures found during the HALT with field failures.
57

The inspection of the product together with discussion with B-K Medical regarding their
qualitative impression of the field information (no thorough analysis had been performed
prior to the testing) led to believe that the majority of the relevant failure mechanisms
would be thermo-mechanical. Thus it was decided to perform a classic HALT.
The sequence of the HALT was as shown schematically in fig. 5.17.

FIG. 5.17 The sequence of the HALT performed on ultrasound scanner electronics.
The actually recorded temperature and vibration log is shown in fig. 5.18. The testing
was performed over 2 periods with reworking in between. The complete HALT lasted 4
days as it can be seen.
0C and down in steps of 10C
High temperature characterisation +40C and up in steps of 10C
Temperature cycling
-20C - +80C, 6 cycles
in steps of 5 grms
Reworking at B-K Medical
Different extra tests at DELTA
58

E501048 B temperature and vibration log, day 1
-50
-30
-10
10
30
50
70
90
09:00 10:00 11:00 12:00 13:00 14:00 15:00 16:00 17:00 18:00
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Tair [C]
PTC [C]
Vibration [Grms]
-50
-30
-10
10
30
50
70
90
08:00 09:00 10:00 11:00 12:00 13:00 14:00 15:00 16:00 17:00
Date, time
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V
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Tair [C]
PTC [C]
Vibration [Grms]

59

-50
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90
08:00 09:00 10:00 11:00 12:00 13:00 14:00 15:00 16:00 17:00
Date, time
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PTC [C]
Vibration [Grms]
-50
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-10
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90
08:00 09:00 10:00 11:00 12:00 13:00 14:00 15:00 16:00 17:00
Date, time
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Tair [C]
PTC [C]
Vibration [Grms]

FIG. 5.18 The recorded temperature and vibration log, day 1 to 4.
B-K Medical A/S supplied one set of electronics together with loose modules and
components for the testing. Fig. 5.19 shows the cassette, the keyboard and the PC when
mounted in the HALT chamber.
60

FIG. 5.19 The cassette together with the embedded PC on the side and the keyboard
The function test during HALT consisted of the steps shown in table 5.5.
61

TABLE 5.5 Function test.
Test Description
Low voltage Off/on at 90 VAC, Scanning with 8660 on phantom
High Voltage Off/on at 264 VAC, Scanning with 8660 on phantom
Nom. Voltage Off/on at 230VAC
+5V D 5V digital +/- 2% (4.9 5.1V)
+3.3VD 3.3V digital +/- 5% (0.31 - 3.47V)
+5V A 5V analog +/- 5% (4.75 5.25V)
-5V A -5V analog +/- 5% (-4.75 -5.25V)
+12V A 12V analog +/- 5% (11.4 12.6V)
-12V A -12V analog +/- 5% (-11.4 -12.6V)
+5VD ripple Ripple on 5V digital
B-Mode B-Mode scanning with 8660 on phantom
B-Mode MFI 5, 7 and MHz
3-D system Capture scan
Triplex Doppler on phantom
Triplex Doppler noise (gain)
B-Mode 1 element sweep on 8660
Test osc Analog test oscillator

Fig. 5.20 overleaf shows the fairly extensive function test set-up.
62

The complete test log can be found in annex 6. Table 5.6 overleaf summarises the
HALT.
63

TABLE 5.6 Summary of HALT of ultrasound scanner electronics performed for B-K
Medical A/S.
Exposure Remark
LOTL
-35C (cassette)
-10C (PC)
Lower Operational
Temperature Limit.
LDTL Not found
Lower Destruct
Temperature Limit
Low temperature
Weakness VGA image falls out
UOTL +59C
Upper Operational
Temperature Limit
UDTL Not found
Upper Destruct
Temperature Limit
High temperature
Weakness
Scanner converting
unstable

OVL Approx. 35 grms (cassette) Operational Vibration Level
VDL Approx. 30 grms (SMPS) Vibration Destruct Level Vibration
Weakness
SMPS fails due to loose
screw in fan
Further examination
required
Temperature cycling
(-20C/+85C, 10 min.
dwell
6 cycles)
Weakness Not found
Combined vibration
and temperature
30, 40 and 50 grms, -
70C/+125C
Weakness
Doppler and 3D function
unstable
(It was not possible to
perform detailed function
test during combined
vibration/-temperature)

The conclusion after a general visual inspection performed at DELTA was that the
weaknesses listed in table 5.7 were found. Table 5.7 gives also a hint on the root cause
and actions as stated by B-K Medical A/S.
64

TABLE 5.7 Weaknesses found by HALT.
Stress level Error description Failing
module
Component
-20 to -40C 3D system stops Error disappears when stress is
removed
ZN0377 -
-20C VGA output unstable (White stripes) ZH0743 Error not found , but
similar problems seen in
production during cold
start at 10C
+60C Scanner stops after Switching task ZD0767 M. osc
+60C Fan on 3D system does not start. OK when
cooled again
ZN0377 -
+70C 3.3V shorted after adjusting master osc. ZD0767 U48 (VD7046)
+70C Keyboard error (Not initialised) ZD0767 U51
5G Keyboard error (Not initialised) ZD0767 U51
20G Doppler stopped and B-picture was not updated ZD0767 Rework at U117
50G Lines on composite video (only visual
inspection)
ZD0743 Loose capacitor ?
50G Keyboard not responsive ZH0676 C10 loose and cable to
keyboard loose
50G Scanner stopped SMPS Short circuit in filter
board in SMPS
50G Front-end board error, No Doppler information ZE0724 Crystal defective
MB0074
50G Front-end error ZE0724
(ZE0728)
4 pcs. transmitters
defective
10G temp cycle Doppler board stopped ZD0758 Trouble shooting in
progress
30G temp cycle Keyboard error ZD0767 U51 and reset of
NVRAM
30G temp cycle
+80C
Test impossible as master oscillator stopped ZD0767 -
50G temp cycle
-20C
Language changed during test ZD0767 Battery ?
50G temp cycle Cassette unable to start ZE0728 Defective
50G temp cycle Cassette unable to start SMPS Filterboard
50G temp cycle Cassette unable to start ZH0795 F1 loose

65

5.3.4 Failure analysis of Octal D-type flip-flops
During vibration it was not possible to activate the keyboard. The 2 Octal D-type flip-
flops were considered to be part of the cause of that failure. The 2 flip-flops were
positioned on the same board in the centre of the board.
The failure analysis consisted of external visual inspection, electrical measurements, X-
ray inspection, chemical stripping and internal visual inspection. The complete report of
failure analysis can be found in annex 5.
The I/V characterisation showed results as could be expected for one of the flip-flops
(S/N 00222). Whereas output 12 of the other flip-flop (S/N 00227) was observed to be
degraded, see fig. 5.21 below.

FIG. 5.21 Left: Characteristic of good flip-flop output.
Right: Characteristic of flip-flop output 12 of S/N 00227.
External visual and X-ray inspection showed nothing unusual on any of the flip-flops.
By internal visual inspection after decapping a severe degradation was observed on S/N
0227 at pin 12 and on part of the GND metallisation (see figs. 5.22 and 5.23). Nothing
unusual was observed on S/N 00222 after decapping.
66

FIG. 5.22 Optical micrograph of S/N 0227 showing survey of the die and location of
the observed degradation.

FIG. 5.23 Optical micrograph of S/N 00227 showing an enlargement of the degraded
area of pin 12.
67

Based on the appearance of the failure site it was concluded that excessive current load
had occurred on pin 12. B-K Medical A/S was recommended to evaluate whether the
functional testing performed during HALT could have caused this electrical overstress or
whether the root cause of the observed failure was degradation of other components in
the application.
B-K Medical A/S concluded that the error was probably caused by a bad connection in
the keyboard connector. This could also explain the problems experienced during
vibration, where the keyboard reacted slowly on key-press and the hourglass popping up
continuously. The flip-flop controls the reset of the keyboard and the load of the cable
and the input filter in the keyboard circuit, switching on and off during vibration might
have caused the excessive current in the output. The flip-flop has never been reported
failing in the field.
5.3.5 Evaluation of exposures and conclusion
The purpose of the HALT performed for B-K Medical A/S was to evaluate HALT as a
tool by comparing the failures found during the HALT with field failures.
B-K Medical A/S went through a tedious process of transforming the field data from
ASCII files into lists giving an overview of field failures. When this was done a top 10 of
the failures could be listed in order of occurrence:
1) Keyboard ZH0676
2) SMPS
3) UL0018 (not tested)
4) Doppler
5) Front end VE5274 (HV-Mux)
6) Front end ZE0728 (X-mit module)
7) Core board VC1506 (Master oscillator)
8) Core board VE5279(OP-AMP for AD converter)
9) Core board - QB0041 (battery)
10) Core board VD7046 (U48)
When the top 10 list of field failures was compared to the failures found during HALT it
could be seen that all the field failures except the UL0018 - which was not tested - were
found during HALT. Further, all failures found during HALT had been seen in the field
one way or the other.
68

In general B-K Medical A/S viewed the HALT very positively and will go on exposing
new products to HALT.
5.4 Modules for BeoSound 1 and BeoSound 3000 from Bang & Olufsen A/S
5.4.1 Test specimens
The case demonstrated HALT on audio modules with the aim of finding weaknesses as
well as evaluating HALT by comparison with Bang & Olufsen A/S' Accelerated Thermal
Stress Test (ATST).
The test specimens were modules for audio equipment namely BeoSound 1 and
BeoSound 3000.
The modules were a Switch Mode Power Supply (SMPS) for BeoSound 1 and PCB 12
i.e. Input-select for BeoSound 3000.
The BeoSound 1 and BeoSound 3000 are shown in fig. 5.24.

FIG. 5.24 BeoSound 1 and BeoSound 3000.
Bang & Olufsen A/S wanted to evaluate HALT with respect to finding potential
weaknesses as well as to compare it with the Bang & Olufsen ATST.
The ATST is a famous Bang & Olufsen speciality. The purpose of the ATST is to verify
that solder joints will not fail due to fatigue, which caused by improper design of solder
joints, physical placement and fixation of components or mismatch between coefficients
of thermal expansion for different materials. It is performed on all new printed circuit
boards designed by and for Bang & Olufsen A/S.
69

It was decided to perform a classic HALT particularly aiming at thermo-mechanical
failure mechanisms in order to make it comparable to the Bang & Olufsen ATST-test.
Fig. 5.25 shows the sequence of the HALT performed.

FIG. 5.25 The sequence of the HALT performed on the modules for BeoSound 1 and
BeoSound 3000.
The actually recorded temperature and vibration log is shown in fig. 5.26. As it can be
seen the complete HALT lasted 3 days.
+10C and down in steps of 10C by approx. 2C/min.
High temperature characterisation
+40C and up in steps of 10C by approx. 5C/min.
Temperature cycling
-55C - +110C, 30 min. dwell, 10 cycles
in steps of 5 grms
-55C - +110C/ 30, 40 50 grms, 1 cycle each vibration level
70

E501018 A Overall logcurve
-80
-60
-40
-20
0
20
40
60
80
100
120
14-apr 09:00 14-apr 15:00 14-apr 21:00 15-apr 03:00 15-apr 09:00 15-apr 15:00 15-apr 21:00 16-apr 03:00 16-apr 09:00
Date, time
T
e
m
p
e
r
a
t
u
r
e

[
C
]
0
10
20
30
40
50
60
70
80
90
100
V
i
b
r
a
t
i
o
n

l
e
v
e
l

[
G
r
m
s
]
Tair [C]
Tproduct [C]
Vibration [Grms]

FIG. 5.26 The recorded temperature and vibration log, day 1 to 3.
Bang & Olufsen A/S supplied 5 SMPS modules and 3 PCB 12 in order to have extra
samples for by-pass of failures and modification. Fig. 5.27 shows the modules when

SMPS

PCB 12

FIG. 5.27 The SMPS module for BeoSound 1 and PCB 12 for BeoSound 3000

71

The accelerometers and temperature sensors were placed as shown in fig. 5.28.

