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09
Sustainability Report 2009
Contents
4 To our stakeholders
9 About ASML
17 Economic
19 Customers
24 Supply Chain
27 Environment
43 Our Communities
45 Reporting Principles
46 Assurance Statement
> Contents
To our stakeholders t echnology leadership as it continues to develop four and developing multi-segment solutions, while honing
new architectures, (2) ASML would generate cash from our operations and execution so as to reduce structural
operations in 2009, in spite of the significant revenue and product cost, as well as cycle time. We also intend
downturn, and (3) ASML would be in a position to to continue scouting other market opportunities beyond
Dear stakeholder, forecast that it would reach a break-even sales level or semiconductors to leverage our technologies and
The year 2009 started in the midst of a major historical above by the second half of 2009. other competencies. In addition, we will commit to our
downturn and finished with a measured recovery of We are encouraged that our communication was under- corporate responsibilities of contributing to a sustainable
the world economies. In our semiconductor world, this stood and supported by our stakeholders. We managed future by investing in technologies and approaches that
translated into a virtual business freeze for six months, to retain confidence among our customers, our suppliers minimize our ecological footprint. We are confident that
followed by a major re-start and acceleration of the and our investors as evidenced by our strong bookings this strategy will be sustained by customer requirements
bookings trend in the second half of 2009. Customers pick-up at the end of 2009, our continuous support from driven by Moore’s law, which justifies our decision to
who had delayed structural technology investments are suppliers gearing capacity back-up and our share price target E 5 billion in yearly revenues at the top of the next
now faced with the need to update their infrastructure to performance. Thanks to the sacrifices and contributions semiconductor cycle.
be able to produce new levels of transistor integration. of our employees and flexible staff, we have proven the
This typical integration trend (Moore’s Law, named after significant robustness of our business model to all our ASML sustainability focus
the Intel co-founder) calls for a doubling of the number of stakeholders, and are emerging from the economic crisis The semiconductor industry – a $225 billion (E 162 bil-
transistors per chip every 18 months to two years which stronger than ever. lion) global sector – and its related equipment industry
has continued even during the 2009 world economic crisis. have continuously enabled the introduction of new
Recovery in the second half of 2009 electronics products with increased performance and
Downturn in the first half of 2009 Our confidence in our ability to maintain production lower energy consumption per electronic function. The
The global economic downturn, one of the sharpest in capacity and continue key R&D – supported by our lower cost and lower power consumption, as evidenced
recorded history, tested our management for the long healthy cash balance of more than E 1 billion – was by the adoption of mobile handheld electronics, means
term and our sustainability policy when first and second rewarded midway through the year when the chip semiconductors have a relatively modest ecological
quarter revenues fell by more than 70 percent in 2009 industry proved one of the first global industry sectors footprint when compared to products from non-scalable
compared to 2008. The crisis forced us to take measures to recover. Our sales in the second half of 2009 more industries. Through our scanners, which can image
which were felt by our employees and other stakeholders. than doubled compared to the first half. Orders rose even smaller structures on chips that consume less power,
We reduced the number of employees, mainly those on faster and we entered 2010 with expectations of very ASML is a key enabler of this trend towards more
temporary contracts, as well as cutting the working hours healthy revenues for the year. As a result of increased energy-efficient electronics. Our key responsibility is to
of manufacturing employees, without cutting wages. As a demand for our products, we rehired temporary employ- work every day to ensure this trend continues, and that
result, we were able to minimize headcount cuts among ees who were laid off earlier in the year. Through our our innovation roadmap to further “shrink” chip features
non-temporary workers. Furthermore, we significantly flexible employment partners we had kept in touch with takes us beyond 2020.
trimmed non-strategic discretionary expenses by more our former flexible staff, and they were approached Our sustainability program can be improved further.
