AMC Short Spec

PICMG AMC.
0
Advanced Mezzanine Card Short Form Specification
June 15, 2004
Version D0.9a
Do Not Specify or Claim Compliance to the Draft Specification
Copyright 2004, PCI Industrial Computer Manufacturers Group. The attention of adopters is directed to the possibility that compliance with or adoption of PICMG specifications may require use of an invention covered by patent rights. PICMG shall not be responsible for identifying patents for which a license may be required by any PICMG specification or for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG specifications are prospective and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.
NOTICE: The information contained in this document is subject to change without notice. The material in this document details a PICMG specification in accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this specification in any company's products. WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE. In no event shall PICMG be liable for errors contained herein or for indirect, incidental, special, consequential, reliance or cover damages, including loss of profits, revenue, data or use, incurred by any user or any third party. Compliance with this specification does not absolve manufacturers of AdvancedTCA equipment from the requirements of safety and regulatory agencies (UL, CSA, FCC, IEC, etc.). The PICMG and CompactPCI names and the PICMG, CompactPCI, and AdvancedTCA logos are registered trademarks and ATCA is a trademark of the PCI Industrial Computer Manufacturers Group. All other brand or product names may be trademarks or registered trademarks of their respective holders.
PICMG AMC.0 Short Form Specification Version D0.9a Page 1 of 57
Introduction and objectives

1.1 Overview
The PICMG Advanced Mezzanine Card (AMC) specification defines the base-level requirements for a wide-range of high-speed mezzanine cards optimized for, but not limited to, AdvancedTCA Carriers. This base specification defines the common elements for each implementation including mechanical, management, power, thermal, and interconnect. Subsidiary specifications will define the usage requirements for each interface implementation. Target interfaces include PCI Express, Advanced Switching, Serial RapidIO, and Gigabit Ethernet.
1.2
Introduction
AMC defines a modular add-on or child card that extends the functionality of a Carrier board (see Figure 1-1). Often referred to as mezzanines, these cards are called AMC Modules or Modules throughout this document. AMC Modules lie parallel to and are integrated onto the Carrier board by plugging into an AMC Connector. Carrier boards may range from passive boards with minimal intelligence to high performance single board computers. Figure 1-1 Four Single-Width AMC Modules on an ATCA Carrier board
AMC enables a modular building block design for both industry standard and proprietary Carrier boards. This AMC specification enables larger markets with more unique functions and creates economies of scale that lower prices. Mezzanines range in terms of their functionality but typically include the following categories: Telecom connectivity (ATM/POS (OC-3/12/48), T1/E1, VoIP, GbE, etc.) Processors (CPUs, DSPs, and FPGAs) Network communication processors (NPUs) Network communications co-processors (Classification, Security or Intrusion Detection) Mass storage
1.2.1
Next generation mezzanine standard
AMC represents the industrys next generation mezzanine standard supporting high-speed interfaces and AdvancedTCA optimization. In the early 1990s, another base mezzanine standard was developed to support parallel interfaces and was optimized to support PCI and CompactPCI environments. This earlier specification is the IEEEP1386 Common Mezzanine Card (CMC) specification. Many subsidiary specifications to CMC have been developed including: IEEE Std P1386.1-2001 PCI Mezzanine Card (PMC) PICMG 2.15 PCI Telecom Mezzanine/Carrier Card (PTMC) ANSI/VITA 32-2003, Processor PMC (PrPMC or PPMC) A new mezzanine specification, rather than an extension of the CMC standard, was required to meet the design objectives of high-speed LVDS interface support and AdvancedTCA optimization. As such, AMC is not backward compatible with mezzanine standards based on the CMC specification. AMC is designed to take advantage of the strengths of the PICMG 3.0 ATCA specification and the Carrier grade needs of Reliability, Availability, and Serviceability (RAS). These strengths and needs required a new Hot Swappable mezzanine that could either maximize density through the use of Stacked Modules or through the use of greater surface area and Component height. In addition, the needs of higher electrical power with higher I/O bandwidth were also compelling reasons to launch a new mezzanine base specification.
1.2.2
Scope
This AMC.0 specification defines the framework or base requirements for a family of anticipated subsidiary specifications. The objective of this document is to define the requirements for mechanical, thermal, power, interconnect (including I/O), system management (including hot swap), and regulatory guidelines. It includes the definitions and requirements for Face Plates with ejectors, defined component spaces, complete mechanical dimensions, thermal definitions, mounting, guides, and a connector necessary to interface between the Module and the Carrier board will also be defined. AMC.0 will not define specific interconnect usage, although it will be optimized for current and emerging HighSpeed LVDS Interconnect standards, such as PCI Express, Advanced Switching, Serial RapidIO, and Gigabit Ethernet. These interconnect definitions will be specified through further subsidiary work.
1.2.3
Design goals
PICMG 3.0 optimized: All elements must work within the bounds of the PICMG 3.0 base specification and build upon its strengths of Reliability, Availability, and Serviceability (RAS). The AMC Module will not be limited by other chassis standards. System management: System management will be an extension of the PICMG 3.0 Shelf management scheme.
This PICMG AMC specification was written with the following design goals in mind:
Hot Swap support: Hot Swap of AMC Modules will be enabled in support of Availability and Serviceability objectives. The focus will be on front loadable Hot Swap Modules with non Hot Swap being an optional implementation. Low Voltage Differential Signaling (LVDS) interconnect: AMC will be optimized for High-Speed LVDS interconnects. Low pin count: The interconnect will be conservative in its total pin count, thereby reducing the amount of space required on both the Module and the Carrier board, yet provide sufficient real estate for intended interconnects and usage models. Support for a rich mix of processors: This includes compute processors (CPUs), network processors (NPUs), digital signal processors (DSPs), and input/output (I/O). Reduced development time and costs: The reduced total cost of ownership will be accomplished through component standardization and by driving economies of scale. Communications and embedded industry focus: Target usage includes support for edge, core, transport, data center, wireless, wireline, and optical network design elements. Modularity, flexibility and configurability: Support for a minimum of four Modules across a given ATCA Carrier, dual width mezzanines, and stacked mezzanines. Future advances in signal throughput: Anticipate advances in interconnect technologies by supporting a minimum of 12.5 Gbps throughput per LVDS signal pair.
1.2.4
Theory and operation of usage
Each AMC Module is designed to be Hot Swappable into an AMC Connector, seated parallel to the host Carrier board. The Carrier Face Plate is to provide one or more slot openings through which the Modules are inserted into AMC Bays. Module Guide Rails support the insertion of the Modules into the AMC Connectors (see Figure 1-2). The AMC Bay opening provides mechanical support as well as EMI shielding. Connectivity between the AMC and the Carrier is provided via a one-part, replaceable connector that is attached to the Carrier board. The connector resides on the Carrier board at the rear of the AMC Module. The Modules I/O can be via the Face Plate or via the AMC Connector. If the I/O is through the Connector, the I/O may also be routed to the hosts backplane or RTM (Rear Transition Module), as is commonly done on ATCA systems. The AMC specification defines usage requirements for a single Carrier board and single ATCA (or proprietary) chassis slot implementation.
Figure 1-2 General orientation and insertion of AMC Modules
Single-Width, Full-Height AMC Module
AMC Connector AMC Guide Rails
Note:
Figure 1-2 is shown without the Side 1 Component Cover.
1.2.4.1
Multi-Width modules
AMC supports two Module width definitions: Single-Width and Double-Width. Single-Width Modules: The standard width for an AMC Module is approximately 74 mm and is referred to as a Single-Width Module. A maximum of four Single-Width Modules fit across an ATCA Carrier board as shown in Figure 1-2. (Can be abbreviated as 1x Module.) Double-Width Modules: AMC.0 also supports a Double-Width Module whose width is roughly twice that of a Single-Width Module at approximately 149 mm. The wider Module enables designs that would otherwise not fit on a Single-Width implementation. Double-Width Modules utilize a single AMC Connector. A maximum of two Double-Width Modules are designed to fit across an ATCA Carrier board. (Can be abbreviated as 2x Module.) A mixture of both Single-Width and Double-Width Modules is permitted (see Figure 1-3). It is important to note that while most illustrations demonstrate Carrier boards fully populated with AMCs, this is not a requirement. It is also important to note that some designs may only support one or two Single-Width AMC Modules.
Figure 1-3 Single-Width and Double-Width Full-Height Module Configuration
Double-Width, Full-Height Module
Single-Width, Full-Height Modules
Note:
1.2.4.2
Multi-height Modules
AMC defines two standard height configurations: Half-Height Modules and Full-Height Modules. Full-Height Modules: Full-Height Modules are defined to maximize the amount of component and thermal space available on Component Side 1 of the AMC Module. Full-Height Modules cannot be stacked. (See Figure 1-3, Figure 1-6, and Figure 1-9.) Half-Height Modules: Half-Height Modules are similar to Full-Height Modules, with the exception of reduced component space on the Modules Component Side 1 (See Figure 1-4, Figure 1-7, and Figure 1-8). The term HalfHeight implies that two Modules equally split the maximum height available in a stacked implementation and should not be taken literally as being half of a Full-Height Module. Table 1-1 presents a general analysis of the different types of connectors that fit on both Half-Height and Full-Height Modules. Table 1-1 Connectors that fit Half-Height and Full-Height Modules
Connector types XPAK (low profile) XPAK2 (X2 MSA) (low profile) XENPAK SFP (MiniGBIC) RJ-45 Full-Height Yes (1 on a 1x; 3 on a 2x) Yes (1 on a 1x; 3 on a 2x) Yes (1 on a 1x; 3 on a 2x) Yes (4 max. -1x) Yes (4 max. -1x) Half-Height Yes (1 on a 1x; 3 on a 2x) Yes (1 on a 1x; 3 on a 2x) (Subject manufacturer specified pin length) No Yes - (4 max.-1x) Yes - (4 max.-1x)
Table 1-2 presents a general assessment of a variety of AMC Modules that would typically be expected to fit on the configurations identified. Table 1-2 Sample Module configurations and functionality
AMC Module configurations Example functionality Disk Drive, DSP Array, FPGA Array, Encryption Engine, T1/E1/J1 Line Cards, T3/E3 Line Cards, OC-3/12/48 Line Cards, GbE WAN Cards, 10 GbE Optical WAN Card, InfiniBand WAN Card, Memory Arrays CPU Boards, DOCSIS Cable Modem, Baseband Modem, Radio Cards NPU Boards
Single-Width, Half-Height Single-Width, Half-Height and Full-Height Double-Width, Half-Height and Full-Height
1.2.4.3
Carrier types
AMC supports three types of Carrier board configurations. Conventional Carriers: The term Conventional Carrier refers to a full Carrier board without any required cutouts and allows components to be placed on the Carrier below AMC Modules. Conventional Carriers support both Full-Height and Half-Height Modules (see Figure 1-6 and Figure 1-7). Conventional Carriers also support up to four Single-Width or two Double-Width Modules across an ATCA Carrier board. Cutaway Carriers: The term Cutaway Carrier is derived from the fact that the Carrier board below the AMC Modules must be cut-away to support Stacked Modules (see Figure 1-4). By cutting the Carrier Board, this permits the maximum component height possible for Half-Height Modules and ensures the needed space for I/O interfaces on the Face Plate (see Figure 1-8). Full-Height Modules can be inserted into the upper Bay of a Cutaway Carrier when the lower Bay is unoccupied (see Figure 1-9). Cutaway Carriers can support up to eight Single-Width, Half-Height Modules (see Figure 1-4) or four DoubleWidth, Half-Height Modules across an ATCA Carrier board. A maximum stacking of two Modules is permitted. Hybrid Carriers. Hybrid Carriers combine both Conventional and Cutaway Carrier sites on a single Carrier board.
Figure 1-4 Single-Width, Stacked Modules on a Cutaway Carrier
Note:
1.2.4.4
Connector types
AMC.0 defines two fundamental Connector types to support Single-Layer and Stacked Module implementations: B and AB. B Connector:The B Connector is used in association with Conventional Carriers and can support a SingleLayer Module implementation. Both Full-Height and Half-Height Modules are supported (see Figure 1-6 and Figure 1-7). AB Connector:The AB Connector is used in association with Cutaway Carriers and supports up to two Stacked Half-Height Modules or one Single-Layer Full-Height Module in the upper Bay when the lower Bay is not occupied. (See Figure 1-8 and Figure 1-9). Figure 1-5 Overview of AMC Connector housings
86 85 86 Slot B 85 86 Slot A 85 85
170 1
85 1 170 1 170 1 1
Style B/B+
Style AB Style A+B+
1.2.4.4.1
Basic and Extended Connectors
AMC Modules use a card-edge connection style, which consists of conductive traces at the edge of the Module PCB. The conductive traces at the edge of the AMC act as male pins, which mate to a female connector mounted on the Carrier board. AMC supports two Connector styles in association with the B and AB Connectors: Basic and Extended. Basic Connector: The term Basic is associated with AMC Connectors that are equipped with conductive traces on only one side of the Connector. This provides cost and real estate savings for designs that do not need a large amount of I/O connectivity. The mating Connector for the single-sided design contains 85 pins and is designated simply as either B or AB. (See Figure 1-5.) Extended Connector: The Extended Connector is equipped with conductive traces on both sides of the Module edge. The mating connector for the two-sided design contains 170 pins per AMC Connector and is designated with a + following the connector type (e.g., B+ and A+B+).
1.2.4.5
Module Orientation on a Conventional Carrier
AMC Modules on a Conventional Carrier are placed such that Component Side (B1) of the Module faces the Carrier board (see Figure 1-6). The mechanical envelope is optimized for Single-Layer Full-Height Modules, which allow for taller components towards the front portion of the Module. This mechanical envelope is maintained for both FullHeight and Half-Height Modules so as to encourage industry interoperability (see Figure 1-7). Additional components may be placed on Component Side 2 (B2) of the Module. Figure 1-6 Full-Height Module orientation in a Conventional Carrier
Component Side B2 Module B Component Side B1 B/B+ Connector Conventional Carrier Carrier Board Components
Figure 1-7 Half-Height Module orientation in a Conventional Carrier