SMPS

Accelerometer at fixture
near SMPS, Z-axis

Product Temperature
Control sensor (PTC)

PCB 12

Accelerometer at fixture
near PCB 12, Z-axis

Accelerometer on PCB 12,
Z-axis

Temperature sensor - 3

FIG. 5.28 The location of accelerometers and temperature sensor.
The modules were monitored by means of a complete Bang & Olufsen A/S equipment.
The function test included power off and power on.
The complete test log can be found in annex 6.
72

5.4.4 Summary of HALT
Table 5.8 below summarises the HALT.
TABLE 5.8 Summary of HALT of SMPS module for BeoSound 1 and PCB 12 for
BeoSound 3000 performed for Bang & Olufsen A/S.
Exposure SMPS PCB 12 Remark
LOTL -55C -35C
Lower Operational
Temperature Limit
LDTL Not found Not found
Lower Destruct
Temperature Limit
Low temperature
Weakness
Noise during
change between
radio and CD
Radio "scratches"
UOTL Not found Not found
Upper Operational
Temperature Limit
UDTL Not found Not found
Upper Destruct
Temperature Limit
High temperature
Weakness
(Stopped at
+110C due to
test cables)
(Stopped at
+110C due to
test cables)

OVL
25 grms
(5 components)
30 grms by L7)
Not found
Operational
Vibration Level
VDL Approx. 35 grms Approx. 65 grms
Vibration Destruct
Level
Vibration
Weakness
Mounting of C1,
C21, C22, C54,
C55, RT1 and L7
Mounting of C97
and C107.
Mounting flange
on mains bar

Temperature cycling
(-55C/+110C,
30 min.dwell
10 cycles)
Weakness
Incipient stress
symptoms at
solderings of
heavy com-
ponents (not
critical yet)
Incipient stress
symptoms at
solderings of
heavy
components (not
critical yet)

Combined vibration
and temperature
cycling
10, 20, 30, 40 and
50 grms, -55C and
+110C
Weakness
Problems
regarding CD
playing at low
temperatures.
Mounting of C11
and U2
Mounting of C89.
Mounting flange
on mains bar.
Antenna
connector broken
in one side

73

The conclusion after a general visual inspection performed at DELTA was that the
weaknesses listed in table 5.9 were found. However, it was recommended that a
thorough visual inspection should be performed on all test specimens in order to uncover
other potential weaknesses.
TABLE 5.9 Weaknesses found by HALT.
SMPS for BeoSound 1 Relevance Possible cause Action Re-HALT
Weakness found Yes No (e.g. reference to failure
report, etc.)
Yes No
Noise during change of between
radio and CD X

No
RT1 fell off
X

Yes
C21, C22, C54 and C55 fell off
X
Bonded by adhesives in
portable equipment
L7 fell off
X

No
C11 fell of
X

No
U2 broke off
X

No
CD playing stopped at low
temperature/vibration X

No

PCB 12 for BeoSound 3000 Relevance Possible cause Action Re-HALT
Weakness found Yes No (e.g. reference to failure
report, etc.)
Yes No
Radio "scratches" at low
temperature X

C97 and C107 fell off
X

C89 broke off
2

X

Mounting flange of the mains bar
broke off
1

X

Antenna connector broke off
2

X

Note 1: The mains bar was used as part of the mounting of the PCB during the HALT
Note 2: Caused by the mains bar breaking off.
Bang & Olufsen A/S commented that even though the failures had been seen, it was very
rarely, due to the nature of the use pattern and thus not subject to corrective actions.
5.4.5 Comparison between ATST and HALT
In order to compare the ATST and the HALT extra HALT temperature cycling were
performed in addition to the previously described HALT.
74

The following tests were performed on the SMPS for BeoSound 1.
HALT temperature cycling: -55C/+110C, up to 30 cycles air to air. The solder
joints were evaluated by external visual inspection after 10, 20 and 30 cycles.
ATST temperature cycling: +5C/+80C, up to 1500 cycles, liquid to liquid. The
solder joints were evaluated by external visual inspection after each 300 cycles.
The Bang & Olufsen procedure for the ATST is as follows:
1) The PCB is cleaned, if necessary, before testing, so that faulty soldered
joints are easy to detect.
2) The PCB is cycled between hot and cold water baths at least 2100 times at
each bath in sequences of 300 cycles followed by inspection.
3) The PCB must be in each bath for at least 300 sec.
4) The temperature in the cold bath must be below +5C.
5) The temperature in the hot bath must be approx. +80C.
6) The test period is approx. 3-4 weeks.
The results of the tests can be found in table 5.10 below.
TABLE 5.10 Results of comparison between HALT and ATST.
HALT cycling ATST cycling
10 cycles 20 cycles 30 cycles 900 cycles 1200 cycles 1500 cycles
U6 + + U2 + +
R6 U2 - D1 L2
R58 L2 L7
L7 TB1 Q1
C31 RT1 T2
C21 C15
C22 J1/JST
C55 SMD resistor

75

Fig. 5.29 shows examples of solderings from Bang & Olufsen guideline for ATST with
the Bang & Olufsen A/S characterisation in white print on the photo.

76

77

FIG. 5.29 Examples of solderings from Bang & Olufsen's guideline for ATST.

78

Figs. 5.30 5.33 show photos of the failures found during HALT.

FIG. 5.30 C21.

FIG. 5.31 RT1.
79

FIG. 5.32 C22.

FIG. 5.33 U2.
80

Further, cross-sectioning of selected components from the HALT were made by Bang &
Olufsen A/S. For examples see figs. 5.34, 5.35 and 5.36.

FIG. 5.34 BeoSound 1 SMPS, component U2. The soldering is characterised by
degraded surface with a number of stress lines.

FIG. 5.35 BeoSound 1 SMPS, component U2. The photo was taken with fluorescence
filter. A crack is seen around the component lead.
81

FIG. 5.36 BeoSound 1 SMPS, component C21. Degradation of the surface with little
cracks is seen. A crack in the soldering near component lead has developed.
It can be seen that the cracks were caused by vibration rather than tempera-
ture cycling from the way the cracks run.
5.4.6 Evaluation of test and conclusion
Bang & Olufsen A/S concluded:
Bang & Olufsen A/S found HALT interesting. They believed that HALT could be
a useful supplement to extensive testing and analysis already done by Bang &
Olufsen A/S. It was found particularly interesting as a means of evaluating
subsuppliers.
Some of the results were comparable, however, in general the results obtained by
HALT cycling were not the same as the ones found by the ATST cycling.
Some of the weaknesses found during HALT occur at or near the component body
rather than in the soldering e.g. cracks in the housing or broken leads. However,
they still provided a good indication of weaknesses in the design.
Both ATST and HALT helped eliminating weaknesses of the design. However,
one of the tests alone would not find all weaknesses. HALT performed on a new
design would certainly give a lot of hints on weaknesses, as this investigation
showed good correlation between most of the weaknesses of the BeoSound 1
SMPS and field failures. However, ATST should not be omitted as a lot of the
early weaknesses of the SMPS had been found and corrected by this method.
The BeoSound 3000 PCB 12 was so robust that only very few weaknesses were
found. However, this is in good correlation with the fact that field failures did not
seem to occur at PCB level.
82

6. Survey of results

Specification limits HALT limits found Product Application
Low
temp.
High
temp.
Vibration LOL UOL VOL SOL
DC/DC
converter
Air fighter -40C +85C 12.6 grms -70C +125C 60 grms -
Hearing aid Human body -25C +55C - - - 7.5 grms 24 h@40C
Ultrasound
scanner
electronics
Clinic/lab -10C +40C 2 g -35C +59C 35 grms
Modules for
audio
equipment
Indoors living
room
+10C 40C 2 grms -55C/
-35C
Not
found
30 grms/
Not
found
-

83

7. Guidelines
The findings of this project resulted in the formulation of guidelines for introduction of
HALT & HASS, guidelines for selection of HALT exposures and guidelines for design
of HASS cycle. The guidelines are presented in this chapter.
7.1 Guideline for introduction of HALT & HASS
When introducing HALT into a company it was important to realise it was a completely
new philosophy and not just a new way to do what were already done. Otherwise the
results would be misinterpreted. Thus, some information as well as a lot of planning
were required. In order to prepare the companies participating in this project as well as
other companies performing their first HALT the checklist below was made by DELTA
and supplemented by the Bang & Olufsen participants in the HALT testing.
Purpose of the testing
All involved parties have to know of the philosophy of HALT & HASS prior to
the testing.
The purpose of the testing has to be decided e.g. investigation of a new product,
benchmarking of different versions of a new product, investigation of field
failures, benchmarking or check of subsuppliers.
Planning of the testing
Economical and human resources have to be earmarked.
The time frame has to be planned.
Considerations of the exposure of the test specimens
What are the test specimens?
Can more test specimens be tested at the same time in order to save cost?
Is it relevant to perform the testing on sub-modules due to weight, size, thermal
mass or complexity of the test specimen?
Is it relevant to introduce a reference specimen i.e. a specimen with a well known
field record, a competitive product etc. together with the actual test specimen in
order to evaluate the result of the testing or to give an absolute measure of the
result?
How is the test specimen used during normal life?
What are the specification limits?
84

What are the top-10 list of failure mechanisms of similar products?
What exposures are relevant?
How is the specimen to be fixed onto the HALT vibration table?
Who is responsible for the fixture?
Is it relevant to reduce the thermal time constant by removing or making holes in
cover plates?
Where to place temperature sensors and accelerometers; Are there points of
particular interest on the test specimen?
What to bring to the test facility
3-5 test specimens are desirable. However, cost and availability often have to be
considered.
Spare modules, parts and components.
Toolbox with components, fuses, adhesives (a hot-melt, which stays solid above
110C is useful e.g. RTV 133), straps etc.
Measuring equipment.
Extension and connecting cables to connect to the test specimen from the outside
of the HALT chamber. 2-3 m of cable are required in order to operate the
equipment under test without being in the way of the HALT operator. Be aware of
the temperature range of test wires. It is wise to use original connectors and solder
extensions on to them. Check all wires by microscope prior to the test. Different
colours of the wires are recommended a bundle and 16 connectors all with
black wires are difficult to distinguish.
Diagram and manuals.
Camera.
ESD and clear bags for broken bits.
A good microscope if relevant.
Protection box i.e. provision for decoupling mechanical impact and keeping
temperature within narrow limits e.g. for sensitive circuits which have to be inside
the HALT chamber.
85

Necessary manning of the test
Designers responsible for electronics, mechanical construction or other relevant
disciplines.
Observer responsible for reporting, registration of failures, etc.
Considerations regarding the monitoring of the function of the test specimen
Monitoring of as many functions as possible.
Continuous monitoring.
Remote operation of switches, etc.
Timing of manual operation of test specimen with respect to the HALT exposures.
The function test sequence has to be carried out within approx. 10 min.
Determination of malfunction criteria prior to the testing.
Check of function test sequence and set-up the company prior to testing at HALT
facility.
Evaluation of the result of the HALT
Is the result adequate? Fig. 7.1 shows a paradigm for summarising of results?
Is further failure analysis and root cause analysis required
Has the action list been filled in?
Is re-HALT required?
Is HASS required?
Is a HASS cycle required to be designed?
86

TABLE 7.1 Paradigm for summarising of results.
Weakness Relevance Possible cause Action Re-HALT
Yes No (e.g. reference to failure report, etc.

7.2 Guideline for selection of HALT exposures
The HALT exposures are selected from the list below in order to expose relevant failure
mechanisms. The selection is based on an evaluation of the design of the product, a
review of the top-10 list of field failures of similar products already in the field if
possible as well as in-house experience.
According to Hobbs (ref. [16] the exposures may be selected from this list:
High temperature in combination with powering and possibly reverse bias which
reveals diffusion processes in Silicon, oxidation of cracks and timing problems.
Clock variation which reveals timing problems.
Power cycling possibly in combination with temperature cycling and 6-axis
vibration which reveals thermo-mechanical weaknesses, design weaknesses and
accelerated electro migration.
Temperature cycling (particularly in combination with modulated excitation)
which reveals interconnection problems, poor solderings, bonding failures and
timing problems.
Power variations in combination with temperature which reveals marginal design.
Vibration which reveals mechanical design weaknesses e.g. large components not
supported sufficiently, weak cable locks and other problems related to cabling.
Vibration in combination with temperature cycling which reveals poor solderings.
Humidity which reveals corrosion problems.
87

Humidity in combination with high pressure which reveals poor grounding and
insulation problems.
ESD which reveals design robustness.
Electro Magnetic Interference which reveals design margin.
When relevant failure mechanisms have been thermo-mechanical in nature a classic
HALT sequence is suggested, see below:
1) High and low temperature characterisation in order to find operating and destruct
limit. Power ON/OFF.
2) Temperature cycling between the low and high operating limits.
3) Vibration characterisation; 6-axis vibration.
4) Combined temperature cycling and vibration exposure.
However, experience has shown that it can be very effective to replace 6-axis vibration
by bounce in case of small plastic products which are typically experiencing failures
related to mechanical impact from all possible angles. This also solves the problem that
this type of product is difficult to fixture securely to the HALT vibration table during
exposure to the very high vibration levels.
In other cases it has been successful to expose failures related to bonding weaknesses
and interconnection of sensor cables in small light plastic products by the following
sequence:
1) Temperature characterisation.
2) High temperature/humidity.
3) Low temperature.
4) Drop when product still at low temperature.