than E 200 million per year, or about 16 percent. We during the expansion. We are happy to report that we We have sharpened our Sustainability Charter to reflect
did not reduce any of our strategic expenses, whether were able to rehire approximately 400 temporary employ- our increased ambition and have set new and ambitious
in Research & Development (R&D) or in Operations. We ees in 2009, almost half of whom have ASML experience. targets for the 2010-2015 period in the following four
communicated that these efforts, although very painful focus areas:
for our dedicated temporary worker population and our Trends for the future 1. Environment at ASML sites: ASML will reduce
suppliers, would ensure that: (1) ASML would strengthen We intend to proceed with our proven strategy, which CO2 emissions; improve waste recycling and
its competitive position by ensuring an improving consists of investing above the market average in R&D conserve water
Eric Meurice
The following table captures ASML’s key performance Table 1 on page 8 illustrates that every year ASML
indicators. Targets have been set after input from our produces more advanced machines, leading to a
customers, investors and other stakeholders. The significant increase of computing power produced
economic crisis has had a big impact on sales and with our systems. An appropriate way to measure this
income, but ASML was able to keep its R&D investments performance increase is by looking at the total number
at a high level. Our business objective of reaching of Petabytes (one Petabyte is one million Gigabytes) of
e 5 billion in next full upturn is unchanged. computer memory produced every year thanks to the
In the area of environmental performance our CO2 introduction of new ASML scanners. ASML’s positive
emissions and water usage have increased due to the economic and environmental performance can be proved
building of new production facilities in the Netherlands when our sales and emissions are measured against
and Asia as well as testing of our new Extreme Ultraviolet the increasing number of Petabytes made on ASML
(EUV) machines. In both areas, we plan for new initiatives machines. This is how ASML adds value for its customers
to improve performance. The absolute amount of waste and we will continue with this proven strategy.
declined as a result of lower sales, but the percentage
of recycled non-hazardous waste declined due to a For the future, we are now seeing multiple opportunities
less favourable mix containing less steel. We plan to to improve our environmental performance in absolute
introduce programs to recycle more waste categories terms. Starting this year we have therefore set
and target to increase recycling of non-hazardous waste ourselves absolute targets for key categories such
to 90 percent by 2015. Our hazardous waste streams as CO2 emissions and waste.
are significantly smaller and our recycling efforts are
restricted to only the two largest categories which make With this established relative performance improvement
up close to 80 percent. We will take any opportunity to as well as our target to improve in absolute terms, we
recycle smaller quantities of other hazardous waste when believe ASML can make a significant contribution to a
possible and make sure all other hazardous waste is more sustainable society and deserve our place amongst
removed and processed with minimal ecological damage the sustainability leaders in our industry.
through special high temperature incineration with energy
conversion.
With regards to health and safety, the number of
incidents was relatively low, and we are seeking
opportunities to further reduce this number. Our social
responsibilities are being met by increasing investments
in charity and our encouragement of employees to
engage in volunteering.
Environment (page 27) 2007 2008 2009
CO2 emissions [*106 kg] 70.1 76.8 80.0 5 50% reduction by 2015 (base: 2010)
CO2 emissions [*106 kg] per 1 Petabyte memory 2 0.042 0.021 0.016 Continue improving trend
Water use (x 1,000 m³) 451 573 692 Increase recycling 6
Water [1,000 m³] used per 1 Petabyte memory 2 0.28 0.16 0.14 Continue improving trend
Total waste materials disposed (x 1,000 kg) 1,277 1,103 796
Recycled non-hazardous waste Veldhoven (%) 62 62 52 90% by 2015
1
ecause ASML operates in a
B 5
CO2 emissions in 2009 were Recycled hazardous waste disposal Veldhoven (%) 75 73 79 80% by 2015 7
highly cyclical industry, we issue based on standard conversion
no annual sales guidance. Every rates.
quarter, ASML indicates the sales 6
See Environmental chapter for
Social and Health & Safety (page 41) 2007 2008 2009
and profit margins it expects in details.
the coming quarter. We have set 7
Our aim is to recycle as much
a target of E 5 billion in annual hazardous waste as possible, Number of payroll employees in FTEs 6,582 6,930 6,548
sales during the next full eco-
but if this is not possible due to Number of temporary employees in FTEs 1,725 1,329 1,137
nomic upturn. small volumes, it is processed in Employee turnover (%) 5.2 6.4 8.5
2
Represents how much net sales, a controlled manner through spe- New hires 1,170 794 112
CO2 or water are needed to cial high-temperature incineration Workforce by gender (men / women in %) 88 / 12 89 / 11 89 / 11 N/A8
produce 1 Petabyte (1 million
with energy conversion. International diversity (% of non-Dutch hires) - 53 65.2 N/A8
Gigabytes) of chip memory. This 8
ASML does not set fixed targets, Average training hours per FTE 20 32 16
shows that ASML produces ever but provides equal opportunities Number of partnerships with
more advanced new systems in recruiting, hiring, education, universities, colleges, schools 9 16 21
which can produce more memory
promotion and compensation Product-related incidents at client sites 2 3 3 Downward trend towards zero
bits than previous generations.
without discrimination for race, Recordable incidents per 100 FTEs 0.49 0.46 0.37 25% improvement every year
3
Total R&D investments includes color, gender, age, religion, Total cash donated to charitable associations (E) 600,000 > 600,000 >600,000 700,000 in 2010
investments made with govern- political opinion, nationality or
ment grants. social origin.
