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R
or by
atomic H exposure of clean surfaces in ultrahigh vacuum.
I9
To understand how this termination is achieved, one must
understand why the surface is H terminated in the first place.
SI HH)
2020 2060
I
l>R/R.
5. iO-
4
PER
-t--
0.5 cm-
i
RESO,-UTION
(0)
(b)
2100 2140 2180
FREQUENCY (0",-1)
FIG. 2. (a) Internal reflection spectrum of Si( Ill) treated with buffered
HF (pH = 5.0) and (b) subsequently rinsed in water. (b/a) Difference
spectrum showing the decrease in the intensity of defect modes and the in-
crease of the ideally terminated terrace mode.
Higashi et at 657
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ibJ
51 (100)
2020 2060 2.00 2140
FREQUENCY (cm-'i
--
Rf:SOLUTION
I
AR/R'
2"
PER
REFLECTION
2<60
FrG. 3. (a) Internal reflection spectrum of Si( 100) upon oxide removal
with concentrated HF; (b) p-po1arization (solid) and s-polarization
(dashed) spectra of the surface subsequently treated in buffered HF
(pH=SoOj.
Indeed, previous authors have argued that fluorine termin-
ates HF-treated surfaces
20
because of the relative strength of
the SiF versus the SiH bonds (-6 eV vs -3.5 eV). Further-
more, F termination of the silicon interface is expected to be
the final step of oxide removal, given the accepted mecha-
nism of oxide etching. Therefore, the observation of atomic
H on the clearly indicates that the termination is
largely determined by reaction kinetics rather than thermo-
dynamics alone.
A simple explanation for the observed H termination
was first proposed by Ubara et al. 5 on the basis of infrared
measurements of HF-treated microcrystalline silicon sam-
ples. They postulate that F-terminated silicon complexes are
unstable in HF solutions due to strong polarization of the
Si--Si back bonds (e.g., + F
3
) facilitating their
attack by HF molecules. This results in reactions such as
=Si-SiF
3
+ HF- SiR + SiF
4
which release silicon
fluorides into solution leaving a H-terminated surface be-
hind. Accurate quantum chemical calculations of the activa-
tion barriers for these types of reactions support their gen-
eral hypothesis.
21
In addition, the question of why the SiH
bonds formed are not attacked by HF is also answered by
these studies. The principal reason is that a reaction such as
=SiH + HF -+ _SiF + H
2
, though exothermic, has an acti-
vation barrier which is significantly higher than that for the
Si-Si bond cleavage reaction discussed above.
The mechanism described above is valid for all forms of
H termination (mono-, di-, and tri-hydride) and depends
only on the initial structure of the Si/ Si0
2
interface, since
only the first Si atom is removed in the process. However,
our best surfaces are achieved in solutions where etching of
the silicon surface itself occurs, as evidenced by the reversibi-
lity of the spectra obtained with different solutions. Highly
basic solutions (e.g., KOH) are known to etch silicon sur-
faces anisotropically [etch rates of Si ( 100) vs Si ( 111) of
greater than 10 to 1], suggesting that the OH concentration
in these solutions plays a role in determining the observed
surface morphologies. The results of Fig. 2 support the idea
that the H-terminated steps and defects characterized by
658 Appl. Phys. Lett., Vol. 56, No.7, 12 February 1990
coupled monohydride, dihydride, and trihydride are prefer-
entially attacked by water.
If this attack results in Si-O bonds (e.g., Si-OH for-
mati on) , preferential removal of those silicon atoms will oc-
cur in the presence ofHF. Given this proposed mechanism,
the formation of ideal H-terminated (111) terraces in the
highly basic HF solutions results from the accelerated etch-
ing of the surface defects due to the high OH concentration.
In contrast to the defective areas, the ideally terminated
Si ( Ill) terraces are extremely stable in highly acidic as well
as highly basic solutions (e.g., from Hel to NH
4
0H).