88

FIG. 7.2 Drop exposure performed on test specimen still at low temperature.
When it comes to corrosion related weakness the selection of the relevant corrosive
exposure has been based on a failure analysis of similar products in the market in
combination with evaluation of the materials forming the design.
7.3 Guideline for design of HASS cycle
HASS is a screening test aimed at finding failures originating from the production
process. The purpose of HASS is:
to expose the largest number of latent failures at the lowest possible cost in the
shortest possible time in order to reduce feedback delay.
to establish the basis of a program of failure analysis and corrective actions for all
failures found during screening.
to increase field reliability by reducing the total number of failures sent to the
market.
to reduce the total production, screening, maintenance and warranty cost.
89

to increase customer satisfaction and thus market share.
to increase profit due to increased volume.
All production samples are tested and shipped to customers afterwards. Thus, the
specimens are stressed well below the destruction limit. However, the duration of the
HASS also has to be very short in order not to increase production time significantly.
This is the trade off to be made when designing the HASS cycle. The procedure is as
follows:
1) The design of the HASS cycle is based on relevant failure mechanisms.
2) HALT is performed and design failures are eliminated.
3) The first suggestion based on the results of the HALT is made.
4) 3-5 HASS cycles are performed. Failures are recorded as a function of the cycle
number.
5) The HASS cycle is optimised based on Miners criterion in order to reduce the
number of cycles to 1.
6) The resulting HASS cycle is verified.
7) Safety of HASS is verified by performing 20-50 of the resulting HASS cycles on a
number of test specimens and afterwards performing a full qualification test on the
same test specimens in order to verify that sufficient life is remaining in the test
specimen.
90

8. Discussion and conclusion
The purpose of this project was to give Scandinavian companies who want to explore the
new exciting test philosophy of HALT &HASS an input to decision making on when and
how HALT & HASS is relevant to their product by answering the following questions:
How does HALT & HASS fit in with other test and analysis method?
What is there to gain from HALT & HASS?
How do HALT results compare to field failures?
How to get started?
Which HALT & HASS exposures are relevant?
How to come from HALT to HASS?
It should be noted that focus of the project was on classic HALT i.e. HALT with thermo-
mechanical exposures as it fitted best with the cases supplied by the various companies.
The first question has been answered by describing HALT & HASS and relating them to
other test strategies. Further, a description of failure analysis in relation to HALT is
given. Failure analysis form an important part of the HALT process. From this
description it can be concluded that HALT & HASS is a completely new philosophy and
not just a new way of doing what has already been done for a long time. In HALT focus
is on finding relevant failure mechanisms as fast and efficiently as possible rather than
simulation of real environmental conditions in a well-defined and reproducible manner.
It also has to be concluded that HALT & HASS is a valuable supplement to the
conventional tests rather than a replacement for these tests.
The main focus of the project was on the practical part demonstrating the application of
HALT on the following very different products:
DC for aircrafts from Terma A/S
Adapto BTE hearing aid from Oticon A/S
Electronics for ultrasound scanner from B-K Medical A/S
Parts for radios from Bang & Olufsen A/S
From the testing it could be concluded that there was a lot to be gained from HALT i.e.:
Large and well-know margins of strength compared to use conditions.
A lot of relevant failures, not found by other tests or analysis methods used by the
participating companies, were revealed.
HALT is a fast and efficient way of developing reliable products as opposed to
qualification tests which are aimed at verifying that minimum requirements are
91

fulfilled. Popularly, it can be said that HALT is based on the reliability
experienced by the user i.e. real life reliability.
There is generally good correlation between failures found during HALT and field
failures this is particularly the case of thermo-mechanical failures.
HALT is a very useful tool for fast evaluation of new processes, different variants
of the same product or benchmarking of sub-suppliers.
It is important to base the selection of HALT exposures on all relevant failure
mechanisms and thus also consider customised exposures i.e. bounce, humidity
and corrosion. However, due to the focus on HALT with thermo-mechanical
exposures in this project. These other exposures have to be investigated further.
It is difficult to accelerate failure mechanisms related to corrosion. It has to be
further investigated.
A new HALT project namely Generalisation of HALT focusing on HALT with
non thermo-mechanical exposures have already been planned.
Representatives from the different companies participated in the HALT with their own
product. Thus, they experienced on first hand how a HALT was prepared and performed.
They were present when the test specimens failed and evaluated the relevance of the
failure and took part in the repair/bypassing of the failure in order to proceed with the
test. The experiences and the comments of the companies are described in the report and
form the basis of the formulation of guidelines of chapter 7; guidelines for introduction
of HALT & HASS, guidelines for selection of HALT exposures and guidelines for
design of HASS cycle.
The guidelines for introduction of HALT & HASS were first formulated as a checklist
by DELTA in order to prepare the companies participating in this project as well as other
companies performing their first HALT. Later it was supplemented by the Bang &
Olufsen participants in the HALT testing.
The guidelines are intended to serve as a tool for present and future users of HALT.
92

Annex 1

Literature references

(2 pages)
93

Literature references
1) IEC 60068-1: Environmental testing General and guidance.
2) IEC 60068-2: Environmental testing Tests.
3) IEC 60721-1: Classification of environmental conditions Environmental
conditions and their severities.
4) IEC 60721-2: Classification of environmental conditions Environmental
conditions appearing in nature.
5) IEC 60721-3: Classification of environmental conditions Classification of groups
of environmental conditions and their severities.
6) IEC 60721-4: Classification of environmental conditions Guidance for the
correlation and transformation of the environmental classes of IEC 60721-3 and
the environmental tests of IEC 60068-2- Introduction. (104/143/CDV).
7) IEC 60605-1: Equipment reliability testing General requirements
8) IEC 60605-2: Equipment reliability testing Design of test cycles.
9) IEC 60605-3: Equipment reliability testing Preferred test conditions.
10) IEC 61014: Programmes for reliability growth
11) IEC61163-1: Reliability stress screening Repairable items manufactured in lots
12) MIL-STD-810F: Environmental engineering considerations and laboratory tests
13) MIL-STD-883E: Test method standard, microcircuits
14) NORMIC D6-3: Environmental classification of microsystems and introduction to
qualification testing. ELTA project no.: P1404-1 1999-09-22
15) JESD22 standard series from JEDEC. JEDEC Solid State Technology Association
is the semiconductor engineering standardisation body of the Electronic Industries
Alliance. The documents are currently published on www.jedec.org on the
internet.
16) Accelerated reliability engineering. HALT and HASS. Gregg K. Hobbs. Wiley &
Sons Ltd, 2000.
17) HALT, HASS & HASA Explained. Accelerated Reliability Techniques. Harry W.
McLean. American Society for Quality, 2000.
18) Failure and yield analysis handbook
D.L. Burgess and O.D. Trapp from Technology Associates
94

19) NORMIC D6-5: Guidelines for testing of microsystems
Jesper Bay, Povl K. Birch, Jens Branebjerg, Viggo Brndegaard Nielsen, Susanne
Otto, Bjarke Schnwandt, DELTA

95

Annex 2

DELTA HALT facilities

(2 pages)

T H E K N O W L E D G E C E N T R E
HALT and HASS
A vaccine against teething troubles in new products
P127 ver.010
Why HALT and HASS?
HALT (Highly Accelerated Life Testing)
and HASS (Highly Accelerated Stress
Screening) find and rectify weaknesses
in products. The result is more reli-
able products, more satisfied custom-
ers, reduced warranty service costs
and shorter time-to-market. Our first
HALT test run on a brand new type of
product was very positive. We found
failures that might well have resulted
in increased warranty service costs if
they hadnt been rectified, commented
Flemming Nielsen, Hardware Engineer
at B-K Medical A/S
What is HALT and HASS?
HALT identifies design weaknesses
whereas HASS identifies weaknesses
resulting from the manufacturing pro-
cess. Both tools are highly effective.
This capability is achieved by testing at
extreme levels, well beyond the specifi-
cations. In this way, failures are detec-
ted within a few hours instead of after
weeks of traditional testing or years on
the market.
The benefits of HALT and HASS
The advantages of HALT and HASS are:
Huge savings in warranty and servi-
cing costs
Shorter time-to-market
Confidence and insights when intro-
ducing new products
Large and known strength margins
to operational stress
Product is mature and free from
teething troubles when it goes into
production
Reduced rework in production
Failures practically never occur
when product in use
Possibility of investigating field
failures
Customer requirements satisfied.
T H E K N O W L E D G E C E N T R E
DELTA
.
Venlighedsvej 4
.
2970 Hrsholm
.
Denmark
Tel. +45 72 19 40 00
.
Fax +45 72 19 40 01
.
email: halt@delta.dk
Also see www.delta.dk/halt
How is HALT carried out?
Testing procedures are selected on the
basis of relevant failure mechanisms.
There is no standard procedure.
Testing might include:
1. Temperature characterisation; low
and high temperatures; functional
and destruction limits defined.
Power ON/OFF
2. Extremely rapid temperature cycling
between the limits identified
3. Vibration characterisation
4. Combined temperature cycling and
vibration stress testing
5. Where relevant, combined tempera-
ture and humidity stress-testing and
cold/drop stress tests.
How is HASS carried out?
HASS testing procedure is designed
on the basis of the limits identified by
HALT. A typical procedure consists of
rapidly induced temperature changes
combined with 6-axis vibration. Tests
are of short duration - ideally lasting
just a few minutes. It is critical to
ensure sufficient lifetime remaining
in the products after screening, and
that all induced failures are found.
Otherwise the customers will discover
them later!
It is the HALT and HASS fault analysis com-
bined with the improvement process that
results in enhanced products.
Failure analysis
Failure analysis is an important com-
ponent of HALT and HASS in determin-
ing if a given failure is relevant. An
appreciation of the mechanism behind
the failure increases the chances of
choosing the right solution. Failure
analysis can also reveal failures not
found by the functional screening pro-
cess. Analysis is performed using tools/
techniques such as:
External and internal visual inspec-
tions
X-ray inspection
Electrical metering
Mechanical and/or chemical sec-
tioning
Scanning Electron Microscope com-
bined with EDX analysis.

Equipment
DELTA has a dedicated HALT equipment
specially intended for temperature,
extreme rapid temperature change and
vibration stress-testing.
Dimensions:
1.06 m x 1.06 m x 1.01 m (W x D x H)
0.91 m x 0.91 m (table)
Temperature:
-100C - +200C, ca. 60C/min.
Vibration:
Up to 70 grms (2 - 10 kHz), 6-axis vibra-
tion.
DELTA also has testing equipment
for e.g. thermal shock in fluid baths,
bounce tests and immediate switching
between low temperature and high
temperature and high humidity.
DELTAs equipment for inducing rapid tempera-
ture changes and 6-axis vibration.
Who stands to benefit from HALT
and HASS?
Generally speaking, HALT and HASS
are ideal for high volume and low value
products or small volume and high
value products. A number of technolo-
gies and industries are already employ-
ing HALT and HASS. These include
space technology, the military, avia-
tion, telecommunication, Information
Technology, medico, automotive, sensor
devices, metering and electronic control
devices
For further information
Contact
halt@delta.dk
Susanne Otto B.Sc.E.E., B Com(Org.),
Consultant
tel. (+45) 65 41 31 52
mobile (+45) 24 23 36 60
suo@delta.dk
or
Kim A. Schmidt, B.Sc.M.E.,
Project Manager
tel. (+45) 72 19 4271
kas@delta.dk
98

Annex 3
Case study - DC/DC converter for use in jet fighters
supplied by Terma A/S - detailed test log,
Cooling of power module, vibrations tests
performed according to MIL-STD-810F

(7 pages)

99

100

101

DELTA/KAS Oversigt over testemner
HALT test af DC/DC converter udfrt for TERMA A/S
DELTA sag nr. E501018 C
Eksponering Dato "A" (ser. No. 3006) "B" (ser. No. 3004) "C" (ser. No. 3007)
Kulde 12-maj x
Varme 12-maj x
Temperaturcycling ( 1cycle) 12-maj x
Vibration 12-maj x
Temperaturcycling ( 20 + 2 cycles) 12 - 13 may x
Kombineret vibration og temperatur 14-maj x
Termovision 14-maj x x
Temperaturcycling ( 5 cycles) 14-maj
x, repareret og
stttelimet
Bemrkninger:
Denne test blev overvret af: Jrn Gaardsvig Nielsen
Henrik Ibsen
Preben Simonsen
Funktionstest bestod af: Belastning p de 4 spndingsudgange
Overvgning af 4 spndingsudgange vha. multimetre
Overvgning af 2 spndingudgange vha. oscilloskop
Denne HALT test blev udfrt vha. flgende udstyr: Thermotron AST-35 HALT test system
Unit ID
CCA, Power supply

