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Internal Use Only
Service Manual
LG-P500h
Date: October, 2010 / Issue 1.0
- -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION ..................................................................5
1.1 Purpose ............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1. Abbreviations ................................................................................... 7
2. PERFORMANCE ...................................................................9
2.1 Product Name .................................................................................. 9
2.2 Supporting Standard .................................................................... 9
2. Main Parts : GSM Solution ........................................................... 9
2.4 HW Features ....................................................................................10
2.5 SW Features ....................................................................................12
2.6 HW SPEC. .........................................................................................14
3. TECHNICAL BRIEF .............................................................22
.1 GENERAL DESCRIPTION .............................................................22
.2 GSM MODE ......................................................................................24
. UMTS MODE ...................................................................................26
.4 GPS RECEIVER .................................................................................29
.5 LO GENERATION and DISTRIBUTION CIRCUIT ...................29
.6 OFF-CHIP RF COMPONENTS ....................................................29
.7 Digital Baseband(DBB/MSM7227) .........................................5
.8 Hardware Architecture ...............................................................6
.9 Subsystem (MSM7227)...............................................................8
.10 Power Block ..................................................................................41
.11 External memory interface ....................................................46
.12 H/W Sub System .........................................................................47
.1 Audio and sound ........................................................................54
.14 Display ............................................................................................60
.15 Proximity Sensor ........................................................................62
.16 Vibrators (Q-Coin Motor) .........................................................6
.17 Compass Sensor .........................................................................64
.18 Motion Sensor .............................................................................66
.19 Main Features ..............................................................................67
4. TROUBLE SHOOTING .......................................................75
4.1 RF Component...............................................................................75
4.2 SIGNAL PATH ..................................................................................77
4. Checking TCXO Block ..................................................................80
4.4 Checking GSM TX Module(GSM PAM + FEM) Block .......82
4.5 Checking WCDMA Block ............................................................85
4.6 Checking GSM Block ...................................................................97
4.7 GPS/WIFI/BT RF Component ................................................. 105
4.8 GPS/WIFI/BT SIGNAL PATH ..................................................... 107
4.9 GPS/WIFI/BT Trouble shooting ............................................. 109
4.10 Power ON Troubleshooting ................................................ 117
4.11 Charging Trouble shooting ................................................. 120
4. 12 M AF Camera trouble ......................................................... 122
4. 1 Main LCD trouble ................................................................... 125
4.14 Proximity Sensor on/of trouble ....................................... 127
4.15 Motion Sensor on/of trouble ............................................ 129
4.16 Compass Sensor on/of trouble ........................................ 11
4.17 Q coin Motor ............................................................................. 1
5. DOWNLOAD ................................................................... 136
6. BLOCK DIAGRAM ........................................................... 149
7. CIRCUIT DIAGRAM ........................................................ 155
8. BGA Pin Map .................................................................. 163
9. PCB LAYOUT ................................................................... 167
10. RF CALIBRATION ......................................................... 171
10.1 Confguration of Tachyon .................................................... 171
10.2 How to use Tachyon ............................................................... 17
11. STAND ALONE TEST .................................................... 176
12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 183
12.1 EXPLODED VIEW ...................................................................... 18
12.2 Replacement Parts.................................................................. 185
12. Accessory ................................................................................... 204
- 4 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.

1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your companys employees, agents, subcontractors, or person working on your
companys behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common carrier telecommunication service of
facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that
result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.

- 6 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION

E. Notice of Radiated Emissions


This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices



ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:

Service personnel should ground themselves by using a wrist strap when exchange system boards. When
repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are
used.
When returning system boards or parts like EEPROM to the factory, use the protective package as described.
- 7 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION

6/140
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked Loop OPLL
Light Emitting Diode LED
Low Drop Output LDO
Liquid Crystal Display LCD
Intermediate Frequency IF
International Portable User Identity IPUI
Global System for Mobile Communications GSM
General Purpose Interface Bus GPIB
Gaussian Minimum Shift Keying GMSK
Flexible Printed Circuit Board FPCB
Electrostatic Discharge ESD
Electrical Erasable Programmable Read-Only Memory EEPROM
Digital Signal Processing DSP
dB relative to 1 milli watt dBm
Digital Communication System DCS
Digital to Analog Converter DAC
Constant Current Constant Voltage CC-CV
Bit Error Ratio BER
Baseband BB
Automatic Power Control APC
1. INTRODUCTION
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LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION

7/140
Wireless Application Protocol WAP
Voltage Control Temperature Compensated Crystal Oscillator VCTCXO
Voltage Controlled Oscillator VCO
Universal Asynchronous Receiver/Transmitter UART
Time Division Multiple Access TDMA
Time Division Duplex TDD
Travel Adapter TA
Side Tone Masking Rating STMR
Pseudo SRAM PSRAM
Static Random Access Memory SRAM
Sending Loudness Rating SLR
Subscriber Identity Module SIM
Surface Acoustic Wave SAW
Real Time Clock RTC
Root Mean Square RMS
Receiving Loudness Rating RLR
Radio Frequency RF
Public Switched Telephone Network PSTN
Phase Locked Loop PLL
Programmable Gain Amplifier PGA
Printed Circuit Board PCB
Power Amplifier Module PAM
1. INTRODUCTION
- 9 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE

2. PERFORMANCE

2.1 Product Name
LGP500h : WCDMA850/1900/2100+EGSM/GSM850/DCS/PCS
(HSDPA 7.2Mbps GPRS Class 10 / EDGE Class 10)

2.2 Supporting Standard
Item Feature Comment
Supporting Standard WCDMA(FDD1,2,5)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase 2+(include AMR)
SIM Toolkit: Class 1, 2, 3, C-E

Frequency Range WCDMA(FDD1) TX : 1920 1980 MHz
WCDMA(FDD1) RX : 2110 2170 MHz
WCDMA(FDD2) TX : 1850 1910 MHz
WCDMA(FDD2) RX : 1930 1990 MHz
WCDMA(FDD5) TX : 824 849 MHz
WCDMA(FDD5) RX : 869 894 MHz
EGSM TX: 880 915 MHz
EGSM RX: 925 960 MHz
GSM850 TX: 824 849 MHz
GSM850 RX: 869 894 MHz
DCS1800 TX : 1710 1785 MHz
DCS1800 RX: 1805 1880 MHz
PCS1900 TX: 1850 1910 MHz
PCS1900 RX: 1930 1990 MHz

Application Standard WAP 2.0

2.3 Main Parts : GSM Solution
Item Part Name Comment
Digital Baseband MSM7227 : Qualcomm
Analog Baseband PM7540 : Qualcomm
RF Chip RTR6285 : Qualcomm
- 10 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE

2.4 HW Features
Item Feature Comment
Form Factor DOP type
1) Capacity
Standard : Li-Ion polymer, 1500mAh

Battery
2) Packing Type : Soft Pack
Size
Standard :
113.5 x 59 x 13.3 mm

Weight 127g With Battery
Volume TBD
PCB L1B1 type, 10 Layers , 0.8t
Stand by time
2G Up to 350 hrs
3G Up to 3500 hrs
@ Paging Period 9 (2G)
@ DRX 7 (3G)
Charging time 3 hrs @ Power Off / 1500mAh
Talk time
2G Up to 250mins
3G Up to 250mins
@ Power Level 5 (2G)
@ Tx = 12dBm (3G)
RX sensitivity
WCDMA(FDD1) : -106.7 dBm
WCDMA(FDD2) : -104.7 dBm
WCDMA(FDD5) : -104.7 dBm
EGSM : -105 dBm
GSM850 : -105 dBm
DCS 1800 : -105 dBm
PCS 1900 : -105 dBm

WCDMA/
GSM/
GPRS
WCDMA : 24dBm/3.84MHz,+1/-3dBm
EGSM : 33dBm
GSM850 : 33 dBm
DCS 1800 : 30 dBm
PCS 1900 : 30 dBm
Class3(WCDMA)
Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)
TX
output
power
EDGE
GSM 900 : 27 dBm
DCS 1800 : 26 dBm
PCS 1900 : 26 dBm
E2 (GSM900)
E2 (PCS)
E2 (DCS)
GPRS compatibility GPRS Class 10
EDGE compatibility EDGE Class 10
SIM card type
Plug-In SIM
3V /1.8V

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Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE

Display
Main LCD
TFT Main LCD(3.2, 320 x 480)

Built-in Camera 3M CMOS Camera
Status Indicator No
Keypad
Function Key : 4
Side Key : 3
Function Key:
Home, Back, Menu, Search
Side Key :
Volume up/down,
Power Key
ANT Main : Internal Fixed Type
System connector 5 Pin
Ear Phone Jack 3.5Phi, 4 Pole, Stereo
PC synchronization Yes
Memory
NAND Flash : 4Gbit
SDRAM : 4Gbit

Speech coding FR, EFR, HR,AMR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
Blue Tooth V2.1+ EDR
MIDI(for Buzzer Function) SW Decoded 72Poly
Music Player MP3/ WMA/AAC/HE-AAC/EAAC+
Video Player MPEG4, H.263, WMV9
Camcorder MPEG4, H.263,
Voice Recording Yes
Speaker Phone mode
Support
Yes
Travel Adapter Yes
CDROM No
Stereo Headset Yes
Data Cable Yes
T-Flash
(External Memory)
Yes
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LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE

2.5 SW Features
Item Feature Comment
RSSI 0 ~ 4 Levels
Battery Charging 0 ~ 6 Levels
Key Volume 0 ~ 7 Level
Audio Volume 1 ~ 15 Level
Time / Date Display Yes
Multi-Language Yes
English/French/German/Spanish/Italia
n/Danish/Dutch/Korean
Quick Access Mode
Dialing/ Contact / Menu / Message /
Camera

PC Sync No
Speed Dial No Voice mail center -> 1 key
Profile Yes not same with feature phone setting
CLIP / CLIR Yes
Phone Book
Name / Number / Email / Chat Id/
Website/Postal
addresses/Organizations/Groups/
BirthdayNotes / Ringtone
There is no limitation on the number
of items.
It depends on
available memory amount.
Last Dial Number Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Last Received
Number
Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Last Missed Number Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Search by Number
/ Name
Name
Group Yes
There is no limitation on the number
of items. It depends on
available memory amount.
Fixed Dial Number Yes
- 1 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE

Service Dial Number No


Own Number Yes
Read only
(add/edit/delete are not
supported)
Voice Memo Yes
Call Reminder No
Network Selection Automatic
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge (AoC) Yes
Call Duration Yes
SMS (EMS)
There is no limitation on the
number of items. It depends on
available memory
amount.
EMS does not support.
SMS Over GPRS No
EMS Melody / Picture No
Send / Receive / Save No
MMS MPEG4
Send / Receive / Save
Yes
Long Message MAX 459 characters SMS 3pages
Cell Broadcast Yes
Download Over the Web
Game Yes
Calendar Yes
Memo Yes
There is no limitation on the number
of items.
It depends on available memory
amount.
World Clock No
Unit Convert No
Stop Watch No
Wall Paper Yes
- 14 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE

WAP Browser No
Support only web browser based on
webkit. WAP stack and wml are not
supported.
Download Melody /
Wallpaper
Yes Over web browser
SIM Lock Yes Operator Dependent
SIM Toolkit Class 1, 2, 3, C
MMS Yes Google MMS Client
EONS Yes
CPHS Yes V4.2
ENS No
Camera Yes
5M AF /
Digital Zoom : x4
JAVA Yes
CLDC V1.1 / MIDP V2.1
Download Over Web
Voice Dial No
IrDa No
Bluetooth Yes
Ver. 2.1+EDR
(HSP,HFP,A2DP,AVRCP)
FM radio Yes
GPRS Yes Class 10
EDGE Yes Class 10
Hold / Retrieve Yes
Conference Call Yes Max. 6
DTMF Yes
Memo pad No
TTY No
AMR Yes
SyncML Yes
IM Yes
Email Yes


- 15 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE

2.6 HW SPEC.
1) GSM transceiver specification
Item Specification
Phase Error
Rms : 5
Peak : 20
Frequency Error
GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance)
GSM/DCS : < -28dBm
Transmitter Output power and Burst
Timing
GSM : 5dBm 33dBm 3dB
DCS/PCS : 0dBm 30dBm 3dB
Burst Timing <3.69us
Spectrum due to modulation out to
less than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out to
larger than 1800kHz offset to the
edge of the transmit band
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection Speech
channels
800kHz, 1600kHz
: -98dBm/-96dBm (2.439%)
AM Suppression
T GSM : -31dBm
- DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance 0.5T


- 16 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE

2) WCDMA transmitter specification


Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band2 : 1850MHz ~ 1910 MHz
Band5 : 824MHz ~ 849MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within 0.1 PPM
Open Loop Power Control Normal Conditions : within 9 dB,
Extreme Conditions : within 12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage
Power Ratio (ACLR)
> 33 dB @ 5 MHz,
> 43 dB @ 10 MHz
Spurious Emissions
|f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz f < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz f < 12.75 GHz
< -60 dBm / 3.84 MHz RW @ 869 MHz f 894 MHz
< -60 dBm / 3.84 MHz RW @ 1930 MHz f 1900 MHz
< -60 dBm / 3.84 MHz RW @ 2110 MHz f 2155 MHz
< -67 dBm / 100 kHz RW @ 925 MHz f 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz f 1880 MHz
< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout -20 dBm
Peak Code Domain Error < -15 dB at Pout t -20 dBm



- 17 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE

3) WCDMA receiver specification


Item Specification
Receive Frequency Band1 : 2110 ~ 2170 MHz
Band2 : 1930 ~ 1990 MHz
Band5 : 869 ~ 894MHz
Reference Sensitivity Level Band1 : BER < 0.001 when or = -106.7 dBm / 3.84 MHz
Band2 : BER < 0.001 when or = -104.7 dBm / 3.84 MHz
Band5 : BER < 0.001 when or = -104.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when or = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity
(ACS)
ACS > 33 dB where BER < 0.001 when
or = -92.7 dBm / 3.84 MHz
& Ioac = 52 dBm / 3.84 MHz @ 5 MHz
Blocking Characteristic BER < 0.001 when or = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = 10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = 15 MHz
Spurious Response BER < 0.001 when or = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm
Intermodulation BER < 0.001 when or= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = 10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = 20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz f 12.75 GHz



Inner Loop Power Control
In Uplink
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24





- 18 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE

4) HSDPA transmitter specification


Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band2 : 1850MHz ~ 1910 MHz
Band5: 824MHz ~ 849MHz
Maximum Output Power Sub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz
HS-DPCCH
Sub-test
in table
C.10.1.4
Power
step
Power step slot
boundary
Power
step size,
P [dB]
Transmitter power
step tolerance [dB]
1 Start of
Ack/Nack
6 +/- 2.3
2 Start of CQI 1 +/- 0.6
3 Middle of CQI 0 +/- 0.6
5
4 End of CQI 5 +/- 2.3

Spectrum Emission Mask

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Frequency offset
from carrier f
Minimum requirement
Measurement
Bandwidth
2.5 ~ 3.5 MHz -35-15(f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1(f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10(f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz

Adjacent Channel Leakage
Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ 5 MHz
> 43 dB @ 10 MHz
Error Vector Magnitude < 17.5 %, when Pout -20 dBm


- 19 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE

5) HSDPA receiver specification


Item Specification
Receive Frequency

Band1 : 2110 ~ 2170 MHz
Band2 : 1930 ~ 1990 MHz
Band5 : 869 ~ 894MHz
Maximum Input Level
(BLER or R), 16QAM Only
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

BLER < 10% or R >= 700kbps

6) WLAN 802.11b transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level 20dBm under (Europe), 30dBm under (USA)
Frequency Tolerance within 25 PPM
Chip clock Frequency
Tolerance
within 25 PPM
Spectrum Mask -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz
-50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time 2us
Carrier Suppression -15dB
Modulation Accuracy
(Peak EVM)
35%
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%
Rx Max input Sensitivity -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER 8%
Rx Adjacent Channel
Rejection
35dB @FER 8%,
interference input signal -70dBm@fc25MHz(11Mbps)


- 20 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE

7) WLAN 802.11g transceiver specification


Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level 20dBm under (Europe), 30dBm under (USA)
Frequency Tolerance within 25 PPM
Chip clock Frequency
Tolerance
within 25 PPM
Spectrum Mask -20 @ 11MHz offset (9Mhz ~ 11MHz)
-28 @ 20MHz offset (11MHz ~ 20Mhz)
-40 @ 30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error
(rms EVM)
-5dB
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER 10%
Rx Adjacent Channel
Rejection
PER 10%,
ACR 16dB@6Mbps, ACR 15dB@9Mbps,
ACR 13dB@12Mbps, ACR 11dB@18Mbps,
ACR 8dB@24Mbps, ACR 4dB@36Mbps
ACR 0dB@48Mbps, ACR -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity

8) GPS receiver specification
Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite -142dBm, 7 satellites -147dBm at coarse time aiding
- 21 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE

7) WLAN 802.11g transceiver specification


Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level 20dBm under (Europe), 30dBm under (USA)
Frequency Tolerance within 25 PPM
Chip clock Frequency
Tolerance
within 25 PPM
Spectrum Mask -20 @ 11MHz offset (9Mhz ~ 11MHz)
-28 @ 20MHz offset (11MHz ~ 20Mhz)
-40 @ 30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error
(rms EVM)
-5dB
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER 10%
Rx Adjacent Channel
Rejection
PER 10%,
ACR 16dB@6Mbps, ACR 15dB@9Mbps,
ACR 13dB@12Mbps, ACR 11dB@18Mbps,
ACR 8dB@24Mbps, ACR 4dB@36Mbps
ACR 0dB@48Mbps, ACR -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity

8) GPS receiver specification
Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite -142dBm, 7 satellites -147dBm at coarse time aiding
- 22 -
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3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 GENERAL DESCRIPTION
The LG-P500h supports UMTS-850, UMTS-1900, UMTS-2100, GSM-850, GSM-850, GSM-900, GSM-1800, and
GSM-1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF
architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband.
The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked
loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.


[Figure 1-1] Block diagram of RF part

3. TECHNICAL BRIEF
RF Block Diagram
- 2 -
Copyright 2010 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF

A generic, high-level functional block diagram of LGP509 is shown in Figure 1-1. One antenna collects base
station forward link signals and radiates handset reverse link signals. The antenna connects with receive and
transmit paths through a ASM(Antenna-Switch-Module).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the
signal directly from RF-to-baseband using radioOne ZIF techniques. The RFICs Rx analog baseband outputs,
for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same
inputs to the MSM IC.
For the transmit chains, the RTR6285 IC directly translates the Tx baseband signals (from the MSM device) to
an RF signal using an internal LO generated by integrated onchip PLL and VCO. The RTR6285 IC outputs
deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective
UMTS PAs. In the GSM receive path, the received RF signals are applied through their band-pass filters and
down-converted directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with
the UMTS receiver and routed to the MSM IC for
further signal processing.
The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is
divided into phase and amplitude components to produce an open-loop Polar topology:

1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to
a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier
from a DAC within the MSM LGP509 power supply voltages are managed and regulated by the PM7540
Power Management IC. This versatile device integrates all wireless handset power management, general
housekeeping, and user interface support functions into a single mixed signal IC.
It monitors and controls the external power source and coordinates battery recharging while maintaining the
handset supply voltages using low dropout, programmable regulators.
The devices general housekeeping functions include an ADC and analog multiplexer circuit for monitoring
on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as
temperature, RF output power, and battery ID.
Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters
such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against
detrimental conditions.

LGP500h
LGP500h
- 24 -
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3. TECHNICAL BRIEF

3.2 GSM MODE


3.2.1 GSM RECEIVER
The GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs of RTR6285 are connected directly to the
transceiver front-end Module. GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs use differential
configurations to improve common-mode rejection and second-order non-linearity performance. For
example Figure 1-2 shows receiver input topologies for DCS and PCS (GSM-850/900 have the same receiver
input topologies). The balance between the complementary signals is critical and must be maintained from
the RF filter outputs all the way into the IC pins.


[Figure 1-2] DCS and PCS Receiver Inputs Topologies

Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only
receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency
duplexers this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900
receive signals are routed to the RTR6285 through band selection filters and matching networks that
transform single-ended 50-G sources to differential impedances optimized for gain and noise figure. The
RTR input uses a differential configuration to improve second-order intermodulation and common mode
rejection performance. The RTR6285 input stages include MSM-controlled gain adjustments that maximize
receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The
downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having
passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC
offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing
asshown in Figure 1-2.
- 25 -
Copyright 2010 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF

3.2.2 GSM TRANSMITTER


The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1) include on-chip output matching
inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The
capacitor value may be optimized for specific applications and PCB characteristics based on pass-band
symmetry about the band center frequency as shown in Figure 1-3.



[Figure 1-3] GSM Transmitter Outputs Topologies

The RTR6285 IC is able to support GSM 850/900 and GSM 1800/1900 mode transmitting. This design
guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive
pads to ensure that the load presented to the outputs remains close to 50ohm.
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3. TECHNICAL BRIEF

3.3 UMTS MODE


3.3.1 UMTS RECEIVER
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6285 device as shown in
Figure 1-4. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second
stage filter that provides differential downconverter as shown in Figure 1-5. This second stage input is
configured differentially to optimize secondorder intermodulation and common mode rejection
performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are
adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx
amplifiers drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted UMTS
Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for
UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are
buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when
the RTR6285 is downconverting GSM signals and on when the UMTS is operating.


[Figure 1-4] UMTS Receiver Inputs Topologies

- 27 -
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3.3.2 UMTS TRANSMITTER


The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog
input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter
output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is
filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that
simplifies the external matching network to a single series capacitor to achieve the desired 50- interface.
The RTR6285 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-
level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the
antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6285 IC with
the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for
multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback
divider, and digital logic generator.
UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine
different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal
directly from baseband to RF. This requires FLO to equal FRF, and the RTR6285 IC design achieves this
without allowing FVCO to equal FRF. The RTR6285 IC is able to support UMTS 2100/1900/1800/1700 and 850
mode transmitting. This design guideline shows only UMTS 2100 applications.

- 28 -
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3. TECHNICAL BRIEF


[Figure 1-5] RTR6285 IC Functional Block Diagram

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Copyright 2010 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF

3.4 GPS RECEIVER


The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from
the GPS antenna switch, through a band pass filter and then an impedance transformer circuit that optimally
matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in
Figure 1-6.


[Figure 1.6] GPS Input Network Topology



3.5 LO GENERATION and DISTRIBUTION CIRCUIT
The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes
to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS up-converters
and down-converters; with the help of these LO generation and distribution circuits, true zero-IF architecture
is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RFto-
baseband and from baseband-to-RF. Two fully functional fraction-N synthesizers, including VCOs and loop
filters, are integrated within the RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS
operation. The first synthesizer (PLL1) in the RTR6285 creates the transceiver Los that support the UMTS
transmitter, and all four GSM band receivers and transmitters including: GSM850, GSM900, GSM1800, and
GSM1900. The second synthesizer (PLL2) in the RTR6285 IC provides the LO for the UMTS primary receiver.
For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The
third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input
signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency
locked. The RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip
loop filter-series capacitors, which significantly reduces off-chip component requirement. With the
integrated fractional-N PLL synthesizers, the RTR6285 ICs have the advantage of more flexible loop
bandwidth control, fast lock time, and low-integrated phase error.

- 0 -
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3. TECHNICAL BRIEF

3.6 OFF-CHIP RF COMPONENTS


3.6.1. UMTS PAM
3.6.1.1 W2100, W850 (U1003,SKY77197)
The SKY77197 Power Amplifier Module (PAM) is a fully matched, 14-pad, surface mount module
developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient
module packs full WCDMA Band I and Band VIII coverage into a single compact package. The SKY77197
meets the stringent spectral linearity requirements of WCDMA transmission, with high
power added efficiency for power output to 27.5 dBm (Band I) and 28 dBm (Band V). The SKY77197
meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA)
data transmission with high power added efficiency. A directional coupler is integrated into the
module thus eliminating the need for any external coupler.
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active
circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching
circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize
efficiency and power performance.
The SKY77197 PAM is manufactured with Skyworks InGaP GaAs Heterojunction Bipolar Transistor
(HBT) BiFET process that provides for all positive voltage DC supply operation while maintaining high
efficiency and good linearity. No VREF voltage is required. Power down is accomplished by setting the
voltage on VENABLE to zero volts. No external supply side switch is needed as typical off leakage is
a few microamperes with full primary voltage supplied from the battery.



SKY77197 (W2100,W850)
- 1 -
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3.6.1.2 W1900 (U1005, SKY77702)


The SKY77702 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for
Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full
18501910 MHz bandwidth coverage into a single compact package. Because of high efficiencies attained
throughout the entire power range, the SKY77702 delivers unsurpassed talk-time advantages. The SKY77702
meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA), High
Speed Uplink Packet Access (HSUPA), and Long Term Evolution (LTE) data transmission with high power
added efficiency. A directional coupler is integrated into the module thus eliminating the need for any
external coupler. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC)
contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and
interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module
package to optimize efficiency and power performance. The SKY77702 PAM is manufactured with Skyworks
InGaP GaAs Heterojunction Bipolar Transistor (HBT) BiFET process that provides for all positive voltage DC
supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77702 is
supplied directly from any three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the
3.2 to 4.2 volt range. No VREF voltage is required. Power down is accomplished by setting the voltage on
VENABLE to zero volts. No external supply side switch is needed as typical off leakage is a few
microamperes with full primary voltage supplied from the battery.
G
G
G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G SKY77702 (W1900)
- 2 -
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3. TECHNICAL BRIEF

3.6.2 19.2MHz VCTCXO (X250, KT3225L19200DCW28RA0)


The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference
frequency for all RFIC synthesizers as well as clock generation functions within the MSM6285 IC. The oscillator
frequency is controlled by the MSM6285 ICs.
TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ.
A two-pole RC lowpass filter is recommended on this control line.
The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval
before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is
enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power
the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits
within the MSM7227 IC require a reference voltage for proper operation and sufficient accuracy. Connecting
the PM7540 IC REF_OUT directly to the MSM7227 IC GSM_PA_PWR_CTL_REF provides this reference. This
sensitive analog signal needs a 0.1 F low frequency filter near to MSM side, and isolate from digital logic and
clock traces with ground on both sides, plus ground above and below if routed on internal layers.


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3. TECHNICAL BRIEF

3.6.3 ASM + GSM PAM (U1002, SKY77544)


SKY77544 is a transmit and receive Front End Module (FEM) designed in a very low profile (0.9 mm), compact
form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation a
complete transmit VCO-to-Antenna and Antenna-toreceive SAW filter solution. The FEM also supports Class
12 General Packet Radio Service (GPRS) multi-slot operation and EDGE Polar Modulation. WCDMA switch-
through support is provided by three dedicated high-linearity ports.
The module consists of a GSM850/900 PA and DCS1800/PCS1900 PA block, impedancematching circuitry for
50 input and output impedances, Tx harmonic filtering, high linearitylow insertion loss switches, and a
CMOS Power Amplifier Control (PAC) block. A custom silicon integrated circuit contains decoder circuitry to
control the RF switch while providing a low current external control interface. An integrated temperature
sensor provides an analog voltage based on the temperature of the module.
Fabricated in InGaP/GaAs, the Heterojunction Bipolar Transistor (HBT) PA blocks support the GSM850/900
bands and DCS1800/PCS1900 bands. Both PA blocks share common power
supply pads to distribute current. The output of the PA block and the outputs to the seven
receive pads connect to the antenna pad through a highly linear antenna switch. The WCDMA
and Rx ports feature a 0 volts DC offset level, which eliminates any need for external blocking capacitors. The
InGaP/GaAs die, switch die, Silicon (Si) controller die, and passive components are mounted on a multi-layer
laminate substrate and the entire assembly is encapsulated with plastic overmold.
RF input and output ports of the SKY77544 are internally matched to a 50 load to reduce the number of
external components for a quad-band design. Extremely low leakage current of the FEM maximizes handset
standby time. Band selection and control of transmit and receive RF signal flows are performed by use of four
external control pads. See Figure 1.9 shown on overleaf. Mode of operation Tx, Rx, Band (GSM850, GSM900,
DCS, PCS, and UMTS) is controlled with 4 logic inputs: BS1, BS2, Mode, and TxEN. Proper timing of the TxEN
input and the VAPC input ensures high isolation between the antenna and Tx-VCO while the VCO is being
tuned prior to the transmit burst. The Enable input controls the initial turn-on of the PAC circuitry to
minimize battery drain.
The integrated power amplifier control (PAC) function provides envelope amplitude control by reducing
sensitivity to input drive, temperature, power supply, and process variation.

