CONTENTS

Topic

Page no.

1. INTRODUCTION..........................................................................................1
1.1 EMBEDDED SYSTEM………………………………………………1
1.2 EXAMPLES OF EMBEDDED SYSTEMS………………………….2
1.3 APPLICATIONS OF EMBEDDED SYSTEM………………………2
1.4 MICROCONTROLLER FOR EMBEDDED SYSTEMS……………4
1.5 INTRODUCTION TO THE PROJECT………………………………5
2. DETAIL DESCRIPTION OF THE PROJECT…………………..…….6
2.1 BLOCK DIAGRAM…………………………………………………...6
2.2 BLOCK DIAGRAM DESCRIPTION………………………………...7
2.3 SCHEMATIC DIAGRAM…………………………………………….10
2.4 CIRCUIT DESCRIPTION…………………………………………….11
3. HARDWARE COMPONENTS…………………………………………12
3.1 MICROCONTROLLER………………………………………………12
3.1.1 EMBEDDED DESIGN………………………………………13
3.1.2 INTERRUPTS………………………………………………..13
3.1.3 PROGRAMS………………………………………………….14
3.1.4 OTHER MICROCONTROLLER FEATURES……………..14
3.2 POWER SUPPLY……………………………………………………..15
3.3 MAX 232………………………………………………………………20
3.4 A/D CONVERTER……………………………………………………21
4. 8051 MICROCONTROLLER……………………………………………24
4.1 INTRODUCTION TO 8051…………………………………………..24
4.2 INTRODUCTION TO ATMEL 89C51…………………………….24
5. ZIGBEE……………………………………………………………………40
5.1 ZIGBEE TECHNOLOGIES…………………………………………..40
5.2 ZIGBEE ARCHITECTURE…………………………………………46

CONCLUSION…………………………………………………………….. IMPLEMENTATION……………………………………………………..…. FUTURE SCOPE………………………………………………………….54 7.73 11.72 10. SOFTWARE COMPONENTS………………………………………….. BIBLIORAPHY……………………………………………………………75 .1 TEMPERARTURE SENSOR…………………………………………52 6.74 12.2 Light Dependent Resistor (LDR-sensor)………………………….6..52 6.57 8. SENSORS…………………………………………………………………. CODING……………………………………………………………………66 9..

.52 23.54 26.10 4. Fig 3.43 19. Fig 6..5 .A/D Converter……………………………………………………21 9.5 – TCON Register…………………………………………………. Fig 4.6 3.1 – Network Topologies……………………………………………. Fig 3. Fig 6.. Fig 4. Fig 4. Fig 2.……………………………………………. Fig 3.Block Diagram……………………………………………………. Fig 6.. Fig 4. Fig 3.1 – LM35…………………………………………………………….1 .3 – LDR…………………………………………………………….2 – Various Wireless Technologies………………………………….4 – TMOD……………………………………………………………33 14.3 .Microcontroller…….22 10.Max 232…………………………………………………………. Fig 5. Fig 1. Fig 2.2 – Program Memory……………………………………………….20 7..6 .45 20.56 .49 22.3 – Pin Configuration………………………………………………. Fig 5. Fig 4..Embedded System……………………………………………….1 ...2 . Fig 5.7 – SBUF…………………………………………………………….6 – Baud Rate of 8051………………………………………………37 16....3 – Zigbee Architecture………………………………………………48 21.25 11..4 .21 8.2 – Internal Circuit………………………………………………….2 .17 6.1 .Full Wave Rectifier……………………………………………….28 13.54 25.Schematic Diagram……………………………………………….1 .. Fig 4..33 15... Fig 6. Fig 4.5 – Humidity Sensor……………………………………………….LIST OF FIGURES Figure Name Page No.Power Supply………………………………………………….Structure………………………………………………………….38 17. 1. Fig 4. Fig 6.26 12.13 5.4 – Internal Circuit………………………………………………….8 – SCON…………………………………………………………….1 2.Block Diagram of 8051…………………………………………. Fig 5.53 24.4 – Pin Diagram Of X-BEE Transceiver…………………………….. Fig 3.38 18. Fig 3.

72 .1 – 7. Fig 7.16 – Software Screenshots……………………………………65 29.1 – Hardware Demonstration………………………………………. Fig 6.6 – Internal Circuit………………………………………………….27.. Fig 9.56 28.