102

DELTA/KAS Kuldeeksponering
Resultat
Aktivitet Dato Tid Init. Bemrkning
Initial F-test 12-maj 10:00 Ter OK
Ned til -40C 12-maj 10:01 KAS
F-test ved -40C 12-maj 10:12 Ter OK
F-test ved -50C 12-maj 10:27 Ter OK
F-test ved -60C 12-maj 10:43 Ter OK En enkelt trigning p skop (evt. stjpuls)
F-test ved -70C 12-maj 10:56 Ter
Problemer med opstart p 5 V og 3,3 V,
OK efter et par sekunder
Ned til -80C 12-maj 11:01 KAS Input strm svinger noget
F-test ved -80C 12-maj 11:06 Ter Alle udgangsspndinger falder noget Forsgt med 31 V input
Lidt ekstra forsg 12-maj 11:33 Ter Fejler ved -76C
Tilabge til ambient 12-maj 11:37 KAS
Lower Operational Temperature Limit LOTL -70C (opstart), -76C (drift)
Lower Destruct Temperature Limit LDTL Ikke fundet
DELTA/KAS Varmeeksponering
Resultat
Initial F-test 12-maj 11:52 Ter OK 2 ekstra temp. Flere, T2 p kasse og T3 p print
Optil +70C 12-maj 11:58 KAS
F-test ved +70C 12-maj 12:35 Ter OK
F-test ved +130C 12-maj 13:28 Ter +12 V vk ellers OK OK et kort jeblik ved power off/on
Ned til +125C 12-maj 13:30 KAS
F-test ved +125C 12-maj 13:32 Ter OK efter power off/on
Upper Operational Temperature Limit UOTL +130C
Upper Destruct Temperature Limit UDTL Ikke fundet

103

DELTA/KAS Temperaturcycling
Resultat
Start cycling 12-maj 13:45 KAS OK
Temperaturcycling 12-maj KAS OK
1 cykle med 15 min dwell time. Tlow = -70C, Thigh =
+125C.
F-test ved ambient 12-maj 16:21 Ter OK Ny power supply ("B") monteret
Temperaturcycling 12-maj 16:25 KAS Et enkelt trig p skop
20 cykles med 10 min dwell time. Tlow = -70C, Thigh =
+125C.
F-test ved ambient 13-maj 08:05 Ter OK
Temperaturcycling 13-maj 08:10 KAS OK
+125C.
Ny power supply ("A") monteret
1,5 cykles med 4 min dwell time. Tlow = -70C, Thigh =
+125C. Emne A
ndring i program
+125C. Emne A
DELTA/KAS Vibrationseksponering
Aktivitet Dato Tid Init. Funktion Bemrkning
Initial F-test
Random 10 grms 12-maj 14:49 KAS OK Ca. 10 minutter
Random 20 grms 12-maj 14:59 KAS OK Ca. 10 minutter
Random 30 grms 12-maj 15:10 KAS Ls PCB skrue efter ca. 4 minutter Ca. 4 minutter
Fejlretning 12-maj 15:18 KAS
Skrue genmonteret og alle 5 skruer
spndt med 0,4 Nm
Ingen locktite p skruerne
Random 30 grms 12-maj 15:26 KAS OK Mleaccelerometre falder af. Ca. 10 minutter
Random 40 grms 12-maj 15:37 KAS OK Kort pause efter ca. 1 minut
Random 50 grms 12-maj 15:51 KAS Ca. 10 minutter
Random 60 grms 12-maj 16:03 KAS Spndinger frst urolige, derefter faldende Stoppet efter ca. 4 minutter
Fejlsgning 12-maj 16:20 Ter Power supply skiftet
Herefter temperaturcykling
Operational Vibration Level KAS ca. 60 grms
Vibration Destruct Level KAS ca. 60 grms
Eksponering udfrt med random vibration i 6 akser. Minimum 10
minutter ved hvert niveau. 10 grms step

104

DELTA/KAS Kombineret vibrations- og temperatureksponering
Aktivitet Dato Tid Init. Resultat Bemrkning
Initial F-test 14-maj 08:25 Ter OK
Kombineret vibration
og temperatur
cycling
14-maj 08:30 KAS
Lidt ustabilitet ved den sidste del af lav
temp delen. Begynder at svigte efter ca.
5 minutter ved den hje temp
1 cykle med 15 min dwell time. Tlow = -70C, Thigh = +125C.
Vibrationsniveau 40 grms.
Funktionstest 14-maj 09:08 Ter Virker ikke, heller ikke efter power off/on
Fejlsgning 14-maj 09:44 Ter
2 stk. komponenter (V59 og V63) faldet
af.
Forstrkning af "A" 14-maj 09:59 Ter
V59 og V63 stttelimet med "Super
Epoxy"
Hrdet 15 minutter ved 125C
og temperatur
cycling
14-maj 12:37 KAS Problemer efter f minutter ved hj temp
1 cykle med 15 min dwell time. Tlow = -70C, Thigh = +125C.
Skiftet til anden
fixtur
og temperatur
cycling
14-maj 13:50 KAS
1 cykle med ca. 15 min dwell time. Tlow = -70C, Thigh = +125C.
Vibrationsniveau 40 grms. Krt manuelt
og temperatur
cycling
14-maj 14:22 KAS Begyndende problemer med 5 V
og temperatur
cycling
14-maj 14:47 KAS
Permanente problemer efter f minutter
ved hj temp
Ca. 3 minutter ved Thigh = +125C. Vibrationsniveau 60 grms. Krt
manuelt
Fejlsgning Fejl kan ikke umiddelbart lokaliseres (modstand R104 faldet af)
Nyt emne "C"
og temperatur
cycling
14-maj 15:54 KAS

105

DELTA/KAS Resume
Bemrkning
LOTL
-70C (opstart)
-76C (drift)
Lower Operational Temperature Limit.
LDTL Ikke fundet Lower Destruct Temperature Limit
Svaghed Opstart usikker
UOTL +125C Upper Operational Temperature Limit.
UDTL Ikke fundet Upper Destruct Temperature Limit
Svaghed 12 V forsvinder
OVL
ca. 30 grms (ls skrue),
60 grms (ustabile spndinger)
Operational Vibration Level
VDL ca. 60 grms Vibration Destruct Level
Svaghed ? Skal undersges nrmere
Temperatur cycling
(-70C/+125C, 4 - 10 min.dwell
> 20 cycles)
Svaghed Ikke fundet
Kombineret vibration og
temperatur
40, 50 og 60 grms, -70C og
+125C
Svaghed
V59, V53, R104 falder af.
Problemer med 5 VDC
Bemrkning: Der br udfres en detaljeret visuel inspektion af alle emner for at afdkke eventuelle andre svagheder
Eksponering
Kulde
Varme
Vibration
DELTA/KAS Konklusioner efter overordnet visuel inspektion udfrt p DELTA
Forml At finde de svage punkter for CCA, Power Supply
Her er der plads til Terma's
kommentarer
Mulig rsag Aktion
Fundne svagheder Ja Nej (evt. henvisning til fejlrapport etc.) Ja Nej
Opstart af 5 V og 3.3 V (lave temperaturer)
12 V forsinder (hje temperaturer)
Ls PCB skrue (ved vibration)
Spndinger falder (ved hje vibrationsniveauer)
V59 og V63 falder af
R104 falder af
Fejl ved kombineret temp. cykling og vibration
Relevant RE-HALT

106

Annex 4

Case study CQ-6263 Adapto BTE hearing aid supplied by Oticon A/S -
detailed test log

(8 pages)

107

CQ-6263 Adapto HALT
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 26-30 31-37
Reference x
Vibrationskarakterisering - bounce x x x
Svedtest, 40C, prkond. med bounce x x x
Cyklus: Varme/fugt, kulde, bounce x x x
Svedtest, 24h@50C, prkond. med bounce x x x
Svedtest, 24h@80C, prkond. med bounce x x
Svedtest II, prcond. med 10.000 P1/P2 skift x x
Fejl / testemne
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Stag i montageskal knkket
- x x x x x - x x x x x x x x x x x - x x
VC hjul falder ind i apparat
og kan ikke dreje
- x x x - - - - - - - - - - - - - - - - -
Trde til telespole knkker
- x x x - - - x x x x x - x x x x x - - -
Lederbaner knkker i
flexzone
- x x x - - - - x - - - - - - - - - - x -
Litzetrd til mikrofon
knkker
- - x x - - - - - - - - - - - - - - - - -
Kompensationssljfe p
telespole lsner
- - x - x - - - - - - - - - - x - - - - -
MT0-omskifter
svigter/fejlfunktion
- - - - - - - - - - - - - - - - x x - - -
Batteriskuffe bner sig og
batteri evt. falder ud
- x x x - - - x x x x x x x x x x - - - -
Mikrofon fejler
- - - - - - - - - x - - - - - - - - - - -
1
Vibrationskarakterisering - bounce
Initial Programering A0 ok 10-07-2003 pha
Acoustical measurements 000-000-01 10-07-2003 hlc
Current consumption mA@1,3V
El./mech. test w/OtiTest ok 10-07-2003 pha
Listen w/press & twist ok 10-07-2003 pha
Visual check ok 10-07-2003 pha

108

2 3 4
Initial Programmering A0 ok ok ok 10-07-2003 pha
Acoustical measurements 000-000-02 000-000-03 000-000-04 10-07-2003 hlc
Current consumption mA@1,3V 1,4 1,3 1,4 10-07-2003 pha
El./mech. test w/OtiTest ok ok ok 10-07-2003 pha
Listen w/press & twist ok ok ok 10-07-2003 pha
Visual check ok ok ok 10-07-2003 pha
Exposure: Bounce Test udfrt med batteri i skuffe,
tndt i M mode.
Testes med lytteslange
monteret, "danser" ikke
s tilfldigt som vrige.
Prop p hook Prop p hook
Sinus, 2,5g, 12Hz Exposure 15 min ok ok ok 11-07-2003 KAS
Listen w/press & twist ok ok ok 11-07-2003 KAS/pha
Current consumption 1,4 1,3 1,4 11-07-2003 KAS
Visual check ok ok ok 11-07-2003 KAS
Sinus, 5g, 13Hz Exposure 15 min ok ok ok 11-07-2003 KAS
Listen w/press & twist ok ok ok 11-07-2003 KAS/pha
Visual check ok ok ok 11-07-2003 KAS/pha
Listen w/press & twist ok ok Intet/meget svagt output
i T mode
11-07-2003 KAS/pha
Visual check ok Tydeligt slid p kant af
batteriskuffe.
Tydeligt slid p kant af
batteriskuffe.
11-07-2003 KAS/pha
Sinus, 10g , 16Hz Exposure 15 min Apparat reset'er af og til
under testen
ok ok 11-07-2003 KAS
Listen w/press & twist ok Intet/meget svagt output
i T mode
Intet/meget svagt output
i T mode
11-07-2003 pha
Visual check ok + slidmrker i
batteri/skuffe
+ slidmrker i
batteri/skuffe
11-07-2003 pha
Sinus, 12,5g, 19Hz Exposure 15 min Batteriskuffe bner sig -
lukket igen under test
Batteriskuffe bner sig -
lukket igen under test
Batteri falder ud af
apparat - sat tilbage
igen under test
11-07-2003 KAS/pha
Listen w/press & twist Fejlfunktion i T mode,
stj og kratten.
Intet output Intet output 11-07-2003 pha
Current consumption 1,4 0,17 0,44 11-07-2003 KAS/pha
El./mech. test w/OtiTest VC test fail no connection no connection 11-07-2003 pha
Visual check VC trykket ind i
apparatet. Skaller har
bnet sig, VC klemmer.
VC trykket skv og ind
i apparatet.
VC trykket skv og ind
i apparatet.
11-07-2003 pha
Final inspection,
Oticon
Visual inspection Se ovenfor Se ovenfor Se ovenfor 28-10-2003 pha
Acoustical measurements Ingen mling, HA adskilt Ingen mling, HA adskilt Ingen mling, HA adskilt 28-10-2003 pha
Internal visual inspection 2 stag knkket af p
montageskal. Rd trd
til telespole knkket
ved lodning p PCB.
Ledebane knkket i
flexzone.
3 stag fra montageskal
knkket af.
Grn trd til telespole
knkket ved spole.
Rd trd til telespole
knkket ved PCB.
Mik.+ litze knkket af
p PCB ved lodning.
Mulig kortslutning af
mik. bl litze (signal) til
telespole grn PCB
lodning.
Telespole komp.
2 stag fra montageskal
knkket af.
Grn trd til telespole
knkket ved spole.
knkket ved PCB.
Mik.+ litze knkket af
p PCB ved lodning.
Isolering i flexzone
knkket, lederbaner
afbrudt.
28-10-2003 pha

