Hplc1050 Service Manual

1050 Series of HPLC
Modules
Service Handbook
Agilent Technologies
Hewlett-Packard-Strasse 8
76337 Waldbronn
Germany
Copyright Agilent
Technologies 2001
All rights reserved.
Reproduction, adaption,
or translation without
prior written permission
is prohibited, except as
allowed under the
copyright laws.
Part No. NONE
09/2001
Printed in Germany
Warranty
The information
contained in this
document is subject to
change without notice.
makes no warranty of
any kind with regard to
this material,
including, but not
limited to, the implied
warranties or
merchantability and
fitness for a particular
purpose.
shall not be liable for
errors contained herein
or for incidental or
consequential damages
in connection with the
furnishing, performance,
or use of this material.
IMPORTANT NOTE
This version of the 1050
service manual includes
all sections from the
01050-90102 edition 4
(1995).
The series I opticals
information (79854A
MWD and G1306A DAD)
and the 79853A VWD
information has been
removed (products went
out of support during
2000).
Part numbers have been
updated as of 09/2001.
Contact your local
Agilent support office in
case of part number
issues or upgrades.
The latest version of this
manual is available as
Adobe Acrobat Reader
(PDF) version only and
can be downloaded from
the Agilent Technolgies
web page
www.agilent.com.
Contents
Service Handbook for 1050 Series of HPLC Modules - 09/2001 3
1 Common: General Information
This chapter provides general information about the 1050 Se-
ries of HPLC Modules 29
Safety Information 30
General 30
Operation 30
Safety Symbols 32
Radio Interference 33
Manufacturers Declaration 33
Sound Emission 33
Manufacturers Declaration 33
UV-Radiation 34
Solvent Information 35
Flow Cell 35
Solvents 35
1050 Introduction 36
The Modules Overview 36
1050 Identification 38
Repair Policy 38
2 Common: Electronic Information
This chapter provides common electronic information about
the 1050 Series of HPLC Modules 39
Overview 41
Common Main Processor Board (CMP) 42
Common 1050 Functions 42
CMP Details 44
Remote Control 47
4 Service Handbook for 1050 Series of HPLC Modules - 09/2001
Contents
Firmware Board (FIM) 53
Firmware Description 53
Fluorescent Indicator Module (FIP) 55
External Contacts 56
Power Supply (DPS-B / DPS-A) 57
General Description 57
Base Supply (DPS-B) 58
Lamp Supply (DPS-A) 60
Communication Interface (CIB / CRB) 64
3 Common: Cable Information
This chapter provides information on cables for the 1050
Modules 67
Overview 68
Analog Cables 70
Remote Cables 72
BCD Cables 77
4 Pumps: General Information
This chapter provides general information about the 1050
Pumps 83
Introduction 84
About this Manual 84
About the Pumps 85
Repair Policy 85
Product Structure 86
Contents
Capillaries 87
Specifications 88
5 Pumps: Hardware Information
This chapter provides hardware information about the 1050
Pumps 91
Overview 93
How does the Pump Work? 95
Isocratic Operation 95
Gradient Operation 96
Overview of the Electronics 96
Overview of the Flow Path 98
Solvent Cabinet 99
Helium Degassing 99
Manual Injection Valve 100
Column Heater 100
Multi Channel Gradient Valve (MCGV) 102
Metering Drive Assembly 103
Pump Head Assembly 104
Continuous Seal Wash 105
Active Inlet Valve 107
Outlet Ball Valve 108
Frit Adapter Assembly 109
Purge Valve 110
High Pressure Damper 111
Column Holder 112
Contents
6 Pumps: Electronic Information
This chapter provides electronic information about the 1050
Pumps 113
Overview 115
Pump Drive Control Board (PDC2) 118
Relative A/D Converter Board (RAD) 123
Firmware Board (SFW) 127
HRI Board - Heater Isocratic Board 128
Heater Quaternary Board (HRQ) 131
High Pressure Transducer Board (HPT) 134
Connector Board (CON) 136
Pump Motherboard (HPS) 138
7 Pumps: Diagnostic Information
This chapter provides information on error messages and di-
agnostic features of the 1050 Pumps 143
How to use the Diagnostic Test Functions 145
Pump Pressure Ripple 146
Flow (Pressure) Tests 147
Prerequisites for the Pressure Tests 148
Normal Pressure Test 149
The Modified Pressure Test 150
Flow Test Method 151
Flow Test Method - Firmware Rev. 1.0 152
Flow Test Method - Firmware Rev. 3.0 and above 157
Gradient Test Method 159
Prerequisites for the Gradient Test Method 159
Running the Gradient Test Method 159
Contents
Error Messages 162
Selftest 163
ROM/RAM Test 163
Panic Error / Bus Error Address Error 164
Common 1050 Error Messages 165
Pump Initialization Error Messages 167
Normal Operation Error Messages 171
Column Heater Error Messages 175
Online Monitor Messages 177
Troubleshooting Hints 180
Standard Pressure Tests with different Solvents 181
Modified Pressure Tests 181
Pressure Tests - Firmware Revision 1.0 182
Pressure Tests - Firmware Revision 3.0 and above 184
Pressure Tests when the Pump is broken 185
Pressure Tests - Leak at Piston Seal 1 186
Pressure Tests - Leak at Piston Seal 2 189
Pressure Tests - Defective Piston 1 192
Pressure Tests - Defective Piston 2 196
Pressure Tests - Defective Active Inlet Valve 200
8 Pumps: Maintenance Information
This chapter provides provide procedures for service and main-
tenance of the 1050 Pumps 203
Solvent Cabinet and Column Heater 205
Replacing the Heat Exchanger 205
Replacing the Cable Assembly 206
