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2 Embedded Processing & DSP Resource Guide 2012
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C2000, DaVinci, OMAP,TMS320C2000,TMS320C24x,TMS320C28x, C24x, C28x, C5000,
TMS320C5000,TMS320C54x,TMS320C55x, C54x, C55x, DaVinci, C6000,TMS320C6000,
TMS320C62x,TMS320C64x,TMS320C64x+,TMS320C67x, C62x, C64x, C64x+, C67x,
TMS320DM64x, DM64x,TMS320C5x, CodeComposer Studio, DSP/BIOS, eXpressDSP, MicroStar
BGA, NanoFree, NanoStar, OMAP, ProbePoint, RTDX,TMS320, XDAIS, XDS510andXDS560are
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Welcome to the 2012
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microprocessors, TMS320C6000 DSPs and TMS320C5000 ULP DSPs, C2000 real-time control
microcontrollers, MSP430 ultra-low-power microcontrollers, Stellaris
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MSP430' ulIra-low-power microcohIrollers - This brochure Iocuses oh Ihe 16-biI, PSC-based,
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Contents
Wireless Debug Isolation for High-Voltage Motor Control Applications
by Andrew Ferrari, Blackhawk................................................................................................................................................................... 8
Spectrum Digital Emulators for TI Processors
by Spectrum Digital, Inc........................................................................................................................................................................... 10
Spectrum Digital TI Processor Target Platforms
by Spectrum Digital, Inc........................................................................................................................................................................... 11
High-Performance DSP Systems-on-Chips Drive New Applications
by Cheryl Coup....................................................................................................................................................................................... 12
Simplifying Multicore Migration
by Ted Gribb, PolyCore Software Inc. ...................................................................................................................................................... 16
Robot Obeys With The Wave Of A Hand
by John Blyler .......................................................................................................................................................................................... 20
Embedded Processing Overview
Embedded Processors
Texas Instruments
Embedded Processing Overview............................................................................................................................................................. 23
C5000 Ultra-Low-Power DSP Generation, Fixed-Point ......................................................................................................................... 24
DaVinci Digital Media Processors ........................................................................................................................................................ 25
C6-Integra DSP + ARM
Processors .................................................................................................................................................... 27
C2000 Microcontrollers, Fixed-Point and Floating-Point ...................................................................................................................... 28
MSP430 Microcontrollers..................................................................................................................................................................... 29
Sitara ARM
Cortex-A8 and ARM9 Microprocessors ................................................................................................................... 31

Stellaris
32-Bit ARM
Cortex-M MCUs ............................................................................................................................................. 34

TMS320C66x DSP Generation Fixed- and Floating-Point........................................................................................................................ 35
Hercules Safety Microcontrollers......................................................................................................................................................... 36
www.xilinx.com
Copyright 2011. Xilinx, Inc. XILINX, the Xilinx logo, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.
Innovation is not only in our
chips. Its in our DNA.
At Xilinx, we are creators of the innovations that engineers use to
move the world ahead. Pioneers of programmable logic that defines
an industry. Architects of the extensible processing platform and
stacked silicon interconnect that are driving innovation forward,
further, faster. We invent the tools that help engineers bring their
ideas to life. How can we move your world ahead?
Products and Services
Development Tools
Companion Chips
Kionix, Inc.
Kionix KXTI9 Tri-Axis Digital Accelerometer ........................ 37
Xilinx, Inc.
Xilinx Spartan-6 FPGAs ......................................................... 38
Xilinx Virtex-6 FPGAs ............................................................ 39
Daughter Cards
Link Research
Multi-channel Data Acquisition daughtercard for the
F2812/F28335 eZdsp.......................................................... 41
Development Tools
Signum Systems
Signum Systems Emulators for TI DSPs, OMAP and
DaVinci Processors ............................................................ 42
Development Boards / EVMs
Traquair Data Systems, Inc.
micro-line TMS320C641x-based Integer DSP/FPGA
Boards ................................................................................... 43
micro-line TMS320C6713 DSP-based Floating-Point
DSP/FPGA Boards ................................................................. 44
Critical Link
MityDSP System on Module with FPGA based on
OMAP-L138, AM1808, or TMS320C6748 DSP ........... 45
Emulators/Analyzers
Blackhawk
High Performance JTAG Emulators....................................... 46
High Performance JTAG Emulators....................................... 47
USB100v2 Model D Controller.............................................. 48
Wireless XDS510 JTAG Emulator...................................... 49
XDS560v2 System Trace ....................................................... 50
Kane Computing Ltd
Kane Computing Company Profle......................................... 51
Lauterbach Inc.
TRACE32 PowerTools............................................................ 52
SEED International Ltd
SEED-XDS560v2 ................................................................... 53
Signum Systems
JTAGjet In-Circuit Debuggers for DSP, OMAP and
DaVinci Processors ............................................................ 55
Embedded Software
Application-Specifc Libraries
Adaptive Digital Technologies
G.PAK: A Rapid Way to Build Integration-Ready
High Density Turnkey Voice Solutions .................................. 56
Wideband IP Phone Solution - TNETV105x .......................... 57
Network Packet-based Intercom / IP Phone Software
Subsystem (ISS) for OMAP35x, and DaVinci DM814x
Devices.................................................................................. 58
VoIP Engine for Android/ARM Driving Next Gen
Mobile IP Voice Applications................................................ 59
DelCom Systems, Inc.
GSM/EGPRS/EDGE LayerONE Physical Layer Software ...... 60
End-Equipment Solutions
VTI Technologies Oy
CMR3000, 3-axis low power gyro for user interface
applications........................................................................... 61
Z3 Technology
High Performance Multi-Channel 1080p60 HD Module....... 63
Engineering Services
Embedded Processors
Micross Components
DSP & Microcontroller Die and Alternative Packaging........ 64
m o u se r. c o m
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If you ever developed a motor control system or appli-
cation, you probably dealt with isolation protection.
Hopefully isolation was included as part of the design
requirements and not a result of equipment damage, which
typically occurs when you introduce test devices (i.e. PC,
JTAG emulator) into the high voltage environment. If you
are new to motor control, you should know that regardless
of the motor type (AC induction, brushed DC, brushless
DC, stepper, etc.), these systems can use upwards of 350v
and quickly damage your test equipment if not isolated
properly. WiFi can provide isolation, both electrically and
physically.
What is Isolation?
Isolation is a technique of separating two components of a
device electrically and physically. Physical isolation is typ-
ically implemented for safety reasons. Electrical Isolation,
and the primary focus of this article, refers to the elimi-
nation of ground paths between two electrical devices.
In motor control applications, providing electrical isola-
tion can prevent ground loops between the motor control
system power rail(s) and the debug equipment. Ground
loops are the focus of the next section (see figure 1).
Ground Loops
Ground loops are the most common source of noise in a
digital system as well as the most common cause of dam-
aged test equipment. Ground loops occur when two devices
are connected at different ground potentials.
When this happens, the ground potential will cause cur-
rent to flow between the two devices. In audio devices,
such as a sound system for example, you may have heard a
hum coming out of the speakers. In video, this can present
by Andrew Ferrari, Blackhawk
Wireless Debug Isolation for High-
Voltage Motor Control Applications
Figure 1 - Ground Loop
www.eecatalog.com/dsp 9
CONTACT INFORMATION
itself as bars, bands visible at different brightness. In an
electrical environment this can occur by simply by having
two devices plugged into a different wall outlet and
attached via cable.
In a typical motor control application, motors will be
powered by 220 VAC and operate between 350 and 400
VDC. This [high] voltage bus can also reside on the nega-
tive power rail, so preventing ground loops and a path to
earth ground is extremely important. A ground loop in
this environment will trigger unwanted voltage to flow
to and through connected test equipment (computer,
emulator, scope, meter, etc.). The act of attaching this test
equipment is usually the culprit in providing the path to
earth ground and the reason why damage occurs to your
emulator and computer.
Isolation Solution Comparisons
There are various isolation options, including galvanic
implementations (optical, magnetic, capacitive, etc.).
For optical, it is well established and cost effective but
lacks high-speed performance, is power hungry and will
degrade over time.
There is wide acceptance in the industry for magnetic
(inductive) solutions and they use lower power compared
to optical, however they have low tolerance for electro-
magnetic noise and offer no electro-static discharge (ESD)
protection.
Capacitive solutions have low voltage requirements and
are not susceptible to noise but they do not offer protec-
tion in high power applications.
No single approach suits all applications as each solution
offers pros and cons. One way or another, you need to
make a trade off in performance, power, or cost.
Wireless Debug Solution
A wireless Ethernet implementation (IEEE 802.11) can
reduce or eliminate isolation trade-offs. By separating
the physical connection of the debug station (i.e. PC) from
the emulator, you can maintain performance and remove
ground loops in harsh environments (see figure 2). This
is based on the fact that the emulator resides in the same
power domain as the motor control application hardware
and motors.
Wireless Ethernet, with the various interface speeds, is
a proven transport under noisy conditions. It does not
sacrifice performance and it will allow the developer to
be positioned at a safe distance. Please see the Blackhawk
USB510W data sheet in this guide for more information.
Figure 2 - Wireless Setup
Blackhawk
123 Gaither Drive
Mt. Laurel, NJ 08054
USA
856-234-2629 Telephone
856-866-1100 Fax
info@blackhawk-dsp.com
http://www.blackhawk-dsp.com
Blackhawk
123 Gaither Drive
USA
856-866-1100 Fax
Spectrum Digital, Inc.
12502 Exchange Drive, Suite 440
Stafford, TX. 77477 USA
Tel: 281.494.4500 x-113
Fax: 281.494.5310
www.spectrumdigital.com
sales@spectrumdigital.com

