CONTENTS

Topic

Page no.

1. INTRODUCTION..........................................................................................1
1.1 EMBEDDED SYSTEM………………………………………………1
1.2 EXAMPLES OF EMBEDDED SYSTEMS………………………….2
1.3 APPLICATIONS OF EMBEDDED SYSTEM………………………2
1.4 MICROCONTROLLER FOR EMBEDDED SYSTEMS……………4
1.5 INTRODUCTION TO THE PROJECT………………………………5
2. DETAIL DESCRIPTION OF THE PROJECT…………………..…….6
2.1 BLOCK DIAGRAM…………………………………………………...6
2.2 BLOCK DIAGRAM DESCRIPTION………………………………...7
2.3 SCHEMATIC DIAGRAM…………………………………………….10
2.4 CIRCUIT DESCRIPTION…………………………………………….11
3. HARDWARE COMPONENTS…………………………………………12
3.1 MICROCONTROLLER………………………………………………12
3.1.1 EMBEDDED DESIGN………………………………………13
3.1.2 INTERRUPTS………………………………………………..13
3.1.3 PROGRAMS………………………………………………….14
3.1.4 OTHER MICROCONTROLLER FEATURES……………..14
3.2 POWER SUPPLY……………………………………………………..15
3.3 MAX 232………………………………………………………………20
3.4 A/D CONVERTER……………………………………………………21
4. 8051 MICROCONTROLLER……………………………………………24
4.1 INTRODUCTION TO 8051…………………………………………..24
4.2 INTRODUCTION TO ATMEL 89C51…………………………….24
5. ZIGBEE……………………………………………………………………40
5.1 ZIGBEE TECHNOLOGIES…………………………………………..40
5.2 ZIGBEE ARCHITECTURE…………………………………………46

.73 11. CODING……………………………………………………………………66 9. FUTURE SCOPE………………………………………………………….1 TEMPERARTURE SENSOR…………………………………………52 6.74 12.….54 7.52 6. BIBLIORAPHY……………………………………………………………75 . IMPLEMENTATION…………………………………………………….6.2 Light Dependent Resistor (LDR-sensor)…………………………..72 10. CONCLUSION…………………………………………………………….. SENSORS………………………………………………………………….57 8... SOFTWARE COMPONENTS………………………………………….

Fig 6.38 17. Fig 5.1 – Network Topologies……………………………………………. Fig 4. Fig 4.54 26..7 – SBUF…………………………………………………………….21 8.1 2.10 4..Block Diagram…………………………………………………….2 – Internal Circuit………………………………………………….20 7.. Fig 4.2 .3 – Pin Configuration……………………………………………….3 . Fig 3..4 .3 – Zigbee Architecture………………………………………………48 21.. Fig 4.Schematic Diagram……………………………………………….33 15.8 – SCON……………………………………………………………. Fig 3.28 13.Max 232………………………………………………………….4 – Pin Diagram Of X-BEE Transceiver……………………………. Fig 3.……………………………………………. Fig 2.2 – Program Memory………………………………………………..56 .2 . Fig 2..5 – Humidity Sensor……………………………………………….52 23.38 18.25 11.Power Supply………………………………………………….54 25..6 3.5 – TCON Register………………………………………………….45 20.13 5. Fig 3.LIST OF FIGURES Figure Name Page No.43 19.Microcontroller…….1 .26 12.22 10. Fig 3.. Fig 4.. Fig 3.4 – TMOD……………………………………………………………33 14. Fig 5. Fig 6. Fig 4.1 – LM35…………………………………………………………….A/D Converter……………………………………………………21 9. 1.49 22...Block Diagram of 8051………………………………………….Full Wave Rectifier……………………………………………….1 .2 – Various Wireless Technologies…………………………………. Fig 5. Fig 6.. Fig 1.Structure…………………………………………………………. Fig 4. Fig 5.53 24.5 ..1 .6 – Baud Rate of 8051………………………………………………37 16.6 .17 6.1 ...3 – LDR…………………………………………………………….4 – Internal Circuit…………………………………………………..Embedded System………………………………………………. Fig 6. Fig 4. Fig 6.

.1 – Hardware Demonstration……………………………………….1 – 7.72 . Fig 7.16 – Software Screenshots……………………………………65 29. Fig 9. Fig 6.27.6 – Internal Circuit………………………………………………….56 28.

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