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EE143 Teaching Staff

Instructor : Prof. Jeffrey Bokor, jbokor@eecs.berkeley.edu
510 Sutardja-Dai Hall, 642-4134 Lecture Hours and Place: Tu &Th, 11-12:30, 11 12:30, 3106 Etcheverry Office Hours: Wed 130pm-230pm, and by appointment GSIs Byron Ho (Head-TA), bho@eecs.berkeley.edu, Office Hours : TBA Changhwan Shin, shinch@eecs.berkeley.edu, Office Hours: TBA Fanglu F l Lu, L fanglulu@eecs.berkeley.edu, f l l @ b k l d Office Hours: TBA Kanghoon Jeon, Jeon dolphin@eecs.berkeley.edu dolphin@eecs berkeley edu Office Hours: TBA
Professor J. Bokor, U.C. Berkeley

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EE143 Lab Sign-up

5 Lab Sections : M 9am-12pm, Tues 2-5pm, W 1-4pm, Fri 9am-12am, Fri 1-4pm Telebears sections are not used! Fill in Doodle p poll http://doodle.com/qw299i3idkvyd9b8 p q y before 1/20 (Thursday) 5pm. Your assigned lab section will be posted online before 5pm on 1/21. Lab attendance is mandatory for Week of 1/24 You will have lab orientation and have to pass a safety quiz before you q y are officially y enrolled in this course.
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Course Website is on bspace Required Text

R.C. Jaeger , "Introduction To Microelectronics Fabrication , 2nd Edition Reprints and Lecture Notes as posted on bspace

Reference Texts
J.D. J D Plummer Plummer, M M.D. D Deal Deal, and P.B. P B Griffin, Griffin Silicon VLSI Technology R. F. Pierret, Semiconductor Device Fundamentals All textbooks are available as Course Reserves in the Engineering Library

Homework
Posted every Friday online Due following Friday at 9am, EE143 HW box in Moore Room (200 Cory) your course g grade Your best ten efforts will be counted towards y

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Grading
Midterm1: 10%,Midterm2: 15%, Final 30%, Homework: 10%, Lab: 35% Undergrads and Grads will be graded as two separate groups The typical mean GPA for the whole class is 2.9 The EECS Department p Policy y on Academic Dishonesty will be strictly enforced. See
http://www.eecs.berkeley.edu/Policies/acad.dis.shtml

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Laboratory Grading: 35% of Total Grade

Lab attendance/participation: 100 pts (5% of the total grade).
Each absence results in -20 pts. Each lateness results in -10 pt. Students receiving a lab attendance grade of 0 pts or less will automatically fail the course. Make-up lab sections are allowed (student will be attending a different lab section for that week), however, prior written request must be submitted to Professor Bokor. Students attending preapproved make-up sections ti will ill not tl lose points. i t Th The GSI will ill assign i a grade d f from 0 0-10 10 f for participation during each lab for each student. Note that being unwilling to participate in the lab activities, and/or not following the safety procedures will result in losing g lab p participation p p points. Pre-Lab Quizzes: (5% of the total grade). They will be given at the beginning of each lab. You must be prepared for Lab! Lab Report 1: 100 pts (15% of the total grade). For every day that it is turned in late, you will lose 20 pts. We will not collect after 4 days past the deadline. Lab Report 2: 100 pts (10% of the total grade). For every day that it is turned in late late, you will lose 20 pts pts. We will not collect after 4 days past the deadline.
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Lab Partners Students work in pairs in the lab, sharing a silicon wafer. In some cases, , students may y triple p up. partners form up p in the first week of lab Lab p All partners must work together in lab to get full participation points Partners collaborate to create a single Lab Report

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Lab Safety Labs start week of 1/24 Week 1 Mandatory y Lab attendance required q You will have a lab orientation session, and will have to pass a safety quiz before you are officially enrolled in this course. You MUST attend the lab session to which you are assigned assigned.