Component Side B2 Module B Component Side B1 Conventional Carrier Carrier Board Components B/B+ Connector
1.2.4.6
Module orientation on a Cutaway Carrier
Cutaway Carriers are designed to enable Stacked Half-Height Modules. The Stacked Modules are oriented such that Component Side 1 of each AMC Module faces in the same direction towards where the Carrier board would be. Additional Components may be placed on Component Side 2 (A2 or B2) of each AMC Module (see Figure 1-8). Cutaway Carriers also may support a Single-Layer Full-Height Module in the B/B+ layer only (see Figure 1-9).
Figure 1-8 Stacked, Half-Height Module orientation in a Cutaway Carrier

Component Side B2 Modules A B Component Side B1 Cutaway Carrier Component Side A1 Component Side A2 AB/A+B+ Connector
Figure 1-9 Single-Layer, Full-Height Module in Cutaway Carrier

Component Side B2 Module B Component Side B1 AB/A+B+ Connector Cutaway Carrier
1.2.4.7
Component Covers
A metal encasement above (Side 1 Component Cover) and below (Side 2 Component Cover) the AMC configuration provides the additional strength and rigidity needed, as well as support for AMC Guide Rails (see Figure 1-1.) These plates are required for both Conventional and Cutaway Carrier configurations wherever AMC Bays are located.
1.2.4.8
Module management
Module management is optimized for an ATCA environment. Other platforms may require extensions to accommodate the AMC Modules. A management controller is located on every mezzanine which supports a minimal subset of IPMI commands. The intent of this subset of commands is to minimize both the size and the cost of the onboard controller. This specification also provides unique geographical address lines for each Modules IPMI address. The Modules management controller communicates with the Carrier board using IPMB.
1.3
Conformance
Do not specify or claim compliance with this Short Form version of the AMC.0 D0.9a Specification. See the complete specification for guidelines regarding any statement of compliance.
1.4
1.4.1
Unit measurements
Dimensions
All dimensions in this standard are in millimeters (mm) unless otherwise specified. Drawings are not to scale.
1.4.2
Pressures and airflows
Pressures and airflows are in English units
1.5
Reference specifications
The following publications are used in conjunction with this standard. When any of the referenced specifications are superseded by an approved revision, that revision shall apply. All documents may be obtained from their respective organizations. AdvancedTCA Base Specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001 ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, January 1, 2001 IPMI Intelligent Platform Management Bus Communications Protocol Specification V1.0 Document Revision 1.0, November 15, 1999 Copyright 1998, 1999 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved. IPMI Intelligent Platform Management Interface Specification, v1.5. Document Revision 1.1, February 20, 2002. Copyright 1999,2000, 2001, 2002 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved. IPMI Platform Event Trap Format Specification V1.0 Document Revision 1.0, December 7, 1998 Copyright 1998, Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved. IPMI Platform Management FRU Information Storage Definition, V1.0 Document Revision 1.1, September 27, 1999 Copyright 1998, 1999 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved. IPMI Wired for Management Baseline, Version 2.0. PICMG Policies and Procedures for Specification Development, Revision 1.5, October 5, 2001, PCI Industrial Computer Manufacturers Group (PICMG), 401 Edgewater Place, Suite 500, Wakefield, MA 01880 USA, Tel: 781.224.1100, Fax: 781.224.1239, www.picmg.org
1.6
Special word usage
This document uses the following key words: may:Indicates the flexibility of choice with no implied preference. should:Indicates flexibility of choice with a strongly preferred implementation. The use of should not (in bold text) indicates flexibility of choice with a strong preference that the choice or implementation be prohibited. shall:Indicates a mandatory requirement. Designers shall implement such mandatory requirements to ensure interoperability and to claim conformance with this specification. The use of shall not (in bold text) indicates an action or implementation that is prohibited.
1.7
Intellectual property
Lucent Technologies has a patent, US #6646890, referring to Mounting of mezzanine circuit boards to a base board. This patent, filed on 9/4/02 and issued on 11/11/03, may cover aspects of the guide mechanisms that are detailed in the AMC.0 specification.
1.8
Glossary
Table 1-3, AMC Carrier specific terms Table 1-4, AMC Module specific terms
Definitions of terms and acronyms as they are used in this document have been grouped as follows:
Table 1-5, AMC Connector or Interface specific terms Table 1-3 AMC Carrier specific terms
Term or acronym AMC Carrier or Carrier AMC Bay or Bay Description AMC Carrier is used to describe Carrier boards that support AMC Modules. The abbreviated Carrier may optionally be used when the context of AMC is well understood. An AMC Bay is a single AMC site on an AMC Carrier and can support either Stacked or Single-Layer Modules. Board Covers provide mechanical rigidity for the Carrier boards as well as a place to mount the Module Guide Rails and the AMC connector body. Conductive board covers are required on both sides of all AMC Carrier board configurations and are referred to as Side 1 Component Cover and Side 2 Component Cover. The term Conventional Carrier refers to a full Carrier board without any required cutouts and allows components to be placed on the Carrier below AMC Modules. Conventional Carriers support both Full-Height and Half-Height Modules (see Figure 1-5 and Figure 1-6). Conventional Carriers also support up to four SingleWidth or two Double-Width Modules across an ATCA Carrier board. The term Cutaway Carrier is derived from the fact that the Carrier board below the AMC Modules must be cut away to support Stacked Modules (see Figure 1-4). Cutting the Carrier Board permits the maximum component height possible for HalfHeight Modules and ensures the needed space for I/O interfaces on the Face Plate (see Figure 1-7). Full-height Modules can be inserted into the upper Bay of a Cutaway Carrier when the lower Bay is unoccupied (see Figure 1-8). Cutaway Carriers can support up to eight Single-Width, Half-Height Modules (as shown in Figure 1-4) or four Double-Width, Half-Height Modules across an ATCA Carrier board. A maximum stacking of two Modules is permitted. An AMC Carrier that has both Conventional and Cutaway sites and includes both B/B+ and AB/A+B+ connector types. Assumes the Carrier board is fully populated with AMC Modules. (Also, see <Link>Partial Carrier.) Any AMC Carrier that is not fully populated with AMC Modules (e.g., a Carrier that includes only two AMC Bays). The following Partial Carrier types are possible: Partial Conventional Carrier, Partial Cutaway Carrier, and Partial Hybrid Carrier.
Component Cover
Conventional Carrier
Cutaway Carrier
Hybrid Carrier
Partial Carrier
. Table 1-4 AMC Module specific terms