Spectrum Digital Emulators for TI Processors

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Part Number 701041 701121 702302 701902 701014 701900 701910 701905 702592 702598
Price in USD $ 1299 $ 2499 $ 89 $ 249 $ 495 $989 $ 1995 $1199 $ 1495 $ 1199
PC Interface
Parallel
Port
Parallel
Port
USB USB
Parallel
Port
USB USB USB
USB,
Ethernet
USB
Powered by PS PS USB USB PS/Target USB USB USB PS USB
TMS320C30-32 Yes Yes
TMS320VC33 Yes Yes Yes
TMS320C4x Yes
TMS320C5x Yes
TMS320F24x/F240x Yes Yes Yes Yes Yes
TMS320F28xx Yes Yes Yes Yes Yes Yes Yes Yes
TMS320C54x
TM
Yes Yes Yes Yes Yes Yes Yes
TMS320C55xx
TM
TMS320C64xx/C64x+ C64x+ Yes Yes Yes Yes Yes Yes
TMS320C64+ Yes Yes Yes Yes Yes Yes Yes
TMS470 ARM7 Yes Yes Yes Yes Yes Yes
TMS470 ARM9/11 ARM 9 Yes Yes Yes Yes Yes Yes
ARM Cortex Yes Yes Yes Yes Yes Yes Yes
OMAP
TM
DaVinci
TM
Yes Yes * Yes * Yes * Yes * Yes Yes
Sitara
TM
C6-Integra
TM
+3.3V to +5V Yes Yes Yes Yes Yes Yes Yes Yes Yes
+1.8V to +3.3V Yes Yes Yes Yes
Supports CCS v4.x Yes Yes Yes Yes Yes v4.2+ v4.2+
SDFlash Support Yes Yes Yes Yes Yes
XMLGUI Support Yes Yes Yes Yes Yes
Boundary Scan Spt Yes
Emulator Accessories Part Number Price
TI14 Pin Low Voltage Adapter for JTAG Emulators (LVA) 701208 $ 99
TI14-TI14 Pin LVA with Adapti ve clock for OMAPP
TM
/DaVinci
TM
701210 $ 149
TI14-CTI20 Pin LVA with Adaptive clock for OMAP
TM
/DaVinci
TM
701212
$ 149
CTI20(in)-TI14(out) 701218 $ 69
TI14(in)-CTI20(out) 701219 $ 69
CTI20(in)-TI60(out) 701220 $ 74
CTI20(in)-ARM20(out) 701222 $ 69
TI14(in)-ARM20(out) 701280
$ 69
XDS560v2 STM adapter kit, MIPI60 to TI14, CTI20, ARM20, TI60 701238 $ 299
4 Channel JTAG Expander for JTAG Emulators 701204 $ 995
SPI110LV Optically Isolated Adapter for JTAG Emulators 701240 $ 1500
Copyright Spectrum Digital 2011, 09/15/2011
Copyright Spectrum Digital 2011, 09/15/2011
Prices shown here are in US dollars and valid for sales
in the United States only. Foreign sales must be made
through an agent or authorized reseller and prices may
be different. All prices are your dock and are subject to
change. Please contact Spectrum Digital for latest
pricing and availability prior to ordering.
OMAP-L137
Spectrum Digital TI Processor Target Platforms
Spectrum Digital, Inc.
Stafford, TX. 77477 USA
Tel: 281.494.4500 x-113
Fax: 281.494.5310
sales@spectrumdigital.com
support.spectrumdigital.com
Processor Family Target Module Scan/Interface Part Number Price
TMS320C3x
D.Module.C31eco (OEM) MPSD Call Call
TMS320VC33 eZdsp
TM
VC33 PP/J TAG 701385 $ 519
D.Module.VC33 J TAG Call Call
TMS320F24x
TM
eZdsp
TM
LF2401A PP/J TAG 761120A $ 515
eZdsp
TM
LF2407A PP/J TAG 761119 $ 319
TMS320F28xx
TM
eZdsp
TM
F2808 USB/J TAG 761131 $ 249
eZdsp
TM
F2808/socket USB/J TAG 761132 $ 469
eZdsp
TM
F2812 PP/J TAG 761128 $ 325
eZdsp
TM
F2812/socket PP/J TAG 761129 $ 469
eZdsp
TM
R2812 USB/J TAG 761130 $ 469
eZdsp
TM
F28335 USB/J TAG 761136 $ 325
eZdsp
TM
F28335/socket USB/J TAG 761135 $ 515
TMS320VC54x
TM
DSK VC5416 USB/J TAG 701840 $ 415
TMS320VC55x
TM
EVM320VC5502 J TAG 701860 $ 995
EVM320VC5505 USB/J TAG 701883 $ 474
DSK VC5509A USB/J TAG 701882 $ 515
DSK VC5510 USB/J TAG 701880 $ 415
C5515 eZdsp
TM
USB Stick USB 702359 $ 89
EVM320C5515 USB/J TAG 702260 $ 415
TMS320C6000
TM
D.Module.C6201 (OEM) J TAG Call Call
D.Module.C6203 J TAG Call Call
D.Module.C6701 (OEM) J TAG Call Call
DSK C6713 USB/J TAG 701895 $ 415
TMS320C64x
TM
DSK C6416T, 1Ghz. USB/J TAG 701891 $ 515
EVM DM642, 720 Mhz. J TAG 702002 $ 1995
D.Module2.DM642 J TAG Call Call
TMS320C64x+ EVM C6424 USB/J TAG 702070 $ 515
EVM DM6455 USB/J TAG 701898 $ 1495
EVM DM6474 USB/J TAG 702090 $ 1995
OMAPP
TM
OMAP-L137 EVM J TAG 702210 $ 415
DaVinci
TM
DaVinci DM6437 DVEVM J TAG 702075 $ 515
DaVinci DM6446 J TAG 702040 $ 1249
DaVinci DM6467 J TAG 702085 $ 2295
DaVinci DM357 J TAG 702067 $ 895
DaVinci DM368 DVEVM J TAG 702231/2 Call
TMS470 ARM eZ470R1A256 USB/J TAG 761470 $ 349
Sitara
TM
EVM AM1810 Call !
C6-Integra
TM
/ C6A816x EVM C6A816x DDR3 Call !
EECatalog
SPECIAL FEATURE
While the role of general-purpose DSPs may be declining,
DSP cores are showing up in more applications than ever in
systems-on-chips (SoCs) and multicore devices. In a report
published last year, researchers at Electronics. CA Publications
expected DSP revenue to grow by 12 to 13 percent annually
through 2011, with most revenue from the communications
market but with the fastest growth coming in the consumer
electronics market. Todays high-performance devices present
new opportunities for applications from smartphones to med-
ical and beyond as well as new design challenges. Richard
White, managing director of Kane Computing Ltd (KCL) and
Tom Hill, senior marketing manager for DSP at Xilinx, discuss
some of these trends in our virtual roundtable.
EE Catalog: As applications
become more specialized, what
roles do general-purpose DSPs
play?
Richard
White, Kane
Computing:
General-
purpose DSPs
continue to play
a role in signal applications
where cost and volume are not
the prime requirements. Over
a number of years, developers
have become familiar with the
development tools and envi-
ronments and can thus modify
or create new products easily
and quickly using general-purpose DSPs.
Tom Hill, Xilinx: Te overall industry trend
has been to oer fewer standalone DSPs but
rather to oer devices that combine DSP cores
with CPUs and dedicated hardware accelerators
in the form of an ASSP. General-purpose DSPs
are more ecient than CPUs while using a soft-
ware design methodology. Tey are well-suited for a variety
of complex signal or video-processing applications that do
not require the additional performance that can be achieved
through custom hardware. FPGAs are often used as co-pro-
cessors to DSPs to provide custom interfaces or to accelerate
processing for a certain class of applications.
EE Catalog: How is the advent of sensor technology aecting
the role of DSPs?
White, Kane Computing: Sensor technology is developing
fast to make interfaces and transfer of data to related proces-
sors easier and in some cases are becoming small enough to be
integrated into the processing chip to help create the newer
SoC products.
Hill, Xilinx: Analog interfaces continue to advance in terms
of system performance and bandwidth. Wireless and defense
applications often use very high sampling rates to improve
the signal-to-noise ratios and improve the performance of
their systems, while applications such as medical use large
arrays of sensors to construct
accurate medical images. Both
these trends drive the use
of FPGAs to implement the
high performance and high
bandwidth analog interfaces
combined with digital ltering
to perform up/down conver-
sion, anti-aliasing and pulse
shaping.
EE Catalog: What major
challenges are developers con-
fronting with todays DSP and
ARM core systems-on-chips?
White, Kane Computing: Te
major challenge today using mul-
ticore DSP/ARM processor-based
systems is to nd engineers/programmers who are familiar with
and understand both ARM and DSP technology and programming
to enable them to make the best use of both types of processor.
Hill, Xilinx: Tere are two main challenges aecting these
developers performance and ease of use. ARM and DSP
processors are highly constrained in cost, size and power. You
cannot scale the performance of the processor to match your
application requirements, but must instead scale your applica-
tion to match your processor performance. ASSPs address this
issue by including highly specialized accelerator blocks that can
be called from the host processors, but this specialization may
not be right for your application. FPGAs can be used as a copro-
cessor to scale the performance and extend the use of the ARM
processor or DSP for high-performance applications not served
by these specialized ASSPs.
by Cheryl Coup
High-Performance DSP Systems-
on-Chips Drive New Applications
You cannot scale the
performance of the
processor to match your
application requirements,
but must instead scale
your application to
match your processor
performance.
EECatalog
SPECIAL FEATURE
EE Catalog: What are some of the most exciting new trends in
tools for DSP-based designs?
White, Kane Computing: Eclipse-based integrated development
environments with optimising C/C++ compilers, source and
assembly-level debuggers are helping developers to develop with
the more complicated processing chips. Also, the ability of emu-
lators and development software tools to support, for example,
MIPI System Trace and Linux host systems, is helping developers
to work more easily with the latest high-performance processors.
Hill, Xilinx: Te most exciting trend is the emergence of viable
high-level design ows capable of targeting both hardware and
software from a common modeling language such as C/C++/
SystemC or MATLAB and Simulink. BDTI in 2009 published
an analysis of the viability of several high-level design tools for
targeting Xilinx FPGAs with promising results. As DSP and video
applications continue to migrate towards hardware platforms
that combine processors with FPGAs, these high-level design
ows will enable the same developer to partition an algorithm
between software running on the processor and accelerator
blocks running on programmable logic such as a Xilinx FPGA.
EE Catalog: What new DSP market opportunities are you
most excited about?
White, Kane Computing: Te most exciting technology
innovations that will help create low-cost, high-performance
computation platforms for medical and nancial needs is the
development of multicore processors.
Hill, Xilinx: While Xilinx FPGAs continue to be used extensively
in performance-hungry DSP and video applications including
wireless, A&D and medical, embedded vision is an area Xilinx
sees as a great opportunity for growth. Applications that extract
meaning from a real-time video source require high levels of
performance and vary signicantly algorithmically from one
application to the next, making them well-suited for custom video
accelerators implemented on a programmable device such as a
Xilinx FGPA and the new Zynq Extensible Processing Platform.
With the move to 28nm, Xilinx devices improve in cost, power
and performance and design methodologies expand to address
the needs of software developers, Xilinx expect to address a host
of new applications in consumer, industrial and medical markets.
Cheryl Berglund Coup is editor of EECatalog.com. Her
articles have appeared in EE Times, Electronic Business,
Microsoft Embedded Review and Windows Developers
Journal and she has developed presentations for the Em-
bedded Systems Conference and ICSPAT. She has held a
variety of production, technical marketing and writing
positions within technology companies and agencies in the Northwest.
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EECatalog
SPECIAL FEATURE
Moving to Multicore
Multi-chip, multi-processing, multi-execution path tech-
nologies have been available for decades and have been used
to solve complex problems and improve performance. Since
single-core technology could address the vast majority of
compute needs with constantly increasing performance,
the tools and buzz was centered on single-core processors.
The computer world is changing as should be the case. Three
factors continue to be the key drivers:
1. Power: Increasing the MHz for a single core is approaching
the physical limits. Whether the product is battery-operated
or tethered by a power cord, developers are seeking to
improve the performance/watt ratio.
2. Performance: Application features and functionality will
continue to expand, which fuels increasing compute perfor-
mance.
3. Consolidation: Te progression of more capabilities on a
single chip. Applications currently running on multiple pro-
cessors will move to multicore, and applications currently
running on multicore will move to denser multicore chips.
The programming model chosen for multicore applications
must have the flexibility to address all three factors. While
addressing power has been the focus of many single-core
applications moving to multicore, the discussion presented
addresses the latter two factors consolidation and perfor-
mance.
The broad range of platform technologies offers the system
designer choices for the platform that would best fit the
applications requirements. A sample of the hardware
options include homogeneous and heterogeneous multi-
core processors, processors with accelerator integration as
well as processors with optimized mechanisms for inter-
processor (IPC)/core communications (transports). The
software paradigms executing on multicore processors
also have variants like symmetric multiprocessing(SMP),
asymmetric multiprocessing(AMP), CPU affinity and virtu-
alization, plus the combinations and permutations of the
models indicated.
Programming Model
The programming model used in any multicore software
paradigm needs to be consistent, have the flexibility to
scale and enable optimizations across various hardware
and software multicore and multi-processor platforms
which are available today and are being planned.
The Multicore Association (MCA) (see http://www.multi-
core-association.org) communications API (MCAPI) (see
http://www.multicore-association.org/workgroup/mcapi.
php) and TI DSPs are used to demonstrate a programming
model for applications consolidating to denser processors
and then looking for better ways to execute the applica-
tion in a multicore environment.
MCAPI has a concept called node which is defined as a
logical abstraction that can be mapped to many entities
such as process, thread, hardware accelerator or a pro-
cessor core. For this example, a node will be the entire
application that executes on a single DSP.
The application is encapsulated with MCAPI calls and we
assume that the IPC transports are available.
Now that our application is set up for MCAPI as encapsu-
lated modules, the first pass on testing could be performed
using any of the following environments:
1. Windows provided that non-Windows calls are handled
such as an OS simulator on Windows
2. Hardware simulator where communications links are simu-
lated
3. Existing single-core hardware
4. Multicore hardware
Initial testing on target hardware could be challenging
because of the number of variables introduced and this
subject better handled by the debug experts. A simulated
by Ted Gribb, PolyCore Software Inc.
Simplifying Multicore Migration
EECatalog
SPECIAL FEATURE
environment provides more control. However, eventually,
the application will be moved to the target platform.
Applying the Programming Model
Lets look at moving a single multi-processor application to a
multicore processor using Texas Instruments (TI) DSPs such
as the TMS320C6474 and then the TMS320C6678 DSP.
The existing application runs on six single DSP proces-
sors. The source code for each DSP is encapsulated using
MCAPI calls, resulting in the code for each DSP becoming
a MCAPI node. By using Poly-Platforms graphical menus
and wizards, the encapsulation is performed quickly and
completely through code insertion and code generation.
The MCAPI enabled application communicates with other
DSPs in the architecture which may be a single core DSP
and/or a multicore C6474. That is, the same application
source code as node(s) may be run as:
1. A single-core DSP communicating to other single-core DSPs
2. A multicore DSP communicating to cores on the same chip
3. A single-core DSP communicating to cores on a multicore
DSP processor
4. A multicore DSP communicating to local cores or DSPs on a
dierent multicore processor
EECatalog
SPECIAL FEATURE
By extension, moving to denser processors, that is, more
cores on a chip, the MCAPI-enabled application source
code can move without source code change.
In the previous example, note that the application had six
nodes that map one-to-one in a dual C6474 configuration.
When moving to the C6678, which has eight cores, the
designer/architect has two extra cores. The additional two
cores could be used as backup or to expand functionality
or to improve the overall system performance. For this
system, the two cores will be used to improve performance.
Optimizing the Application for Multicore
The MCAPI-enabled application nodes provide flexibility in
deploying the nodes throughout the system. Nodes can be
grouped onto cores for systems with a memory-protected
operating environment and/or replicated to improve
systems performance. By grouping the nodes, the system
architect may be able to balance the operational load by
having nodes with lesser resource needs share a resource.
Should a node need substantially more resources, the node
could be assigned to a resource and replicated, which would
allow more data sets to be processed in parallel.
To quickly try alternate node mappings to cores, the
designer could use Poly-Platforms graphical user interface
to reconfigure the topology, build and run the new topology
using the same application source code. The communica-
tions infrastructure is quickly re-modeled and code is
generated for the new topology.
The following diagram shows an application with four
nodes that are mapped to three configurations. In the top
configuration, all nodes operate on a single core. In the dual-
core architecture, the nodes have different allocations. The
middle mapping shows an optimized configuration where
the resource load for the first two nodes is approximately
the same as the latter two nodes. Should the architect find
that the nodes have very different resource loads, the lower
configuration may be the best fit for the application. It is
important to note that the nodes are redeployed using the
same application source code.
Returning to the application running on TI DSPs, the
additional two cores could be used by node(s) that are more
resource intensive. Suppose that N2 is substantially more
resource intensive. Then, the architect may replicate N2
and deploy N2 on the seventh and eighth DSP, which should
yield an improved system performance. The new configura-
tion is seen in the following diagram.
EECatalog
SPECIAL FEATURE
Alternatively, the additional core could be used to improve
a single nodes performance. As the developer learns more
about the applications behavior, a resource-intensive seg-
ment of a node may be identified. The resource-intensive
segment may be separated from the original node, encap-
sulate as described earlier and made into a new node. This
new node could be move to the additional core(s) where an
improvement in performance could be realized.
Te approach of moving the application to a multicore platform
and then identifying areas for performance improvements
could be called divide and conquer a common approach to
engineering problems. With the divide-and-conquer approach,
moving to multicore becomes manageable because the devel-
opers understand the application partitioning. Debugging and
further optimizations are more readily managed too.
Programming Model for Today and for
the Next Generation
Multicore platforms are being used and we know more
applications will be moving to multicore platforms. Most
applications have been written as serial tasks or processes
which should be well-defined execution blocks. Architects
can employ the programming model with MCAPI described
in this paper to move their application to multicore plat-
forms with minimal effort.
Also, the MCAPI-enabled application has the benefit to
quickly move to the next-generation multicore platform.
For this discussion, the nodes were deployed to homoge-
neous cores. The programming model readily extends to
heterogeneous cores, processor platforms and operating
system. Thus, a node could be allocated to a core that would
better fit the nodes workload. As an example, an application
could have nodes running on a server platform communi-
cating with nodes running on embedded processors.
Economic benets for the manufacturer are that the same
application source code could be used across a product line
where the underlying platform diers by compute power. An
entry level product could have a single or fewer cores plat-
form. A mid-range product could have more compute power.
Te high-end product could have a heterogeneous platform.
Regardless of the products underlying platform, the same
application source would be used.
By adopting the programming model based on the MCA stan-
dards, the developer is able to start using multicore platforms
today. As more is learned about the applications operation, the
application can be modied to operate as multiple nodes with
a result of improved performance and improved scalability
for more core platforms and next-generation platforms. Te
programming model works for todays platform and prepares
the application for tomorrows platforms.
Ted Gribb is PolyCore Softwares vice president
of sales. Prior to joining PolyCore Software,
Gribb had sales management positions for
Wind River, Diab Data and Mentor Graphics.
Previously, he held management positions in
software engineering. Gribb received a Bach-
elor of Science degree in mathematics from DeSales University.
EECatalog
SPECIAL FEATURE
Both the sensor and wireless market continue to be strong
growth areas in the electronics industry, especially the mobile
segment. Tis growth is attributed in large measure to the
cost-eective availability of sensors based on microelectrome-
chanical systems (MEMS) and RF components.
Sensors and wireless technology always have been important
subsystems in the design of most mobile electronics. Today,
however, these technologies have become so pervasive as to
dene what is meant by a system.
Mobile electronicsfrom smartphones and tablets to smart
robotsare no longer distinguished by their processors or
RTOSes, but by the type of sensors and wireless features that
they support.
To get a sense of the changes taking way, consider the Segway.
When rst introduced, the Segway was a marvel of balance
and control. Digital signal processors, microcontrollers, sen-
sors and motors keep the personal transport upright during
motion. Gyroscopes and level-detecting sensorsmainly
accelerometersdetect shifts in passenger weight to both
control the speed and direction of the Segway.
Tanks to the area, power and
performance scaling achieved
by the semiconductor industry,
todays Segway has found many
new applications. Te smaller size
of high-performance and ultra-
low-power electronics and motors
has made Segway technology
ideal for the robotics industry.
So aordable have these con-
stituent subsystems become that
Segway-like robots are being
used in engineering course at
institutions like the University of
Illinois. Te Segbot is part of several inverted pendulum proj-
ects in the U of I Control Systems Labs. Like their big brothers,
these miniature robots use MEMS-based accelerometers and
rate gyroscopes to determine and maintain balance of the
device. Te sensors give the robot its amazing stability. As
with it big brethren, the Segbot relies on TI DSPs embedded
in a microcontroller to perform the necessary the necessary
positioning and balancing algorithms.
Te basic design of these
robotic systems is not new;
nor is the use of sensors to
control the motion or posi-
tion of the robots. What
are new are the tiny sizes,
ultra-low power and fast per-
formance of todays sensors
and associated signal condi-
tioning components.
Aside from new technology
in the control system, there
other new features that have
become synonymous with
mobile systems is the wireless connection. For example, the
Segbot is remotely controlled by a wireless watch namely,
the Texas Instruments eZ430-Chronos Watch Development
Tool. Te watch is basically a motion-sensitive microcontroller
development platform that uses a USB interface for coding and
debugging of the embedded target system. Once programmed,
a user moves his/her watch arm in various positions to con-
trol the Segbot. (Youtube video: Segbot controlled with TIs
Chronos watch at ESC2011)
Gesturing is a growing type of user interface, especially in
the consumer market. Many applications are being developed
for gesture-based interfaces that rely on camera and video
systems (See Qualcomm Recognizes Importance of Gesture
IP ). Tese applications, like the U of I Segbot, require high-
performance DSPs to process sensor and video stream data.
Unlike camera-based system, the Segbot requires only arm
motions to wirelessly control motions on the target platform.
Te user can literally control the direction of the robot with a
wave of their arm.
Yesterdays vernacular of hardware and software has given way
to a more functionally-based discussion. Systems designers
should take note that it will be dicult to develop future
electronics devices that dont contain an array of sensors and
wireless interfaces.
John Blyler can be reached at:
jblyler@extensionmedia.com
by John Blyler
Robot Obeys With The
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C6-Integra
DSP+ARM
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C6000
Digital Signal
Processors
C5000
Digital Signal
Processors
C2000
Micro-
controllers
MSP430
Micro-
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Sitara
Micro-
processors
Stellaris
32-Bit ARM
Cortex-M MCUs
Hercules
Safety Micro-
controllers
Audio
Automotive
Communications
Industrial
Medical
Security
Video
Wireless
Key Feature Complete
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Embedded Processing Overview
Texas Instruments has the broadest portfolio of scalable DSP, MCU, differentiated ARM
and complementary analog products, offering

complete system solutions for electronics manufacturers. This portfolio offers the full range of power/performance requirements ensuring
the right combination of attributes for the smallest portable devices to the largest multichannel systems and everything in between. In
addition, TI offers design resources including extensive software (including open source), tools, technical training, in-person and online
tech support, and engineer-to-engineer forums at e2e.ti.com. Visit www.ti.com for technical literature, system block diagrams and more.
Applications Matrix Guideline
DaVinci Digital Media Processors:
Optimized for Digital Video
DaVinci technology consists of scalable,
programmable signal processing system on
chips (SoCs), accelerators and peripherals,
optimized to match the price, performance and
feature requirements for a broad spectrum of
video end equipments.
C6-Integra DSP+ARM Processor Platform
The C6-Integra product platform includes
high performance, cost efficient processors
comprised of the high performing C6A816x
devices with a floating- and fixed-point DSP
processor with speeds up to 1.5GHz along with
an ARM Cortex-A8 processor with speeds up
to 1.5GHz, integrated high-bandwidth peripherals,
3D graphics and display engines. This product
platform also includes OMAP-L1x application
processors based on DSP + ARM9 devices which
offer secure boot and multi-level encryption.
High Performance: TMS320C6000
DSP Platform
The C6000 DSP platform offers the industrys
highest-performance single- and multicore
DSPs, ideal for networking, telecommunication,
video, imaging, infrastructure, test and equipment,
military, and industrial applications. The platform
includes C64 high-performance DSPs, C67x
floating-point DSPs, C674x fixed-/floating-point
DSPs and C66x fixed-/floating-point multicore
DSPs.
Ultra-Low-Power TMS320C5000
DSP Platform
The C5000 DSP platform provides a broad
portfolio of the industrys lowest power (lowest
total active core power at less than 0.15 mW/MHz
at 1.05V and standby power at less than 0.15
mW)16-bit DSPs with performance up to 300MHz
(600 MIPs) extending overall battery life.
High peripheral integration and large on-chip
memory helps reduce overall system cost. Ultra
low cost development boards, system develop-
ment kits, free and highly mature software librar-
ies with an extensive database of code examples
enables fast time to market. With these advantag-
es, the C5000 has become a very popular choice
for a variety of low-power and cost-efficient
embedded signal processing solutions, including
portable devices in audio, voice, communications,
medical, security and industrial applications.
C2000 32-Bit Microcontroller for
Real-Time Control
The C2000 microcontroller family
combines advanced control peripherals with the
processing power of a 32-bit core. With the low-
cost, high-integration Piccolo MCUs, the power-
ful Delfino floating-point MCUs and the connec-
tivity and control featured in the Concerto
MCUs, C2000 MCUs offer a broad range of options
and are ideal for embedded industrial control and
green energy applications such as digital motor
control, digital power supplies, solar and wind
energy, LED lighting, and automotive HEV/EV.
MSP430 Ultra-Low-Power Microcontroller
Platform
The MSP430 family of ultra-low-power
16-bit RISC mixed-signal processors provides
the ultimate solution for battery-powered
measurement applications. Using leadership
in both mixed-signal and digital technologies,
TI has created the MSP430 MCU, enabling system
designers to simultaneously interface to analog
signals, sensors and digital components while
maintaining unmatched low power.
Sitara ARM
Microprocessors
The high-performance Sitara ARM-based micro-
processors include solutions based on the ARM
Cortex-A8 and ARM9. The platform includes the
AM1x, AM35x, AM37x, AM387x and AM389x
MPUs, which offer a software-compatible roadmap
for customers using TIs OMAP35x and OMAP-L1x
processors. These solutions are also scalable
with the C6-Integra DSP+ARM solutions and
DaVinci Digital Media Processors.
Stellaris
32-Bit ARM Cortex-M MCUs

