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EPON Resins

and Modifiers

EPON

SC:3059-01 / EPON Resins and Modifiers

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EPON Resins and Modifiers

Introduction

Qualifying a resin system that offers the best balance of performance and processability can be a significant task. You not only need quality products from a reliable supplier; you need a company that is willing to share its extensive technical expertise and provide services that will help satisfy your unique requirements. Thats where we come in. Were Resolution Performance Products LLC (RPP), one of the leading suppliers of epoxy resins, curing agents, modifiers, and resin systems. We offer a diverse line of epoxy resins that vary in chemical structure, molecular weight, viscosity and functionality providing the formulator with a multitude of options. Whats more, our products have over 50 years of innovation and success in a variety of markets and end-use applications. At our world-class technology centers in Houston, Texas, and Louvain-la-Neuve, Belgium, we pursue advanced processing technologies while creating new resin products and systems with broad performance ranges. By continually working on technical challenges in our application laboratories, we are able to translate real application requirements into high quality, production-oriented materials. EPON Resins and Modifiers offer advantages such as: Low room temperature viscosity Very long working life Low moisture absorption Good epoxy performance characteristics Flexibility Reactivity High elongation Adjustable cure times Good chemical and corrosion resistance Heat resistance Fire retardance Compliance with MIL-R-9300B specifications*

*In some resin systems.

SC:3059-01 / EPON Resins and Modifiers

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At A Glance

EPON Resins This family of resins was developed to provide superior overall performance in a variety of end-use applications. These products enable manufacturers to achieve practically any desired performance level, while optimizing processability and strength retention at elevated temperatures. Liquid and Blends (see page 5-7) This segment of our product line represents the most widely used products in a number of industries. The most commonly used EPON Resin/HELOXY Modifier blends are available in several viscosity cuts. Acrylates (see page 8) These products offer excellent wetting characteristics with rapid reaction rates. Brominated (see page 9) These products can be used to obtain fire retardance in a base epoxy resin formulation. Semi-Solid and Solid (see page 10-12) Both of these product groups have a higher molecular weight, providing the ability to vary the viscosity, flexibility and reactivity of a system. EPON HPT Resins (see pages 13-14) These products are multi-functional materials specifically designed for use in the production of advanced composite structural parts. They are also high performance replacements for conventional epoxy resins in many pre-preg and structural adhesive applications. EPON HPT Resins also enable the production of composite parts with improved hot/wet performance, and offer processing characteristics comparable to conventional epoxy materials. Multi-Functional and Specialty (see pages 13-14) These product segments provide the formulator with access to increased levels of heat and chemical resistance. Elastomer Modified EPON Resins (see page 15) These products offer improved adhesive properties, thermal shock resistance and toughness, with good fatigue resistant properties. EPI-REZ Waterborne Epoxy Resins (see page 16) These non-ionic, totally aqueous dispersions of our epoxy resins provide benefits such as extended potlife, high crosslink density, high temperature performance, very good chemical resistance, B-stage capability, low color, and complete water-reducibility. Among the many choices in curatives, dicyandiamide can be used as a curing agent for these epoxy dispersions to provide extended potlife formulations which cure at 300-350 F to highly cross-linked systems suitable for service at high temperatures.

SC:3059-01 / EPON Resins and Modifiers

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At A Glance (cont.)

HELOXY Modifiers (see page 17-18) HELOXY Monofunctional Glycidyl Ethers are low viscosity epoxy functional modifiers that provide maximum viscosity reduction at the lowest cost. HELOXY Polyfunctional Glycidyl Ethers are reactive modifiers that provide good viscosity reduction while maintaining very good physical performance in liquid epoxy resin systems. HELOXY Flexibilizers are reactive modifiers that provide good viscosity reduction while imparting flexibility to the epoxy resin system. EPON Resin/EPI-CURE Curing Agent Resin Systems (see pages 19-22) These systems cover a broad range of amine terminated materials, including polyamides, amidoamines, aliphatics, cycloaliphatics and aromatics. This diversity in cure chemistries provides for diversity in processing possibilities from room temperature cure/general performance, to long potlife/high performance. EPON Resins 9000 Series Systems (see page 22) This series of resins and curing agents was developed with low viscosity, long working life, superior hot/wet performance, and low water absorbent characteristics. They are resistant to common aircraft and automotive fluids and provide improved combinations of toughness, temperature resistance, and good tensile and flexural properties.