4
Although ASML aims to increase Supply Chain (page 24) 2007 2008 2009
its market share, we issue no
market share targets as we
Product-related key suppliers that meet
regard market share gains as
ASML social requirements (%) - 100 100 100% in 2010
the outcome of an effective
Product-related key suppliers with a
execution of our strategy which
Health and Safety Management System (%) 95 97 100 100% in 2010
is to offer customers the best
Product-related key suppliers with an
and most cost-effective semi
Environmental Management System (%) 80 90 100 100% in 2010
conductor lithography systems
in all segments of the market.
ASML designs, develops, integrates, markets and ser- ASML faces several industry and company risks.
vices advanced systems used by customers – the major These risks are described in Item 3D of the company’s
global semiconductor manufacturers – to create chips Annual Report on Form 20-F. These include, but are not
that power a wide array of electronic, communication limited to: economic conditions, product demand and
and information technology products. semiconductor equipment industry capacity, worldwide
demand and manufacturing capacity utilization for
ASML technology transfers circuit patterns onto silicon semiconductors (the principal product of our customer
wafers to make integrated circuits. This technology is base) including the impact of credit market deterioration
central to making integrated circuits smaller, faster and on consumer confidence and demand for our customers’
cheaper. Our technology is known as optical lithography. products, competitive products and pricing, manufactur-
ASML systems are called steppers and Step & Scan ing efficiencies, new product development and customer
systems (scanners). They use a photographic process to acceptance of new products, ability to enforce patents
image nanometric circuit patterns onto a silicon wafer, and protect intellectual property rights, the outcome of
much like a traditional camera prints an image on film. intellectual property litigation, availability of raw materials
and critical manufacturing equipment, trade environment
With every generation, the complexity of producing and changes in exchange rates.
integrated circuits with more functionality increases.
Semiconductor manufacturers need partners that provide More information about ASML can be found on our
technology and complete process solutions. ASML is website www.asml.com.
committed to providing customers with leading edge
technology that is production-ready at the earliest
possible date. ASML technology is supported by
process solutions, enabling customers to gain and
sustain a competitive edge in the marketplace.
This makes the semiconductor industry unique, because Moore’s Law also has an impact on the energy usage
Responsibility to execute ASML’s strategy it is capable of continuing rapid improvements in of chips. Smaller geometries allow for much lower
in a sustainable way performance and productivity, which are unmatched electrical currents to operate the chip. High on the
ASML’s business strategy is based on achieving and by any other industry. This progress is powered by better heels of Moore’s Law follows the trend that the number
further developing a position as a technology leader in imaging capabilities from companies like ASML that of computations per unit of electricity doubles every
semiconductor lithography. This strategy results in the enable chip makers to project smaller structures on a 1.5 years (see graph 2). This has helped to contain the
delivery of lithography systems which enable customers silicon wafer, increasing the computing capacity per chip world’s energy consumption despite the proliferation of
to produce the highest performance and lowest cost at roughly stable costs. Today, chip makers can image affordable computing.
semiconductors. The superior value of ownership offered electronic circuits and features that are over 6,000 times
to customers as a result of ASML’s strategy also maxi- smaller than they were in the early 1970s. This trend was
mizes ASML’s own financial performance, aligning the first observed by Intel co-founder Gordon Moore in 1965
interests of ASML and our customers. We implement our and has held true ever since (see graph 1).