Replacing the Active Inlet Valve 207
Contents
Replacing the Outlet Ball Valve 209
Maintaining the Frit Adapter Assembly 210
Maintaining the Purge Valve 211
Maintaining the Pump Head Assembly 212
Procedure 1: Pump Head with old Plunger Housing 213
Stage 1: Removing the Pump Head Assembly 213
Stage 2: Disassembling the Pump Head assembly 213
Stage 3: Replacing the Seals 214
Stage 4: Disassembling the Plunger Housing 215
Stage 5: Reassembling the Plunger Housing 216
Stage 6: Reassembling the Pump Head Assembly 217
Stage 7: Mounting the Pump Head Assembly 217
Procedure 2: Pump Head with new Plunger Housing 218
Stage 1: Removing the Pump Head Assembly 218
Stage 2: Disassembling the Pump Head Assembly 218
Stage 3: Replacing the Seals 219
Stage 4: Reassembling the Pump Head Assembly 220
Stage 5: Mounting the Pump Head Assembly 220
Continuous Seal Wash Option 221
Replacing the Fan 222
Removing the Metering Drive Assembly 223
9 Pumps: Parts Information
This chapter provides information on parts of the 1050
Pumps 225
Electronic Boards 227
Complete List of Ti-Parts 229
Solvent Cabinet 230
Contents
Solvent Cabinet with Helium Degassing 232
Solvent Cabinet with Column Heater and Manual Injection
Valve 234
Overall Diagram 236
Hydraulic Flow Path 240
Metering Drive Assembly 243
Pump Head Assembly (old version) 244
Pump Head Assembly (new version) 245
Pump Head Assembly with Seal Wash 246
Active Inlet Valve 248
Frit Adapter Assembly 250
Purge Valve Assembly 251
Column Holder Assembly 252
Special Tools 253
10Pumps: Additional Information
This chapter provides additional information about the 1050
Pumps 255
Product History 257
Firmware History 259
Revision 1.0 259
Revision 3.0 259
Revision 3.1 260
Revision 3.2 260
How does the On-line Monitor work 261
Normal Operation 262
M2 Gas Bubble 263
M4 Leak at first Piston 265
Contents
M6 Valve Backflow 266
M8 Outlet Valve Problem 267
If You Need Operational Hints 268
Helium Degassing Principle 269
Helium Regulators 269
Bottle Head Assembly 270
Isocratic Pumps 270
Pump Head Assembly 271
PDC Board 271
PDC2 Board 271
HRQ Board 272
GVD Board 272
Wear Retainer 272
Flow Test Method 273
Method loading 273
Flow Gradients 273
Manual Injection Valve 273
Metering Drive Repairs 274
Troubleshooting E27 Errors (Max Motor Drive Power Exceeded) 275
Piston with Conical Holder 276
Ghost Leak messages 276
PANIC Errors 276
11Sampler: General Information
Autosampler 281
About this Manual 282
About the Autosampler 282
Repair Policy 283
Contents
Product Structure 283
Capillaries 284
Specifications 285
12Sampler: Hardware Information
Autosampler 287
Overview 289
Solvent Flow Path 290
How Does The Autosampler Work? 291
The Injection Sequence 293
What happens when the 18596L/M Sample Tray is
connected? 294
Overview of the Electronics 295
Sampling Unit 297
Metering Drive 299
Analytical Head Assembly 300
High Pressure Switching Valve 301
Pneumatic Assembly 302
Actuator Air Solenoids 303
Additional 100 Sample Capacity 304
13Sampler: Electronic Information
Autosampler 307
Overview 309
Contents
Max Tray Drive Board (MTD) 312
Needle Mini Tray Drive Board (NMD) 316
Valve Metering Drive Board (VMD) 320
Autosampler Motherboard (ALM) 325
Extender Test Board (ET) 330
14Sampler: Diagnostic Information
agnostic features of the 1050 Autosampler 333
Single Steps 335
Entering the Test Functions 335
Single Steps For The 21 Sample Tray 336
Single Steps for the 100 Sample Tray 338
Entering the Additional Single Steps 338
18596L/M Sample Tray Diagnostic Mode 340
Entering Diagnostic Mode 340
Z Test (Gripper Assembly) 340
R Test (radial arm movement) 341
Theta Test (angular movement) 341
Error Messages 342
Selftest 343
Panic Error 343
Error Messages for Firmware Revision 4.0 and greater 346
Injector Program Error Messages 350
Normal Operation Messages for Firmware Revision 3.1 and
below 351
Events Messages 354
Contents
18596L/M Vial Tray 355
15Sampler: Maintenance Information
tenance of the 1050 Autosampler 357
Sampling Unit 359
Stage 1: Removing the Sampling Unit 359
Stage 2: Removing the Needle 360
Stage 3: Installation of the Needle 361
Stage 4: Removing the Seat Capillary 361
Stage 5: Disassembling the Needle Arm 362
Stage 6: Reassembling the Needle Arm 362
Stage 7: Disassembling the Tray Mechanic 363
Metering Device 365
Removing the Metering Device 365
Removing the Gear Belt 365
Analytical Head Assembly 366
Procedure 1: Analytical Head Assembly with old Adapter Housing 366
Procedure 2: Analytical Head with new Adapter Housing 369
Reassembling the Metering Device 371
Stage 1: Removing 372
Stage 2: Disassembling 372
Adjust the Sensors 374
Service Only Level 374
Sensors of the Sampling Unit 376
Sensor of the High Pressure Switching Valve 379
Metering Device Home Sensor 380
Contents
16Sampler: Parts Information
This chapter provides information on parts of the 1050
Autosampler 381
Electronic Boards and Fuses 383
Electronic Boards 383
Fuses 383
Complete List of Ti-Parts 384
Overall Diagram 79855A/B 385
Hydraulic Flow Path 389
Sampling Unit 391
Arm Assembly Spare Parts 395
Metering Drive and Analytical Head 396
Metering Drive 396
Analytical Head (Old Version) 396
Pneumatic Valve Assembly 401
17Sampler: Additional Information
Autosampler 403
Product History 405