- 4 -
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3. TECHNICAL BRIEF


[Figure 1.9] SKY77544 Block Diagram



[Figure 1.10] SKY77544 Control Logic

- 5 -
Copyright 2010 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF

3.7 Digital Baseband(DBB/MSM7227)


3.7.1 General Description
A. Features(MSM7227)
The basic MSM7227 system solution consists of the MSM7227, RTR6285, and PM7540 ICs, plus AMSS
system software with the SURF7227 platform available for development. General features include:
-WCDMA Rel 99 plus HSDPA and HSUPA
-GSM/GPRS/EDGE
-High-performance ARM1136JF-S application processor at up to 600 MHz; QDSP5000 at 320 MHz
-High-performance ARM926EJ-S modem processor at up to 400 MHz; QDSP4000 at 122.88 MHz
-Java hardware acceleration for faster Java-based games and other applets
-Support for Bluetooth 2.1 EDR via an external Bluetooth System-on-Chip (SoC)
-High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnection cost
between the MSM device and the LCD panel
-Receive diversity support for WCDMA mode, thereby providing improved capacity and data throughput
-USB 2.0 compliant high-speed USB core with limited OTG capabilities
-Integrated high-speed USB PHY
-Integrated wideband stereo codec for digital audio applications
-Direct interface to digital camera module with video front-end (VFE) image processing
-GPS position location capabilities
-Vocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)
-Advanced 12 12 1.05 mm, 0.4 mm pitch, 560 NSP









3.6.4 GPS LNA (U1004, RF2815)


The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along
with high gain, achieved by the RF2815 makes it ideal for GPS recievers requiring high sensitivity. This
module builds upon RFMDs leading edge pHEMT process and integrates input matching and low loss high
rejection SAW filter at the output. This results in high performance and a reduced solution size. The ease of
implementation simplifies the reciever design.
The RF2185 is packaged in a compact 3.3 mm x 2.1 mm x 1.0 mm package with low external component
count required to achieve the best-in-class performance.
- 6 -
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3. TECHNICAL BRIEF

3.8 Hardware Architecture


<System HW Block>


Figure. Block Diagram
USBH DM & DP
Transceiver
(RTR6285)
Transceiver
(RTR6285)
BT_UART
Capacitive Touch
(Melpas + LGIT)
Key LED
Key LED
MUIC_I2C
MMC
USBPHY
SIM
UART3
LCD Backlight IC
AAT2862
BL_I2C
DDR SDRAM(4G)
NAND FRESH (4G)
EBI1 (DDR)
CAM I/F
TX_IQ, PRX_IQ
MOTION_I2C
BT_PCM
FM_L&R
RF I/F
USIM
KPD_PWR_N
I2C
PRX_IQ
GPS
CAM_I2C
MSM7227
EBI2 (NAND)
WLAN_SDIO
LINE_L& R
LBEH19UNBC-338
Bluetooth v2.1
Wi-Fi 802.11b/g
FM Radio
BT &
Wi-Fi
FM
FEM
(SKY77544)
FEM
(SKY77544) DRX_IQ
DRX_IQ
GPIO59
GPS
GSM & WCDMA
CAM 3M
TOUCH I2C
MCP(Micron)
Prox Sensor
(GP2AP002S00F)
PROX_I2C
SBDT
MOTION Sensor
(KR3DM)
MOTION_INT
FUEL_I2C
Back Key
UART3
Array TP
REMOTE_PWR_ON
MPP3,4
USIM
USIM I/F
GPIO106
SBDT_SSBI
PM7540
KPD_DRV_N
PMIC_SSBI
AMUX_OUT
HKAIN2 AMUX_OUT
AMUX_OUT
PM_INT_N
MSM_INT_N GPIO24
PWR/End Key
PON_RESET_N
PS_HOLD
GPIO25
RESIN_N
nJTAG_RESOUT
JTAG_PS_HOLD
JTAG
JTAG CONN.
JTAG(TCK,TDI,TDO)
UART3_TX/RX
QTKEY_I2C
System HW Block Diagram All System
Fuel Gauge
(MAX17040G)
Fuel Gauge
(MAX17040G)
PS_HOLD
MDDI Interface
Home Key
Send Key
MUIC
(TS5USBA)
MUIC
(TS5USBA)
I2C
5
p
i
n
_
U
S
B
C
o
n
n
e
c
t
o
r
5
p
i
n
_
U
S
B
C
o
n
n
e
c
t
o
r
Main Board
LINE_ON&OP
EAR1_OP&ON
HPH_L&R
LINE_OP, LINE_ON
RCV_P & N
HPH_R, HPH_L
Q-Motor
(WHVM-1030Q10)
Q-Motor
(WHVM-1030Q10)
GPIO_28
LIN_PWM_FREQ
Menu Key
Volume Key
Sub FPCB
MT29C4G96MAZAPCJA-5 IT
MIC
MIC
USIM
SPK_RCVP, N
Speaker &
Receiver
3.5 pi
Earjack
EAR_L, R
COMPASS_I2C Digital Compass
(AMI304) COMPASS_INT
Key COL, Key ROW
MDDI Interface
3.2" HVGA
320*480
Audio Sub
WM9093ECS-R
TOUCH INT
GPIO_27
GPIO36 ~ 38
Backlight_Key
AUDIO_I2C
TCXO_19.2MHz
(Kyocera)
RTR_TRK_LO_ADJ
TCXO_IN
TCXO
TCXO_RTR_19.2MHz
TCXO_PM_19.2MHz
TCXO_
26MHz
FM_L&R
F_CLK_IN
CLK_REQ
- 7 -
Copyright 2010 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF

<Power Block>



Figure. Simplified Block Diagram

- 8 -
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3. TECHNICAL BRIEF

3.9 Subsystem (MSM7227)


3.9.1. ARM Microprocessor Subsystem
The MSM7227 device uses an embedded ARM1136JF-S, ARM926EJ-S microprocessor. This microprocessor,
through the system software, controls most of the functionality for the MSM, including control of the
external peripherals such as the keypad, LCD, SDRAM, and NANDFlash devices. Through a QUALCOMM
proprietary single-wire SBI (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6285
and PM7540 devices.

3.9.2. WCDMA Subsystem
The WCDMA subsystem performs the data conversions and signal processing necessary to maintain the
WCDMA air interface between the handset and the base station (and also the WCDMA network). The
subsystem components include:
-Searcher engine
-Demodulating fingers
-Combining block
-Frame deinterleaver
-Viterbi decoder
-Reverse link subsystem
-Turbo decoder
On the forward link traffic channel, the WCDMA subsystem searches, demodulates, and decodes incoming
pilot, sync, paging, and traffic channel information. It extracts low bit-rate packet data from the forward link
traffic channel and sends the packet data to the vocoder for processing. On the reverse link, the WCDMA
subsystem processes the packet data from the vocoder and modulates the reverse traffic channel.

3.9.3. GSM Subsystem
The GSM subsystem performs the data conversions and signal processing necessary to maintain the GSM air
interface, including PA gain control for GPRS support. For GSM, the power profile ramps up before the burst
and ramps down afterward. For GPRS, transmit bursts can occur in as many as four sequential slots and the
PA must be ramped up and down smoothly between each slot, holding the desired output power level
during each burst. GSM support includes:
-GSM release 99 (circuit switching)
-GPRS (packet switching)
-EDGE E2 power class for 8 PSK

- 9 -
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3.9.4. RF Interface
The RF interface communicates with the mobile stations external RF and analog baseband circuits. Signals to
these circuits control signal gain in the Rx and Tx signal path and maintain The systems frequency reference.

3.9.5. Single-wire serial bus interface (SSBI)
The MSM7227 devices SSBI is designed specifically to be a quick, low pin count control protocol for
QUALCOMMs RTR6285 and PM7540 ASICs. Using the SSBI, the RTR6285 and PM7540 devices can be
configured for different operating modes and for minimum power consumption, extending battery life in
Standby mode. The SBI also controls DC baseband offset errors.

3.9.6. Audio function
MSM7227 audio functions include the analog Rx and Tx paths (or stereo wideband codec), audio digital
signal processing (DSP) that provides adjustable gains and filtering, PCM circuits for interfacing with external
devices, and additional audio DSP that actually implements encoding and decoding. Other key features
include:
-The wideband codec supports stereo music/ringer melody applications in addition to the 8 kHz voice
band applications on the forward link.
-A PCM interface allows an external codec to be used instead of the internal codec; this supports inter-IC
Sound (I2S) modes that allow an external stereo DAC or SADC to be used.
-Currently in AMSS baseline only I2S output mode is supported (SDAC-only, no SADC support).
-Audio decoder summing and headset switch detection are included.
-Audio DSP includes the Rx and Tx filters needed to meet ITU-T G.712 requirements.
-A programmable sidetone path provides for summing part of the Tx audio into the Rx path.
-Many codec parameters are configurable via SBI registers.
-The audio processing is configured through QDSP5 command types and is not directly controlled by the
microprocessor.

3.9.7. Vocoder Subsystem
The MSM7227 devices QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to
support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls,
Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC),
Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx
compensation filters. The MSM7227 devices integrated ARM9TDMI processor downloads the firmware into
the QDSP4000 and configures QDSP4000 to support the desired functionality.

- 40 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.9.8. Mode Select and JTAG Interfaces


The mode pins to the MSM7227 device determine the overall operating mode of the ASIC. The options under
the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode,
which enables the built-in trace mode, and test mode for factory testing. The MSM7227 device meets the
intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects
between devices within the mobile station during manufacture.

3.9.9. General-Purpose Input/Output Interface
The MSM7227 IC includes 133 general purpose input/output (GPIO) pins, and each can be configured as a
digital input or digital output. Inputs can be set to have a pull-up, pull-down, keeper, or no-pull. Output drive
strength is also programmable. Software assigns functions to the GPIOs and their configurations are set
accordingly. Some of the GPIO pins have alternate functions supported on them. The alternate functions
include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART
interface. The function of these pins is documented in the various software releases.

3.9.10. UART
The MSM7227 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share
multiplexed pins.
-UART1 for Bluetooth
-UART2 for USIM interface
-UART3 for data
.
3.9.11. USB
The MSM7227 IC supports one High Speed USB (HS-USB) USBH port with built-in PHY and one Full Speed
USB-UICC port. The MSM7227 IC supports USB interfaces using two controllers:
-The primary controller is the HS-USB port with an integrated physical layer (PHY). This HS-USB port is
also capable of supporting USB operations at low-speed and full-speed.
-The secondary controller is the FS USB-UICC port, which only supports host mode functionality.
- 41 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.10 Power Block


3.10.1. General
MSM7227, included RF, is fully covered by PM7540 (Qualcomm PMIC). PM7540 cover the power of MSM7227,
MSM memory, RF block, Bluetooth, USIM and TCXO.
Major power components are :
PM7540 (U403) : Phone main PMIC

3.10.2 PM7540
The PM7540 device (Figure) integrates all wireless handset power management. The power management
portion accepts power from all the most common sources battery, external charger, adapter, coin cell back-
up and generates all the regulated voltages needed to power the appropriate handset electronics. It
monitors and controls the power sources, detecting which sources are applied, verifying that they are within
acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the
handset electronics supply voltages. Eight programmable output voltages are generated using low dropout
voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages
the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator
signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses
the PM7540 IC using Single-wire SBI(SSBI) supplemented by an Interrupt Manager for time-critical
information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-
on sequence.
- 42 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF


Figure. PM7540 functional block diagram
Figure. PM7540 functional block diagram
- 4 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.10.3. Charging control


A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for the
charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin
(VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For
additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping
ADC via the analog multiplexer. PM7540 circuits monitor voltages at VCHARGER and ICHARGE pins to
determine which supply should be used and when to switch between the two supplies. These pins are
connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.
3.10.3.1. Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the
PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to
pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance
specified below (3.2V). The charging current is set to 80mA.

Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA




Figure. PM7540 Charging Flow (TC Charging)

- 44 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.10.3.2. Constant Current Charging


The PM7540 IC supports constant current charging of the main battery by controlling the charger pass
transistor and the battery transistor. The constant current charging continues until the battery reaches its
target voltage, 4.2V.



Figure. PM7540 Charging Flow (CC Charging)

u|z\\ZW
- 45 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.10.3.3. Constant Voltage Charging


Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of
constant voltage charging is commonly detected 10% of the full charging current.
3.10.3.4. LGP509 Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 700mA
-Nominal Battery Capacity : 1500mAh
-Charging time : Max. 3h 30m
- Full charge indication current (icon stop current) : 50mA
3.10.3.5. LGP509 battery bar icon display
Battery Bar Number Specification
BAR 6 (Full) 90% over
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup (No call)
Critical Low Battery Pop-up 0% ~ 3% : Level change popup (No call)
POWER OFF 0%
Remain %
Table. LGP509 battery bar specification
LGP500h
LGP500h
LGP500h
- 46 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.11 External memory interface


3.11.1. MSM7227
The MSM7227 device was designed to provide two distinct memory interfaces. EBI1 was targeted for
supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous
devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the high-bandwidth, high-density, and
low-latency requirements of the advanced on-chip applications, the MSM7227 IC has two high-speed, high-
performance memory slave interfaces: the external bus interface 1 (EBI1) and the stack memory interface
(SMI). To achieve higher bandwidth and better use of the memory device interface, the SMI accepts multiple
commands for the external memory
device. The SMI interface acts as a slave device to all of the bus masters within the MSM device. The masters
arbitrate to gain access to the SMI, and upon obtaining the access, they issue commands to the SMI. The bus
masters are connected to the SMI through an advanced extensible interface (AXI) bus bridge (or global
interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXI bus bridge
provides the arbitration logic for all of the bus masters.
EBI1 Features
- Support for only low-power memories at 1.8-V I/O power supply voltage
- AXI bus frequencies up to 133 MHz
- A 16-bit/32-bit static and dynamic memory interface
DDR SDRAM interface features include:
- Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed
- Supports auto precharge and manual precharge
- Supports partial refresh
- Separate CKE pin per chip-select to support partial operation mode
- Idle power down to save idling power consumption
EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).
- 2Mbytes of memory per chip select.
- Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)

3.11.2.LGP509 External memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package
-4Gbit Mobile DDR SDRAM / 4Gbit NAND Flash

Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
NAND 1.8V 42ns K524G2GACB-A050
SDRAM
SEC
1.8V 200MHz
LGP500h
- 47 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.12 H/W Sub System


3.12.1. RF Interface
3.12.1.1. RTR6285 (WCDMA_Tx, GSM_Tx/Rx)
MSM7227 controls RF part(RTR6285) using these signals.
-RTR6285_SSBI : SSBI I/F signals for control Sub-chipset
-RTR_TXON : Power AMP on RF part
-RTR_RX_I/Q_M/P, RTR_TX_I/Q_M/P : I/Q for T/Rx of RF
-RTR_DAC_REF : Reference input to the MSM Tx data DACs
3.12.1.2. the others
TRK_LO_ADJ : TCXO(19.2M) Control
PA_ON0/PA_RANGE0 : WCDMA(2100) TX Power Amp Enable
ANT_SEL[0-3] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
GSM_PA_RAMP : Power Amp Gain Control of APC_IC
3.12.1.3. RF2815 (GPS LNA)
* GPS_LNA_EN : GPS LNA Enable Signal (GPS LNA Shutdown)

- 48 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.12.1.4. LBEH19UNBC-338 (BT / WiFi module )


WiFi
* WLAN_CMD : WLAN SDIO Command Line.
* WLAN_CLK : WLAN SDIO Clock Input.
* WLAN_SDIO[3:0] : WLAN SDIO Data Line.
* WLAN_RESET_N : Low asserting reset for WLAN core.
* WLAN_HOST_WAKEUP : WL_HOST_WAKEUP signal output.
BT
* BT_UART_RXD : Bluetooth UART Serial Input.
* BT_UART_RTS : Bluetooth UART Request to Send. Active-low request.
* BT_UART_CTS : Bluetooth UART Clear to Send. Active-low clear.
* BT_UART_TXD : Bluetooth UART Serial Output.
* BT_PCM_CLK : BT PCM clock, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_DIN : BT PCM data input.
* BT_PCM_SYNC : BT PCM sync signal, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_OUT : BT PCM data output.
* BT_WAKEUP : BT Wakeup Input.
* BT_HOST_WAKEUP : BT Host Wakeup Output
* BT_RESET_N : Low asserting reset for BT core.
Common
* WLAN_REG_ON : If low the internal regulators will be disabled.
* SLEEP_CLK : LPO clock (32.768kHz) input. Used for low-power mode timing.
* CLK_IN : Crystal amplifier input or frequency reference input.
* CLK_REQ : Crystal Circuit / Reference Clock Enable (active-high)
FM Radio
* FM_ANT : FM RF input.
* SLEEP CLK : External reference oscillator input. (32.768KHz)
* FM_R : Right audio line output digital input data.
* FM_L : Left audio line output digital frame synchronization.

- 49 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
Figure. Wif/BT/FM Interface Block Diagram
WiFi/BT/FM Radio Block Diagram
26MHz
TCXO
32.768KHz
PM7540
SLEEP_CLK(LPO Clock:
32.768KHz)
WLAN_CMO
WLAN_CLK
WLAN_PEG_CN
WLAN_PESET_N
WLAN_SOC30|
BT_PESET_N
BT_PCM_SYNC
BT_PCM_ON
BT_PCM_OCUT
BT_PCM_CLK
BT_WAKEUP
BT_HCST_WAKEUP
BT_UAPT_CTS
BT_UAPT_PTS
BT_UAPT_PXO
BT_UAPT_TXO
3.5
Ear Jack
FM_ANT
WLAN_HCST_WAKEUP
FM_P
FM_L
AUOC2
AUOC!
BT_PST_N
BT_GPC_0
BT_GPC_!
FM_ANT
BT_PCM_SYNC
BT_PCM_CUT
BT_PCM_N
BT_PCM_CLK
BT_UAPT_PXO
BT_UAPT_TXO
BT_UAPT_PST_N
BT_UAPT_CTS_N
WLAN_HCST_WAKEUP
SOC_CMO
SOC_CLK
PEG_CN
WL_PST_N
SOC30|
W_WAKE_B
L
B
E
H
1
9
U
N
B
C
LNE_P_P
LNE_L_P
GPC94
GPC62
GPC23
GPC93
GPC46
M
S
M
7
2
2
7
GPC45
GPC44
GPC43
GPC!23
GPC70
GPC69
GPC68
GPC7!
GPC42
GPC83
ANT
GPC6467|
E
a
r

a
c
k
E
a
r

a
c
k
GPC63
S_CLK_N
F_CLK_N
CLK_IN
- 50 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.12.2 MSM Sub System


3.12.2.1. USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
-USIM_CLK : USIM Clock
-USIM_Reset : USIM Reset
-USIM_Data : USIM Data T/Rx




3.12.2.2. UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

GPIO_Map Name Note
GPIO_86 UART3_RX Data_Rx
GPIO_87 UART3_TX Data_Tx
Table. UART Interface

- 51 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.12.2.3. HS-USB
The High-Speed USB module contains an embedded UTMI+ core with a built-in transceiver eliminating the
need for an external PHY. The HS-USB port is a standard 4-pin interface that connects directly to the USB
connector (USBPHY_DP, USBPHY_DN, USBPHY_ID and USBPHY_VBUS). Two additional pins are required for
PHY operations which include an external reference resistor pin (USBPHY_REXT) and a USB system clock pin
which the USB PHY uses to lock its internal PLL (SYS_CLK)



Figure. HS-USB connections and architecture

- 52 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.12.3 KEY
3.12.3.1 Side key
There are 3 side key buttons that are controlled by MSM7227.
Refer to the circuit.









Figure. Volume Side key









Figure. Power key

0
1
6
A
V
CN3
4
3
2
1
470 R25
1
A
V
9
0
6
A
V
R613 470
R610 470
KEY_COL[2]
KEY_ROW[1]
KEY_ROW[0]
0603
CN5
2
1
VA2
KPD_PWR_N
- 5 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.12.3.3 KEY Backlight


There are 4 White side view LED, 4 white LED in key backlight circuit

Figure. KEY Backlight

2
7
1
1
R
1
3
7
1
1
R
1
5
7
1
1
R
1
LD1 LD4 LD3 LD2
C1931
2.2u
4
7
1
1
R
1
+VPWR
BACKLIGHT_KEY
- 54 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.13 Audio and sound
3.13.1 Overview of Audio path
3.5
q
1.8V LDO
RP103K181D
Audio Block Diagram
Figure. Block diagram of Audio & Sound path
- 55 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.13.2. Audio signal processing & interface


3.13.2.1 MSM7227 audio interface
The MSM7227A audio front end comprises the stereo wideband codec, PCM interface, and additional DSP
audio processing. The stereo wideband codec allows the MSM7227 device to support stereo music/ringer
melody applications in addition to the 8 kHz voice band applications on the forward link.
In the audio transmit path, the device operates as 13-bit linear converter with software, selectable 8 kHz and
16 kHz sampling rate. In the audio receive path, the device operates as a software-selectable 13-bit or 16-bit
linear converter with software selectable 8 kHz,16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz
sampling rate. Through software, the Rx path can be configured as either a mono or stereo output. New to
the MSM7227 device is a transmit (Tx) ADC path that now supports stereo wideband sampling. The
integrated codec contains all of the required conversion and amplification stages for the audio front end. The
codec operates as a 13-bit linear codec with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T
G.712 requirements.
The codec includes a programmable side tone path for summing a portion of the Tx audio into the Rx path.
An on-chip voltage/current reference is provided to generate the precise voltages and currents required by
the codec. This circuit requires a single capacitor of 0.1 F to be connected between the CCOMP and GND
pins. The on-chip voltage reference also provides a microphone bias voltage required for electret condenser
microphones typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 V DC
while delivering as much as 1 mA of current.
Audio decoder summing and headset switch detection are included. The codec interface includes the
amplification stages for both the microphone and earphone. On the transmit (Tx) path, the interface
supports two differential microphone inputs, a differential auxiliary input, and a stereo line input. On the
receive (Rx) path the interface supports one differential earphone output, a stereo single-ended headphone
output, one differential auxiliary output, and stereo single-ended line outputs. The codec is configured by
the codec SBI registers. The codec interface is shown in Figure.
Also part of the audio front end is the PCM interface. The PCM interface allows for an external codec to be
used instead of the internal codec. This interface can be used in I2S mode which will allows for an external
stereo DAC to be used. Finally, the audio front end includes additional DSP audio processing that does gains,
filtering and other audio processing.
The DSP audio processing is configured through the QDSP5000 command types and is
not directly controlled by the microprocessor.


- 56 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Figure. Detailed diagram of MSM7227 audio interface
- 57 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.13.2.2 WM9093 audio interface


The WM9093 is a high performance low power audio subsystem, including headphone driver and Class AB/D
earpiece/speaker driver. The Class D speaker driver support 650mV output power at 3.6V, 1%THD.
The unique dual mode charge pump architecture provides ground referenced headphone outputs removing
the requirement for external coupling capacitors. Class G technology is integrated to increase the efficiency
and extend playback time by optimizing the headphone driver supply voltages according to the volume
control.
The flexible input configuration allows single ended or differential stereo inputs. Mixers allow highly flexible
routing to the outputs, A voice Bypass path is also available for low-power voice applications.
The WM9093 is controlled using a two-wire I2C interface. An integrated oscillator generates all internal clocks.
Removing the need to provide any external clock.
Separate mixer and volume controls are provided for each headphone and speaker driver. Automatic Gain
control limits the speaker output signal in order to prevent clipping. DC offset correction to less than 1mV
Guarantees a pop/click-free headphone start up.
The WM9093 is available in a 2.0mm 2.5mm 20-bump CSP package.

Figure. Detailed diagram of WM9093 audio interface

- 58 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
FB701
1800
FB700
1800
33p
C702
1
2
MIC_BIAS
33p
C703
MIC1
6
5
4
3
2
1
OUT
G1
G2
G3
PWR
G4
VA615
33p
C700
MIC_1P
MIC_1N
changed 12/28
MIC
R509 12
J2
2
3
6
5
4
1 M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
10K
R521
FB502 1800
10K
R520
1
0
6
Q
D
G
S
0
0
5
D
2
0
5
D
3
0
5
D
47p
C542
1
0
5
D
33p
C544
M
1
8
6
1
1
R
15p
C545 C543
47p
4
0
5
D
270n
L504
VREG_MSMP_2.6V
U502
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
9
6
1
1
R
K
7
4
VREG_MSMP_2.6V
K
2 .
2
7
0
5
R
33p
C538
2.2u
C539
R515 12
FB500 1800
FB501 1800
10u
C537
FM_ANT
EAR_L
EAR_R
EARJACK_SENSE
HS_MIC_BIAS_EN
HS_MIC
HIGH
LOW(DEFAULT)
STATE
UNMATING
EAR_SENSE
MATING
2009.11.16 added
10.04.08 Changed Rev.C
3.5pi Ear Jack Connector
- 59 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
R1170 2.2K
2
0
5
C
p
9
3
3
0
5
R
0
2
5
0
5
R
K
7.
4
2.2K R1171
4
0
5
C
u
1
R1177 10
+VPWR_AUDIO
10 R1176
C522
2.2u
C509 33n
33n C510
C518
2.2u
2
0
5
R
0
2
4
0
5
R
K
7.
4
47p C505
47p C506
u
1
.
0
3
1
5
C
u
1
.
0
2
1
5
C
1u C511
1u C514
VREG_MSMP_2.6V
C519
2.2u
IC500
3
B
A4
C3
C2
2
B
D1
D3
4
D
C1
A1 D2
1
B
D5
A2
A5
A3
B5
4
B
C5
4
C
D
N
G
OUT+
D
D
V
P
H
CPVDD
CPVSS
CN
HPL
OUT-
S
A
I
B
IN2- HPR
IN1+
D
D
V
S
IN3-
IN2+
A
D
S
IN1-
IN3+
CP
L
C
S
1u C507
C508 1u
C523
2.2u
u
0
1
3
0
5
C
2.2u C515
VREG_HPVDD_1.8V
LINE_ON
LINE_OP
AUDIO&MOTION_I2C_SDA
HPH_R
HPH_L
AUDIO&MOTION_I2C_SCL
RCV_P
RCV_N
EAR_L
EAR_R
SPK_RCV+
SPK_RCV-
Audio SUB SYSTEM
- 60 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.14 Display
LCD module is connected to Main PCB with 24-pin connector.
The LCD is controlled by MDDI Interface in MSM7227.

Figure. Schematic of LCD connector (Main Board)











CN601
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
1
D
Z
FL603
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
VREG_LCD_2.8V VREG_LCD_1.8V
D600
4 3
5 2
6 1
2.2u
C616 C617
2.2u
WLED_PWR
C4
4.7u
WLED5 WLED4
WLED3 WLED2
WLED1
WLED6 WLED7
LCD_RESET_N
LCD_MAKERID_LOW
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_P
LCD_VSYNC_O
3.2" HVGA LCD Connector
- 61 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF


Table. Interface between LCD Module and MAIN Board



- 62 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.15 Proximity Sensor


When call connected, the object is moved nearer to the proximity sensor.
LCD backlight and Touch screen is disable operation automatically.
U700 : GP2AP002S00F IC used I2C interface to MSM7227

Figure. Proximity Sensor Schematic

Figure. Proximity Sensor Block Diagram
VREG_MSMP_2.6V
U700
5 4
6 3
7 2
8 1
LEDA SCL
LEDC SDA
VCC VIO
VOUT
GND
C707
1u
R700
10
C708
0.1u
R703
10
VREG_PROX_2.8V
R702
4.7Kohms
R701
4.7Kohms
C709
4.7u
10u
C705
PROX_OUT
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDA
- 6 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.16 Vibrators (Q-Coin Motor)


The strength of vibration is determined by the duty cycle of PWM (LIN_PWM_FREQ)
U602 : EUSY0404001 is Q-Coin motor driver IC.

Figure. Q-Coin Moter IC Schematic


Figure. Vibrator Block Diagram
C623
0.1u
R614
4.7Kohms
R617
51K
C625 10n
R612 100K
R618
1K
R615
1K
R616
51K
VREG_MOTOR_3.3V VREG_MOTOR_3.3V
U602
B2 C1
A1 B1
B3 C2
A3 C3
IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
Q600
C
B
E GND
IN
OUT
C624
0.1u
R619 100K
LIN_PWM_FREQ
MTR_P_2sub
MTR_N_2sub
1%
1%
1%
1%
1%
1%
- 64 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF


3.17 Compass Sensor
If a customer buy the application SW, The Sensor Support a Eletric Compass function
U1 : AMI304 IC used I2C interface to MSM7227


Figure. Compass Sensor Schematic
C706
470n
VREG_MSMP_2.6V VREG_MOTION_3.0V
4
0
7
C
n
0
1
U1
12
11
10
9
5
4
6
3
7
2
8
1
D
D
V
D
G
E
R
V
A
D
N
G
S
D
N
G
D
D
V
A
ADDR
SCL
NC1
T
N
I
VPP
DRDY
SDA
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDA
COMPASS_DRDY
- 65 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF


Figure. Compass Sensor Block Diagram


- 66 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF


3.18 Motion Sensor
According to tilt the cell phone, the screen is had rotated automatically.
U503 : KR3DH IC used I2C interface to MSM7227
















Figure. Motion Sensor Schematic


Figure. Compass Sensor Block Diagram
0
4
5
C
u
1
.
0
U503
6
1
7 6
5
4
8
3
9
2
10
1
11
12
13
4
1
5
1
2
D
E
V
R
E
S
E
R
D
D
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
S
C
SCL_SPC
GND1
O
D
S
_
I
D
S
_
A
D
S
0
A
S
_
O
D
S
4
D
N
G
VREG_MOTION_3.0V
10u
C541
8
1
5
R
K
2
.
2
9
1
5
R
K
2
.
2
MOTION_INT
MOTION_I2C_SCL
MOTION_I2C_SDA
- 67 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF


3.19 Main Features
3.19.1. LG-P500h Main Features
- DOP Type design
- UMTS 2100 + UMTS 1900 + UMTS 850 + GSM 900 + DCS 1800 + PCS 1900 + GSM850 based
GSM/GPRS/EDGE/UMTS
- HSDPA 7.2Mbps
- TFT Main LCD(3.2 HVGA, 320 x 480)
- Capacitive/Electrostatic Touch Window
- 3M AF Camera
- 3.5Phi Stereo Headset & Speaker phone
- Mobile XMF Mobile DLS / Scaleable Polyphony
- MP3/AMR/AAC/AAC/WAV/WMA decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g)
- Supports FM Radio
- 1500 mAh (Li-Ion)
















LG-P500h
- 68 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.19.2. LG-P509 Main component (bottom)



Main Board Bottom








Logic
RF
PMIC
WLAN
GPS
LG-P500h
- 69 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.19.2. LG-P509 Main component (bottom & Sub carrier)





























Main Board Bottom & Sub carrier





Vibrator
Camera
SD memory
soket
LG-P500h
- 70 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.19.2. LG-P509 Main component (Top)

























Main Board Top








Power key
Side Volume key
Dome key
LG-P500h
- 71 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.19.3. RF of LG-P500h
G

















FL1006
FL1010
WCDMA PAM(II)
DCS/PCS RX Dual SAW Filter
FL1001 TCXO X200
RF Antenna connector SW1001 WCDMA (I) RX SAW Filter
EGSM/850 RX Dual SAW Filter
U1005 WCDMA (I) TX SAW Filter
FL1003
WCDMA (I) Duplexer
FL1002 External LNA(I, II ,V) U2
WCDMA (II) Duplexer WCDMA PAM(I, V) U1003
WCDMA (II) RX SAW Filter FL1012 GSM PAM/FEM module U1002
WCDMA (II) TX SAW Filter FL1009 RTR6285 U1001
Description Reference Description Reference
SW1001
X200
FL1006
U1002 FL1008
FL1009
FL1002
FL1010
FL1001
U1001
U1003
U1005
FL1003
FL1012
U2
FL1008
FL1
FL1005
FL2
FL1
FL2
WCDMA (V) RX SAW FILTER FL1005 WCDMA (V) TX SAW FILTER
WCDMA (V) DuplexerG
- 72 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.19.4. BaseBand of LG-P509




































GPS D flip-flop U502 Level shifter U601
LCD CONN. CN601 MDDI filter FL603
J-TAG CONN. CN200 Q-coin Motor drive amp U602
Motion sensor U503 MSM7227 U200
Charge pump U1007 Memory U301
Description Reference Description Reference
U301
U602
U1007
U503 U202
FL603
U601
CN200
CN601
LG-P500h
- 7 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF

3.19.5. Power and Logic of LG-P509




































Q400
Fuel gauge IC U404
Sleep X-tal X400 SIM connector J1
Battery Conn. CN401 Digital Compass U1
Charging IC Q400 PM7540 U403
Description Reference Description Reference
X400
U403
U1
J1
CN401
U404
LG-P500h
- 74 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.19.6. Audio of LG-P509

































CN1 CN600 U502 IC500
G
G Audio Sub system IC500
Headset Bias LDO U502 Sub FPCB B2B conn. CN2
Camera conn. CN600 Touch Conn. CN1
Description Reference Description Reference
LG-P500h
- 75 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG
TROUBLE SHOOTING
4.1 RF Component
G G
U1002
FEM
SW1001
RF SW
FL1008
W2100 Duplexer
FL1010
W1900 Duplexer
U1003
W2100/W850
PAM
U1001
RF Transceiver
FL1009
W1900 Tx saw filter
FL1006
W2100 Tx saw filter
U2
WCDMA LNA
FL1001
EGSM/850
Rx saw filter
FL1002
DCS/PCS
Rx saw filter
X200
VCTCXO
U1005
W1900
PAM
FL1003
W2100 Rx saw filter
FL1012
W1900 Rx saw filter
FL1005
W850 Tx saw filter
FL1
W850 Rx saw filter
FL2
W850 Duplexer
4. TROUBLE SHOOTING
- 76 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G













RF component (WCDMA / GSM)

Reference Description Reference Description
U1001 RTR6285(Transceiver) FL1001 EGSM/850 Rx saw filter
U1002 GSM TX Module
(FEM + GSM/EDGE PAM)
U2 WCDMA (I, IV)
LNA
U1003 WCDMA Dual (I,VIII) PAM U1005 WCDMA (IV) PAM
FL1006 WCDMA (I) TX SAW Filter X200 VCTCXO(19.2MHz)
FL1003 WCDMA (I) RX SAW Filter U1004 GPS LNA
FL1008 WCDMA (I) Duplexer FL1007 GPS SAW Filter
FL1009 WCDMA (IV) TX SAW Filter
FL1012 WCDMA (IV) RX SAW Filter
FL1010 WCDMA (IV) Duplexer
FL1002 DCS/PCS Rx saw filter
SW1001 RF Antenna Connector

U1004
GPS LNA
FL1007
GPS Rx saw filter
- 77 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.2 SIGNAL PATH


WCDMA I and II and V Band TX Signal PATH
D2. WCDMA 2100 TX PATH
E2. WCDMA 1900 TX PATH
F2. WCDMA 850 TX PATH
G1. COMMON TX/RX PATH
- 78 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G


WCDMA I and II and V Band RX Signal PATH
D1. WCDMA 2100 RX PATH
E1. WCDMA 1900 RX PATH
F2. WCDMA 850 TX PATH
F1. COMMON TX/RX PATH



- 79 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G



GSM850/GSM900/DCS/PCSs RX/TX Signal PATH
A. GSM850/GSM900/DCS1800/PCS1900 RX PATH
B. GSM850/GSM900/DCS1800/PCS1900 TX PATH
C. COMMON TX/RX PATH


- 80 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G

4.3 Checking TCXO Block
The output frequency (19.2MHz) of TCXO (X200) is used as the reference one of RTR6285 and PM7540 internal
VCO.