Stellaris 32-bit MCUs combine advanced
connectivity options with the general-purpose
processing performance of the industry-standard
ARM Cortex-M core for cost-conscious
applications.
Hercules Safety Microcontrollers
Hercules safety microcontrollers are based on TIs
20+ years of safety-critical system expertise,
industry collaboration and proven hardware for the
automotive market. The platform consists of three
ARM
Cortex-based microcontroller families

(RM48x, TMS570 and TMS470M) that deliver
scalable performance, connectivity, memory and
safety features. Unlike many microcontrollers that
rely heavily on software for safety capabilities,
Hercules microcontrollers implement safety in
hardware to maximize performance and reduce
software overhead.
Software and Development Tools
TMS320 DSPs are supported by eXpressDSP
software and development tools, including Code
Composer Studio IDE, DSP/BIOS kernel, the
TMS320 DSP algorithm standard and numerous
reusable, modular software from the largest
developer network in the industry.
Complementary Analog Products
TI offers a range of complementary data
converter, power management, amplifiers,
interface and logic products to complete
your design.
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Specifications
TI has extended its popular TMS320C5000
ultra-low power platform to provide a broader
portfolio of the industrys most power-efficient
DSPs with total active core power at less than
0.15 mW/MHz at 1.05V and standby power at
less than 0.15 mW and performance up to
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Extremely low power consumption and more
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Higher integration with large on-chip memory
and a variety of peripheral offerings on a
smaller form factor
Software compatible with all C5000 DSPs
Easy-to-use development tools and more
value-added third-party solutions speed
time to market
Applications
Feature-rich, miniaturized personal and portable
products; 2G, 2.5G and 3G cell phones and
basestations; digital audio players; digital still
cameras; electronic books, voice recognition,
GPS receivers; fingerprint / pattern recognition;
wireless modems; headsets; biometrics; audio
and voice applications (headset, speakers, smart
phone audio accessories and voice recorders).
TMS320C5504/C5505 DSPs
Best-in-Class Standby and Dynamic Power
As low as 15 mW active power
10-mm 10-mm small form factor
Four pin-to-pin compatible devices with
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Richest feature sets as shown in the
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TMS320C551x DSPs
High Performance with Low Power
100% code-compatible with C55x devices
Broad portfolio of the industrys most power-
efficient 16-bit DSPs with standby power as
low as 0.15 mW/MHz and performance up to
600 MIPS
Lowest industry standby power greatly extends
battery life
Secure boot encryption enables protection of
intellectual property and sensitive data
TMS320C553x DSPs
Lowest Power with the Lowest Cost
Four devices- C5532, C5533, C5534 and
C5535, each with 50 MHz and 100 MHz
performance
Industrys lowest total power DSP with total
active core power at less than 0.15 mW/MHz
at 1.05V and standby power at less than 0.15
mW upto 6 times lower power consumption
than the nearest competition
0.8mm BGA package allows use of four-layer
printed circuit board (PCB) to reduce overall
system cost
Integrated high-speed peripherals: USB 2.0
with PHY, SD/eMMC, I2S, UART, SPI, GPIO
On-chip memory options ranging from
64 KB to 320 KB for scalability according
to application needs
C5000 Ultra-Low-Power DSP Generation, Fixed-Point
Industrys lowest power and lowest cost DSPs
Get samples, data sheets, tools and app reports at: www.ti.com/cheapdsp
TMS320C553x DSP Block Diagram
The C553x ultra-low-power DSP generation featuring the lowest power and lowest cost DSP in the
industry, starting at $1.95/1ku, offers the industrys lowest power with active power less than 0.15
mW/MHz at 1.05V and standby power less than 0.15 mW. These highly integrated processors
enable developers to get DSP sophistication at a microcontroller price and power consumption.
C5000 DSP Platform Roadmap
The C5000 DSPs span the applications spectrum with core performance extended to 300 MHz.
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Targeted Applications
Automotive infotainment
Automotive video sensing
Automotive vision
Broadcast systems
Cable head-end video equipment
(routers)
Digital camcorders
Digital still cameras
Digital media adapters
Digital photo frames
Digital signage
Digital TV and server head-ends
Digital video recorders
IP network cameras
IP-based video-conferencing
endpoints
IP-based video phones
IP set-top boxes
Hard-copy appliances
Machine vision
Media encoder/decoder appliances
Media gateways
Medical imaging
Network projectors
Personal video recorders
Portable media players
Professional-grade video broadcast
equipment
Robotics
Security recording systems
Streaming video appliances
Video broadcast transcoding
Video-conferencing, multipoint
conference units (MCUs)/gateways
Video infrastructure
Video jukeboxes
Digital video security recorders
(DVRs)
Video surveillance cameras
Webpads
Wireless cameras
DaVinci Digital Media Processors
Industrys lowest power and lowest cost DSPs
Get samples, data sheets, tools and app reports at: www.ti.com/davinci
DaVinci Digital Media Processors Roadmap
Digital video customers benefit from TIs DaVinci SoC processor portfolio of digital media processors,
development tools, software and support, enabling them to accelerate development and fuel innovation.
DaVinci Technology
TMS320DM816x SoC Block Diagram
The high-performance DM8168 DaVinci digital media proces-
sor offers 3x the video streaming capability over competing
solutions enabling customers to build video-centric systems
that capture, encode, decode and analyze multiple video
streams simultaneously on up to three independent displays.
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Optimized for digital video systems,
DaVinci digital media processor
solutions are tailored for digital audio,
video, imaging, and vision applications.
The DaVinci platform includes a general
purpose processor, video accelerators, an
optional DSP, and related peripherals. With
over 200+ devices, offerings include a
wide range of performance, power and
price points. Optimized for video encode
and decode applications, the scalable
DaVinci platform of solutions also includes
free multimedia codecs and easy-to-use
development tools and software.
DaVinci Processors Reduce
System Cost
The DaVinci digital media processor port-
folio consists of scalable, programmable
signal processing system-on-chips (SoCs),
accelerators and peripherals, optimized to
match the price, performance and feature
requirement for a broad spectrum of video
end equipments. The DaVinci digital media
portfolio includes:
TMS320DM816x digital media
processors The high-performance
DM8168 DaVinci digital media proces-
sor offers three times the video stream-
ing capability over competing solutions
with up to three simultaneous 1080p60
frames per second (fps) video streams,
12 simultaneous 720p30 fps video
streams or a combination of lower
resolution streams. This enables
customers to build video-centric
systems that capture, encode, decode
and analyze multiple video streams
simultaneously on up to three indepen-
dent displays. It also concurrently allows
customers to differentiate their products
with advanced analytics capabilities.
processors The lower-power
DM8148 DaVinci digital media proces-
sor offers a single, high-performance,
1080p60 fps video stream, three simul-
taneous 720p30 fps video streams or
multiple lower resolution streams at
3 watts. It also includes cutting-edge
display and analytics capabilities,
similar to the DM8168 DaVinci digital
media processor, and its perfect for
power-sensitive, consumer and medical
video applications requiring fewer video
streams.
processors DSP-based SoCs specifi-
cally tuned for real-time, multiformat,
HD video transcoding at 10x the
performance and 1/10th the price.
The DM6467 consists of an integrated
ARM926EJ-S core, TMS320C64x+
DSP core, high-definition video/imaging
coprocessors (HD-VICP), video data
conversion engine and targeted video
port interfaces. The DM6467 processor
is specifically designed to address the
HD transcoding challenge for
commercial and consumer markets,
such as media gateways, multipoint
control units, digital media adapters,
digital video servers and recorders for
the security market and IP set-top
boxes (STBs).
processors Highly integrated SoCs
based on an ARM926 processor
and the C64x+ DSP core. The
TMS320DM6446, TMS320DM6443
and TMS320DM6441 processors
are ideal for applications and end
equipments such as video phones,
automotive infotainment and IP STBs.
processors Based on the C64x+
DSP core and priced as low as U.S.
$9.95*. TMS320DM6437,
TMS320DM6435, TMS320DM6433
and TMS320DM6431 processors are
ideal for cost-sensitive applications and
include special features that make them
suitable for automotive market applica-
tions such as lane departure and
collision avoidance, as well as machine-
vision systems, robotics and video
security.
processors TMS320DM64x digital
media processors are optimized for
video and include a range of high-
performance and low-cost options. The
TMS320DM64x generation of digital
media processors are fully programmable
and offer industry-leading performance
for the most demanding streaming
multimedia and multichannel video
security and infrastructure applications,
including digital video recorders (DVRs),
IP video servers, machine-vision
systems and high-performance imaging
applications. In addition, TI offers a wide
range of complementary analog parts,
easy-to-use development tools,
extensive video and imaging third-party
algorithms and more.
processsors Developers can now
deliver cost-effective solutions for
crystal clear video up to HD resolutions,
targeted at both portable and plugged
devices. The DM3x generation features
an ARM9 processor with speeds up to
300 MHz, some devices with video
coprocessing and bundled codecs to
speed development efforts, all with a
video-processing subsystem adding
intelligence to video processing. The
DM3x generation, including DM335,
DM355, DM357 and DM365 proces-
sors, is ideal for camera-driven applica-
tions as well as video-playback devices
such as IP cameras, video doorbells,
video conferencing, digital signage,
portable media players and more.
OMAP3530/25 applications
processors OMAP3530 and
OMAP3525 high-performance,
applications processors are based on
the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed
to provide best-in-class video, image,
and graphics processing sufficient to
support streaming video, 3D mobile
gaming, video conferencing and high-
resolution still imaging.
DaVinci Digital Media Processors
*Pricing valid at 10 ku
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Specifications
TIs integrated DSP+ARM system-on-chip (SoC)
architecture is suited for products requiring
intensive signal processing, comprehensive system
control, a responsive graphical user interface and
the ability to run applications under advanced
operating systems
Robust offerings that include multiple operating
frequencies, 3-D graphics acceleration, multiple
packaging options and temperature operating
points
Integrated high-bandwidth connectivity peripherals
including: CAN, DDR2/DDR3 interfaces, Gigabit
Ethernet, PCI Express, SATA 2.0 and USB 2.0
Demo in 10 minutes and develop in less than an
hour with robust Linux software development kits
Accelerate both software and hardware develop-
ment with low-cost development tools and free
software base ports
Secure boot and multi-level encryption options
available
Applications
Automation and control (high-speed data acquisition
and generation, signal/waveform generator), software
defined radios, Smart Grid (smart e-meter: ARM/AMI,
smart meter: gas and water), test and measurement
(digital multimeter: bench/system, signal/waveform
generator), machine vision (camera, frame grabber,
military and avionics image, patient monitoring,
ultrasounds system, portal ultrasound) and currency
counter
Features
A floating-/fixed-point DSP with up to 750 MHz
performance coupled via high-speed interconnect
with an ARM MPU (either Cortex-A8 MPU or
ARM926EJ-S) at up to 1.5 GHz enable real-time
signal processing and accelerated vision for high
precision and wide dynamic range
Low total power at less than 2.0 Watts enable
portable products (no fan or heat sink required)
Integrated 3D graphics accelerator enabling rich
2D and 3D GUIs as well as supporting multi-display
systems
High-speed connection to computer backpanes
and FPGAs, larger memory bandwidth improving
multi-programming system responsiveness and
performance
High-speed connectivity to mass storage
Peripherals
USB 1.1 and USB 2.0 connectivity
10/100 Ethernet MAC
Display subsystem LCD controller
Video I/O for camera and other video input options
CAN
EtherCAT
SATA 2.0
HDMI
PCI Express
MMC/SD card interface
SGX 3-D graphics engine
Support for multiple HD displays
TMS320C6A8168 DSP+ARM Block Diagram
The C6A816x C6-Integra DSP+ARM processors are a highly-integrated programmable
platform that leverages TIs C6-Integra technology to meet the processing needs of the
following applications: medical/industrial vision systems, high-end test and measurement,
tracking and control and medical/biological imaging.
C6-Integra DSP+ARM
Processors
Cost Efficient, High Performance Processors
Get samples, data sheets, tools and app reports at: www.ti.com/c6-integra
C6-Integra DSP+ARM Processor Roadmap
The C6-Integra platform includes cost efficient, high performance processors comprised of
devices with a floating- and fixed-point DSP processor and an ARM MPU (Cortex-A8 or ARM9)
with speeds up to 1.5GHz.
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Specifications
32-bit C28x MCU core with
floating-point option
Highest performance MCUs at 300 MHz
and 600 MFLOPS
Only processors with full software com-
patibility between fixed-point and float-
ing-point
Full software compatibility across all
C28x platform controllers
All C28x controllers are AEC Q-100
qualified for automotive applications
Applications
Green energy (solar, wind, fuel cells), digital
motor control (home appliances, industrial
drives, medical), Intelligent
LED Lighting, digital power supplies (tele-
com and server rectifiers, wireless basesta-
tions, UPS), automotive (HEV/EV, electric
power steering, drivers assistance radar,
wipers, HVAC),
Power Line Communications
Features
Industrys most efficient C compiler for
32-bit controllers
Up to 300-MHz operation
Single-precision 32-bit floating-point
unit on select devices
Ultra-fast interrupt response time
Integrated real-time debugging simplifies
control system development
Single-cycle 32 x 32-bit multiply-
accumulate
Multiple communication interfaces
including Ethernet and USB
Concerto combines ARM Cortex-M3 with
C28x cores for both communication and
control proficiency
Peripherals
Up to 512-KB flash and 68-KB RAM
Code security module with 128-bit pass-
word protection
Ultra-fast 12-bit A/D converter with up
to 80-ns conversion time
High-resolution PWM allows duty-cycle
modulation with down to
65-picosecond accuracy
Flexible PWM generation allows easy
generation of any switching waveform
Quadrature encoder interfaces for easy
motor feedback
Multiple communications interfaces
The C2000 microcontroller platform provides an optimized combination of 32-bit performance and
integration for digital control systems. Not all devices contain all modules shown.
C2000 Microcontrollers, Fixed-Point and Floating-Point
MCU Real-time Control, 32-Bit Performance
Get samples, data sheets, tools and app guides at: www.ti.com/c2000
TMS320C2000 Microcontroller Platform Roadmap
The C2000 controller platform provides an optimized combination of DSP performance and MCU
integration for digital control systems.
High Voltage Motor
Control & PFC Kit
DC/DC LED
Lighting Kit
High Voltage
Bridgeless PFC Kit
F28069 Piccolo
USB Stick
Access the latest C2000 MCU software, documentation, and more through controlSUITE software.
Download today at www.ti.com/controlsuite
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Key Applications
Low-power wireless applications
Consumer electronics
Utility metering
Intelligent sensing and control
Portable medical and instrumentation
Security systems
Key Features
16-bit RISC CPU enables new appli-
cations at a fraction of the code size
Ultra-low power architecture and
flexible clock system extends
battery life:
0.1-A RAM retention
<1-A RTC mode
<230 A/MIPS (flash)
<110 A/MIPS (RAM)
Increased performance
Up to 25 MHz
1.8-V ISP flash erase and write
Fail-safe, flexible clocking system
User-defined bootstrap loader
Up to 1-MB linear memory
addressing
Innovative features
Multichannel DMA supports data
movement in standby mode
Industry-leading code density
More design options including
USB, RF, LCD interface
Integrated intelligent peripherals
including a wide range of high-
performance analog and digital
peripherals to offload the CPU
Easy to get started: Complete
development tools starting at only
US$4.30 with integrated development
environments available free of charge
CC430 RF
Systems-on-Chip
Integrates MSP430F5xx with CC1101
High analog performance/integration
Ease of development
High RF sensitivity and blocking
Flexible data rate and RF modulation
formats
MSP430 Microcontrollers
Ultra-Low Power, Easy-to-Use, 16-Bit RISC Microcontrollers
Get samples, data sheets, tools and app reports at: www.ti.com/msp430
CC430 High integration reduces complexity, lets designers do more with less.
www.ti.com/cc430
MSP430 roadmap
MSP430x1xx Flash/ROM-based MCUs
offering 1.8-V to 3.6-V operation, up to 60
KB, 8 MIPS and a wide range of peripherals.
MSP430F2xx Flash-based family featur-
ing even lower power and up to 16 MIPS
with 1.8-V to 3.6-V operation. Additional
enhancements include 1 percent on-chip
very-low-power oscillator, internal pull-up/
pull-down resistors and low-pin-count
options.
MSP430x4xx Flash/ROM-based devices
offering 1.8-V to 3.6-V operation, up to
120-KB flash/ROM, 8 and 16 MIPS with FLL
+ SVS along with an integrated LCD control-
ler. Ideal for low-power metering and medical
applications.
MSP430F5xx/6xx New flash-based
microcontroller family featuring the lowest
power consumption and performance up to
25 MIPS. It offers a wide operating voltage
range from 1.8 V to 3.6 V. Features include
an innovative power management module
for optimizing power consumption, an inter-
nally controlled voltage regulator, integrated
LDC driver on select devices and a wide
range of memory options up to 256 KB.
MSP430FR57xx New 16-bit microcon-
troller family featuring embedded FRAM
memory. Cuts the industrys lowest active
power consumption by 50%, operating at
less than 100uA/MHz. Features write
speeds 100x faster than flash-based MCUs
and virtually unlimited write endurance.
True unified memory means designers can
partition the memory between code or data
depending on the application.
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Large register file eliminates
accumulator bottleneck
Optimized for C and assembler
programming
Compact core design reduces power
and cost
Up to 16 MIPS of performance available
The MSP430 MCUs orthogonal archi-
tecture provides the flexibility of 16 fully
addressable, single-cycle 16-bit CPU
registers and the power of a RISC. The
modern design of the CPU offers versatility
using only 27 easy-to-understand instruc-
tions and seven consistent addressing
modes. This results in a 16-bit low-power
CPU that has more effective processing, is
smaller-sized and more code-efficient
than other microcontrollers. Develop new
ultra-low power, high-performance appli-
cations at a fraction of the code size.
16-Bit RISC CPU
R15
R4 General Purpose
General Purpose
RO/PC Program Counter
R1/SP Stack Pointer
R2/SR/CG1 Status
R3/CG2 Constant Generator
0 15
The MSP430 CPU core with sixteen 16-bit
registers, 27 core instructions and seven
addressing modes results in higher processing
efficiency and code density.
The MSP430 microcontroller is designed
to provide industry-leading ultra-low
power performance. A flexible clocking
system, multiple operating modes and
zero-power always-on brown-out reset
(BOR) are implemented to reduce power
consumption and dramatically extend
battery life. The MSP430 BOR function
is always active, even in all low-power
modes, to ensure the most reliable perfor-
mance possible. The MSP430 CPU archi-
tecture with 16 registers, 16-bit data and
16-/20-bit address buses minimizes
power consuming fetches to memory,
while a fast vectored-interrupt structure
reduces the need for wasteful CPU soft-
ware flag polling. Intelligent hardware
peripheral features were also designed to
allow tasks to be completed more effi-
ciently and independent of the CPU. Many
MSP430 customers have developed
battery-based products that will last for
over 10 years from the original battery.
Ultra-Low Power Checklist:
Multiple operating modes
0.1-A RAM retention
<1-A real-time clock mode
Down to 165 A/MIPS
Instant-on stable high-speed clock
1.8-V to 3.6-V operation
Zero-power BOR
<50-nA pin leakage
CPU that minimizes CPU cycles per task
Low-power peripheral options
Ultra-Low Power Performance
Low-frequency auxiliary clock for ultra-
low power standby mode
High-speed master clock for high-
performance processing
Stability over time and temperature
The MSP430 MCU clock system is
designed specifically for battery-powered
applications. Multiple oscillators are uti-
lized to support event-driven burst activity.
A low-frequency auxiliary clock (ACLK) is
driven directly from a common 32-kHz
watch crystal or the internal very-low-
power oscillator (VLO) with no additional
external components.The ACLK can be
used for a background real-time clock self
wake-up function. An integrated high-
speed digitally controlled oscillator (DCO)
can source the master clock (MCLK) used
by the CPU and sub-main clock (SMCLK)
used by the high-speed peripherals. By
design, the DCO is active and stable in
1 s (F2xx) or < 6 s (x1xx, x4xx, F5xx).
MSP430 device-based solutions efficiently
use 16-bit RISC CPU high performance
in very short burst intervals. This results
in very high performance and ultra-low
power consumption.
Flexible Clock System
32.768 kHz
Control
Crystal
Digitally
Controlled
Oscillator
Very-Low Power
Oscillator (VLO)
Up to 20 kHz
f
ACLK 32 kHz
MCLK 100 kHz 16 MHz
Low-Power Peripherals
CPU and Peripherals
Multiple oscillator clock system
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Specifications
Cortex-A8 and ARM9 processors
Optional high-performance 3-D graphics acceler-
ator
Programmable real-time unit (PRU)
Robust display options
Optimized for low-power applications
Android, Linux and Windows
CE baseports
Targeted Applications
Automation and control, human machine inter-
face, medical, portable data terminals
Key Features
AM38x ARM Cortex-A8 MPU
H||e| pe||c|r|| |||e-:c|e AR| Cc||e/-A8
a| up |c 1.o H/
U|pa|a||e|ed |||e|a||c|
H||-oa|dW|d|| :c||e:||.||] pe||p|e|a|
8-O |ap||: |c| ||:| ue| |||e||a:e
Suppc|| |c| ru|||p|e d|p|a]
S:a|ao||||] W||| T|' |||u/ EZ SO| |c (u|:||]
expand product portfolio
and features and reuse software
800-|H/ a|d 1-H/ p|c:ec|
Up to 30 percent lower power
Display subsystem with picture-in-picture
8-O |ap||: e|||e oaed c| |ra||a||c|
Te:||c|c]' P0wERVR S/ |ap||: a::e|e|a|c|
O00-|H/ p|c:ec|
Suo-1-w pcWe| :c|urp||c|
8.8-V a|d 1.8-V |/0
Display subsystem with picture-in-picture
AM18x and AM17x ARM9 MPUs
8/o-|H/ a|d 4o0-|H/ AR|9 processors
SORA|/OOR2/rOOR rerc|] cp||c|
Key Peripherals
Gigabit Ethernet MAC
PCIe2.0 + PHY
DMA
CAN
SATAII + PHY
USB |c| /8, USB 2.0 0T, ||C/SO :a|d
|||e||a:e /8, 1.8-V ||pu|/cu|pu| a|d d|p|a]
subsystem with LCD :c|||c||e| a|d .|dec
e|:cde| W||| :crpc||e a|d S-.|dec uppc||
OOR2 uppc||, |||e|a|ed CA\ :c|||c||e|,
Cc||e:||.||] cp||c| W||| |||-peed USB 2.0
0|-T|e-c (0T, W||| ou|||-|| PH\, 10/100
EMAC
AM18x ARM9 MPU
SATA, uPP, .|dec |/0 |c| :are|a a|d c||e|
.|dec ||pu| cp||c|
AM17x ARM9 MPU
USB 1.1 a|d USB 2.0 :c||e:||.||], 10/100
Ethernet MAC, LCD controller
Sitara ARM
Cortex-A8 and ARM9 Microprocessors