The Formulators Choice

All of our products are manufactured to high standards of quality and have very specific property ranges. To help you assess the many production and performance advantages of RPPs complete product line of resins and modifiers, weve coupled typical properties and resin system characteristics in the technical charts which follow. The data contained in this brochure are intended to give only basic product information for quick reference individual product technical bulletins with additional information are available for many of the products listed in the following pages. For additional information about any or all of these products, visit our website at:

www.resins.com
For answers to technical questions, call our toll-free technical assistance hotline at:

1-800-TEC-EPON
(1-800-832-3766)

Table 1/Typical Properties of Liquid EPON Resins*

Product Liquid 177-182


Blend of BPA and BPF resins. Provides improved crystallization resistance over BPA or BPF resins, along with moderate viscosity. Low viscosity alternative to EPON Resin 862 and EPON Resin 828/HELOXY Modifier blends. High purity resin with strong crystallization tendency. Provides chemical resistance, high solids formulations. General bisphenol-A epoxy resin providing chemical resistance. Subject to crystallization when cold. General bisphenol-A, moderate viscosity, standard grade epoxy resin. Minimal crystallization tendency; higher viscosity.

Chemical type Comments 60-80

Physical form

Viscosity at 25 C, P

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin 235

DGEBPA/ DGEBPF Liquid 192-204 175-180 178-186 185-192 190-198 290-335 Liquid Liquid Liquid Viscous liquid Semi-solid
(75% solids in MIBK)

EPON Resin 824 60-65 65-95 110-150 170-225 L-U

Modified DGEBPA

40-70

SC:1971 RP:3073 RP:3074 RP:3075 SC:2144

EPON Resin 825

DGEBPA

EPON Resin 826

DGEBPA

EPON Resin 828

DGEBPA

EPON Resin 830

DGEBPA

EPON Resin 836

DGEBPA

High molecular weight, liquid bisphenol-A epoxy resin. Provides improved toughness, flexibility, flow control, and tack. Low viscosity bisphenol-F epoxy resin used alone or in blends with other resins. Allows high solids formulations with good chemical resistance. A high performance alternative to blends of EPON Resin 828 with HELOXY Modifiers.

EPON Resin 862 25-45

DGEBPF

Liquid

166-177

SC:772

EPON Resin 8280 Liquid

DGEBPA

Liquid

110-150 110-140

185-195 182-195

Anti-settling and anti-foaming resin for use in filled systems. Anti-settling and anti-foaming resin for silica fillers.

SC:894 SC:940
Page 5

EPON Resin 8281

DGEBPA

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 2/Typical Properties of Liquid EPON Resin/HELOXY Modifier Blends*


Viscosity at 25 C, P Comments Good chemical and crystallization resistance. Superior wetting characteristics. Low viscosity, precatalyzed liquid resin for use with phenolic hydroxyl containing compounds in making custom resins. Low viscosity, precatalyzed liquid resin for use with phenolic hydroxyl containing compounds in making custom resins. Modified BPA resin that provides flexibility and toughness. Used in applications where thermal shock or impact resistance are important. 5-7 5-7 30-70 193-203 175-195 180-195 RP:3072 SC:2431 SC:1717

Product HELOXY Modifier 62 HELOXY Modifier 61 Xylene/Ethylene Glycol Monomethyl Ether

Modifier used

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin 813

EPON Resin 815C

EPON Resin 829

EPON Resin 829H 30-70 193-203

Xylene/Propylene Glycol Methyl Ether

SC:1717

EPON Resin 872 15-38 625-725

SC:2143

EPON Resin 8091 4.5-6.0

360-380

Low viscosity resin used primarily in electrical applications where high thermal shock resistance is required. Cured with liquid anhydrides. Not recommended for use with amine curing agents. 7-11 11-16 182-190 245-275 Higher viscosity version of EPON Resin 815C.

SC:1526

EPON Resin 8112

HELOXY Modifier 61 HELOXY Modifier 505

Flexible resin for flooring and adhesive applications. SC:1534


Page 6

EPON Resin 8131

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 2/Typical Properties of Liquid EPON Resin/HELOXY Modifier Blends*


Viscosity at 25 C, P Comments Primary resin for flooring systems. Anti-settling and anti-foaming resin for highly filled systems. Highest viscosity version of EPON Resin 8132 for flooring. Medium viscosity version of EPON Resin 8132 for flooring. High molecular BPA solid resin solution. Used in coatings applications where high toughness and non-HAP solvents are required. 5-7 50-65 180-195 195-215 SC:1425

Continued

Product HELOXY Modifier 8 HELOXY Modifier 62

Modifier/solvent used

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin 8132

EPON Resin 8201

EPON Resin Custom Solution 241 HELOXY Modifier 8 22.5-27.5 190-200

SC:1972

EPON Resin Custom Solution 242 HELOXY Modifier 8 13.5-18.5 195-205

SC:1972

EPON Resin Custom Solution 258 Propylene Glycol Methyl Ether Acetate 40-65 Z1-Z2
(Gardner Holdt)

1600-1900

EPON Resin Custom Solution 267 Propylene Glycol Methyl Ether Acetate/Toluene Z4-Z6
(Gardner Holdt)

2700-3300

Modified high molecular BPA solid resin solution. Used in coatings applications where high toughness is required. 380-410 Low molecular weight bisphenol-A epoxy resin solution.