Schematic of the Crystal Part (19.2MHz)
TP3
TP2
TP1
TP2
TP3
TP1
R208 220
R210 100K
U201
3
2
4
1
5
VCC
GND
C220 0.1u
C221 330p
VREG_MSMA_2.6V
VREG_TCXO_2.85V
330p
C210
330p C207
C205
1n
C206
0.1u
19.2MHz
KT3225L19200DCW28RA0
X200
4 2
3 1
VCONT OUT
GND VCC
R205 100
R209 33
C208
10n
TCXO_EN
TCXO_RTR_19.2MHZ
TCXO_PM_19.2MHZ RTR_TRK_LO_ADJ
USBH_SYSCLK
Clesed to TCXO
TCXO Circuit
1.0T
FFA Rev.C(220Ohm@100MHz)
TP2
TP1
TP3
- 81 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Check TP1
VCC of TCXO
VCC 2.85V Check the PM7540
No
Yes
Check TP2
2.4V Voltage 0.4V Check the MSM7227
No
Yes
Check TP
19.2 MHz Signal
Check soldering and
components
No
Yes
TCXO is OK
- 82 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.4 Checking GSM TX Module(GSM PAM + FEM) Block









VBATT(TP1)
ANT_SEL0
ANT_SEL3
ANT_SEL2
ANT_SEL1
- 8 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING XU{yv|islGzovv{punG G
G




Schematic of the Antenna Switch Block


TP1
2.2K
R1006
U1002
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
39p
C1024
0
3
1
4
R
47
R6
0
3
1
5
R
+VPWR_RF
C1043
10u
75
R7
1
9
6
1
R
C1045 1n
1n C1047
1n C1048
C1051 1n
1
9
5
1
R
47p
C1044
ANT_SEL1
ANT_SEL2
ANT_SEL0
ANT_SEL3
GSM_PA_RAMP
DCS_PCS_TX
GSM_TX
0603
2mm
11dB
7dB
GSM850(824-849MHz)
8
0
6
1
GSM900(880-915MHz)
PCS(1850-1910 MHz)
DCS(1710-1785 MHz)
0603
TP1
- 84 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Check ANT_SEL 0, 1, 2,
High Level
1.2V < Voltage < V Check the TP1(VBATT)
No
Yes
Check the Logic in each mode
- 85 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.5 Checking WCDMA Block
START
1. Check TCXO 19.2MHz
6. Ro-download SW & Cal.
2. Check FEM Block
Refer to 1.4
. Check RF Tx Level
4. Check PAM Block
Refer to 1.5.4
5. Check RF Level
- 86 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.5.1Checking TCXO Block
Refer to 1.3
4.5.2. Checking FEM Block
Refer to 1.4
4.5.3. Checking RF TX Level


Test Point (TX Level)
TP1
TP2
TP3
TP4
- 87 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
U1002
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
18n
L1004 L11
DNI
33p C1005
SW1001
4 3
2
1
ANT COMMON
G3 G4
GND
WCDMA_2100_RTX
WCDMA_850_RTX
WCDMA_1900_RTX
TP1
33p
C1087
C1079
8.2p
L1030
DNI
L1151
3n
C1929
100p
L1027 3.3n
FL1005
836.5MHz
3 2
4 1
5
GND
IN OUT
G1 G2
5
1
1
1
R
C1153
33p
I
N
D
3
6
1
1
R
C1086
DNI
FL1009
1880MHz
5 2
4 1
3
G3
IN OUT
G1 G2
C1090
12p
2.7n
L1035
FL2
836.5 MHz,881.5 MHz
7 5
8
4 9
2
3
1 6
ANT RX
TX
GND1
GND5 GND2
GND6
GND3 GND4
C1081
DNI
8
7
1
1
R
0
L1021
6.8n
C1088
15p
L1025
1.5n
C1084
3n
L1033
DNI
FL1008
7 5
8 4
9 2
3
1 6
ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
DNI
L1020
U1003
6
1
5
1
8 7
9 6
10 5
11 4
12 3
13 2
14 1
IN_BAND_V OUT_BAND_V
VMODE_0 GND3
VMODE_1 VCC2_2
VCC2_1 GND2
VEN_BAND_V OUT_BAND_I
VEN_BAND_I GND1
IN_BAND_I CPL_OUT
1
D
N
G
P
2
D
N
G
P
3.3p
C1089
5.6n
L1029
33
R1022
18
R1023
+VPWR_RF
C1075
0.001uF
10u
C1077
330p
C1076
L1026
DNI
C1109
33
L1041
1.5n
C1154
4.7n
C1092
1.5n
C1083
33p
100p
C1094 C1096
100p 100p
C1095
L1031
DNI
U1005
6 5
7 4
8 3
9 2
10 1
11
PGND
VCC1 VCC2
RFIN RFOUT
VMODE_1 CPL_IN
VMODE_0 GND
VEN CPL_OUT
C1112
1.5p
+VPWR_RF
1950MHz
FL1006
5 2
4 1
3
G3
IN OUT
G1 G2
C1111
1.5p
C1113
100p
C1104
1n
C1110
100
C1114
100p 100p
C1115
2.2u
C1102
33p
C1103
C1108 33p
C1116
0.5p
L1040
2.4n
FL1010
1880,1960MHz
7 5
8 4
9 2
3
1 6
ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
C1078
22p
C1117
DNI
L1130
18n
10n
L1022
L1150
DNI
L1120
DNI
100p
C12
100p
C13
9.
9
4
7
2
0
1
R
PA_ON1
PA_ON0
PA_R0
PA_R0
PA_ON2
WCDMA_2100_RTX
WCDMA_2100_TX_OUT
PDET_IN
WCDMA_1900_TX_OUT
WCDMA_850_RTX
WCDMA_850_TX_OUT
PA_R1
PA_R1
WCDMA_1900_RTX
W1900
0603
Band I
Band 5
W2100
W850
WCDMA 1900 Tx (1850-1910MHz)
Band 2
Near to 12 Pin Near to 12 Pin Near to 4 Pin
Near to 10 Pin Near to 1 Pin
TP2
TP2
TP3
TP3
TP4
TP2
TP3
TP4
TP4
- 88 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
For testing, Max power output is needed.
Check ANT_SEL 0, 1, 2
(High, Low, Low)
Check TP1 Over 21dBm? RF Tx Level is OK
Yes
No
Check PAM Block
Refer to 1.5.4
Check TP2 Over 21dBm? Check TX Module
Yes
No
Check TP Over 21dBm? Check Duplexer
Yes
No
Check TP4 Over 7dBm? Check RTR6285
Yes
No
RTR6285 Maximun output Power = 7dBm
RTR6285 minimun output Power = -80dBm
- 89 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.5.4. Checking PAM Block
PAM control signal
W_PA_ON (W_1900_PA_ON(C1115), W_2100_PA_ON(C1095) and W_850_PA_ON(C1096)) :
PAM Enable
W_PA_RO: PAM Gain Control
W_PA_ON must be HIGH (over 2.6V)


- 90 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
PAM IN/OUT Signal :
When PAM is under the operation of high power mode (WCDMA_PA_R0(C1929):Low),
PAM OUT power must be over 21 dBm
PAM IN power must be under 10 dBm



TP3
TP1
TP2
- 91 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
33p
C1087
C1079
8.2p
L1030
DNI
L1151
3n
C1929
100p
L1027 3.3n
FL1005
836.5MHz
3 2
4 1
5
GND
IN OUT
G1 G2
5
1
1
1
R
C1153
33p
I
N
D
3
6
1
1
R
C1086
DNI
FL1009
1880MHz
5 2
4 1
3
G3
IN OUT
G1 G2
C1090
12p
2.7n
L1035
FL2
836.5 MHz,881.5 MHz
7 5
8
4 9
2
3
1 6
ANT RX
TX
GND1
GND5 GND2
GND6
GND3 GND4
C1081
DNI
8
7
1
1
R
0
L1021
6.8n
C1088
15p
L1025
1.5n
C1084
3n
L1033
DNI
FL1008
7 5
8 4
9 2
3
1 6
ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
DNI
L1020
U1003
6
1
5
1
8 7
9 6
10 5
11 4
12 3
13 2
14 1
IN_BAND_V OUT_BAND_V
VMODE_0 GND3
VMODE_1 VCC2_2
VCC2_1 GND2
VEN_BAND_V OUT_BAND_I
VEN_BAND_I GND1
IN_BAND_I CPL_OUT
1
D
N
G
P
2
D
N
G
P
3.3p
C1089
5.6n
L1029
33
R1022
18
R1023
+VPWR_RF
C1075
0.001uF
10u
C1077
330p
C1076
L1026
DNI
C1109
33
L1041
1.5n
C1154
4.7n
C1092
1.5n
C1083
33p
100p
C1094 C1096
100p 100p
C1095
L1031
DNI
U1005
6 5
7 4
8 3
9 2
10 1
11
PGND
VCC1 VCC2
RFIN RFOUT
VMODE_1 CPL_IN
VMODE_0 GND
VEN CPL_OUT
C1112
1.5p
+VPWR_RF
1950MHz
FL1006
5 2
4 1
3
G3
IN OUT
G1 G2
C1111
1.5p
C1113
100p
C1104
1n
C1110
100
C1114
100p 100p
C1115
2.2u
C1102
33p
C1103
C1108 33p
C1116
0.5p
L1040
2.4n
FL1010
1880,1960MHz
7 5
8 4
9 2
3
1 6
ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
C1078
22p
C1117
DNI
L1130
18n
10n
L1022
L1150
DNI
L1120
DNI
100p
C12
100p
C13
9.
9
4
7
2
0
1
R
PA_ON1
PA_ON0
PA_R0
PA_R0
PA_ON2
WCDMA_2100_RTX
WCDMA_2100_TX_OUT
PDET_IN
WCDMA_1900_TX_OUT
WCDMA_850_RTX
WCDMA_850_TX_OUT
PA_R1
PA_R1
WCDMA_1900_RTX
W1900
0603
Band I
Band 5
W2100
W850
WCDMA 1900 Tx (1850-1910MHz)
Band 2
Near to 12 Pin Near to 12 Pin Near to 4 Pin
Near to 10 Pin Near to 1 Pin
TP3
TP3
TP2
TP1
TP3
TP1
TP1
- 92 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone Tx is On and
PDM is 210
Check TP Over 21dBm? RF Tx Level is OK
Yes
No
Change the board
Check TP2 PA_RO 2.6V Check MSM7227
Yes
No
Check TP1 Over 10 dBm? Check RTR6285
Yes
No
- 9 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.5.5. Checking RF Rx Level


Test Point (RF Rx Level)




TP1
TP2
TP3
TP5
Bias
TP4
4.5.5. Checking RF Rx Level
- 94 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
2.2K
R1006
U1002
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
39p
C1024
0
3
1
4
R
47
R6
0
3
1
5
R
R1005
0.75p
18n
L1004
+VPWR_RF
C1043
10u
75
R7
ANT1003
L11
DNI
1
9
6
1
R
C1045 1n
1n C1047
ANT1002
C1003
15p
100p
C1007
33p C1005
1n C1048
C1051 1n
C1009
8.2n
1
9
5
1
R
47p
C1044
SW1001
4 3
2
1
ANT COMMON
G3 G4
R1004
3.3n
ANT_SEL1
ANT_SEL2
ANT_SEL0
ANT_SEL3
GSM_PA_RAMP
GND
DCS_PCS_TX
GSM_TX
0603
2mm
11dB
7dB
GSM850(824-849MHz)
8
0
6
1
GSM900(880-915MHz)
PCS(1850-1910 MHz)
DCS(1710-1785 MHz)
0603
TP1
C1079
8.2p
C1090
12p
2.7n
L1035
FL2
836.5 MHz,881.5 MHz
7 5
8
4 9
2
3
1 6
ANT RX
TX
GND1
GND5 GND2
GND6
GND3 GND4
C1081
DNI
L1021
6.8n
FL1008
7 5
8 4
9 2
3
1 6
ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
L1041
1.5n
L1031
DNI
C1116
0.5p
FL1010
1880,1960MHz
7 5
8 4
9 2
3
1 6
ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
C1117
DNI
L1130
18n
L1120
DNI
100p
C12
100p
C13
WCDMA_2100_RTX
WCDMA_850_RTX
WCDMA_1900_RTX
Band I
Band 5
Band 2
TP2
TP2
TP2
- 95 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
C36
1.2p
DNI
R9
C1122
1.2p
C23
10p
FL1012
1960MHz
4 5
1
3 2
G1 O1
IN
G2 O2
8.2n
L2
8
R
0
10n
C20
DNI
R12
L1042
5.6n
VREG_TCXO_2.85V
BGA735L16
U2
9
8
7
6
5
0
1
4
1
1
3
2
1
2
3
1
1
14
15
16
17
PGND
RFOUTM
RFOUTH
RFOUTL
C
N
F
E
R
R
S
G
V
1
N
E
V
C
C
V
2
N
E
V
1
H
D
N
G
F
R
L
N I
F
R
2
H
D
N
G
F
R
RFINM
RFINH
RFGNDM1
RFGNDM2
L1048
5.6n
C1123
DNI
C37
1.2p
C14
27p
10p
C27
C1148
0.5p
2.7n
L6
22n
L8
10n
L9
2.2n
L10
DNI
C1128
R24
33p
22p
C24
L4000
DNI
L7
1n
3.3n
C10
12p
C28
0
0
1
R
27K
R18
C1728
DNI
4.7p
C15
C1928
DNI
FL1
881.5MHz
4 5
1
3 2
G1 O1
IN
G2 O2
0
R14
C26
2.7p
RX_WCDMA_2100
RX_WCDMA_1900_M
RX_WCDMA_1900_P
RX_WCDMA_850_P
RX_WCDMA_850_M
RX_WCDMA_1900_SE
INTER_RX_SW_SEL_1
INTER_RX_SW_SEL_2
LNA_GAIN_CONTROL
0603
22p
C25
22p
C22
L5
3.3n
TP3
TP3
TP4
TP4
K
1
9
1
0
1
R
7
6
0
1
C
u
1
.
0
p
0
0
1
8
6
0
1
C
3.9p C1069
L1018
1.8n
2n
L1017
L1019
1.8n
DNI
C1070
C1080 3.9p
C1073
DNI
VDD_RX
C1072 33p 33p C1071
2140MHz
FL1003
4 5
1
3 2
G1 O1
IN
G2 O2
DNI
R1021
R1029
DNI
WB2100_MIX_INM
WB2100_MIX_INP RX_WCDMA_1900_LNA_OUT
RX_WCDMA_2100_LNA_OUT
3
0
6
0
W2100 RX(2110 - 2170 MHz)
Bias
TP5
TP3
TP4
- 96 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone Rx is On
Check BIAS over 2.1V Check bias block soldering
No
Yes
Change the board
Check TP1 Signal exist? Check RF Switch (M/S)
No
Yes
Check TP2 Signal exist? Check TX Module Refer 1.4
No
Yes
Check TP Signal exist? Check Duplexer
No
Yes
Check TP4 Signal exist? Check LNA
No
Yes
Check TP5 Signal exist? Check RTR6285 and Rx SAW flter
No
Yes
- 97 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Start
1. Check TCXO Block
4. Ro-download SW & Cal.
2. Check ANT_SW Module
. Check RF TRX Level
4.6 Checking GSM Block
- 98 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G






1
2,3
- 99 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.6.1 Checking TCXO Block
Refer to 1.3
4.6.2 Checking FEM Block
Refer to 1.4
4.6.3 Checking RF TX level



TP1
TP2
TP3
- 100 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
2.2K
R1006
U1002
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
39p
C1024
0
3
1
4
R
47
R6
0
3
1
5
R
R1005
0.75p
18n
L1004
+VPWR_RF
C1043
10u
75
R7
ANT1003
L11
DNI
1
9
6
1
R
C1045 1n
1n C1047
ANT1002
C1003
15p
100p
C1007
33p C1005
1n C1048
C1051 1n
C1009
8.2n
1
9
5
1
R
47p
C1044
SW1001
4 3
2
1
ANT COMMON
G3 G4
R1004
3.3n
ANT_SEL1
ANT_SEL2
ANT_SEL0
ANT_SEL3
GSM_PA_RAMP
GND
DCS_PCS_TX
GSM_TX
0603
2mm
11dB
7dB
GSM850(824-849MHz)
8
0
6
1
GSM900(880-915MHz)
PCS(1850-1910 MHz)
DCS(1710-1785 MHz)
0603
TP1
TP3
Schematic of GSM/DCS/PCS Tx Block
TP2
- 101 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Check TCXO Block Refer to 1.
Check TP1
If GSM over 1 dBm?
If DCS/PCS over 28 dBm?
GSM/DCS/PCS Tx is OK
Check other part
Yes
No
Change the board
Check TP2,
If GSM(TP2) under 6 dBm?
If DCS/PCS(TP) over 6 dBm?
Check ANT SW Block (ASM+EDGR PAM)
Refer to 1.4
Yes
No
Check RTR & PAD Check soldering and components
No Problem
Still exist Problem
START
No
- 102 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.6.4 Checking RF Rx Block



















TP1
TP2
- 10 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
U1002
31
30
29
44
43
42
41
40
39
38
7
3
6
3
5
3
16
15
4
1
3
1
2
1
1
1
0
1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
3
2
3
4
2
2
5
2
6
2
7
2
8
2
1
DCS_PCS_IN
1
1
D
N
G
0
1
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6
P
M
E
T
4
X
R
3
X
R
2
X
R
1
X
R
WCDMA1
WCDMA2
7
D
N
G
P
8
D
N
G
P
9
D
N
G
P PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
L1003
82n
82n
L1008
0.5p
L1011
DNI
L1014
18n
L1004
18n
L1005
1842.5MHz,1960MHz
FL1002
10 3
5 2
8 1
9
6
7 4
IN_1842_5 OUT_1842_5_1
OUT_1842_5_2
OUT_1960_1
IN_1960 OUT_1960_2
GND1 GND3
GND2 GND4
C1042
6.8n
5.6n
C1040
C1052
6.8n
5.6n
C1036
C1023
4.7p
L1007
18n
L11
DNI
C1025
4.7p
22n
L1010
2.2p
C1016
2.2p
C1004
12n
L1013
33p C1005
881.5MHz,942.5MHz
FL1001
10 3
5 2
8 1
9
6
7 4
IN_881_5 OUT_881_5_1
OUT_881_5_2
OUT_942_5_1
IN_942_5 OUT_942_5_2
GND1 GND3
GND2 GND4
SW1001
4 3
2
1
ANT COMMON
G3 G4
DNI
L1002
33p
C1014
33p
C1021
DNI
L1006
33p
C1039
27n
L1009
33p
C1041
DNI
L1012
GND
WCDMA_2100_RTX
RX_PCS_P
RX_PCS_M
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_M
RX_GSM_850_P
RX_GSM_850_M
RX_DCS_P
WCDMA_850_RTX
WCDMA_1900_RTX
DCS(1805-1880 MHz)
PCS(1930-1990 MHz)
GSM(925-960 MHz)
GSM(869-894 MHz)
Schematic of GSM/DCS/PCS Rx Block
TP1
TP2
- 104 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone Rx is On
Check TP1 Signal exist? Check RF Switch (M/S)
No
Yes
Change the board
Check TP2 Signal exist? Check FEM Block Refer 1.4
No
Yes
- 105 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.7 GPS/WIFI/BT RF Component

RF Component(GPS)









Reference Description
ANT1005 ANTENNA PAD
connected to Carrier type antenna
ANT1006 GND PAD
FL1007 GPS SAW FILTER
U1004 GPS LNA
ANT1005
ANT1006
FL1007
U1004
- 106 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G

RF component (WiFi / BT )

Reference Description
ANT1 ANTENNA PAD
connected to Carrier type antenna
ANT2 GND PAD
U500 WiFi / BT module



5QQ
[T
[T1
- 107 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.8 GPS/WIFI/BT SIGNAL PATH


GPS Signal PATH (main board bottom)

GPS Rx PATH
- 108 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G


WiFi / BT Signal PATH









WiFi / BT Tx and Rx PATH
- 109 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.9 GPS/WIFI/BT Trouble shooting
4.9.1 A-GPS Block




TP1
TP2
- 110 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone GPS is ON
Check TP1 About 2.7V? Check power LRC flter soldering
No
Yes
Change the board
Check TP2 About 2.6V? Check SW and NV item
No
Yes
12
R1025
FL1007
5 2
6 4
3 1
IN
OUT
G
OUT_NON
1
G
2
G
DNI
C1097
L1034
DNI
L12
100p
L1032
DNI
DNI
C1105
U1004
3
2
5
4
1
N
I
_
F
R
FIL_OUT
VDD
S_D
GND
C1099
0.1u 18p
C1098
L1036
3.3n
R1026
1K
6.8p
C1107
C1093
DNI
ANT1006
C1091
47p
VREG_RF_2.7V
ANT1005
5.6n
L1028
L1039
100p
8.2n
C1106
GPS_IN
GPS_MODE
DIVERSITY_IN
Near To LNA
Schematic of the A-GPS block
TP1
TP2
- 111 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
4.9.2 WLAN/BT/FM Block



1
2
3
START
1. Check the Power
Component Change
2. Check the Clock
. Check the Module
- 112 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP5
8pF
C7
DNI
C16
ANT2
10uF
C18
TP7
4.7uF
C5
0.1uF
C2
L1
3.3uH
L3
4.7u
6
0
5
R
K
0
0
1
C536
1u
U500
0
3
9
2
8
2
7
2
6
2
5
2
4
2
3
2
2
2
1
2
0
2
9
1
8
1
7
1
6
1
31
32 15
14
33
34 13
35 12
36 11
37 10
38 9
39 8
40 7
6
41 5
4
42
43 3
44 2
45
1
6
4
7
4
8
4
9
4
0
5
1
5
2
5
3
5
4
5
1
D
N
G
2
D
N
G
3
D
N
G
4
D
N
G
B
_
E
K
A
W
_
T
S
O
H
_
L
W
D
X
T
_
T
R
A
U
_
T
B
N
_
S
T
C
_
T
R
A
U
_
T
B
N
_
S
T
R
_
T
R
A
U
_
T
B
D
X
R
_
T
R
A
U
_
T
B
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
B
B
2
X
L
V
_
R
S
B
B
T
U
O
V
_
R
S
OI
D
D
V
U
P
_
L
A
T
X
D
S
_
OI
D
D
V
T
U
O
_
2
P
1
_
GI
D
T
U
O
_
2
P
1
_
G
L
N
A
O
D
L
V
2
P
1
_
NI
V
T
U
O
_
2
O
D
L
N
L
A
D
S
_
T
B
L
C
S
_
T
B
1
OI
D
U
A
2
OI
D
U
A
N
_
T
S
R
_
T
B
7
D
N
G
C30
0.1u
4
3
5
C
u
2 .
2
C32
0.1u
C533
1u
C535 1n
C33
4.7uF
ANT1
1u
C8
C17
47p
C9
2.2u
TP12
C1 0.001uF
TP9
TP1
TP3
TP11
TP4
TP10
R1
0
C6
2.2uF
TP13
+VPWR
VREG_MSMP_2.6V
C34 4.7uF
TP8
10uF
C19
0.1u
C31
TP6
VREG_MSMP_2.6V
U501
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
L4
DNI
+VPWR
VDD_TCXO
VDD_TCXO
26MHz
X500
TG-5010LH-87N
4 2
3 1
NC OUT
GND VCC
SLEEP_CLK
FM_L
FM_R
WLAN_HOST_WAKEUP
WLAN_RESET_N BT_WAKEUP
BT_PCM_CLK
BT_PCM_SYNC
BT_UART_TXD
BT_UART_RXD
BT_UART_CTS
BT_UART_RTS
BT_HOST_WAKEUP
FM_ANT
Q
E
R
_
K
L
C
CLK_REQ
CLK_IN
CLK_IN
RF_IN_OUT
RF_IN_OUT
BT_PCM_DOUT
BT_PCM_DIN
WLAN_CLK
WLAN_CMD
BT_RESET_N
WLAN_REG_ON
WLAN_SDIO[3]
WLAN_SDIO[2]
WLAN_SDIO[1]
WLAN_SDIO[0]
0603
0603
3
0
6
0
3
0
6
0
3
0
6
0
3
0
6
0
3
0
6
0 3
0
6
0
close to 3
close to 17
Must Check Schematic
26MHz TCXO
Wi-Fi&BT&FM MODULE
TCXO LDO
[Figure] Schematic of WiFi/BT module
- 11 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G








TP1
TP2
TP3
- 114 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
START
TP1 1, 2, is OK? Check the power block
No
Yes
Board change
SDIO OK?
UART OK?
Module check
Yes
No
- 115 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
XU{yv|islGzovv{punG G
G
Main clock part




CLK_IN
TP1
TP2
TP1
TP2
6
0
5
R
K
0
0
1
C536
1u
4
3
5
C
u
2 .
2
C533
1u
C535 1n
U501
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
+VPWR
VDD_TCXO
VDD_TCXO
26MHz
X500
TG-5010LH-87N
4 2
3 1
NC OUT
GND VCC
CLK_REQ
CLK_IN
0603
0603
3
0
6
0
3
0
6
0
26MHz TCXO TCXO LDO
TP1
Main clock part
TP2
- 116 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
!.TPCUBLE SHCCTNG




- Bluetooth RF Test procedure
1. Set phone to Bluetooth test-mode.
- Blue tooth ON: Enter Test Mode(277634#*#) Module test set BT DUT BT DUT ON
2. Insert a phone in a TEMCELL (in case of radiation test)
3. Set discover after push menu button of the tester and select the link analyzer.
4. After set test mode, confirm the connection state.
5. Measure the power of full channel after hopping mode is selected to ON
6. You can select wanted test cases after getting an optimized power
7. Blue tooth On/Off
- Menu KeysettingsWireless controlsBluetoothTurn on/Turn off









TC 3000B (Blueloolh Tesler)G TC 3000B (Blueloolh Tesler)G TC 3000B (Blueloolh Tesler)G TC 3000B (Blueloolh Tesler)G TC 3000B (Blueloolh Tesler)G
TC G

TC G 3000B (Blueloolh Tesler)G


- 117 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING

4.10 Power ON Troubleshooting


Power On sequence of P509 is :
Power key press KPD_PWR_N go to low PM7540 Power Up VREG_MSMC1_1.2V(C433),
VREG_MSMC2_1.2V(C434), VREG_MSME_1.8V(C435), VREG_MSMP_2.7V(C453), VREG_MSMA_2.6V(C452),
VREG_TCXO_2.85V(C457) power ON Phone booting and PS_HOLD(D404) go to High






























Slarl
Ballery vollaqe. hqher
lhan 3.70V(CCV)?
VA20 hqh lo low
when key press?
VMSMC!_!.2V. VMSMC2_!.2V.
VMSMP_2.6V. VMSME_!.8V.
VTCXC_2.85V.
VMSMA_2.6V power up?
s clock ok?
X! !9.2M
Chanqe or charqnq lhe
Ballery
!. Check correclly worknq
power key
Chanqe lhe Man board
Chanqe lhe Man board
NC
YES
YES
YES
YES
NC
NC
NC
Pedownload sw maqe
START
Battery voltage higher than
.70V(OCV)?
Change or charging the Battery
No
Yes
Redownload SW image
VA20 hight to low when key pness? Check correctly working powerkey
No
Yes
VMSMC1_1.2V, VMSMC2_1.2V,
VMSMP_2.6V, VMSME_1.8V, VTCXO_2.85V,
VMSMA_2.6V power up?
Change the Main board
No
Yes
is clock OK?
X1:19.2M
Change the Main board
No
Yes
P500h
- 118 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING




































TP1 : KPD_PWR_N go to low
- 119 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING




































VMSMC2_1.2V
VMSMC1_1.2V
VMSME_1.8V
VMSMP_2.6V
VMSMA_2.6V
VTCXO_2.85V
PS_HOLD
- 120 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.11 Charging Trouble shooting
U400
9 6
5 3
4
8 2
7 1
IN1 OUT1
IN2 OUT2
IC1
OVLO IC2
D
N
G
D
N
G
P
CN4
11
10
9
5
4
3
2
1
8
7
6
u
1
4
0
4
C
5
0
4
C
u
1
VCHG_VBUS
C402
22p
FL1013
5
6
3 1
4 2
P2 P4
P1 P3
6
P
5
P
p
2
2
3
0
4
C
0
0
4
D
Z
FL400
1
IN OUT
GND1 GND2
D400
USB_ID
MAX_DP
MAX_DM
10.04.08 Changed Rev.C
2mm
REV.E_CHANGED_0517
2mm
TA OVP Circuit
VBUS 2mm
u-USB Connector
C407
100u
+VPWR_RF
10n
C408
VCHG_VBUS
VBAT
Q400
5
6 4
7 3
8 2
9 1
10
DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
0
0
4
R
1
.
0
10u
C409
+VPWR
+VPWR_RF|+VPWR
ISNS_P
CHG_CTL_N
BATT_FET_N
2mm
1608
2009.11.16 changed
1608
10V
2mm
1%
ISNS_M
Charging Procedure
- Connect TA or u-USB Cable
- Control the charging current by PM7540 IC
- Charging current fows into the battery
Check Point
- Connection of TA or USB Cable
- Charging current path(NUS550MIN)
- Battery
Troubleshooting Setup
- Connect TA and battery to the phone

Troubleshooting Procedure
- Check the charger (TA or USB Cable) connector
- Check the OVP Circuit
- Check the charging current Path
- Check the battery
Charging Current Flow
TA
(5.1V)
Main
Battery
- 121 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Check the pin and battery
Connect terminals of I/O connector
Connection OK?
No
Yes
Is the u- USB Cable)
voltage 4.8V (or 5.0V)?
No
Yes
Is it charging properly
After turning on?
START
Check PMIC SMT status by X-ray
Exchange PMIC or Change the main
board and Retest
Change I/O connector
Change TA (or u-USB cable)
END
Yes
No
Charger Troubleshooting Flow
- 122 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4. 12 3M AF Camera trouble
3M camera control signals are generated by ISX005 and MSM7227.






