CONTENTS

Topic

Page no.

1. INTRODUCTION..........................................................................................1
1.1 EMBEDDED SYSTEM………………………………………………1
1.2 EXAMPLES OF EMBEDDED SYSTEMS………………………….2
1.3 APPLICATIONS OF EMBEDDED SYSTEM………………………2
1.4 MICROCONTROLLER FOR EMBEDDED SYSTEMS……………4
1.5 INTRODUCTION TO THE PROJECT………………………………5
2. DETAIL DESCRIPTION OF THE PROJECT…………………..…….6
2.1 BLOCK DIAGRAM…………………………………………………...6
2.2 BLOCK DIAGRAM DESCRIPTION………………………………...7
2.3 SCHEMATIC DIAGRAM…………………………………………….10
2.4 CIRCUIT DESCRIPTION…………………………………………….11
3. HARDWARE COMPONENTS…………………………………………12
3.1 MICROCONTROLLER………………………………………………12
3.1.1 EMBEDDED DESIGN………………………………………13
3.1.2 INTERRUPTS………………………………………………..13
3.1.3 PROGRAMS………………………………………………….14
3.1.4 OTHER MICROCONTROLLER FEATURES……………..14
3.2 POWER SUPPLY……………………………………………………..15
3.3 MAX 232………………………………………………………………20
3.4 A/D CONVERTER……………………………………………………21
4. 8051 MICROCONTROLLER……………………………………………24
4.1 INTRODUCTION TO 8051…………………………………………..24
4.2 INTRODUCTION TO ATMEL 89C51…………………………….24
5. ZIGBEE……………………………………………………………………40
5.1 ZIGBEE TECHNOLOGIES…………………………………………..40
5.2 ZIGBEE ARCHITECTURE…………………………………………46

73 11. CONCLUSION…………………………………………………………….6.72 10.2 Light Dependent Resistor (LDR-sensor)………………………….….57 8.1 TEMPERARTURE SENSOR…………………………………………52 6.54 7. SOFTWARE COMPONENTS…………………………………………..74 12.. IMPLEMENTATION……………………………………………………. BIBLIORAPHY……………………………………………………………75 .52 6. CODING……………………………………………………………………66 9.. SENSORS…………………………………………………………………... FUTURE SCOPE………………………………………………………….

...45 20.1 .4 – Internal Circuit…………………………………………………... Fig 4.A/D Converter……………………………………………………21 9.LIST OF FIGURES Figure Name Page No.2 – Various Wireless Technologies………………………………….. Fig 1.10 4..5 – TCON Register…………………………………………………. Fig 3. Fig 5.6 3.53 24.13 5..2 – Internal Circuit………………………………………………….Block Diagram…………………………………………………….4 – Pin Diagram Of X-BEE Transceiver……………………………. Fig 6. Fig 6.2 ... Fig 4. Fig 3.1 2.26 12.3 – Zigbee Architecture………………………………………………48 21.7 – SBUF……………………………………………………………. Fig 4.. Fig 5.3 – Pin Configuration……………………………………………….Schematic Diagram………………………………………………. Fig 6. Fig 4.56 .1 – Network Topologies……………………………………………. Fig 5. Fig 2. Fig 3.8 – SCON…………………………………………………………….1 – LM35…………………………………………………………….Max 232…………………………………………………………..2 .54 26.Full Wave Rectifier……………………………………………….Block Diagram of 8051…………………………………………. Fig 4.20 7.3 .38 17..1 .1 .1 .21 8. Fig 5.. 1.Embedded System………………………………………………. Fig 4.Structure………………………………………………………….. Fig 3. Fig 4.54 25.52 23.22 10..17 6.28 13.3 – LDR…………………………………………………………….6 – Baud Rate of 8051………………………………………………37 16.25 11.Microcontroller……. Fig 4. Fig 2.2 – Program Memory………………………………………………. Fig 3.43 19..Power Supply………………………………………………….33 15.49 22.…………………………………………….5 – Humidity Sensor………………………………………………. Fig 6.4 – TMOD……………………………………………………………33 14.5 .6 . Fig 3. Fig 6.38 18.4 .

72 . Fig 6.27.6 – Internal Circuit…………………………………………………..16 – Software Screenshots……………………………………65 29.1 – Hardware Demonstration………………………………………. Fig 7. Fig 9.1 – 7.56 28.

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