H||-Pe||c|ra|:e, |cW-PcWe| |PU
Get samples, data sheets, tools and app reports at: www.ti.com/sitara
Sitara ARM Microprocessor Roadmap
By utilizing ARM processors and common peripheral sets, Sitara ARM microprocessors offer highly
reusable software code bases that allow designers to easily scale within the product family.
Multiple operating frequencies, 3-D graphics acceleration, multiple packaging options and temper-
ature operating points further provide optimal flexibility to fit most application requirements.
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Why Choose Cortex-M?
Cortex-M is the MCU version of ARMs V7
instruction set architecture family of cores:
Optimized for single-cycle flash usage
Deterministic, fast interrupt processing:
always 12 cycles, or just 6 cycles with
tail chaining
Three sleep modes with clock gating for
low power
Single-cycle multiply instruction and
hardware divide
Atomic operations
ARM Thumb2 mixed 16-/32-bit
instruction set
1.25 DMIPS/MHz better than ARM7
and ARM9
Extra debugging support including data
watchpoints and flash patching
Capabilities of the LM4F series using the
Cortex-M4F technology:
Single-cycle multiply-accumulate (MAC)
instructions
Optimized SIMD arithmetic and saturat-
ing arithmetic instructions
IEEE 754 standard compliant single
precision floating point unit
Why Choose the Stellaris
Family?
Designed for serious microcontroller
applications, the Stellaris family provides
the entry into the industrys strongest
ecosystem, with code compatibility
ranging from US$1 to 1 GHz.
Superior integration saves up to
US$3.28 in system cost
More than 180 Stellaris family
members to choose from
Real MCU GPIOs all can generate
interrupts, are 5-V-tolerant and have
programmable drive strength and slew-
rate control
Advanced communication capabilities,
including 10/100 Ethernet MAC/PHY,
USB and USB OTG and CAN controllers
Sophisticated motion-control support in
hardware and software
Both analog comparators and ADC
functionality provide on-chip system
options to balance hardware and
software performance
Development is easy with the royalty-
free StellarisWare software
Stellaris
family block diagram

Overview
TI Stellaris MCUs are the industrys
leading family of robust, real-time
microcontrollers based on the revolu-
tionary Cortex-M technology from
ARM
. The award-winning Stellaris