Check the camera Conn.
and reconnect the camera
Camera is OK?
No
Change the Main board
END
Yes
Check IOVDD(TP5),
DVDD(TP6), AVDD(TP7)
START
Yes
Check the EMI Filter(FL601, FL602)
Camera is OK
No
No
Yes
MSM 7227 output signal check
MCLK(TP1), PCLK(TP2),
Reset(TP), Standby(TP4)
Change the camera
Yes
END
Change the Filter(FL601, FL602)
No
No
Yes
- 12 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
47
R211
DNI
C222
7.5p
C223
U15
W15
AC16
AB16
AF15
Y15
AC15
AB15
W14
AE14
AC14
Y14
AC13
U13
Y13
AB13
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
AE21
AB22
AC22
AE24
AE25
AF24
GPIO_0
GPIO_1
GPIO_2
GPIO_3
GPIO_4
GPIO_5
GPIO_6
GPIO_7
GPIO_8
GPIO_9
GPIO_10
GPIO_11
GPIO_12
GPIO_13
GPIO_14
GPIO_15
GPIO_16
GPIO_17
GPIO_18
GPIO_19
GPIO_20
GPIO_21
GPIO_22
GPIO_23
GPIO_24
GPIO_25
GPIO_26
GPIO_27
GPIO_28
GPIO_29
GPIO_30
GPIO_31
GPIO_32
GPIO_33
GPIO_34
GPIO_35
GPIO_36
GPIO_37
GPIO_38
GPIO_39
GPIO_40
GPIO_41
GPIO_42
MOTION_INT
BT_WAKEUP
AUDIO&MOTION_I2C_SDA
CAM_DATA[3]
CAM_DATA[2]
PS_HOLD
PM_INT_N
CAM_MCLK
CAM_VSYNC
CAM_HSYNC
AUDIO&MOTION_I2C_SCL
LIN_PWM_FREQ
MUIC_I2C_SDA
MUIC_I2C_SCL
MUIC_INT
EARJACK_SENSE
PA_ON1
HS_MIC_BIAS_EN
CAM_DATA[1]
CAM_DATA[0]
CAM_RESET_N
CAM_PWDN
CAM_DATA[4]
CAM_DATA[5]
CAM_DATA[6]
CAM_DATA[7]
CAM_PCLK
COMPASS_DRDY
KEY_COL[2]
KEY_COL[1]
KEY_COL[0]
KEY_ROW[1]
KEY_ROW[0]
WLAN_REG_ON
LNA_GAIN_CONTROL
DIVERSITY_LNA_EN
MOTION_I2C_SCL
MOTION_I2C_SDA
REV.E_CHANGED_0517
TP1
FL600
7.5pF
0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
FL601
7.5pF
0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
FL602
7.5pF
0
1 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
CAM_DATA[3]
CAM_DATA[2]
CAM_VSYNC
CAM_HSYNC
CAM_DATA[1]
CAM_DATA[0]
FLT_CAM_VSYNC
FLT_CAM_HSYNC
CAM_DATA[4]
CAM_DATA[5]
CAM_DATA[6]
CAM_DATA[7]
FLT_CAM_DATA[0]
FLT_CAM_DATA[1]
FLT_CAM_DATA[2]
FLT_CAM_DATA[3]
FLT_CAM_DATA[4]
FLT_CAM_DATA[5]
FLT_CAM_DATA[6]
FLT_CAM_DATA[7]
1608
1608
1608
MSM7227
EMI FILTER
- 124 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING







5
1
6
C
u
1
.
0
FB600
120
FB602
120
33p
C608
C606
4.7u
4
1
6
C
F
u
1
VA607
120
FB601
CAM_IOVDD_2.6V
CAM_AF_2.8V
FB603
120
CAM_DVDD_1.2V
CN600
17
16
15
14
13
12
11
10
9
8
7
6
5
31 4
32 3
33 2
34 1
30
29
28
27
26
25
24
23
22
21
20
19
18
R605 12
CAM_AVDD_2.7V
3
1
6
C
u
0
1
4
0
6
R
K
2
.
2
3
0
6
R
K
2
.
2
C605
4.7u
C604
4.7u
CAM_MCLK
CAM_I2C_SCL
CAM_I2C_SDA
FLT_CAM_VSYNC
FLT_CAM_HSYNC
CAM_RESET_N
CAM_PWDN
CAM_PCLK
FLT_CAM_DATA[0]
FLT_CAM_DATA[1]
FLT_CAM_DATA[2]
FLT_CAM_DATA[3]
FLT_CAM_DATA[4]
FLT_CAM_DATA[5]
FLT_CAM_DATA[6]
FLT_CAM_DATA[7]
TP7
TP6 TP5
TP3
TP4
TP2
- 125 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING

4. 13 Main LCD trouble


Main LCD control signals are generated by MSM7227. Those signals path are :
MSM7227 -> LCD Module






Press END key to tun the power On
Is the circuit powered?
Yes
END
Follow the Power ON
trouble shooting
No
LCD display OK?
START
No
Check Power
VREG_LCD_1.8V(TP1)
VREG_LCD_2.8V(TP2)
No
Change the Main board
Disconnect and reconnect
LCD connector
Change the LCD module
The LCD works
Yes
Yes
Yes
- 126 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING






CN601
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
1
D
Z
FL603
0
1
9
8 4
7 3
6 2
5 1
P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
VREG_LCD_2.8V VREG_LCD_1.8V
D600
4 3
5 2
6 1
2.2u
C616 C617
2.2u
WLED_PWR
C4
4.7u
WLED5 WLED4
WLED3 WLED2
WLED1
WLED6 WLED7
LCD_RESET_N
LCD_MAKERID_LOW
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_P
LCD_VSYNC_O
3.2" HVGA LCD Connector
TP2
TP1
- 127 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING

4.14 Proximity Sensor on/off trouble


Proximity Sensor is worked as below :
Send Key click Phone number click Call connected Object moved at the sensor
Control the screens on/off operation automatically



Measurement
VREG_MSMP_2.6V
VREG_PROX_2.6V
PROX_OUT
PROX_COMPASS_I2C_SCL / SDA





Object moved at the Proximity Sensor
LCD of?
No
Check PROXI_SDA /
SCL output & Prox_out
No
No
Work well?
START
END
Change the
Proximity Sensor U700
No
Yes
Send Key click & call connected
Chang the main board
Yes
- 128 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING







VREG_MSMP_2.6V
U700
5 4
6 3
7 2
8 1
LEDA SCL
LEDC SDA
VCC VIO
VOUT
GND
C707
1u
R700
10
C708
0.1u
R703
10
VREG_PROX_2.8V
R702
4.7Kohms
R701
4.7Kohms
C709
4.7u
10u
C705
PROX_OUT
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDA
TP1
TP2
TP3
- 129 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING

4.15 Motion Sensor on/off trouble


Motion Sensor is worked as below :
Accelerometer Sensor function On Tilt the phone (90) The screen is had rotated automatically.





Measurement
VREG_MSMP_3.0V
MOTION_INT
MOTION_I2C_SDA / SCL



Tilt the phone
The screen is ratated
No
MOTION_INT output
No
Yes
Work well?
START
END
Change the Main board
No
Yes
Accelerometer Sensor function On
Change the Main board
Yes
Check mation_I2C_SDA / SCL
output
No
Change the Motion Sensor U50
Yes
- 10 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING





0
4
5
C
u
1
.
0
U503
6
1
7 6
5
4
8
3
9
2
10
1
11
12
13
4
1
5
1
2
D
E
V
R
E
S
E
R
D
D
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
S
C
SCL_SPC
GND1
O
D
S
_
I
D
S
_
A
D
S
0
A
S
_
O
D
S
4
D
N
G
VREG_MOTION_3.0V
10u
C541
8
1
5
R
K
2
.
2
9
1
5
R
K
2
.
2
MOTION_INT
MOTION_I2C_SCL
MOTION_I2C_SDA
TP1
TP3
TP2
- 11 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING

4.16 Compass Sensor on/off trouble


Compass Sensor is worked as below :
Compass Sensor function On




Measurement
VREG_MSMP_2.6V
VREG_MOTION_3.0V
PROX_COMPASS_I2C_SCL / SDA
COMPASS_DRDY



Chang the position of thr phone
The direction is correct?
No
Check the COMPASS_DRDY &
PROX_COMPASS_I2C_SDA
/ SCL output
No
Yes
Work well?
START
END
Change the
Compass Sensor U1
No
Yes
Compass Sensor function On
Chang the main board
Yes
- 12 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING






C706
470n
VREG_MSMP_2.6V VREG_MOTION_3.0V
4
0
7
C
n
0
1
U1
12
11
10
9
5
4
6
3
7
2
8
1
D
D
V
D
G
E
R
V
A
D
N
G
S
D
N
G
D
D
V
A
ADDR
SCL
NC1
T
N
I
VPP
DRDY
SDA
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDA
COMPASS_DRDY
TP3 TP2
TP1
- 1 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING

4.17 Q coin Motor


Q coin Motor is worked as below :
touch touch-window Vibration feedback
U601 : Used the PWM pulse







Measurement
VREG_MOTOR_3.3V
LIN_PWM_FREQ
MTR_N_2sub/MTR_P_2sub




Output of U602 OK?
(L42-L18)
Yes
No
VREG_MOTOR_.V(C624) is .V?
LIN_PWM_FREQ(U602)is working?
START
Check SW
Change the
Q coin Motor(VB700)
Yes
No
Reboot
Check an U602 SMT status by X-ray, Exchange it
Work well?
Yes
No
END
Measurement
VREG_MOTOR_.V
LIN_PWM_FREQ
MTR_N_2sub/MTR_P_2sub
- 14 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
C623
0.1u
R614
4.7Kohms
R617
51K
C625 10n
R612 100K
R618
1K
R615
1K
R616
51K
VREG_MOTOR_3.3V VREG_MOTOR_3.3V
U602
B2 C1
A1 B1
B3 C2
A3 C3
IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
Q600
C
B
E GND
IN
OUT
C624
0.1u
R619 100K
LIN_PWM_FREQ
MTR_P_2sub
MTR_N_2sub
1%
1%
1%
1%
1%
1%
TP2
VB700
2
1
3
L
n
5
1
4
A
V
3
A
V
n
5
1
1
L
MTR_N_2sub
MTR_P_2sub
TP1
TP4
TP3
- 15 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING







- 16 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
- 164 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
LG-P500h
LG-P500h
5. DOWNLOAD
- 17 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 165 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
LG-P500h
LG-P500h
LG-P500h
- 18 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 166 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
LG-P500h
LG-P500h
5. DOWNLOAD
- 19 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 167 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
LG-P500h
LG-P500h
LG-P500h
5. DOWNLOAD
- 140 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 168 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
LG-P500h
5. DOWNLOAD
- 141 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 169 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD 5. DOWNLOAD
- 142 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 170 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
- 14 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 171 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD 5. DOWNLOAD
- 144 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 172 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
- 145 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 173 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD 5. DOWNLOAD
- 146 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 174 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
LG-P500h
LG-P500h
LG-P500h
LG-P500h
LG-P500h
LG-P500h
LG-P500h LG-P500h
5. DOWNLOAD
- 147 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 175 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
LG-P500h LG-P500h
LG-P500h LG-P500h
LG-P500h
LG-P500h LG-P500h
5. DOWNLOAD
- 148 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 176 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
LG-P500h LG-P500h
LG-P500h
LG-P500h
5. DOWNLOAD
- 149 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
USBH DM & DP
Transceiver
(RTR6285)
Transceiver
(RTR6285)
BT_UART
Capacitive Touch
(Melpas + LGIT)
Key LED
Key LED
MUIC_I2C
MMC
USBPHY
SIM
UART3
LCD Backlight IC
AAT2862
BL_I2C
DDR SDRAM(4G)
NAND FRESH (4G)
EBI1 (DDR)
CAM I/F
TX_IQ, PRX_IQ
MOTION_I2C
BT_PCM
FM_L&R
RF I/F
USIM
KPD_PWR_N
I2C
PRX_IQ
GPS
CAM_I2C
MSM7227
EBI2 (NAND)
WLAN_SDIO
LINE_L& R
LBEH19UNBC-338
Bluetooth v2.1
Wi-Fi 802.11b/g
FM Radio
BT &
Wi-Fi
FM
FEM
(SKY77544)
FEM
(SKY77544) DRX_IQ
DRX_IQ
GPIO59
GPS
GSM & WCDMA
CAM 3M
TOUCH I2C
MCP(Micron)
Prox Sensor
(GP2AP002S00F)
PROX_I2C
SBDT
MOTION Sensor
(KR3DM)
MOTION_INT
FUEL_I2C
Back Key
UART3
Array TP
REMOTE_PWR_ON
MPP3,4
USIM
USIM I/F
GPIO106
SBDT_SSBI
PM7540
KPD_DRV_N
PMIC_SSBI
AMUX_OUT
HKAIN2 AMUX_OUT
AMUX_OUT
PM_INT_N
MSM_INT_N GPIO24
PWR/End Key
PON_RESET_N
PS_HOLD
GPIO25
RESIN_N
nJTAG_RESOUT
JTAG_PS_HOLD
JTAG
JTAG CONN.
JTAG(TCK,TDI,TDO)
UART3_TX/RX
QTKEY_I2C
System HW Block Diagram All System
Fuel Gauge
(MAX17040G)
Fuel Gauge
(MAX17040G)
PS_HOLD
MDDI Interface
Home Key
Send Key
MUIC
(TS5USBA)
MUIC
(TS5USBA)
I2C
5
p
i
n
_
U
S
B
C
o
n
n
e
c
t
o
r
5
p
i
n
_
U
S
B
C
o
n
n
e
c
t
o
r
Main Board
LINE_ON&OP
EAR1_OP&ON
HPH_L&R
LINE_OP, LINE_ON
RCV_P & N
HPH_R, HPH_L
Q-Motor
(WHVM-1030Q10)
Q-Motor
(WHVM-1030Q10)
GPIO_28
LIN_PWM_FREQ
Menu Key
Volume Key
Sub FPCB
MT29C4G96MAZAPCJA-5 IT
MIC
MIC
USIM
SPK_RCVP, N
Speaker &
Receiver
3.5 pi
Earjack
EAR_L, R
COMPASS_I2C Digital Compass
(AMI304) COMPASS_INT
Key COL, Key ROW
MDDI Interface
3.2" HVGA
320*480
Audio Sub
WM9093ECS-R
TOUCH INT
GPIO_27
GPIO36 ~ 38
Backlight_Key
AUDIO_I2C
TCXO_19.2MHz
(Kyocera)
RTR_TRK_LO_ADJ
TCXO_IN
TCXO
TCXO_RTR_19.2MHz
TCXO_PM_19.2MHz
TCXO_
26MHz
FM_L&R
F_CLK_IN
CLK_REQ
- 150 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
RF Block Diagram
- 151 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
6. BLOCK DIAGRAM
- 152 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
3.5
q
1.8V LDO
RP103K181D
Audio Block Diagram
- 15 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
WiFi/BT/FM Radio Block Diagram
26MHz
TCXO
32.768KHz
PM7540
SLEEP_CLK(LPO Clock:
32.768KHz)
WLAN_CMO
WLAN_CLK
WLAN_PEG_CN
WLAN_PESET_N
WLAN_SOC30|
BT_PESET_N
BT_PCM_SYNC
BT_PCM_ON
BT_PCM_OCUT
BT_PCM_CLK
BT_WAKEUP
BT_HCST_WAKEUP
BT_UAPT_CTS
BT_UAPT_PTS
BT_UAPT_PXO
BT_UAPT_TXO
3.5
Ear Jack
FM_ANT
WLAN_HCST_WAKEUP
FM_P
FM_L
AUOC2
AUOC!
BT_PST_N
BT_GPC_0
BT_GPC_!
FM_ANT
BT_PCM_SYNC
BT_PCM_CUT
BT_PCM_N
BT_PCM_CLK
BT_UAPT_PXO
BT_UAPT_TXO
BT_UAPT_PST_N
BT_UAPT_CTS_N
WLAN_HCST_WAKEUP
SOC_CMO
SOC_CLK
PEG_CN
WL_PST_N
SOC30|
W_WAKE_B
L
B
E
H
1
9
U
N
B
C
LNE_P_P
LNE_L_P
GPC94
GPC62
GPC23
GPC93
GPC46
M
S
M
7
2
2
7
GPC45
GPC44
GPC43
GPC!23
GPC70
GPC69
GPC68
GPC7!
GPC42
GPC83
ANT
GPC6467|
E
a
r