Term or acronym Description An AMC Module (or Module) is a modular add-on or child card that extends the functionality of a Carrier board. An AMC Module can also be referred to as a mezzanine. The term is also used to generically refer to the different varieties of Multi-Width and Multi-Height Modules. A Module that is roughly twice the width of a Single-Width AMC Module and requires two AMC Bays. A maximum of two Double-Width Modules are designed to fit across an ATCA Carrier. Full-Height Modules allow for taller components on Component Side 1 of the Module but otherwise are identical to Half-Height Modules. The component height on Component Side 1 of Half-Height Modules is optimized to allow for two Stacked Modules to equally split the maximum height (ATCA pitch) available. The term Half-Height should not be taken literally as being half of a FullHeight Module. Guide Rail utilized by AMC Modules to facilitate insertion into the AMC Bay and to help facilitate Hot Swap of Modules. Used to describe the presence of a single AMC Module in an AMC Bay and is always used in connection with Full-Height Modules.
AMC Module or Module
Double-Width Module Full-Height Module Half-Height Module
Module Guide Rail Single-Layer Module
Table 1-4 AMC Module specific terms (Continued)

Term or acronym Single-Width Module Stacked Modules Description The standard (1x) width of an AMC Module that fits into a single AMC Bay. Used to describe two Half-Height Modules that are stacked one above another using an AB/A+B+ Connector.
. Table 1-5 AMC Connector or Interface specific terms

Term or acronym Description Module orientation when inserted into the lower Bay of an AB/A+B+ Connector. It is located in the cutout section of a Cutaway Carrier and is utilized by Half-Height Modules only. An AMC Connector that supports two AMC Bays. The AB designation indicates support as Basic Connectors. The + designation indicates support as Extended Connectors. Used to generically refer to AMC defined connectors including B/B+ and AB/A+B+. Module orientation when inserted into B/B+ Connector or into the upper Bay of an AB/A+B+ Connector. Requires conductive traces on only one side of the connector and supports all the mandatory aspects of the connector definition including AMC power and management. The mating connector for the single-sided design contains 85 contacts per Bay and is designated simply as B or AB. The Basic Connector supports 8 ports. Refers to the side of the AMC Connector that supports a Basic Connector. An AMC Connector that supports a single AMC Bay. The B designation indicates support as a Basic Connector. The + designation indicates support as an Extended Connector. Defines the use of each contact and is identical for both the AMC Module and Connector. A stiffener that is mounted on Component Side 2 of the Carrier board, opposite the AMC Connector and used to help prevent the Carrier board from bending. Requires conductive traces on each side of the Connector and includes the Basic Connector definition. The mating connector for the two-sided design contains 170 contacts per Bay and is designated with the + designation (i.e., B+ and A+B+). Refers to the side of the AMC Connector associated with the additional support provided by an Extended Connector. Refers to Low Voltage Differential Signaling and defined in ANSI/EIA-644-A. One or more Ports aggregated under a common protocol. Links are groups of Ports that are enabled and disabled by Electronic Keying operations. A xN Link (pronounced by-N link) is composed of N Ports. A later development of LVDS defined in ANSI/TIA/EIA-644. It is specifically designed for multi-drop and multi-sourced signaling. A set of differential signal pairs, one pair for transmission and one pair for reception. (Note: The PCI Express term Lane is equivalent to the AMC.0 term Port.)
A Layer
AB/A+B+ Connector AMC Connector or Connector B Layer
Basic Connector
Basic Side B/B+ Connector
Contact List Connector Brace Extended Connector Extended Side LVDS or High-Speed LVDS Link
M-LVDS Port
Mechanical
2.1
2.1.1
Modules
Module PCB dimensions
Modules shall have all 170 gold plated pads and pre-pads regardless of whether they are electrically required or not in order to protect the contacts of the connectors. The Module contacts shall be electroplated 0.4 m hard gold over 1.3 m nickel. The Module keepout areas shall exclude all components, traces, test points, vias, and features that can form a mechanical impediment or provide an electrical conduction including traces protected by solder mask.
2.1.1.1
Single-Width Module PCB dimensions
Figure 2-1 Single-Width Module PCB dimensions
2.1.1.2
Double-Width Module PCB dimensions
Figure 2-2 Double-Width Module PCB dimensions
2.1.1.3
Module Connector interface dimensions
Figure 2-3 Module Connector interface dimensions
Figure 2-4 Module edge contact detail
2.1.2
Module component height requirements
The maximum Module component heights shall not exceed those shown in the profiles in Figure 2-5 and Figure 2-6; these show Half-Height Modules with a total component envelope of 11.58 mm and Full-Height Modules with a total component envelope of 17.91 mm for the front 100 mm and 15.85 mm for the rear 73 mm. Full-Height Modules shall be supported in the B-Layer only.
2.1.3
Module Face Plate

Support for the latch mechanism Mounting surface for I/O connectors EMC containment Mounting and mating of EMC gasket surfaces Mechanical interface to the AMC PCB ESD shield Mounting for LED displays Mounting and display of product information
Module Face Plates fulfill a series of tasks:
2.1.4
Module Face Plate labels
Figure 2-5 Vendor and PICMG label dimensioning and positioning
2.1.5
2.1.5.1
Carrier PCB dimensions

Cutaway Carrier board dimensions
Figure 2-6 Cutaway Carrier using AB Connector dimensions
2.1.5.2
Conventional Carrier board dimensions
Figure 2-7 Conventional Carrier board dimensions
2.1.6
Carrier component height requirements
All component heights that are not below the Module, with the exception of the AMC Connector, shall conform to all PICMG 3.0 specifications or the relevant requirements for other form factors.
2.1.6.1
Conventional Carriers
These dimensions are also applicable to the Conventional Carrier portion of Hybrid Carriers. See relevant requirements for other form factors. Figure 2-8 Conventional Carrier component heights
2.1.6.2
Cutaway Carriers
Cutaway Carriers mandate that the Carrier board PCB be removed below the AMC Module sites. Therefore, there are no AMC-controlled Carrier board component heights.
2.1.7
Card guides and struts
The component covers provide a means of mounting removable and non-removable channels on which the edges of Module PCB boards ride in or ride out. These are known as AMC card guides.
2.1.7.1
A Layer
Figure 2-9 Card guide A Layer assembly dimensions
Figure 2-10 A Layer card guide and strut parts dimensions
2.1.7.2
B Layer
Figure 2-11 Card guide B Layer assembly dimensions
Figure 2-12 B Layer card guide and strut parts dimensions
Module management
3.1 Overview
The management aspects of Modules are intended to be platform agnostic. Although the Module specification is developed with ATCA in mind, it is the intent of the management architecture to support Modules in ATCA-based Carrier cards as well as platforms that might be exclusively Module-based or platforms that mix Modules with other form factors. In defining the role of the Module in system management it has been the intent of this section to minimize the management burden on the Module where space is a premium. Modules are controlled by a management controller with minimal functionality called the Module Management Controller or MMC. The commands that the MMC must support are intended to be a bare minimum in order to lower the cost of the MMC and save space on the Module. The Carrier IPMC communicates with a Modules MMC using IPMI messages over IPMB. This specification provides unique geographical address lines for each Modules IPMB-L address. Figure 3-1 Module Management Infrastructure
Shelf External System Manager
Shelf Manager Active
Shelf Manager Standby
ShMC
ShMC
2x Redundant, Bussed or Radial, IPMB-0