strategy through customer focus, strategic investment in 10 16
rests on three pillars. Our first priority is to continue R&D- 10 12 486/25 and 486/33
Desktops
intensive creation of more advanced lithography scanners, 10 11
Memory IBM PC AT
which help produce chips that require less energy to 10 10 10 10 IBM PC
Transistors per Die
IBM PC XT
Microprocessor Cray 1 supercomputer Commodore 64
operate (discussed in more detail in this chapter). 10 9 10 9 DEC PDP 11/20
Second, we will work towards greater energy efficiency 10 8
10 8
of our ASML scanners (Environmental chapter). Third, 10 7 10 7 SDS 920
we will reduce the environmental impact of our manu- 10 6 10 6 Univac III (transistors)
facturing sites and systems and offer a safe and fulfilling 10 5 10 5 Univac III
Univac I
and gender (chapters: Suppliers, Environment, 10 3
10 3
EDVAC
Workplace and Careers and Health and Safety). 10 2 10 2 Eniac
10 1 10 1
The power of shrink 10 0 10 0
By executing our strategy successfully for the past
1970
1975
1980
1985
1990
1995
2000
2005
2010
1940
1950
1960
1970
1980
1990
2000
2010
25 years, ASML has enabled chip makers to:
Graph 1 This graphic of Moore’s Law shows how his prediction Graph 2Source: Lawrence Berkeley National Laboratory,
of transistor shrink has been realized over 40 years. Stanford University and Intel, 2009
Source: Intel
7,000 0
ciently. The second benefit is that every improvement in
Shire (phrama)
ASML (semiconductors)
Porsche (automotive)
UCB (pharma)
Lundbeck (pharma)
AstraZeneca (pharma)
Autonomy (software)
Sanofi-Aventis (pharma)
Nokia (telecom equipment)
Alcatel-Lucent (telecom equipment)
cost, size and energy efficiency of semiconductors opens 6,000
up new possibilities and markets for the use of advanced 1.896 Billion kWh
technology. While economic growth has become sub- 5,000
stantially less energy-intensive over the past decade,
1.242 Billion kWh
more benefits of technology substitution need to be 4,000
realized in order to cut absolute energy usage. In a study
commissioned by the Semiconductor Industry Associa- 3,000
tion, the Washington DC-based American Council for
2010
2014
2018
2022
2026
2030
an Energy-Efficient Economy (ACEEE) has found that
there is potential to reduce energy consumption from
the US Department of Energy’s reference scenario, as
Graph 3Future electricity scenarios for the USA Graph 4ASML second in European R&D per employee
shown in graph 3. Source: ACEEE Source: European Commission
450 35
400 30
350 25
300 20
250 15
200 10
150 5
0 0
1984 1989 1990’s 2000 2010
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
PAS 2000 PAS 5000 PAS 5500 Twinscan NXE EUV systems
Resolution: > 1um Resolution: <500 nm steppers/scanners Resolution: 100 to 38 nm Resolution: 32 < 20 nm
overlay: 250 nm overlay: 100 nm Resolution: 400 to 900 nm overlay: 20 to 4 nm overlay: 2 nm
overlay: 100 to 12 nm
Graph 5 ASML’s commitment to innovation Figure 1 Technology complexity - Litho tools portfolio
We currently focus our R&D investments on three A number of suppliers also carry out their own R&D. trends and customer requests. Customers are served
core programs, centered around current-generation cost- This significantly leverages ASML’s own R&D invest- by gaining early access to new lithography technology
efficient immersion, high-performance immersion and ments. ASML aims to increase supplier R&D over the at open research institutes where pre-competitive chip
next-generation Extreme Ultraviolet (EUV) technologies. coming years, enabling even faster and more efficient process development is carried out (more information
Performance has improved over the years, where our R&D. This means that ASML is at the heart of a coop on page 19) in order to help define roadmaps and
EUV architecture will take the smallest resolution we can erative knowledge network which improves competences determine efficient investments.
image to less than 20 nanometers (see figure 1). throughout the chain. ASML’s suppliers are set to
increase their R&D over the coming years in order to Business Continuity
To develop new products, ASML also works with univer continue and accelerate the industry’s innovation pace, In order to guarantee delivery of our long-term com-
sities and independent external research institutes which (see graph 6). mitment, we have had a Business Continuity policy
bring in specialist knowledge for specific projects. This and procedures since 2006. This was triggered by the
cross-fertilization increases development speed and Our collaborative approach to business is also reflected increasing demand from our customers for continuity
makes both ASML and its research partners stronger. In in the way we engage with suppliers and customers. planning and ASML’s objective to demonstrate respon-
EUV, for instance, research groups introduced knowledge Suppliers are treated as partners who receive insight into sible business behavior. In addition, the international
about vacuum technology while ASML expanded vacuum ASML’s planning and operations (more information on community was already working towards standardization
technology applications. page 24) so they can best prepare for global economic in the area of Business Continuity management.
4% 15%
Some examples of measures that prevent the loss of 9%
3% 3% 5%
resources that are critical to our key processes: 3%
10% 6%
• Redundancy in data centers for back-up and recovery
purposes of critical information technology applications
and data. R&D spending 2009 Expected R&D spending 2014
• Increased availability of remote working licenses to
ensure employees can continue working indepen Labor
dently if a particular ASML site is affected by a Material
Various
catastrophe.
ASML companies Brion and Optics
• Measures to prevent the H1N1 virus from spreading Philips, VDL and others
within ASML and to our customers/suppliers and Farm out (TNO, TUs, others)
to monitor the impact of the virus on the ASML Carl Zeiss
Cymer
workforce / available capacity.
• Redundancy in manufacturing capability for volume
Graph 6 R&D spending by external parties to be increased to 50% by 2014
products.
• Focusing on business continuity as an integral part of
ASML’s supplier selection and evaluation process.