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Course Structure Lab and Lecture

You learn the theories in class; you practice them in lab You are going to make:
resistors, diodes, MOS-capacitor bipolar transistor, MOS-transistor,

By the end of the semester, you should have l learned d

basic lab techniques how to operate some fabrication equipment how to characterize the devices you made

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Lab Cleanliness
only enter the clean room fully gowned
hair net + lab coat + glove + shoe net + safety g gg goggles

do NOT touch chemicals / equipment with bare hands always handle wafers with tweezers and t trays (unless ( l t told ld otherwise) th i ) wash hands before and after entering the lab (why??)
before: so as not to contaminate wafers or equipment after: avoid chemicals being ingested

3rd week, GSIs will demonstrate how to clean masks 4th week, GSIs will demonstrate how to piranha-clean wafers

Professor J. Bokor, U.C. Berkeley

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Lab Safety
do NOT enter the lab when GSI arent present know all the emergency exits (ask the GSIs to show you) know where to find the MSDS
under d th the whiteboard hit b d i in characterization h t i ti room

know where to find the closet water sources, shower, eye wash, sink ask whenever not clear do NOT try things out without permission NO eating eating, drinking, drinking playing playing, etc etc. inside the lab Things in the lab can be dangerous if not carefully f handled. Be sure to respect the chemicals.

Professor J. Bokor, U.C. Berkeley

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Chemical Handling
wear protective gear when handling corrosive chemicals
face shield, chemical apron, chemical gloves, respirator if necessary

check glove for holes check pH of unknown spillage, label everything corrosive chemicals: H2SO4, HF, aluminum etch, TMAH wash and rinse the exposed body parts with water for > 15mins add acids to water, not the other way around handle wet chemicals only at sinks, acid on right, others on left l ft side id Always THINK about what you are doing. What might go wrong? g g What would y you do if it does g go wrong? g
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Add Acid to Water

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Chemical Handling g ( (contd) ) HF:

be very very careful HF will penetrate your body and attack your skeletal system; once you feel it, it it is already eating your bones!!! apply calcium gluconate if exposure is suspected use only plastic beakers for HF (why??)

H2SO4:
very painful, severely burns add H2O2 to H2SO4 to prepare piranha do not carry y the beaker around after mixing g( (HOT!!) ) use only glass beakers for piranha (why??) NEVER mix solvents with piranha

Chemicals used in the lab are often harmful. Dont breathe and avoid exposure if possible possible. Use teflon-ware when handling wafers in acids. Be careful, those teflon tweezers do not hold the wafers very well!!

Professor J. Bokor, U.C. Berkeley

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Chemical Disposal p
organic chemicals are discarded in designated containers NOTE: in this lab, photoresist (PR) is also dumped down the drain. do NOT mix organic wastes with acids (why??)
can cause fire or even explosion

do NOT mix acids and bases

Professor J. Bokor, U.C. Berkeley

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What is EE143 all about?

Microfabrication Principles for IC and MEMS Hands-on Hands on Fabrication and Testing of IC and MEMS Devices

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EE143 Chip Fabrication

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Photograph of EE143 Wafer

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EE143 Lab Processing Equipment

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EE143 Chip Characterization

17-stage Ring Oscillator

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Inside the Integrated g Circuit

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Processor Chips

3/20/2010 Professor J. Bokor, U.C. Berkeley

Nano High

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The Transistors are Nano!

45 nm

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The First Integrated Circuit (IC), 1958

Jack Kilby Nobel Prize Nobe e in Physics, ys cs, 2000

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Moores Law

Gordon Moore, Intel co-Founder Electronics El t i Magazine, M i 1965

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Current Intel Marketing Version

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3DTV?

HDTV Ipod p Cell GPS phones Internet Laptop Digital WWW computer cameras IBM PC PS2, PS1, N64 PacMan Game Xbox Boy Palm Pilot Iphone

Pong g

PS3, Wii

Moores Law Brings New Gadgets

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Larger Wafers
Lower Die Cost

Cost to Process a Wafer is Relatively Fixed for a Given Process Larger Wafer Lower Cost/Die
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Example Cost to process a wafer is nearly independent of wafer size! Assume $ $1000 p per wafer. Assume 50% Yield of good dice. Assume 10 cm X 10 cm die size What is the cost per good die for
150 mm wafers (6 inch)? 200 mm wafers (8 inch)? 300 mm wafers (12 inch)?

Professor J. Bokor, U.C. Berkeley

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Commercial MEMS Products

Acceleratometer ( Analog Devices)

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Optomechanical p y (TI, 1996) Displays

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MEMS Actuators

Gear Speed Reduction Unit

Movable Mirror

Responsive Drug Delivery Valve

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Turbine engine 32
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MEMS-IC Integration
(Sandia National Lab) MEMS fabricated in 12m-deep trench Filled with SiO2 and planarized using CMP

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Responsive Drug Delivery Systtem

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Source, Madou , Lab Chip, 3, 26-28N (2003)

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Large Area Processing (Flat Panel Displays) Displa s)

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Large Area Processing (Ph t (Photovoltiacs) lti )

The Grid Parity Challenge (< US$1 /Watt )

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