ATCA Carrier Board
ATCA Board
IPMC
IPMC
isolator
MMC MMC MMC MMC
AMC AMC AMC AMC
Bussed or Radial, IPMB-L
isolator
isolator
isolator
3.1.1
IPMI and IPMB architecture overview
The Carrier and Module communicate through a limited set of IPMI commands. The intent is to allow the use of inexpensive single chip microcontrollers on the Module. This specification requires that the Carrier provide ways to isolate the IPMB to each Module. This was done to prevent a Module from bringing down the IPMB. The specification also envisions that the Carrier might have multiple IPMBs. For clarity, the term IPMB-0 refers to the AdvancedTCA IPMB and the term IPMB-L refers to the IPMB between the Carrier and Module. The IPMB-L could either be radial or bussed as desired by the Carrier board designer. The IPMB-0 and IPMB-L are physically separate busses and in general the Carrier is responsible for bridging the two as necessary.
Note:
Intelligent controllers are referred to as an MMC on an AMC and as an IPMC on Carriers.
3.1.2
Module and Carrier power architecture overview
The Carrier provides management and payload power to a Module. Management power is used to power the management circuitry in the Module. The management circuitry includes the MMC, and pullups for IPMB-L and ENABLE#. Management power is current-limited by the Carrier. An MMC reset is provided from the Carrier. The Carrier will hold the MMC in reset until the Module is fully inserted. The MMC reset can also be controlled by the Carrier in the event that it becomes necessary to reset the MMC. Payload power (PWR) is the power provided to the Module from the Carrier for the main function of the Module. The Module FRU information contains records that define the PWR requirements for the payload. A Carrier will enable PWR if it determines that enough power and cooling exist to support the Module.
3.2
Module management interconnects
Figure 3-2 shows the interconnections between the Module and Carrier. Note that active low signals are denoted with a trailing #. All logic levels are assumed to be 3.3 V compatible unless noted. Figure 3-2 Interconnections between Carrier and Module
Module
GA_PULLUP 3.3K 33K 10K
MP
Carrier
Module Management Pow er
GA[2..0] IPMB-L ENABLE#
2.2K
MMC
IPMB-L_Isolator Reset_MMC# From IPMC
RESET#
PS1# PS0#
3.2.1
Geographic address [2..0] (GA[2..0])
There are three geographic address pins which are used to assign the address of the Module on the local IPMB-L. Each of the GA pins can encode three different levels. The GA (Geographic Address) lines can be connected to ground, to management power, or left unconnected on the Carrier to define the geographic address of the Module. This scheme requires that the Module be able to distinguish between the three states. The states of the GA bits can be G (grounded), U (unconnected), and P (pulled up to management power).
3.2.2
PS0# and PS1#
PS0# and PS1# pins are used to detect the presence of a Module in a Carrier. The PS pins are last mate pins located on opposite sides of the connector. These pins are used to de-skew the connector and provide an indication that all pins on the Module connector have mated. The Carrier connects PS0# to GND and PS1# to a management power pullup resistor. The Module provides a low resistance path between PS0# and PS1#. The Carrier can detect the presence of a Module by a low on PS1#.The Module can determine insertion into a Carrier by the Carriers feedback of PS0# and PS1# on ENABLE# as well as current flowing through the PS0# - PS1# connection.
3.2.3
ENABLE#
The Enable pin is an active low input to the Module pulled up on the Module to management power. This signal is inverted on the Module to create an MMC RESET# signal. This input indicates to the Module that the Module is fully inserted and valid states exist on all inputs to the Module. The MMC is not allowed to read the GA inputs or use the IPMB-L while ENABLE# is inactive. Note that the payload power decisions are made by the higher level entity and the Carrier executes that decision.
3.2.4
IPMB-L
The IPMB-L is made up of clock (SCL_L) and data (SDA_L) signals. These signals are to be considered valid by the Module when ENABLE# is active. Each Module receives an isolated copy of the IPMB-L. This isolated IPMB can be provided using FET type switches or I2C buffers.
3.2.5
BLUE LED
The BLUE LED is local to the Module. The BLUE LED is mounted on the front of the Module and is used to provide basic feedback to the user on the Hot Swap state of the Module. The BLUE LED states are off, short blink, long blink, and on. Once management power is available to the Module, the BLUE LED is turned 100% on as soon as possible.
3.2.6
LED 1 (mandatory)
LED 1 typically provides basic feedback about failures and out of service.
3.2.7
Hot Swap switch
The Hot Swap switch input connects to the mechanical latching mechanism. This switch is used to indicate a request for a pending extraction. This switch is pulled up to management power so that it can be read when payload power is not applied. The Module sends an IPMI platform event message to the Carrier when the Hot Swap switch changes state.
3.2.8
Payload reset
The payload reset is local to the Module. This signal is used by the MMC to reset the payload when a FRU Control command is issued by the Carrier IPMC.
3.2.9
Watchdog timer
A watchdog timer is provided to reset the MMC in the event that the MMC is unresponsive. The watchdog could be integrated into the MMC. This specification does not mandate what the watchdog checks; just that a watchdog be provided to reset an unresponsive MMC. Note that the state of the payload cannot be impacted if an MMC watchdog timer reset occurs.
3.3
Module management-hardware requirements
This section defines the requirements for the interconnects as seen by the Module. Figure 3-3 presents a simplified block diagram showing the Module interconnects for clarity. Figure 3-3 Module to Carrier hardware
Module
GA_PULLUP
300 Ohm 10 K 3.3 K 33 K 10 K
Carrier
MP
GA[2..0] IPMB-L
Hot Swap Switch Blue LED
MMC
ENABLE#
RESET#
PS1# PS0#
3.4
Carrier management-hardware requirements
This section defines the interconnect requirements for the Carrier. Figure 3-4 shows a simplified version of the interconnects on a Carrier for clarity. Figure 3-4 Carrier and Module interconnects
Module
MP Module Management Power Control 2.2K
Carrier
3.3 V IPMB-L Enable 3.3K IPMB Isolator IPMB-L
GA[2..0] IPMB-L ENABLE# PS1# PS0#
IPMC
Reset_MMC#
3.5
Power management
This specification insists that the power needs of the Module are not part of the Carriers power budget and that the Modules be treated as separate FRUs and represent their power budget as such. The intelligent power management decisions for the Modules are made by the Shelf Manager and the Carrier plays the role of a facilitator cum executor of that decision. A converter is viewed as part of the Carriers power budget. An additional criteria is the amount of power that can be delivered to an AMC site. This is typically limited by the trace width. The final criteria in power management is the amount of power that the Module can consume. As explained in the AdvancedTCA base specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001, in order to make intelligent decisions about when the FRUs (in this case, AMCs) are powered up or down and what power levels to assign for each FRU (in this case, AMC), the Shelf Manager must collect several pieces of data. The Carrier data (provided by the Carrier manufacturer) Maximum PWR Current (number 5 in Figure 3-5) that could be that can be delivered to all of the AMC sites. This is typically the power rating of the DC-DC converter that generates PWR. Maximum FRU Current (number 6 in Figure 3-5) that could be delivered to a particular Module. This is the maximum amount of current that can be delivered to an AMC site in Amps at 12 V. The Module power consumption (provided by the Module manufacturer). The Power consumed by a Module in Amps (number 7 in Figure 3-5). Figure 3-5 Power distribution management architecture
5 6 2 1 3 3 7
1 Power supplied to the Shelf Power Feed; entered during Shelf installation 2 Power that can be handled by this Feed; entered by Shelf manufacturer 3 Max. Power that can be routed to an ATCA Board; entered by Shelf manufacturer 4 Power required by the ATCA Board; entered by ATCA Board manufacturer 5 Power available to all AMC sites; entered by ATCA Board manufacturer 6 Max. Current that can be routed to an AMC site; entered by ATCA Board manufacturer 7 Power required by the AMC; entered by AMC Board manufacturer
Shelf ATCA Board AMC Defined in ATCA Spec. Defined in AMC Spec.
3.6
Cooling management
To support a higher level managing entity to appropriately manage the cooling resources, the Module has to provide reports of abnormal temperature in its environment. Every Module has to have a temperature sensor to enable the Module to report the temperature and this temperature sensor is monitored by the MMC. When an MMC detects that
a monitored temperature sensor exceeds one or more thresholds or returns to normal, The MMC raises a standard IPMI temperature event message and sends it to the event receiver (the Carrier). The Carrier, or a higher level managing entity, uses this information to manage the cooling. Every Module must contain at least one temperature sensor and an appropriate Sensor Data Record (SDR) to describe the sensor.
3.7
E-Keying
Electronic Keying is the mechanism by which the mandatory AMC.0 Management infrastructure is used to dynamically satisfy the needs that had traditionally been satisfied by various mechanical connector keying solutions: Prevent mis-operation Verify fabric compatibility Since the AMC.0 specification does not allow a direct connection between Modules and the Carrier backplane, the Carrier must provide one or more switch(es) between the Carrier backplane and the Modules. The IPMC on the Carrier is responsible for E-Keying between the Modules and switch(es). E-Keying between switch(es) and the Carrier backplane is out of scope of the AMC.0 specification and is covered by PICMG 3.0. This section uses the terms Control Interface and Data Fabric Interface. These interfaces are made up of a number of ports. The ports allocated to the Control Interface on a Module or Carrier are typically connected to the ATCA base interface through an on-Carrier switch. The ports allocated for the Data Fabric Interface would typically connect to the ATCA fabric.
3.7.1
E-Keying process
The basis for the E-Keying process is the E-Keying entries present as FRU information in the Carrier and all Modules. Those E-Keying entries describe the Control Interface, and the Data Fabric Interface implemented by the Carrier and Modules.
3.7.2
Point-to-point E-Keying
Point-to-point E-Keying covers the Control Interface and Data Fabric Interface. In the Data Fabric, the primary unit of point-to-point connectivity is a Port. A Port is two differential pairs (one transmit and one receive). One to four Ports can be grouped into a logical AMC Channel that is similar to an AdvancedTCA Channel. An AMC Channel is composed of an arbitrary (not necessarily numerically or physically contiguous) set of up to four Ports. In contrast, any given AdvancedTCA Channel involves a specific set of contiguous zone 2 connector pins. AMC Channels are identified by AMC Channel IDs. In the data structures and commands defined in this section, AMC Channel IDs play essentially the same role as Channel numbers in AdvancedTCA E-Keying. AMC Channel IDs start at 0 and are numbered sequentially on a given Carrier or Module. In this specification, each Link is mapped to a specific AMC Channel and an associated protocol. As in AdvancedTCA, a Link can be composed of several AMC Channels (say, to create a x16 PCI Express Link that combines four AMC Channels, each representing a x4 connection). Point-to-Point E-Keying supports two Data Fabric AMC Carrier routing models: the centralized AMC switch model and the AMC direct connectivity model. The point-to-point connectivity provided in a Carrier is described in the Carrier FRU information. The capabilities of an AMC Module to communicate over point-to-point connections are described in the Modules FRU information. Similar information for the links supported by the on-Carrier switch(es) is provided in the Carrier FRU information. In this topic there are references to Switch ID; these refer to the ID (number) assigned to an on-Carrier switch. The assignment of the number is arbitrary.
3.7.2.1
AMC point-to-point interface information
One or more AMC point-to-point connectivity records are included in the AMC FRU information and describe the connections to the Control and Data Fabric Interfaces that are implemented on the AMC Module. Similarly, one or more such records are included in the Carrier FRU information to describe the connections to the Control and Data Fabric Interfaces that are implemented by on-Carrier switch(es). These connections, each consisting of some subset of the Ports associated with one or more AMC Channels, are generically referred to as Links. Each AMC point-to-point connectivity record contains AMC Link Descriptors, each of which identifies a Link and an associated protocol.
3.8
Module payload control
The FRU Control command provides base level control over the Modules payload to the Carrier IPMC. Through this command, the Modules payload can be reset, rebooted, instructed to attain quiescence, or have its diagnostics initiated. The exact implementation of these commands will vary according to individual requirements, and all command variants with the exception of the FRU Control (Cold Reset) and FRU Control (Attain Quiescence are optional. The FRU Control command does not directly change the operational state of the Module as represented by the Carrier IPMC (which is typically M4 or FRU Active).
3.9
Module sensor management
MMCs have the capability of supporting any of the IPMI or OEM sensor types (analogous to an IPMC on an ATCA board). The MMCs sensors on IPMB-L are visible to the ShMC through the IPMC over IPMB-0. Since the IPMC must present unique sensor numbers and sensor LUNs over IPMB-0, it is necessary for the IPMC to translate the MMCs sensor number and sensor LUN to IPMC-wide unique numbers. The IPMC device SDR repository holds a combination of its own SDRs and SDRs from MMCs installed on the Carrier. The IPMC adds the MMCs SDRs into its SDR Repository after management power has been enabled to the MMC. Conversely, the MMCs SDRs are removed from the IPMCs SDR repository after management power has been removed from an MMC. As mentioned previously, when an IPMC adds the MMCs SDRs into its SDR repository, it needs to ensure that the sensor number and sensor LUN assigned are unique for the IPMC. The IPMC will also need to provide unique FRU IDs for all MMCs on a Carrier. The local FRU ID for an MMC is always 0; the IPMC will need to assign unique FRU IDs to all MMCs. MMC SDRs are linked with a Module using the entity fields of the SDR; the entity ID identifies that SDR as coming from a Module FRU and the entity instance is set to the Module site number to identify the Module on the Carrier. Also refer to Section 3.4.3 in the AdvancedTCA base specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001 and to IPMI 1.5 Chapter 33.1 for more information on IPMI entities. The IPMC will need to maintain a table that would be used to translate the IPMC-wide unique sensor number, sensor LUN, and FRU ID to the MMCs sensor number, sensor LUN, and FRU ID. When an IPMC receives a request over IPMB-0 for an MMCs sensor or FRU data, the IPMC substitutes the received sensor number, sensor LUN, or FRU ID with the target MMCs sensor number, sensor LUN, or FRU ID and sends the request over the IPMB-L to the MMC. The IPMC then returns the requested data substituting the MMCs identifying data with the IPMCs identifying data. The IPMC is also responsible for redirecting events generated on IPMB-L to the system event receiver on IPMB-0. In doing so, the IPMC substitutes the event generator ID with its own ID and substitutes the sensor number and sensor LUN from the received message with the IPMC-wide unique sensor number and sensor LUN. The message is then transmitted over IPMB-0.
3.10
FRU information
All Carriers and Modules must contain a FRU information storage device (for instance, an SEEPROM) that contains basic information about them. The format of the FRU information follows the requirements set forth in Section 3.6.3, IPM Controller FRU Information, in the AdvancedTCA base specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001. In addition to this basic information, additional fields are required to support functions unique to the Modules. An early and important feature of system management is its inventory management capability. Sections 1.6.11 through 1.6.14 of the IPMI specification provide an overview of FRU information principles and implementations. While the IPMI specification highly recommends that each IPMC implement the FRU Inventory Device commands, this document makes that a requirement of each MMC. The term Field Replaceable Unit (FRU) is used to reference a unit that can be replaced by customers in the field. All Modules are FRUs. The term FRU information refers to information stored within the Module in some non-volatile storage location. For instance, it could be contained in a SEEPROM within the unit. In all cases, the FRU information is accessed through a controller that knows how to talk to the non-volatile storage within the Module.
3.10.1
FRU information access commands
Access to read or write the FRU information is provided by three IPMI commands directed at the MMC that hosts the FRU information. FRU device IDs corresponding to particular Module sites can be identified by scanning the Carrier IPMC device SDR repository for device locator records (Type 11h) with entity ID fields set to C1h (Advanced Mezzanine Carrier [AMC]). These records represent Modules and their entity instance fields identify the site number in which they are installed.
3.11
Bridging
The Carrier IPMC manages the Module using a minimal set of IPMI commands. This minimal set of commands are the mandatory ones that the Module must support. For Module management purposes, there is no means and no need for an external entity (application in the Carrier, or Shelf Manager) to execute an IPMI command directly on the MMC. But if there are proprietary IPMI-based commands or optional IPMI 1.5 commands implemented in the MMC that the applications in the Carrier (or other entity that can talk to the IPMC on the Carrier) have to execute, the way to do it is by utilizing the Send Message command in the IPMC. For this reason all Carriers that host one or more Modules must support the Send Message IPMI command.
Power distribution
The purpose of this section is to describe the specifications for features and components required to support the Advanced Mezzanine Card (AMC), such as: Payload current limiting Payload power Management power AMC Module power interface AMC Connector AMC Module power distribution
Fault tolerant payload operation Standard Carrier board features outside the scope of this document include power source isolation, safety grounding, backplane interface, limiting inrush current, providing over-current protection, and steady state operational current.
4.1
Overview
The power distribution required to support AMCs on the Carrier includes power sources for both payload power and management power. Hence, AMC power distribution requirements include both payload and management power. Figure 4-1 shows the major components comprising the power distribution system. Figure 4-1 Power distribution block diagram
AMC Payload Power Source AMC Module Power Interface(s)
PWR (8)
Payload Power
MP (1)
AMC Connector(s)
Basic side
Management Power
AMC Module(s) Power Distribution
GND (28) GND (27)