Firmware Revisions 406
Firmware Revision 1.0 406
Contents
If you update the firmware to revision 4.0 and greater 412
If you add a 100 vial tray to the autosampler 412
If you have Intermittant E17: Needle cannot move out of vial 413
If you have to update the autosampler with a fan 413
If the fan in the autosampler does not work properly 413
If the needle lifts the vial out of the tray 414
If the injections are not reproducible (grooved needle) 414
18DAD/MWD: General Information
This chapter provides general information about the 1050 Di-
ode Array and Multiple Wavelength Detectors 419
About the Detector 420
General 420
Repair Policy 420
Identification 421
Compatibility 421
DAD Differences 422
Added features 422
Removed features from local keyboard 422
Restrictions of user interface 423
Compatibility 423
Local User Interface 424
Workstation Interface 426
Test Functions 428
Options 428
Specifications DAD/MWD 429
Contents
19DAD/MWD: Hardware Information
This chapter provides hardware information about the 050 Di-
ode Array and Multiple Wavelength Detectors 433
Overview: Optical System 435
Overview: Electronics 436
Optical Unit 438
Flow Cell Assemblies 439
Slit Assembly 441
Deuterium Lamp Assembly 442
Heat Exchanger Assembly 444
Shutter Assembly 445
Leak Sensor Assembly 446
Fans 447
20DAD/MWD: Electronic Information
Diode Array and Multiple Wavelength Detectors 449
Overview 451
Array Signal Conversion Board (ASC) 454
Data Acquisition Board (AQB) 459
Common Main Processor Board (CMP) 464
Remote Control 466
Communication Interface (CRB) 467
Digital to Analog Conversion Board (DAC) 468
Fluorescent Indicator Module (FIP) 472
Motherboard (LUM) 473
LPC Board 477
Contents
Power Supply (DPS-A) 478
21DAD/MWD: Diagnostic & Troubleshooting Information
agnostic features of the 1050 Diode Array and Multiple Wave-
length Detectors 483
STATUS Information 485
Status Modes 485
Status LEDs 486
Warnings 486
Error Messages 487
Selftest 487
1050 DAD/WMD Error Messages 490
Diagnostic Features 493
Entering the Test Functions 493
Measure Intensity Profile 494
Lamp Intensity Test 496
Measure Holmium Spectrum 498
D/A Converter Test 500
Electronic Noise Test 502
Check of Wavelength Calibration 504
ASC Test 505
Shutter Position 506
ROM/RAM/DISPLAY Tests 507
Using the Built-in Test Chromatogram 508
How to print the DAD Profiles 510
Contents
22DAD/MWD: Maintenance Information
tenance of the 1050 Diode Array and Multiple Wavelength
Detectors 513
Tools Needed 514
Warnings and Notes 515
Removing the Optical Unit 516
Flow Cell Maintenance 517
Flushing Procedure 517
Replacements on Standard Flow Cells 518
Replacements on High Pressure Flow Cells 520
Lamp House Window Maintenance 522
Removing the Quartz Window 522
Replacing the Achromat 524
Replacing Fans 525
Replacement of Shutter or LPC Board 526
Replacement of Leak Sensor 527
Upgrade to from 79854A MWD to G1306A DAD 528
Upgrade MWD with Series II Optical 529
Verifying the Performance 530
Specifications 530
What You Need 530
Preparations 530
Scaling Factors 532
23DAD/MWD: Parts Information
This chapter provides information on parts of the 1050 Diode
Array and Multiple Wavelength Detectors 533
Contents
Overall Diagram 535
Optical Unit 538
Heat Exchanger and Flow Cell 540
Flow Cell Parts (STD-SST) 541
High Pressure Flow Cell Parts (HP-STD-SST) 542
High Pressure Flow Cell Parts (HP-Micro-SST) 543
Cell Repair Kits 544
Lamp Housing 545
Upgrade Parts MWD to DAD 546
Upgrade Parts MWD to Series II Optical 547
List of Accessories 548
24DAD/MWD: Additional Information
Diode Array and Multiple Wavelength Detectors 549
Product History 551
Hardware Changes 551
Firmware Changes 552
Known Problems 553
Panic Errors 553
25VWD: General Information
Variable Wavelength Detectors 559
About the Detector 561
Versions vs. Support Periods (EOS) 561
Contents
79853A 561
79853C 561
Repair Policy 562
Specifications 563
26VWD: Hardware Information
Overview 566
Optical System Overview 568
Leak Interface Assembly 569
Fan Assemblies 571
Optical Unit 572
Flow Cells 573
Deuterium Lamp 576
Photodiodes Assemblies 579
Filter Assembly 580
Grating Assembly and Motor 581
Mirrors 582
Slit Assemblies 582
Beam Splitter 582
Enhanced Optical Unit (D) 583
27VWD: Electronic Information
Contents
Location of Electronic Assemblies 587
Interconnection Diagram 589
Detector Controller Board (DCB) 590
Digital Section 592
Analog Sections 594
Power Supply (DPS-A) 601
Keyboard 602
Keyboard Electronics (KDI / VFD) 603
Pre-Amplifier Boards 605
Power Supply Connection Board (PSC) 606
GPIB Communication Interface 607
GPIB Firmware Revisions 608
28VWD: Diagnostic & Troubleshooting Information
agnostic features of the 1050 Variable Wavelength
Detectors 609
Self Diagnosis 611
During Power On 611
During Normal Operation 611
Error Messages Before Lamp Ignition 612
At Power ON 612
Error Messages After Lamp Ignition 616
Error Messages During Normal Operation 617
Error Messages During Use of Control Functions 619
User Control Functions 620
Service Control Functions 622
Entering the Service Mode 622
Zero Order Calibration 624
Contents
Wavelength Calibration 626
Wavelength Calibration Check 628
SET WL Parameter 629
Fix Signal 631
Leak Sensor Voltage 634
Voltage Test 635
ADC Noise 636
Grating Photo Sensor 637