SC:694

EPON Resin Custom Solution 286 Methyl Isobutyl Ketone/Xylene

SC:1702

EPON Resin Custom Solution 349

7.5-10.5

189-202

Moderately high molecular weight bisphenol-A solid resin solution. 14 295-330 BPA resin/phenolic curing agent solution.

EPON Resin Custom Solution 360

Methyl Ethyl Ketone

SC:2886
Page 7

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 3/Typical Properties of Epoxy Acrylate EPON Resins*


Viscosity at 25 C, cP Equivalent weight Comments Very low viscosity resin that imparts viscosity reduction, flexibility and superior wetting characteristics into a resin system. Moderate viscosity resin with superior wetting. Used in flooring, casting, encapsulation and grouting compounds. Produces exceptionally rapid reaction rates. Uses include various high build sealers, wear resistant surfacing, and low temperature curing applications. Moderate viscosity resin that imparts flexibility and superior wetting into a resin system. 150 85-115 SC:1525

Product Liquid

Chemical type

Physical form

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin 8021

Aromatic epoxy polyacrylate

EPON Resin 8101

Aromatic epoxy polyacrylate 192

Liquid

400-800

SC:1535

EPON Resin 8111

Aromatic epoxy polyacrylate 140

Liquid

800-1100

SC:2362

EPON Resin 8115

Aromatic epoxy polyacrylate 229-237 Liquid 130 2,700-3,700

Liquid

500-700

EPON Resin 8121

Aromatic epoxy polyacrylate

Ultimate reactivity when combined with aliphatic amines. Used alone or as a highly reactive modifier for adhesives, grouting, high build sealers, and various low temperature applications. 177

SC:2389

EPON Resin 8161

Liquid

1,800-2,400

Aromatic epoxy polyacrylate

Moderate viscosity resin. Performance properties similar to EPON Resin 828. Applications include flooring, grouts, adhesives, casting and encapsulation systems.

SC:1527

Page 8

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 4/Typical Properties of Lightfast EPONEX Resins*


Viscosity at 25 C, cP Equivalent weight Comments Low viscosity cycloaliphatic glycidyl ether. Building block resin for higher molecular weight epoxies. Resists chalking, yellowing. 210-238 1,300-2,500 SC:729

Product Liquid

Chemical type

Physical form

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPONEX Resin 1510

Hydrogenated DGEBPA

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 5/Typical Properties of Brominated EPON Resins*


Softening point, F 140 380-410

Product Solid

Chemical type

Physical form

Weight per epoxide

Comments Low melting semi-solid with 48% by weight bromine. Imparts fire retardancy.

Refer to Technical Bulletin No. SC:2449

EPON Resin 1163

Brominated DGEBPA Solid 207

EPON Resin 1183

Brominated DGEBPA

625-725

Non-sintering solid epoxy with 42% by weight bromine. Imparts fire retardancy.

SC:2450

Page 9

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 6/Typical Properties of Semi-Solid and Solid EPON Resins*


Viscosity at 25 C, cP Comments Used for pre-pregs and adhesives properties modification. Used for pre-pregs and adhesives properties modification. Low molecular weight, bisphenol-A epoxy resin used to provide improved toughness, flexibility, flow control, and tack. Basic coating/pre-preg resin; sinters upon storage. Sinter-resistant grade of EPON Resin 1001F. Medium molecular weight, bisphenol-A epoxy resin containing hydroxyl groups. Usually reacted with vegetable oil acids to produce epoxy ester resins. Can also add toughness, flexibility, and rheology control. Moderately high molecular weight resin used for baked industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. 1,700-2,300 2,300 3,800 275 Very high molecular weight resin for baked industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. O-V1 80 230-280 SC:2145 Softening point, F

Product Semi-solid

Chemical type

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin 834

DGEBPA

EPON Resin 836 Semi-solid 97 290-335

DGEBPA

L-U2

SC:2144

EPON Resin 1001F Solid 174 525-550

DGEBPA

7.0-9.63

RP:3062

EPON Resin 1002F Solid 185 205 800-950 Solid 15-253 600-700

DGEBPA

9.2-13.63

RP:3063 RP:3064

EPON Resin 1004F

DGEBPA

EPON Resin 1007F Solid 257

DGEBPA

50-1003

RP:3065

EPON Resin 1009F Solid

DGEBPA

100-2503

RP:3066

Page 10

70% solution in butyl DIOXITOL. 75% solution in MIBK. 40% weight solution in MEK.