Extended side
Ground Ground
The AMC payload power source can be at any voltage derived from the supplied and specified 12 V and a single payload power voltage helps minimize the number of power pins. This also accounts for the supply voltages changing constantly, as they migrate to lower and lower voltages. This approach has the additional advantage of lending itself
Boundary
Carrier side
Carrier/Module
Module side
to a point of load (POL) regulated power distribution strategy (to all payload circuits on the Module), which is believed to be a superior design technique. AMC payload power distribution is variable and determined by the Module design, as long as it conforms to the requirements of this section. The AMC management power source can be at any voltage that is convenient to the design and is derived from the specified Carrier. The Module management source can either be Carrier management power or Carrier payload power. The AMC Module power distribution will mostly provide isolated management power for the Module Management Controller (MMC).
4.1.1
Power interface
Module power interface presented in Figure 4-2 includes management and payload power current limiters; these two supply voltages need to have power-good indicators so that the system management can detect boot sequence events and nominal operating conditions. PS0# and PS1# provide for AMC presence detection. Two signals are used to ensure that the Module is fully seated even if rotated slightly. Also, the interface circuitry presented in Figure 4-2 recurs for every Module-Carrier combination. The power interface also provides an ENABLE# signal which is an open drain signal, driven by the Carrier and pulled up to MP on the Module. This signal is asserted when the Carrier detects that the Module is not fully inserted. The Carrier may additionally assert ENABLE# to restart the MMC if needed. The MMC is supposed to not execute a payload reset on the Module in this case. The CMC can sense the actual amount of Module current flow for any given site. This will allow the CMC to dynamically respond to any Module site if the site begins to draw more current than the stored value on the FRU ROM. The response of the CMC could be to inform the Shelf Manager of this condition or to immediately shut down the offending Module sites power supply. Figure 4-2 Module power interface
Carrier (non-recurring circuit) Module Management Power Source Carrier Management Power AMC Power Interface (recurring circuit for each bay) Module Management Power Current Limit PG 2.2K MP Good Presence ENABLE# PS0# IPMC PP Enable PS1# Payload Pwr Good 2.7K 470
Note 1
AMC Connector MP
AMC Module Power Distribution Module Management Power 10K
MMC
220 2.7K Option surprise extraction detection circuit MPP Enable
Current Limit Payload Power Source

Note 1 - If surprise extraction circuit not used replace 470 with 0 ohms
PWR
Module Payload Power Module side
Carrier side
Thermal
Thermal design requirements of this sort are relatively new to specifications such as PICMG 3.0 and PICMG.AMC. They are included here because of the experiences of the committee members in the market. Printed circuit board manufacturers have not been able to create designs with clearly defined capabilities, to dissipate heat. And system integrators have not had the necessary thermal data to design a system, mandated by the specifications. This portion of this specification is an attempt to bring a new level of understanding and information exchange to meet this market need. Being in compliance with the shall requirements in this section will not guarantee complete compatibility of Modules and Carriers. The system integrator will be required to evaluate the compatibility/ interoperability of Modules and Carriers involved. Also, in this section alone, compliance with the should provisions is intended to provide good evidence of interoperability, but not a guarantee. The committee felt that it was too restrictive of a Module originally designed for unique specific applications to match the features of a general-purpose Module. Carriers with mezzanine cards are in fact the most challenging thermal design applications and some issues that cause them to be so are: Multiple Carrier form factors Wide range of Module types Higher airflow resistance Varying power levels There are at least two approaches to obtaining the thermal data required in this section: 1) Thermal analysis using Computational Fluid Dynamics modeling tools such as ICEPAK from Fluent or Flotherm from Flomerics, and 2) Empirical measurement using a wind tunnel. The analysis approach requires specified pressure gradients across Modules or Carriers. Knowing the design pressure will enable the ability to calculate volumetric airflow based on impedance curves of the individual components. Then having determined airflow, heat dissipation and temperature rise can be calculated.
Interconnect
The AMC.0 interconnect framework comprises the physical Connector used to mate the AMC with its Carrier board, the mapping of signals to that Connector, and the routing of those signals among the AMCs across the Carrier, and also to the Carrier based switching elements. The performance headroom in the Connector will allow future interconnect technologies with higher signal rates to be accommodated within the framework. The generic signal mapping across the AMC Connector supports a variety of system fabric topologies for connecting AMCs together. The Interconnect interfaces are divided into six functional groups: Fabric Interface Control Interface System Management Interface Synchronization Clock Interface JTAG Test Interface Power These interfaces are connected between each AMC Carrier and the AMC Module across the Connector. AMC Carrier and Module compatibility guidelines are defined within this section for the following functional groups: Fabric Interface, Control Interface, Synchronization Clocks and JTAG. System Management and Power Interconnect specifics are covered in Sections 3 and 4 respectively. The AMC.0 base specification provides a physical framework for the Fabric Interface. AMC.0 subsidiary specifications define how to overlay a specific switching interconnect technology onto the AMC.0 Fabric Interface physical framework. Governance of AMC Module and Carrier board compatibility for the Interconnect interfaces, including the Fabric Interface, is provided by an Electronic Keying mechanism that is an integral part of the AMC.0 Module Management architecture. The ability to deploy interconnect technologies to the Fabric Interface (through subsidiary specifications) is limited by the number of assigned Fabric ports on the AMC Connector and the signal rate capacity defined by that Connector.
6.1
Connector pin allocation
The AMC Connector supports 170 pins, the Connector and pin definition are optimized around supporting high speed interconnects. The AMC Carrier can be optionally fitted with either a full connectivity 170 pin Connector, or with an 85 pin version to reduce cost where less Fabric connectivity can be accepted. The AMC Connector array optimally supports five separate interfaces to the AMC Carrier to utilize: 2 pins allocated to the Control Interface 42 signal pairs allocated to the Fabric Interface 3 pin pairs allocated to the Synchronization Clock Interface 5 pins allocated to the JTAG Test Interface 9 pins allocated to the System Management Interface Four levels of sequential mating (first mate, second mate, third mate, and last mate) are provided to ensure a correct electrical connection sequence is followed during insertion and extraction of the Module.
Table 6-1 AMC Connector A+B+ footprint pin assignments

