CONTENTS

Topic

Page no.

1. INTRODUCTION..........................................................................................1
1.1 EMBEDDED SYSTEM………………………………………………1
1.2 EXAMPLES OF EMBEDDED SYSTEMS………………………….2
1.3 APPLICATIONS OF EMBEDDED SYSTEM………………………2
1.4 MICROCONTROLLER FOR EMBEDDED SYSTEMS……………4
1.5 INTRODUCTION TO THE PROJECT………………………………5
2. DETAIL DESCRIPTION OF THE PROJECT…………………..…….6
2.1 BLOCK DIAGRAM…………………………………………………...6
2.2 BLOCK DIAGRAM DESCRIPTION………………………………...7
2.3 SCHEMATIC DIAGRAM…………………………………………….10
2.4 CIRCUIT DESCRIPTION…………………………………………….11
3. HARDWARE COMPONENTS…………………………………………12
3.1 MICROCONTROLLER………………………………………………12
3.1.1 EMBEDDED DESIGN………………………………………13
3.1.2 INTERRUPTS………………………………………………..13
3.1.3 PROGRAMS………………………………………………….14
3.1.4 OTHER MICROCONTROLLER FEATURES……………..14
3.2 POWER SUPPLY……………………………………………………..15
3.3 MAX 232………………………………………………………………20
3.4 A/D CONVERTER……………………………………………………21
4. 8051 MICROCONTROLLER……………………………………………24
4.1 INTRODUCTION TO 8051…………………………………………..24
4.2 INTRODUCTION TO ATMEL 89C51…………………………….24
5. ZIGBEE……………………………………………………………………40
5.1 ZIGBEE TECHNOLOGIES…………………………………………..40
5.2 ZIGBEE ARCHITECTURE…………………………………………46

IMPLEMENTATION……………………………………………………. CODING……………………………………………………………………66 9.52 6. BIBLIORAPHY……………………………………………………………75 . FUTURE SCOPE………………………………………………………….74 12.57 8.…..54 7..73 11.. SENSORS………………………………………………………………….6..72 10. CONCLUSION……………………………………………………………. SOFTWARE COMPONENTS………………………………………….1 TEMPERARTURE SENSOR…………………………………………52 6.2 Light Dependent Resistor (LDR-sensor)…………………………..

Fig 3.45 20.3 .1 . Fig 2. Fig 5.3 – Pin Configuration………………………………………………. Fig 4.. 1.6 .4 – Internal Circuit………………………………………………….1 – LM35……………………………………………………………..Block Diagram…………………………………………………….Schematic Diagram……………………………………………….53 24.. Fig 5. Fig 4.1 2.Block Diagram of 8051…………………………………………..1 .43 19.A/D Converter……………………………………………………21 9.25 11..56 .. Fig 3.5 – Humidity Sensor……………………………………………….Full Wave Rectifier………………………………………………..Microcontroller…….5 – TCON Register………………………………………………….6 – Baud Rate of 8051………………………………………………37 16. Fig 6.4 .17 6.5 .Structure………………………………………………………….20 7.Power Supply………………………………………………….49 22. Fig 4.Embedded System………………………………………………..38 18..1 – Network Topologies…………………………………………….10 4.Max 232………………………………………………………….3 – Zigbee Architecture………………………………………………48 21.. Fig 4. Fig 6. Fig 3.4 – TMOD……………………………………………………………33 14. Fig 4.……………………………………………. Fig 3.. Fig 6. Fig 4.52 23.4 – Pin Diagram Of X-BEE Transceiver……………………………. Fig 5. Fig 2.2 – Program Memory……………………………………………….21 8. Fig 3. Fig 5.LIST OF FIGURES Figure Name Page No.54 26.2 – Internal Circuit…………………………………………………. Fig 6.38 17.22 10..26 12.28 13..2 ..1 ..7 – SBUF…………………………………………………………….2 – Various Wireless Technologies………………………………….6 3. Fig 4.3 – LDR……………………………………………………………...8 – SCON……………………………………………………………. Fig 1. Fig 4.33 15.13 5. Fig 3.1 .54 25. Fig 6.2 .

.72 .16 – Software Screenshots……………………………………65 29.1 – 7.1 – Hardware Demonstration……………………………………….6 – Internal Circuit………………………………………………….27. Fig 7. Fig 9.56 28. Fig 6.

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