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 6/Typical Properties of Semi-Solid and Solid EPON Resins*


Viscosity at 25 C, cP Comments Medium molecular weight, bisphenol-A epoxy resin containing hydroxyl groups used primarily for thin film epoxy powder coating applications. Medium molecular weight, bisphenol-A epoxy resin containing flow control agent. Medium molecular weight, bisphenol-A epoxy resin containing hydroxyl groups used primarily for thin or thick film epoxy powder coating applications. Medium molecular weight, bisphenol-A epoxy resin used primarily for thin or thick film epoxy powder coating applications. Moderately high molecular weight, bisphenol-A epoxy resin used primarily for thick or intermediate film epoxy powder coating applications. 1200-1400 510-570 Blend of solid BPA fusion resin and epoxidized BPF novolac resin used primarily in high performance powder coating applications, due to superior chemical and corrosion resistance. 80-90 10-173 55-60 675-760 RP:3068 Softening point, F

Continued

Product Solid

Chemical type

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin 2002

DGEBPA

EPON Resin 2002-FC-10 Solid Solid 13.5-183 725-825

DGEBPA

760-875

RP:3069

EPON Resin 2003

DGEBPA

EPON Resin 2004 Solid 18-273 875-975

DGEBPA

RP:3070

EPON Resin 2005 Solid 230-248

DGEBPA

25-553

SC:1020

EPON Resin 2012 Solid

DGEBPA/ Epoxidized BPF Novolac

11-183

SC:1557

Page 11

70% solution in butyl DIOXITOL. 75% solution in MIBK. 40% weight solution in MEK.

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 6/Typical Properties of Semi-Solid and Solid EPON Resins*


Viscosity at 25 C, cP Comments Blend of solid BPA fusion resin and epoxidized BPF novolac resin used primarily in high performance powder coating applications, due to superior chemical and corrosion resistance. Medium molecular weight, bisphenol-A epoxy resin containing flow control agent. Modified, solid BPA resin with lower melt viscosity with high softening point. Modified, solid BPA resin for low melt viscosity and high reactivity. Primarily used for electrical encapsulation applications. Modified, solid BPA resin for low melt viscosity and high reactivity. Primarily used for electrical encapsulation applications. 35-753 100-120 750-850 SC:1557 Softening point, F

Continued

Product Solid

Chemical type

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin 2014

DGEBPA/ Epoxidized BPF Novolac

EPON Resin 2024 Solid 95-105 17-263

DGEBPA

850-950

RP:3071

EPON Resin 2042 Solid 75-85

Modified DGEBPA Solid 5.6-7.2 440-500

8-123 700-750

SC:1654

EPON Resin 3001

Modified DGEBPA

EPON Resin 3002 Solid

Modified DGEBPA

7.4-9.5 520-590

Page 12

70% solution in butyl DIOXITOL. 75% solution in MIBK. 40% weight solution in MEK.

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 7/Typical Properties of EPON Resins and EPON HPT Multi-Functional and Specialty Epoxy Resins*

Product 345-385 168-178


Functionality of 2.5. Low viscosity version of EPON HPT Resin 1050. Multi-functional novolac epoxy resin with low viscosity, easy processing, good thermal stability, and chemical resistance.

Chemical type Comments Viscous liquid

Physical form

Viscosity Softening Weight point, per at 25 C, F epoxide P SC:1366

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin 160

Epoxidized BPF novolac

EPON Resin 161 180-280

169-178

Functionality of 2.5. Lower viscosity version of EPON Resin 160. Multi-functional novolac epoxy resin with low viscosity, easy processing, good thermal stability, and chemical resistance.

Epoxidized BPF novolac

Viscous liquid

SC:2915

EPON Resin 164 70-100 174


resistance.
(at 248 F)

Epoxidized cresolic novolac Solid 200-230


(at 150 C)

Solid 200-240

Functionality of 4.1. High temperature and chemical

SC:735

EPON Resin 165

100-200

An epoxy cresol novolac resin with a functionality of about 5.5. Produces high strength cured systems with good chemical resistance, and elevated temperature stability.

Multifunctional cresol novolac

SC:2733

EPON Resin 1031 172


(at 248 F)

Solid

39

195-230

Functionality of 3.5. High temperature and chemical resistance.