Slot Layer A
Pin Nr. A85 A84 A83 A82 A81 A80 A79 A78 A77 A76 A75 A74 A73 A72 A71 A70 A69 A68 A67 A66 A65 A64 A63 A62 A61 A60 A59 A58 A57 A56 A55 A54 A53 A52 A51 A50 A49 A48 A47 A46 A45 A44 A43 A42 A41 A40 Signal GND MA_PWR MA_PS0# GND MA_CLK3MA_CLK3+ GND MA_CLK2MA_CLK2+ GND MA_CLK1MA_CLK1+ GND MA_PWR MA_SDA_L GND MA_Tx7MA_Tx7+ GND MA_Rx7MA_Rx7+ GND MA_Tx6MA_Tx6+ GND MA_Rx6MA_Rx6+ GND MA_PWR MA_SCL_L GND MA_Tx5MA_Tx5+ GND MA_Rx5MA_Rx5+ GND MA_Tx4MA_Tx4+ GND MA_Rx4MA_Rx4+ GND MA_PWR MA_ENABLE# GND Pin Nr. A86 A87 A88 A89 A90 A91 A92 A93 A94 A95 A96 A97 A98 A99 A100 A101 A102 A103 A104 A105 A106 A107 A108 A109 A110 A111 A112 A113 A114 A115 A116 A117 A118 A119 A120 A121 A122 A123 A124 A125 A126 A127 A128 A129 A130 A131 Signal GND MA_Tx8MA_Tx8+ GND MA_Rx8MA_Rx8+ GND MA_Tx9MA_Tx9+ GND MA_Rx9MA_Rx9+ GND MA_Tx10MA_Tx10+ GND MA_Rx10MA_Rx10+ GND MA_Tx11MA_Tx11+ GND MA_Rx11MA_Rx11+ GND MA_Tx12MA_Tx12+ GND MA_Rx12MA_Rx12+ GND MA_Tx13MA_Tx13+ GND MA_Rx13MA_Rx13+ GND MA_Tx14MA_Tx14+ GND MA_Rx14MA_Rx14+ GND MA_Tx15MA_Tx15+ GND Pin Nr. B85 B84 B83 B82 B81 B80 B79 B78 B77 B76 B75 B74 B73 B72 B71 B70 B69 B68 B67 B66 B65 B64 B63 B62 B61 B60 B59 B58 B57 B56 B55 B54 B53 B52 B51 B50 B49 B48 B47 B46 B45 B44 B43 B42 B41 B40
Slot Layer B
Signal GND MB_PWR MB_PS0# GND MB_CLK3MB_CLK3+ GND MB_CLK2MB_CLK2+ GND MB_CLK1MB_CLK1+ GND MB_PWR MB_SDA_L GND MB_Tx7MB_Tx7+ GND MB_Rx7MB_Rx7+ GND MB_Tx6MB_Tx6+ GND MB_Rx6MB_Rx6+ GND MB_PWR MB_SCL_L GND MB_Tx5MB_Tx5+ GND MB_Rx5MB_Rx5+ GND MB_Tx4MB_Tx4+ GND MB_Rx4MB_Rx4+ GND MB_PWR MB_ENABLE# GND Pin Nr. B86 B87 B88 B89 B90 B91 B92 B93 B94 B95 B96 B97 B98 B99 B100 B101 B102 B103 B104 B105 B106 B107 B108 B109 B110 B111 B112 B113 B114 B115 B116 B117 B118 B119 B120 B121 B122 B123 B124 B125 B126 B127 B128 B129 B130 B131 Signal GND MB_Tx8MB_Tx8+ GND MB_Rx8MB_Rx8+ GND MB_Tx9MB_Tx9+ GND MB_Rx9MB_Rx9+ GND MB_Tx10MB_Tx10+ GND MB_Rx10MB_Rx10+ GND MB_Tx11MB_Tx11+ GND MB_Rx11MB_Rx11+ GND MB_Tx12MB_Tx12+ GND MB_Rx12MB_Rx12+ GND MB_Tx13MB_Tx13+ GND MB_Rx13MB_Rx13+ GND MB_Tx14MB_Tx14+ GND MB_Rx14MB_Rx14+ GND MB_Tx15MB_Tx15+ GND
Table 6-2 Table 6-4. AMC Connector A+B+ footprint pin assignments (continued)
Slot Layer A
Pin Nr. A39 A38 A37 A36 A35 A34 A33 A32 A31 A30 A29 A28 A27 A26 A25 A24 A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 Signal
MA_Tx3MA_Tx3+ GND MA_Rx3MA_Rx3+ GND MA_Tx2MA_Tx2+ GND MA_Rx2MA_Rx2+ GND MA_PWR MA_GA2 GND MA_Tx1MA_Tx1+ GND MA_Rx1MA_Rx1+ GND MA_PWR MA_GA1 GND MA_Tx0MA_Tx0+ GND MA_Rx0MA_Rx0+ GND MA_PWR MA_ETH100T GND MA_ETH100R MA_GA0 MA_MP MA_PS1# MA_PWR GND
Slot Layer B
Signal
MA_Rx15MA_Rx15+ GND MA_Tx16MA_Tx16+ GND MA_Rx16MA_Rx16+ GND MA_Tx17MA_Tx17+ GND MA_Rx17MA_Rx17+ GND MA_Tx18MA_Tx18+ GND MA_Rx18MA_Rx18+ GND MA_Tx19MA_Tx19+ GND MA_Rx19MA_Rx19+ GND MA_Tx20MA_Tx20+ GND MA_Rx20MA_Rx20+ GND MB_TCLK MB_TMS MB_TRST# MB_TDO MB_TDI GND
Pin Nr. A132 A133 A134 A135 A136 A137 A138 A139 A140 A141 A142 A143 A144 A145 A146 A147 A148 A149 A150 A151 A152 A153 A154 A155 A156 A157 A158 A159 A160 A161 A162 A163 A164 A165 A166 A167 A168 A169 A170
Pin Nr. B39 B38 B37 B36 B35 B34 B33 B32 B31 B30 B29 B28 B27 B26 B25 B24 B23 B22 B21 B20 B19 B18 B17 B16 B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1
Signal
MB_Tx3MB_Tx3+ GND MB_Rx3MB_Rx3+ GND MB_Tx2MB_Tx2+ GND MB_Rx2MB_Rx2+ GND MB_PWR MB_GA2 GND MB_Tx1MB_Tx1+ GND MB_Rx1MB_Rx1+ GND MB_PWR MB_GA1 GND MB_Tx0MB_Tx0+ GND MB_Rx0MB_Rx0+ GND MB_PWR MB_ETH100T GND MB_ETH100R MB_GA0 MB_MP MB_PS1# MB_PWR GND
Pin Nr. B132 B133 B134 B135 B136 B137 B138 B139 B140 B141 B142 B143 B144 B145 B146 B147 B148 B149 B150 B151 B152 B153 B154 B155 B156 B157 B158 B159 B160 B161 B162 B163 B164 B165 B166 B167 B168 B169 B170
Signal
MB_Rx15MB_Rx15+ GND MB_Tx16MB_Tx16+ GND MB_Rx16MB_Rx16+ GND MB_Tx17MB_Tx17+ GND MB_Rx17MB_Rx17+ GND MB_Tx18MB_Tx18+ GND MB_Rx18MB_Rx18+ GND MB_Tx19MB_Tx19+ GND MB_Rx19MB_Rx19+ GND MB_Tx20MB_Tx20+ GND MB_Rx20MB_Rx20+ GND MB_TCLK MB_TMS MB_TRST# MB_TDO MB_TDI GND
6.2
Fabric Interface
The Fabric Interface is comprised of up to 21 ports providing point-to-point connectivity for Module-to-Carrier and Module-to-Module implementations. The Fabric Interface can be used in a variety of ways by AMCs and AMC Carrier boards to meet the needs of many applications. There are two usage models: Transport types covered by the AMC subsidiary specifications, i.e., Ethernet, PCI-Express, etc. Vendor-specific mappings named within this specification as General Purpose Input/ Output. GPIO still adheres to the Fabric Interface electrical specifications.
6.2.1
Fabric Interface electrical requirements for LVDS
Independent of Electronic Keying (E-Keying), the receiver hardware must not be damaged during inadvertent interconnects of incompatible interfaces; therefore, the following requirements have to be followed. Figure 6-1 shows one mode of operation where two Modules are directly connected via a passive AMC Carrier. The example shows the case where optional receive interface capacitors are required. Figure 6-1 Channel test points - Module to Module routing model
AMC Carrier AMC Module AMC Module
Tx
Rx
TP-1 (BGA Pads)
TP-4 (BGA Pads)
AMC Connectors
6.2.2
Fabric Interface electrical requirements for non-LVDS
Due to the fine pitch of the connector and the 0.1 mm isolation distances between conductive areas in the connector area, the voltage range of the signaling needs to be restricted. The potential difference between adjacent connection areas is limited accordingly by the following requirements:
6.3
Control Interface
A dedicated control Port is provided to allow for the initialization and Control of the AMC Module before Fabric ports are enabled. This allows for components on the Module to be initialized at startup. This also allows software uploads which may include FPGA code to initialize programmable logic devices, or runtime images to be retrieved from networked storage devices for example. This provides the ability to see the AMC as a logical IP endpoint for control purposes. AMC Modules supporting the Control Interface may also support the Fabric Interface. The Control Interface supports 100 Mbit Ethernet operating in a single ended mode. Figure 6-2 shows the interconnect detail for this interface.
Figure 6-2 Control Interface