32-bit MCUs combine sophisticated,
flexible mixed-signal system-on-chip
integration with unparalleled real-time
multitasking capabilities. Complex
applications previously impossible
with legacy MCUs can now be
accommodated with ease by powerful,
cost-effective and simple-to-program
Stellaris MCUs. With more than 170
devices, the Stellaris family offers the
widest selection of precisely compati-
ble MCUs in the industry.
The Stellaris family is positioned for
cost-conscious applications requiring
significant control processing and
connectivity capabilities, including
motion control, monitoring (remote,
fire/security, etc.), HVAC and building
controls, power and energy monitor-
ing and conversion, network appli-
ances and switches, factory automa-
tion, electronic point-of-sale
machines, test and measurement
equipment, medical instrumentation,
and gaming equipment.
In addition to MCUs configured for
general-purpose real-time systems,
the Stellaris family offers distinct
solutions for advanced motion control
and energy-conversion applications,
real-time networking and real-time
internetworking, and combinations of
these applications including connect-
ed motion control and hard real-time
networking. Welcome to the future of
microcontrollers.
Stellaris
32-Bit ARM
Cortex
-M MCUs
Get samples, data sheets, tools and app reports at: www.ti.com/stellaris
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Specifications
Code compatible between C64x and
C66x platforms
Industrys first 10Ghz DSP with
320 GMACs /160 GFLOPs
C66x is a true fixed and floating point
DSP
Supports TIs new KeyStone
multicore architecture
Best power per performance
Full set of development software,
tools & complier
Target Markets
Mission Critical
- Military & defense
- Public safety
- Satellite
Medical Imaging
- CT scan
- MRI
- OCT
Test & Automation
- Test & measurement
- Industrial imaging
- Semiconductor manufacturing
High Performance Compute
- Counterfeit & verification
- Composition & purity
- Large displays
Emerging Broadband
- Blade servers
- Cloud computing
- Application workstations
C66x KeyStone Features
KeyStone Architecture Multicore
SoC architecture for highest
performance
KeyStone Software Software &
programming model support for
ease of use & performance
KeyStone Tools Tools for delivering
singe core simplicity for multicore
performance
KeyStone Partners Partner network
for quick development
C6678 Processor Block Diagram
For developers of products in mission critical, medical imaging, test and automation and high-
performance computing markets,TIs TMS320C6672/74/78 (C667x) DSP family offers the industrys
first 10-GHz DSP. Based on TIs KeyStone multicore architecture, and integrated with the new and
innovative C66x DSP core, C6672/74/78 devices come with two, four or eight cores, respectively.
C6000 Multicore Roadmap
C64x & C66x multicore DSPs provide the highest performance solutions for various
market segments.
TMS320C66x DSP Generation, Fixed- and Floating-Point
High Performance Multicore DSPs
Get samples, data sheets, tools and app reports at: www.ti.com/c66multicore
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Key Applications
Industrial/medical applications
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TMS470M Safety MCUs
80-|H/ Cc||e/-|8 CPU
Up |c O40-|B ||a| / O4-|B RA| W||| ECC
p|c|e:||c| a|d EEPR0| eru|a||c|
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||e/|o|e ||re| rcdu|e (1O :|,
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Sa|e|] |ea|u|e (ECC, B|ST, CRC,
P|| a|d c||Wa|e :crpa||o|e |ar||]
Eroedded deou rcdu|e
Hercules Safety Microcontrollers
|a|e ||e Wc||d a|e| W||| ||e |eW He|:u|e a|e|] |CU p|a||c|r
e| arp|e, da|a |ee|, |cc| a|d app u|de a|. www.ti.com/hercules
www.eecataIog.com/dsp DeveIopment TooIs 37
CONTACT INFORMATION
Kionix, Inc.
Kionix, Inc.
36 Thornwood Drive
Ithaca, NY 14850
USA
salesna@kionix.com
www.kionix.com
Factory-programmable Offset and Sensitivity / High
Shock Survivability / Excellent Temperature Perfor-
mance / Self-test Function
Digital High and Low pass lters
AVAILABILITY
Now
APPLICATION AREAS
Automotive, Communications & Telecom, Computers &
Peripherals, Consumer Electronics, Industrial, Medical,
Military, Security, Wireless
Kionix KXTI9 Tri-Axis
Digital Accelerometer
Supported TI Processors: OMAP-L1x DSP, MSP430L092 Series
Low Voltage, MSP430F1xx Series Up to 8 MHz, MSP430G2xx
Value Series Up to 16 MHz, MSP430F2xx Series Up to 16 MHz,
MSP430AFE2xx Series Up to 12 MHz, MSP430F4xx Series Up
to 8 or 16 MHz, MSP430F5xx/F6xx Series Up to 25 MHz, MSP-
430FR57xx FRAM Series Up to 8 or 24 MHz, CC430 Series Up
to 20 MHz
The KXTI9 is a low-power, high-performance, Fast-mode
I2C tri-axis accelerometer. It is pin- and register-compat-
ible with the popular Kionix KXTF9, and offers a 43%
reduction in power consumption in 12-bit mode (325A)
and 56% lower power in 8-bit operation (100A) versus
the KXTF9. It includes a 252-byte FIFO/FILO buffer, which
simplies timing requirements and enables burst reads,
and has an integrated voltage regulator with a supply
voltage range of 1.8V to 3.6V. In addition, the KXTI9
offers a wide range of user-programmable settings,
including 8-bit or 12-bit resolution; 2g, 4g or 8g ranges;
and Output Data Rates (ODR) from 12.5 Hz to 800 Hz with
programmable high-pass and low-pass lters. The KXTI9
integrates Kionixs second-generation algorithm engine
that improves Directional Tap/Double-Tap, shake-to-
wake, and screen rotation
FEATURES & BENEFITS
Low Power Consumption makes it ideal for mobile
devices
Low-Power Motion Interrupt: HPF based to ignore
static offsets; 8-bits of programmable thresholds and
delays; Independent ODR (25Hz 200Hz)
FIFO or FILO Buffer operation: 252 bytes; Low-res
1-byte per axis (64 XYZ sample buffer) or high-res
2-bytes per axis (32 XYZ sample buffer); Streaming
mode with programmable watermark interrupt; Trig-
gered mode; Asynchronous clear
Internal regulated power supply
Directional Tap/Double-TapTM detection feature rec-
ognizes single-tap and double-tap input and reports
the acceleration axis and direction from which each
tap originated, enabling up to 12, user-dened,
function commands. Orientation-detection feature
reports changes in landscape, portrait, face-up, and
face-down conditions.
TECHNICAL SPECS
Ultra-Small, 3x3x0.9mm LGA Package with User-
selectable g range (2g, 4g, 8g)
Fast-mode Digital I2C Output / 8-bit or 12-bit Resolution
User-selectable Output Data Rate
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CONTACT INFORMATION
38 DeveIopment TooIs Embedded Processing & DSP Resource Guide 2012
Xilinx, Inc.
Xilinx, Inc.
2100 Logic Drive
San Jose, CA 95124-3400
USA
more_info@xilinx.com
www.xilinx.com/spartan6
TECHNICAL SPECS
Spartan-6 LX FPGAs for absolute lowest cost with
up to 150K logic density, 4.8Mb memory, integrated
memory controllers, and up to 180 DSP blocks at 250
MHz
Spartan-6 LXT FPGAs for lowest risk, lowest cost
serial connectivity with up to eight low power 3.2
Gbps GTP transceivers, integrated PCI Express core,
and up to 180 DSP slices at 250 MHz
Start designing today with the Spartan-6 FPGA
Evaluation Kit that provides all elements needed to
design right out of the box
AVAILABILITY
Shipping now with the Spartan-6 FPGA Evaluation Kit
available at: www.xilinx.com/kits
APPLICATION AREAS
Automotive, Broadcast Video, Consumer Electronics,
Wired/Wireless Communications, Aerospace & Defense,
and Industrial, Scientic Medical Instrumentation and
Embedded Vision
Xilinx Spartan-6 FPGAs
Supported TI Processors: DM646x, DM644x, DM643x, DM64x,
DM355, OMAP35x, F283x, F282x, F281x, F280x, LF240x, C55x,
C54x, C672x, C67x, C645x, C6414T/15T/16T, C642x, C6410/12/13/18,
C62x, MSP430x1xx, MSP430x2xx, MSP430x3xx, MSP430x4xx
Compatible Operating Systems: Embedded Linux, Java-Embed-
ded, Mentor Graphics/Nucleus, Windows Embedded
The Xilinx Spartan-6 FPGA family offers an optimal
balance of cost, power, and performance for consumer,
automotive, surveillance, wireless, and other cost and
power-sensitive applications.
Built for connectivity and low power, Spartan-6 FPGAs
provide the programmable foundation for Xilinx Tar-
geted Design Platforms that accelerate innovation and
improve differentiation of lower power greener elec-
tronics products. Spartan-6 FPGAs benet from Xilinxs
holistic approach to lowering power through hardware,
software, power estimation tools, and demonstration
boards with power measurement capabilities.
System developers can meet the demand for new
features with twice the capability at half the power con-
sumption. Spartan-6 FPGAs are fabricated using mature,
low power 45-nanometer process technology. A rich
selection of built-in blocks including second generation
DSP slices, low power (150-180mW per) high-speed serial
transceivers, and PCI Express interface cores enable
greater system-level integration and power savings.
Spartan-6 FPGAs bring 65 percent lower power than pre-
vious Spartan families with innovations in system-level
power management to reduce static and dynamic power,
advanced power control modes, and a lower power 1.0V
core option. In addition, fast, exible I/Os deliver over
12Gbps memory access bandwidth with 3.3 volt compat-
ibility and RoHS-compliant Pb-free packaging.
FEATURES & BENEFITS
Advanced power control features such as hibernate
and suspend modes for ultra low-power applications
Low power operation mode when not in use is ideal
for battery powered applications
Only low cost and low power FPGA to have inte-
grated high-speed serial transceivers
Integrated hard memory controller enables DDR3
memory support in low-cost FPGA
Low power device option lowers operating voltage to
1.0V to reduce power by an additional 30 percent
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CONTACT INFORMATION
Xilinx, Inc.
Xilinx, Inc.
2100 Logic Drive
San Jose, CA 95124-3400
USA
more_info@xilinx.com
www.xilinx.com/virtex6
TECHNICAL SPECS
Virtex-6 LXT FPGAs for high-performance logic, DSP
and serial connectivity with up to 36 low-power 6.6Gbps
GTX transceivers and 864 DSP slices at 600 MHz
Virtex-6 SXT FPGAs for ultra high-performance DSP
and serial connectivity with up to 36 low-power 6.6Gbps
GTX transceivers and 2,016 DSP slices at 600 MHz
Virtex-6 HXT FPGAs for the industrys highest band-
width with line rates in excess of 11Gbps and over 1Tbps
serial connectivity with 720 SelectIO pins and up to 72
multi-rate transceivers
Start designing today with the Virtex-6 FPGA Evalu-
ation Kit that provides all elements needed to design
right out of the box
AVAILABILITY
Shipping now: http://www.xilinx.com/virtex6
APPLICATION AREAS
Automotive, Broadcast Video, Consumer Electronics,
Wired/Wireless Communications, Aerospace & Defense,
and Industrial, Scientic and Medical Instrumentation
Xilinx Virtex-6 FPGAs
DM355, OMAP35x, F283x, F282x, F281x, F280x, LF240x, C55x,
C54x, C672x, C67x, C645x, C6414T/15T/16T, C642x, C6410/12/13/18,
C62x, MSP430x1xx, MSP430x2xx, MSP430x3xx, MSP430x4xx
Compatible Operating Systems: Embedded Linux, Java-Embedded,
Mentor Graphics/Nucleus, Windows Embedded
The Xilinx Virtex-6 FPGA family is optimized for the
higher bandwidth and lower power demands of wire-
less/wired communications, broadcast, and aerospace/
defense electronics.
Virtex-6 FPGAs provide the high performance program-
mable foundation for Xilinx Targeted Design Platforms that
accelerate innovation and improve product differentiation
of compute-intensive applications. At up to 50 percent
lower power and 20 percent lower cost than previous
generations, Virtex-6 FPGAs benet from Xilinxs holistic
approach to lowering power through hardware, software,
power estimation tools, and demonstration boards with
power measurement capabilities.
Virtex-6 FPGAs use the combination of high performance
40-nanometer process technology, innovative circuit
design techniques, and architectural enhancements to
deliver more computational performance and faster
networking, while signicantly reducing both static and
dynamic power consumption.
DSP bandwidth exceeds 1,000GMACS with over 2000 DSP
slices and optimized ratios of logic, Block RAM, and distrib-
uted RAM. This computational bandwidth is augmented
with over 500Gbps of total serial bandwidth that is also
optimized to reduce overall system power consumption for
system architects designing the green central ofces and
data centers of the future. With Virtex-6 FPGAs, even fur-
ther power savings can be realized with enhanced support
for partial reconguration and low-voltage device options.
FEATURES & BENEFITS
Low power and high performance with greatly simplied
power system design
Optimized feature mix delivers two-fold increase of
Flipops and BRAM with six times more DSP than
similar-sized devices
Integrated system blocks save up to 10X static power
compared to soft implementations
Devices operate on 1.0V core voltage with a 0.9V
low-power option that reduces power by an additional
20 percent
New I/O power reduction features allow low power
modes for memory interfaces
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CONTACT INFORMATION
Link Research
Link Research
131 Fairview Street
Providence, RI 02908
USA
401-270-5221 Fax
sales@link-research.com
www.link-research.com
TECHNICAL SPECS
Analog Input Range: 10 volts.
A/D Channels: Three versions having 4, 8, or 16,
14-bit converters with simultaneous sampling.
D/A Channels: Two versions having 8 or 16, 14-bit
converters with simultaneous updating.
Sampling Rate: 350 kbps using one channel, 100
kbps per channel using all channels.
RS-232 Interface: Operates up to 921.6 kbps
AVAILABILITY
In production since 2006
APPLICATION AREAS
Power Supply Design, Power Factor Correction, Three
Phase Power Inverters, Motor Control, Uninterruptible
Power Supply.
Multi-channel Data Acquisition
daughtercard for the F2812/
F28335 eZdsp
Supported TI Processors: F28x Delno Floating-point MCUs,
F28x Fixed-point Series
The Link Research models LR-F2812DAQ and LR-
F28335DAQ daughtercards plug directly into the F2812
and F28335 eZdsp boards respectively. The daughter-
cards feature up to 16 channels of 14-bit, simultaneous
sampling A/Ds, and up to 16 channels of simultaneous
updating D/As. All analog I/O channels feature a full 10
volt I/O range. A/D sampling rates of up to 350kHz on a
single channel, or 100 kHz with all channels operating are
possible.
The standard version of the daughtercard includes an
RS-232 interface with a maximum data rate of 921.6 kbps,
eight digital I/Os, two user LEDs and a Hitachi 44780
compatible LCD display interface (F2812 version only).
Also available as optional interfaces are a ber optic
serial communications interface allowing true galvanic
isolation between the daughtercard and the PC, and an
802.3 compatible Ethernet interface.
The daughtercard ships with everything needed to get
up and running fast, including a 15 volt analog power
pack, a 6 foot RS-232 cable, an extra set of connectors to
be soldered into the eZdsp board, and framework soft-
ware and documentation on CD.
FEATURES & BENEFITS
Adds high precision, multi-channel data conversion
capability to the F2812 or F28335 eZdsp boards
Includes complete CCS projects demonstrating both
DSP/BIOS software kernel foundation as well as
non-BIOS applications
Optional Ethernet interface includes software dem-
onstrating a web browser JAVA applet model for
accessing development system data.
Achieve a maximum of 16 A/D and 16 D/A channels
by stacking a second daughtercard (model LR-
F2812DAQ8X8/LR-F28335DAQ8X8)
These daughtercards are also available bundled with
a Spectrum Digital eZdsp development system
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CONTACT INFORMATION
Signum Systems
Signum Systems Corp
1211 Flynn Rd., #104
Camarillo, CA 93012
USA
805-383-3685 Fax
sales@signum.com
www.signum.com
Signum Systems Emulators for TI DSPs,
OMAP and DaVinci Processors
Signum Systems JTAGjet line of In-Circuit Debuggers
(emulators) covers the entire line of TI DSP, OMAP,
DM and DaVinci processors as well as other vendors
ARM devices. We offer many precongured models or
you can create your own, custom emulator. If you need
more options later, no problem most can be emailed to
you whenever they are needed. This unusual exibility
protects your investment in embedded tools and simpli-
es the debugging process. And yes, you can use almost
any ARM debugger with JTAGjet: Code Composer
Studio IDE, ARM ADS, eSOL eBinder, GDB, Eclipse,
Keil, IAR, Mentor Graphics, MetroWerks and others. Our
own Chameleon Debugger capable of embedded Linux
debugging is included with most models.
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JTAGjet-CCS JTAGjet-DaVinci JTAGjet-
OMAP3
JTAGjet-
Trace-OMAP
JTAGjet-470 JTAGjet-570 JTAGjet-C2000
Price (USA) $995 $2,500 $2,800 from $4,200 $1,500 $2,200 $595
ARM7 Debugger Optional Yes Yes Yes Yes Yes -
ARM9 Debugger Optional Yes Yes Yes Optional Optional -
ARM11 Debugger Optional Optional Yes Optional Optional Optional -
Cortex Debugger Optional Optional Yes Optional Optional Yes -
ARM 20-pin
JTAG Adapter
Optional Optional Yes Yes Optional Yes -
TI 14-pin JTAG Adapter Yes Yes Yes Yes Yes Yes Yes
Isolation opt.
cTI-20 JTAG Adapter Optional Yes Optional Optional Optional Optional Optional
CCStudio drivers Yes Yes Yes Yes Yes Yes Yes
eSOL eBinder Support Optional Yes Yes Optional Optional Optional -
ETM Trace Memory - Optional Optional 1 MBytes to
18 MBytes
Optional Optional -
NOR / On-chip Flash
Programming
CCStudio
Flash470
CCStudio
Flash470
Chameleon
CCStudio
Flash470
Chameleon
CCStudio
Flash470
Chameleon
CCStudio
Flash470
Chameleon
CCStudio
Flash470
Chameleon
CCStudio
Flash-C2000
(opt.)
NAND Flash
Programming
Optional Optional Optional Optional Optional Optional -
Device Support
C6000
C5000
C2000
VC33
OMAP, OMAP3
TMS470
TMS570
DaVinci, DM
Non-TI ARM7
Non TI ARM9
Non-TI ARM11
Non-TI Cortex
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Optional
Optional
Optional
Optional
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Optional
Optional
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Optional
Optional
Optional
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Optional
Optional
Yes
-
-
Yes
-
-
-
-
-
-
-
-
-
CONTACT INFORMATION
114 Sheldon Road
Ithaca, NY 14850
USA
607.266.6000 Telephone
607.266.8221 Fax
sales@traquair.com
www.traquair.com
TECHNICAL SPECS
C6412Compact
720-MHz TMS320C6412-based ihIeger DSP board
1-MGaIe or 4-MGaIe SparIah-3 FPGA
Up Io 128-MB SDPAM, up Io 32-MB booI program
ROM
Two ihdepehdehI EEE1394a FireWire ihIerIaces
for streaming data in/out simultaneously
10/100BaseT EIherheI, USB 2.0 ahd PS-232 ihIer-
faces; 16-/32-bit host port interface
AVAILABILITY
In production since 2006
APPLICATION AREAS
Audio, Automotive, Broadband, Communications &
Telecom, Industrial, Medical, Military, Security, Video
and Imaging, Wireless
micro-line TMS320C641x-based
Integer DSP/FPGA Boards
Supported TI Processors: C6410/12/13/18
The micro-line series of embedded DSP/FPGA boards
provides embedded systems developers with a tightly
integrated suite of programmable DSP, FPGA and I/O
resources in small, stand-alone-capable board formats.
micro-line C6412Compact and C641xCPU DSP/FPGA boards
target high-performance integer DSP applications using
Texas Instruments TMS320C6410/6412/6413/6418 DSPs.
The C6412Compact combines a powerful 720-MHz
TMS320C6412 DSP, up to 128-MB SDRAM, 8- or
32-MB boot program ROM and a high-density 1-MGate
or 4-MGate Xilinx Spartan-3 FPGA. The optionally
programmable FPGA greatly expands processing and
interfacing options. Two independent 400-Mbps 1394a
FireWire interfaces are included, enabling simultaneous
high-bandwidth video-in/out for completely integrated
video processing. A 64-bit bus connects the DSP, FPGA,
SDRAM and FireWire resources. On-board USB 2.0 and
10/100BaseTx Ethernet interfaces round off the impres-
sive array of features.
The C641xCPU family of boards features a smaller
(98-mm x 67-mm footprint) and leaner configuration,
with up to 64-MB SDRAM, 8-MB boot program ROM,
and a high-density 500-KGate, 1-MGate, or 1.6-MGate
Spartan-3E FPGA.
Analog I/O daughtercards can also be combined with
these boards:
OPS-112 (16-biI A/D/A)
4-ch A/D 2.5 MSPS, 4-ch D/A 625 KSPS
2-ch A/D 65 MSPS, 2-ch D/A 125 MSPS
12-ch A/D 250 KSPS, 12-ch D/A 100 KSPS
FEATURES & BENEFITS
Small form factor, embeddable DSP/FPGA boards for
OEM applications
Suitable for product development and volume production
User-programmable DSP, optionally programmable FPGA
Extensive connectivity options via DSP, FPGA,
FireWire, USB, Ethernet, RS-232
Optional A/D/A
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CONTACT INFORMATION
114 Sheldon Road
Ithaca, NY 14850
USA
607.266.8221 Fax
sales@traquair.com
www.traquair.com
TECHNICAL SPECS
C6713Compact
300-MHz IoaIihg-poihI TMS320C6713 DSP
SparIah-6 (LX45, LX75, LX100, or LX150) or VirIe-
II (250-kGate, 500kGate, or 1MGate) FPGA; up to
160 congurable digital I/O pins
Oh-board 400-Mbps EEE1394a FireWire ihIerIace,
RS-232 interface also included
EIerhal access Io TMS320C6713 DSP /O ihIerIaces:
32-bit EMIF, XF0/1 pins, timer input/output pins,
McASP and McBSP ports, IC, and Host Port Interface
67-mm 120-mm IooIprihI, SO9001:2000 accred-
ited production and CE certication
AVAILABILITY
C6713Compact with Spartan-6 LX FPGA: 2012; others in
production since 2003
APPLICATION AREAS
Telecom, Industrial, Medical, Military, Security, Video
and Imaging, Wireless
micro-line TMS320C6713
DSP-based Floating-Point
DSP/FPGA Boards
Supported TI Processors: C67x DSPs
The micro-line series of embedded DSP/FPGA boards
provides embedded systems developers with a tightly
integrated suite of programmable DSP, FPGA and I/O
resources in small, stand-alone capable board formats.
micro-line C6713Compact and C6713CPU DSP/FPGA
boards target high-performance oating-point DSP
applications using the powerful Texas Instruments
TMS320C6713 DSP.
The C6713Compact incorporates up to 128-MB SDRAM,
8-MB boot program ROM and an on-board, high-density
Xilinx Spartan-6 LX or Virtex-II FPGA (optionally pro-
grammable). The FPGA greatly expands processing and
hardware interfacing options. An on-board 400-Mbps
IEEE 1394a FireWire interface allows for communica-
tions with other embedded DSP resources, cameras,
sensors and PCs. Software APIs are available to utilize
the FireWire interface for general purposes, video frame
capture from cameras, and data storage to hard drives
and CompactFlash memory.
The C6713CPU offers a smaller (98-mm x 67-mm foot-
print) and leaner conguration, with up to 64-MB SDRAM,
2-MB boot program ROM and a high-density 400-kGate or
1-MGate Xilinx Spartan-3 FPGA.
Analog I/O daughtercards can also be combined with
these boards:
4-ch A/D 2.5 MSPS, 4-ch D/A 625 KSPS
2-ch A/D 65 MSPS, 2-ch D/A 125 MSPS
12-ch A/D 250 KSPS, 12-ch D/A 100 KSPS
FEATURES & BENEFITS
Small form factor, embeddable DSP/FPGA boards for
OEM applications
Suitable for product development and volume production
User-programmable DSP, optionally programmable FPGA
Extensive connectivity options via DSP, FPGA,
FireWire, RS-232
Optional A/D/A
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Critical Link
Critical Link
6712 Brooklawn Parkway
Syracuse, NY 13211
US
315.425.4048 Fax
info@CriticalLink.com
www.mitydsp.com
The MityDSP can be easily congured to meet the
specic needs of your applications, removing the
need to sacrice on key features to get products to
market more quickly and cheaply.
With MityDSP, you can replace obsolescence-prone
PCs. And with MityDSPs long term availability,
you wont have to worry about forced yearly PC
upgrades, or obsolescence issues in the CPU design.
TECHNICAL SPECS
OMAP-L138 (ARM processor + oating point DSP),
AM1808 (ARM only), or TMS320C6748 processor
(oating point DSP only) in multiple speed grades up
to 456MHz. 128MB DDR2, 8 MB NOR ash, 256MB
NAND ash
Xilinx Spartan-6 FPGA available in multiple sizes.
Modules available with and without FPGA option
Operating Systems Supported: Real-Time Embed-
ded Linux, QNX (ARM), DSP/BIOS software kernel
foundation
I/O Options: ADC, DAC, Ethernet, USB, RS-232,
RS-485, RS-422, CAN, PROFIBUS, industrial proto-
cols, motor control, GPIO, display, McASP, McBSP,
uPP, PWM, HPI, eCAP, MMC/SD, SATA
Meet the needs of your most demanding applica-
tions: Industrial Automation; Scientic, Medical, &
Industrial Instrumentation; Network Enabled Data
Acquisition; Test & Measurement; Machine Vision
AVAILABILITY
Shipping
APPLICATION AREAS
Audio, Communications & Telecom, Industrial, Medical,
Military, Security, Video and Imaging, Wireless
MityDSP System on Module
with FPGA based on OMAP-L138,
AM1808, or TMS320C6748 DSP
Supported TI Processors: OMAP-L1x DSP, 674x Low Power DSP,
AM18x ARM9
The MityDSP family of congurable System on Modules
supports a wide range of demanding application require-
ments. In addition to modules built around TIs C6711 and
C645x DSPs, the MityDSP supports TIs OMAP proces-
sors and Sitara ARM
MPUs the OMAP-L138, AM1808,

and C6748 DSP-based devices built for challenging applica-
tions requiring minimal power consumption.
The MityDSP-L138F combines DSP, ARM
processor, and
Xilinx
Spartan
-6 FPGA processing power, and features