Tetraglycidyl ether of tetraphenolethane 310-400

RP:3067

EPON HPT Resin 1050

176-181

An epoxy phenolic novolac resin with a functionality of about 3.6. Produces high strength cured systems with good chemical resistance, and elevated temperature stability.

SC:1823

(aka EPIKOTE Resin 154)

Phenolic novolac Highly viscous liquid


(at 125 F)

Page 13

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 7/Typical Properties of EPON Resins and EPON HPT Multi-Functional and Specialty Epoxy Resins*

Continued

Product Comments
Functionality of 2.5. An epoxy bisphenol-A novolac providing good thermal stability and chemical resistance. Useful for electrical, adhesives, and composites applications.

Chemical type Viscosity, P 20-60


(at 120 F)

Physical form Viscous liquid 180-200

Weight per epoxide SC:1578

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin SU-2.5

Epoxidized BPA novolac

EPON Resin SU-3


(at 125 F)

Epoxidized BPA novolac


adhesives, and composites applications.

Semisolid 150-450 187-207

Functionality of 3. An epoxy bisphenol-A novolac providing good thermal stability and chemical resistance. Useful for electrical,

SC:1579

EPON Resin SU-8


(at 266 F)

Solid1 10-60 195-230

Functionality of 8. An epoxy bisphenol-A novolac providing rapid development of green strength, with good high temperature performance. Useful for electrical, adhesives, and composites applications.

SC:1580

(aka EPIKOTE Resin 157)

Epoxidized BPA novolac

Page 14

Melts at approximately 83 C.

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 8/Typical Properties of Elastomer Modified EPON Resins*


Viscosity at 125 F, P Comments
A CTBN-elastomer modified bisphenol-F epoxy resin with an elastomer content of 40% wt. Provides improved adhesive properties, thermal shock resistance, and toughness with good fatigue resistant properties. A CTBN-elastomer modified bisphenol-A epoxy resin with an elastomer content of 40% wt. Provides improved adhesive properties, thermal shock resistance, and toughness with good fatigue resistant properties. A CTBN-elastomer modified bisphenol-A epoxy resin with an elastomer content of 40% wt. Provides improved adhesive properties, thermal shock resistance, and toughness with good fatigue resistant properties. A CTBN-elastomer modified HELOXY Modifier 68 resin with an elastomer content of about 50% wt. Provides improved adhesive properties, thermal shock resistance, and toughness with good fatigue resistant properties. A CTBN-elastomer modified HELOXY Modifier 107 resin with an elastomer content of about 50% wt. Lower viscosity aids in processing. Provides good flexibility, adhesion, fatigue resistance, and toughness properties. A CTBN-elastomer modified epoxy-functional adduct formed with EPON Resin 828 with an elastomer content of about 5% wt. Provides tack and early green strength to composites and adhesives. An elastomer modified bisphenol-A epoxy resin specifically designed to provide excellent adhesion to plasticized vinyl subtrates.

Product 1,500-3,000 285-330

Physical form

Weight per epoxide SC:2366

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPON Resin 58003

Viscous liquid

EPON Resin 58005 3,000-8,000

Viscous liquid 325-375

SC:1499

EPON Resin 58006 1500-3000

Viscous liquid 330-360

SC:1500

EPON Resin 58034 40-80

Moderate viscous liquid 275-305 150-300 325-375

SC:1501

EPON Resin 58042

Medium viscosity liquid 1,000-5,000 195-210

SC:1502

EPON Resin 58901

Viscous liquid

SC:1504

EPON Resin 58135 250-500

Viscous liquid

208-220

SC:2542

Page 15

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 9/Typical Properties of EPI-REZ Waterborne Epoxy Resins*


Viscosity at 77 F, cP Comments Water dispersion of an epoxidized bisphenol-A epoxy resin with an average functionality of 8. Water dispersible bisphenol-A epoxy resin. Water dispersible bisphenol-A epoxy resin. Water dispersion of a low molecular weight bisphenol-A epoxy resin. Water dispersion of an intermediate weight bisphenol-A epoxy resin. Water dispersion of a CTBN-modified bisphenol-A epoxy resin. Water dispersion of a bisphenol-A solid epoxy resin. Water dispersion of an epoxidized bisphenol-A novolac resin with an average functionality of 3. Water dispersion of a urethane-modified bisphenol-A epoxy resin. 480-560 230-270 Water dispersion of an epoxidized o-cresylic novolac resin with an average functionality of 6. 550 3,000 Water dispersion of a solid bisphenol-A epoxy resin, especially suited for low VOC non-HAP applications. 50-120 210-250