Transmitter Portion
3V3
Receiver Portion
49.9 R
49.9 R 0.1uF
Tx+ 3V3 PHY-Transmit (100Base-FX) 49.9 R Tx49.9 R 49.9 R
Rx+
1V8
PHY-Receive (100Base-FX)
Rx-
6.3.1
Control Interface model
The Control Interface is based on a single ended Ethernet model capable of supporting 100 Mbps. Control Interface support is governed by the system management Electronic Keying mechanism; however, only a subset of requirements apply due to the deterministic nature of the interface. In particular, the Control Interface drivers do not need to be electrically isolated either from the AMC Module or the Carrier perspective.
6.3.2
Control Interface E-Keying requirements
Because the Control Interface signaling has only one configuration, Electronic Keying is not required to resolve potential signaling conflicts. However, boards are required to support E-Keying entries in the AMC FRU information.
6.4
Synchronization Clock Interface
This section defines the clock interface requirements to ensure interoperability between the AMC Module and the Carrier card that may be supplied by multiple vendors. Many telecommunications applications using the AdvancedTCA and Advanced Mezzanine Card architectures need to interface to external networks that require strict timing relationships between multiple interfaces and the external network, such as PDH networks and SONET/SDH networks.Such Interfaces typically require the AMC Module to receive frame and bit rate clocks from the Carrier, also to transmit a bit rate clock to the Carrier. The Synchronization Clock Interface provides three differential pairs for clock distribution to enable applications that require the exchange of synchronous timing information among Modules and consequently multiple boards in a Shelf. This allows Modules to source clock(s) to the system in the case where it provides a Network Interface function, or conversely to receive timing information from another Carrier board or Module within the system.
6.5
JTAG Interface
JTAG IEEE 1149.1 support is provided on the AMC Connector. This provides an industry standard method of performing manufacturing test and verification and is critical to the test of today's complex and often exclusively BGA device products. The JTAG Interface is supported for vendor product test primarily to increase product test throughput and hence reduce manufacturing cost. The optional JTAG support is provided via the extended half of the Connector, which is available in the B+ or A+B+ Connectors. The Module may support JTAG as required by the vendor. The Carrier may provide JTAG chain support for Modules and should allow the chain to be kept intact in the absence of an empty Module site. The JTAG capable Module shall function correctly on a non-JTAG supporting Carrier by providing applicable pullup/pulldown resistors.
6.6
System integration guidelines
The design flexibility offered by the Fabric Interface requires some guidelines to ensure proper interoperability between compatible AMC Modules and their Carrier boards. This section describes the minimum compatibility requirements for Carrier boards and Modules to ensure interoperability. The AMC Electronic Keying mechanism will confirm compatible connections exist prior to interface drivers being enabled. This ensures incompatible Module/Carrier combinations do not damage one another; however, interoperability of compatible boards can only be obtained when they are installed correctly. The AMC subsidiary specifications detail the Fabric Port usage specific requirements to ensure interoperability.
6.7
AMC Carrier fabric topologies
The AMC Connector provides up to 21 ports of fabric connectivity. This gives the flexibility to support a variety of fabric topologies. The following sections describe two fabric topologies that are expected to cover many of the application requirements and can be supported with AMC Carrier applications. Supporting multiple fabrics and/or topologies within a single system environment can be advantageous both for: Communications applications that require high speed, low latency data-plane interconnects. Control-plane interconnects with less stringent latency and jitter requirements.
AMC Connector
AMC Connector manufacturers shall comply with Performance Level 3, System Quality Requirements Level III and Quality Level III according to GR-1217-CORE. AMC Connector manufacturers shall state the Performance Level, the System Quality Requirements, Level, and the Quality Level according to GR-1217-CORE of their products. The AMC Connector is a single-part Z-Pluggable Connector. It contains groups of contacts for power, for general purpose connections, and for very high speed transmissions. The general contact pitch is 0.75 mm at the Module side and at the Carrier side. The AMC Connector makes pluggable card edge connections to the contact fingers on the AMC Module PCB and solderless compression connections to the conductive pads on the Carrier board. It is mounted on the Carrier by means of two screws through the Carrier board onto a steel Connector Brace.
7.1
AMC Connectors - Basic and Extended
The Basic Connector only connects to contact fingers on Component Side 1; the Extended AMC Connector connects to both sides of the AMC Module PCB. Compared to the Extended Connector, the Basic Connector provides a cost advantage for the connector and saves real estate on the Carrier board. AMC Connector contact definitions have been made such that the indispensable connections are implemented in the Basic Side. Connections for additional differential pair signals have been implemented in the Extended Side, they are only available in the Extended Connectors. The Basic Connectors have been designated as B and AB, while the Extended Connectors have been designated as B+ and A+B+. Table 7-1 Functional contact list: Basic Side
Basic Side (AMC Module Component Side 1) Power Ground General purpose Differential pairs
2, 9, 18, 27, 42, 57, 72, 84 1, 7, 10, 13, 16, 19, 22, 25, 28, 31, 34, 37, 40, 43, 46, 49, 52, 55, 58, 61, 64, 67, 70, 73, 76, 79, 82, 85 3, 4, 5, 6, 8, 17, 26, 41, 56, 71, 83 11/12, 14/15, 20/21, 23/24, 29/30, 32/33, 35/36, 38/39, 44/45, 47/48, 50/51, 53/54, 59/60, 62/63, 65/66, 68/69, 74/75, 77/78, 80/81
Table 7-2 Functional contact list: Extended Side

Extended Side (AMC Module Component Side 2) Power Ground General purpose
none 86, 89, 92, 95, 98, 101, 104, 107, 110, 113, 116, 119, 122, 125, 128, 131, 134, 137, 140, 143, 146, 149, 152, 155, 158, 161, 164, 170 165, 166, 167, 168, 169 87/88, 90/91, 93/94, 96/97, 99/100, 102/103, 105/106, 108/109, 111/112, 114/115, 117/118, 120/121, 123/124, 126/127, 129/130, 132/133, 135/136, 138/139, 141/142, 144/145, 147/148, 150/151, 153/154, 156/157, 159/160, 162/163
Differential pairs
7.1.1
Family of AMC Connector styles
The AMC Connector family consists of four different connector styles, with three different housings. Table 7-3 Number of contacts in the fixed connector
Interface to AMC Module Number of Module Slots Number of contact positions to Carrier Number of contact rows on Carrier General purpose contacts
Connector Style
Differential pairs
Power contacts
Ground contacts
B B+ AB A+B+
Basic Extended Basic Extended
1 1 2 2
85 170 170 340
1 2 2 4
19 45 38 90
11 16 22 32
8 8 16 16
28 56 56 112
Figure 7-1 Overview of AMC Connector housings

86 85 86 Slot B 85 86 Slot A 85 85
170 1
85 1 170 1 170 1 1
Style B/B+
Style AB Style A+B+
When the Carrier is equipped with a Cutaway Carrier board, two layers of Half-Height AMC Modules may be used. AMC Connectors AB and A+B+ provide the interconnections between both AMC Module layers and the Cutaway Carrier board. When the Carrier is equipped with a Conventional Carrier board (no cut-out), only AMC Module Layer B can be used. AMC Connectors B and B+ provide the connections between Module Layer B and the Conventional Carrier board. The AMC Connector styles shall provide alignment posts, distance pillars, and passages for mounting screws to assure proper alignment of the Carrier Component Covers. The lead-in chamfers of the plug-in slots of the AMC Connector shall be able to correct a maximum misalignment of the AMC Module PCB of 1 mm in the height and width directions, taking the lead-in features of the AMC Module PCB into account.
7.1.2
Contact protection mechanism (optional)
The AMC Connector may contain an optional feature to protect the contact beams from damage during insertion over the card edge. The mechanism prevents the contacts from scraping over the milled chamfers, where potentially exposed copper layers and glass fibers cause wear and eventual contamination to the contact surface. A mechanical device hovers the contacts over the AMC Module PCB edge, and lets them land on auxiliary pads in front of the actual contact pads.
7.2
7.2.1
Dimensions
Dimensions of AMC Connectors
For dimensional drawings of other connector styles see the full AMC Specification. Figure 7-2 Overall dimensions of AMC Connector style A+B+
Figure 7-3 View on compression mounted bottom of AMC Connector style A+B+
7.2.2
Connector Braces for the Carrier board
On Component Side 2 of the Carrier board, opposite the AMC Connector, a Connector Brace shall be mounted to exert a homogeneously spread force of 0.5 N per contact, to compensate for the compression force and prevent the Carrier board from bending after time and temperature exposure.
7.3
7.3.1
Electrical characteristics
Current carrying capacity
All power and ground conductors inside the AMC Connector shall be able to carry 1.0 A minimum, simultaneously driven, at an ambient temperature of 70 C.
7.3.2
Line resistance
Table 7-4 Maximum line resistances

Maximum initial line resistance Differential pair conductors Ground conductors General purpose conductors Power conductors Maximum change in relation to initial value
375 m max 60 m max 90 m max 90 m max
15 m 15 m 15 m 15 m
In order to avoid excessive current in the lower resistance lines, the difference in line resistance between conductors belonging to the same group of power conductors shall not exceed 20% of the average line resistance in the group during all test sequences.
7.4
High-speed characteristics
Conditions:Specimen environment impedance = 100 differential Measured step rise time (10% 90%) throughout the AMC Connector 30 ps maximum Adjacent lines terminated at both ends
7.4.1
Differential impedance
Under the conditions stated above, the impedance profile of the AMC Connector together with its connections to the AMC Module PCB and the Carrier board shall show an average value of 100 5 . Under the conditions stated above, the differential impedance peak values of the AMC Connector together with its connections to the AMC Module PCB and the Carrier board shall stay within a tolerance band of 100 10 .
7.4.2
Differential return loss
Under the conditions stated above, the differential loss profile of the AMC Connector together with its connections to the AMC Module PCB and the Carrier board shall be better than 20 dB at 5 GHz, better than 15 dB at 8 GHz, and better than 8 dB at 18 GHz.
7.4.3
Differential attenuation
Under the conditions stated above, the differential attenuation profile of the AMC Connector together with its connections to the AMC Module PCB and the Carrier board shall be less than 1 dB at 8 GHz, less than 2 dB at 12 GHz, and less than 4 dB at 18 GHz.
7.4.4
Differential pair cross talk
Under the conditions stated above, the differential cross talk amplitude induced at the far end to a differential pair by two driven adjacent differential pairs in the AMC Connector, together with their connections to the AMC Module PCB and the Carrier board, shall be less than 2%. Under the conditions stated above, the differential cross talk amplitude induced at the far end to a differential pair on the Extended Side by an opposite differential pair on the Basic Side in the AMC Connector, together with their connections to the AMC Module PCB and the Carrier board, shall be less than 2%.
7.4.5
Propagation characteristics
The propagation characteristics are measured in transmission lines including traces and contact pads on the AMC Module PCB and the Carrier board. Transmission lines coming from the Basic Side have a shorter propagation time compared to the lines coming from the Extended Side. The time difference between Basic and Extended Side is identical for connectors coming from different sources. This difference can be compensated by adding 30 ps of propagation time in the layout of the traces on the Carrier board for the lines coming from the Basic Side. The propagation delay skew within each differential pair including traces and contact pads on the AMC Module PCB and the Carrier board shall be 2 ps maximum. The propagation delay skew between differential pairs including traces and contact pads on the AMC Module PCB and the Carrier board and belonging to the same side of the Module interface shall be 20 ps maximum. The average propagation delay shall be 30 ps greater on the Extended side of the connector than on the Basic side.
7.5
7.5.1
Mechanical characteristics
Mechanical operation
The AMC Module PCB shall withstand 50 mating cycles with one AMC Connector under the above stated conditions, without damage that would impair normal operation. The AMC Connector shall withstand 250 mating cycles with five AMC Module PCBs in sequence, each of them serving 50 cycles under the above stated conditions, without damage that would impair normal operation.
7.5.2
Engaging and separating forces
Table 7-5 Engaging and separating forces

