CONTENTS

Topic

Page no.

1. INTRODUCTION..........................................................................................1
1.1 EMBEDDED SYSTEM………………………………………………1
1.2 EXAMPLES OF EMBEDDED SYSTEMS………………………….2
1.3 APPLICATIONS OF EMBEDDED SYSTEM………………………2
1.4 MICROCONTROLLER FOR EMBEDDED SYSTEMS……………4
1.5 INTRODUCTION TO THE PROJECT………………………………5
2. DETAIL DESCRIPTION OF THE PROJECT…………………..…….6
2.1 BLOCK DIAGRAM…………………………………………………...6
2.2 BLOCK DIAGRAM DESCRIPTION………………………………...7
2.3 SCHEMATIC DIAGRAM…………………………………………….10
2.4 CIRCUIT DESCRIPTION…………………………………………….11
3. HARDWARE COMPONENTS…………………………………………12
3.1 MICROCONTROLLER………………………………………………12
3.1.1 EMBEDDED DESIGN………………………………………13
3.1.2 INTERRUPTS………………………………………………..13
3.1.3 PROGRAMS………………………………………………….14
3.1.4 OTHER MICROCONTROLLER FEATURES……………..14
3.2 POWER SUPPLY……………………………………………………..15
3.3 MAX 232………………………………………………………………20
3.4 A/D CONVERTER……………………………………………………21
4. 8051 MICROCONTROLLER……………………………………………24
4.1 INTRODUCTION TO 8051…………………………………………..24
4.2 INTRODUCTION TO ATMEL 89C51…………………………….24
5. ZIGBEE……………………………………………………………………40
5.1 ZIGBEE TECHNOLOGIES…………………………………………..40
5.2 ZIGBEE ARCHITECTURE…………………………………………46

...74 12.52 6.…. SENSORS………………………………………………………………….6. FUTURE SCOPE………………………………………………………….2 Light Dependent Resistor (LDR-sensor)………………………….72 10. CONCLUSION……………………………………………………………..54 7. CODING……………………………………………………………………66 9.1 TEMPERARTURE SENSOR…………………………………………52 6. IMPLEMENTATION……………………………………………………. SOFTWARE COMPONENTS…………………………………………. BIBLIORAPHY……………………………………………………………75 .57 8.73 11..

Fig 4.A/D Converter……………………………………………………21 9.8 – SCON……………………………………………………………. Fig 4.52 23..4 – Pin Diagram Of X-BEE Transceiver…………………………….. Fig 3. Fig 3.1 ..6 – Baud Rate of 8051………………………………………………37 16.33 15.28 13.2 – Various Wireless Technologies………………………………….…………………………………………….20 7..Schematic Diagram……………………………………………….2 – Internal Circuit………………………………………………….54 26.13 5..1 . Fig 4.Power Supply………………………………………………….3 – Zigbee Architecture………………………………………………48 21..Block Diagram……………………………………………………. Fig 6.5 – Humidity Sensor……………………………………………….2 . Fig 3.2 – Program Memory………………………………………………. Fig 4.. Fig 1. Fig 5.4 .49 22..1 .25 11. Fig 5.26 12. Fig 6. Fig 6. Fig 4. Fig 2..22 10. 1.Block Diagram of 8051…………………………………………. Fig 4.2 . Fig 3. Fig 2.LIST OF FIGURES Figure Name Page No..5 – TCON Register………………………………………………….6 3.4 – Internal Circuit………………………………………………….Full Wave Rectifier………………………………………………..43 19.1 – LM35…………………………………………………………….21 8.6 .3 – Pin Configuration……………………………………………….45 20.4 – TMOD……………………………………………………………33 14.38 18...56 ..38 17. Fig 5.3 .17 6. Fig 3.. Fig 4. Fig 4.1 2.5 . Fig 5.Structure………………………………………………………….53 24.Embedded System………………………………………………..1 – Network Topologies…………………………………………….Max 232………………………………………………………….3 – LDR…………………………………………………………….7 – SBUF…………………………………………………………….Microcontroller…….54 25..1 .10 4. Fig 6. Fig 6. Fig 3.

1 – Hardware Demonstration………………………………………. Fig 7.27.72 . Fig 6..1 – 7.56 28.16 – Software Screenshots……………………………………65 29.6 – Internal Circuit…………………………………………………. Fig 9.

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