Our experimental observations of pH modified HF etch-
ing (pH>5) of Si(111) surfaces leads immediately to the
idea that anisotropic etching will occur when surfaces other
than the (111) are used. The results obtained on the SiC 100)
surfaces (Fig. 3) clearly show that the more basic the HF
solution, the more developed the ( 111) facets, although the
size of these facets remains limited, This finding stresses that
the pH of the HF solutions used to clean Si(100) prior to
oxidation must be chosen carefully to minimize roughness.
S. B. Christman, E. E. Chaban, and R. D. Yadvish are
gratefully acknowledged for their technical support.
'w. Kern, Semicond. Int. April, 94 (1984).
2F. J. Gnmthaner and P. J. Grunthaner, Mater. Sci. Rep. 1, 69 (1986).
3M. Grundner and H. Jacob, App!. Phys. A 39,73 (1986).
"Trace contamination at the 10 ppm level can reslIlt in threshold voltage
shifts, device instability, lowered transconductance, etc.
'R. Ubara, T. Imura, and A. Hiraki, Solid State Commun. 50, 673 (1984).
"E. Yab1onovitch, D. L. AHara, C. C. Chang, T. Gmitter, and T. B. Bright,
Phys. Rev. Lett. 57, 249 (1986).
"V. A. Burrows, Y. J. Chabal, G. S. Higashi, K. Raghavachari, and S. B.
Christman. App!. Phys. Lett. 53, 998 (1988).
"Y. J. Chahal, G. S. Higashi, K. Raghavachari, and V. A. Burrows, J. Vac.
Sci. Techno!. A 7, 2104 (1989).
"N. J. Harrick, I mernal Reflection Spectroscopy (Wiley, New York, 1967),
second printing (Harrick, Ossining, 1979).
lOY. J. Chabal, Surf. Sci. Rep. 8, 211 (1988).
"Origillally it was thought that the mode observed at 2077 em -I for H on
Si( Ill) 7X7 might be characteristic of the ideal terrace monohydride. It
appears, however, that the strain around the terrace atoms may be respon-
sible for shifting the frequency down by 6-7 em - I.
ICy' J. Chabal and K. Raghavachari, Phys. Rev. Lett. 53, 282 (1984).
13This is the smallest linewidth observed for any adsorbate on any substrate
at room temperature. In particular, the monohydride on Si( 100) is char-
acterized by a 3 em - I width, with 2 em - I due to dephasing and 1 em - I
due to inhomogeneous broadening. See J. C. Tully, Y. J. Chabal, K. Ragh-
avachari, J. M. Bowman, and R. R. Lucchese, Phys. Rev. B 31, 1184
(1985).
'"Yo J. Chabal and K. Raghavachari, Phys. Rev. Lett. 54, 1055 (1985).
"Y. J. Chahal, in Chemistry and Physics a/Solid Surfaces VII, edited by R.
Vanselow and R. F. Howe, Springer Series in Surface Science. Vol. 10
(Springer, Berlin, 1988) pp. 109-150.
1('See, for example, Z. Schesinger, L. H. Greene, and A. J. Sievers, Phys.
Rev. B 32, 2721 (1985), and references therein.
17D. Graf, M. Grundner, and R. Shultz, J. Vac. Sci. Techno!. A 7, 808
(1989).
IMM. Grundner and R. Schulz, AlP Conf. Proc. 167, 329 (1987).
19H. Kobayashi, K. Edamoto, M. Onchi, and M. Nishijima, J. Chern. Phys.
78, ;429 (1983); Y. J. Chabal, G. S. Higashi, and S. B. Christman, Phys.
Rev. B 28, 4472 (1983).
ellE. R. Weinberger, G. G. Peterson, T. C. Eschrich. and H. A. Krasinski, J.
App!. Phys. 60, 3232 (1986).
"G. W. Trucks, K. Raghavachari, G. S. Higashi, and Y. 1. Chahal (unpub-
lished).
Higashi et al. 658
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