a
c
k
E
a
r

a
c
k
GPC63
S_CLK_N
F_CLK_N
CLK_IN
- 154 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 155 -
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
33p
C1087
C36
1.2p
12
R1025
L1045
DNI
C1079
8.2p
DNI
R9
FL1007
5 2
6 4
3 1
IN OUT
G OUT_NON
1 G 2G
2.2K
R1006
C1122
1.2p
L1030
DNI
U1002
31
30
29
44
43
42
41
40
39
38
73 63 53
16
15
4 1 31 21 11 0 1
34
33
32
17
9
18
8 19
7 20
6 21
5 22
4
32
3
42
2
52 6 2 72 82
1 DCS_PCS_IN
11
D
N
G
01
D
N
G
9
D
N
G
8
D
N
G
GND1
7
D
N
G
GSM_IN
6
D
N
G
VAPC
GND5 VBATT
GND4 BS2
GND3 BS1
GND2 _TXEN
ANT
E
D
O
M
WCDMA3
PGND4
PGND5
PGND6 P
ME T
4X
R
3X
R
2X
R
1X
R
WCDMA1
WCDMA2
7
D
N
GP
8
D
N
GP
9
D
N
GP PGND10
PGND11
PGND12
PGND13
PGND14
PGND15
PGND16
PGND1
PGND2
PGND3
DNI
C1097
39p
C1024
L1034
DNI
L1003
82n
82n
L1008
0.5p
L1011
DNI
L1014
L1015
100p
L1016
5.6n
L1151
3n
C1929
100p
2.2 R1010
10 R1012
0 31 4R
47
R6
03 1 5R
C1009
0.0082uH
C23
10p
FL1012
1960MHz
4 5
1
3 2
G1 O1
ING2 O2
8.2n
L2
L1027 3.3n
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
R1004
2.7n
18n
L1004
FL1005
836.5MHz
3 2
4 1
5 GND
IN OUT G1 G2
9401C
u1.0
10u
C1163
51
11R
+VPWR_RF
C1043
10u
100p
C1065
75
R7
VREG_SMPS_2.1V
C1153
33p
33p C1046
C1022 33p
R19
0
18n
L1005
5501C
u1.0
u1.0
0301C
I ND
3611R
p22
7201C
12K R1018 1842.5MHz,1960MHz
FL1002
10 3
5 2
8 1
9
6
7 4 IN_1842_5 OUT_1842_5_1
OUT_1842_5_2
OUT_1960_1
IN_1960 OUT_1960_2
GND1 GND3
GND2 GND4
K1
9 1 0 1R
33p C1020
C1086
DNI
C1042
6.8n
U1001
32 92 82 53 43 96
62
61
60
54
43 36
37 38
27 68
25 52
21 42
8
7 45
1 44
53 47
22 46
10
6 49
4 48
3
51
67 50
19 39
40
18
17 41
16
15 33
32
13 31
14 30
12
11 59
58
9 56
24
5 57
55
65
66 20
63 2
64 26 RF_ON TX_IP
TCXO TX_IN
SBDT TX_QP
TX_QN
LB_RF_OUT1
LB_RF_OUT2 VTUNE1
VTUNE2
HB_RF_OUT1 VTUNE_GPS
HB_RF_OUT2
HB_RF_OUT3 PRX_QP
PRX_QN
WPRXLBP PRX_IP
WPRXLBN PRX_IN
WPRXHBP
WPRXHBN DRX_QP
DRX_QN
WDRXLB DRX_IP
DRX_IN
WDRXHB1
WDRXHB2 NC
GCELL_INP DAC_IREF
GCELL_INN
VDDA1_1
EGSM_INP VDDA1_2
EGSM_INN VDDA1_3
VDDA1_4
DCS_INP VDDA1_5
DCS_INN VDDA1_6
GPCS_INP VDDA2_1
GPCS_INN VDDA2_2
VDDA2_3
GPS_IN VDDA2_4
PDET_IN VDDA2_5
TX_RBIAS VDDA2_6
WPRXSE1 VDDA2_7
WPRXSE2 VDDA2_8
VDDA2_9
VDDA2_10
VDDA2_11
VDDA2_12 DNGP
TUO_2ESXRPW
TUO_1ESXRPW
PNI_XM_BW
MNI_XM_BW
MDDV
5.6n
C1040
C1011 100p
VREG_RF_2.7V
10 R1016
u1.0
8301C
C1052
6.8n
5.6n
C1036
1n C1018
C1023
4.7p
L1007
18n
FL1009
1880MHz
5 2
4 1
3
G3
IN OUT
G1 G2
C1090
12p
R1017 10
68p
C1010
ANT1003
C1012 100p
C1017 33p
VREG_MSMP_2.6V
76 0 1C
u1.0
C1019
68p
L11
DNI
3501C
u1.0
u01
0501C
p22
9201C
7301C
n1
u1.0
9501C
0601C
u1.0
C1025
4.7p
22n
L1010
u7.4
6501C
4501C
u7.4
u1.0
8501C
7501C
u1.0
22p
C1064
p001
86 0 1C
0.1u
C1066
3601C
u1.0
2.2p
C1016
2.2p
C1004
19 61 R
C1045 1n
L12
100p
VDD_RX
1n C1047
2.7n
L1035
FL2
836.5 MHz,881.5 MHz
7 5
8
4 9
2
3
1 6 ANT RX
TX
GND1
GND5 GND2
GND6
GND3 GND4
FB2
0
C1081
DNI
8711R
0
ANT1002
L1021
6.8n
C1088
15p
12n
L1013
L1025
1.5n
R1005
1p
33p C1005
C1084
3n
1n C1048
2140 MHz
FL1011
5 2
4 1
3
G3
IN OUT
G1 G2
3.9p C1069
L1033
DNI
L1018
1.8n
0 R1015
C1051 1n
2n
L1017
L1019
1.8n
DNI
C1070
C1007
56p
DNI
C1105
C1080 3.9p
U1004
3
2
5
4
1
NI_FR
FIL_OUT
VDD
S_D
GND
C1099
0.1u 18p
C1098
19 51R
C1073
DNI
L1036
3.3n
R1026
1K
VDD_RX
C1072 33p 33p C1071
6.8p
C1107
8R 0
47p
C1044
22p
C25
FL1008
7 5
8 4
9 2
3
1 6
ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
C1093
DNI
2140MHz
FL1003
4 5
1
3 2
G1 O1
ING2 O2
10n C1013
10n
C20
DNI
L1020
U1003
61 51
8 7
9 6
10 5
11 4
12 3
13 2
14 1 IN_BAND_V OUT_BAND_V
VMODE_0 GND3
VMODE_1 VCC2_2
VCC2_1 GND2
VEN_BAND_V OUT_BAND_I
VEN_BAND_I GND1
IN_BAND_I CPL_OUT
1 D NGP
2DNGP
DNI
R12
3.3p
C1089
L1042
5.6n
5.6n
L1029
33
R1022
18
R1023
+VPWR_RF
C1075
0.001uF 10u
C1077
330p
C1076
L1026
DNI
C1109
33
L1041
1.5n
C1154
4.7n
C1092
1.5n
C1083
33p
100p
C1094 C1096
100p 100p
C1095
C11
100p
4301C
u1.0
33p C1118
C1127
DNI
p22
1301C
p22
3301C
VREG_TCXO_2.85V
ANT1006 C1091
47p
BGA735L16
U2
9
8
7
6
5
01
4
11
3
2 1
2
31
1
14
15
16
17 PGND
RFOUTM
RFOUTH
RFOUTL
CN
FERR
SGV
1NEV
CCV
2NEV
1HDNGFR
LNIFR
2HDNGFR
RFINM
RFINH
RFGNDM1
RFGNDM2 U1006
7
4 3
5 2
6 1 RFIN RFOUT
EN RREF
GS VCC D N GP
C1130
10n
VREG_RF_2.7V
ANT1005
R1030 27K
5.6n
L1028
C1120 10p C1121 33p
C1015 10n
u1.0
2301C
2601C
u1.0
u1.0
1601C
VREG_TCXO_2.85V
L1031
DNI
L1044
3.6n
10p C1119
L1043
2n
100p
C1129
FB3
0
U1005
6 5
7 4
8 3
9 2
10 1
11 PGND
VCC1 VCC2
RFIN RFOUT
VMODE_1 CPL_IN
VMODE_0 GND
VEN CPL_OUT
C1112
1.5p
881.5MHz,942.5MHz
FL1001
10 3
5 2
8 1
9
6
7 4 IN_881_5 OUT_881_5_1
OUT_881_5_2
OUT_942_5_1
IN_942_5 OUT_942_5_2
GND1 GND3
GND2 GND4
+VPWR_RF
L1048
5.6n
C1123
DNI
1950MHz
FL1006
5 2
4 1
3
G3
IN OUT
G1 G2
22p
C22
C37
1.2p
C14
27p
10p
C27
C1148
0.5p
2.7n
L6
C1111
1.5p
22n
L8
10n
L9
2.2n
L10
C1113
100p
C1104
1n
DNI
C1128
C1110
100
C1114
100p 100p
C1115
2.2u
C1102
33p
C1103
C1108 33p
C1116
0.5p
R24
33p
L1040
2.4n
FL1010
1880,1960MHz
7 5
8 4
9 2
3
1 6 ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
22p
C24
C1078
22p
L4000
DNI
C1117
DNI
L1130
18n
L1032
6.8n
SW1001
4 3
2
1 ANT COMMON
G3 G4
u1.0
8201C
DNI
L1002
33p
C1014
33p
C1021
DNI
L1006
33p C1039
27n
L1009
33p C1041
DNI
L1012
10n
L1022
L5
3.3n
L7
1n
3.3n
C10
L1039
100p
8.2n
C1106
12p
C28
L1150
DNI
0 0 1R
L1120
DNI
L1110
DNI
100p
C12
100p
C13
27K
R18
C1728
DNI
4.7p
C15
C1928
DNI
FL1
881.5MHz
4 5
1
3 2
G1 O1
ING2 O2
DNI
R1021
0
R14
C26
2.7p
C1003
10p
9.94
7201R
4.7u
C1162
4.7u
C1160
R1029
DNI
ANT_SEL1
ANT_SEL2
ANT_SEL0
ANT_SEL3
TCXO_RTR_19.2MHZ
GSM_PA_RAMP
TX_ON
VSNS_RF_SMPS
VREG_SMPS_2.1V|VSNS_RF_SMPS
PA_ON1
GND
GND
PA_ON0
PA_R0
PA_R0
PA_ON2
GPS_IN
GPS_IN
DCS_PCS_TX
DCS_PCS_TX
GSM_TX
GSM_TX
WCDMA_2100_RTX
WCDMA_2100_RTX
RX_PCS_P
RX_PCS_P
RX_PCS_M
RX_PCS_M
RX_DCS_M
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_P
RX_GSM_900_M
RX_GSM_900_M
RX_GSM_850_P
RX_GSM_850_P
RX_GSM_850_M
RX_GSM_850_M
WCDMA_2100_TX_OUT
WCDMA_2100_TX_OUT
RX_WCDMA_2100
RX_WCDMA_2100
PDET_IN
PDET_IN
DAC_REF
TX_I_P
TX_I_M
TX_Q_P
TX_Q_M RX0_I_P
RX0_I_M
RX0_Q_M
RX0_Q_P
RX1_I_P
RX1_I_M
RX1_Q_M
RX1_Q_P
GPS_MODE
RTR6285_SSBI
RX_DCS_P
RX_DCS_P
RX_WCDMA_1900_M
RX_WCDMA_1900_M
RX_WCDMA_1900_P
RX_WCDMA_1900_P
WCDMA_1900_TX_OUT
WCDMA_1900_TX_OUT
RX_WCDMA_850_P
RX_WCDMA_850_P
RX_WCDMA_850_M
RX_WCDMA_850_M
WB2100_MIX_INM
MNI_XI
M_0012B
W
WB2100_MIX_INP
PNI_XI
M_0012B
W
WCDMA_850_RTX
WCDMA_850_RTX
WCDMA_850_TX_OUT
WCDMA_850_TX_OUT RX_WCDMA_1900_LNA_OUT
RX_WCDMA_1900_LNA_OUT
RX_WCDMA_1900_SE
RX_WCDMA_1900_SE
PA_R1
PA_R1
WCDMA_1900_RTX
WCDMA_1900_RTX
DIVERSITY_IN
DIVERSITY_IN
AWS_RXDIV_LNA_OUT
AWS_RXDIV_LNA_OUT
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_2100_LNA_OUT
INTER_RX_SW_SEL_1
INTER_RX_SW_SEL_2
LNA_GAIN_CONTROL
DIVERSITY_LNA_EN
0603
W1900
0603
8061
0603
3060
500 1
5001
W2100
VDDA1 : Pin 3,4,6,10,22,53 = +2.7V VDC
GSM Quad
LOW
GSM850 RX
ANT_SEL0 ANT_SEL1 ANT_SEL2
GSM900 RX
DCS1800 RX
VDDA2 : Pin 1,7,8,21,25,27,37,43,54,60,61,62 = +2.1V VDC
ANT_SEL3
LOW
LOW
ANTENNA SWITCH MODULE LOGIC(SKY77544)
LOW
HIGH HIGH LOW
LOW
LOW LOW LOW
LOW
2mm
11dB
LOW
DCS(1805-1880 MHz)
PCS(1930-1990 MHz)
GSM(925-960 MHz)
LOW
LOW(X)
GSM(869-894 MHz)
LOW(X)
LOW(X)
EUSY0344001
W900(W850)
LOW(X)
HIGH
HIGH
7dB
HIGH
HIGH
LOW LOW
LOW
LOW
HIGH
HIGH
+2.1V
GSM850(824-849MHz)
1%
HIGH
PCS1900 RX
W1700
GSM850/GSM900 TX
8 0 6 1
+2.7V
DCS1800/PCS1900 TX
HIGH
HIGH
HIGH
HIGH
GSM900(880-915MHz)
HIGH
HIGH
LOW
PCS(1850-1910 MHz)
DCS(1710-1785 MHz)
Band I
Band 5
W2100
W850
AWS DIVERSITY
WCDMA Triple
LNA for the GPS
W2100 RX(2110 - 2170 MHz)
WCDMA RX 2100 LNA Circuit
0603
0603
WCDMA 1900 Tx (1850-1910MHz)
Band 2
0603
0603
0603
0603
3060
3060
3060
3060
0603
0603
0603
Near To LNA
Near To RTR
Near to 12 Pin Near to 12 Pin Near to 4 Pin
Near to 10 Pin Near to 1 Pin
7. CIRCUIT DIAGRAM
- 156 - LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
302R
K01
R208 220
2.2n
C204
VBAT
UAT200
12
11
10
9
8
7
6
5
4
3
2
1 GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G 2.5G
VCHG_VBUS
VREG_MSMP_2.6V
1 1 2C
Fu 1
202R
K1
CN200
16 15
8 7
9 6
10 5
11 4
12 3
13 2
14 1
18 17
102R
K01
R210 100K
U201
3
2
4
1
5
VCC
GND
R218 100
202AV
002AV
102AV
312R
K01
R215 100
C220 0.1u
C221 330p
VREG_MSMA_2.6V
412C
u1.0
5 1 2C
u 1 . 0
712C
u1.0
VREG_TCXO_2.85V
R216 1K
330p C210
C227
0.1u
330p C207
C202
0.1u
61 2 C
u1. 0
C201
47p
VREG_MSMP_2.6V
402R K 2 . 2
VREG_MSMA_2.6V
VREG_MSMP_2.6V
R217 100
312C
F u 1
102D
49.9
R214
002C
p74
R219 1K
C205
1n
812C
u1.0
302AV
C203
22u
702R
IND
R26
0
R220 K001
002D
21 2 C
u1. 0
15
002R
U202
4 3
5 2
6 1 D VCC
CP NC
GND Q
912C
u1.0
TP201
33p
C225
47
R211
DNI
C222
7.5p
C223
C206
0.1u
0.1u
C224
VREG_TCXO_2.85V
C226
33n
2K R212
19.2MHz
KT3225L19200DCW28RA0
X200
4 2
3 1 VCONT OUT
GND VCC
402AV
502AV
TP202
TP203
R205 100
TP200 602R
0406
SUBV_GHCV
MIC_BIAS
R209 33
U200
M5
Y18
AC19
AF18
Y17
U16
AC18
AF17
W16
AE17
AC17
Y16
AB17
W5
W3
V5
V6
AB9
V9
V8
Y9
W8
AB8
V3
V2
U2
U8
U9
AF4
AE2
AB7
AE4
AE3
AD3
L2
L8
L3
L9
AD2
AC6
AC3
AC2
U15
W15
AC16
AB16
AF15
Y15
AC15
AB15
W14
AE14
AC14
Y14
AC13
U13
Y13
AB13
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
AE21
AB22
AC22
AE24
AE25
AF24
6M 8M 9M 8EA
7FA
8CA
6FA
7CA
6EA
11R
81BA
81W
11Y
71C
71B
61H
81H
71M
62G
01Y
11T
01W
61EA
8FA
61FA
5FA
31F
21C
21B
11H
11J
21H
21J
11 E
21F
11F
21E
91EA
91FA
02BA
51C
61F
31H
41H
41J
31J
11C
41L
3F 2F 3E 2E 2D 52G
61L
91C
91B
91H
62F
02H
81J
71J
32H
22F
32F
61J
71E
51J
71F
61B
61C
51H
81B
52B
12F
0 2B
02F
71H
02E
02C
81C
81F
B21
B22
C21
E21
C22
C24
E26
B24
F25
C26
D26
C23
B23
C25
D25
E23
W20
AD26
N17
T20
J25
M20
N25
V26
H26
L25
P20
U26
V19
AC25
U19
U20
AB23
W25
W26
R19
T19
W22
AC26
V23
AB26
AB25
AA23
AA25
Y26
Y23
T17
Y22
W23
AA26
V20
J26
K20
J20
J23
J22
K19
K26
L22
L19
L23
L20
M19
L26
M26
M22
M23
N26
N19
N20
P26
R26
P19
R25
T26
R22
R23
R20
T23
T22
U25
U23
U22
4C 6G 5G 6N 3N 2N 2W 6W 3M 8T 2K 3K 2J 3J 2H 3H 2G 3G 6R 2P 3P 2R 3R
11B
41FA
31FA
21FA
11FA
5BA
3BA
2BA
3AA
2AA 2Y
6AA 2M 3U
11W
9EA
9CA
6BA 3Y
71W
91BA
51E
41C
31C
51B
41B
31B 8H 6F 5F
01J
01H 9H
01C
01B 9C 9B 8F 8E 7F 7E 7C 7B 6C 5C 6B 5B
PI_R _ EN I L
NI_R_ENIL
PI_L_ENIL
NI_L_ENIL
P1 C IM
N 1 CI M
P2CIM
N2CIM
PI X UA
N I XU A
PO_ENIL
NO_ENIL
PO_1RAE
NO_1RAE
TUOXUA
R_HPH
L_HPH
PMOCC
SAIB_CIM
FERV_HPH
KLCSYS_YHPBSU
PD_YHPBSU
ND_YHPBSU
DI_YHPBSU
SUBV_YHPBSU
TXER_YHPBSU
N_NISER
N_TUOSER
NE_GODW
0_EDOM
1_EDOM
2 _E D OM
3_EDOM
O XC T
JDA_OL_KRT
KLC_PEELS
IDT
SMT
N_TSRT
ODT
KCT
KCTR
P_ATAD_IDDM
N_ATAD_IDDM
P_BTS_IDDM
N_BTS_IDDM
KLCP_CDCL
P_TUO_I
N_TUO_I
P_TUO_Q
N_TUO_Q
FER_CAD
0HC_PI_I
0HC_MI_I
0HC_PI_Q
0HC_MI_Q
1HC_PI_I
1HC_MI_I
1HC_PI_Q
1HC_MI_Q
NO_XT
JDA_CGA_XT
0NO_AP
0EGNAR_AP
LTC_RWP_AP
M_LTC_RWP_AP
FER_GB_MSG
0NIAKH
1NIAKH
2NIAKH
EBI1_DQ_0
EBI1_DQ_1
EBI1_DQ_2
EBI1_DQ_3
EBI1_DQ_4
EBI1_DQ_5
EBI1_DQ_6
EBI1_DQ_7
EBI1_DQ_8
EBI1_DQ_9
EBI1_DQ_10
EBI1_DQ_11
EBI1_DQ_12
EBI1_DQ_13
EBI1_DQ_14
EBI1_DQ_15
EBI1_DQ_16
EBI1_DQ_17
EBI1_DQ_18
EBI1_DQ_19
EBI1_DQ_20
EBI1_DQ_21
EBI1_DQ_22
EBI1_DQ_23
EBI1_DQ_24
EBI1_DQ_25
EBI1_DQ_26
EBI1_DQ_27
EBI1_DQ_28
EBI1_DQ_29
EBI1_DQ_30
EBI1_DQ_31
EBI1_ADR_0
EBI1_ADR_1
EBI1_ADR_2
EBI1_ADR_3
EBI1_ADR_4
EBI1_ADR_5
EBI1_ADR_6
EBI1_ADR_7
EBI1_ADR_8
EBI1_ADR_9
EBI1_ADR_10
EBI1_ADR_11
EBI1_ADR_12
EBI1_ADR_13
EBI1_CKE0
EBI1_CKE1
EBI1_DCLK
EBI1_DCLKB
EBI1_WE_N
EBI1_CS0_N
EBI1_CS1_N
EBI1_BA_0
EBI1_BA_1
EBI1_DQS_0
EBI1_DQS_1
EBI1_DQS_2
EBI1_DQS_3
EBI1_DM_0
EBI1_DM_1
EBI1_DM_2
EBI1_DM_3
EBI1_RAS_N
EBI1_CAS_N
EBI1_RESOUT_N
EBI1_CAL
EBI2_DATA_0
EBI2_DATA_1
EBI2_DATA_2
EBI2_DATA_3
EBI2_DATA_4
EBI2_DATA_5
EBI2_DATA_6
EBI2_DATA_7
EBI2_DATA_8
EBI2_DATA_9
EBI2_DATA_10
EBI2_DATA_11
EBI2_DATA_12
EBI2_DATA_13
EBI2_DATA_14
EBI2_DATA_15 0_RDA_2 I BE
1_RDA_2 I BE
2_RDA_2 I BE
3_RDA_2 I BE
4 _ RD A_ 2 IB E
5 _ RD A_ 2 IB E
6_RDA_2IBE
7_RDA_2IBE
8 _ RD A_ 2 IB E
9 _ RD A _2 IB E
01_RDA_2IBE
11_RDA_2IBE
21_RDA_2IBE
31_RDA_2IBE
41_RDA_2IBE
51_RDA_2IBE
61_RDA_2IBE
N_0SC_2IBE
N_1SC_2IBE
N_4SC_2IBE
N_5SC_2IBE
N_6SC_2IBE
N_7SC_2IBE
KLC_2 I BE
N_EW_2IBE
N_EO_2IBE
N_BU_2IBE
N_BL_2IBE
N_0YSUB_2IBE
REPIW
RL_ST
LL _ ST
RU_ST
LU_ST
231_OIPG
131_OIPG
0 3 1_ O IPG
921_OIPG
821_OIPG
7 2 1_ O IPG
621_OIPG
521_OIPG
421_OIPG
321_OIPG
221_OIPG
121_OIPG
021_OIPG
911_OIPG
811_OIPG
711_OIPG
611_OIPG
511_OIPG
411_OIPG
311_OIPG
211_OIPG
111_OIPG
011_OIPG
901_OIPG
801_OIPG
701_OIPG
601_OIPG
501_OIPG
401_OIPG
301_OIPG
201_OIPG
101_OIPG
001_OIPG
99_OIPG
89_OIPG
79_OIPG
69_OIPG
59_OIPG
49_OIPG
39_OIPG
29_OIPG
19_OIPG
09_OIPG
98_OIPG
88_OIPG
78_OIPG
68_OIPG
58_OIPG
GPIO_0
GPIO_1
GPIO_2
GPIO_3
GPIO_4
GPIO_5
GPIO_6
GPIO_7
GPIO_8
GPIO_9
GPIO_10
GPIO_11
GPIO_12
GPIO_13
GPIO_14
GPIO_15
GPIO_16
GPIO_17
GPIO_18
GPIO_19
GPIO_20
GPIO_21
GPIO_22
GPIO_23
GPIO_24
GPIO_25
GPIO_26
GPIO_27
GPIO_28
GPIO_29
GPIO_30
GPIO_31
GPIO_32
GPIO_33
GPIO_34
GPIO_35
GPIO_36
GPIO_37
GPIO_38
GPIO_39
GPIO_40
GPIO_41
GPIO_42
GPIO_43
GPIO_44
GPIO_45
GPIO_46
GPIO_47
GPIO_48
GPIO_49
GPIO_50
GPIO_51
GPIO_52
GPIO_53
GPIO_54
GPIO_55
GPIO_56
GPIO_57
GPIO_58
GPIO_59
GPIO_60
GPIO_61
GPIO_62
GPIO_63
GPIO_64
GPIO_65
GPIO_66
GPIO_67
GPIO_68
GPIO_69
GPIO_70
GPIO_71
GPIO_72_GRFC_9
GPIO_73_GRFC_8
GPIO_74_GRFC_7
GPIO_75_GRFC_6
GPIO_76_GRFC_5
GPIO_77_GRFC_4
GPIO_78_GRFC_3
GPIO_79_GRFC_2
GPIO_80_GRFC_1
GPIO_81_GRFC_0
GPIO_82
GPIO_83
GPIO_84
C208
10n
SDRAM_ADDR[13]
TSR_NOPn
SMT_MSM
MSM_TMS
ODT_MSM
MSM_TDO
IDT_MSM
MSM_TDI
PMIC_TCXO
OXCT_CIMP
KCT_MSM
MSM_TCK
TUOSER_GATJn
nJTAG_RESOUT
KLC_PEELS
KCTR_MSM
MSM_RTCK
nRESETOUT
IBSS _C IMP
NE_OXCT
TCXO_EN
2EWn
2BUn
2EOn
2BLn
EBI2_DATA[9]
EBI2_DATA[8]
EBI2_DATA[7]
EBI2_DATA[6]
EBI2_DATA[5]
EBI2_DATA[4]
EBI2_DATA[3]
EBI2_DATA[2]
EBI2_DATA[15]
EBI2_DATA[14]
EBI2_DATA[13]
EBI2_DATA[12]
EBI2_DATA[11]
EBI2_DATA[10]
EBI2_DATA[1]
EBI2_DATA[0]
SC_HSALF_DNANn
YDAER_HSALF_DNAN
nSDRAM_WE
nSDRAM_RAS
SDRAM_DQS3
SDRAM_DQS2
SDRAM_DQS1
SDRAM_DQS0
SDRAM_DQM3
SDRAM_DQM2
SDRAM_DQM1
SDRAM_DQM0
SDRAM_DCLK1
SDRAM_DCLK0
nSDRAM_CAS
SDRAM_BA1
SDRAM_BA0
SDRAM_ADDR[9]
SDRAM_ADDR[8]
SDRAM_ADDR[7]
SDRAM_ADDR[6]
SDRAM_ADDR[5]
SDRAM_ADDR[4]
SDRAM_ADDR[3]
SDRAM_ADDR[2]
SDRAM_ADDR[12]
SDRAM_ADDR[11]
SDRAM_ADDR[10]
SDRAM_ADDR[1]
SDRAM_ADDR[0]
ANT_SEL1
ANT_SEL2
ANT_SEL0
ANT_SEL3
TCXO_RTR_19.2MHZ
PMAR_AP_MSG
JTAG_PS_HOLD
MOTION_INT
T U O_XO RP
NO_ENIL
PO _EN IL
L_MF
R_M F
MD_HBSU
PUEKAW_TSOH_NALW
N_TESER_NALW
BT_WAKEUP
MICROSD_DET_N
AUDIO&MOTION_I2C_SDA
REMOTE_PWR_ON
REMOTE_PWR_ON
TUO_XUMA
FER_CAD_AP_MSG
TCXO_PM_19.2MHZ
RTR_TRK_LO_ADJ
RTR_TRK_LO_ADJ
P 1_ C IM
UART3_TX
XT_3TRAU
UART3_TX
UART3_TX
UART3_RX
XR_3TRAU
UART3_RX
UART3_RX
BT_PCM_CLK
BT_PCM_SYNC
PD_HBSU R_HPH
L_HPH
MMC_CMD
MMC_DATA[0]
MMC_DATA[1]
MMC_DATA[2]
MMC_DATA[3]
MSM_USIM_DATA
MSM_USIM_RST
MSM_USIM_CLK
BT_UART_TXD
BT_UART_RXD
BT_UART_CTS
BT_UART_RTS
CAM_DATA[3]
CAM_DATA[2]
PS_HOLD
PM_INT_N
BT_HOST_WAKEUP
CAM_MCLK
CAM_VSYNC
CAM_HSYNC
AUDIO&MOTION_I2C_SCL
LIN_PWM_FREQ
P_VCR
N_VCR
NO_XT
MUIC_I2C_SDA
MUIC_I2C_SCL
MUIC_INT
BT_PCM_DOUT
BT_PCM_DIN
EARJACK_SENSE
ADS_C2I_HCUOT
TNI_HCUOT
LCS_C2I_HCUOT
LCD_BL_EN
PA_ON1
MMC_CLK
SDRAM_DATA[31]
SDRAM_DATA[30]
SDRAM_DATA[29]
SDRAM_DATA[28]
SDRAM_DATA[27]
SDRAM_DATA[26]
SDRAM_DATA[25]
SDRAM_DATA[24]
SDRAM_DATA[23]
SDRAM_DATA[22]
SDRAM_DATA[21]
SDRAM_DATA[20]
SDRAM_DATA[19]
SDRAM_DATA[18]
SDRAM_DATA[17]
SDRAM_DATA[15]
SDRAM_DATA[14]
SDRAM_DATA[13]
SDRAM_DATA[12]
SDRAM_DATA[11]
SDRAM_DATA[10]
SDRAM_DATA[9]
SDRAM_DATA[8]
SDRAM_DATA[7]
SDRAM_DATA[6]
SDRAM_DATA[5]
SDRAM_DATA[4]
SDRAM_DATA[3]
SDRAM_DATA[2]
SDRAM_DATA[1]
SDRAM_DATA[0]
SDRAM_DATA[16]
nSDRAM_CS0
KLCSYS_HBSU
USBH_SYSCLK
ADS_C2I_LEUF
FUEL_I2C_SCL
SDRAM_CKE0
HS_MIC_BIAS_EN
WLAN_CLK
WLAN_CMD
CIM_SH
CIM_SH
NTSRT_MSM
MSM_TRSTN
CAM_I2C_SCL
CAM_I2C_SDA
N_TESER_DCL
LCS_C2I_SSAPMOC_XORP
WOL_DIREKAM_DCL
ADS_C2I_SSAPMOC_XORP
CAM_DATA[1]
CAM_DATA[0]
N1 _ C IM
GND|MIC_1N
N_TESER_TB
nSDRAM_CS1
SDRAM_CKE1
CAM_RESET_N
CAM_PWDN
CAM_DATA[4]
CAM_DATA[5]
CAM_DATA[6]
CAM_DATA[7]
LCS_C2I_LB_DCL
ADS_C2I_LB_DCL
CAM_PCLK
M_BTS_P_IDDM
P_BTS_P_IDDM
M_ATAD_P_IDDM
P_ATAD_P_IDDM
O_CNYSV_DCLM
COMPASS_DRDY
KEY_COL[2]
KEY_COL[1]
KEY_COL[0]
KEY_ROW[1]
KEY_ROW[0]
WLAN_REG_ON
0NO_AP
0R_AP
2NO_AP
FER_CAD
P_I_XT
M_I_XT
P_Q_XT
M_Q_XT
P_I_0XR
M_I_0XR
M_Q_0XR
P_Q_0XR
P_I_1XR
M_I_1XR
M_Q_1XR
P_Q_1XR
GPS_MODE
RTR6285_SSBI
1R_AP
INTER_RX_SW_SEL_1
INTER_RX_SW_SEL_2
LNA_GAIN_CONTROL
DIVERSITY_LNA_EN
TRK_LO_ADJ
JDA_OL_KRT
WLAN_SDIO[3]
WLAN_SDIO[2]
WLAN_SDIO[1]
WLAN_SDIO[0]
MMC_COVER_DETECT
MOTION_I2C_SCL
MOTION_I2C_SDA
GPS D FLIP-FLOP
MPM Port
Array TP
Clesed to NC7SZ74L8X
Clesed to TCXO
TCXO Circuit
ARM9&ARM11 JTAG
1.0T
0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG
ARM9&ARM11 JTAG
MODE[3:0]
0001 : Native, ARM9 + ARM11 on PJTAG
FFA Rev.C(220Ohm@100MHz)
2010.01.18 updated
NEST JIG
(MIC_1N)
RX1X_HCUOT
UY2Y_HCUOT
LX2X_HCUOT
DY1Y_HCUOT
FFA
71ppm)3B( 0457MP ;ESNES_TABV
REV.E_CHANGED_0517
- 157 -
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
833C
u01
u01
323C
R301
0
C301 0.1u
C300 0.1u
u2.2
413C
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
6 13 C
n 0 1 u2 2
513C
R304
0
813C
n01
913C
n1
7 1 3C
n 1
523C
u1.0
623C
u1.0
923C
u1.0
033C
u1.0
023C
n01
423C
n1
823C
n1
233C
n1
533C
u1.0
VREG_MSMC1_1.25V
133C
n01
933C
u1.0
143C
u1.0
043C
n01
633C
n01
733C
n1
243C
n1
903C
n01
213C
u2.2
u2.2
703C
U301
01P
1P 4M
M3
5G 1G 5E 01B
1B
H8
7H 7J 01R
9R
G10
2R
F9
1R
E10
01A
D9
9A
C10
2A
N10
M9
E7
L10
F8
K10
G6
J9
J8
H2
G9
G2
F10
K1
E9
B2
D10
E3
C9
G8
N9
F3
M10
J2
L9
K9
C7
J10
C8
D7
M2
D8
P9
D6
J1
E8
H9
D5
C1
F6
B9
F7
E6
M1
H4
P8
H3
H10
F5
H1
E4
D1
F4
B8
G4
G3
P6
J4
C5
H5
H6
N5
J5
B5
J6
G7
C6
K6
C3
K5
C4
K7
B4
L8
B7
K8
B3
L7
B6
L6
L5
N8
L4
M7
N7
K2
P5
J3
P4
F1
N4
F2
P3
K3
P2
D4
M8
E2
N6
D3
M6
E1
P7
D2
M5
C2
N3
L3
N2
L2
N1
L1
K4 A0
A1
IO0
A2
IO1
A3
IO2
A4
IO3
A5
IO4
A6
IO5
A7
IO6
A8
IO7
A9
IO8
A10
IO9
A11
IO10
A12
IO11
BA0
IO12
BA1
IO13
IO14
DQ0
IO15
DQ1
DQ2
CE#
DQ3
RE#
DQ4
WE#2
DQ5
CLE
DQ6
ALE
DQ7
WP#
DQ8
R_B#
DQ9
DQ10
VCC1
DQ11
VCC2
DQ12
DQ13
VSS6
DQ14
VSS7
DQ15
DQ16
VDD6
DQ17
VDD1
DQ18
VDD2
DQ19
VDD3
DQ20
VDD4
DQ21
VDD5
DQ22
DQ23
VSS8
DQ24
VSS1
DQ25
VSS2
DQ26
VSS3
DQ27
VSS4
DQ28
VSS5
DQ29
DQ30
VDDQ0
DQ31
VDDQ1
VDDQ5
CS0#
VDDQ3
CS1#
VDDQ4
CK
VDDQ2
CKE0
VDDQ7
CKE1
VDDQ6
WE#1
VDDQ8
RAS#
VDDQ9
CAS#
DM0
VSSQ0
DM1
VSSQ1
DM2
VSSQ2
DM3
VSSQ3
VSSQ4
0UND
VSSQ5
1UND
VSSQ6
2UND
VSSQ7
3UND
VSSQ8
4UND
VSSQ9
5UND
6UND
0SQD
2SQD
CK#
4CN
6CN
3SQD
UND
1S QD
A13
1UFR
2UFR
KCOL
223C
u1.0
VREG_MSME_1.8V
003R
K001
TP301
TP302 203R
K001
U200
L5
E10
AE22
AD25
AE18
AE15
AE11
AE7
Y5
T5
H25
E25
E22
Y25
V25
T25
P25
M25
K25
AE12
AC10
AC5
Y8
AF26
AF25
AF3
AF2
AE26
AB11
Y20
W19
U17
U11
P23
N23
M11
L17
L12
K23
K9
J19
G23
E19
C2
B26
B3
B2
T2
R8
R5
P9
N8
K6
K5
J6
J5
F9
E6
C8
C3
U6
T6
T3
R9
P8
P5
N9
K8
J9
J8
H6
H5
E9
E5
D3
B8
AE13
AE5
AB14
AB10
AA22
Y19
Y6
V22
U14
T16
T15
T14
T13
T12
R17
R16
R15
R14
R13
R12
P22
P17
P16
P15
P14
P13
P12
P11
P6
N22
N16
N15
N14
N13
N12
M16
M15
M14
M13
M12
L15
L13
L6
K22
G22
F19
F15
F10
E14
B4
7GA 6GA 5GA 4GA 3GA 72GA
62GA
52GA
42GA
32GA
22GA
12GA
02GA
2GA 91GA
81GA
71GA
61GA
51G A
41GA
31GA
21GA
11GA
01GA
1GA 72FA
1FA 72 EA
1EA 72DA
1DA 72CA
1CA 72BA
1BA 72AA
1AA 72A 62A 52A 42A 32A 22A 12A 02A 91A 81A 71A 61A 51A 41A 31A 21A 11A 01A 9A 8A 7 A 6 A 5A 4A 3 A 2A 1A
61E 41F 5AA 22H 11N 5N 81E 31E 5U 9T 7 2Y 1Y 72W 1W 72V 1V 72U 1U 72T 1T 72R 1R 72P 1P 72N 1N 72M 1M 72L 1L 72K 1K 72J 1J 72H 1H 72G 1G 72F 1F 72E 1E 72D 1D 7 2C 1C 72B 1B 9 GA 8GA
5 6 _C N
6 6 _C N
76_CN
86_CN
9 6 _C N
0 7 _C N
17_CN
27_CN
37_CN
47_CN
57_CN
67_CN
77_CN
87_CN
97_CN
08_CN
18_CN
28_CN
38_CN
48_CN
58_CN
68_CN
78_CN
88_CN
98_CN
09_CN
19_CN
29_CN
39_CN
49_CN
59_CN
69_CN
79_CN
89_CN
99_CN
001_CN
101_CN
201_CN
30 1 _C N
401_CN
1 D VS R
2DVSR
8P_DDV
9P_DDV
01P_DDV
GRP_ESUFQ_DDV
1C_SNS_DDV
2C_SNS_DDV
6P2_YHPBSU_DDV
3P3_YHPBSU_DDV
1 _ CN
2 _ CN
3_ C N
4_ C N
5 _ CN
6 _ CN
7_ C N
8_ C N
9_CN
01_CN
11_CN
21_CN
31_CN
41_CN
51_CN
61_CN
71_CN
81_CN
91_CN
02_CN
12_ C N
22_CN
32_CN
42_CN
52_CN
62_CN
72_CN
82_CN
92_CN
03_ C N
13_CN
23_CN
33_ CN
43_CN
53_CN
6 3_CN
73_CN
83_CN
9 3_CN
04_CN
14_CN
24_CN
34_CN
44_CN
54_CN
64_CN
74_CN
8 4_CN
94_CN
05_CN
15_CN
25_CN
35_CN
45_CN
55_CN
65_CN
75_CN
85_CN
95_CN
06_CN
16_CN
26_CN
36_CN
46_CN
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21
GND22
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
GND38
GND39
GND40
GND41
GND42
GND43
GND44
GND45
GND46
GND47
GND48
GND49
GND50
GND_A1
GND_A2
GND_A3
GND_A4
GND_A5
GND_A6
GND_A7
GND_A8
GND_A9
GND_A10
GND_A11
GND_A12
GND_A13
GND_A14
GND_A15
GND_A16
VDD_A1
VDD_A2
VDD_A3
VDD_A4
VDD_A5
VDD_A6
VDD_A7
VDD_A8
VDD_A9
VDD_A10
VDD_A11
VDD_A12
VDD_A13
VDD_C1_1
VDD_C1_2
VDD_C1_3
VDD_C1_4
VDD_C1_5
VDD_C1_6
VDD_C1_7
VDD_C1_8
VDD_C1_9
VDD_C1_10
VDD_C1_11
VDD_C1_12
VDD_C1_13
VDD_C1_14
VDD_C1_15
VDD_C1_16
VDD_C1_17
VDD_C1_18
VDD_C1_19
VDD_C1_20
VDD_C1_21
VDD_C1_22
VDD_C1_23
VDD_C1_24
VDD_C2_1
VDD_C2_2
VDD_C2_3
VDD_MDDI
VDD_P1_1
VDD_P1_2
VDD_P1_3
VDD_P1_4
VDD_P1_5
VDD_P1_6
VDD_P2_1
VDD_P2_2
VDD_P2_3
VDD_P3_1
VDD_P3_2
VDD_P3_3
VDD_P3_4
VDD_P3_5
VDD_P3_6
VDD_P4_1
VDD_P4_2
VDD_P7_1
VDD_P7_2
92R
0
TP300
VREG_MSME_1.8V
VREG_MSME_1.8V
113C
Fu1
VREG_MSME_1.8V
313C
Fu1
V3.3_BSU
V6.2_A
MS
M_GERV
V9.2_2XUA_GERV
VREG_MSMP_2.6V
VREG_MSME_1.8V
VREG_MSMC2_1.25V
VREG_MSMC1_1.25V
VREG_MSMA_2.6V
R303
0
VSNS_MSMC2_1.25V
VSNS_MSMC1_1.25V
VSNS_MSME_1.8V
u01
333C
723C
u01
013C
u1.0
VREG_MSMP_2.6V VREG_MSMA_2.6V VREG_MSMC2_1.25V VREG_MSME_1.8V VREG_MSMC1_1.25V
V8.1_E
MS
M_GERV
V6.2_P
MS
M_GERV
V8.1_E
MS
M_GERV
60 3 C
Fu 1
503C
u1.0
803C
u7.4
203C
IND
SDRAM_ADDR[13]
nRESETOUT
nWE2
nUB2
nOE2
nLB2
]9[ATAD_2IBE
EBI2_DATA[9]
EBI2_DATA[8]
EBI2_DATA[7]
EBI2_DATA[6]
EBI2_DATA[5]
EBI2_DATA[4]
EBI2_DATA[3]
EBI2_DATA[2]
EBI2_DATA[15]
EBI2_DATA[14]
EBI2_DATA[13]
EBI2_DATA[12]
EBI2_DATA[11]
EBI2_DATA[10]
EBI2_DATA[1]
EBI2_DATA[0]
nNAND_FLASH_CS
NAND_FLASH_READY
nSDRAM_WE
nSDRAM_RAS
3SQD_MARDS
2SQD _MARD S
1SQD_MARDS
0SQD_MARDS
SDRAM_DQM3
SDRAM_DQM2
SDRAM_DQM1
SDRAM_DQM0
SDRAM_DCLK1
SDRAM_DCLK0
nSDRAM_CAS
SDRAM_BA1
SDRAM_BA0
SDRAM_ADDR[9]
SDRAM_ADDR[8]
SDRAM_ADDR[7]
SDRAM_ADDR[6]
SDRAM_ADDR[5]
SDRAM_ADDR[4]
SDRAM_ADDR[3]
SDRAM_ADDR[2]
SDRAM_ADDR[12]
SDRAM_ADDR[11]
SDRAM_ADDR[10]
SDRAM_ADDR[1]
SDRAM_ADDR[0]
PMAR_AP_MSG
MD_HBSU
P D _HBSU
SDRAM_DATA[31]
SDRAM_DATA[30]
SDRAM_DATA[29]
SDRAM_DATA[28]
SDRAM_DATA[27]
SDRAM_DATA[26]
]52[ATAD_MARDS
SDRAM_DATA[25]
SDRAM_DATA[24]
SDRAM_DATA[23]
SDRAM_DATA[22]
SDRAM_DATA[21]
SDRAM_DATA[20]
SDRAM_DATA[19]
]81[ATAD_MARDS
SDRAM_DATA[18]
SDRAM_DATA[17]
]51[ATAD_MARDS
SDRAM_DATA[15]
SDRAM_DATA[14]
SDRAM_DATA[13]
]21[ATAD_MARDS
SDRAM_DATA[12]
SDRAM_DATA[11]
SDRAM_DATA[10]
SDRAM_DATA[9]
SDRAM_DATA[8]
SDRAM_DATA[7]
SDRAM_DATA[6]
SDRAM_DATA[5]
SDRAM_DATA[4]
SDRAM_DATA[3]
SDRAM_DATA[2]
SDRAM_DATA[1]
SDRAM_DATA[0]
SDRAM_DATA[16]
nSDRAM_CS0
KLCSYS_HBSU
SDRAM_CKE0
nSDRAM_CS1
SDRAM_CKE1
M_BTS_P_IDDM
P_BTS_P_IDDM
M_ A TA D _P_ I DD M
P_ATAD_P_IDDM
IBSS_5826RTR
JDA_OL_KRT
8061
u22 >- u01 D.veR A F F
V8.1 - 8P : CDCL ESU UOY FI
Cap for MSM7227 Power
MSM7227 Power Part
MCP (4G NAND FLASH +4G DDR SDRAM)
8061
8061
8061
8061
For Artwork
REV.C_0408_CHANGED
2010.01.25 updated
7. CIRCUIT DIAGRAM
- 158 - LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
C426 1n
2.2u
L400
10u C438
C411 0.1u
VREG_MSMP_2.6V
634C
u7.4
C415 0.1u
C444 2.2u
VREG_LCD_2.8V
CN401
3
2 4
1
C407
100u
VREG_AUX2_2.9V
524R
K1 VBAT
u7.4
254C
C437 1n
+VPWR_AUDIO
C412
33p
C413 0.1u
C458 0.1u
+VPWR
C419 0.1u
C418 0.1u
C417 0.1u
C422 0.1u
C421 0.1u
C420 0.1u
434C
u7.4
10u C427
4.7u L402
VBAT
104D
U404
9
7 4
8 1
6
5
3 2 CELL VDD
SEO
EO
CTG SDA
GND SCL D NGP
R415
10K
D404
C443
1u
2.2u
C454
VREG_MOTION_3.0V
D402
C442
1u
VREG_MSMP_2.6V
714R
K2.2
+VPWR_RF
C457
1u
n1
134C
VREG_SMPS_2.1V
VREG_MSMC2_1.25V
2.2u
C451
u7.4
334C
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
VREG_MSMA_2.6V
C448
2.2u
u 2 . 2
4 2 4C
VREG_RUIM_3.0V
n1
034C
VCHG_VBUS
VREG_MSMC1_1.25V
VBAT
C455
2.2u
C410 0.1u
C447
2.2u
234C
n1
R424 51
VREG_TCXO_2.85V
8 14 R
K2 . 2
IC1
4B
D2
B2
A1 A2
B3
C2
A4
C1
A3 D1
E4
D3 D4
E3
E2 C3
E1 C4
1B
YLPPUSV
UART_TX VBUS
UART_RX DM
DP
USB_DM ID
USB_DP
AUDIO_L R2_2K
AUDIO_R
MIC
DSS
_INT
SDA CLDO
SCL
GND TESI
R423 121K
U403
9J 8J 7J 6J 5J 9H 8H 7H 6H 5H 9G 8G 7G 6G 5G 9F 8F 7F 6F 5F 9E 8E 7 E 6E 5E
H1
E10 F1
F10 E1
C12 N2
B1
M12 B2
K7
A5
N13 A4
M13 B5
B4
G10 A7
D9 A6
H12 B7
B6
C13
A13 D10
A12 K10
H10
G12 J10
G1
M1 K4
D13 J4
E12 H4
N11 M2
A3 L2
A10 H2
A8
H13 K2
G13 J2
A11 G4
K13 F4
E13 D5
B13 B3
A9 M5
N12 N3
J13 N1
A2 M3
K6
M4 K5
N4 K9
M9 K8
N10 M11
M6 L12
N6 A1
M8 D4
N8 B12
J1 D8
K1 N5
M7
2G
21D 7D 8B
01M 6D 9B
21J
31F
21F
21K 7N 9N
01B
31L
11B 2F 4E 2C 1C 1D 1 L 2D 2E
GHCV
N_LTC_GHC
S UBV _BS U
N _LT C_BS U
P_SNSI
M_SNS I
N _ TEF_TAB
TABV
N IOCV
PUKCAB_V
A NA _ DDV
E_1C_DDV
AP_2C_ D DV
2PG_DDV
6PG_DDV
2EMSM_D DV
PMSM_DDV
1FR_DDV
2F R _DDV
MIUR_DDV
RKPS_L_DDV
RKPS_ R _ D DV
OXCT_DDV
NALW_DDV MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1DN G
2 D N G
3 D N G
4 DNG
5DNG
6DN G
7 D N G
8D N G
9DNG
01 D N G
11 D N G
21 DNG
31DNG
41DNG
51DNG
61DNG
71DNG
81DNG
91DNG
02 D N G
12DNG
22DNG
32 D N G
42DNG
52DNG
VREG_RF_2.7V
C450
2.2u
VREG_MSME_1.8V
+VPWR
924C
n1
L404 4.7u
VREG_LCD_1.8V
VREG_MSME_1.8V
VREG_MSMP_2.6V
4.7u L401
R407
4.7
K051
624R
VREG_HPVDD_1.8V
TP400
TP401
VREG_MSMP_2.6V
TP402
200K
R428
+VPWR
USB_3.3V
VREG_TOUCH_3.0V
4.7u L403
U400
9 6
5 3
4
8 2
7 1 IN1 OUT1
IN2 OUT2
IC1
OVLO IC2 DNG
DNGP
CN4
11
10
9
5
4
3
2
1
8
7
6
u7.4
354C
1u
C40
1 64 C
Fu1
004C
u1.0
2.2u
C456 C3
2.2u
R401 2.2K
504R
smhoK7.4
404R
K2
0391C u1
02R
K7.4
R413
470Kohms
8 04 R
K01
C441
u 1. 0
u7.4
534C
C425 1n
R414
1K
u1
404C
214R
051
10u
C428
114R
051
U401
5
3 2
4 1 VOUT VIN
GND STBY DN GP
K6.08
904R
VREG_MSMP_2.6V
0.1u
C439
VBAT
3 04 D
104DZ
C440
10n
VREG_PROX_2.8V
2.2u
C446
614R
smhoK086
SC2
1
724R
smhoK034
VREG_MMC_3.0V
C460 10pF
C459 10pF
304R
K2
C462
DNI
014R
K074
1u
C45
CAM_AF_2.8V
504C
u1
VCHG_VBUS
zHK867.23
AS5123XN
004X 2
1
C402
22p
FL1013
5
6
3 1
4 2 P2 P4
P1 P3
6P
5P
10n C408
VCHG_VBUS
VBAT
Q400
5
6 4
7 3
8 2
9 1
10 DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
004R
1.0
p22
304C
0.1u
C401
00 4 D Z
FL400
1 IN OUT
GND1 GND2
VCHG_VBUS
VREG_MSMP_2.6V
C48
10n
+VPWR
D400
10u
C409
1n
C414
+VPWR
+VPWR_RF|+VPWR
R WPV+
USB_3.3V_EN
USB_3.3V_EN
nPON_RST
PMIC_TCXO
SLEEP_CLK
PMIC_SSBI
TCXO_EN
JTAG_PS_HOLD
USBH_DM
REMOTE_PWR_ON
AMUX_OUT
GSM_PA_DAC_REF
TCXO_PM_19.2MHZ
UART3_TX
UART3_RX
USBH_DP
MSM_USIM_DATA
MSM_USIM_RST
MSM_USIM_CLK
PS_HOLD
PM_INT_N
SIM_RST
SIM_CLK
VBAT_TEMP
VBAT_TEMP
VBAT_SENSE
VBAT_SENSE
USB_ID
USB_ID
MAX_DP
MAX_DP
MAX_DM
MAX_DM
KPD_PWR_N
P_SNSI
ISNS_P
N _ L TC _ G HC
CHG_CTL_N
N _ TE F _ T TAB
BATT_FET_N
VSNS_MSME_1.8V
PCB_REVISION
PCB_REVISION
MUIC_I2C_SDA
MUIC_I2C_SCL
MUIC_INT
VSNS_RF_SMPS
VSNS_MSMC1_1.25V
FUEL_I2C_SDA
FUEL_I2C_SCL
VSNS_MSMC2_1.25V
NIOCV
SIM_IO
BACKLIGHT_KEY
Place crystal and load caps close to PM7540
Must Check Battery Conn. Pin Map
1%
r e h t e g o t et u oR
REV.C_0408_CHANGED
0.5mm
Local Ground Plan
PM7540
Place in PM7540 room at shield edge
0.6mm
0.6mm
These CAPs close to inductors
REV.C_0408_CHANGED
1
.
1
.
v
e
R
0.6mm
USB 3.3V LDO
Route together
Place close to PM7540 pins
1608
150K
1%
150K
150K
R1
ADC
150K
A&F
150K
R2
R2
2.13V
10K
68K
47K
150K
150K
REV
1.93V
D&I
C&H
B&G
Rev.1.1
150K
150K
HKAIN0 : PCB Revision Check ADC
0.16V
Rev.1.0
E&J
Rev.1.2 680K
0.81V
100K
1.73V
0.62V
300K
R1
430K
M_SN S I
1.30V
1.04V
close to each other
2mm
mm5.0 9N ,7N
0603
VOLTAGE DETECTOR REMOVED
Fuel Gauge IC & Battery Conn.
2mm
10.04.08 Changed Rev.C
SERIAL RESISTOR REMOVED
1608
Am08 eldnaH naC e c arT
2mm
REV.1.0_0624_CHANGED
2mm
09.12.17 added
Turbo Mode
09.11.12 added
2009.11.16 changed
1608
10V
Aloha 091209
0.3mm 0.3mm
REV.C_0408_CHANGED
REV.E_CHANGED_0517
REV.E_CHANGED_0517
REV.C_0408_CHANGED
2mm
Battery Charging Circuit
MUIC
TA OVP Circuit
VBUS 2mm
u-USB Connector
2mm 1%
ISNS_M
CITIZEN -> NDK
- 159 -
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
TP5
8pF
C7
R509 12
DNI
C16
R1170 2.2K
FB701 1800
ANT2
C523
DNI
10uF
C18
FB700 1800
205C
p93
TP7
4.7uF
C5
305R
02
0.1uF
C2
505R
K7.4
2.2K R1171
L1
3.3uH
C545
47pF
J2
2
3
6
5
4
1 M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
L3
4.7u
405C
u1
10K
R521
FB502 1800
10K
R520
33p
C702
1
2
605R
K001
106Q
D
G
S
R1177 10
+VPWR_AUDIO
C536
1u
10 R1176
U500
03 92 82 72 62 52 42 32 22 12 02 91 81 71 61
31
32 15
14
33
34 13
35 12
36 11
37 10
38 9
39 8
40 7
6
41 5
4
42
43 3
44 2
45
1
64 74 84 94 05 15 25 35 45
1DNG
2DNG
3DNG
4DNG
B_EKA W _ TS OH_LW
DXT_TRAU_TB
N_STC_TRAU_TB
N_STR_TRAU_TB
DXR_TRAU_TB
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
BB2XLV_RS
BBTUOV_RS
OIDDV
UP_LATX
DS_OIDDV
T U O_ 2P 1_GID
TUO_2P1_GLNA
ODLV2P1_NIV
T U O _2OD L NL
ADS_TB
LCS_TB
1OIDUA
2OIDUA
N_TSR_TB
7DNG
C30
0.1u
MIC_BIAS
4 35 C
u 2 .2
C32
0.1u
C533
1u
C535 1n
005D
205D
305D
47p
C542
C33
4.7uF
ANT1
105D
1u
C8
33p
C703
C17
47p
33p
C544
M1
8611R
C543
47p
405D
270n
L504
C522
2.2u
VREG_MSMP_2.6V
C9
2.2u
TP12
C1 0.001uF
TP9
TP1
TP3
TP11
TP4
C509 33n
U502
5
3 2
4 1 VOUT VIN
GND STBY DNGP
TP10 R1
0
C6
2.2uF
9611R
K74
TP13
+VPWR
VREG_MSMP_2.6V
MIC1
6
5
4
3
2
1 OUT
G1
G2
G3
PWR
G4
C34 4.7uF 33n C510
TP8
10uF
C19
0.1u
C31 TP6
VREG_MSMP_2.6V
C518
2.2u
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
VA615
205R
02
VREG_MSMP_2.6V
K2.2
705R
33p
C538
2.2u
C539
U501
5
3 2
4 1 VOUT VIN
GND STBY DNGP
L4
DNI
405R
K7.4
47p C505
47p C506
u1.0
315C
u1.0
215C
1u C511
1u C514
VREG_MSMP_2.6V
C519
2.2u
IC500
3B
A4
C3
C2
2B
D1
D3
4D
C1
A1 D2
1B
D5
A2
A5
A3
B5
4B
C5
4C
DNG
OUT+
DDVPH
CPVDD
CPVSS
CN
HPL
OUT-
SAIB
IN2- HPR
IN1+
DDVS
IN3-
IN2+
ADS
IN1-
IN3+
CP
LCS
1u C507
C508 1u
u01
305C
R515 12
2.2u C515
VREG_HPVDD_1.8V
FB500 1800
FB501 1800
33p
C700
+VPWR
VDD_TCXO
VDD_TCXO
26MHz X500
TG-5010LH-87N
4 2
3 1 NC OUT
GND VCC
10u
C537
SLEEP_CLK
LINE_ON
LINE_OP
FM_L
FM_R
WLAN_HOST_WAKEUP
WLAN_RESET_N BT_WAKEUP
AUDIO&MOTION_I2C_SDA
MIC_1P
BT_PCM_CLK
BT_PCM_SYNC
HPH_R
HPH_L
BT_UART_TXD
BT_UART_RXD
BT_UART_CTS
BT_UART_RTS
BT_HOST_WAKEUP
AUDIO&MOTION_I2C_SCL
FM_ANT
FM_ANT
QER_KLC
CLK_REQ
CLK_IN
CLK_IN
RF_IN_OUT
RF_IN_OUT
RCV_P
RCV_N
EAR_L
EAR_L
EAR_R
EAR_R
BT_PCM_DOUT
BT_PCM_DIN
EARJACK_SENSE
HS_MIC_BIAS_EN
WLAN_CLK
WLAN_CMD
HS_MIC
MIC_1N
BT_RESET_N
SPK_RCV+
SPK_RCV-
WLAN_REG_ON
WLAN_SDIO[3]
WLAN_SDIO[2]
WLAN_SDIO[1]
WLAN_SDIO[0]
changed 12/28
0603
MIC
0603
3060
3 060
3060
3060
3060 3060
close to 3
close to 17
HIGH
LOW(DEFAULT)
STATE
UNMATING
Audio SUB SYSTEM
EAR_SENSE
MATING
Must Check Schematic
2009.11.16 added
10.04.08 Changed Rev.C
3.5pi Ear Jack Connector
26MHz TCXO
Wi-Fi&BT&FM MODULE
TCXO LDO
7. CIRCUIT DIAGRAM
- 160 - LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
0.1u
C623
516C
u1.0
FB600
120
J1
5 1
6 2
7 3
8 4
9 10 GND2 GND1
RESERVED1 RESERVED2
CLK I_O
RST VPP
VCC GND
2 711R
1
VREG_MMC_3.0V
FB602
120
33p
C608
C619
33p
3 7 11 R
1
CN2
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
C621
33p
C620
0.1u
C618
33p
R614
4.7Kohms R617
51K
C625 10n
VREG_MSMP_2.6V
FL600
7.5pF
01 5
6 4
7 3
8 2
9 1 INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
OJ600 OJ601
CN601
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
1DZ
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
5 7 11 R
1
FL601
7.5pF
01 5
6 4
7 3
8 2
9 1 INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
FL602
7.5pF
01 5
6 4
7 3
8 2
9 1 INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G 2G
C611
4.7uF
LD1
R612 100K
C606
4.7u
FL603
01 9
8 4
7 3
6 2
5 1 P1 P5
P2 P6
P3 P7
P4 P8
1
G
2
G
416C
Fu1
LD4
VREG_LCD_2.8V VREG_LCD_1.8V
D600
4 3
5 2
6 1
2.2u
C616 C617
2.2u
WLED_PWR
006L
s m ho1
R618
1K
VA607
116R
s mh o K1.5
R615
1K
VREG_RUIM_3.0V
VREG_RUIM_3.0V
106BF
smho7.4
D601
4 3
5 2
6 1
R616
51K
VREG_MOTOR_3.3V VREG_MOTOR_3.3V
U1007
52 0 2 6
11 4
8
3
9
10 5
16
17
18
19
15
14
13
12 23
1 7
1 2 22 4 2 2
+2C
+1C
- 1C
-2C
IN1 OUT
IN2 BL1
BL2
BL3
BL4
BL5
BL6
BL7_AUX1
BL8_AUX2
EN LDOA
LDOB
SDA
LDOC
SCL LDOD
DNGA
DNGP PE
CAM_IOVDD_2.6V
U602
B2 C1
A1 B1
B3 C2
A3 C3 IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
Q600
C
B
E GND
IN
OUT
C624
0.1u
WLED_PWR
LD3 LD2
C1931
2.2u
CAM_IOVDD_2.6V
CAM_DVDD_1.2V
CAM_AVDD_2.7V
C610
2.2u
C609
2.2u
C622
33pF
2.2u
C612
VREG_MOTOR_3.3V
4.7K
R601
4.7K
R600
VREG_MSMP_2.6V
206R
K001
+VPWR
C600
1u
C601
1u
706C
u2.2 u2. 2
206C
4 71 1 R
1
CAM_AF_2.8V
FB603
120
CAM_DVDD_1.2V
CN600
17
16
15
14
13
12
11
10
9
8
7
6
5
31 4
32 3
33 2
34 1
30
29
28
27
26
25
24
23
22
21
20
19
18
R605 12
CAM_AVDD_2.7V
316C
u01
406R
K2.2
306R
K2.2
VREG_LCD_1.8V VREG_MSMP_2.6V
U601
4 3
5 2
6 1 VCCA VCCB
A B
GND OE_
+VPWR
C605
4.7u
C604
4.7u
C4
4.7u
R619 100K
MICROSD_DET_N
MMC_CMD
MMC_DATA[0]
MMC_DATA[1]
MMC_DATA[2] MMC_DATA[3]
CAM_DATA[3]
CAM_DATA[2]
CAM_MCLK
CAM_VSYNC
CAM_HSYNC
LIN_PWM_FREQ
SIM_RST
SIM_RST
SIM_CLK SIM_CLK
LCD_BL_EN
MMC_CLK
CAM_I2C_SCL
CAM_I2C_SDA
VCOIN
WLED5
WLED5
WLED4
WLED4
WLED3
WLED3
WLED2
WLED2
WLED1
WLED1
WLED6
WLED6
WLED7
WLED7
LCD_RESET_N
LCD_MAKERID_LOW
MTR_P_2sub
MTR_P_2sub
MTR_N_2sub
MTR_N_2sub
CAM_DATA[1]
CAM_DATA[0]
FLT_CAM_VSYNC
FLT_CAM_VSYNC
FLT_CAM_HSYNC
FLT_CAM_HSYNC
CAM_RESET_N
CAM_PWDN
CAM_DATA[4]
CAM_DATA[5]
CAM_DATA[6]
CAM_DATA[7]
LCD_BL_I2C_SCL
LCD_BL_I2C_SDA
CAM_PCLK
FLT_CAM_DATA[0]
FLT_CAM_DATA[0]
FLT_CAM_DATA[1]
FLT_CAM_DATA[1]
FLT_CAM_DATA[2]
FLT_CAM_DATA[2]
FLT_CAM_DATA[3]
FLT_CAM_DATA[3]
FLT_CAM_DATA[4]
FLT_CAM_DATA[4]
FLT_CAM_DATA[5]
FLT_CAM_DATA[5]
FLT_CAM_DATA[6]
FLT_CAM_DATA[6]
FLT_CAM_DATA[7]
FLT_CAM_DATA[7]
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_P
MLCD_VSYNC_O
LCD_VSYNC_O
LCD_VSYNC_O
SPK_RCV+ SPK_RCV-
SIM_IO
SIM_IO
MMC_COVER_DETECT
BACKLIGHT_KEY
MAIN-SUB CONNECTOR
1608
1608
1608
KEY BACKLIGHT LED
Rev.E Changed _ 0517
BACKLIGHT CHARGE PUMP
3.2" HVGA LCD Connector
CAMERA EMI FILTER
LEVEL SHIFT REV.E_CHANGED_0517
USIM Socket
3M CAMERA
1%
1%
LGIT_1/4'' SVCY0024801(C3AA-Y314A)
1%
Q-coin MOTOR
1%
1%
1%
- 161 - LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
045C
u1.0
C706
470n
VREG_TOUCH_3.0V
VREG_MSMP_2.6V
4.7Kohms
R2
4.7Kohms
R3
VA612
VREG_MOTION_3.0V
016AV
VREG_MSMP_2.6V
VREG_MOTION_3.0V
U700
5 4
6 3
7 2
8 1 LEDA SCL
LEDC SDA
VCC VIO
VOUT GND U503
KR3DH
2DEVRESER
DDV
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1 ODS_IDS_ADS
0AS_ODS
4DNG
10u
C541
CN3
4
3
2
1
470 R25
1AV
906AV
VA613 VA611 VA614
C707
1u
815R
K2.2
915R
K2.2
R613 470
R700
10
R610 470
C708
0.1u
407C
n01
CN1
6 5
7 4
8 3
9 2
10 1
G1 G2
G3 G4
KB702 KB701
KB703
R703
10
KB704
VREG_PROX_2.8V
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
R702
4.7Kohms
R701
4.7Kohms
C709
4.7u
U1
12
11
10
9
5
4
6
3
7
2
8
1
DDVD
GERV
ADNG
SDNG
DDVA
ADDR
SCL
NC1
TNI
VPP
DRDY
SDA
10u
C705
CN5
2
1
VA2
MOTION_INT
PROX_OUT
KPD_PWR_N
TOUCH_I2C_SDA TOUCH_INT
TOUCH_I2C_SCL
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDA
PROX_COMPASS_I2C_SDA
COMPASS_DRDY
KEY_COL[2]
KEY_COL[1] KEY_COL[0]
KEY_ROW[1]
KEY_ROW[1]
KEY_ROW[0]
KEY_ROW[0]
MOTION_I2C_SCL
MOTION_I2C_SDA
TOUCH
DOCKING
2010.01.20 updated
Must Check Schematic
HALL IC(N.A)
HOT KEY
Acceleration Sensor
VOLUME SIDEKEY
0603
Digital Compass
REV.E_CHANGED_0517
HOME SEND
MENU
Proximity Sensor
0603
REV.C_0408_CHANGED
POWER KEY
SEVY0008101
33010S5CLVE
7. CIRCUIT DIAGRAM
- 162 - LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1u
C701
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
VB700
2
1 K022
007R
4L
n33
1K
R709
BAT1
1AV
2AV
3L
n 5 1
507AV
407AV
307AV
007AV
207AV
107AV
CN1
ENBY0034101
GB042-24P-H10-E3000
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
n33 2L
4AV
3AV 017R
K022 S700
GND
DAT2
CD_DAT3
CMD
VDD
CLK
VSS
CARD_DETECT
DAT0
COVER_DETECT1
DAT1
n 5 1 1L
C705
1u
607AV
K74
307R
K74
407R
K74
507R
607R
K74
K74
707R
VREG_MMC_3.0V VREG_MSMP_2.6V
VREG_MMC_3.0V
VREG_MSMP_2.6V
CN701
2
1
MMC_DATA[3] MMC_DATA[3]
MMC_DATA[0]
MMC_DATA[0]
MMC_DATA[1]
MMC_DATA[1]
MMC_DATA[2]
MMC_DATA[2]
MMC_CD
MMC_CD
MMC_CMD
MMC_CMD
MMC_CLK
MMC_CLK
MTR_N_2sub
MTR_N_2sub
MTR_P_2sub
MTR_P_2sub
SPK_RCV-
SPK_RCV-
SPK_RCV+
SPK_RCV+
VCOIN
VCOIN
MMC_COVER_DETECT
MMC_COVER_DETECT
LGP500_SUB_PCB_Rev A
BACK-UP BATTERY Micro SD Socket Main2Sub B2B VIBRATOR(Q-Motor)
SPEAKER PAD
- 16 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
8. BGA PIN MAP
8. BGA PIN MAP