dual-core architecture, providing the benets of both
DSP and RISC technology. The MityARM-1808F combines
an ARM processor with a Spartan-6 FPGA; the MityDSP-
6748F pairs a oating point DSP with a Spartan-6 FPGA.
With all MityDSP modules, the FPGA can be used for I/O
expansion, signal processing, or to support high speed data
acquisition. CPU-only versions are offered for each pro-
cessor option. All modules have been specically designed
to be interchangeable, allowing for a single solution that
takes advantage of a highly scalable CPU/FPGA subsystem.
Critical Link also offers production-ready carrier boards,
including the Industrial Interface Board, designed for the
MityDSP-L138F, MityARM-1808F, and MityDSP-6748F
modules.
Critical Link has two new modules containing ARM
Cortex-
A8 based processors under development (available 1Q2012).
The rst is a general purpose applications processor. The
second is based on the TI DaVinci digital media processor
(DM8148) and will contain a oating-point DSP, a Xilinx FPGA
and enhanced video capabilities.
FEATURES & BENEFITS
The MityDSP SoM helps you bring your most
demanding scientic and industrial applications to
market more quickly and cost-effectively by reducing
the risk associated with complex CPU design.
Concept to prototype in just 6 weeks; product ship in
6 months. Save up to 80% on the cost of completely
in-house, ground-up development effort.
The MityDSP supports the most demanding applications
those that require robust operating systems, rich user
interfaces, and industrial-strength processing power.
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CONTACT INFORMATION
Blackhawk
123 Gaither Drive
USA
856-866-1100 Fax
Blackhawk
USB2000 Features
Super Low-CosI XDS510'-class CohIroller
SupporIs T C2000 DigiIal Sighal Processors
F283 F281 F280
F280
LF240
3.3/5.0 volI device /O supporI
Code Composer SIudio v3.3 SP2 or laIer
AVAILABILITY
All Blackhawk Emulators are available for immediate
delivery from a world wide network of industry resellers
and distributors. Please visit www.blackhawk-dsp.com
for a complete list.
APPLICATION AREAS
Audio, Automotive, Communications, Military, Telecom,
Telecom Infrastructure, Telephony, Video Conferencing,
Video Security, Video and Imaging, Wireless.
High Performance JTAG Emulators
Blackhawk is a recognized leader in providing advanced
JTAG Emulators for Texas Instruments DSPs and the
rst company to develop a USB JTAG Emulator for TI
TMS320 DSPs. Our XDS510-class emulators & con-
trollers provide a full range of features and benets with
support for a wide-range of TI DSPs. Blackhawk XDS510-
class JTAG Emulators & Controllers are also compatible
with Code Composer Studio Flash-burner utility.
Feature Set of Both Emulators
Bus-powered via USB cable
Bi-Color SIaIus LED (red/greeh)
Full CCSIudio DE compaIibiliIy
Wihdows Plug h' Play hsIallaIioh
Drivers are provided Ior Wihdows XP, VisIa ahd
Windows 7 including 64-bit support
All driver updaIes are available Ior dowhload Iree-
of-charge from our website
CompaIibiliIy wiIh Ihe CCSIudio Flashburh plugih
and Blackhawk FlashBurn Utility add-on
Free Iechhical supporI ahd web dowhloads
Ohe Year WarrahIy
AuIo-sehsihg low /O volIage supporI
SIahdard 14-pih JTAG Header CohhecIor
Fully assembled ahd IesIed ih Ihe US
PoHS CompliahI
OpIiohal solaIioh AdapIer Available
USB510L Features
AIIordable XDS510'-class CohIroller
SupporIs T TMS320' DigiIal Sighal Processors:
C2000' High PerIormahce 32-biI cohIrollers
C5000' Power-EIIciehI DSPs
C6000' FloaIihg-poihI DSPs
C6000' High PerIormahce DSPs
DaVihci' DigiIal Media Processors
TMS470 (APM)
TMS570LS APM CorIe'-P4
SIellaris 32-biI APM CorIe-M3
SiIara' APM CorIe' A8 & APM9'
OMAP'
hIegra DSP+APM
3.3/5.0 volI device /O supporI.
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123 Gaither Drive
USA
856-866-1100 Fax
CONTACT INFORMATION
Blackhawk
hcludes pih adapIers Ior 20-pih(APM) ahd 60-pih
(Trace) target header
hcludes boIh a halI-heighI (ihsIalled) ahd sIahdard
height bracket
USB560 BP Features
USB Bus-powered, heeds ho power supply
LighIweighI (5 ouhce) pod wiIh sIaIus LED
High-speed USB 2.0 (480 MbiIs/sec) porI
NaIive ADAPTVE CLOCKNG supporI Ior T APM-
based devices
AVAILABILITY
APPLICATION AREAS
High Performance JTAG Emulators
Feature Set of All Blackhawk 560 Emulators
SupporI Ior Corelis Scah Epress Programmer ahd
Scan Express Jet Boundary Scan tools
SupporI Ior TMS320, TMS470 (APM) ahd OMAP'
families including the DaVinci platform
High-speed PTDX' wiIh daIa raIes oI over 2 MB/sec
hcludes XDS560 Pevisioh D cable elecIrohics ahd
features with 20-pin cTI JTAG Header
hcludes 20-pih cT Io 14-pih adapIer Ior boards
using standard 2x7 target header
AuIo-sehsihg low /O volIage supporI dowh Io 0.5v
Peal-Iime, hoh-ihIrusive Advahced EvehI Triggerihg
(AET) capability
CCSIudio DE compaIibiliIy Ior v2.2 ahd laIer
Drivers are provided Ior Wihdows 2000, XP ahd
Vista, including 64-bit support for XP Pro, Vista and
Windows 7.
LNUX supporI uhder CCSIudio v5
All driver updaIes are available Ior dowhload IreeoI-
charge from our website
CompaIibiliIy wiIh Ihe CCSIudio Flash-burher uIiliIy
Up Io 100 Iimes IasIer Ihah XDS510' emulaIors
USB560M FEATURES
CompacI pod wiIh power ahd USB sIaIus ihdicaIor
LEDs
High-speed USB 2.0 (480 MbiIs/sec) porI
Fleible 12 ihch high-speed micro coa JTAG cable
with 20-pin cTI (Compact TI) header
LAN560 has all the features of the USB560M plus:
10/100 Mbps EIherheI LAN hIerIace
NeIwork AcIiviIy LED
HosI ihIerIace via USB or EIherheI (PJ45)
TCP/P cohIguraIioh seIIihgs Ior P, mask ahd
gateway address
PCI560 Features
UlIra compacI halI-heighI ahd halI-lehgIh Iorm IacIor
Fleible 5 IooI high-speed micro coa JTAG
cable with 20-pin cTI (Compact TI) header
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123 Gaither Drive
USA
856-866-1100 Fax
CONTACT INFORMATION
Blackhawk
123 Gaither Drive
USA
856-866-1100 Fax
Blackhawk
1.8/3.3 volI device /O supporI.
NaIive 210 20-pih cT JTAG Header.
hcludes 27 14-pih JTAG adapIer (selecI models).
OpIiohal APM MulIi-ce pih cohverIer available.
Ohlihe SupporI Irom T.
AVAILABILITY
APPLICATION AREAS
Audio, Automotive, Motor Control, Communications,
Military, Telecom, Telecom Infrastructure, Industrial,
Telephony, Video Conferencing, Video Security, Video
and Imaging, Wireless.
USB100v2 Model D Controller
The Blackhawk USB100v2 Model D is a very low-cost
controller for basic debugging of Texas Instruments
DSPs. Requiring no external power source, the USB100v2
Model D can support most of the basic features of higher
priced controllers and requires no additional drivers
when installed using CCS v4 or later.
Its also a TI XDS100v2-compatible controller fully sup-
ported under CCS v4 and future Texas Instruments
roadmap software development environments. The
USB100v2 Model D provides for faster code downloads
and assembly code stepping in that the USB100v2 Model
D uses a high-speed USB2.0 (480 Mb/s) port instead of
slower USB1.x (12 Mb/s) implementations.
Measuring just 2.75L x 0.80W x 0.65H (7.0cm x 2.0cm x
1.5cm) the Blackhawk USB100v2 Model D is the smallest
and most compact emulation product from a US manu-
facturer and is fully assembled and tested in the USA.
It will support 1.8-3.3v targets with native cTI compact
20-pin connections and also includes standard 14-pin
emulation adapter.
On selected models, the USB100v2 includes an adapter
for 14-pin targets and the USB100v2 Model D uses a
native 20-pin compact TI (cTI) JTAG header. This option
alone would cost over $100, but, is included at no addi-
tional charge.
Additionally, with an optional 20cTI to 20ARM connector
(available from Blackhawk), the USB100v2 Model D can
connect to 20-pin ARM Multi-Ice platforms.
USB100v2 Features
High-Speed USB 2.0 (480Mb/s) HosI hIerIace.
Power SIaIus LED.
SupporIed Devices:
TMS320C28 High PerIormahce 32-biI cohIrollers
TMS320C54 Power-EIIciehI DSPs
TMS320C55 Fied-poihI DSPs
TMS320C674 Low Power DSPs
TMS320C645 DSPs
TMS320C64+ High PerIormahce DSPs
APM CorIe M3 (how ihcludes SIellaris!)
APM CorIe P4
APM CorIe A8 & APM9'
hIegra DSP+APM Processor
DaVihci' (hoI ihcludihg DM64)
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CONTACT INFORMATION
Blackhawk
123 Gaither Drive
USA
856-866-1100 Fax
Blackhawk
123 Gaither Drive
USA
856-866-1100 Fax
Blackhawk
Bi-Color SIaIus LED (red/greeh)
Full CCSIudio DE compaIibiliIy
Drivers are provided Ior Wihdows XP, VisIa ahd
Windows 7 including 64-bit support
All driver updaIes are available Ior dowhload IreeoI-
charge from our website
CompaIibiliIy wiIh Ihe CCSIudio Flashburh plugih
and Blackhawk FlashBurn Utility add-on
Free Iechhical supporI ahd web dowhloads
Ohe Year WarrahIy
AuIo-sehsihg low /O volIage supporI
20-pih cT (compacI T) JTAG Header CohhecIor
Fully assembled ahd IesIed ih Ihe US
PoHS CompliahI
AVAILABILITY
APPLICATION AREAS
Wireless XDS510 JTAG Emulator
The Blackhawk USB510W is the rst of its kind wireless JTAG
emulator for Texas Instruments DSPs. The USB510W has an
embedded 802.11 wireless transceiver and requires no hard
connection to a PC in order to debug using Code Composer
Studio. The major benet of this capability is to completely
isolate the PC from the target therefore eliminating the
chance for high-voltage damage of test components. This
protects the target board, PC and emulator from voltage
spikes and the absence of a common ground plane.
Conguration of the USB510W is accomplished via the
USB port in the same fashion as setting up a wireless
router. Or, the USB510W can be used wirelessly right out
of the box using the default settings suitable for most
wi networks. And of course, the USB510W can also be
used for debugging via the high-speed USB port.
The integrated wireless transceiver chip of the USB510W
is capable of supporting the following wireless protocols
and speeds:
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, & 65 Mbps
802.11ag: 6, 9, 12, 18, 24, 36, 48, & 54 Mbps
802.11b: 1, 2, 5.5, & 11 Mbps
Blackhawk is a recognized leader in providing advanced
JTAG Emulators for Texas Instruments DSPs and the
rst company to develop a USB JTAG Emulator for TI
TMS320 DSPs. Our XDS510-class emulators & con-
trollers provide a full range of features and benets with
support for a wide-range of TI DSPs. Blackhawk XDS510-
class JTAG Emulators & Controllers are also compatible
with Code Composer Studio Flash-burner utility.
USB510W Features
Wireless 802.11 XDS510'-class CohIroller
SupporIs T TMS320' DigiIal Sighal Processors:
C2000' High PerIormahce 32-biI cohIrollers
C5000' Power-EIIiciehI DSPs
C6000' FloaIihg-poihI DSPs
C6000' High PerIormahce DSPs
TMS470 (APM)
TMS570LS APM CorIe'-P4
SIellaris 32-biI APM CorIe-M3
SiIara' APM CorIe' A8 & APM9'
OMAP'
C6-hIegra DSP+ARM
1.8/3.3/5.0 volI device /O supporI.
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CONTACT INFORMATION
Blackhawk
123 Gaither Drive
USA
856-866-1100 Fax
Blackhawk
123 Gaither Drive
USA
856-866-1100 Fax
Blackhawk
SupporIs T Embedded Processors:
C2000' 32-biI Peal-Iime MCUs
C5000' Low Power, Fied PoihI DSPs
C6000' High PerIormahce & FloaIihg-poihI DSPs
TMS470' (APM7), TMS570' (APM CorIe P4)
OMAP', SiIara' APM CorIe A8 & APM9'
SIellaris' (CorIe M3)
C6-hIegra' DSP+APM Processors
AVAILABILITY
APPLICATION AREAS
Audio, Automotive, Motor Control, Communications,
Military, Telecom, Telecom Infrastructure, Industrial,
Telephony, Video Conferencing, Video Security, Video
and Imaging, Wireless.
XDS560v2 System Trace
The Blackhawk XDS560v2 System Trace Emulator
(BH560v2) is based on the new Texas Instruments
XDS560v2 JTAG emulator reference design (XDS560v2).
The XDS560v2 design is the next-generation of the
high-performance XDS560-class technology rst made
available by Blackhawk with the USB560/LAN560 and
XDS560 Trace. The XDS560v2 design includes both
high-speed USB 2.0 and 10/100Mbit Ethernet host inter-
faces, multi-color state and activity LEDs and a exible
ribbon-ized coax JTAG cable. The XDS560v2 adds sup-
port for IEEE1149.7 and the system trace module (STM),
an inter-face on the TI heterogeneous multi-core (ARM
+ DSP) devices. If you are familiar with the Blackhawk
LAN560 product, you will already be familiar with this
new design.
The BH560v2 meets all of the TI XDS560v2 reference
design features and requirements and extends (improves)
capabilities by offering the following enhanced features:
POWER: This is the first and most important feature
enhancement. The BH560v2 has the option to be
powered from either the USB or POE (power over
Ethernet) connectors. Yes, the unit can be powered
solely from the USB; a great feature for you road
warriors. And for LAN operation, the BH560v2
offers an 802.11af POE connector that can be pow-
ered from a POE enabled switch or available POE
injector supply.
INDICATORS: We also added dedicated power and
USB activity LEDs, which are found on the current
Blackhawk USB560m and LAN560 models.
CONFIGURATION & TEST: The BH560v2 includes
a graphical user interface application that allows
users to find, update, configure and test Bh560v2
devices on the local area network (LAN). You can
even name the units, configure DHCP or fixed IP
and more.
XDS560v2 Features
High-speed USB 2.0(480Mb/s) porI
10/100 EIherheI porI
Powered via USB or PoE
MulIi-colored sIaIe ahd sIaIus LEDs
SupporIs EEE1149.7
SupporIs SysIem Trace Module (STM) oh heIero-
geneous multi-core ARM+DSP devices
LNUX SupporI uhder CCSIudio v5
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CONTACT INFORMATION
Kane Computing Ltd
Kane Computing Ltd
Suite I, Ascot Court,
71-73 Middlewich Road
Northwich, Cheshire CW9 7BP
UK
01606 351006 Telephone
01606 351007 Fax
sales@kanecomputing.com
www.kanecomputing.co.uk
Many years of industrial experience of DSPs and
signal/video processing.
TI-trained engineers with the widest range of DSP
development tools in the UK.
UK Distributor/Agent for a wide range of TI 3rd party
products.
Application Areas: Audio, Automotive, Broadband
Solutions, Communications, Imaging, Industrial,
Military, Motor Control, Optical Networking, Telecom,
Telephony, Broadcast, Video,
Video Infrastructure, Wireless.
Kane Computing Company Profle
Supported TI Processors: DM64x, OMAP35x, DM81xx, C6A816x,
C5xxx, C67xx, C64xx, MSP430, C2xxx and DM3xx.
Kane Computing supply cost effective and reliable DSP
solutions to match the users needs. We have the widest
range of DSP development tools, hardware and soft-
ware, in the UK and we have an intimate knowledge of
these products.
Kane Computing also have vast experience in video
and audio processing, particularly for compression,
streaming and storage. Kane Computing also works
with a number of members of TIs Third Party Network
who provide hardware platforms, software libraries and
technical resources, to allow Kane Computing to offer
complete packages not available from any other single
source.
TECHNICAL SPECS
Consultants and providers of DSP Development
Tools, hardware and software, for the complete
range of TI DSPs.
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Embedded Processing & DSP ONLINE
Explore...
Directory of leading DSP & Embedded Solutions
Top Stories and News
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Expert Opinions (Blogs)
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CONTACT INFORMATION
Lauterbach Inc.
Lauterbach Inc.
4, Mount Royal Avenue
Marlbourough, MA 01752
USA
++1 508 303 6812 Telephone
++1 508 303 6813 Fax
info_us@lauterbach.com
www.lauterbach.com
TECHNICAL SPECS
Target voltage 0.4V 5.0V
JTAG clock 10kHz 80MHz
Ethernet 1 Gigabit and USB 2.0
Logic analysis and external bus tracing up to 500MHz
AVAILABILITY
TMS320F28x DSPs now TMS320C28x DSPs now
TMS320C54x DSPs now TMS320C55x DSPs now
TMS320C55x+ DSPs now TMS320C62x DSPs now
TMS320C64x DSPs now TMS320C64x+ DSPs now
TMS320C67x DSPs now
More information can be found under http://www.lauter-
bach.com/powertools.html
APPLICATION AREAS
Telecom, Computers & Peripherals, Consumer Elec-
tronics, Industrial, Military, Wireless
TRACE32 PowerTools
DM37x, DM3x, OMAP35x, DM814x, DM816x, OMAPL1x, C6A816x,
C6A814x, C55x, C674x Low Power DSP, C67x DSP, C647x Mul-
ticore DSP, C645x Multicore DSP, C64x DSP, C62x DSP, AM37x,
ARM Cortex-A8 , AM35x ARM Cortex-A8, AM18x ARM9
, AM17x ARM9, F28x Delno Floating-point MCUs, F28x
Piccolo Series, F28x Fixed-point Series, MSP430L092 Series
Low Voltage, MSP430F1xx Series Up to 8 MHz, MSP430G2xx
Value Series Up to 16 MHz, MSP430F2xx Series Up to 16 MHz,
to 20 MHz, 1000 Series, 2000 Series, 3000 Series, 5000 Series,
6000 Series, 8000 Series, 9000 Series, X00 Series
TRACE32 provides a complete set of development and
testing tools. The advanced modularity of TRACE32-
PowerTools allows the user to extend the debugger
with a trace extension. TRACE32 works with the highest
variety of host interfaces. The communication link to the
host is done by USB or Ethernet allowing a high-speed
transfer. It is possible to share a TRACE32 in a LAN of PCs
and workstations. TRACE32 also supports multi-core
debugging when e.g. a TMS320C55x ultra-low signal
processor is combined with other cores (e.g. ARM in
OMAP processor-based devices).
TRACE32-PowerTools are controlled by TRACE32-Power-
View, the powerful IDE allowing HLL debugging on C
or C++ level. It works together with all third party com-
pilers. It allows unlimited software breakpoints, but also
supports the on-chip hardware break- and watchpoints.
A ash programming utility is included. The comfortable
windowed GUI is completely congurable by the user,
no other system offers more exibility.
TRACE32 supports more than 600 microprocessors.
FEATURES & BENEFITS
FLASH programming
Full support for on-chip breakpoints
Real-time trace, trigger and benchmarking
Multicore debugging
External trigger
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CONTACT INFORMATION
Unit 1201, Pan-pacifc
Plaza, No.12A, South Street
Zhongguancun, Haidian District,
Beijing
info@seeddsp.com
www.seeddsp.com/eng
SYSTEM REQUIREMENT
Software Enivronment Requirements: Code Com-
poser Studio IDE v4.1.3 or above version
You may need DSP Target Board (EVM, eZdsp,
DSK) from TI or SEED
AVAILABILITY
Available in August, 2011
Ofcial Standard Price: 1280USD
APPLICATION AREAS
tronics, Industrial, Medical, Military, Security, Video and
Imaging, Wireless
SEED-XDS560v2
A8 ARM 9 Microprocessor: AM37x ARM Cortex-A8 ,
AM35x ARM Cortex-A8, AM389x ARM Cortex-A8 , AM18x
ARM9, AM17x ARM9
Supported DaVinci Processors: DM646x, DM644x, DM643x,
DM64x, DM37x, DM3x, OMAP35x, DM814x, DM816x
Supported Integra DSP+ARM processors: OMAPL1x proces-
sors, C6A816x, C6A814x
Supported C2000 MCUs: F28M35x Concerto Series, F28x
Delno Floating-point MCU, F28x Piccolo Integrated Circuits,
F28x Fixed-point Series
Supported Stellaris ARM Cortex-M3-based MCUs: 1000
Series, 2000 Series, 3000 Series, 5000 Series, 6000 Series, 8000
Series, 9000 Series, X00 Series
C5000 DSPs: C55x
C6000 DSPs: C674x Low Power DSP, C67x DSP, C647x Multicore
DSP, C645x Multicore DSP, C66x Multicore DSPs , C64x DSP, C62x
DSP
M SP430 MCUs: MSP430L092 Series Low Voltage, MSP-
430F1xx Series Up to 8 MHz, MSP430G2xx Value Series Up
to 16 MHz, MSP430F2xx Series Up to 16 MHz, MSP430AFE2xx
Series Up to 12 MHz, MSP430F4xx Series Up to 8 or 16 MHz,
MSP430F5xx/F6xx Series Up to 25 MHz, MSP430FR57xx FRAM
Series Up to 8 or 24 MHz, CC430 Series Up to 20 MHz
SEED-XDS560v2 is the newest generation JTAG Emu-
lator with system trace function, supporting multi-core
DSP debugging, and the newest TI Netra platform. It
has two kinds of emulation function: USB2.0 High speed
(480MB/S) and Ethernet RJ45 (10/100M).
SEED-XDS560v2 is fully compatible with TI XDS560v2
technology
It supports CCSv4.1.3 and versions above, suitable for
all the platformance classes of TI including DM816x,
DaVinci processors, digital media processors and C66x
multicore DSPs.
SEED-XDS560v2 is able to debug many DSPs at the
same time.
FEATURES & BENEFITS
Support traditional JTAG protocol IEEE 1149.1 and
IEEE 1149.7;
Support high speed USB2.0 and 10/100Mbit Ethernet
host interface
Support System Trace ; Unique MAC address;
Congurable IP addresses
Support CCS4.1.3 and versions above; Support
Windows XP/Vista/Win7/Linux
High-speed anti-interference emulation cables; Sup-
port JTAG from +1.2 to +4.1 V
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For more
information on
becoming an exhibitor,
please contact:
J. Spargo & Associates, Inc.
at milcom@jspargo.com or 703-631-6200
Conrmed
speakers include:
GEN Ann E. Dunwoody, USA
Commanding General
U.S. Army Materiel Command
LTG Susan S. Lawrence, USA
Chief Information Ofcer/G-6
U.S. Army
Invited:
Lt Gen (Sel) Charles R. Davis, USAF
Commander-Designate
Electronic Systems Center
Air Force Materiel Command
Lt Gen Ellen M. Pawlikowski, USAF
Commander
Space and Missile Systems Center
Air Force Space Command
Networks...Attaining the Value
Baltimore Convention Center
Baltimore, MD
Nov. 710, 2011
www.milcom.org
Registration
now open
www.milcom.org
early bird rates | technical program | conference agenda
Proud to host MILCOM 2011
CONTACT INFORMATION
Signum Systems
Signum Systems Corp
1211 Flynn Rd., #104
Camarillo, CA 93012
USA
805 383 3682 Telephone
805 383 3685 Fax
sales@signum.com
www.signum.com
TECHNICAL SPECS
Supports ARM7, ARM9, ARM11, Cortex-M0/M3/R4/
A8/A9 devices from all manufacturers
Supports C2000, C5000, C6000, TMS470, TMS570,
Stellaris technology, OMAP, OMAP3, DM, DaVinci
and Sitara devices
High-speed USB 2.0 port (480Mbps) allows super
fast RAM downloads and Flash programming
ETM trace clock of up to 200MHz allows debugging
devices running at over 1GHz
AVAILABILITY
Now
APPLICATION AREAS
Imaging, Wireless
JTAGjet In-Circuit Debuggers for DSP,
OMAP and DaVinci Processors
DM355, OMAP35x, F283x, F282x, F281x, F280x, LF240x, C55x, C54x,
C672x, C67x, C645x, C6414T/15T/16T, C642x, C6410/12/13/18, C62x,
TMS470, TMS570, Stellaris Cortex-M3, Sitara AM37x, AM35x,
AM18x, AM17x
JTAGjet is a USB 2.0 based In-Circuit Debugger
designed to support all ARM cores from ARM7 to
Cortex-A9 as well as all current TI DSP, OMAP and
DaVinci processors. JTAGjet comes with a multi-
core Chameleon Debugger for ARM but it can also be
used with a variety of 3rd party debuggers from ARM
Ltd., Keil, IAR, GHS, Freescale, Texas Instruments,
Mentor Graphics, Eclipse, GNU and others. When
used with Chameleon debugger, JTAGjet features ETM
& ETB real-time trace, Serial Wire Debugging (SWD),
integrated Flash programming, code proling, timing
analysis and complex triggering events making the
debugging process faster and easier.
One of the unique JTAGjet features is that it may be
used concurrently with other debuggers (like TI Code
Composer Studio IDE or eSOL eBinder) offering a
complete multi-core debug environment that uses dif-
ferent RTOSes for different cores.
FEATURES & BENEFITS
Supports all ARM, Cortex, TI DSP, OMAP and
DaVinci processors for a long laboratory life span
Available with ETM and/or ETB real-time trace
for quicker, more efcient debugging with timing
analysis
Multi-core support on single and multiple JTAG
chains
Compatible with all major ARM and DSP debuggers
Integrated GUI and batch mode Flash programming
Real-time trace history of program execution and
variables along with CPU cycle-accurate timing
helps to locate even the most elusive bugs
Embedded Linux support speeds-up uBoot, Linux
kernel, kernel modules, peripheral drivers and
application debugging
Coverage Analysis (ARM and Cortex cores only
requires ETM)
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56 Embedded Software Embedded Processing & DSP Resource Guide 2012
CONTACT INFORMATION
525 Plymouth Road
Suite316
Plymouth Meeting, Pennsylvania
19462
USA
1-800-340-2066 Toll Free
610-825-0182 x120 Telephone
sales@adaptivedigital.com
www.adaptivedigital.com
G.PAK enables developers to implement high-density,
multi-channel, voice-over-packet applications in the
shortest possible time with maximum processing
performance.
G.PAK is a built to order, voice over packet soft-
ware solution. Spend your engineering resources on
features that differentiate your product.
A video demonstration of the G.PAK build process can
be found on Adaptive Digitals web site at http://www.
adaptivedigital.com/video_training/GPAK/GPAK.htm.
White Paper G.PAK-C6472: A Rapid Way to Build
High Density Voice Solutions available for down-
load. http://www.adaptivedigital.com/gpak-6472.htm
AVAILABILITY
Available now
APPLICATION AREAS
Broadband, Communications & Telecom, Consumer Elec-
tronics, Industrial, Medical, Military, Security, Wireless
G.PAK: A Rapid Way to Build
Integration-Ready High Density
Turnkey Voice Solutions
Supported TI Processors: C641x, C642x, C674x, C647x, and
OMAP DSP
Adaptive Digitals G.PAK DSP software solutions address
the need for high-density, VoIP, and traditional telecom-
munications applications. Available applications include
VoIP gateway, AT&T-certied G.168 echo cancellation, con-
ferencing, and transcoding. The DSP solution is turnkey,
and includes host API software to simplify the process of
integrating a host processor with the DSP applications.
G.PAK is a congurable VoIP DSP application that provides
exibility while maintaining a high degree of integra-
tion. Although Adaptive Digital provides pre-built G.PAK
software images for common applications, it can easily
be customized to a particular applications requirements.
G.PAK is scalable with build time congurable plug in
items such as: vocoders, voice enhancement algorithms
and channels types. This scalability allows creation of
custom DSP images that provide optimal channel densi-
ties suitable for most telephony applications.
G.PAK can be congured to include only the necessary
algorithms, channel congurations, and interfaces. And
if G.PAKs built-in exibility is not enough, source code
can be licensed.
FEATURES & BENEFITS
The VoIP DSP software includes all the DSP function-
ality necessary for most VoIP applications from IP
gateways to IP phones including Adaptive Digitals
patented, AT&T certied G.168 echo canceller.
VOICE PROCESSING FUNTIONS INCLUDE: G.168, AEC,
Conferencing, DTMF, Tone Detect/Generate/Relay, AGC,
VAD/CNG, T.38, G.711, G.728, G.729AB, G.723.1, G.726,
AMR-NB, G.722.2 (AMR-WB), & Noise Suppression.
G.PAK supports several channel types: TDM to Packet,
PCM to TDM, Packet to Packet, TDM to Conference,
Packet to Conference, and Conference Composite.
Each channel can be dynamically set up at run time to
use any of the functions selected at build time. G.168 can
be congured to operate on PCM and/or Packet data.
The combination of TIs High Density DSPs and
Adaptive Digitals eld-tested algorithms and G.PAK
framework provide a solid foundation for the develop-
ment of high-quality, differentiated telecom products.
Host processor
Your Application Code
G.PAK API
Boot, Configure, Read/Write Packets, etc.
Host DSP Driver
G.PAK Application Software
DSP HPI or Ethernet
Serial Port(s)
G.PAK Application Software
Control / Status
Packet Data
G.PAK Application Block Diagram
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www.eecataIog.com/dsp Embedded Software 57
CONTACT INFORMATION
525 Plymouth Road
Suite316
19462
USA
1-800-340-2066 Toll Free
610-825-0182 x120 Telephone
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Each packet channel can be congured at run time.
Each of the PCM channels provides a tone generator.
The provided acoustic echo canceller (AEC), voice
activity detector (VAD), and automatic gain control
(AGC) are run-time congurable on the Handset or
Speakerphone channels.
AGC and VAD work together with the AEC to get the
enhance voice quality.
All of the functionality needed for the TNETV105x
Wideband IP Phone is provided in the G.PAK frame-
work.
Expandable Solution supporting next generation IP
phone applications.
The TNETV105x Wideband IP Phone leverages both
TI C55x DSP technology and Adaptive Digitals best-
in-class, eld proven DSP algorithms.
Should modications be necessary for your project,
customization and/or source code is available.
AVAILABILITY
Available now
APPLICATION AREAS
Wideband IP Phone
Solution - TNETV105x
Supported TI Processors: C55x
Adaptive Digitals Wideband IP Phone software runs on
the TI TNETV105x family of VoIP phone chips.
The TNETV1050/1055 is a communications processor
based on a MIPS32 RISC processor along with a C55x
DSP. This device, which has a rich peripheral set archi-
tected specically for IP Phone applications, keeps BOM
cost to a minimum and reduces the time and complexity
associated with developing an IP Phone. Combined with
Adaptive Digital IP Phone software, the TNETV1050/1055
provides a complete hardware/software solution capable
of reducing system design cycle times.
The Wideband IP Phone product provides the functionality
required for todays executive enterprise desktop speaker-
phones. It includes acoustic echo cancellation for full duplex
speakerphone capability support for three-way conferencing
and support for low bit rate and wideband codecs.
Adaptive Digitals VoIP Software provides an efcient
framework for real-time voice processing that has been
pre-integrated and rigorously tested.
This Wideband IP Phone DSP software has following soft-
ware features on the phone:
Widebahd Audio SupporI (16Khz PCM samplihg
rate and sampling rate conversion when interfacing
to NB paths)
G.711 wiIh appehdi 1(PackeI Loss CohcealmehI (PLC)
G.722 wiIh PLC
G.729 AB
AcousIic Echo Cahceller (WB 16Khz)
CohIerehcihg
AuIomaIic Gaih CohIrol (AGC)
Tohe GeheraIe
EqualizaIioh
VOE SoIIware
DiaghosIics recordihg
Adaptive Digital may add optional features according to
the customers request.
FEATURES & BENEFITS
Wideband Audio Support (16Khz PCM sampling rate
and sampling rate conversion when interfacing to
narrowband paths)
2 PCM channels and 5 packet channels: the Primary, 2
Conference channels, Paging, and Ringtone channels.
MIPS Processor
Phone Application
MIPS Processor
HOST API
C55X Core
Adaptive Digital Software
DMA
I-Cache
Serial Port
McBSP(s)
CODEC
Handset Speaker/MIC
Ethernet
MAC/PHY/Switch
TNETV105x
SOFTWAREFEATURES
G.711
G.711 Appendices 1 and 2
G.729A
G.729AB
G.722 (Wideband Voice)
Acoustic Echo Cancellation
Noise Reduction
AGC
RTP payload packetization
5 packet channels for phone,
conference, and/or intercom
Tone Generation
Conferencing
Volume control
Caller ID
Mute control
Handset port and
Speakerphone port
LEDS
Keypad
Switches
SDRAM
MIPS Application
DSP Program
Captured Data
PhoneApplication
Software:
User interface,
Phone control,
Network interface
Protocol processing
IP NETWORK
SOFTWAREFEATURES
G.711
G.711 Appendices 1 and 2
G.729A
G.729AB
G.722 (Wideband Voice)
Acoustic Echo Cancellation
Noise Reduction
AGC
RTP payload packetization
5 packet channels for phone,
conference, and/or intercom
Tone Generation
Conferencing
Volume control
Caller ID
Mute control
Handset port and
Speakerphone port
CONTACT INFORMATION
525 Plymouth Road
Suite316
19462
USA
1-800-340-2066 Toll Free
610-825-0182 x120 Telephone
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FEATURES & BENEFITS
The VoIP Intercom ISS features three modes of RTP
connectivity; point-point (full-duplex), point-to-
multipoint (half-duplex), and broadcast (half-duplex).
The VoIP software includes Adaptive Digitals Gen-4
Acoustic Echo cancellation, which incorporates a noise
reduction feature, as well as anti-howling, nonlinear
processing, and double-talk detection.
VOICE PROCESSING FUNTIONS INCLUDE: Digital
Gain Control, Noise Reduction, Vad/CNG, RTP & Jitter
Buffer, AGC, G.711 u-Law, G.711 a-Law, and G.729AB.
The combination of TIs ARM based processors and
Adaptive Digitals superior algorithms and G.PAK frame-
work, provide a solid foundation for the development of
differentiated next-gen telecom products.
Adaptive Digitals VoIP Intercom ISS enables equip-
ment manufacturers to develop products quickly and
cost-effectively.
Should modications be necessary for your project,
customization is available.
AVAILABILITY
Available now
APPLICATION AREAS
Network Packet-based Intercom
/ IP Phone Software Subsystem
(ISS) for OMAP35x, and
DaVinci DM814x Devices
Supported TI Processors: OMAP35x, DM814x
Adaptive Digitals ISS software subsystem simplies
software design of an IP intercom or IP phone that runs
on both TIs ARM-based OMAP3530 processor, and
DaVinci DM814x devices. ISS implements complete
VoIP capability all the way from PCM to Packet and back.
This includes a process running on the ARM under Linux
as well as the necessary voice-processing running on the
DSP core.
A users application, co-resident on the ARM, can set up
and tear down VoIP channels via the ISS API. The ISS soft-
ware takes care of everything else.
The intercom system utilizes a TCP/IP client-server model
for status and control
The API functions running on the client-side of the inter-
face format messages that are sent over a connected
socket to the server. The server side of the interface
responds to these messages by calling the appropriate
G.PAK API functions, which in turn, control the DSP. Sub-
sequent status messages are returned to the client.
The server software runs as a Linux process on the SOCs
ARM processor core. In addition to supporting client mes-
sages, the server process is responsible for booting and
downloading the DSP portion of the SOC device, control-
ling the DSPs operation, and the timely transfer of RTP
packets between the network stack and the DSP software.
About G.PAK:
G.PAK is a voice-over-packet DSP software solution that
turns a DSP into an easily controlled voice-over-packet
engine. G.PAK integrates the building blocks required in
voice-over-packet systems into a turnkey solution.
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Intercom
Server
Process
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16-bit Serial
G.PAK DSP
OMAP3530
Linux ARM
OMAP3530
RTP
Call
Processing
Control
Status
Decode
G.711,
G.729
Packet Loss
Concealment
CNG
McBSP2 Tx
Tx Audio Processing
RTP Tx
Audio
Codec
Encode
G.711 Appendices 1 &2, G.729
AGC VAD
McBSP2 Rx
AEC
Far-end Data
Analog Audio
J itter Buffer
Tx Packets
Rx
Tx
Speaker
Microphone
User Application
Note: Your design may vary, image for reference purpose only
OMAP3530 IntercomSystemBlock Diagram
www.eecataIog.com/dsp Embedded Software 59
CONTACT INFORMATION
525 Plymouth Road
Suite316
19462
USA
1-800-340-2066 Toll Free
610-825-0182 x120 Telephone
Optional Software Features: Voice Quality Enhance-
ment: Noise Reduction; Voice codecs: G.726, AMR WB
G.722.2 (Wideband), AMR NB (Narrowband), EVRC-B,
MELP; Protocol stacks: SIP.
By leveraging VoIP Engine, developers can focus on the
functionality of the end application without dealing with
the complexities of voice processing at the native layer.
Enables VoIP application development strictly at the
Java layer.
Adaptive Digital provides customers with expertise in
integration and development to enable differentiation
of their next gen mobile application.
Adaptive Digital brings 17 years of voice/VoIP technology
experience to the mobile digital device market.
AVAILABILITY
Available now
APPLICATION AREAS
VoIP Engine for Android/
ARM Driving Next Gen Mobile
IP Voice Applications
Supported TI Processors: OMAP35x, DM814x
Adaptive Digitals VoIP Engine for the Android/ARM is a
software package that handles the processing needed to
transform PCM samples to VoIP packets and VoIP packets
to PCM samples. In other words, it provides all the voice
processing necessary to VoIP-enable an Android/ARM
application.
The core of VoIP Engine is an Android native-layer library
that includes a complete suite of Adaptive Digitals eld-
proven telephony, VoIP, and voice quality enhancement
algorithms that enable developers to create toll-quality
next generation mobile applications for Android/ARM
users.
Todays mobile phone applications include an extraor-
dinary amount of functionality. In the Android space in
particular, writing software at the native layer is difcult
not only due to the complexity of Android but also due
to the anarchistic nature of open-source software in gen-
eral. The best-case scenario for a developer is therefore
to work at the Java layer. But for performance reasons,
much functionality needs to run at the native layer.
To make mobile phone application development manage-
able, developers have many development kits at their
ngertips to handle the native layer complexity. Adaptive
Digitals VoIP Engine brings the necessary VoIP function-
ality to the native layer. All the developer needs to do is
access the VoIP engine using a simple API, and package
the supplied VoIP Engine with the end user Android appli-
cation.
FEATURES & BENEFITS
VoIP Engine is supplied with a sample Java applica-
tion and a sample native application that in turn
interfaces with the VoIP Engine software.
The sample Java application interfaces with the sample
native application via Java Native Interface (JNI) to
setup an RTP/IP to RTP/IP VoIP connection.
Android developers can incorporate the Java sample
code into more complete VoIP-enabled Android
applications.
Included Software Voice Quality: AEC, AGC; Network
Optimization: Adaptive Jitter Buffer, PLC (G.711
Appendix 1); Compression: G.711 Appendix 2, G.722
(wideband), G.729 AB; Protocol: RTP, SRTP; Telephony:
Tone Generation.
A p p l i ca t i o ns
ApplicationFramework
SIP
Libraries
Android Runtime
Network Driver
Network
Audio Driver Audio
Ja v a
La yer
Native
Layer
IP
Stack
VoIP
Engine
Audio
Flinger
Android VoIP Architecture
Vocoders
AEC
RTP
VQE
Tone
SRTP
Phone App
L i n u x K e r n e l
- Adaptive Digital Algorithms
Core Libraries
Dalvik Virtual
Machine
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CONTACT INFORMATION
260 Bear Hill Rd
Suite 101
Waltham, MA 02451
USA
781-890-2055 Fax
info@delcomsys.com
www.delcomsys.com
A5/1, A5/2, and A5/3 ciphering support.
Includes support for detection of neighboring cells
for femtocell and custom applications.
AVAILABILITY
Available now.
APPLICATION AREAS
Broadband, Communications & Telecom, Consumer
Electronics, Industrial, Military, Security, Wireless
GSM/EGPRS/EDGE LayerONE
Physical Layer Software
DM37x, DM3x, OMAP35x, DM814x, DM816x, OMAPL1x, C6A816x,
C6A814x, C55x, C674x Low Power DSP, C67x DSP, C647x Multi-
core DSP, C645x Multicore DSP, C66x Multicore DSPs , C64x DSP,
C62x DSP, AM37x ARM Cortex-A8 , AM35x ARM Cortex-
A8, AM389x ARM Cortex-A8 , AM18x ARM9 , AM17x
ARM9
DelComs GSM LayerONE is a turnkey 2.75G physical layer
solution based on software-dened radio (SDR). Designed
with ease of integration in mind, the software framework
allows for rapid product development without the need for
expertise in the intricacies of modulation, channel coding,
interleaving, and physical channel multiplexing. Clean and
concise Layer 2, Layer 3, and base-band interfaces and
extensive logging capabilities make integration a snap.
Available for a variety of processors including TIs OMAP
processors, DaVinci digital processors, TCI, Faraday, and