Filter Photo Sensor 638
Remote Test 639
Filter Check 640
Zero Order Test 641
DAC Test 642
Pre-amplifier Gain 644
EEROM Test 645
DAC Calibration 646
Wavelength Compensation 647
29VWD: Maintenance Information
tenance of the 1050 Variable Wavelength Detectors 649
Warnings 650
Securing for Transport 651
Replacement of Deuterium Lamp 652
Step 1: Replacement 652
Step 2: 0th Order Calibration 653
Step 3: WL CALIBRATION 654
Flow Cell Maintenance 655
Flow Cell Maintenance Kits 655
Replacing Cell Parts 655
Contents
Flushing Procedure 656
Leak Test 657
Using the Cuvette Holder 658
Replacing DCB Board and Firmware 661
DCB Board 661
DCB Firmware 661
Replacing Display Boards 662
Replacing the Leak Interface 663
Leak Interface 664
Replacements in the Optical Unit 665
Removing the Optical Unit 666
Replacing the PSC Board 667
Replacing Pre-amplifiers or Photodiodes 667
Replacing Grating Assembly Parts 668
Replacing Filter Assembly Parts 670
Replacing Mirrors, Beamsplitter and Slits 670
Optical Alignment Procedures 671
Procedure 1: Simple Alignment 671
Procedure 2: Sample Beam Alignment 672
Procedure 3: Reference Beam Alignment 674
Cleaning of Optical Unit Parts 675
Upgrade to GPIB 676
Performance Verification 677
What you need 677
Preparations 677
Starting a run 678
Scaling Factors 679
30VWD: Parts Information
This chapter provides information on parts of the 1050 Vari-
Contents
able Wavelength Detectors 681
Overall Diagram 683
Front Panel Parts 686
Leak Interface 686
Font Panel 687
Optical Unit C 688
Optical Unit C Inner Parts Top 689
Optical Unit C Inner Parts Bottom 690
Grating Assembly 691
Filter Assembly 692
Standard Flow Cell C (SST/Ti) 693
Semi-Micro Flow Cell (SST) 695
High Pressure Flow Cell (SST) 696
Ultra High Pressure Flow Cell (SST) 697
Preparative Flow Cell (Ti) 698
Cuvette Holder 700
Accessories 701
Screws 702
31VWD: Enhanced Optical Unit Information
This chapter provides information about the enhanced optical
unit D 705
Compatibility 706
Support of Previous Optical Units 706
Introduction 707
Support Considerations 708
Prefix Change 708
Identification 708
Contents
Compatibility Matrix 708
Part Numbers for Enhanced D Optical Unit 709
Standard Flow Cell D Repair Parts 710
Repair and Mainenance 711
Tools required: 711
Pre-requisites: 711
Additional Information 712
Replacements and Calibrations 712
Installing the Test Slit 713
Replacing Mirror #1 Assembly 715
Replacing Mirror #3 or #4 Assembly 716
Replacing the Grating or Grating Motor 718
Replacing the Beam Splitter 720
Cleaning or Replacing the Lens 721
Unlocking the Reference Aperture 723
Optimizing the Reference Readings 725
Installing the Standard Slit 726
32VWD: Additional Information
Product History 729
Prefix Changes 729
DCB ROM Firmware Revisions 731
GPIB ROM Firmware Revisions 733
Hardware Changes and Service Notes 734
Modified Pre-Amplifier Gain 734
Important Service Note 734
Contents
1050 Series of HPLC

Modules
Service Handbook -
Common Information
76337 Waldbronn
Germany
Copyright Agilent
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
The information
contained in this
this material,
including, but not
warranties or
merchantability and
purpose.
IMPORTANT NOTE
01050-90102 edition 4
(1995) and G1306-90102
edition 2 (May 1994). It
merges both sections,
the MWD and the DAD.
information (79854A
MWD) information has
been removed (product
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
1
1 Common: General Information
This chapter provides general information about
the 1050 Series of HPLC Modules
Common: General Information
Safety Information
Safety Information
The following general safety precautions must be observed during all phases
of operation, service, and repair of this instrument. Failure to comply with
these precautions or with specific warnings elsewhere in this manual violates
safety standards of design, manufacture, and intended use of the instrument.
Agilent Technologies assumes no liability for the customers failure to comply
with these requirements.
General
This is a Safety Class I instrument (provided with terminal for protective
earthing) and has been manufactured and tested according to international
safety standards.
Operation
Before applying power, comply with the installation section. Additionally the
following must be observed.
Do not remove instrument covers when operating. Before the instrument is
switched on, all protective earth terminals, extension cords,
auto-transformers, and devices connected to it must be connected to a
protective earth via a ground socket. Any interruption of the protective earth
grounding will cause a potential shock hazard that could result in serious
personal injury. Whenever it is likely that the protection has been impaired,
the instrument must be made inoperative and be secured against any
intended operation.
Make sure that only fuses with the required rated current and of the specified
type (normal blow, time delay, and so on.) are used for replacement. The use
of repaired fuses and the short-circuiting of fuseholders must be avoided.
Some adjustments described in the manual, are made with power supplied to
the instrument, and protective covers removed. Energy available at many
points may, if contacted, result in personal injury.