8. BGA PIN MAP



MCP




- 164 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA PIN MAP

MSM7227

- 165 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
8. BGA PIN MAP

RTR6285(Top View)


- 166 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA PIN MAP

PM7540(PMIC)




- 167 -
9. PCB LAYOUT
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1 0 7 B K
C
203
1 0 2 C
3 D L
R1175
L
D
2
5 N C
M
IC
1
2 0 2 C
3 0 7 B K
0 0 7 B F
1 0 7 B F
VA615
3 7 1 1 R
C1931
VA614
VA612 2 7 1 1 R
VA613
VA611
4 D L 4 0 7 B K
5 0 7 C
C709
R700
0 0 7 U
C707
C708
3 0 7 R
1 0 7 R
9 6 1 1 R
Q
601
2 0 7 R
8 6 1 1 R
2 0 7 B K
L
D
1 R1174
LG-P500h_MAIN_SPFY0233701-1.1_PLACE_TOP
MIC1 : Microphone
- no far-end voice
- no voice recording
9. PCB LAYOUT
- 168 - LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
E
D
A
F
AD M
7
5
13
A B C D
1
6
12
10
10
N H G F M L K J
24 20
E
13
11
1
1 A B C
5
4
27
1
10
A E D C B
K L J H G F E D C B
B
L J K H G
U V W Y AA AB AC N P R T
4
E
D
C
18
34
R P N M
AG AF AE
17
12
24
13
8
14
1 0 0 1 U
1 0 6 N C
5 1 4 C
R414
2 A V
5 2 R
1 A V
C
N
3
D404
2 5 4 C
4 5 4 C
8 5 4 C
3 2 4 R
7 4 4 C
0 1 4 C
2 2 4 C
3 4 4 C
1 1 4 R
2 1 4 R
0 4 4 C
8 0 4 C
TP4
3 0 4 U
C420
2 N C
3 1 P T
0 0 5 U
2 3 C
TP10 9 P T
C448
0 6 4 C
C438
3 0 2 P T
1 J
1 0 4 N C
R409
C513
9 1 5 C
5 0 3 C
TP6
5 3 5 C
6 0 5 R
C533
5 3 4 C
1 3 4 C
C430
C433
6 3 4 C
2 3 4 C
9 2 R
R415
D403
0 0 4 D Z
0 0 2 U
2 B F
0 3 1 1 L
2 0 6 B F
1 0 3 U
6 1 3 C
7 0 2 R
4 0 2 C C337
5 0 2 R
6 0 2 C
7 1 0 1 R
0 5 0 1 C
5 1 0 1 R
C1096
1 L F
9 0 1 1 C 9 7 0 1 C
5 0 0 1 U
C1115
R403
FL603
C339
C1064
9 2 0 1 R
1 2 5 R
1 0 5 B F
FB601 7 0 1 1 C
R1026
C1106
5 0 1 1 C
C341
0 0 2 C
L1015
L1016
C27
U2
L101 2
1 0 0 1 W S
ANT1003
5 0 0 1 T N A
C1063
6 0 0 1 T N A
2 3 0 1 L
0 2 1 1 C
9 0 6 C
2 1 6 C
1 0 6 U
0 1 6 C
1 1 6 C
8 0 0 1 L
7 0 0 1 L
1 0 0 1 L F
1 U
7 0 4 R
1 0 2 A V
VA202
C622
C620
C407
2 T N A
1 T N A
0 1 6 A V
3 1 6 R
C706
C704
R219
5 0 2 A V
4 2 4 C
R218 VA204
8 0 4 R
VA200
R217
L600
5 1 2 R
R216
1 2 6 C
3 0 2 A V
C618
D601
1 1 6 R
C619
2 4 4 C
C409
R410
D401
C16
7 1 C 4 L
TP8
C 419
C421
C450 C418
C457
TP402
Q400
R400
2 R 3 R
1 N C
9 0 6 A V
0 1 6 R
C18
TP7
1 P T
R1
1 1 P T
5 C
3 P T
C2
C446
C444
C456
1 6 4 C
8 2 4 R
5 2 4 R
C34
TP401
C428 7 1 4 C
1 1 4 C
3 1 4 C
4 0 4 U
3 0 5 C 2 0 5 C
L1
L3
C453
4 0 5 C
C451
0 0 4 X
9 5 4 C
D402
0 0 4 L
2 1 4 C
1 0 2 P T
6 1 4 R
3 1 4 R ZD40 1 9 3 4 C
R1171
R1177
R1176
6 C
R427
R426
3 0 5 R
C510
R1170
C508
C512
2 0 5 R
C507
5 4 C
C509
1 1 5 C
4 1 5 C
C505
C8 C33
C19
C31
6 2 4 C
0 3 C
3 C C414 0 4 C
U401
3 0 4 L
5 2 4 C
1 4 4 C
5 5 4 C 7 2 4 C
2 0 4 L
1 0 4 L
7 3 4 C 0 3 9 1 C
4 0 4 L
2 0 2 P T
7 1 4 R
8 1 4 R
C522
IC500
0 0 3 R
8 1 2 C
2 1 2 C
5 0 5 R
4 0 5 R
C515
C506
3 2 5 C
C518
9 C
4 0 6 C 5 P T 2 1 P T
7 C
1 C
0 0 5 X
TP302
6 3 5 C
1 1 3 C
2 0 3 R C534
U501
2 0 3 C
7 2 3 C
2 6 4 C
1 3 3 C
2 3 3 C
9 1 3 C
2 2 3 C
TP301
R424 0 0 3 C
0 0 4 P T
4 0 2 R
0 3 3 C
1 0 3 C
6 0 2 R
4 0 3 R
C434
7 1 2 C
5 1 2 C
6 1 2 C
2 0 7 C
C429 0 0 7 C
4 1 2 C
C213
C211 3 0 7 C
5 0 4 C
0 0 4 D
C402
FL1005
R1163 9 2 0 1 L
8 0 1 1 C
C404
0 0 4 U
C401
0 0 6 B F 5 0 6 C
9 0 3 C 4 1 3 C
C320
1 0 3 R
C219
C315
U201
0 2 2 C 8 0 2 R
1 2 2 C 0 1 2 R
4 8 0 1 C
3 5 1 1 C
6 8 0 1 C
L1030
C1087
C1095
L1027
R1022
R1023
9 8 0 1 C
3 3 0 1 L
0 5 1 1 L
FL1009
L1151
R1178
C1104
C1114
C1113
R20
C48
R404
C400 FL400
3 0 4 C
4 N C
C1056
C207
C1094 U1003
2 2 0 1 L
C1077
R1027
4 0 6 R 3 0 6 R
7 0 3 C
C313 2 1 3 C
6 2 R
C336 C333
C335
9 0 2 R 8 0 2 C
0 0 2 X
3 6 1 1 C
0 1 2 C 5 0 2 C
2 7 0 1 C
C1071
C1068
L1017
7 6 0 1 C
5 5 0 1 C
3 7 0 1 C
R1019
3 0 0 1 L F
C1076 3 8 0 1 C
6 2 0 1 L
5 2 0 1 L
C1929
0 2 0 1 L C1078
5 7 0 1 C
C1154
0 1 1 1 C
2 L F
1 2 0 1 L
C1103
C1111
C1102
C1112
L1040
1 1 R
R405
R401
FL1013
1 C I
C
N
6
0
0
TP300
R211
C222
C340
6 1 0 1 R
C224
C1053
C1054
C1070
2 2 1 1 C
9 6 0 1 C 8 1 0 1 L
C13
L1120
C1081
C11
R14
0 1 3 C
6 0 3 C 6 0 6 C
C317
C318
R214
R220 TP200
C342
5 2 3 C
3 2 3 C
C338 C324
6 2 3 C
3 0 3 R
R212
C226
3 0 2 R
2 0 2 U
C225
0 8 0 1 C 9 1 0 1 L
C1062
C1061 C1162
C1049 5 1 0 1 C
L4000
C1123 2 4 0 1 L
L8
8 4 0 1 L
7 3 C
6 3 C
9 R
C1728
L10
C1128
FL1012
5 1 C
5 L
5 2 C
0 2 C
2 2 C
L1110
C12
1 4 0 1 L
7 1 1 1 C
0 1 0 1 L F
C1116
0 2 5 R
C625
8 0 3 C
R615
R618
C223
R19
C540
R202
C601
ZD1
C1065
C1066
C1032
9 1 5 R
C1031
8 1 5 R
R1021
8 R
L1035
R18
L1031
C1005
2 J
0 0 5 B F
9 0 5 R
D501
2 4 5 C
0 0 5 D
0 0 6 L F
2 0 6 L F
2 1 6 R
2 0 6 U
R616
C624
C623
R617
R614
R619
Q600
C328
C616
C617
D600
9 2 3 C
C4 R201
1 0 2 D
0 0 2 D
C607
3 0 5 U
1 4 5 C
L7
C1928
6 L
C1148
8 2 C
R24
0 1 R
0 1 C
R12
C14
L9 3 2 C
L2
C26
C24
FL1008
0 9 0 1 C
4 0 0 1 L
L11
R1004
3 0 0 1 C
9 0 0 1 C
5 0 0 1 R
C615
C537
5 2 0 1 R
7 0 0 1 U
C1029
C1028
C1030
C1018
C1013
C1027
C1007
FB502
C545
4 4 5 C
L504
D503
2 0 5 D
U502
7 0 5 R
C539
C543
C614
R515
C613
4 0 5 D
1 0 6 L F
R605
VA607
FB603 C608
4 0 0 1 U
C1097
3 9 0 1 C
6 3 0 1 L
8 2 0 1 L
8 9 0 1 C
C1121
L1045
9 9 0 1 C
0 3 0 1 R L1039
C602 R602
R600
0 0 6 C
R601
7 2 2 C
0 0 2 R 3 1 2 R
C1023
C1042
1 1 0 1 L
C1052
C1036
4 1 0 1 L
C1040
3 1 0 1 L 0 1 0 1 L
C1021
L1006
L1009
C1041
2 0 0 1 L F
C1039
2 0 0 1 U
ANT1002
L1044
FL1011
CN200
8 3 0 1 C 0 1 0 1 R
C104 6
2 2 0 1 C 8 8 0 1 C
3 3 0 1 C
1 5 0 1 C 7 4 0 1 C
C538
L12
1 9 0 1 C 4 3 0 1 L
7 2 1 1 C
FL1007 C1118
6 0 0 1 U
0 3 1 1 C
L1043
C1119
9 2 1 1 C
2 1 0 1 R 7 3 0 1 C
6 0 0 1 L F
8 1 0 1 R 3 B F
0 6 1 1 C
C1010
C1019
1 1 0 1 C
7 5 0 1 C
0 2 0 1 C
8 5 0 1 C
7 1 0 1 C
2 9 0 1 C
0 6 0 1 C
9 5 0 1 C
2 1 0 1 C
3 0 0 1 L
C1016
C1025
5 0 0 1 L
C1004
4 3 0 1 C
L1002
C1024
6 0 0 1 R
C1014
C1044
3 4 0 1 C
8 4 0 1 C
7 R
5 4 0 1 C
R15
6 1 R
R5 6 R
4 R
LG-P500h_MAIN_SPFY0233701-1.1_PLACE_BOT
J2 : 3.5pi Ear-Jack
- no Sound
CN600 : 3M Camera DOP Connector
- no Camera
U301 : Memory
- no Booting
CN601 : LCD Conn.
- no Display
U200 : DBB
- no Power On
- no Servive
U1007 : ChargePump
- no LCD backlight
X200 : 19.2Mhz X-tal
- no Power On
- no Service
U1001 : Transceiver
- no Service
- RF Sensitivity & TX Power
U1002 : FEM&GSM PAM
- no Service
- RF Sensitivity & TX Power
IC1 : MUIC
- no Booting
- no USB/Serial Connection
CN4 : I/O conn.
- no USB Connection.
- no Serial Connection.
CN2 : GPS,WIFI,Motor Connector
- no GPS/WiFi/Motor
CN1 : Touch Connector
- no touch sensing
IC500 : Audio AMP Sub System &
Signal Distributor
- no Sound
U500 : BT+FM Radio Module
- no BT Connection
- no FM Radio
U403 : PMIC
- no Booting
- no Power On
- no Service
U1003 : PAM
- no Service
- RF Sensitivity & TX Power
J1 : SIM Conn.
- No SIM
CN401 : Battery Conn.
- no power On
Q400 : Charging IC
- no Battery Charge
U1005 : PAM
- no Service
- RF Sensitivity & TX Power
- 169 -
9. PCB LAYOUT
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
R
7
0
3
V
A
7
0
2
4 0 7 R
5 0 7 A V
1 A V
2 A V
V
A
7
0
6
5 0 7 C
R
7
0
0
V
A
7
0
4
V
A
7
0
3
C
7
0
6
R
7
0
6
0 1 7 R
R
7
0
5
V
A
7
0
0
3 A V
4 A V
1 0 7 C
9 0 7 R
1 0 7 A V
7 0 7 R
B
A
T
1
LG-P500h_F_SUB_SPCY0242301-1.1_TOP
9. PCB LAYOUT
- 170 - LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LG-P500h_F_SUB_SPCY0242301-1.1_BOT
1 0 7 N C
0 0 7 S
0 0 7 B V
4 L
L
3
C
N
1
2 L
L
1
- 171 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
10. RF CALIBRATION
10. RF CALIBRATION
10.1 Confguration of Tachyon
10.1.1 Confguration of directory
LG-P500h/ LG-P500h
LG-P500h
LG-P500h
LG-P500h
LG-P500h
- 172 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. RF CALIBRATION
F o l d er D es c r i p ti o n
Tachyon Exe file and MFC dll, UI dll is present.
Common
Common dll files.
(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)
Config
Envirement files.
(Port configuration, Loss adjust)
Instrument Tester control dll.
Model
Model files is present.
(Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL
NAME(LGGW620, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, )
OCX Conponent files.
PhoneCmd Phone communication file
Report
Report Files is present.
(Cal data, test data)
F i l e D es c r i p ti o n
MODEL NAME_Calibration.XML
There are imformations to calibrate.
It consist of calibration items.
MODEL NAME_CallSetup.XML There are imformations to call.
MODEL NAME_NV.INI
It consists of default values.
It is written when cal&auto is begun.
MODEL NAME_Sequence.XML It is described a testing procedures.
10.1.2 Description of basic folders
10.1.3 Description of confguration fles
- 17 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
10.2 How to use Tachyon
10.2.1 Model selection
Follow the procedure before start calibration & auto test
a. Click the icon, in tool bar. Then, you can see the below screen.
b. Select Model LGP500h
10. RF CALIBRATION
- 174 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. RF CALIBRATION
c. Select the model : You should select LGP500h
d. Select the buyer (must be double clicked) Then, you can see PASS in Confg File Check.
e. Click select button
C
D
E
- 175 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
10.2.2 Start cal & auto
a. Click calibration & autotest button, in Tool bar.
b. Calibration & autotest will be executed in order.
1) Precede Action.
- NV write
- Test command send.
2) Calibration
) Auto test
4) After action
- Phone reset
- Change UE to AMSS