TMS320C6000, and TMS320C5000 DSPs. DelComs
LayerONE physical layer framework offers the scalability
and exibility only a software solution can provide.
FEATURES & BENEFITS
Portable to almost any commercially available DSP,
general-purpose processor, or proprietary core with
customizable interfaces to drop into your existing
design or network stack.
Perfect for femtocell and picocell applications as well
as standard BTS designs.
Ideal for use in specialty applications such as point-
of-sale devices, test and measurement equipment,
proprietary modems, network load monitors, IMSI/
IMEI catchers, and lawful call interceptors (SIGINT).
Extensive built-in test functionality and L3, L2, and
base-band logging capabilities simplify integration
and hardware qualication.
Flexible terms including full source code licenses
are available to qualied customers. All core library
modules for both MS and BTS devices including the
GMSK and 8PSK (EDGE) equalizers are also available
for license individually.
TECHNICAL SPECS
Circuit-switched trafc modes include TCH/FS, TCH/
EFS, TCH/AFS, TCH/WFS, TCH/HS, TCH/AHS, TCH/
F14.4, TCH/F9.6, TCH/F4.8, and TCH/F2.4.
Packet-switched trafc modes include GPRS CS-1
through 4 and EDGE/EGPRS MCS-1 through 9.
Automatic system information message scheduling
and transmission.
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CONTACT INFORMATION
VTI Technologies Oy
VTI Technologies Oy
P.O.Box 27
Vantaa, 01621
Finland
+358 9 879 181 Telephone
sales@vtitechnologies.com
www.vtitechnologies.com
TECHNICAL SPECS
2.5 V - 3.6 V supply voltage, down to 1.6 V IO-voltage
2000 dps measurement range
5 mA active current consumption, sub-1 uA in power
down
Digital IC and SPI interfaces
-40C to +85C temperature range
APPLICATION AREAS
Communications & Telecom, Computers & Peripherals,
Consumer Electronics, Industrial, Wireless
CMR3000, 3-axis low power gyro
for user interface applications
Supported TI Processors: OMAP35x, MSP430L092 Series Low
Voltage, MSP430F1xx Series Up to 8 MHz, MSP430G2xx Value
Series Up to 16 MHz, MSP430F2xx Series Up to 16 MHz,
to 20 MHz
CMR3000 3-axis gyro is designed for user interface
applications in gaming, remotes, tablet PCs and mobile
phones. Industrys smallest digital output 3-axis gyro
and lowest power consumption help designers to inno-
vate with less constrains.
CMR3000-D01 with digital SPI and I2C interfaces is opti-
mised for systems requiring small size and low power.
The low 5 mA current consumption is enhanced with a
power save feature. In duty cycled operation, further cur-
rent consumption reductions of tens of percent can be
achieved. It has two user selectable frequency responses
optimised for user interface applications. Interrupt signal
can be triggered by data ready.
Markets and applications include:
Mobile phohes ahd mobile hIerheI devices
Game cohIrollers ahd compuIer peripherals
PemoIe cohIrollers
MoIioh ahalysis ih sporIs
User ihIerIace
GesIure recoghiIioh
Sehsor Iusioh
AugmehIed realiIy
PedesIriah havigaIioh
FEATURES & BENEFITS
Smallest digital output gyro component and solution
size makes it ideal for mobile devices
Good stability in real life environments ensures full
performance over the product life time
Lowest current consumption maximizes battery life
time
High shock durability
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9
th
International System-on-Chip (SoC)
Conference, Exhibit & Workshops
November 2 & 3, 2011 Radisson Hotel Newport Beach
www.SoCconference.com
Special 2011 Pricing to Support the Tech Community!
Dont Miss Out!
The Most I nformative, State- of- the- Art, and Affordably Priced Chip Design Conference of the Year!
Platinum Sponsors
Table-Top Exhibit (Free Passes)
3-D ICs
Analog & Mixed-Signal Designs
Green Chips
SoC Design & Verification
MEMS-Based SoCs
20nm Design Challenges & EDA
Customizable SoCs - FPGAs
IEEE Student Design Contest
Multicore Software Development
Many Door Prizes
SOI vs. CMOS
4G SoC Innovations
Multicore SoC Platforms
CPU/DSP Cores
Network-on-Chips (NoCs)
Informative Panels
Emerging IP Blocks
IEEE OC Job Fair
Technical Workshops
Networking Opportunities
And Much More. . .
Keynote Speakers
Yale University
Dr. Eugenio Culurciello.
Microsemi
Paul Pickle, Senior Vice President,
Integrated Circuit Group.
Johns Hopkins University
Dr. Ralph Etienne-Cummings.
Selected Participating Companies, Universities & Organizations
For More Information or Questions, Please Contact the SoC Conference Organizing Committee at:
SoC@SoCconference.com or (949) 851-1714
www.SavantCompany.com & www.SoCconference.com
www.eecataIog.com/dsp End-Equipment SoIutions 63
CONTACT INFORMATION
Z3 Technology
Z3 Technology
4701 Innovation Drive
Suite CB103
Lincoln, Nebraska 68521
USA
+1.402.323.0702 Telephone
+1.801.697.6829 Fax
sales@z3technology.com
www.z3technology.com
TECHNICAL SPECS
Compact Size: 88mm x 108mm or I/O connector-less
version 68mm x 108mm
512 MB (-0X) and 1GB DDR3 (-2X), 256MB Flash
SATA, Gigabit Ethernet, 2x USB 2.0, 12V Power,
RS-232 serial interface
HDMI, YPbPr and Composite Video Out
UBL, Linux 2.6, u-boot, root-le system, NAND boot,
tool chain, ash programming tool
AVAILABILITY
The Z3-DM8168-MOD is currently available. Please con-
tact sales@z3technology.com for more details or visit us
on the web at www.z3technology.com
APPLICATION AREAS
Imaging, Wireless
High Performance Multi-
Channel 1080p60 HD Module
Supported TI Processors: DM816x
Z3 Technologys Z3-DM8168-MOD module is built based
on the powerful DM816x high-performance digital media
processors; part of the DaVinci processor family. The
on-chip ARM and DSP cores plus dedicated video
and graphic accelerators enable advanced multimedia
functionality, intuitive user interfaces with cutting-edge
displays, and analytics capabilities.
The Z3-DM8168-MOD is a compact OEM-ready system-
on-module, supporting H.264 codec at up to two channels
of 1080p at 60 fps (frames per second) encode or decode
(stream or storage). It features a unique expansion inter-
face comprised of ve high density connectors providing
access to the vast majority of interface signals available
from the DM8168 DaVinci digital media processor. Its
versatile design allows the system designer to focus on
the end application, with condence that the Z3-DM8168-
MOD will handle all audio and video media operations
required with little or no additional engineering effort.
The Z3-DM8168-MOD is designed for applications such
as real time transcoding, broadcast video encoding and
decoding, digital signage and video kiosks, medical and
industrial video, video conference terminal and MCU and
high denition embedded video sub-systems. Whether
the end application requires encode or decode media
from storage or stream, the OEM-ready Z3-DM8168-
MOD will simplify the overall system design, reducing
time to market and costs.
FEATURES & BENEFITS
OEM-ready HD multimedia module based on the
DM8168 high performance multimedia DaVinci
digital media processor
Ready-to-run software executables for encode and
stream, decode from stream, encode to storage and
decode from storage. Supports H.264 multi-channel
in all video resolutions from QCIF to 1080p60
In conjunction with Z3-DM8168-APP application
board, the Z3-DM8168-MOD can support 2x HDMI
input (up to 1080p60 with embedded audio), 2x
analog component inputs (up to 1080i), 2x analog
stereo audio
Complete Linux OS, multimedia software and SDK
available for application development and system
integration.
Supports open-source Linux 2.6 and OpenMAX
multimedia framework
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64 Engineering Services Embedded Processing & DSP Resource Guide 2012
CONTACT INFORMATION
Micross Components
Micross Components
7725 N. Orange Blossom Trail
Orlando, FL 32810
USA
407.290.0164 Fax
sales.americas@micross.com
www.micross.com
FEATURES & BENEFITS
Bare die made available to customer specications,
and custom packages smaller than those offered by
the manufacturer.
Extensive array of post wafer fabrication processing
options insures that whether die is used in a wire bond
or ip chip application, product is inspected, tested
and packaged to customer requirements.
Chip Scale Packaging (CSP) is slightly larger than bare
die but offers a reduced size and weight alternative to
the standard packaged part, while maintaining the ease
of handling associated with the standard package part.
Wide range of alternate interconnect possibilities
utilizing smallest form factors available for next
generation builds or new product designs.
AVAILABILITY
Die and packaging solutions from Micross Components
are available now. For more information please refer to
our website at www.micross.com.
APPLICATION AREAS
Communications & Telecom, Industrial, Medical, Military,
Security, Video and Imaging, Wireless
DSP & Microcontroller Die
and Alternative Packaging
Supported TI Processors: DM644x, DM355, F283x, F281x,
C55x, C54x, 674x Low Power DSP, MSP430x1xx, MSP430x2xx,
MSP430x3xx, MSP430x4xx
Micross Components enables designers of military, med-
ical, communication, and industrial products to meet their
design goals by offering TIs DSP and MCu products in a
wide range of alternative interconnect solutions.
Die Availability
Micross Components provides the performance of TI prod-
ucts in the smallest form factors available. With our expertise
in handling bare die, and our extensive array of processing
options, we bridge the gap between TIs standard offerings
and the customers design goals. As the smallest form factor
available, die gives engineers the freedom to shrink existing
designs where package parts may currently be used, or
create new products with the smallest footprint possible.
Packaging Solutions
Micross Components packaging solutions are ideal when
OTS products cannot be used or when handling bare die
is not an option. When requirements call for a reduction
in size or weight, additional functionality, or custom fea-
tures, Micross can provide a solution.
Chip Scale Packaging (CSP) is a best t for those seeking
the smallest form factor with ease of handling. Because
our CSPs are designed in-house, features such as package
thickness, leaded or lead-free balls, and signal routing can
be customized. Micross Components currently offers the
following TI microcontrollers as standard products in CSP
(lead free is also available):
MSP430F149
MSP430F169
MSP430FG4618
MSP430FG4619
Multi-Chip Modules provide the advantage of increased
functionality and performance with overall space savings.
By integrating multiple die into a single package, Micross
Components can broaden design options and improve
management of product life-cycles. Micross has con-
tinued success in building two die stack modules using
the same footprint as the OTS monolithic package.
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|me|ctets:
XDS560v2 STM, XDS560v2 STM Traveler,
XDS510USB PLUS, XDS510 USB,
XDS100v2, XDS510USB Galvanic,
XDS510PP PLUS, C2000 XDS510LC,
SPI530 MPSD, JTAG Pin Adapters