109

5 6 7
Svedtest, prkond. med bounce
Initial Acoustical measurements - - -
El./mech. test w/OtiTest + A0 ok ok ok 11-07-2003 pha
Prconditionering med bounce Med batteri i skuffe, men slukket apparat
Visual check slidmrker ved
batteriskuffe
slidmrker ved
batteriskuffe
slidmrker ved
batteriskuffe
11-07-2003 KAS/pha
Svedtest 40C 24 timer Uden batteri i skuffe
Listen w/press & twist ok ok ok 11-08-2003 OT
Current consumption 1,22 1,31 1,14 11-08-2003 OT
El./mech. test w/OtiTest ok ok ok 11-08-2003 OT
Visual check ? ? ? 11-08-2003 OT
Final inspection,
Oticon
Visual inspection Returneret til Oticon
adskilt. MTO switch
klippet af og adskilt.
Returneret til Oticon
adskilt.
ok 28-10-2003 pha
Acoustical measurements Ingen mling, HA adskilt ok ok 28-10-2003
29-10-2003
pha
hlc
Internal visual inspection Stag knkket.
Kompensationssljfe
ls.
Probemrker p
lodninger omkring MTO-
switch. Bat. plus-fjeder
bukket. Stag knkket.
ok 28-10-2003 pha
8 9 10
Cyklus: Bounce -> varme/fugt -> kulde
El./mech. test w/OtiTest + A0 ok ok ok 11-07-2003 pha
Sinus, 7,5g, 16Hz Exposure 15 min ok ok Batteri faldet ud 11-07-2003 KAS
Listen w/press & twist Intet output i T mode ok ok 11-07-2003 pha
El./mech. test w/OtiTest ok VC test fail ok 11-07-2003 pha
batteriskuffe
VC trykket, kan ikke
roteres. slidmrker ved
batteriskuffe
slidmrker ved
batteriskuffe
11-07-2003 pha
Listen w/press & twist Intet output i T mode ok ok 07-07-2003 pha/kp/ot
Current consumption 1,2 1,15 1,22 07-07-2003 pha/kp/ot
El./mech. test w/OtiTest ok 07-07-2003 pha/kp/ot
batteriskuffe
07-07-2003 pha/kp/ot
11-08-2003 OT
Listen w/press & twist Intet output i T mode ok ok 11-08-2003 OT
El./mech. test w/OtiTest ok ok ok 11-08-2003 OT
Visual check
Vame/fugt, kulde ? ? ?

110

11 12 13
Svedtest, prkond. med bounce dato init
Current consumption 1,20 1,17 1,25 08-08-2003 KP
El./mech. test w/OtiTest + A0 ok ok ok 07-08-2003 KP/OT
Listen w/press & twist ok ok ok 07-08-2003 KP/OT
Visual check ok ok ok 07-08-2003 KP/OT
Sinus, 7,5g, 16Hz Exposure 15 min ok ok ok 08-08-2003 KP
Listen w/press & twist
Current consumption
El./mech. test w/OtiTest
Visual check Batteri faldet ud,
switche pos. M1,
slidmrker ved
batteriskuffe
Batteri faldet ud,
switche pos. M1,
slidmrker ved
batteriskuffe
Batteriskuffe ben,
switch pos. M1,
slidmrker ved
batteriskuffe
08-08-2003 KP
After bounce Listen w/press & twist ok - ok 11-08-2003 OT
El./mech. test w/OtiTest ok - teleslynge virker ikke
mere 11-08-2003
OT
Visual check ok ok ok 11-08-2003 OT
Svedtest, 50C Exposure 24 timer
After sved 50 Listen w/press & twist ok Helt dd ok Teleslynge defekt 12-08-2003 OT
El./mech. test w/OtiTest ok Teleslynge defekt :: ok Teleslynge defekt 12-08-2003 OT
Final inspection,
Oticon
adskilt.
adskilt.
adskilt.
28-10-2003 pha
Acoustical measurements ok Ingen mling, HA adskilt Samlet for akustisk
mling. Fejler lyttetest.
Meget svagt
mikrofonsignal (kontrol
med FB measure).
28-10-2003
29-10-2003
pha
hlc
Internal visual inspection se Delta noter Trd(e) til telespole
knkket. PCB
lederbanet knkket i
bukkezone - set som
markfejl (service).
Se ogs Delta noter
Trde(e) til telespole
knkket. Coating af
PCB revnet i
bukkezone. Stag p
montageskal knkket
af.
28-10-2003 pha

111

14 15 16
El./mech. test w/OtiTest + A0 ok ok ok 08-08-2003 KP
Listen w/press & twist ok ok ok 08-08-2003 KP
Visual check ok ok ok 08-08-2003 KP
Listen w/press & twist
Current consumption
El./mech. test w/OtiTest
Visual check Batteriskuffe ben,
switch pos. M1,
slidmrker ved
batteriskuffe
Batteriskuffe ben,
switch pos. M2,
slidmrker ved
batteriskuffe
Batteri faldet ud, swith
pos. M1, slidmrker
ved batteriskuffe
08-08-2003 KP
After Bounce Listen w/press & twist ok ok ok 11-08-2003 OT
El./mech. test w/OtiTest Tele slynge defekt Tele slynge defekt ok 11-08-2003 OT
Visual check
Svedtest, 60C Exposure 24 timer ok ok ok 14-08-2003 PT OT
After SVED 60 Listen w/press & twist ok ok ok 14-08-2003 OT
El./mech. test w/OtiTest ok Teleslynge Defekt ok Teleslynge Defekt ok 14-08-2003 OT
Final inspection,
Oticon
Visual inspection ok Returneret til Oticon
adskilt.
adskilt.
28-10-2003 pha
Acoustical measurements ok ok ok 29-10-2003 hlc
Internal visual inspection Stag p montageskal
ved VC knkket af.
knkket ved PCB.
se Delta noter. Coat
revnet i flexzone
ok 28-10-2003 pha
17 18 19
El./mech. test w/OtiTest + A0 ok ok ok 08-08-2003 KP
Listen w/press & twist ok ok ok 08-08-2003 KP
Visual check ok ok ok 08-08-2003 KP
El./mech. test w/OtiTest teleslynge defekt teleslynge defekt teleslynge defekt 11-08-2003 OT
Visual check Batteriskuffe lidt ben,
switch pos. M2,
akustisk tilbagekobling,
slidmrker ved
batteriskuffe
Batteriskuffe ben,
switch pos. M1,
slidmrker ved
batteriskuffe
Batteriskuffe ben,
switch pos. M2,
slidmrker ved
batteriskuffe
08-08-2003 KP
Svedtest, 70C Exposure 24 timer ok ok ok 14-08-2003 PT
After sved 70
El./mech. test w/OtiTest teleslynge defekt teleslynge defekt teleslynge defekt 15-08-2003 OT
Final inspection,
Oticon
adskilt.
ok Returneret til Oticon
adskilt.
28-10-2003 pha
Acoustical measurements ok ok ok 29-10-2003 hlc
Internal visual inspection Stag p montageskal
knkket. Se ogs
Delta noter.
Stag p montageskal
knkket. Flex-flap med
komp.sljfe get fra i
limen p telespolen.
Stag p montageskal
knkket. Flex-flap med
komp.sljfe get fra i
limen p telespolen. Se
ogs Delta noter.
28-10-2003 pha

112

20 21
Current consumption 1,23 1,26 08-08-2003 KP
El./mech. test w/OtiTest + A0 ok ok 08-08-2003 KP
Listen w/press & twist ok ok 08-08-2003 KP
Visual check ok ok 08-08-2003 KP
Sinus, 7,5g, 16Hz Exposure 15 min ok ok 08-08-2003 KP
Listen w/press & twist ok ok 11-08-2003 OT
Current consumption 1,03 0,00 11-08-2003 OT
El./mech. test w/OtiTest Er syg Teleslynge
defekt
Eprom test fejler -
Teleslynge defekt
11-08-2003 OT
Visual check Batteriskuffe ben,
switch pos. M1,
slidmrker ved
batteriskuffe
Switch pos. M2,
akustisk tilbakobling,
slidmrker ved
batteriskuffe
08-08-2003 KP
Svedtest, 80C Exposure 24 timer ok ok 15-08-2003 PT
After sved 80 Listen w/press & twist Meget svag Opstn
unknown Var ikke sat
up OT har reloaded
A0Full gain
Meget svag Opstn
unknown Var ikke sat
up OT har reloaded
A0Full gain 15-08-2003
OT
Current consumption 1,15 1,29 Muligt periodisk fejl
?
El./mech. test w/OtiTest Switch Test Failed Programswitch failed 18-08-2003 ot
Visual check ok ok 18-08-2003 ot
Final inspection,
Oticon
adskilt.
adskilt.
28-10-2003 pha
Acoustical measurements MTO fejl. M og T pos.
byttet om!?
MTO fejl. M og T pos.
byttet om!?
28-10-2003
29-10-2003
pha
hlc
Internal visual inspection Se Delta noter. Stag knkket ved VC. 28-10-2003 pha

113

22 23 24
Initial 10 sept 03 Programering A0 FULL Gain ok ok ok 10-09-2003 OT
Acoustical measurements ok ok ok
Current consumption mA@1,3V 1,05 1,07 1,05 10-09-2003 OT
El./mech. test w/OtiTest ok ok ok
Listen w/press & twist ok ok ok
Visual check ok ok ok
Sinus, 7,5g, 16Hz 15
min
Efter danse test Programering A0 FULL Gain ok Virker ikke mere ok 10-09-2003 OT
Acoustical measurements ok ok
Current consumption mA@1,3V 1,30 0,00 1,38
El./mech. test w/OtiTest ok ok
Listen w/press & twist ok ok
Visual check ok ok
40 grader 4 dages sved
16-09-2003 Programering A0 FULL Gain ok Virker stadig ikke mereok 16-09-2003 OT
Acoustical measurements ok ok
Current consumption mA@1,3V 1,16 0,00 1,63
El./mech. test w/OtiTest ok Switch test fail
Teleslynge virker ikke
Listen w/press & twist ok ok
Visual check ok ok
Final inspection,
Oticon
Visual inspection ok ok Returneret til Oticon
adskilt. MTO omskifter
klippet af.
28-10-2003 pha
Acoustical measurements ok Ingen mling, HA adskilt Ingen mling, HA adskilt 28-10-2003
29-10-2003
pha
hlc
Internal visual inspection ok Stag ved VC knkket.
Lederbaner knkket i
bukkezone.
Se Delta noter. 28-10-2003 pha

114

Results of visual inspection of samples from artificial sweat testing

Exposure
temperature
Evaluated samples Results
40C S/N 5, 6 One sample shows cracks in the plastic cover.
No corrosion / migration are observed. Salt residues are
present inside the samples.
50C S/N 11, 12, 13 One or both telecoil connections are broken at the coil
interface. No corrosion of the wires are observed.
In one sample (S/N 12) also the flex PCB is cracked in a
bend area.
60C S/N 15, 16 One telecoil connection is broken at the coil interface in
S/N 15. No corrosion of the wire is observed.
In one sample (S/N 15) also the flex PCB is cracked in a
bend area but conductor elements are still intact.
70C S/N 17, 19 One or both telecoil connections are broken at the coil
interface in both samples. No corrosion of the wire is
observed.
Indications of condensation residues on the gold contact
pins are observed.
80C S/N 20, 21 One or both telecoil connections are broken at the coil
interface in both samples. In one sample one wire is
broken at the PCB. No corrosion of the wire is observed.
Indications of condensation residues on the gold contact
pins are observed.
In one sample (S/N 21) the isolation of one wire is
damaged in a bend area.

115

Annex 5

Case study
Ultrasound scanner 2120 EXL supplied by B-K Medical A/S
detailed test log

(31 pages)

116

A5.1 Result of cold step stress test
Cassette was initially tested at 20C with Ok result.