Return to shareholders
Cash & cash equivalents 1,905 1,656 1,272 1,109 1,037
Each year, the Board of Management evaluates the Working capital 1 1,786 2,236 1,998 1,965 1,705
amount of dividend that will be proposed to the Annual Total assets 3,756 3,954 4,073 3,939 3,727
General Meeting of Shareholders. For 2008, a dividend Long-term debt 383 381 602 647 663
Shareholders’ equity 1,712 2,148 1,891 1,989 1,775
was declared of E 0.20 per ordinary share of E 0.09
which was paid in 2009.
Table 2 Five-year overview (in accordance with U.S. GAAP)
A proposal will be submitted to the Annual General With immersion becoming the cornerstone of the modern
1
orking capital is calculated as the difference between total
W
Meeting of Shareholders on March 24, 2010 to declare current assets, including cash and cash equivalents, and total chip factory, we have developed different immersion
an unchanged dividend for 2009 of E 0.20 per ordinary current liabilities. systems for different needs. We have optimized our
share of E 0.09. TWINSCAN XT immersion systems for cost-effective
imaging down to 40 nanometer patterning, while we
Overview of products ASML pioneered this “wet” technology and has expe- have simultaneously developed a new dual wafer stage
The foundation of our lithography scanners is our dual- rienced strong demand for immersion-based systems, system called TWINSCAN NXT with improved imaging,
stage wafer imaging platform – the TWINSCAN system – driven initially by NAND Flash solid state memory chip positioning and productivity. The NXT platform can
which we introduced in 2000 and which allows exposure makers which have aggressive shrink roadmaps to pattern features as small as 22 nanometers through the
of one wafer while simultaneously measuring the wafer reduce cost-per-memory function. Shrinking the feature so-called Double Patterning technique which requires
which will be exposed next. Our strong leadership in this sizes on chips by means of immersion systems has several exposures per layer on a chip. Imaging patterns
capability has allowed us to achieve the industry’s high- meanwhile been adopted by most of our customers in and lines between one another without creating contacts
est throughput, enabling reduced cost-per-exposure per all other semiconductor market segments, including is very demanding when it comes to the exact placement
wafer. ASML is the only lithography manufacturer that the DRAM memory chip and Logic chip segments as of lines and patterns, and this “overlay” requirement
has volume production based on dual stage systems. well as the Foundry contract chip manufacturers. With is uniquely served by our NXT planar wafer stage and
166 immersion systems shipped at the end of 2009, breakthrough grid metrology. Our first NXT:1950i shipped
Our innovative immersion lithography replaces air over our immersion technology is now widely accepted as in September 2009 and achieved overlay below the
the wafer with fluid, enhancing focus and enabling circuit the standard for critical layer high-volume chip manu- specification of 3 nanometers, which is only 12 silicon
line-width to shrink to even smaller dimensions than facturing, solidifying our technology leadership position atoms across, or the length that a human hair grows in
what is possible with “dry” lithography systems. worldwide. just half a second.
22% 27%
3%
9% 20%
12%
2%
30%
Source ASML
Resolution (nm)
listened very carefully to our customers and used their ASML system resolution
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
service called BRES.
Percentage
Litho as % of IC revenue
portfolio of corresponding systems for larger structures
Cost trend
on what is known as the “less critical” layers of a chip. 6.0
In this area, we compete by offering value through high
productivity and image stability, resulting in high yields 5.0
(yield = functioning chips per wafer).
4.0
4. Best imaging quality
However, offering customers the ability to project smaller 3.0
chip structures is not enough on its own, because litho-
graphic scanners also need to be able to position these 2.0
lines with great precision on the silicon wafers. This is
called “overlay” and typically accounts for a small per- 1.0
centage of the resolution. If the resolution of the smallest
structure is 40 nanometers, the overlay may need to 0
be as small as a few nanometers – one nanometer is a
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
millionth of a millimeter, or four silicon atoms in a row.