10. RF CALIBRATION
- 176 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. STAND ALONE TEST
11. STAND ALONE TEST
Hidden Menu Start
Start shortcut keys: 845#*500#
Hidden Menu List
Start the desired menu: Menu, click
Version Info
Classifed Information representation
Factory Reset
Format SD Card : SD Card Data reset
Factory Reset : Changing the Factory
Delete Userdata : Disabled
- 177 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. STAND ALONE TEST
Device Test List
Auto All Test :
-> Auto All Test menu click
-> Continuous information on the menu, giving you ability test
Auto All Test Result
Auto All Test Result
-> From the factory with the ability to view the results screen
Device Test List
Auto All Test : Device functionality testing at the factory to use
Auto All Test Result : Test Result
LCD Test : Display test(Color)
Proximity Test : Proximity Sensor
Vibrator Test : Vibrator test
Camera Test : Camera & Cam test
Sound Test : Sound test
RTC Test : Date/Time Setting
Touch Test : Display touch test
Motion Sensor test : Motion Sensor test
External Memory Test : SD Card Write test
Compass Test : Compass Test
GPS Test : GPS Test
IRT Test : N/A
- 178 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. STAND ALONE TEST
LCD Test List
Manual Test : Click on the following screen
Automatic Test : Automatically, without clicking
- White Display
- Black Display
- Red,Green, Blue, White Display
- Red,Green, Blue, White Display 2
Proximity Test
Phone contact with your fngers in the top of the sensor
determine the sensor response
- Away 1
- Near 0
Vibrator test
A case-by-state vibration tests
- 179 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. STAND ALONE TEST
Camera test
Menu features disabled
This feature is part of Auto All Test replaced by
-> Auto All Test
-> Camera test
-> Cam test
Sound test
Ring : Ringtone test
Efect Sound :
Message Tone :
Loop Back test : Mic & Speak loop Back test
Audio CAL Tool : Setting
-> Ring menyujung Enabled
RTC test
Date & time : setting
- 180 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. STAND ALONE TEST
Touch test
Finger Print : Free mode test
Grid Touch Test : Block mode on touch point mode test
Touch Key Test : key test
Grid Touch Color Change
Block Touch Test
Motion Sensor test
Motion Sensor test
-> 4 Check the operation of the sensor in the direction of lean
External Memory Test
SD Card test
-> Write a test check of the SD Card memory
- 181 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. STAND ALONE TEST
Key / Compass Test
SD Card : Check Recognition
SIM Card : Check Recognition
Up/Down key : Check Recognition
End Call key : Check Recognition
Menu key : Check Recognition
Home key : Check Recognition
Back key : Check Recognition
Search key : Check Recognition
Compass test
GPS Test
GPS test : GPS check recognition

