Ericsson develops tiny basestation that fits in the hand

no comment richard wilson 2013/09/25

Ericsson has introduced its smallest mobile phone basestation, which is small enough to fit a persons hand. The disk-shaped Ericsson Radio Dot System, is designed as a radio booster system, which uses an new design of antenna and supports broadband radio channels for in-building newtworks. The basestations are connected and powered via standard internet LAN cables (Category 5/6/7) to indoor radio units that link to a basestation. Radio Dot System leverages the same industry-leading features found in Ericssons macro base station. The aim, said Johan Wibergh, head of Ericsson Business Unit Networks, is to lower the (cost) threshold to building indoor coverage. The product is expected to be commercially available by the end of next year. - See more at: http://www.electronicsweekly.com/news/design/communications/ericssondevelops-tiny-basestation-that-fits-in-the-hand-2013-09/#sthash.bHAz8zgo.dpuf

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100G fibre links are interoperable at ECOC 2013

no comment richard wilson 2013/09/18

Xilinx will demonstrate a 100G link running at OTN data rates in participation with the Optical Internetworking Forum (OIF) at ECOC in London next week ( September 23-25). It will demonstrate interoperability between its 28.05Gbit/s capable (GTZ) transceiver and a Finisar CFP2 optical module running at 27.95Gbit/s. The Virtex-7 H580T FPGA interoperating with the Finisar optical module following the OIF CEI-28G-VSR implementation agreement, illustrates real-world integration of 100G networking systems. The Physical and Link Layer demonstration by OIF members at ECOC will include CEI-28GVSR chip-to-module interfaces for CFP2 and QSFP28 pluggable module form factors, CEI-25GLR backplane applications and module thermal specifications that enable 100G capabilities.

- See more at: http://www.electronicsweekly.com/news/design/communications/100g-fibrelinks-are-interoperable-at-ecoc-2013-2013-09/#sthash.65auZKYx.dpuf

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GaN-on-SiC HEMT packs 600W for pulsed power

no comment steve bush 2013/09/17

Macom Technology Solutions has announced a ceramic GaN-on-SiC power HEMT for avionics. MAGX-001090-600L00 is a gold-metallised matched GaN-on-SiC RF power transistor optimised for pulsed avionics at 1,030-1,090MHz, such as secondary surveillance radar in air traffic control systems. It provides 600W of output with 21.4dB typical gain and 63% efficiency.

The device has a thermal resistance of 0.05C/W and load mis-match tolerance of 5:1, said the firm. In addition, the device has a pulse droop of 0.2dB and can be used effectively under more demanding Mode-S ELM operating conditions. The device provides the highest load mismatch tolerance in its class, claimed product manager Paul Beasly. Operating voltage is 50V max, and the firm is predicting MTTF of over 600 years at a maximum junction temperature of 200C. Evaluation boards are available from stock, and the device will be on show ot the Macom stand at European Microwave Week in Nuremberg on 8-10 October. - See more at: http://www.electronicsweekly.com/news/design/communications/gan-on-sichemt-packs-600w-for-pulsed-power-2013-09/#sthash.dL93Mqfl.dpuf

LTE-Advanced test scripts without programming skills

no comment steve bush 2013/09/17

Anite has eased the development of test scripts for LTE-Advanced (LTE-A) device testing. Called Scenario Mode, it is an addition to the firms Development Toolset and offers a graphical interface intended to enable engineers without specific programming skills to develop and edit test scripts.

Users of Anites LTE-A Scenario Mode are able to create most types of tests, even the most complex ones, through a simple drag and drop graphical interface, claimed the firm. It offers a procedure-based rather than a message-based approach to script creation, which can make test creation simpler and faster. The user creates a complete test by assembling procedure blocks without necessarily working through each message in detail. Development Toolset provides ways to validate lower layer test scenarios and includes tools that support the wireless device development lifecycle from pre-silicon protocol module development through to systems integration and verification, said Anite. - See more at: http://www.electronicsweekly.com/news/design/communications/lte-advancedtest-scripts-without-programming-skills-2013-09/#sthash.Fcc0fd1V.dpuf

Office LANs get speed boost from passive optical networks at ECOC
no comment richard wilson 2013/09/05

Corning, IBM, and TE Connectivity are part of a group of companies looking to promote the adoption of passive optical networks in computer data networks, and they have formed a cross-industry body called the Association for Passive Optical LAN (APOLAN) . The companies will use the ECOC Exhibition in London later this month (23-25 September) to demonstrate how passive optical networks can be the basis of very high speed data networks in computer centres and offices.

Passive Optical LAN has been used in telecoms netwroks for some time, but it could yet make a signifcant impact on IT networks. It can bring enormous data bandwidth and scalability to LAN infrastructure compared to traditional workgroup switch-based LAN architectures. With data and video consumption forecast to grow between 7-10X in the next few years, the demand for highly cost-effective and high-quality voice, video, and data continues to grow in the enterprise LAN market space, making Passive Optical LAN an appealing solution to address current and future bandwidth demands, said Nav Chander, research manager, Enterprise Telecom at IDC. The deployments of Passive Optical LAN to date have demonstrated significant cost and performance advantages compared to traditional Ethernet designs, and the optical foundation future-proofs the network for any new bandwidth demand a clear advantage over existing copper solutions, said Dave Cunningham, president and chairman of the APOLAN. APOLAN members are Corning, IBM, SAIC, TE Connectivity, Tellabs, Zhone and 3M, representing infrastructure, electronics and consulting services. - See more at: http://www.electronicsweekly.com/news/general/office-lans-get-speed-boostfrom-passive-optical-networks-at-ecoc-2013-09/#sthash.3xc872A8.dpuf

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Broadcom uses Wi-Fi Direct to link wearable electronics to the cloud

no comment richard wilson 2013/08/30

Broadcom says companies developing wearable electronic systems will find it easier to link to the cloud via smart mobile devices with the integration of a device-todevice Wi-Fi interface into its WICED embedded wireless platform. The company has integrated the Wi-Fi Direct point-to-point interface into its WICED platform. This allows a consumer to directly connect two Wi-Fi devices together without the need for an access point or computer. Broadcom said its WICED platform is being used in blood pressure monitors, glucometers, smart watches and fitness monitors. It believes support for Wi-Fi Direct, which does not need a Wi-Fi access point or computer, will bee used in the development of smart clothing and other wearable sensors. For example, Bluetooth Smart and Wi-Fi links allows for data to be collected from wearable devices and transferred to a smartphone or into the cloud in low power systems. OEMs creating wearable products require interoperable technology that will allow these new devices to connect with smartphones and tablets available today, said Joshua Flood, Senior Analyst, ABI Research. For Bluetooth Smart this already exists and the GATT, Generic Attribute Profile, simplies the development of applications allowing them to run easily on different platfiorms such as iOS, Android and Windows 8. Wi-Fi is now following a similar route. - See more at: http://www.electronicsweekly.com/news/general/broadcom-uses-wi-fi-direct-tolink-wearable-electronics-to-the-cloud-2013-08/#sthash.iW06TchN.dpuf