Product Liquid

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

EPI-REZ Resin DPW-5108

EPI-REZ Resin WD-510 8,000-12,000 50,000 500-5,000 185-215 195-210 Liquid Liquid

Liquid 190-205

SC:1523 SC: 1524 SC:1551

EPI-REZ Resin WD-512

EPI-REZ Resin 3510-W-60

EPI-REZ Resin 3515-W-60 4,000-15,000

Liquid 225-275

SC:1554

EPI-REZ Resin 3519-W-50 5,000-15,000

Liquid 560-660

SC:1550

EPI-REZ Resin 3522-W-60 8,000-18,000 5,000-15,000 195-215 Liquid

Liquid 615-715

SC:1560 SC:1553

EPI-REZ Resin 5003-W-55

EPI-REZ Resin 5520-W-60 5,000-15,000

Liquid

SC:1556

EPI-REZ Resin 6006-W-70 6,000-13,000

Liquid

SC:2328

Developmental Epoxy Resin Dispersion DPW-6520

Liquid

SC:2856
Page 16

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 10/Typical Properties of HELOXY Modifiers*


Viscosity at 77 F, cP Comments Alkyl C8-C10 glycidyl ethers. Provides good dilution efficiency and has low volatility (some odor present). Alkyl C12-C14 glycidyl ethers. Provides good dilution efficiency and has lower volatility and odor than HELOXY Modifier 7. Triglycidyl ether of trimethylolpropane. Efficient viscosity reducer with increased crosslink density and reactivity. Butyl glycidyl ether. Provides the maximum viscosity reduction with minimum loss of physical performance, good substrate wetting, and allows for increased filler loading. Cresyl glycidyl ether with good performance and low volatility. Phenyl glycidyl ether with good performance and low volatility. Nonylphenyl glycidyl ether. Provides moderate dilution efficiency and is used as a chemical intermediate. p-tert-Butylphenyl glycidyl ether. Provides moderate dilution efficiency, low volatility and good electrical properties. Diglycidyl ether of 1,4-butanediol. Offers good viscosity reduction with minimum loss of performance. 3-5 220-235 SC:1519

Product

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

HELOXY Modifier 7

Liquid

HELOXY Modifier 8 6-10

Liquid

280-300

SC:1520

HELOXY Modifier 48 125-250

Liquid

135-155

SC:1509

HELOXY Modifier 61 1-2

Liquid

145-155

SC:1511

HELOXY Modifier 62 5-10 4-7 90-130 300-325 150-165

Liquid

175-195

SC:1512 SC:1513 SC:1514

HELOXY Modifier 63

Liquid

HELOXY Modifier 64

Liquid

HELOXY Modifier 65 20-30

Liquid 225-240

SC:1515

HELOXY Modifier 67 13-18

Liquid

120-135

SC:1516

Page 17

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 10/Typical Properties of HELOXY Modifiers*


Viscosity at 77 F, cP Comments Diglycidyl ether of neopentyl glycol. Low volatility resin that provides good viscosity reduction with minimum loss of performance. Dimer acid diglycidyl ester. Provides flexibility, improved impact strength, and toughness. Polyglycidyl ether of aliphatic polyol used as an epoxy flexibilizer to improve thermal shock, impact resistance. Diglycidyl ether of cyclohexane dimethanol. Offers moderate viscosity reduction with minimum loss of properties, especially for maintenance of deformation under load. 2-Ethylhexyl glycidyl ether. Provides good dilution efficiency and may be a substitute for butyl glycidyl ether. Polyglycidyl ether of castor oil. Provides good flexibility, water resistance, low volatility, and low odor. Glycidyl ester of neodecanoic acid. Provides good dilution efficiency and has low volatility (some odor present). 13-18 130-140 SC:1517

Continued

Product

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

HELOXY Modifier 68

Liquid

HELOXY Modifier 71 400-900

Liquid

390-470

SC:1355

HELOXY Modifier 84 200-320

Liquid

620-680

SC:1521

HELOXY Modifier 107 55-75

Liquid

155-165

SC:1505

HELOXY Modifier 116 2-4

Liquid

215-225

SC:1506

HELOXY Modifier 505 300-500

Liquid

550-650

SC:1510

CARDURA E-10 5-10

Liquid

244-256

SC:1416

Page 18

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 11/Typical Properties of EPON Resin/EPI-CURE Curing Agent Systems*


Mix ratio, pbw Viscosity at 25 C, cP Tg, C (F) Comments Potlife at 25 C, hours

Products

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

800 Series Systems 100/36 1,100 2.5 110 (230)


System: Low viscosity, bisphenol-A epoxy and a non-MDA polyamine. Characteristics: High elongation (10%), tough, and thermal resistant. Especially useful in applications when high fatigue and microcracking resistance are required. System: Low viscosity bisphenol-A epoxy and a low viscosity anhydride curing agent. Characteristics: Low system viscosity, long working life, excellent electrical properties. System: Moderate viscosity bisphenol-A epoxy and a viscous liquid catalytic curing agent. Characteristics: Long working life, good balance of performance properties. Especially useful in pre-preg formulations and processing.