ELT Test
Automatic Mode
Manual Mode :
- 182 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. STAND ALONE TEST
ELT Test
Automatic Mode : LCD Automatic on/of test
-> time setting
ELT Manual Test
LCD Backlight
Ringtone
Vibrator
Camera
Audio Loopback
-> test on the device is working
(The ability to use plant)
- 183 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
SMJY00
ACGM01
MTAD00
SPKY01
ADCA00
SPKY00
EBP00
ABFZ01
ACGM00
GMEY00
SBPL00
ACQ00
EAA00
MBFZ00
GMZZ00
SUSY00 SJMY00
EBR00
ACKA00
SUMY00
EBR01
MBJZ01
MBJZ00
SVLM00 ABFZ00
AKAC00
Description
Bracket Assembly
Motor,DC
PCB Assembly,Flexible
Speaker Module
Cover Assembly,Rear
Antenna,PIFA
Touch Window Assembly
Keypad Assembly,Main
LCD,Module-TFT
Cover Assembly,Front
Tape,Window
Button
Button
Bracket Assembly
PCB Assembly,Main
Can Assembly,Shield
Dome Assembly,Metal
PCB,Sidekey
Camera Module
PCB,Sidekey
Microphone,Condenser
Screw,Machine
SCREW MACHINE
Bracket
Rechargeable Battery,Lithium Ion
Cover Assembly,Battery
Location
ABFZ01
SJMY00
EBR00
SUSY00
ACGM00
EAA00
SMZY00
AKAC00
SVLM00
ACGM01
MTAD00
MBJZ00
MBJZ01
ABFZ00
EBR01
ACKA00
ADCA00
SPKY00
EBP00
SPKY01
SUMY00
GMEY00
GMZZ00
MBFZ00
SBPL00
ACQ00
- 184 - LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 185 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
Level
Location
No.
Description Part Number Spec Remark
1 AGQ000000 Phone Assembly - AGQ86291501 LGP500H.AVIVBK BK:Black -
2 ACQ100400 Cover Assembly,EMS - ACQ85324601 LGP500H.AVIVBK BK:Black -
3 ABFZ01 Bracket Assembly - ABFZ0027801 LG-P500 ORF ZZ:Without Color -
3 ACGM00 Cover Assembly,Rear - ACGM0169610 LG-P500H SS:SHINE SILVER -
4 MDJ000000 Filter MFBZ0024401 COMPLEX LG-P500 ZZ:Without Color FILTER, MIC_REAR
4 MEG000000 Holder MHGZ0035901
COMPLEX LG-P500 ORF ZZ:Without Color MOLD, Silicone
Rubber K-770, , , , ,
4 MCQ000000 Damper MPBZ0318301 COMPLEX LG-P500 ZZ:Without Color PAD, CAMERA
4 MCQ000002 Damper MPBZ0318501 COMPLEX LG-P500 ZZ:Without Color PAD, MOTOR
4 MCQ000001 Damper MPBZ0326101 COMPLEX LG-P500 ZZ:Without Color PAD, CONN_LCD
4 MJN061100 Tape,Protect MTAB0447002
COMPLEX LG-P500 BL:Blue TAPE,
PROTECTION_REAR_B_2
4 MCR000000 Decor MDAY0085204 COMPLEX LG-P500 ORF BK:Black 3.2 Mega Pixels Printed
4 MCK063300 Cover,Rear MCJN0126901
COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PC
LUPOY GP-2102, , , , ,
4 MBK070300 Can,Shield MCBA0085901 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,STS,
4 MJN061101 Tape,Protect MTAB0447102
COMPLEX LG-P500 BL:Blue TAPE,
PROTECTION_REAR_C_2
4 MKC009400 Window,Camera MWAE0064901
COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,
(empty), , , , ,
4 MJN000000 Tape MTAZ0353001 COMPLEX LG-P500 ZZ:Without Color TAPE, MIC
4 MJN089300 Tape,Window MTAD0133101
COMPLEX LG-P500 ZZ:Without Color TAPE,
WINDOW_CAMERA
3 ACQ003400 Cover Assembly,Bar - ACGV0021801 LG-P500 ORF BK:Black -
4 AKAC00 Keypad Assembly,Main AKAC0018601 LG-P500 ORF ZZ:Without Color -
4 ACGM01 Cover Assembly,Front - ACGK0170701 LG-P500 ORF ZZ:Without Color -
5 MEG000000 Holder MHGZ0036001
COMPLEX LG-P500 ORF ZZ:Without Color MOLD, Silicone
Rubber K-770, , , , ,
5 MCQ043300 Damper,LCD MPBG0118401 COMPLEX LG-P500 ZZ:Without Color PAD, LCD
5 MJN061100 Tape,Protect MTAB0451701
COMPLEX LG-P500 ZZ:Without Color TAPE,
PROTECTION_VOL
5 MJN061101 Tape,Protect MTAB0451901
COMPLEX LG-P500 ZZ:Without Color TAPE,
PROTECTION_PWR
5 MTAD00 Tape,Window MTAD0134201 COMPLEX LG-P500 ZZ:Without Color TAPE, MAIN_WINDOW
12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Mechanic component>
- 186 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
5 MBJZ00 Button MBJZ0041201
COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PC
LUPOY SC-1004A, , , , ,
5 MBJZ01 Button MBJZ0041301
COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PC
LUPOY SC-1004A, , , , ,
5 MCK032700 Cover,Front - MCJK0134701
COMPLEX LG-P500 ORF BK:Black MOLD, PC LUPOY SC-
2302, , , , ,
6 MFEZ00 Frame MFEZ0037101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,
6 MICE001 INSERT,NUT MICE0016901 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,
6 MICE00 INSERT,NUT MICE0016909 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,
5 MCR000000 Decor MDAY0086601
COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,
(empty), , , , ,
5 MDJ000000 Filter MFBZ0024201 COMPLEX LG-P500 ZZ:Without Color FILTER_SPEAKER
5 MDS000000 Gasket MGAZ0109001 COMPLEX LG-P500 ZZ:Without Color Gasket_ESD
5 MJN000000 Tape MTAZ0353301
COMPLEX LG-P500 ZZ:Without Color TAPE,
RUBBER_PROXIMITY
4 MHK000000 Sheet MSAZ0074801 COMPLEX LG-P500 ZZ:Without Color SHEET_LCD_COG
4 MJN061100 Tape,Protect MTAB0447401
COMPLEX LG-P500 ZZ:Without Color TAPE,
PROTECTION_BAR
4 MJN061102 Tape,Protect MTAB0450301
COMPLEX LG-P500 ZZ:Without Color TAPE,
PROTECTION_WINDOW
4 MJN061101 Tape,Protect MTAB0447201
COMPLEX LG-P500 ZZ:Without Color TAPE,
PROTECTION_KEYPAD
4 ABFZ00 Bracket Assembly - ABFZ0026601 LG-P500 ORF ZZ:Without Color -
5 MJN000001 Tape MJN67672601 COMPLEX LG-P500 ZZ:Without Color TAPE, BRACKET_SIDE
5 MBFZ00 Bracket MBFZ0053801 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,
5 MTAZ00 Tape MTAZ0353101 COMPLEX LG-P500 ZZ:Without Color TAPE, BRACKET_LCD
5 ACKA00 Can Assembly,Shield - ACKA0032401 LG-P500 ORF ZZ:Without Color -
6 MEZ000900 Label,After Service MLAB0006701
COMPLEX GS505 TMO ZZ:Without Color COMPLEX, (empty),
, , , ,
6 MCQ000000 Damper MCQ66465901 COMPLEX LG-P500 ZZ:Without Color PAD, CAN_SHIELD
6 MCBA00 Can,Shield MCBA0089101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,
6 MTAZ01 Tape MTAZ0347201 COMPLEX LG-P500 ZZ:Without Color TAPE, CAMERA_BACK
6 MTAZ00 Tape MTAZ0366501 COMPLEX LG-P500 ZZ:Without Color TAPE, CAMERA_SIDE
5 ADCA00 Dome Assembly,Metal ADCA0117901 LG-P500 ORF ZZ:Without Color -
5 MDJ000000 Filter MFBZ0031701
COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,
(empty), , , , ,
6 SC2 Can Assembly,Shield - ABM73436401 LGP500.AORFZY ZZ:Without Color -
- 187 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
7 MDQ000000 Frame MFEZ0045301 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,Ni,
7 MBK070300 Can,Shield MCBA0103101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,Ni,
5 MEZ000000 LABEL MLAZ0038301 LG-VX6000 SV,ZZ,PID Label 4 Array
3 GMEY00 Screw,Machine GMEY0013901
BH + 1.4mM 4mM MSWR FZB N - ARIMA
COMMUNICATIONS CORP.
3 GMZZ00 SCREW MACHINE GMZZ0019003
111111,3.5 mm,1.5 mm,MSWR3 ,N ,+ ,- ,NYLOK Coating
(ZnB-BLACK)
3 MBFZ00 Bracket MBFZ0059701
COMPLEX LG-VS660 VRZ ZZ:Without Color PRESS, STS, , , ,
,
2 MEZ002100 LABEL,APPROVAL MLAA0062320 GU280 OREBK BK,ZZ,COMPLEX, (empty), , , , ,
1 AGF000000 Package Assembly APAY0151823
LGP500H.AVIVBK ZZ:Without Color LGP500H VIV Brazil
Packing
1 AAD000000 Addition Assembly - AAD85597901 LGP500H.AVIVBK BK:Black -
2 ACQ00 Cover Assembly,Battery - ACQ85319907 LGP500.AORFZY BK:Black -
3 MCK004100 Cover,Battery MCJA0119607 COMPLEX LG-P509 BK:Black MOLD,PC LUPOY SC-1004A,
3 MJN061100 Tape,Protect MTAB0448101
COMPLEX LG-P500 ZZ:Without Color
TAPE_GUIDE_COVER_BATTERY
2 AFN053800
Manual
Assembly,Operation
- AFN75252824
LGP500H.AVIVBK ZZ:Without Color LGP500H manual assy for
VIV
3 MBM062600 Card,Quick Reference MBM63198501
COMPLEX LGP500H.AVIVBK ZZ:Without Color Brazil Leaflet
for LGP500H
- 188 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
Level
Location
No.
Description Part Number Spec Remark
2 EAN011400
IC,Memory Card,
MICRO SD
EAN61826701
MMAGR02GUECA-2MBTN 2GBYTE 2.7VTO3.6V MICRO SD
CARD 15.0x11.0x1.0MM TR 8P MicroSD Card 2GB
SAMSUNG ELECTRONICS CO., LTD.
4 SJMY00 Motor,DC SJMY0007116
WHVM-1030Q10 2 V,65 mA,10 *3.0T,3V, WOOSUNG G&T
CO.,LTD
4 EBR00 PCB Assembly,Flexible - EBR72701001 LG-P500 FLEXIBLE 1.0
5 SACE00
PCB Assembly,
Flexible,SMT
- EBR72700601 LGP500.AORFBK FLEXIBLE 1.0
6 SACC00
PCB Assembly,
Flexible,SMT Bottom
- EBR72700701 LGP500.AORFBK FLEXIBLE 1.0
7 L1,L3 Inductor,Multilayer,Chip ELCH0001032
HK1005 18NJ-T 18NH 5% 0V 8A 3.1GOHM 350mHZ 300m
NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD
7 CN1 Connector,BtoB ENBY0034101
GB042-24P-H10-E3000 24P 0.40MM STRAIGHT PLUG SMD
R/TP 1M - LS Mtron Ltd.
7 L2,L4 Inductor,Multilayer,Chip ELCH0001417
LL1005-FHL33NJ 33NH 5% 0V 200mA 1OHM 1.7GHZ 10
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
7 S700 Socket,Card ENSY0023802
SCHB1B0201 Micro-SD 8P ANGLE SMD R/TP - ALPS
ELECTRIC KOREA CO.,LTD.
6 SACD00
PCB Assembly,
Flexible,SMT Top
- EBR72700801 LGP500.AORFBK FLEXIBLE 1.0
7 EAX010700 PCB,Flexible SPCY0242301
SPCY0242301 POLYI Multi - 0.25 LG-P500
OREBK,FLEXIBLE,F,POLYI,0.25 mm,MULTI-3 LG
Innotek.com
7
VA1,VA2,
VA3,VA4,
VA700,
VA701,
VA702,
VA703,
VA704,
VA705,
VA706
Varistor SEVY0004301
ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE SMD
R/TP INNOCHIPS TECHNOLOGY
7 BAT1 Module,Assembly SMZY0026701
EECEP0F333YD GM750 SFRTN Backup
Capacitor,0.03F,3.8pi,Module Assembly PANASONIC
INDUSTRIAL KOREA CO., LTD
7
R703,R704,
R705,R706,
R707
Resistor,Chip ERHZ0000486
MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
7 C706 Capacitor,Ceramic,Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005
R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
7 R700,R710 Resistor,Chip ERHZ0000445
MCR01MZP5J224 220KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Main component>
- 189 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
7 C701 Capacitor,Ceramic,Chip ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005
R/TP - TDK KOREA COOPERATION
7 C705 Capacitor,Ceramic,Chip ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP
- MURATA MANUFACTURING CO.,LTD.
7 R709 Resistor,Chip ERHY0000241
MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
4 SUSY00 Speaker Module SUSY0028914
ISDT-181230-08W-04 ASSY,8 ohm,91 dB,1812
mm,3.0T,20mm,WIRE GoerTek Inc.
4 EAA010400 Antenna,Helical SNMF0066301 HIR-02A16-0000AA DUAL -5DB 50OHM 5 E.M.W CO., LTD.
4 EAA00 Antenna,PIFA EAA62385801 HIR-02A62-0000AA MULTI -5DB 3:1 E.M.W CO., LTD.
4 SMZY00 Touch Window Assembly SMZY0029602
TSMC-P304A Captive TSM Assembly,3.2" ,; ,Module Assembly
LG INNOTEK.,LTD.
4 SVLM00 LCD,Module-TFT SVLM0041401
TX08D42VM0BAA
Main,3.2,HVGA,49.52x77.83x1.9t,16.7M,TFT,TM,S6D05A1(Sa
msung),Bending Type, HITACHI DISPLAYS.,LTD
3 EBR01 PCB Assembly,Main - EBR72673401 LG-P500h MAIN 1.0
4 EBR071500
PCB
Assembly,Main,Insert
- EBR72701401 LG-P500 MAIN 1.0
5 SPKY00 PCB,Sidekey SPKY0093201
SPKY0093201 POLYI Double DOUBLE 0.15 LG-P500
TMO,SIDEKEY,E,POLYI,0.15 mm,DOUBLE LG Innotek.com
5 EBP00 Camera Module EBP61301801
C3AA-Y314C C3AA-Y314C 3M AF, Sony(1/5"), 8.5x8.5x5.4t,
FPCB 3.5mm, 90degree LG INNOTEK CO., LTD
5 SPKY01 PCB,Sidekey SPKY0093401
SPKY0093401 POLYI Double DOUBLE 0.15 LG-P500
TMO,SIDEKEY,E,POLYI,0.15 mm,DOUBLE LG Innotek.com
4 EBR071800
PCB Assembly,
Main,SMT
- EBR72673501 LG-P500h MAIN 1.0
5 SAD010000 Software,Mobile SAD32751001 V10a - CENTRAL AND SOUTH AMERICA QCT -
5 EBR071700
PCB Assembly,
Main,SMT Top
- EBR72673601 LG-P500h MAIN 1.0
6 EAX010000 PCB,Main SPFY0233701
SPFY0233701 FR-4 - LX-BUMP 10 0.8 LG-P500
TMO,MAIN,F,FR-4,0.8 mm,LX-BUMP 10 UNITECH PRINTED
CIRCUIT BOARD CORP.
6 SUMY00 Microphone,Condenser SUMY0010610
SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42
dB,4.72*3.76*1.25,mems TDMA Improve KNOWLES
ACOUSTICS
6 C1931 Capacitor,Ceramic,Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005
R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C202,C708 Capacitor,Ceramic,Chip ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO.,LTD.
6 R1169 Resistor,Chip ERHZ0000287
MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
- 190 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6
R1172,
R1173,
R1174,
R1175
Resistor,Chip ERHZ0000434
MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
LD1,LD2,
LD3,LD4
LED,Chip EDLH0014803
SSC-WH107 WHITE 2.7~3.1 20mA 100~230mcd x, y 64mW
1608 R/TP 2P - SEOUL SEMICONDUCTOR CO.,LTD
6 R701,R702 Resistor,Chip ERHY0000254
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
FB700,
FB701
Filter,Bead SFBH0008102
BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P
MURATA MANUFACTURING CO.,LTD.
6 U700 IC,Proximity EUSY0376201
GP2AP002S00F GP2AP002S00F,8,R/TP SHARP
CORPORATION.
6 R700,R703 Resistor,Chip ERHZ0000402
MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C705 Capacitor,Ceramic,Chip ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608
R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
VA611,
VA612,
VA613,
VA614
Varistor SEVY0008101
EVLC5S01033 EVLC5S01033,5.5 V, ,SMD ,0603 AMOTECH
CO., LTD.
6 C706 Capacitor,Ceramic,Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005
R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 Q601 FET EQFP0004501
SI1305-E3 P-CHANNEL MOSFET -8V +-8 -0.92A 0.28OHM
340mW SOT323 R/TP 9P VISHAY INTERTECHNOLOGY
ASIA PTE LTD
6 VA615 Varistor SEVY0007902
ICVS0305500FR ICVS0305500FR,5.6 V,M ,SMD ,0603 SIZE
INNOCHIPS TECHNOLOGY
6 C203 Capacitor,TA,Conformal ECTH0001903
F980J226MMA 22 uF,6.3V,M,L_ESR,1608,R/TP NICHICON
CORPORATION, EAST JAPAN SALES OFFICE
6 C705 Capacitor,Ceramic,Chip ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP
- MURATA MANUFACTURING CO.,LTD.
6 R1168 Resistor,Chip ERHZ0000407
MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C201 Capacitor,Ceramic,Chip ECCH0000122
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP -
ROHM Semiconductor KOREA CORPORATION
5 EBR071600
PCB Assembly,
Main,SMT Bottom
- EBR72673701 LG-P500h MAIN 1.0
6 C1079 Capacitor,Ceramic,Chip ECZH0000846
C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 C1007 Capacitor,Ceramic,Chip ECZH0000841
C1005C0G1H560JT000F 56pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 FL1009 Filter,Saw SFSY0034701
SAFEA1G88KB7F00 1880 1.4*1.1*0.5 SMD R/TP 5P
MURATA MANUFACTURING CO.,LTD.
6 FL1012 Filter,Saw SFSY0034601
SAFEB1G96FL0F00 1960 1.4*1.1*0.6 SMD R/TP 5P
MURATA MANUFACTURING CO.,LTD.
- 191 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6 FL1 Filter,Saw SFSY0030001
SAFEB881MFM0F00 881.5 1.4X1.1X0.6 SMD R/TP 5P
MURATA MANUFACTURING CO.,LTD.
6 FL1005 Filter,Saw SFSY0029901
SAFEB836MAL0F00 836.5 1.4X1.1X0.6 SMD R/TP 5P
MURATA MANUFACTURING CO.,LTD.
6
FL600,
FL601,
FL602
Filter,EMI/Power SFEY0011401
ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD R/TP
INNOCHIPS TECHNOLOGY
6 FL2 Filter,Duplexer,DCN SDDY0005201
SAYFP836MAJ0F00 881500000 869 to 894 836500000 824 to
849 2.4 1.8 2.5x2.0x0.55 DUAL SMD R/TP - MURATA
MANUFACTURING CO.,LTD.
6 U503 IC,Acceleration Sensor EUSY0408701
KR3DH NONE NONE LGA R/TP 16P - ST
MICROELECTRONICS ASIA PACIFIC PTE LTD.
6
C1122,
C36,C37
Capacitor,Ceramic,Chip ECCH0000701
C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK CORPORATION
6 C26 Capacitor,Ceramic,Chip ECCH0000175
GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 -55TO+125C 1005
R/TP - MURATA MANUFACTURING CO.,LTD.
6 FL1010 Filter,Duplexer,PCS SDPY0004701
ACMD-7407 ACMD-7407,1880 MHz,1960 MHz,2.8 dB,3.2
dB,55 dB,50 dB,2.5*2.0*0.95,SMD,FBAR,Band2 Rx unbal.
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED
6 R416 Resistor,Chip ERHZ0000537
MCR01MZP5F6803 680KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 L1040 Inductor,Multilayer,Chip ELCH0003828
LQG15HS2N4S02D 2.4NH 0.3NH 0V 300mA 0.15OHM 6GHZ
8 NON SHIELD 1 1X0.5X0.5MM R/TP MURATA
MANUFACTURING CO.,LTD.
6
C1111,
C1112
Capacitor,Ceramic,Chip ECZH0000822
C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 U1003 IC,Power Amplifier SMPY0021701
SKY77197 28.25 dBm,40 %,A,-36 dBc,27
dB,4x5x0.85,SMD,3G Dual PAM Band 1+5 w/
coupler,LGA,R/TP,14, SKYWORKS SOLUTIONS INC.
6 U1005 IC,Power Amplifier SMPY0022801
SKY77702-12 28.6 dBm,36 %,10 mA,-34 dBc,27
dB,3.0*3.0*1.0,SMD,USPCS,WBNAD 2,CPL,3
MODE,3.2V~4.2V,-35dBc at 28.6dBm
2nd,28.6dBm,595mA,1,SMD,R/TP,10 SKYWORKS
SOLUTIONS INC.
6 L5 Inductor,Multilayer,Chip ELCH0001034
HK1005 3N3S-T 3.3NH 0.3NH 0V 8A 8GOHM 100mHZ 300m
NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD
6 L1130 Inductor,Multilayer,Chip ELCH0001052
1005GC2T18NJLF 18NH 5% 0V 200mA 0.65OHM 1.6GHZ 8
NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6
L1042,
L1048
Inductor,Multilayer,Chip ELCH0001054
1005GC2T5N6SLF 5.6NH 0.3NH 0V 300mA 0.27OHM 3.2GHZ
8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6 L7 Inductor,Multilayer,Chip ELCH0001403
LL1005-FHL1N0S 1NH 0.3NH 0V 500mA 0.1OHM 20GHZ 8
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6
L1025,
L1041
Inductor,Multilayer,Chip ELCH0001404
LL1005-FHL1N5S_ 1.5NH 0.3NH 0V 500mA 0.13OHM 12GHZ
8 NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
- 192 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6
C1084,
L1151
Inductor,Multilayer,Chip ELCH0003820
LQG15HS3N0S02D 3NH 0.3NH 0V 300mA 0.17OHM 6GHZ 8
NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATA
MANUFACTURING CO.,LTD.
6 C1009 Inductor,Multilayer,Chip ELCH0004705
1005GC2T8N2J00 8.2NH 5% 0V 250mA 0.37OHM 2.8GHZ 8
NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6 C1110 Resistor,Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP - ROHM.
6 R427 Resistor,Chip ERHZ0000284
MCR01MZP5F4303 430KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 FB2,FB3 Resistor,Chip ERHZ0000401
MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C14 Capacitor,Ceramic,Chip ECCH0000117
CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005
R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R611 Resistor,Chip ERHZ0000530 MCR01MZP5J512 5.1KOHM 5% 1/16W 1005 R/TP - ROHM.
6 R1030,R18 Resistor,Chip ERHY0000137
MCR01MZP5F2702 27KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C1130,C20,
C208,C309,
C316,C318,
C320,C331,
C336,C340,
C408,C440,
C48,C625,C
704
Capacitor,Ceramic,Chip ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6
R201,R203,
R213,R408,
R520,R521
Resistor,Chip ERHZ0000405
MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C1005,
C1014,
C1017,
C1020,
C1021,
C1022,
C1039,
C1041,
C1071,
C1072,
C1083,
C1087,
C1103,
C1108,
C1118,
C1121,
C1153,
C225,C412,
C538,C544,
C608,C618,
C619,C621,
C622,C700,
C702,C703,
R24
Capacitor,Ceramic,Chip ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
- 19 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6 C202,C708 Capacitor,Ceramic,Chip ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO.,LTD.
6
L1018,
L1019
Inductor,Multilayer,Chip ELCH0001412
LL1005-FHL1N8S 1.8NH 0.3NH 0V 500mA 0.14OHM 12GHZ
8 NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6 R600,R601 Resistor,Chip ERHZ0000485
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R205,R215,
R217,R218
Resistor,Chip ERHY0009503
MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C1013,
C1015
Capacitor,Ceramic,Chip ECCH0009106
C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C 0603
R/TP - TDK CORPORATION
6
D400,D500,
D501,D502,
D503,D504,
ZD1
Diode,TVS EDTY0010101
ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300
mW,R/TP,15pF SCG HONG KONG SAR LTD.
6 C1107 Capacitor,Ceramic,Chip ECCH0001001
C1005C0G1H6R8CT000F 6.8pF 0.5PF 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 L1022 Inductor,Multilayer,Chip ELCH0001048
1005GC2T10NJLF 10NH 5% 0V 250mA 0.42OHM 2.5GHZ 8
NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6 U500 Module,WLAN SMZY0024901
LBEH19UNBC-338 2.3VTO5.5V LGA 54P 9.0x7.8x1.3MM
MURATA MANUFACTURING CO.,LTD.
6 C201 Capacitor,Ceramic,Chip ECCH0000122
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP -
ROHM Semiconductor KOREA CORPORATION
6 C705 Capacitor,Ceramic,Chip ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP
- MURATA MANUFACTURING CO.,LTD.
6
R1016,
R1017
Filter,Bead SFBH0007102
BLM15AG100PN1 10ohm 1.0x0.5x0.55 SMD R/TP 2P
MURATA MANUFACTURING CO.,LTD.
6 C1931 Capacitor,Ceramic,Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005
R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
R1006,
R1170,
R1171,
R204,R401,
R417,R418,
R507,R518,
R519,R603,
R604
Resistor,Chip ERHZ0000443
MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 R415 Resistor,Chip ERHZ0000203
MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C1076,
C207,C210,
C221
Capacitor,Ceramic,Chip ECCH0000137
C1005X7R1H331KT000F 0.33nF 10% 50V X7R -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6
C1069,
C1080
Capacitor,Ceramic,Chip ECCH0000195
GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO.,LTD.
6 R701,R702 Resistor,Chip ERHY0000254
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
- 194 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6 FL1007 Filter,Saw SFSY0027101 B7742 - - - - 5P EPCOS PTE LTD.
6
C1065,
C1068,
C1094,
C1095,
C1096,
C1113,
C1114,
C1115,
C1929
Capacitor,Ceramic,Chip ECCH0009103
C0603C0G1H101JT00NN 100pF 5% 50V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
6
R1176,
R1177
Resistor,Chip ERHZ0000206
MCR01MZP5F10R0 10OHM 0.1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 U601 IC,TTL EUSY0391601
NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P - SCG
HONG KONG SAR LTD.
6 R1005 Capacitor,Ceramic,Chip ECZH0000802
C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
6 R1023 Resistor,Chip ERHZ0000428
MCR01MZP5J180 18OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C1028,
C1030,
C1032,
C1034,
C1038,
C1049,
C1053,
C1055,
C1057,
C1058,
C1059,
C1060,
C1061,
C1062,
C1063,
C1066,
C1067,
C224,C30,
C31,C32
Capacitor,Ceramic,Chip ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C
0603 R/TP - TDK CORPORATION
6 C705 Capacitor,Ceramic,Chip ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608
R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 L1
Inductor,Wire
Wound,Chip
ELCP0012101
CIG21L3R3MNE 0H 20% - 800mA 0.22OHM - - SHIELD
2X1.25X1MM NONE - SAMSUNG ELECTRO-MECHANICS
CO., LTD.
6 C204 Capacitor,Ceramic,Chip ECCH0000147
MCH155CN222KK 2.2nF 10% 50V X7R -55TO+125C 1005
R/TP - ROHM.
6
C1011,
C1012,
C11,C1129,
C12,C13,
L1015,
L1039,L12
Capacitor,Ceramic,Chip ECZH0000813
C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C 1005
R/TP - TDK KOREA COOPERATION
6 R502,R503 Resistor,Chip ERHZ0000435
MCR01MZP5J200 20OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
- 195 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6
C33,C34,
C606
Capacitor,Ceramic,Chip ECCH0006201
C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C
1608 R/TP - TDK CORPORATION
6 C1046 Capacitor,Ceramic,Chip ECZH0025916
GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO.,LTD.
6 R1018 Resistor,Chip ERHY0009555
MCR006YZPF1202 12KOHM 1% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 D402 Diode,Switching EDSY0011901
SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2 R/TP
2P 1 AUK CORP
6
R210,R220,
R300,R302,
R612,R619
Resistor,Chip ERHZ0000204
MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C1018,
C1037,
C1045,
C1047,
C1048,
C1051,
C414,
C535
Capacitor,Ceramic,Chip ECZH0025920
GRM033R71C102K 1nF 10% 16V X7R -55TO+125C 1608
R/TP - MURATA MANUFACTURING CO.,LTD.
6 C537 Capacitor,TA,Conformal ECTH0004801 TCM0J106M8R 10 uF,6.3V,M,STD,1608,R/TP ROHM.
6
VA611,
VA612,
VA613,
VA614
Varistor SEVY0008101
EVLC5S01033 EVLC5S01033,5.5 V, ,SMD ,0603 AMOTECH
CO., LTD.
6
C1,C1075,
C1104,
C205,C317,
C319,C324,
C328,C332,
C337,C342,
C425,C426,
C429,C430,
C431,C432,
C437
Capacitor,Ceramic,Chip ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005 R/TP
- ROHM Semiconductor KOREA CORPORATION
6
R202,R216,
R219,R414,
R425,R615,
R618
Resistor,Chip ERHY0003201 MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP - ROHM.
6 U1007 IC,Sub PMIC EUSY0378001
AAT2862 AAT2862,TQFN34,24,R/TP,3x4x0.8 Advanced
Analogic Technologies HK Limited
6 C7 Capacitor,Ceramic,Chip ECCH0000109
MCH155A080DK 8pF 0.25PF 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 CN600 Connector,BtoB ENBY0040301
GB042-34S-H10-E3000 34P 0.4MM STRAIGHT SOCKET
SMD R/TP 1M - LS Mtron Ltd.
6
R25,R610,
R613
Resistor,Chip ERHY0009541
MCR006YZPF4700 470OHM 1% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C701 Capacitor,Ceramic,Chip ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005
R/TP - TDK KOREA COOPERATION
- 196 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6
C4,C433,
C434,C435,
C436,C5
Capacitor,Ceramic,Chip ECCH0007802
CV105X5R475M10AT 4.7uF 20% 10V X5R -55TO+85C 1608
R/TP - KYOCERA CORP.
6 U200
IC,Digital Baseband
Processor,3G
EUSY0392302
MSM7227 0VTO0V 0W BGA R/TP 560P - QUALCOMM
INCORPORATED.
6 C10,L1036 Inductor,Multilayer,Chip ELCH0004709
1005GC2T3N3S00 3.3NH 0.3NH 0V 300mA 0.19OHM 4.5GHZ
8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6
D200,D201,
D401,D404
Diode,Switching EDSY0010501
KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESC R/TP 2P
1 KEC CORPORAITION
6 IC1 IC,Analog Multiplexer EUSY0372001
TS5USBA33402YZPR TS5USBA33402,WCSP,20,R/TP,MUIC
TEXAS INSTRUMENTS KOREA LTD, HONGKONG BRANCH.
6 FL1003 Filter,Saw SFSY0028201
SAFEB2G14FB0F00 - - - - 2P MURATA MANUFACTURING
CO.,LTD.
6
R1025,
R509,R515
Resistor,Chip ERHZ0000348
MCR01MZP5F12R0 12OHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 R15,R16 Resistor,Chip ERHZ0000517
MCR01MZP5J910 91 ohm,1/16W,J,1005,R/TP ROHM
Semiconductor KOREA CORPORATION
6
R1,R26,
R29,R301,
R303,R304
Wire Pad,Short SAFP0000501 LG-VS760 VRZ
6
FB600,
FB602,
FB603
Filter,Bead SFBH0009901
HB-1M1005-121JT 120 1.0x0.5x0.5MM SMD R/TP 2P
CERATECH CORPORATION
6 U1002 RF Module SMRH0006201
SKY77544 MHz,MHz,POLA EDGE QUAD TX
MODULE,SP9T,6.0*6.0*1.0,28p, SKYWORKS SOLUTIONS
INC.
6 C1088 Capacitor,Ceramic,Chip ECCH0000112
MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP -
ROHM Semiconductor KOREA CORPORATION
6 C1024,C502 Capacitor,Ceramic,Chip ECCH0000120
MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP -
ROHM Semiconductor KOREA CORPORATION
6 FL400 Filter,EMI/Power SFEY0015301
NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP
MURATA MANUFACTURING CO.,LTD.
6 L401,L402
Inductor,Wire
Wound,Chip
ELCP0008005
CPI2520LZ4R7ME 4.7UH 20% 0V 900mA 0.3OHM 0HZ 0
SHIELD 2.5X2X1MM NONE R/TP SAMWHA CAPACITOR
CO, LTD.
6
C1050,
C1077,
C1163,
C18,C19
Capacitor,Ceramic,Chip ECCH0005604
GRM188R60J106M 10000000
pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA
MANUFACTURING CO.,LTD.
6 C1106,L2 Inductor,Multilayer,Chip ELCH0003838
LQG15HS8N2J02 8.2NH 5% - 300mA 0.24OHM 3.7KHZ 8
SHIELD 1 1.0X0.5X0.55MM R/TP MURATA
MANUFACTURING CO.,LTD.
6 R411,R412 Resistor,Chip ERHZ0000420
MCR01MZP5J151 150OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 U202 IC,TTL EUSY0408201
74LVC1G79GM 1.65~5.5V - D FLIP-FLOP SOT R/TP 6P -
STC CORP.
- 197 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6 J2 Jack,Phone ENJE0007601
KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P - KSD
CO., LTD
6 R605 Resistor,Chip ERHZ0000410
MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
FB700,
FB701
Filter,Bead SFBH0008102
BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P
MURATA MANUFACTURING CO.,LTD.
6 U301 IC,MCP,NAND EUSY0426801
MT29C4G96MAZAPCJA-5 IT FBGA ,137 ,ETC
,4G(LB/256Mx16)
NAND+4G(DDR400/16Mx4x32*2_2CS_2CKE) SDRAM ,;
,IC,MCP MICRON SEMICONDUCTOR ASIA PTE LTD.
6
R10,R1015,
R14,R19,
R8
PCB ASSY,MAIN,
PAD SHORT
SAFP0000401 LG-LU3000 LGTBK,MAIN,A,
6 R200 Resistor,Chip ERHZ0000490
MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 CN2,CN601 Connector,BtoB ENBY0034201
GB042-24S-H10-E3000 24P 0.40MM STRAIGHT SOCKET
SMD R/TP 1M - LS Mtron Ltd.
6
C1078,
C22,C24,
C25,C402,
C403
Capacitor,Ceramic,Chip ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005 R/TP -
ROHM Semiconductor KOREA CORPORATION
6 C1089 Capacitor,Ceramic,Chip ECCH0000180
GRM1555C1H3R3C 3.3pF 0.25PF 50V NP0 -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO.,LTD.
6 L1008 Inductor,Multilayer,Chip ELCH0004717
1005GC2T82NJ00 89NH 5% 0V 150mA 2.1OHM 700MHZ 8
NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6
C1027,
C1029,
C1031,
C1033,
C1064
Capacitor,Ceramic,Chip ECCH0009216
GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO.,LTD.
6 R403,R404 Resistor,Chip ERHZ0000437
MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
R1027,
R214
Resistor,Chip ERHY0000104
MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C1010,
C1019
Capacitor,Ceramic,Chip ECCH0009206
GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO.,LTD.
6 L10 Inductor,Multilayer,Chip ELCH0003832
LQG15HS2N2S02 2.2NH 0.3NH - 300mA 0.12OHM 6KHZ 8
SHIELD 1 1.0X0.5X0.55MM R/TP MURATA
MANUFACTURING CO.,LTD.
6 U501
IC,LDO Voltage
Regulator
EUSY0407101
BU28TD4WNVX SSON004,4,R/TP,2.8V 150mA Single
LDO,IC,LDO Voltage RegulatorIC,LDO Voltage Regulator
ROHM.
6 L1027 Inductor,Multilayer,Chip ELCH0001405
LL1005-FHL3N3S LL1005-FH3N3S,3.3 nH,S ,1005 ,R/TP ,
TOKO, INC.
6 R207 Wire Pad,Open SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI
- 198 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6
L1004,
L1005,
L1007
Inductor,Multilayer,Chip ELCH0004714
1005GC2T18NJ00 18NH 5% 0V 200mA 0.65OHM 1.6GHZ 8
NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6 R428 Resistor,Chip ERHY0000161
MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 U404 IC,A/D Converter EUSY0242303
MAX17040G DFN,8,R/TP,Fuel gauge,IC,CMOSIC,CMOS
MAXIM INTEGRATED PRODUCTS INC.
6 L3
Inductor,Wire Wound,
chip
ELCP0008001
MIP2520D4R7M 4.7UH 30% 0V 1.1A 0.11OHM 0HZ 0 SHIELD
2.5X2X1MM NONE R/TP FDK CORPORATION.
6 R7 Resistor,Chip ERHZ0000509
MCR01MZP5J750 75OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 L1016 Inductor,Multilayer,Chip ELCH0004718
1005GC2T5N6S00 5.6NH 0.3NH 0V 300mA 0.27OHM 3.2GHZ
8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6
L1017,
L1043
Inductor,Multilayer,Chip ELCH0003844
LQG15HS2N0S02 LQG15HS2N0S02,2 nH,S,1005,R/TP,Chip
coil MURATA MANUFACTURING CO.,LTD.
6
C1036,
C1040,
L1028,
L1029
Inductor,Multilayer,Chip ELCH0001036
HK1005 5N6S-T 5.6NH 0.3NH 0V 8A 5.7GOHM 150mHZ
300m NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD
6 C706 Capacitor,Ceramic,Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005
R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C1003,
C1119,
C1120,
C23,C27,
C459,C460
Capacitor,Ceramic,Chip ECCH0000110
MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 C1092 Inductor,Multilayer,Chip ELCH0001033
HK1005 1N5S-T 1.5NH 0.3NH 0V 8A 13GOHM 50mHZ 300m
NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD
6 C1098 Capacitor,Ceramic,Chip ECCH0000113
MCH155A180J 18pF 5% 50V NP0 -55TO+125C 1005 R/TP -
ROHM Semiconductor KOREA CORPORATION
6
R1172,
R1173,
R1174,
R1175
Resistor,Chip ERHZ0000434
MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C223 Capacitor,Ceramic,Chip ECCH0010501
GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATA
MANUFACTURING CO.,LTD.
6 U401
IC,LDO Voltage
Regulator
EUSY0407201
BU33TD4WNVX SSON004,4,R/TP,3.3V 150mA Single
LDO,IC,LDO Voltage RegulatorIC,LDO Voltage Regulator
ROHM.
6 CN4 Connector,I/O ENRY0010501
GU075-5P-SD-E1500 5P 0.65MM ANGLE RECEPTACLE DIP
R/TP - LS Mtron Ltd.
6 R409 Resistor,Chip ERHZ0000318
MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP -
ROHM Semiconductor KOREA CORPORATION
6 C407 Capacitor,TA,Conformal ECTH0002703
TCTAL1A107M8R 0.0001F 20% 10V 50UA -55TO+125C
0OHM 3.2x1.6x1.1 NONE SMD R/TP ROHM CO.,LTD.
- 199 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6
VA200,
VA201,
VA202,
VA203,
VA204,
VA205
Varistor SEVY0004401
ICVL0518400V500FR 18V 0% 40F 1.0*0.5*0.55 NONE SMD
R/TP INNOCHIPS TECHNOLOGY
6
L1035,L6,
R1004
Inductor,Multilayer,Chip ELCH0001056
1005GC2T2N7SLF 2.7NH 0.3NH 0V 300mA 0.17OHM 5.5GHZ
8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6 R506 Resistor,Chip ERHY0009506
MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C1102,
C602,C607
Capacitor,Ceramic,Chip ECCH0005602
GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C 1608
R/TP - MURATA MANUFACTURING CO.,LTD.
6 L1010 Inductor,Multilayer,Chip ELCH0004711
1005GC2T22NJ00 22NH 5% 0V 200mA 0.8OHM 1.5GHZ 8
NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.
6 R4,R5 Resistor,Chip ERHZ0000415
MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 U1004 IC,RF Amplifier SMZY0025501
RF2815 3.3*2.1*1.0,FILTER+GPS LNA+FILTER
MODULE,GPS, RF MICRO DEVICES INC
6 U1 IC,A/D Converter EUSY0418501
AMI304 QFN,12,R/TP,Geomagnetic Sensor,IC,A/D
ConverterIC,A/D Converter AICHI STEEL CORPORATION
6 CN200 Connector,BtoB ENBY0045901
AXT614124 14P 0.4MM STRAIGHT HEADER SMD R/TP 1M -
BJ PANASONIC ELECTRONIC PARTS CO.,LTD
6 R11 Resistor,Chip ERHY0000181 MCR01MZP5F15R0 15 ohm,1/16W,F,1005,R/TP ROHM.
6 SW1001 Connector,RF ENWY0008701
MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU
50OHM 400mDB HIROSE KOREA CO.,LTD
6 C534 Capacitor,Ceramic,Chip ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005
R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R400 Resistor,Chip ERHZ0003901 MCR10EZHFLR100 0.1OHM 1% 1/4W 2012 R/TP - ROHM.
6 L8 Inductor,Multilayer,Chip ELCH0001413
LL1005-FHL22NJ 22NH 5% 0V 300mA 0.7OHM 2.1GHZ 10
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6 R423 Resistor,Chip ERHZ0004201
MCR01MZP5F1213 121KOHM 1% 1/16W 1005 R/TP -
ROHM.
6 L403,L404
Inductor,Wire Wound,
Chip
ELCP0008004
MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ 0
SHIELD 2.0X1.6X1.0MM NONE R/TP FDK CORPORATION.
6 L1009 Inductor,Multilayer,Chip ELCH0005005
HK100527NJ 27NH 5% 0V 8A 2.3GOHM 470mHZ 300m NON
SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD
6
VA1,VA2,
VA3,VA4,
VA700,
VA701,
VA702,
VA703,
VA704,
VA705,
VA706
Varistor SEVY0004301
ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE SMD
R/TP INNOCHIPS TECHNOLOGY
- 200 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6 D600,D601 Diode,TVS EDTY0009801
VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
6 C400,C401 Capacitor,Ceramic,Chip ECCH0000182
GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C 1005
R/TP - MURATA MANUFACTURING CO.,LTD.
6 C1154 Inductor,Multilayer,Chip ELCH0001035
HK1005 4N7S-T 4.7NH 0.3NH 0V 8A 6GOHM 120mHZ 300m
NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD
6 C1090,C28 Capacitor,Ceramic,Chip ECZH0000816
C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 C613 Capacitor,TA,Conformal ECTH0003701
TCSCM0J106MJAR 10 uF,6.3V,M,L_ESR,1608,R/TP
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 CN401
Connector,Terminal
Block
ENZY0029201
04-9247-003-017-829+ 3,2.5 mm,STRAIGHT,Gold,Twin
contact KYOCERA ELCO KOREA SALES CO.,LTD.
6 U602 IC,Audio Amplifier EUSY0404001
TPA6202A1ZQVR BGA,8,R/TP,Class AB SPK Amp,IC,Audio
AmplifierIC,Audio Amplifier TEXAS INSTRUMENTS KOREA
LTD, HONGKONG BRANCH.
6 R1010 Resistor,Chip ERHZ0000456
MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
FB601,
R407
Resistor,Chip ERHZ0000488
MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 FL1001 Filter,Saw,Dual SFSB0001802
SAWEN881MCN0F00 881.5MHz, 1960MHz 1.8*1.4*0.5 SMD
R/TP 10P MURATA MANUFACTURING CO.,LTD.
6
C1023,
C1025,C15
Capacitor,Ceramic,Chip ECZH0000839
C1005C0G1H4R7CT000F 4.7pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6
C1042,
C1052,
L1021,
L1032
Inductor,Multilayer,Chip ELCH0004713
1005GC2T6N8J00 1005GC2T6N8J00,6.8 nH,J ,1005 ,R/TP ,
PILKOR ELECTRONICS LTD.
6 FL1013 Filter,EMI/Power SFEY0016301
ICMEF112P900M COMMON MODE NOISE FILTER 0HZ 0F
0H SMD R/TP INNOCHIPS TECHNOLOGY
6 U403 IC,PMIC EUSY0342201
PM7540 -0.5~18 N/A 0W CSP R/TP 137P - QUALCOMM
INCORPORATED.
6 C315 Capacitor,Ceramic,Chip ECCH0017501
CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C 1608
R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R602 Resistor,Chip ERHZ0000406
MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C533,C536,
C8
Capacitor,Ceramic,Chip ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C
0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R1178 Resistor,Chip ERHY0009501
MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6
C1109,
R1022,
R209
Resistor,Chip ERHZ0000463
MCR01MZP5J330 33OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C226 Capacitor,Ceramic,Chip ECCH0009203
GRM033R60J333K 33nF 10% 6.3V X5R -55TO+85C 0603
R/TP - MURATA MANUFACTURING CO.,LTD.
- 201 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6 FL1011 Filter,Saw SFSY0039301
SAFEB2G14AL0F00 2140
MHz,1.4*1.1*0.6,SMD,2110M~2170M,IL 3.5,5pin,U-U,50-
50,W-BAND I Rx
DIVERSITY,2140,1.4*1.1*0.6,SMD,R/TP,2140,1.4*1.1*0.6,SM
D,R/TP MURATA MANUFACTURING CO.,LTD.
6
C1116,
C1148,
L1011
Capacitor,Ceramic,Chip ECZH0001002
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 ZD401 Diode,TVS EDTY0008601
PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1
PROTEK DEVICES INC.
6 D403 Diode,TVS EDTY0008606
PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK DEVICES
INC.
6 R616,R617 Resistor,Chip ERHZ0000295
MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 R211,R6 Resistor,Chip ERHZ0000483
MCR01MZP5J470 47OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 X200 Oscillator,VCTCXO EXSK0008901
KT3225L19200DCW28RA0 19.2MHZ 2PPM 2.8V
0.0x0.0x0.0MM NONE SMD R/TP KYOCERA CORP.
6 R410,R413 Resistor,Chip ERHZ0000288
MCR01MZP5F4703 470KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 L1044 Inductor,Multilayer,Chip ELCH0003816
LQG15HS3N6S02D 3.6NH 0.3NH 0V 300mA 0.18OHM 6GHZ
8 NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATA
MANUFACTURING CO.,LTD.
6 L504 Inductor,Multilayer,Chip ELCH0010402
LK1005R27-T LK1005R27-T,270 nH,M ,1005 ,R/TP ,CHIP
TAIYO YUDEN CO.,LTD
6 U2 IC,RF Amplifier EUSY0365001
BGA735 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP 16P -
INFINEON TECHNOLOGIES (ASIA PACIFIC) PTE LTD.
6 U201 IC,MCP,NOR EUSY0216301
NC7SV00P5X_NL SC70 ,5 PIN,R/TP ,Single 2-Input NAND
Gate FAIRCHILD SEMICONDUCTOR
6 R1019 Resistor,Chip ERHY0009504
MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 R208 Filter,Bead SFBH0009601
HB-1T1005-221JT 220 ohm 1.0*0.5*0.5 SMD R/TP 2P
CERATECH CORPORATION
6 ZD400 Diode,TVS EDTY0008602
PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP 2P 1
PROTEK DEVICES INC.
6 FL1006 Filter,Saw SFSY0028101
SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5P
MURATA MANUFACTURING CO.,LTD.
6 C1099 Capacitor,Ceramic,Chip ECCH0002001
C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005
R/TP - TDK CORPORATION
6 IC500 IC,Audio Sub System EUSY0403901
WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -
WOLFSON MICROELECTRONICS PLC
6 J1 Card Socket ENSY0024701
GCA26C-8S-H15-E1500 SIM 8P ANGLE SMD R/TP - LS
Mtron Ltd.
6 R1026 Resistor,Chip ERHZ0000404
MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
- 202 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6
C1004,
C1016
Capacitor,Ceramic,Chip ECCH0000901
C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 U1006 IC,RF Amplifier EUSY0365401
BGA711L7 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP 7P -
INFINEON TECHNOLOGIES (ASIA PACIFIC) PTE LTD.
6 U1001 IC,Tx/Rx EUSY0344001
RTR6285 1.8VTO3V,2.7VTO3V 500mW QFN R/TP 68P -
QUALCOMM INCORPORATED.
6 R700,R703 Resistor,Chip ERHZ0000402
MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 U400 IC,Voltage Detector EUSY0374601
MAX14528 MAX14528,TDFN,8,R/TP,Programmable OVP
MAXIM INTEGRATED PRODUCTS INC.
6 R212 Resistor,Chip ERHY0009592
MCR006YZPJ202 2KOHM 5% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C404 Capacitor,Ceramic,Chip ECZH0003503
GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP
- MURATA MANUFACTURING CO.,LTD.
6 Q400 FET EQFP0008601
NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A 0.07OHM
1.3W TSOP6 R/TP 8P ON SEMICONDUCTOR
6 X400 Crystal EXXY0026801
NX3215SA 32.768KHZ 20PPM 0F NONE SMD R/TP NIHON
DEMPA KOGYO CO.,LTD.
6 L400
Inductor,Wire Wound,
Chip
ELCP0011901
CPI2012NHL2R2MT 2.2UH 20% - 800mA 0.25OHM - -
SHIELD 2X1.25X1MM NONE - SAMWHA CAPACITOR CO,
LTD.
6 U502
IC,LDO Voltage
Regulator
EUSY0407501
BU18TD4WNVX SSON004,4,R/TP,1.8V 150mA Single
LDO,IC,LDO Voltage RegulatorIC,LDO Voltage Regulator
ROHM.
6 R426 Resistor,Chip ERHZ0000222
MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 L9 Inductor,Multilayer,Chip ELCH0001409
LL1005-FHL10NJ 10NH 5% 0V 400mA 0.3OHM 3.6GHZ 9
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6 C509,C510 Capacitor,Ceramic,Chip ECCH0000161
MCH153CN333KK 33nF 10% 16V X7R -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 Q600 TR,Bipolar EQBN0012401
KRC402E NPN 30V 0V 50V 100mA 500mA 50 100mW ESM
R/TP 3P KEC CORPORAITION
6 FL603 Filter,EMI/Power SFEY0015901
ICMEF214P101MFR ICMEF214P101MFR,SMD,ESD Common
mode Filter INNOCHIPS TECHNOLOGY
6 CN1 Connector,BtoB ENBY0058601
51338-9873 10P 0.40MM STRAIGHT FEMALE SMD R/TP
1.5M - HANKOOK MOLEX
6 L1003 Inductor,Multilayer,Chip ELCH0001425
LL1005-FHL82NJ 82NH 5% 0V 200mA 1.9OHM 970MHZ 10
NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6 R424 Resistor,Chip ERHY0000105
MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 FL1002 Filter,Saw,Dual SFSB0001902
SAWEN1G84CN0F00 1842.5MHz, 1960MHz 1.8*1.4*0.5 SMD
R/TP 10P MURATA MANUFACTURING CO.,LTD.
6 C706 Capacitor,Ceramic,Chip ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005
BK-DUP - MURATA MANUFACTURING CO.,LTD.
6 R206 Resistor,Chip ERHY0024201 MCR01MZP5F6041 6040 ohm,1/16W,F,1005,R/TP ROHM.
- 20 -
Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description Part Number Spec Remark
6 FL1008 Filter,Duplexer,IMT SDMY0001901
SAYFP1G95AA0B00 SAYFP1G95AA0B00,1950 MHz,2140
MHz,1.8 dB,2.4 dB,52 dB,43
dB,2.5*2.0*0.55,SMD,Band1,2520size,SAW,Rx unbal MURATA
MANUFACTURING CO.,LTD.
6 C1044 Capacitor,Ceramic,Chip ECZH0025917
GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO.,LTD.
6 L1013 Inductor,Multilayer,Chip ELCH0003819
LQG15HS12NJ02D 12NH 5% 0V 300mA 0.28OHM 3GHZ 8
NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATA
MANUFACTURING CO.,LTD.
6 X500 Oscillator,TCXO EXST0001901
TG-5010LH-87N 26MHZ 2.5PPM 2.8V 32.0x25.0x10.0MM -
SMD R/TP EPSON TOYOCOM CORP
- 204 -
LGE Internal Use Only Copyright 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
Level
Location
No.
Description Part Number Spec Remark
2 EBX000000 Accessory,Data Cable SGDY0016701
KCA-ET-8-0020 KCA-ET-8-0020 Micro USB, 1.2M KSD CO.,
LTD
2 EAB010200 Earphone,Stereo SGEY0003744
EMB-LGE004MSKB 3mW 16OHM 115DB 85HZTO126HZ 1M
BLACK 3.5 L TYPE STEREO 4POLE PLUG - CRESYN
CO.,LTD
2 SBPL00
Rechargeable
Battery,Lithium Ion
SBPL0102301
LGIP-400N-WW-LGC 3.7 V,1500 mAh,1
CELL,PRISMATIC,PRISMATIC,BLACK, LG Chem,LTD.
2 EAY060000 Adapters SSAD0036001
STA-U12BR 90Vac~264Vac 5.1V 700mA 5060 GOST NONE
NONE - SUNLIN ELECTRONICS CO.,LTD
12.3 Accessory Note: This Chapter is used for reference, Part order is ordered

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