In addition to this stringent overlay requirement, the
consistency, or uniformity, of the structure is also impor- Graph 11Litho cost trend expected to continue to decline in 2010 and 2011
tant because the power running through chip circuits is Sources VLSI Research, ASML
world’s total semiconductor market. We shared the Technology leadership, manufacturing excellence,
top three satisfaction rankings with non-lithography and customer partnership are TSMC’s trinity of
producers, which means our customer satisfaction strength and the core values for its business
ratings surpassed every lithography competitor for the success. With its long standing strategic partner-
seventh year in a row. Survey participants rewarded ship and collaboration with TSMC, ASML has
ASML with the highest rating of 8.65 in technical leader- proven its commitment to deliver excellence in
ship, praising the company for being the “technical technology, best in class customer service and
leader in industry”. Since 1988, VLSI Research’s dedication to drive the success and improve
annual survey has provided chip makers such as Intel, competitiveness with our customers in the semi-
Samsung, Qualcomm, Texas Instruments and TSMC conductor industry.”
an opportunity to evaluate the equipment performance
and customer service of equipment suppliers. Source TSMC 2009
Environmental Impact
1 Energy
consumption of transistors on chips
The semiconductor manufacturing process requires produced by one production line for 1 year
several steps, the most important of which are the 1 (34 kilotonne of CO2)
0.5
0.4
0.3
0.2
0.1
0
AT:400
XT:400B
XT:400C
XT:400D
XT:400E
XT:450E
XT:400F
XT:450F
XT:400G
XT:450G
XT:400H
AT:7509A,B)
AT:850D
XT:760F
XT:850F
XT:860F
XT:800G
XT:850G
XT:860H
XT1000H
AT:1100B
AT:1150C
AT:1200B
AT:1200B - pep B
AT:1200B - pep C
AT/XT:1250D
XT:1250B
XT:1400E
XT:1400F
XT:1450G
XT:1450H
XT:1700Fi
XT:1900Gi
XT1950Gi
XT:1950Hi
NXT:1950i
NXT:1950i-pep 200
iLine (365 nm) KrF (248 nm) ArF (193 nm) ArF (193 nm)
Graph 12 Total nominal Power kW/wafers per hour (NXT: provisional and estimated data)
a new machine contains more computing and memory While a more energy-intensive EUV system will gradually
Energy (microjoule/bit)
1000
power than one from its predecessor. If we include the become the workhorse of the chip industry in the next
miniaturization capability of our machines, the next graph decade, the impact on total energy consumption of a 100
shows how much energy is needed to image the smallest production line to produce one transistor or memory cell
Introduction
feature on a chip. Over time, lithographic scaling has led will remain modest. ASML estimates that our scanners 10 of EUV
to an exponential reduction of energy needed to create account for a relatively small part of the total energy
transistors and memory cells. used by a chip maker – we estimate it at 2 to 3 percent 1
70
60
50
40
30
20
10
0
based on the performance of our current most advanced
Our new EUV scanner is expected to use significantly scanners in the field, growing to around 9 percent when Technology node (nm)
more energy, which is almost entirely related to the new EUV is introduced. The energy needed to produce one
EUV light source. However, as we explained earlier, complete, but much smaller, transistor will therefore Graph 13 Total energy to create a NAND memory cell
shrinking the size of transistors is the biggest contri continue its positive trend, as seen in graph 13. Total energy consumption per memory bit continues
to fall sharply with EUV
bution we can make to the environment, and EUV is Source ASML
the breakthrough technology which will take further
miniaturization well into the next decade.
x 1,000 m3
16.1 ultrapure water. EUV machines and lasers in Veldhoven
19.2
60 21.5 600 and Wilton require more cooling water than previous
machine types.
40 400
63.9 Waste water in Veldhoven and Wilton is discharged via
57.6
48.6
20 200 neutralization units. The level of acidity in the waste
water after passing through the neutralization units
0 0 is continuously monitored. In Veldhoven, the quality
2007 2008 2009 2007 2008 2009 of discharged waste water is checked annually by an
independent expert, according to legal requirements.
Graph 16 Total emissions of CO2 Graph 17 Tap water consumption
There was no violation of the legal waste water quality
CO2 direct (from purchased fuels) standards in 2009.
CO2 indirect (from purchased electricity)
Waste materials
ASML uses mainly non-hazardous materials to construct
For the calculation of the CO2 emissions from purchased Water consumption products, such as metals, glass, modest amounts of
fuels and purchased electricity, up-to-date emission ASML is committed to containing and reducing its water plastics and wiring. ASML machines are tested by pro-
factors have been used per production site. Even though consumption through comprehensive state-of-the-art cessing wafers as if in a real semiconductor factory. For
total energy usage in 2009 was stable in comparison re-use, recycling and other water reduction projects. the coating and development of these wafers, chemicals
with 2008, CO2 emissions increased by 4 percent (see All water used is tap water. Total water consumption at are used in process labs on ASML premises. The use of
graph 16). This was mainly due to increased electricity ASML increased by 20.8 percent in 2009 compared to these chemicals is monitored.
use at Veldhoven and the new production facility in 2008 (see graph 17). Water efficiency has deteriorated as
Linkou, Taiwan, which was partly offset by office closures a result of the increasing immersion and EUV production In its lithography machines, ASML uses gases for rinsing
in Tempe. In 2009, the ACE production facilities in Taiwan activities in our facilities at Veldhoven and Wilton, as well and conditioning purposes. In addition to XCDA (extra
started reporting their electricity use and accompanying as the data reported from our new ACE facility in Taiwan clean dry air) inert gases are used, such as nitrogen,
air emissions, which explains the increased emissions (table 7). Our increasingly popular immersion machines xenon, neon and helium. Hydrogen gas is also used in
in Asia (see table 6). use ultrapure water between the lens and the wafer (see the lithography machines for cleaning purposes. The use
economics – products section). This ultrapure water of these gases is monitored on a daily basis.