Test condition: 0C
Test description Result Remark
5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,1
12V analogue +/- 5% (11.4 12.6V) 11,9
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
Ripple on 5V digital < 50mV
B-Mode scanning with 8660 on phantom Ok
MFI 5.5, 7 and 8 MHz Ok
Capture scan Ok
Doppler on phantom Ok
Doppler noise (gain) 65%
1 element sweep on 8660 Ok
Analogue test oscillator Ok
Off/on at 90 VAC, Scanning with 8660 on phantom Ok

Test condition: -10C
5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,2
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,1
12V analogue +/- 5% (11.4 12.6V) 11,9
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
Capture scan Ok
Noise on video out
(Composite) VGA picture
ok

117

5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,2
-5V analogue +/- 5% (-4.75 -5.25V) -5,1
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
Capture scan Fail
Off/on at 90 VAC, Scanning with 8660 on phantom Ok. (not 3D)
VGA picture unstable (Line
sync? Tear out). Video out
noisy. 3D no picture (Mouse
arrow can be moved, but
picture partly missing).
Unable to go to 3D after
switching off and on again.
It was decided to continue
without the 3D system

5V digital +/- 2% (4.9 5.1V) 4,84
3.3V Digital +/- 5% (3.14 - 3.47V) 3,32
5V analogue +/- 5% (4.75 5.25V) 5,08
-5V analogue +/- 5% (-4.75 -5.25V) -5
12V analogue +/- 5% (11.4 12.6V) 11,9
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
B-Mode scanning with 8660 on phantom Ok, but
picture
unstable
Capture scan Fail
1 element sweep on 8660 0k
VGA picture very unstable
(Line sync? Tear out and
picture sync. unstable).
Video out noisy. Unable to
go to 3D

118

5V digital +/- 2% (4.9 5.1V) 4,92
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,06
-5V analogue +/- 5% (-4.75 -5.25V) -5,04
12V analogue +/- 5% (11.4 12.6V) 11,9
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
Ripple on 5V digital 100mv pp
B-Mode scanning with 8660 on phantom Unreadable
MFI 5.5, 7 and 8 MHz -
Capture scan Fail
Doppler on phantom Doppler is
running
Doppler noise (gain) Unreadable
1 element sweep on 8660 Unreadable
VGA picture disappeared.
Composite video output
very noisy and unreadable.
Clock is running and the
scanner is able to change
mode (B-mode/ Triplex).
Unable to go to 3D

As the picture was
unreadable it was decided to
increase the temperature to
20C again

At -20C and much less at other temperatures. Doppler is less sensitive during temperature
changes.
At -20 C VGA picture tear out (line sync). Still unable to go to 3D, at -10C VGA Ok, still
unable to go to 3D. At 20C 3D was okay again, everything else also OK.
3D system has a problem when starting at low temperature (<= -20C). Ripple on 5V digital is
approx. 50mV (approx. 3s time period).
The Lower Operating Limit (LOL) was set to -20C, where the entire cassette excl. the 3D
system, was still functioning. The Lower Destruct Limit (LDL) was not found.

119

A5.2 Result of warm step stress test
An initial test was performed at room temperature before starting the warm stress test.

Test condition: 20C
5V digital +/- 2% (4.9 5.1V) 5,06
3.3V Digital +/- 5% (3.14 - 3.47V) 3,27
5V analogue +/- 5% (4.75 5.25V) 5,18
-5V analogue +/- 5% (-4.75 -5.25V) -4,94
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,1
Ripple on 5V digital < 50 mV
Capture scan Ok

Test condition: 40C
5V digital +/- 2% (4.9 5.1V) 4,94
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,16
-5V analogue +/- 5% (-4.75 -5.25V) -5,04
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan Ok

120

Test condition: 50C
5V digital +/- 2% (4.9 5.1V) 4,84
3.3V Digital +/- 5% (3.14 - 3.47V) 3,36
5V analogue +/- 5% (4.75 5.25V) 5,16
-5V analogue +/- 5% (-4.75 -5.25V) -5,04
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan Ok

Test condition: 60C
5V digital +/- 2% (4.9 5.1V) 4,82
3.3V Digital +/- 5% (3.14 - 3.47V) 3,36
5V analogue +/- 5% (4.75 5.25V) 5
-5V analogue +/- 5% (-4.75 -5.25V) -4,96
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
B-Mode scanning with 8660 on phantom -
Capture scan -
Doppler on phantom -
Doppler noise (gain) -
1 element sweep on 8660 -
Analogue test oscillator -
Off/on at 90 VAC, Scanning with 8660 on phantom -
At 59C. The scanner
picture disappeared. Video
test picture Ok (Video board
Ok) 3D system worked.
Stopped after 'switching
task'

It was decided to lower the temperature to 50C again. At 55C, the picture came back. Scan
converting was not correct. 3D system worked but Freeze button did not work. At 50C
everything Ok again. It was decided to raise the temperature 1C/min to investigate further.
55C scan convertering Ok. Communication sometimes failing (freeze not always understood).
58C.
Scan convertering Ok. Communication sometimes failing (freeze not always understood). 59C
scan converting fails.
It was decided to raise the temperature to 70C to see if other errors appeared.
121

Test condition: 70C
5V digital +/- 2% (4.9 5.1V) 4,92
3.3V Digital +/- 5% (3.14 - 3.47V) 3,2
5V analogue +/- 5% (4.75 5.25V) 5
-5V analogue +/- 5% (-4.75 -5.25V) -4,88
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Ripple on 5V digital -
B-Mode scanning with 8660 on phantom -
Capture scan Ok
Analogue test oscillator -
Coreboard starts, but stops
after 'switching task'.

Master oscillator (120MHz) under suspicion. A local air cooling was placed in that area and it was
decided to repeat the 60C step.

Test condition: 60C
5V digital +/- 2% (4.9 5.1V) 4,92
3.3V Digital +/- 5% (3.14 - 3.47V) 3,55
5V analogue +/- 5% (4.75 5.25V) 5,16
-5V analogue +/- 5% (-4.75 -5.25V) -5,1
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -11,9
Capture scan Ok
At 60,1 degree picture
disappeared again, but came
back when the local cooling
(airflow) was started. The
test was performed
successfully.

The temperature was raised to 70C, but the airflow was inadequate to cool master osc. down.
12V fan on 3D system not running! The test was stopped to try to adjust the master oscillator.
122

Master osc. adjusted. Afterwards 3.3V shorted. Coreboard #2001 000 000 (trouble shooting)+
videoboard. Troubleshooting 10/6 showed: 3.3V Ok. U48 (AVG/Peak controller FPGA) is getting
hot (running on 3.3V). Keyboard error -> U51 does not initiate keyboard.
New Coreboard ZD0767 #2001 000 010 installed with new videoboard ZH0743 2002 100 337.
Test repeated at 60C.
Everything worked except the 12V fan on 3D did not start, after switching on at 90V.
The test was then continued at 70C.

Test condition: 70C
5V digital +/- 2% (4.9 5.1V) 4,98
3.3V Digital +/- 5% (3.14 - 3.47V) 3,48
5V analogue +/- 5% (4.75 5.25V) 5,26
-5V analogue +/- 5% (-4.75 -5.25V) -4,92
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan
12V fan on PC backend
started during start at 25C.
Stopped at 70 C.

Test condition: 80C
5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,28
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
B-Mode scanning with 8660 on phantom ok
MFI 5.5, 7 and 8 MHz ok
Capture scan ok
Doppler on phantom ok
Off/on at 90 VAC, Scanning with 8660 on phantom ok
Off/on at 264 VAC, Scanning with 8660 on phantom ok
1/5-2003. Air in Doppler
phantom. Flow set to 3l/h
Tested before start.

12V fan Ok again!

123

Test condition: 90C
5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,27
5V analogue +/- 5% (4.75 5.25V) 5,14
-5V analogue +/- 5% (-4.75 -5.25V) -4,9
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan ok
Analogue test oscillator
Off/on at 90 VAC, Scanning with 8660 on phantom
Off/on at 264 VAC, Scanning with 8660 on phantom
Doppler flow changed to
6l/h.

Composite out unstable.

After 8 min. the screen got
black (power disappeared).
Temperature was lowered.
Started normal again when
temperature was 25C.

A complete test was done at 20C.

Test condition: 20C
5V digital +/- 2% (4.9 5.1V) 5,06
3.3V Digital +/- 5% (3.14 - 3.47V) 3,27
5V analogue +/- 5% (4.75 5.25V) 5,18
-5V analogue +/- 5% (-4.75 -5.25V) -4,94
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,1
Ripple on 5V digital < 50 mV
Capture scan Ok

It was decided to stop the high temperature test at this temperature. The Upper Operating Limit
(UOL) was set to 80C. The Upper Destruct Limit (UDL) was not found.
124

A5.3 Result of temperature cycling step stress test
The temperature cycling test was set in the interval from 20C to +80C. At each end
temperature there was a dwell time of 10 min. where the test could be performed.

5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,32
5V analogue +/- 5% (4.75 5.25V) 5,16
-5V analogue +/- 5% (-4.75 -5.25V) -5
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan Ok
The 3D system was tested
prior to the Off/On test as it
was unable to start again at
low temperature

Test condition: +80C
5V digital +/- 2% (4.9 5.1V) 5,02
3.3V Digital +/- 5% (3.14 - 3.47V) 3,3
5V analogue +/- 5% (4.75 5.25V) 5,26
-5V analogue +/- 5% (-4.75 -5.25V) -5,08
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan Ok
after the Off/On test as it did
not start again after having
being stressed with the low
temperature from the
previous cycle.

Fan on 3D system (12VDC)
stopped. Backflow from air
inlet!

Flow on Doppler a little
weaker (colours). Composite
video a little unstable.
Doppler ok later. Some
elements are weaker during
1-element sweep
(transmitters??)

125

5V digital +/- 2% (4.9 5.1V) 5,02
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,04
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
Capture scan Ok
low temperature

5V digital +/- 2% (4.9 5.1V) 5,02
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,08
-5V analogue +/- 5% (-4.75 -5.25V) -4,98
12V analogue +/- 5% (11.4 12.6V) 11,9
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
Capture scan Ok
previous cycle.

126

5V digital +/- 2% (4.9 5.1V) 5,00
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,08
-5V analogue +/- 5% (-4.75 -5.25V) -4,98
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan Ok
low temperature

1 element sweep has weak
elements. Not completely
reset after leaving 1 element
sweep (Test osc. not turned
off!!). Ok after off/on.

5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,28
5V analogue +/- 5% (4.75 5.25V) 5,08
-5V analogue +/- 5% (-4.75 -5.25V) -4,96
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan
previous cycle.

Some week elements in 1
element sweep

127

5V digital +/- 2% (4.9 5.1V) 4,88
3.3V Digital +/- 5% (3.14 - 3.47V) 3,28
5V analogue +/- 5% (4.75 5.25V) 5,08
-5V analogue +/- 5% (-4.75 -5.25V) -5
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Ripple on 5V digital <50 mV
Capture scan Ok
low temperature

element sweep

5V digital +/- 2% (4.9 5.1V) 4,92
3.3V Digital +/- 5% (3.14 - 3.47V) 3,38
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan Ok
previous cycle.

element sweep

128

5V digital +/- 2% (4.9 5.1V) 4,88
3.3V Digital +/- 5% (3.14 - 3.47V) 3,38
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,02
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan Ok
low temperature

element sweep

5V digital +/- 2% (4.9 5.1V) 4,88
3.3V Digital +/- 5% (3.14 - 3.47V) 3,4
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,06
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
Capture scan
previous cycle.

element sweep

1.5 cycles more were performed during lunch, where there are no results recorded. After the
cycling the chamber was brought back to 20 degree and a final test was performed.

129

Test condition: 20C
5V digital +/- 2% (4.9 5.1V) 4,88
3.3V Digital +/- 5% (3.14 - 3.47V) 3,38
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,06
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
Capture scan Ok

130

A5.4 Result of vibration step stress test
Prior to starting the vibration the harddrive for the 3D system was removed from the system and
placed in 2 strings hanging down from the ceiling of the chamber, to avoid problems with the
harddrive during test.
The vibration step stress test started with 5G, but the cassette stopped working when vibration
started! After removing vibration and powered up again the message Keyboard error popped up
on the screen. From the Coreboard ZD0767 2002 000 010 no response was received from the
keyboard during initialisation. The error followed the Coreboard. (Troubleshooting 10/6-2003
showed that U51 was defective (Latch for HW programming and reset of the keyboard)). Passed
the PCB test system in P4 030811/HED)
Coreboard was changed and the test continued at 5G.

Test condition: 5G @ 20C
5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,3
5V analogue +/- 5% (4.75 5.25V) 5,14
-5V analogue +/- 5% (-4.75 -5.25V) -5
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Ripple on 5V digital 200mVPP
Capture scan Ok
Doppler is less sensitive.
Test osc. noise at the
boarders. Video signal
noisy. Ripple on power
supply is steady even though
power is off

131

5V digital +/- 2% (4.9 5.1V) 4,9
3.3V Digital +/- 5% (3.14 - 3.47V) 3,3
5V analogue +/- 5% (4.75 5.25V) 5,26
-5V analogue +/- 5% (-4.75 -5.25V) -5,08
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Ripple on 5V digital 200mVPP
Capture scan Unable to
start
Off/on at 264 VAC, Scanning with 8660 on phantom OK
3D system locked up.
Mouse arrow could be
moved until it was turned
off.
Very long time starting up
(Coreboard ?) showed KDB
on = K 2001 and waited for
approx. 30 sec. Before
proceeding. This happened
at both 90 and 264 V. 3D
was unable to start under the
test. After test the Coreboard
started up at normal speed
and the 3D system was
working again.