Any adjustment, maintenance, and repair of the opened instrument under
voltage should be avoided as much as possible. When inevitable, this should
be carried out by a skilled person who is aware of the hazard involved. Do
not attempt internal service or adjustment unless another person, capable of
Safety Information
rendering first aid and resuscitation, is present. Do not replace components
with power cable connected.
Do not operate the instrument in the presence of flammable gases or fumes.
Operation of any electrical instrument in such an environment constitutes a
definite safety hazard.
Do not install substitute parts or make any unauthorized modification to the
instrument.
Capacitors inside the instrument may still be charged, even though the
instrument has been disconnected from its source of supply. Dangerous
voltages, capable of causing serious personal injury, are present in this
instrument. Use extreme caution when handling, testing and adjusting.
When working with solvents please observe appropriate safety procedures
(for example, goggles, safety gloves and protective clothing) as described in
the material handling and safety data sheet by the solvent vendor, especially
when toxic or hazardous solvents are used.
Safety Information
Safety Symbols
Table 1 shows safety symbols that are used on the instrument and in the
manuals.
WARNI NG A warning alerts you to situations that could cause physical injury or
damage to the equipment. Do not proceed beyond a warning until you
have fully understood and met the indicated conditions.
CAUTI ON A caution alerts you to situations that could cause a possible loss of data. Do
not proceed beyond a caution until you have fully understood and met the
indicated conditions.
Table 1 Safety Symbols
Symbol Description
The apparatus is marked with this symbol when the user should refer to the
instruction manual in order to prevent risk of harm to the operator and protect
the apparatus against damage.
Indicates dangerous voltages.
Indicates a protected ground terminal.
Eye damage may result from directly viewing the light produced by the
deuterium lamp used in this product. Always turn off the deuterium lamp
before opening the metal lamp door on the side of the instrument.

Radio Interference
Radio Interference
Manufacturers Declaration
This is to certify that this equipment is in accordance with the Radio
Interference Requirements of Directive FTZ 1046/1984. The German
Bundespost was notified that this equipment was put into circulation, the
right to check the series for compliance with the requirements was granted.
Test and Measurement
If test and measurement equipment is operated with equipment unscreened
cables and/or used for measurements on open set-ups, the user has to assure
that under operating conditions the radio interference limits are still met
within the premises.
Sound Emission
Manufacturers Declaration
This statement is provided to comply with the requirements of the German
Sound Emission Directive of 18 January 1991.
This product has a sound pressure emission (at the operator position)
< 70 dB.
Sound Pressure Lp < 70 dB (A)
At Operator Position
Normal Operation
According to ISO 7779:1988/EN 27779/1991 (Type Test)
UV-Radiation
UV-Radiation
Emissions of ultraviolet radiation (200-315 nm) from this product is limited
such that radiant exposure incident upon the unprotected skin or eye of
operator or service personnel is limited to the following TLVs (Threshold
Limit Values) according to the American Conference of Governmental
Industrial Hygienists:
Typically the radiation values are much smaller than these limits:
Table 2 UV-Radiation Limits
Exposure/day Effective Irradiance
8 hours
0.1 W/cm
2
10 minutes
5.0 W/cm
2
Table 3 UV-Radiation Typical Values
Position Effective Irradiance
Lamp installed, 50-cm distance
average 0.016 W/cm
2
Lamp installed, 50-cm distance
maximum 0.14 W/cm
2
Solvent Information
Solvent Information
Observe the following recommendations on the use of solvents.
Flow Cell
Long term operation at pH > 11 should be avoided. Never leave strongly
alkaline solutions in the flow cell without flow.
Solvents
Always filter solvents through 0.4 m filters, small particles can permanently
block the capillaries. Avoid the use of the following steel-corrosive solvents:
Solutions of alkali halides and their respective acids (for example, lithium
iodide, potassium chloride, and so on).
High concentrations of inorganic acids like sulfuric acid, especially at
higher temperatures (replace, if your chromatography method allows, by
phosphoric acid or phosphate buffer which are less corrosive against
stainless steel).
Halogenated solvents or mixtures which form radicals and/or acids, for
example:
2CHCl
3
+ O
2
2COCl
2
+ 2HCl
This reaction, in which stainless steel probably acts as a catalyst, occurs
quickly with dried chloroform if the drying process removes the
stabilizing alcohol.
Chromatographic grade ethers, which can contain peroxides (for example,
THF, dioxane, di-isopropylether) such ethers should be filtered through
dry aluminium oxide which adsorbs the peroxides.
Solutions of organic acids (acetic acid, formic acid, and so on) in organic
solvents. For example, a 1-% solution of acetic acid in methanol may attack
steel.
Mixtures of carbon tetrachloride with 2-propanol or THF dissolve stainless
steel.
1050 Introduction
1050 Introduction
The Modules Overview
1050 is a series of HPLC products based on a modular concept. The
necessary functions are broken down into independent stand-alone modules
with standardized external design hydraulic- and external interfaces.
Following modules will be available at introduction:
Table 4 1050 Modules
Module Product Number
1050 Isocratic Pump 79851A
1050 Quaternary Pump 79852A
1050 Quaternary Pump (bio compatible) 79852B
1050 Variable Wavelength Detector 79853C
1050 Multiple Wavelength Detector 79854A
1050 Diode Array Detector G1306A
1050 Autosampler 79855A
1050 Autosampler (bio compatible) 79855B
1050 Introduction
Figure 1 1050 Modules
1050 Introduction
1050 Identification
Each module is identified by a 5 digit product number and a 10 unit serial
number on a label attached to the wall inside the module. The first four digits
of the serial number are the serial prefix. The letter identifies the country of
origin. The last five digits are an identification number unique to each
module. Any changes to the modules will be covered initially by Service
Notes. They will be sent out to all Service personnel prior to implementation
of the change to the instrument. With every reprint these changes will be
incorporated into the documentation.