0e|eggets:
TI Code Composer Studio
TM
IDE
|vc|ect|eaNe6e|es:
VC5502/VC5505/C5515/C6455/
DM355/DM357/DM365/DM368/
DM642/DM6446/DM6467/
AM1807/AM1808/AM1810

eI6s
TM
,0SKs,0SKsca6eI1I0
DSKs for F2407/VC5416/VC5509A/
VC5510/C6713/C6416T/C6455,
eZdsp for LF2401A/LF2407A/VC33/F2808/
F2812/R2812/F28335/VC5505/C5515/
C5502, eZ470 and OSKs for OMAP-L137
SeItwcteIee|s:
C compilers, assemblers, linkers
FLASH Programming Utilities
k||tct|eaSeItwcte
eCAN Stack, Enet Stack, Algorithm Wizard,
CodeBox
TM
C Library, NEXTPlay
TM
DSP Software
Beea6ctyStcaIestSeItwcte:
Temento DiaTem Debugger for TI DSPs
N|ste||caeees:
Digital Motor Controllers, Prototype Modules,
Power Supplies, JTAG Expander
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8/01/11
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SPECTRUM DIGITAL
SOLUTION
SPECTRUM DIGITAL
SOLUTION
One Source For High
Performance TI DSP
Development Tools
One Source For High
Performance TI DSP
Development Tools
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2011, Texas Instruments Incorporated

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Purchasing guides for the electronics industry

Cortex-A8 and ARM9 Microprocessors ................................................................................................................... 31

Cortex-M MCUs ............................................................................................................................................. 34

16 Embedded Processing & DSP Resource Guide 2012

and complementary analog products, offering

32-Bit ARM Cortex-M MCUs

Cortex-based microcontroller families

Cortex-A8 and ARM9 Microprocessors

family block diagram

. The award-winning Stellaris

MPUs the OMAP-L138, AM1808,

-6 FPGA processing power, and features

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