5V digital +/- 2% (4.9 5.1V) 5,12
3.3V Digital +/- 5% (3.14 - 3.47V) 3,26
5V analogue +/- 5% (4.75 5.25V) 5,26
-5V analogue +/- 5% (-4.75 -5.25V) -5,06
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan Ok
Doppler on phantom No doppler
information
(vibration in
table)
Off/on at 90 VAC, Scanning with 8660 on phantom Ok (80 sec.
start up
time)
Off/on at 264 VAC, Scanning with 8660 on phantom Ok (start up
time 75 sec.)
3D system on during start.
OK at 10G. Switched to 2 D
-> ok. Back to 3D but
locked. Scanner off/on.
Start-up takes a very long
time. Slow reaction on a
keypress. Scanner stopped
during test. Off/on -
>Scanner continued. (Long
start-up time) and 3D got up
and running again

Tape was put on trackerball on the keyboard to prevent interrupts. Start-up at 15G was faster.
Scanner stopped when triplex should be tested. Off/on -> long startup time. Stopped again when
selecting Triplex. Off/on -> start-up 100 sec.
132

5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,15
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Ripple on 5V digital <50mV
Capture scan Not running
Analogue test oscillator Ok. Noisy
picture.
Scanner stopped 4 times
when trying to run triplex.

Vibration removed. Still a problem when entering triplex mode. 3D system was running when
vibration was removed.
Delayboard ZE0772 sn 000 004 changed and an extra keyboard was set externally to avoid
interrupts from the trackball.
Doppler stopped with new delay board and B-picture was not updated, during ramp from 0 to 20G
within 5 min. It stopped at 0.3G. It was decided to change the delay board.
ZE0772 000 001 was inserted instead. Knocking on the cassette caused the scanner to stop. An
error was found on the Coreboard (rework on U117).
The original delay board was therefore tested and found ok. Original delay board ZE0772
(000 004) was inserted again and test continued. First ramping from 10G to 20G, then continuing
at 20G.
133

5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,16
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,3
Ripple on 5V digital 150mVpp
Capture scan .
Doppler on phantom .
Doppler noise (gain) approx. 60%
(noise from
movement)
3D does not start.

The start speed was normal
after keyboard disconnected
and external keyboard
attached.
External keyboard attached during further testing.
5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,08
-5V analogue +/- 5% (-4.75 -5.25V) -5,06
12V analogue +/- 5% (11.4 12.6V) 12,2
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan -
Doppler noise (gain) approx.
55-60%
3D does not start.

134

5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,08
-5V analogue +/- 5% (-4.75 -5.25V) -5,06
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Ripple on 5V digital 50mV
Capture scan -
Doppler noise (gain) Approx.
55% noisy
Off/on at 264 VAC, Scanning with 8660 on phantom OK
3D does not start. Vibration
removed and system was
able to start and perform a
scan.

Test condition: 35G @ 20 C
5V digital +/- 2% (4.9 5.1V) 4,94
3.3V Digital +/- 5% (3.14 - 3.47V) 3,28
5V analogue +/- 5% (4.75 5.25V) 5,2
-5V analogue +/- 5% (-4.75 -5.25V) -5,12
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,3
Capture scan Ok!!
Doppler noise (gain) ?? Noisy
3D is running again!

135

5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,2
-5V analogue +/- 5% (-4.75 -5.25V) -5,12
12V analogue +/- 5% (11.4 12.6V) 12,2
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan -
3D does not start.
Picture is noisy. Some
stribes in ultrasound picture
(with 8660 transducer).
Vibration removed and
scanner turned off and on
again. 3D system was
running

5V digital +/- 2% (4.9 5.1V) 4,96
3.3V Digital +/- 5% (3.14 - 3.47V) 3,24
5V analogue +/- 5% (4.75 5.25V) 5,08
-5V analogue +/- 5% (-4.75 -5.25V) -5,06
12V analogue +/- 5% (11.4 12.6V) 12,2
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Capture scan -
Doppler on phantom Ok, but
noisy
3D system worked at 40G,
when vibration was started
after 3D was up and
running. Stopped after 6
min. @ 45G

136

5V digital +/- 2% (4.9 5.1V) 4,98
3.3V Digital +/- 5% (3.14 - 3.47V) 3,28
5V analogue +/- 5% (4.75 5.25V) 5,08
-5V analogue +/- 5% (-4.75 -5.25V) -5,08
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,4
Ripple on 5V digital 50mV pp
Capture scan -
3D not running. Vibration
stopped and system
restarted. 3D was running.
Vibration started after 3D
was restarted. After 8 min.
3D was still working. Lines
appeared on the captured
image. Went to 2D -> lines
in picture. Size was changed
and lines disappeared. Back
to 3D still -> ok. After 13
min. the capture stopped
(unresponsive). System
restarted. The 2D system
started, but stopped when
scanning was started
(possible watchdog
shutdown).

After the test, Dornier logo has now changed to BK logo and date/time was not correct. A RAM
checksum error must have occurred and the Coreboard must have set the contents to default value
(a possible battery problem).
Composite video output was very noisy.
Vibration removed and system restarted -> ok. Vibration on again -> 40G. 2D system started up
but crashed as scanning was started. Lines on composite video out. Possible bad connection on
videoboard (As the videocard was a Prototype card without number it was checked and one
capacitor seemed loose, but no further troubleshooting was performed).
Vibration was removed and everything was running again.
Keyboard in chamber was checked. TGC potmeters and trackball worked, but keyboard was
unresponsive.
After changing the front-end board (ZE0724) sn 000 013 to sn 000 109 vibration was started again
ramping from 40 to 50G. The scanner did not stop this time, but after 5 min. the scanner stopped
as the power supply failed. It turned out to be a screw from one of the fans that had gone loose and
short circuited the power supply filter. The filter was changed.
After the filter had been changed no doppler information could be found. Front-end board was
changed (ZE0724 #000 102) to the old board #000 109.
Further troubleshooting showed that the 2 front-end boards were not working (no doppler
information / Transmitter errors).
137

A5.5 Result of combined temperature cycle and vibration step stress test
The test was performed 29/9 2003 with. SW version 0.140 24-09-2003 (Improved doppler).
Initial pretest:
5V digital +/- 2% (4.9 5.1V) 5,02
3.3V Digital +/- 5% (3.14 - 3.47V) 3,38
5V analogue +/- 5% (4.75 5.25V) 5,26
-5V analogue +/- 5% (-4.75 -5.25V) -5,18
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Ripple on 5V digital 25mvPP
Capture scan Ok
Off/on at 90 VAC, Scanning with 8660 on
phantom
Ok
phantom
Ok
1 element sweep could
not be tested as the Com
port on the attached PC
was not functioning.
During the initial temperature cycling test from -20 t0 +80 deg the cassette stopped at 61C
The master osc. was adjusted. 1/8 Rp counter-CW. Seemed a little better as it was ok to 70C
Adjusted 1/8 more. Ferrite defective.
Therefore a new coreboard was inserted. It was decided to continue the test even though the
cassette stops.
The new coreboard was equipped with SW dated 14/5-2003.12.13
A quick test was done to determine the state of the master oscillator:
@60C Ok still functioning.
Back to 20C test start at -20 to 80 deg and vibration 10G.
138

Test condition: 10G @ -20C
5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,4
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,12
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Capture scan Ok
Doppler noise (gain) NA
1 element sweep on 8660 NA
phantom
Ok
phantom
Ok
Doppler could not be
tested with stress as it was
too noisy during tempera-
ture changes with
vibration
Doppler did not work when stress was removed. Doppler board ZD0758 sn 000 264 inserted
instead of sn 000 104. Jumper J5 almost off. New board tested ok. Test continued.

139

Test condition: 20G @ -20C to 80C
5V digital +/- 2% (4.9 5.1V) 5,04
3.3V digital +/- 5% (3.14 - 3.47V) 3,4
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,18
12V analogue +/- 5% (11.4 12.6V) 11,9
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
MFI 5.5, 7 and 8 MHz OK
Capture scan Can be
selected
but not
operated
phantom
1)
phantom
2)
ture changes with
vibration.

1) KBD on =K 2001.
Stops here without
getting further. When
vib removed ok. Error
is related to keyboard.
Keyboard removed
and test ok. TGC line
visible always
(Indicates that the
keyboard is active)
2) At -20 deg 20G See
1) Works at -20C
without vib.
To avoid interruptions from the keyboard during the test the keyboard was removed and the test
continued.

140

Test condition: 20G @ ~50C rising
temperature
5V digital +/- 2% (4.9 5.1V) 4,98
3.3V Digital +/- 5% (3.14 - 3.47V) 3,34
5V analogue +/- 5% (4.75 5.25V) 5,24
-5V analogue +/- 5% (-4.75 -5.25V) -5,18
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Capture scan -
phantom
Ok
phantom
Ok
ture changes with
vibration.
3D unable to start during
stress

Keyboard is interrupting all the time (hourglass) even though only an external keyboard is
attached (No keyboard in the chamber).
This might indicate a bad connection either to the supply voltage or to the reset line. Doppler gate
is moving during vibration, when keyboard is connected (absolutely no movement on trackball)
the gate is ok when vibration is removed.
141

Test condition: 30G @ ~-15C falling
temperature
5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,34
5V analogue +/- 5% (4.75 5.25V) 5,2
-5V analogue +/- 5% (-4.75 -5.25V) -5,16
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -18
Capture scan -
Analogue test oscillator OK
phantom
Ok
phantom
Ok
ture changes with
vibration.
stress

Test condition: 30G @ ~50 C rising
temperature
5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,36
5V analogue +/- 5% (4.75 5.25V) 5,22
-5V analogue +/- 5% (-4.75 -5.25V) -5,16
12V analogue +/- 5% (11.4 12.6V) 11,9
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Capture scan
phantom
1)
phantom
1)
too noisy during
temperature changes with
vibration.
stress
1) Unable to start. Stops
after switching task
Keyboard error. Unable to start. Stops after switching task. Coreboard (ZD0767 sn 000 002 )
was inserted to see if the Coreboard was the problem.
142

The new coreboard was OK, but the hourglass still occurred during vibration.
U51 changed on coreboard, but the coreboard had to be reset (setting NVRAM to default) to
enable power up.

143

5V digital +/- 2% (4.9 5.1V) 5,24
3.3V Digital +/- 5% (3.14 - 3.47V) 3,38
5V analogue +/- 5% (4.75 5.25V) 5,04
-5V analogue +/- 5% (-4.75 -5.25V) -5,18
12V analogue +/- 5% (11.4 12.6V) 11,9
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Capture scan -
phantom
Ok
phantom
Ok
too noisy during
temperature changes with
vibration.
stress

Test condition: 30G @ +80C
5V digital +/- 2% (4.9 5.1V) 5.04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,38
5V analogue +/- 5% (4.75 5.25V) 5,22
-5V analogue +/- 5% (-4.75 -5.25V) -5,2
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Ripple on 5V digital 25mvpp
B-Mode scanning with 8660 on phantom NA
MFI 5.5, 7 and 8 MHz NA
Capture scan NA
Doppler on phantom NA
Analogue test oscillator NA
phantom
Ok 1)
phantom
Ok 1)
Test at +80C was
impossible as master osc.
on the new coreboard
stopped.

1) Until after switching
task
As a complete functional test could not be performed because the master oscillator stopped, the
temperature was set to 20 C and the functional test performed.
144

5V digital +/- 2% (4.9 5.1V) 5.04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,38
5V analogue +/- 5% (4.75 5.25V) 5,18
-5V analogue +/- 5% (-4.75 -5.25V) -5,16
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,5
Capture scan Ok
1 element sweep could not
be tested as the Com port on
the attached PC was not
functioning.
Doppler could not be tested
with stress as it was too
noisy during temperature
changes with vibration.

As the result was satisfying it was decided to continue the test at 40G.
5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,38
5V analogue +/- 5% (4.75 5.25V) 5,22
-5V analogue +/- 5% (-4.75 -5.25V) -5,14
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Capture scan -
functioning.
stress.
Composite video out is
flickering

145

5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,34
5V analogue +/- 5% (4.75 5.25V) 5,28
-5V analogue +/- 5% (-4.75 -5.25V) -5,14
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Capture scan NA
Off/on at 90 VAC, Scanning with 8660 on phantom Ok 1)
Test at +80C was
impossible as master osc. on
the new coreboard stopped.

1) Until after switching task
Stress was removed shortly to make a functional test
5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,38
5V analogue +/- 5% (4.75 5.25V) 4,96
-5V analogue +/- 5% (-4.75 -5.25V) -5,14
12V analogue +/- 5% (11.4 12.6V) 12,1
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Capture scan Ok 1)
functioning.

1) The 3D system did not
respond the first time
(Windows regenerating. But
was Ok after windows had
restarted.

146

The test was continued at 50G.
5V digital +/- 2% (4.9 5.1V) 5,04
3.3V Digital +/- 5% (3.14 - 3.47V) 3,4
5V analogue +/- 5% (4.75 5.25V) 5,22
-5V analogue +/- 5% (-4.75 -5.25V) -5,16
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Capture scan -
Doppler on phantom Ok 1)
functioning.
stress
Composite video flickering.
Language switched during
test!! (after power down).