EPON Resin 826 EPI-CURE Curing Agent 9551

SC:2441

EPON Resin 826 MTHPA

100/82.6 760 138 (280)

SC:772

EPON Resin 828 BF3

100/3 12,000 HDT 174 (345)

SC:67

100/32.5 2,000
(at 60 C)

EPON Resin 828 DDS

HDT 174 (345)

System: Moderate viscosity bisphenol-A epoxy and a solid, non-MDA polyamine. Characteristics: Exceptionally long working life, excellent physical and chemical performance, excellent high temperature properties. Especially useful in pre-preg formulations and processing.

SC:2088

100/7 100,000
(at 70 C)

EPON Resin 828 EPON Resin 1001 DICY Diuron

125 (260)

System: High viscosity, bisphenol-A epoxy and a solid, catalytic curing agent. Characteristics: Long working life, good balance of performance properties, good electrical properties. Especially useful in adhesives and pre-preg processes.

Page 19

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 11/Typical Properties of EPON Resin/EPI-CURE Curing Agent Systems*


Mix ratio, pbw Viscosity at 25 C, cP Tg, C (F) Comments Potlife at 25 C, hours

Continued

Products

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

800 Series Systems (cont.) 100/22.7 2,000-2,200 120-140 0.1-0.3


System: Moderate viscosity bisphenol-A epoxy and low viscosity aliphatic polyamine. Characteristics: High elongation, tough, and thermal resistant. System: Moderate viscosity bisphenol-A epoxy and low viscosity aliphatic polyamine. Characteristics: Good physical properties, thermal and chemical resistant. System: Moderate viscosity bisphenol-A epoxy and low viscosity cycloaliphatic polyamine. Characteristics: Good physical properties, thermal and chemical resistant. System: Bisphenol-A epoxy and a fast, room temperature curing, low viscosity liquid aliphatic amine. Characteristics: Fast cure cycles in a variety of end-use applications. System: Moderate viscosity bisphenol-A epoxy and a low viscosity aliphatic polyamine. Characteristics: Low system viscosity, high elongation, tough, and thermal resistant. System: Moderate viscosity bisphenol-A epoxy and a solid aromatic amine curing agent. Characteristics: Excellent balance of physical and chemical properties, good balance of processing features. Especially useful in filament winding.

EPON Resin 828 EPI-CURE Curing Agent 3200

SC:1674 SC:2865

EPON Resin 828 EPI-CURE Curing Agent 3234 130-140

100/12.9 2,200-2,400

0.5-1.0

SC:1674 SC:2865

EPON Resin 828 EPI-CURE Curing Agent 3300 146 HDT

100/22.7 12-19

SC:2986

EPON Resin 828 EPI-CURE Curing Agent 9552 94-119 (201-246)

100/25.7 4,200

0.2

SC:1547

EPON Resin 828 EPI-CURE Curing Agent 9553 110 HDT

100/15.4 670

SC:1546

EPON Resin 828 MDA

100/28 10,000

HDT 160 (320)

SC:67

Page 20

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 11/Typical Properties of EPON Resin/EPI-CURE Curing Agent Systems*


Mix ratio, pbw Viscosity at 25 C, cP Tg, C (F) Comments Potlife at 25 C, hours

Continued

Products

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

800 Series Systems (cont.) 100/16.9 350 90 HDT


System: Low viscosity bisphenol-F epoxy and a low viscosity aliphatic polyamine. Characteristics: Low system viscosity, high elongation, tough, and thermal resistant. System: Bisphenol-F epoxy and a low viscosity, non-MDA aromatic amine curing agent. Characteristics: Moderate system viscosity, long potlife, good balance of properties.

EPON Resin 862 EPI-CURE Curing Agent 9553

SC:1546

EPON Resin 862 EPI-CURE Curing Agent W

100/26.4 2,200 21.5 160 (320)

SC:1183

Multi-Functional Systems 75/25/88 8,500 24 HDT 275 (527)


System: Moderate bisphenol-A epoxy and a low viscosity anhydride curing agent. Characteristics: Moderate system viscosity, long working life, excellent electrical properties, excellent high temperature properties. Useful in pre-preg formulations and wet lay-up processing.