Repair Policy
Major mechanical and electrical assemblies inside the 1050 modules will be
repaired on an assembly-exchange level. All other items have to be repaired
on board/component level. Repair procedures are given in the respective
sections of this manual (refer to Table of Contents). Assemblies can be set up
to the Blue Stripe Exchange system or can be removed. If in doubt contact
Waldbronn Product Support (Europe/ICON) or Little Falls Product Support
(USA/Canada).
2
2 Common: Electronic Information
This chapter provides common electronic
information about the 1050 Series of HPLC
Modules
Common: Electronic Information
This chapter gives information about the common electronics used in more
than one of the 1050 Series of modules:
Overview
Common Main Processor (CMP)
Remote Control
Firmware Boards (FIM, SFW)
Fluorescent Indicator Module (FIP)
External Contacts
Poweer Supplies (DPS-B, DPS-A)
Communication Interfaces (CIB, CRB)
Overview
Overview
Some of the electronic boards are used in more than one 1050 module.
The following table shows common electronic assemblies:
Table 5 Common Electronic Boards
Description Modules Part Number Exchange
Power Supply (DPS-B) pump, sampler 5061-3374 01050-69374
Power Supply (DPS-A) MWD, DAD, VWD 5061-3375 01050-69375
Common Main Processor (CMP) pump, sampler, MWD, DAD 5061-3380 01050-69580
Display Interface Board (FIP) pump, sampler, MWD, DAD 5061-3376 no
Communication Interface (CIB) pump, sampler 5061-3382 no
Communication Interface (CRB) MWD, DAD 5062-2482 no
Common Main Processor Board (CMP)
Repair Level: Board
Common 1050 Functions
display handling
keyboard polling
remote control input and output
leak sensing
option interfacing
time programming
method storage
module configuration
memory switching
32 kbyte RAM with battery back-up for parameter storage.
Table 6 Part Numbers for CMP Board
Item Part Number
CMP Board (Exchange) 01050-69580
CMP Board (NEW) 5061-3380
Figure 2 Blockdiagram CMP
According to the above functions the main processor board contains some
basic hardware which is common to all 1050 modules:
68008 main processor running at 8 MHz;
64 kByte RAM (32 kbyte RAM with battery back-up for parameter storage.
The data will be lost when CMP is removed from the slot);
interrupt logic for system communication;
3 channel software controlled timer;
interface to keyboard/display module;
remote I/O hardware;
leak sensor electronics;
interface to backplane bus;
watchdog hardware.
Firmware is not part of this board, because parts of the main processors
software are module specific. The main processor firmware will be located
on the personality module (AQB-, RAD, VMD-Board) or on an optional
board.
CMP Details
Interrupt system
There are one non-maskable interrupt six high priority hardware interrupt
lines and seven low priority mail interrupt lines. The non-maskable interrupt
is connected to the powerfail line of the power supplies (DPS-A/B).
The high priority interrupt lines are: One from timer 6840 for hardware
synchronization and five from remaining slots (these lines are disabled by
SOK- = HIGH (system not ok).
The low priority interrupt lines are: Five lines from all slots except power
supply used for communication with local processors via dual port RAMs and
two lines for CMP controlled software interrupts.
Watchdog timer
(Test for CPU hang-up) This circuitry is software retriggerable and is
disabled during CPU initialization. In case of CPU hang-up SOK line is set the
CPU is halted and the remote line shutdown is set.
LED on board
There is a RED LED on the board which is the output of the watchdog circuit.
It is ON during initialization and when the processor has a hang-up (LD 101).
Programmable timer
It includes 3 independent timers:
Timer 1 is connected to the backplane bus its free for module special use.
Timer 2 is used as software timer for the CMP.
Timer 3 is used to generate the BUS ERROR signal.
Reset system
A harware reset is performed
at power
manually by on-board switch
Hardware reset will reset all devices connected to the bus but main
processor can reset these devices by software too.
Reset for display unit
The latch for the status LEDs and the brigthness control will not be reseted
by power on or by software reset. The alphanumeric display is reseted at
power on.
I/O
Two remote connectors are at the rear panel. They provide start, stop, not
ready, shutdown, prepare-run and power on signals. The remote lines are
input and output and are decoupled for EMC. The shutdown line is set by
hardware in the case of leak or CPU hang-up.
System control
The POK (peripheral OK) is driven from all devices. The SOK- (system OK)
is outputted from main processor to all devices;
is hardware and software controlled
disables/enables all devices by main software;
disables all devices if main processor watchdog becomes active (main
processor hang-up);
All devices are enabled after initialization. Bus control After bus request the
main processor will pass bus control to the requesting external controller.
The local main processor areas including I/O are accessible too.
This may be a feature for diagnostics or if data rate is increasing to much
with later options. For this second case an external fast transfer hardware
(for example DMA device) could do the transfers after set-up by the main
processor.
Leak sensing
The leak detection circuit is located on the CMP board and checks
continuously for presence and leak conditions. If the sensor is missing
(defect) or in leak condition the PTC is cooled down the error message
appears. When the module is turned on the leak message is disabled for some
time to allow the sensor to reach its working range.
Actions:
Check for leak.
Check connector of the sensor.
Check resistance of leak sensor.
Change leak sensor.
Change CMP board.
Change FIM board.
Working condition of the PTC
Normal: about 75C 400...500 Ohm
Error: below 55C about 150 Ohm
Remote Control
The CMP board provides two remote connectors.
Remote control allows easy connection between single instruments or
systems to ensure coordinated analysis with simple coupling requirements.