In 2009, ASML Netherlands B.V. acquired a NOx emission is produced by ASML itself with the help of a purifier. ASML strives to minimize waste and enhance efficiency
trade permit. In accordance with this permit, ASML
must monitor, measure, register, verify and report its
NOx emissions. The NOx emissions in Veldhoven in 2009
decreased by about 14.1 percent compared to 2008, Table 7 Tapwater consumption per region
from 54 x 103 kg to 45 x 103 kg. This decrease is purely (percent of total tap water consumption) 2007 2008 2009
128
The legal authorities in Connecticut were immediately customer’s premises for re-use, instead of returning
1.050 notified. The fitting was repaired that same day by them to headquarters in Veldhoven for cleaning and
153
the compactor’s waste hauling company. The legal repair. Local partners in Asia now prepare the containers,
700 121 authorities decided that no follow-up action was which are then used for shipments between chip makers
1.149 needed and no fine was incurred. in the region. This has resulted in fewer kilometers
950
350 675
traveled and a savings of E 372,000 in shipping costs
Logistics in 2009, which had a positive impact on CO2 emissions.
0 Logistics is not included in ASML’s CO2 official footprint This program will be expanded in 2010 and beyond.
2007 2008 2009 reported on page 31, but it is clear that we have a respon- We opened a distribution center for spare parts at
sibility to be efficient in our Logistics efforts. In 2009 Incheon airport in South Korea in 2009, which has two
Graph 18 Waste materials
- a downturn year - we shipped 82 systems, arranging beneficial impacts: it reduces delivery times of spare
Hazardous waste materials shipping for 49 systems, while our customers arranged parts to Asian customers by 16 to 30 hours, while also
Non-hazardous waste materials
shipping for the remaining 33. The shipment of one reducing intercontinental freight costs and CO2 emissions
Twinscan machine takes two specially designed aluminum because we can consolidate shipments.
Despite these adjustments, we have been able to offer Table 9 Workforce by region and gender Asia Europe USA Total
2,000
Product 577 122 224 128 474
1,600
Field Customer Support 2,317 914 420 531 1,865
1,200 Development & Engineering 1,567 18 1,299 276 1,592
800 Planning & Manufacturing 1,291 46 995 353 1,393
Supply Chain Management 420 53 234 64 351
400
Corporate Support 759 128 397 78 604
0 Industrial Engineering 10 232 27 269
Total 6,931 1,291 3,800 1,457 6,548
< 30 30-39 40-49 50-59 60+
The breakdown of ASML employees is shown in table 10 due to layoffs in Tempe, resulting from the closure of Despite the economic downturn, ASML was able to offer
by FTE distribution over the company’s main sectors. a facility there. The percentage of voluntary turnover job security to most of the payroll employees, as can be
dropped to 3.3 percent (compared to 4.5 percent during seen in graph 20. This illustrates that in a volatile, short-
In addition to the 6,548 payroll employees (in FTEs), 2008). The employee turnover per region is shown in cycle market, a relatively high fix – flex ratio provides more
there are 1,137 temporary employees (in FTEs), which is table 11. job security to our payroll employees.
14 percent less compared to 2008. The largest group of
employees is in Field Customer Support, which provides
9,000
Employees
Another knowledge transfer program is the international than the 7,000 attended training programs in 2008 and
training of ASML employees. In 2009, 214 colleagues is the result of a stricter training policy during 2009 me@ASML: first worldwide employee
from Asia and the US visited our headquarters in to anticipate the economic downturn and the need survey is a finger on the pulse
Veldhoven for training. These trainings last an average to reduce non-business-critical costs. This number In a year that put the company to the test on flex-
of 10 weeks per person. Knowledge transfer is executed excludes several broadly implemented Computer Based ibility, robustness and efficiency, ASML launched
in different areas. Training (CBT) offerings, i.e. on Intellectual Property a survey to chart the company’s strengths and
Awareness and on Anti-Trust. During 2009, we developed weaknesses in the eyes of its employees. Branded
Job-oriented training a CBT on Knowledge Protection that will be broadly me@ASML, the survey covered employee percep-
ASML’s philosophy on training is that 70 percent takes implemented in 2010. tion of a wide range of subjects, such as corporate
place “on the job” and 30 percent is achieved through culture, efficiency, management styles, interaction,
specific training and coaching. ASML encourages In 2009, ASML spent approximately E 1.8 million on non- work environment, and career development. This
employees to enhance their job-oriented skills by product-related training, amounting to almost E 275 per ‘finger on the pulse’ will enable the company to
attending training workshops or programs at accredited payroll employee. On average, each employee received very specifically define action plans for short,
educational institutions. These range from personal 16 hours of training. Due to the economic downturn in medium and long-term improvement in 2010.
