CONTENTS

Topic

Page no.

1. INTRODUCTION..........................................................................................1
1.1 EMBEDDED SYSTEM………………………………………………1
1.2 EXAMPLES OF EMBEDDED SYSTEMS………………………….2
1.3 APPLICATIONS OF EMBEDDED SYSTEM………………………2
1.4 MICROCONTROLLER FOR EMBEDDED SYSTEMS……………4
1.5 INTRODUCTION TO THE PROJECT………………………………5
2. DETAIL DESCRIPTION OF THE PROJECT…………………..…….6
2.1 BLOCK DIAGRAM…………………………………………………...6
2.2 BLOCK DIAGRAM DESCRIPTION………………………………...7
2.3 SCHEMATIC DIAGRAM…………………………………………….10
2.4 CIRCUIT DESCRIPTION…………………………………………….11
3. HARDWARE COMPONENTS…………………………………………12
3.1 MICROCONTROLLER………………………………………………12
3.1.1 EMBEDDED DESIGN………………………………………13
3.1.2 INTERRUPTS………………………………………………..13
3.1.3 PROGRAMS………………………………………………….14
3.1.4 OTHER MICROCONTROLLER FEATURES……………..14
3.2 POWER SUPPLY……………………………………………………..15
3.3 MAX 232………………………………………………………………20
3.4 A/D CONVERTER……………………………………………………21
4. 8051 MICROCONTROLLER……………………………………………24
4.1 INTRODUCTION TO 8051…………………………………………..24
4.2 INTRODUCTION TO ATMEL 89C51…………………………….24
5. ZIGBEE……………………………………………………………………40
5.1 ZIGBEE TECHNOLOGIES…………………………………………..40
5.2 ZIGBEE ARCHITECTURE…………………………………………46

52 6.72 10. FUTURE SCOPE…………………………………………………………..74 12. BIBLIORAPHY……………………………………………………………75 . SOFTWARE COMPONENTS………………………………………….73 11. CODING……………………………………………………………………66 9..57 8.1 TEMPERARTURE SENSOR…………………………………………52 6.54 7.. SENSORS………………………………………………………………….2 Light Dependent Resistor (LDR-sensor)………………………….6.. CONCLUSION……………………………………………………………. IMPLEMENTATION……………………………………………………..….

Fig 3. Fig 3.1 ..Schematic Diagram……………………………………………….38 17.Power Supply…………………………………………………. Fig 3.1 2..2 ..5 – TCON Register………………………………………………….53 24.. Fig 4.20 7.2 .3 – Pin Configuration……………………………………………….Max 232…………………………………………………………. Fig 3.1 .5 – Humidity Sensor………………………………………………. Fig 4.5 .. Fig 5..43 19.52 23.3 .LIST OF FIGURES Figure Name Page No.28 13..13 5.17 6. Fig 5..3 – Zigbee Architecture………………………………………………48 21.33 15. Fig 6.A/D Converter……………………………………………………21 9.…………………………………………….49 22.. Fig 6.26 12... Fig 4.56 .6 – Baud Rate of 8051………………………………………………37 16.1 – Network Topologies…………………………………………….54 25..2 – Internal Circuit…………………………………………………. Fig 1. Fig 6. 1. Fig 4. Fig 6.1 .. Fig 6. Fig 5. Fig 4.6 . Fig 4.3 – LDR…………………………………………………………….22 10.4 – TMOD……………………………………………………………33 14. Fig 4.4 – Internal Circuit………………………………………………….2 – Program Memory……………………………………………….7 – SBUF…………………………………………………………….2 – Various Wireless Technologies………………………………….Full Wave Rectifier………………………………………………. Fig 2...6 3.Microcontroller…….Structure…………………………………………………………. Fig 2.4 .8 – SCON…………………………………………………………….. Fig 3.1 .38 18. Fig 3. Fig 4.Block Diagram……………………………………………………..1 – LM35…………………………………………………………….45 20. Fig 5.10 4.21 8.25 11.4 – Pin Diagram Of X-BEE Transceiver…………………………….54 26.Embedded System……………………………………………….Block Diagram of 8051………………………………………….

27.1 – 7.1 – Hardware Demonstration……………………………………….6 – Internal Circuit………………………………………………….16 – Software Screenshots……………………………………65 29.56 28. Fig 7..72 . Fig 6. Fig 9.