When 1050 System is started from the autosampler the following signals can
be measured at the remote lines. The START REQUEST signal is only
available when the autosampler was started from any other module (remote
configuration set to HPSystem).
Figure 3 Remote Control Analysis
For the 1050 Series of HPLC Modules the subminiatur D connector is used.
Each module provides two remote connectors which are both parallel and
inputs/outputs (wired-or technique).
To provide maximum safety within a distributed analysis system one line is
dedicated to SHUT DOWN the systems critical parts in case any module
detects a serious problem.
To detect whether all participating modules are switched on or properly
powered one line is defined to summarize the POWER ON state of all
connected modules.
Control of analysis is maintained by signal readiness READY for next
analysis followed by START of run and optional STOP of run triggered on the
respective lines. In addition PREPARE and START REQUEST may be issued.
Signal description
The signal level are defined as standard TTL levels (0 V is logic true, + 5 V is
logic false). The remote lines can be input or output (wired or technique).
Fan-out is 10
Input Load 2 kOhm against + 5 V
Outputs are open collector type
SHUT DOWN (L) System has serious problem (e.g. leak: stops pump). Receiver is
any module capable to reduce safety risk.
POWER ON (H) All modules connected tosystem are switched on. Receiver is any
module relying on operation of others.
READY (H) System is ready for next analysis. Receiver is any sequence
controller.
PREPARE (L) Request to prepare for analysis (e.g. calibration detector lamp on).
Receiver is any module performing preanalysis activities.
START REQUEST (L) Request to start injection cycle (e.g. by start key on any module).
Receiver is the autosampler.
START (L) Request to start run / timetable. Receiver is any module
performing runtime controlled activities.
STOP (L) Request to reach system ready state as soon as possible (e.g.
stop run abort or finish and stop injection). Receiver is any module
performing runtime controlled activities.
The REMOTE Connector
To help you make the correct connections the signals carried on each pin are
listed in the table below (the colors refer to wires of remote cable
01046-60201).
Figure 4 APG Remote Connector
Remote Configuration
The 1050 Series provides three remote configurations:
Table 7 Remote Signals
Pin Signal Active Color
1 Digital ground white
2 Prepare run LOW brown
3 Start LOW gray
4 Shut down LOW blue
5 Reserved pink
6 Power ON HIGH yellow
7 Ready HIGH red
8 Stop LOW green
9 Start request LOW black
HPsystem Start of automatic operation from any modules start key.
Start request is outputted.
GLOBAL Synchronized start of several modules for a single run.
Start / Stop is outputted.
LOCAL Single modules start. No pulses outputted.
Figure 5 Table of line definition
Notes
Y1 is done by balance key of MWD only.
Y2 BALANCE on detectors is performed.
Y3 is not used in the module.
The remote line SHUT DOWN will always be active.
The remote line POWER ON will not be processed.
Figure 6 Schematic of Remote Control
NOTE Above schematic is for Pump, Autosampler, MWD and DAD.
The signal level are defined as standard TTL levels
(0 V is logic true, +5 V is logic false).
The remote lines can be input or output (wired or technique).
Fan-out is 10
Input Load >=2.2 kOhm against + 5 V
Figure 7 Board Layout CMP
Firmware Board (FIM)
Repair Level: Exchange Board
Firmware Description
Figure 3-7 shows the firmware structure for the 1050 Series of modules
(pump, autosampler, multiple wavelength detector and diode array detector).
As many as possible tasks use the same core firmware and only special
routines for each module are developed seperate (control of the hardware
sensors motors and so on). This common structure gives maximum flexibility
for later development of similar products.
It is obvious that also in the common firmware different commands display
contents method parameters and so on. appear (Dialog, Method Handler,
Parameter Handler). But nevertheless the structure is the same. In each part
of the firmware there exist tables which hold the module specific commands
parameters and so on, which are all handled under the same conditions.
The firmware works with a foreground background mode. All time critical
tasks (timetable execution, sensor and motor information) are working in the
foreground mode and have highest priority. All other tasks share the
remaining time in the background. If there are no tasks running the processor
goes into the idle state.
The firmware per module has approxmiately 300 kByte, where 170 kByte is
Common and 130 kByte module specific).
Table 8 Part Numbers for Firmware Boards
Item Part Number Exchange
for Pumps (79851/2A/B) on RAD Board 01018-66518 no
for Autosamplers (79855A/B) on VMD Board 01078-66504 no
for Multiple Wavelength Detectors (79854A) on AQB
Board
01048-66504 no
for Diode ArrayDetectors (G1306A) on AQB Board G1306-66524 no
The firmware is located on the module specific firmware board which is
piggy back on the personality board of each module (AQB-, RAD- or
VMD-board) and can be exchanged easily.
Figure 8 Firmware Structure
Repair Level: Board or Fuse ICP1
The FIP module is located behind the keyboard module of pump,
autosampler and multiple wavelength detector.
The function of the FIP module is to provide an interface between a host
system and the user. Messages can be displayed with up to 32 characters
(2 lines x 16 characters/line). A matrix keyboard is scanned for numeric or
special function input and status information is displayed through 4 LEDs.
The characters are displayed in a 5 x 7 dot matrix.
In case of a dark display, check the on board fuse ICP1 (1 A) which is
soldered in close to the connector P1/P2.
Figure 9 Board Layout FIP
Table 9 Part Numbers for FIP Board
Item Part Number used for
FIP Board 5061-3376 pumps, autosampler, MWD amd DAD
Fuse 1 A 2110-0099
External Contacts
External Contacts
The personality boards of the 1050 modules (MWD/DAD: AQB, Pumps: RAD
and Autosampler: VMD) have two external conacts at the rear.