effectiveness workshops and personal computer training 2009, training was reduced to what was business critical,
to technical, non-product-related education. During the which explains the reduction in training spending and With a worldwide response rate of 57 percent, or
first half of 2009, when business was slow, our employees training hours from 2008 to 2009. 4,343 participants, employees signaled ASML’s
in manufacturing spent significant time in internal trainings major strengths as being the high level of creative
for ASML’s newly developed products NXT and NXE. This Employee involvement freedom and flexibility, the exciting challenges
training time was facilitated by the Labor Time Reduction ASML is committed to keeping its workforce involved of working with world-class technology, and
support program. in its business decisions. In the Netherlands, consul the great collegiality and culture. But they also
tation and negotiation with employee representatives is indicated significant areas for improvement.
Since 2007, ASML has been using a worldwide Learning organized through the works council, as required by law.
Management System (LMS) to manage functional skills There is a roster of meetings throughout the year with These included more efficient work organization,
development for large groups of people in Customer works council representatives to discuss operations, better access to relevant job-related information,
Support and Manufacturing sectors. finance, governance and social issues with a variety of and enhanced career planning, which will be
corporate departments. Our employees are represented addressed by Human Resources representatives
Non-product-related training programs were attended in Korea by the Labor Management Council and in and senior management worldwide with action
over 4,200 times during 2009. This is a lower number France by the Commitée d’Entreprise. plans to be implemented starting in 2010.
BECO Group
The Netherlands
March 19, 2010
Environmental - Energy use - EVP Operations - Section: Environment - Section: Environment -Section: Health and Safety -Section: Governance
- Water use - Sustainability Board - Sustainability charter and Management;
- Emissions Environment ➔ Audit
- Effluents
- Waste
Labor - Employment - Board of Management - Section: Workplace - Complaints Procedure - Section: Health and Safety ➔ - Section: Governance
- Labor relations - HRM Officer & Careers; and Management;
- Occupational Health & Safety Health and safety Health and Safety ➔
- Training & Education Management system
- Diversity - Whistleblower’s
Procedure
Human Rights - Non-discrimination - Legal Officer - Section: Governance and - Principles of Ethical Business - Section: Governance and -Three Complaint
- Freedom of Association Management ➔ ASML Code Conduct and Internal Guidelines Management ➔ ASML Code Committees
- Complaints of Conduct - Complaints Procedure of Conduct
Society - Community -Board of Management - Section: Governance and - Anti Fraud Policy -Section: Corporate Profile ➔ - Section: Governance
- Corruption -Legal Officer Management ➔ ASML Code - Principles of Ethical Business Governance and Management ➔ and Management ➔
- Public policy of Conduct Conduct and Internal Guidelines Governance ASML Code of Conduct
- Anti-Competitive behavior - Whistleblower’s procedure
- Compliance
Product - Customer Health & Safety -EVP Operations - Section: Customers ➔ - Section: Customers ➔ - Section: Health and Safety ➔ - Section: Health and
Responsibility - Labeling Customer relationship Customer relationship Safety ➔ Management
- Communications management management system
- Compliance
Organizational profile
Reporting parameters
PR 1 Improving health and safety impacts across Supply Chain – Sustainable Supply Chain;
the life cycle Health and Safety
PR 3 Product information and labeling ASML systems have extensive manuals covering all aspects of operation
PR 6 Marketing communications Practices comply with SEMI industry organization
PR 9 Monetary value of significant fines None in 2009
Corporate Headquarters
De Run 6501
5504 DR Veldhoven
The Netherlands
Mailing address
P.O. Box 324
5500 AH Veldhoven
The Netherlands
Corporate Communications
Tel: +31 40 268 7870
E-mail: corpcom@asml.com
Investor Relations
Tel: +31 40 268 3938
E-mail: investor.relations@asml.com