EPON Resin SU-3 EPON Resin 828 NMA

SC:2094

Page 21

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 11/Typical Properties of EPON Resin/EPI-CURE Curing Agent Systems*


Mix ratio, pbw Viscosity at 25 C, cP Tg, C (F) Comments Potlife at 25 C, hours

Continued

Products

Refer to Technical Bulletin No.

SC:3059-01 / EPON Resins and Modifiers

9000 Series Systems 100/33/0.67 1,000-1,200 7.5 177 (350)


System: Low viscosity, bisphenol-A epoxy and an aromatic amine hardener. Characteristics: Low viscosity, long potlife, fast gelation. Especially useful in the pultrusion process, where it processes at high line speeds with low pull loads and good surface quality. System: Low viscosity, bisphenol-A epoxy and a non-MDA aromatic amine hardener. Characteristics: Low viscosity, very long working life, very versatile processing system for fabricating high performance composite parts using filament winding, resin transfer molding, pultrusion, or pre-preg. System: Non-MDA, non-styrene resin system based on a bisphenol-A epoxy resin. Characteristics: Low viscosity, fast gelation. Especially useful in the pultrusion process, where it processes at high line speeds with low pull loads and good surface quality. System: Low viscosity bisphenol-A epoxy and a low viscosity, non-MDA polyamine. Characteristics: Low system viscosity, low cure temperature, high tensile strength and elongation, excellent fatigue resistance. Especially useful in molding processes such as RTM and SCRIMP.

EPON Resin 9310 ANCAMINE 9360 Curing Agent EPI-CURE Accelerator 537

SC:712

EPON Resin 9405 ANCAMINE 9470 Curing Agent

100/28 or 100/37 850-950 35-40 147-180 (297-358)

SC:856

EPON Resin 9500 EPI-CURE Curing Agent 9550

100/33 900 4-5 89 (192)

SC:2026

EPON Resin 9504 EPI-CURE Curing Agent 9554

100/26 350 1

110-135 (230-275)

SC:2508

Page 22

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

EPON

Resolution Performance Products P.O. Box 4500 Houston, Texas 77210-4500 For product availability, order placement or samples, call our toll-free customer service number at:

1.877.859.2800
For sales outside the U.S., call:

713.241.1065
For technical inquiries, call toll-free:

1.800.TEC.EPON (1.800.832.3766 )
For technical literature and additional technical assistance, visit our website at:

www.resins.com

SAFETY & HANDLING These products are capable of producing adverse health effects ranging from minor skin irritation to serious systemic effects. Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Resolution Performance Products LLC (RPPLLC) products should be directed to your RPPLLC sales representative, or the nearest RPPLLC sales office. Information and MSDSs on non-RPPLLC products should be obtained from the respective manufacturer. WARRANTY NOTHING CONTAINED HEREIN CONSTITUTES AN OFFER FOR THE SALE OF ANY PRODUCT. ALL PRODUCTS SUPPLIED BY RESOLUTION PERFORMANCE PRODUCTS LLC (RPPLLC) ARE SUBJECT TO THE TERMS AND CONDITIONS OF THE APPLICABLE SALES CONTRACT AND NOTHING CONTAINED HEREIN SHALL AMEND OR MODIFY ANY SUCH CONTRACT. SUBJECT TO THE FOREGOING, RPPLLC WARRANTS ONLY THAT ITS PRODUCTS WILL MEET SPECIFICATIONS SET FORTH IN THE APPLICABLE SALES CONTRACT. RPPLLC MAKES NO OTHER WARRANTIES, EITHER EXPRESS OR IMPLIED, WITH RESPECT TO ITS PRODUCTS OR THE RESULTS TO BE OBTAINED FROM THE USE THEREOF, OR WITH RESPECT TO ANY INFORMATION PROVIDED BY RPPLLC, INCLUDING WITHOUT LIMITATION THAT ANY PRODUCT WILL BE MERCHANTABLE OR FIT FOR ANY PARTICULAR PURPOSE OR THAT THE USE OF ANY PRODUCT OR INFORMATION PROVIDED BY RPPLLC WILL NOT INFRINGE ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS. ALL SUCH WARRANTIES ARE HEREBY DISCLAIMED AND EXCLUDED.

2001 Resolution Performance Products LLC. All rights reserved. Printed in the U.S.A.

SC:3059-01 (Formerly SC:1844-99 and SC:2326-99) 01/02 1.5M

E P I KOT E

EPON

EPI-CURE

EPI-REZ

H E LOX Y

C A R D U R A

V E O VA