Mating sides Maximum engaging force Maximum separating force Maximum bottoming force Single-sided Double-sided
100 N 65 N 200 N
100 N 65 N 200 N
7.5.3
Compression connection - remounting operation
Conditions:Use three times the same connector and the same connector location on the same Carrier board After successfully mounting and connecting the AMC Connector, it shall be possible to perform at least three remounting operations without damaging the AMC Carrier board in a way that would impair normal operation.
AMC mating conditions

A.1
Alignment in width direction (parallel to the plane of the Module PCB)
Table A-1 Width dimensions and tolerances

Nominal dimension Tolerance Position tolerance
Guide Rail width (from pitch-line) Guide Rail slot depth Connector slot width Connector centering holes Module PCB width Module PCB interface width Width of non-insulated components Milling symmetry on Module PCB Etching symmetry on Module PCB Pitch on cover plates
Gw Sd Cw Cc Bw Bi CNw Msym Esym P
0,50 1,70 65,15
0,030 0,08 0,05
0,08
0,03 0,03
73,50 65,00 70,10
0,10 0,10 max. 0,03 0.05
75,00
0.08
Figure A-1 Dimensions in width direction
The given dimensions assure that in mated condition there is no constraint in width direction between the Connector and the Guide Rails. As a result, the back end of the Module PCB will be solely supported by the Connector, not by the Guide Rails. The lead-in chamfers of the plug-in aperture of the Connector are designed to correct a maximum misalignment of 1 mm in width direction, taking the chamfers of the Module PCB into account. In worst case conditions the Module PCB keeps an overlap with the Guide Rails of at least 0.7 mm under all insertion/withdrawal and mating circumstances. The space between the Guide Rails permits the use of non-insulated components with a maximum width of 70.10 mm without interference with the Guide Rails. During insertion of the AMC Module the inclination in width direction is limited to 1 by the Guide Rails of the Carrier, in mated and locked condition it is reduced to 020'.
A.2
Alignment in height direction (perpendicular to the plane of the Module PCB)

Module Layer A Nominal Tolerance dimension Module Layer B Nominal Tolerance dimension Gb
Table A-2 Height dimensions and tolerances
Centre of Guide Rail slot/cover plate Guide Rail slot height Module PCB thickness Centre of Connector slot/cover plate Connector slot height
Ga Sh Bt Ca Co
8.68 2.10 1.60 8.68 1.90
00.8 00.8 0.16 00.8 00.8
3.90
00.8
Cb
3.90
00.8
Figure A-2 Dimensions in height direction
The given dimensions assure that in mated condition there is no constraint in height direction between the Connector and the Guide Rails. As a result, the back end of the Module PCB will be solely supported by the Connector, not by the Guide Rails. The lead-in chamfers of the plug-in aperture of the Connector are designed to correct a maximum misalignment of 1 mm in height direction, taking the chamfers of the Module PCB into account.
A.3
Mating depth conditions
The Module Locking Latch mechanism applies a constant force on the Module PCB in engaging direction, to keep it bottomed to the Connector slot, at all times and under all possible operating conditions.
AMC Module Face Plates implementation example

B.1 Purpose
In Section 2 of the AMC Specification some features concerning the Module Face Plate assembly are left open for various design solutions: The shape and manufacturing technology of the Face Plate may be different from the sheet metal construction. The fixation of the Face Plate to the Module PCB is implementation dependent. The location of the LEDs may vary in a small range at the top of the Face Plate. The extraction lever and the locking mechanism may adopt different solutions. The location and choice of the Hot Swap microswitch depends on the choice of the locking mechanism. The purpose of Appendix B is to show different examples of mechanical implementations, including specific board layouts and keepout areas.
B.2
Schroffs implementation
Schroffs example is a AMC Module Face Plate unit, consisting of a U-shaped profile with two die-cast flanges and a rotating locking latch.
Figure B-1 Overview of Schroffs Implementation
B.3
Front of the Face Plate unit

The location of the LEDs The location and front dimensions of the extraction lever The available area for Cable Connector arrangements
Schroffs implementation specifies fixed dimesnions for:
B.4
Fixation to the Module PCB
The following figure shows the specific method of mounting and the layout of the Module PCB with the milled contours, the mounting holes and the keepout areas. Figure B-2 Layout of the mounting features on a Single-Width Module PCB
View on Component Side 2
View on Component Side 1
B.5
Cross section through the Face Plate unit
Schroff's implementation also specifies the space for components inside the faceplate unit, on both sides of the Module PCB. It defines how the return flanges of the Faceplate Unit fit into the cutouts of the Carrier Board and their position versus the Carrier Struts and Card Guides. It clarifies the maximum dimensions of a faceplate cutout for the implementation of Cable Connectors.
B.6
Locking mechanism
Figure B-3 AMC Module in position for normal operation
Module Face Plate
Rotating locking latch
Hot Swap microswitch Carrier strut with catch
Carrier Card Guide
B.7
Locking latch and its catch in the Carrier strut
Figure B-4 Compensation for 1 mm insertion depth tolerance
Three situations in case the Module PCB bottoms in the AMC Connector 0.5 mm before it reaches its nominal position, in its nominal position, and 0.5 mm beyond its nominal position
B.8
Extraction lever
Shape and dimensions of the Knob and the Extraction Lever, including hole for extraction tool. Travel of the Extraction Lever during the unlocking sequence. Actuating forces during the unlocking and extraction sequence. Figure B-5 Dimensions of extraction lever
Under preparation
B.9
Other implementations

AMC Short Spec

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AMC Short Spec

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PICMG AMC.

June 15, 2004

Do Not Specify or Claim Compliance to the Draft Specification

PICMG AMC.0 Short Form Specification Version D0.9a Page 1 of 57

Introduction and objectives

PICMG AMC.0 Short Form Specification Version D0.9a Page 2 of 57

Next generation mezzanine standard

PICMG AMC.0 Short Form Specification Version D0.9a Page 3 of 57

Theory and operation of usage

PICMG AMC.0 Short Form Specification Version D0.9a Page 4 of 57

Figure 1-2 General orientation and insertion of AMC Modules

Single-Width, Full-Height AMC Module

AMC Connector AMC Guide Rails

Figure 1-2 is shown without the Side 1 Component Cover.

PICMG AMC.0 Short Form Specification Version D0.9a Page 5 of 57

Figure 1-3 Single-Width and Double-Width Full-Height Module Configuration

Double-Width, Full-Height Module

Single-Width, Full-Height Modules

Figure 1-3 is shown without the Side 1 Component Cover.

PICMG AMC.0 Short Form Specification Version D0.9a Page 6 of 57

PICMG AMC.0 Short Form Specification Version D0.9a Page 7 of 57

Figure 1-4 Single-Width, Stacked Modules on a Cutaway Carrier

Figure 1-4 is shown without the Side 1 Component Cover.

Style AB Style A+B+

PICMG AMC.0 Short Form Specification Version D0.9a Page 8 of 57

Basic and Extended Connectors

Module Orientation on a Conventional Carrier

Figure 1-7 Half-Height Module orientation in a Conventional Carrier

Module orientation on a Cutaway Carrier

PICMG AMC.0 Short Form Specification Version D0.9a Page 9 of 57

Figure 1-8 Stacked, Half-Height Module orientation in a Cutaway Carrier

Figure 1-9 Single-Layer, Full-Height Module in Cutaway Carrier

Pressures and airflows

Pressures and airflows are in English units

PICMG AMC.0 Short Form Specification Version D0.9a Page 10 of 57

Special word usage

PICMG AMC.0 Short Form Specification Version D0.9a Page 11 of 57

. Table 1-4 AMC Module specific terms

AMC Module or Module

Double-Width Module Full-Height Module Half-Height Module

Module Guide Rail Single-Layer Module

PICMG AMC.0 Short Form Specification Version D0.9a Page 12 of 57

Table 1-4 AMC Module specific terms (Continued)

. Table 1-5 AMC Connector or Interface specific terms

AB/A+B+ Connector AMC Connector or Connector B Layer

Basic Side B/B+ Connector

PICMG AMC.0 Short Form Specification Version D0.9a Page 13 of 57

Single-Width Module PCB dimensions

Figure 2-1 Single-Width Module PCB dimensions

PICMG AMC.0 Short Form Specification Version D0.9a Page 14 of 57

Double-Width Module PCB dimensions

Figure 2-2 Double-Width Module PCB dimensions

PICMG AMC.0 Short Form Specification Version D0.9a Page 15 of 57

Module Connector interface dimensions

Figure 2-3 Module Connector interface dimensions

PICMG AMC.0 Short Form Specification Version D0.9a Page 16 of 57

Figure 2-4 Module edge contact detail

Module component height requirements

PICMG AMC.0 Short Form Specification Version D0.9a Page 17 of 57

Module Face Plate

Module Face Plates fulfill a series of tasks:

Module Face Plate labels

Figure 2-5 Vendor and PICMG label dimensioning and positioning

PICMG AMC.0 Short Form Specification Version D0.9a Page 18 of 57