1) Doppler stopped. Power
down and up again. Doppler
ok.

5V digital +/- 2% (4.9 5.1V) 5,06
3.3V Digital +/- 5% (3.14 - 3.47V) 3,36
5V analogue +/- 5% (4.75 5.25V) 5,26
-5V analogue +/- 5% (-4.75 -5.25V) -5,14
12V analogue +/- 5% (11.4 12.6V) 12
-12V analogue +/- 5% (-11.4 -12.6V) -12,6
Capture scan NA
At 60C the master osc
stopped. Only partial test
performed
Composite video flickering.

1) until switching task
As the functional test could not be completed at +80C the stress was remove after 10 min. to
make a functional test at +20C.
However, when the stress was removed the scanner was unable to start. The trouble shooting
showed that one transmitter module (ZE0728) was defective, a fuse on the motherboard was
damaged and the power supply had 2 errors.
The fan did not run (had to be changed).
Transformer on the filter board had a loose connection.
147

Annex 6

Case study
Modules for BeoSound 1 and BeoSound 3000
supplied by Bang & Olufsen A/S
detailed test log

(7 pages)

148

DELTA/KAS Oversigt over testemner
HALT test af moduler til BeoSound 1 og BeoSound3000 udfrt for Bang & Olufsen a/s
DELTA sag nr. E501018 A
Eksponering
Dato Nr. 1 Nr. 2 Nr. 3 Nr. 4 Nr. 5 Nr. 1 Nr. 2 Nr. 3
Kulde 14-apr x x
Varme 14-apr x x
Temperaturcycling 14-apr x x
Vibration optil 15 grms 15-apr x x
Vibration optil 25 grms 15-apr x x
Vibration ved 25 grms 15-apr x (x) x x
Vibration ved 30 grms 15-apr x x
Ekstra temperaturtest 15-apr x
Vibration ved 35 grms 15-apr x
Vibration optil 65 grms 15-apr x
Kombineret vibration og temperatur 16-apr x
med ny
metal vinkel
Bemrkninger:
Overvgning lavet vha. komplette B&O apparater F-test inkluderer power off/on
Test overvget af: Turi Bach Roslund
Mogens Agger
Unit ID
PCB 12 (Input-select til
BeoSound 3000)
SMPS (til BeoSound 1)

149

DELTA/KAS Kuldeeksponering
Aktivitet Dato Tid Init. SMPS PCB 12 Bemrkning
Initial F-test 14-apr 11:30 B&O OK OK
F-test ved +10C 14-apr 11:38 B&O OK
Ingen lyd (hverken fra CD
eller Radio)
PCB 12 kan tilsyneladende
ikke lide temperaturtransienter
F-test ved +17C 14-apr 11:46 B&O N/A Stopper af og til
F-test ved +25C 14-apr 11:50 B&O N/A Verifikation af opstilling
Rampe ned med 1/min 14-apr 12:02 B&O N/A
OK ved 20C, OK ved
17C,
F-test ved +15C 14-apr 12:41 B&O N/A OK
Rampe ned med 1/min 14-apr B&O
Funktion ustabil (skifter
mellem lyd eller display)
Rampe ned med 1/min 14-apr B&O Rampe hastighed passer ikke !
F-test ved 0C 14-apr 13:22 B&O OK OK
F-test ved -10C 14-apr 13:33 B&O OK
OK, dog funktion ustabil af
og til
OK, dog funktion ustabil af
og til
F-test ved -30C 14-apr 14:04 B&O OK OK
Radio begynder at
"knase" ved -35C
Radio-del nsten
ubrugelig, grn LED tndt
Grn LED hrer til "Timer
funktionen"
Rampe ned med 2/min 14-apr 14:24 B&O
F-test ved -50C 14-apr 14:35 B&O OK Grn LED tndt
Rampe ned med 2/min 14-apr 14:36 B&O
Stj ved skift mellem
programkilder ved -55C
F-test ved -60C 14-apr 14:43 B&O Gr ud engang imellem
Tilbage til ambient 14-apr B&O
F-test ved +25C 14-apr 14:56 B&O OK Display ustabilt ellers OK
Ekstra test ved -55C 15-apr 14:15 KAS N/A
Med nr. 3. Knaser ved ca. -
38C
Efter at P20 testledning var
repareret
Lower Operational Temperature Limit LOTL -55C -35C
Lower Destruct Temperature Limit LDTL Ikke fundet Ikke fundet
Resultat

150

DELTA/KAS Varmeeksponering
Initial F-test 14-apr 14:56 B&O OK Display ustabilt ellers OK
Rampe op med 5/min
F-test ved +40C 14-apr 15:09 B&O OK OK
Rampe op med 5/min
Rampe op med 5/min
OK (dog lidt problemer med
display)
Rampe op med 5/min
Rampe op med 5/min
Rampe op med 5/min
Rampe op med 5/min
Rampe op med 5/min
Stoppet ved +110C
for ikke at beskadige
testledninger
Rampe ned med 50/min
Upper Operational Temperature Limit UOTL Ikke fundet Ikke fundet
Upper Destruct Temperature Limit UDTL Ikke fundet Ikke fundet
Resultat
DELTA/KAS Temperaturcycling
Start cycling 14-apr 16:33
Temperaturcycling KAS OK OK
10 cykles med 30 min dwell time.
Tlow = -55C, Thigh = +110C.
F-test 15-apr 08:09 B&O OK OK
Visuel inspektion 15-apr 08:15 B&O
Begyndende
stresssymptomer ved
lodning af tunge
komponenter (endnu ikke
kritisk)
Begyndende
stresssymptomer ved
lodning af tunge
kritisk)
Resultat

151

DELTA/KAS Vibrationseksponering
Initial F-test 15-apr 09:44 B&O OK
Nr. 1. virker ikke rigtigt
(brummer og reagerer
langsomt). Skiftet til nr. 2
inden vibrationstest
Random 5 grms 15-apr 09:52 KAS OK OK Ca. 15 minutter
Random 15 grms 15-apr 10:20 KAS OK Slr fra engang imellem Ca. 10 minutter
Fejlsgning 15-apr 10:32 B&O N/A
Ser ud til at vre omkring
stik P20 (data, clock
mm.). P20
testledningsstik ustabilt
F-test 15-apr 10:58 B&O N/A
Skiftet til nr. 3 +
testledningstik P20 skiftet
Random 25 grms 15-apr 11:38 KAS
C1 + RT1 falder af efter ca.
1 minut
OK Ca. 2 minutter
F-test 15-apr 11:58 B&O
Skiftet til nr.2 hvor C1 og
RT1 er stttelimet
OK
C55 falder af og C54 ls
efter ca. 12 minutter
OK
Pause efter ca. 1 minut, i alt ca.
12 minutter
Skift til nyt emne 15-apr 12:17 B&O
Skiftet til nr. 3 hvor C55,
C54, C21, C22, C1 og RT1
er stttelimet. Nr. 3 virker
ikke i opstillingen. Skiftet til
nr. 4 der er stttelimet p
samme mde
OK
Random 25 grms 15-apr 13:09 KAS OK Ustabil
Ca. 3 minutter (i alt ca. 15
minutter ved 25 Grms).
Accelerometer nr. 4 faldet af
L7 knkket halvt af efter
ca. 15 minutter. Repareret
og stttelimet
OK Ca. 15 minutter
Random 30 grms 15-apr 14:02 KAS OK OK
Ca. 3 minutter. Accelerometer #
4 sat p igen
Random 35 grms 15-apr 14:05 KAS Fejler OK Ca. 6 minutter
Herefter lav temperatur af PCB 12
# 3
Random 35 grms 15-apr 14:18 KAS (ikke med) OK
Accelerometer # 2 og # 4 falder
af. Ca. 10 minutter i alt
Random 40 grms 15-apr 14:29 KAS (ikke med) OK Ca. 10 minutter
Random 55 grms 15-apr 15:02 KAS (ikke med) OK Lidt ustabilitet i lys
Random 100% ! 15-apr 15:22 KAS (ikke med)
OK (frste produkt p
100% !!!)
Ca. 61-64 grms. Ca. 10 minutter
Visuel inspektion 15-apr 15:37 B&O
C97 og C107 faldet af.
Monteringsvinkel p
netstiksskinne ved
netskinne knkket
25 Grms (C1, C21, C22,
C54, C55, RT1)
30 Grms (L7)
Vibration Destruct Level KAS 35 Grms
ca. 65 grms
(kondensatorer)
Resultat
Operational Vibration Level Ikke fundet KAS
Eksponering udfrt med random vibration i 6 akser. 10-15 minutter ved hvert niveau. 5 grms step

152

DELTA/KAS Kombineret vibrations- og temperatureksponering
Initial F-test SMPS PCB 12
og temperatur
cycling
16-apr 08:11 KAS
Ustabilitet efter ca. 8
minutter ved -55C.
CD afspilning virker
ikke efter ca. 10
minutter. Dr helt
efter ca. 7 minutter
ved +110C
"Sdvanlig knas" p vej
ned i temperatur. Vil
ikke starte op efter
power off ved -55C.
Kan ikke spille CD ved
slutningen af T = 110C
1 cykle med 15 min dwell time.
Funktionstest 16-apr 08:50 B&O OK OK
og temperatur
cycling
16-apr 08:53 KAS
CD afspilning
stopper efter ca. 5
minutter ved -55C.
Stttelim (Hot-melt)
svigter ved den hje
temperatur
Radio "dr" efter ca. 4
minutter ved -55C
Funktionstest 16-apr 09:36 B&O
Virker ikke (C55
knkket af)
OK
og temperatur
cycling
16-apr 09:36 KAS
Er med, men virker
ikke
Stadig problemer
undervejs (men ingen
"nye")
Funktionstest 16-apr 10:16 B&O
Virker ikke (flere
komponenter der er
stttet limet
knkket af)
OK
og temperatur
cycling
16-apr 10:19 KAS
Er med, men virker
ikke
Stadig problemer
undervejs (men ingen
"nye")
Visuel inspektion +
funktionstest
16-apr 10:57 B&O
C11 og U2 knkket
af
Funktion OK, men C89
knkket af.
Antennestik knkket.
Monteringsvinkel p
netskinne knkket
Resultat

153

DELTA/KAS Resume
SMPS PCB 12 Bemrkning
LOTL -55C -35C
Lower Operational
Temperature Limit.
LDTL Ikke fundet Ikke fundet
Lower Destruct Temperature
Limit
Svaghed Stj ved skift af programkilder Radio "knaser" i lyden
UOTL Ikke fundet Ikke fundet
Upper Operational
Temperature Limit.
UDTL Ikke fundet Ikke fundet
Upper Destruct Temperature
Limit
Svaghed
(stoppet ved +110C pga.
testledninger)
(stoppet ved +110C pga.
testledninger)
OVL
25 grms (5 komponenter)
30 grms med L7)
Ikke fundet Operational Vibration Level
VDL ca. 35 grms ca. 65 grms Vibration Destruct Level
Svaghed
Montering af C1, C21, C22,
C54, C55, RT1 og L7
Montering af C97 og C107.
Moneringsvinkel p netskinne
Temperatur cycling
(-55C/+110C, 30 min.dwell
10 cycles)
Svaghed
Begyndende stresssymptomer
ved lodning af tunge
kritisk)
Begyndende stresssymptomer
ved lodning af tunge
kritisk)
Kombineret vibration og
temperatur
10, 20, 30, 40 og 50 grms,
-55C og +110C
Svaghed
Problemer med CD afspilning
ved lav temp. Montering af C11
og U2.
Montering af C89.
Monteringsvinkel p netskinne,
Antennestik knkket i ene
side
Bemrkning: Der br udfres en detaljeret visuel inspektion af alle emner for at afdkke eventuelle andre svagheder
Eksponering
Kulde
Varme
Vibration

154

DELTA/KAS Konklusioner efter overordnet visuel inspektion udfrt p DELTA
Forml At finde de svage punkter for SMPS til BeoSound 1
Her er der plads til
kundens's kommentarer
Mulig rsag Aktion
Stj ved skift mellem programkilder
RT1 falder af
C21, C22, C54 og C55 falder af
L7 falder af
C11 falder af
U2 knkker af
CD afspilning stopper ved kav temp./vibration
Forml At finde de svage punkter for PCB12 til BeoSound 3000
Mulig rsag Aktion
Radio "knaser" i lyden (ved lav temp.)
C97 og C107 falder af
C89 knkker af
Monteringsvinkel p netskinne knkker af
Antennestik knkker af
Relevant RE-HALT
Relevant RE-HALT
De testede moduler br underkastes en detaljeret visuel inspektion

SPM 169 Suo Halt and Hass

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HALT & HASS

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