1 contact without supply (contact closure) <newline>max. 30 V/250 mA
(fused with 250 mA)
1 contact with internal 24 V supply (max. 250 mA output with fuse)
The schematic for all three boards (AQB, NMD and RAD) is in general the
same. Only the values of the components vary from board to board due to
internal specifications.
Figure 10 External Contacts
Table 10 Components of External Contacts
Components AQB RAD VMD
L1, L2, L3, L4 4.7 H 10 H 1 H
C1, C2, C6, C7 100 nF 1 nF
C3, C4, C8, C9 10 nF 10 nF 10 nF
C5, C10 1 nF
Fuse F250 mA (2110-0004)
Power Supply (DPS-B / DPS-A)
Repair Level: Fuses and DPS-B / DPS-A
General Description
The power supply is a primary switching regulated type. It consists of two
parts. the Base Supply and the Lamp Supply. The Base Supply provides
outputs of +5 V, 19 V, +24 V and +36 V. In addition the Lamp Supply
provides all circuits necessary for the operation of a deuterium lamp.
Table 11 Part Numbers for LUC/LPC Board
DPS-B (Exchange) 01050-69374 Pumps and Autosamplers
DPS-B (New) 5061-3374 Pumps and Autosamplers
DPS-A (Exchange) 01050-69375 MWD, DAD, VWD
DPS-A (New) 5061-3375 MWD, DAD, VWD
Fuse for 110 V operation 3 A 2110-0003
Base Supply (DPS-B)
Figure 11 on page 59 shows the base part of the DPS-A. The line voltage is
rectified filtered and switched with about 50 kHz by a power MOS-FET. The
complete control of frequency and pulsewidth is made by the control
board #1 containing the logic needed and the FET driver.
The isolation between the primary and the secondary part is made by
opto-couplers and the switching transformer. The DC-output voltages are
generated by single-phase rectifiers and LC-filtering with the additional
features: The +36 V output has an separate over-voltage protection to limit
the voltage to +45 V maximum. The +5 V output contains an additional analog
series regulator to provide a stable output for all load conditions under
different applications. The synchronization input is used in the 1050
MWD/DAD only to synchronize the switching frequency to a value of three
times (54 kHz) of the diode array readout frequency. This output is not used
in the other modules.
The power supply status is monitored by the processor system to detect a
powerfail condition and to save all important data. The Power Supply
STATUS LED (GREEN) at the rear panel shows the OK condition of the
power supply.
NOTE OK means that the pulsewidth of the switching FET is inside the allowed
limits. OK does not means that all voltages at the output are present (for
example a broken inductor is not detected).
Figure 11 Block Diagram DPS-B (Base Supply)
Lamp Supply (DPS-A)
Figure 12 on page 61 and Figure 13 on page 62 show the additional circuits
necessary for the deuterium lamp:
a DC output of 5.5 V for the regulated heater output (located on the
primary board);
a regulated constant current source with selectable current of 320 mA,
360 mA or 400 mA;
a 600 V lamp ignition circuit;
a 12 V regulated output for future use.
WARNI NG Hazardous voltage present at the output connector with instrument
power cord connected to AC line.
The main feature of this power supply is a low noise current source for the
deuterium lamp. For realization a pulse-width modulated DC-DC converter
(36 V input, 170 V no load output) is built-up with a switching FET and high
voltage transformer. The pulse-width is regulated so that the DC-output is
about 12V above the actual anode voltage of the deuterium lamp.
This design allows minimum power loss if the anode voltage varies from
lamp to lamp and by aging between 65 V and 100 V. The final regulation to the
selected current is made by an analog power regulator. Again the switching
frequency is synchronized to 54 kHz in the 1050 MWD/DAD.
Figure 12 Block Diagram DPS-A (Lamp Supply I)
Figure 13 Block Diagram DPS-A (Lamp Supply II)
Lamp Ignition
To ignite the deuterium lamp a 0.5 F capacitor loaded with 600 V is
discharged via a 10 kOhm resistor to the anode. These 600 V are generated by
a separate winding.
The lamp status output signal shows "OK" if the lamp current has the selected
value. Otherwise an error message is generated.
The heater output made by a series regulator is in the pre-heating status 2.5 V
always. After ignition a different output voltage is selected depending on the
lamp type used:
In the 79853C VWD, 79854A MWD and the G1306A DAD, the heater is
switched off after ignition.
The 12 V low noise output is made by a series regulator connected to the
+19 V output.
Communication Interface (CIB / CRB)
Repair Level: Exchange Board
NOTE This section describes the communication interface for the 1050 Pumps
(79851/2A/B), Autosamplers (79855A/B), Multiple Wavelength Detectors
(79854A) and Diode Array Detector (G1306A) only.
The communication interface for the 1050 Variable Wavelength Detector
(79853C) is described in the chapter of the 1050 VW Detector.
The communication interface board is necessary for the control by a
Personal Computer and to connect printer or plotter devices. The
communication interface board provides one GPIB and one RS-232 interface.
The CRB for the 1050 MWD/DAD has a 96 kbyte runbuffer for the
data/spectrum operation with the Multiple Wavelength Detector. The
interface is located in Slot #2 of the module.
Table 12 Part Numbers for CRB Board
CIB Board (NEW) 5061-3382 Pumps and Autosampler
CRB Board (NEW) 5062-2482 79854A MWD / G1306A DAD
Compatibilities
Firmware
To use the communication interface board it is mendatory to have the 1050
Modules equipped with the latest firmware revisions (see Table 13).
Baud rate
The board contains a baudrate generator. The baudrate is setable up to
19200 baud from the keyboard. The transmitter and receiver baudrate are
independent adjustable.
RS-232 Interface
The implemented serial interface is a subset of the RS-232 standard only. It
contains at
The 1050 modules are designed as DCE (data communication equipment)
without hardware handshake.
Table 13 CIB/CRB Compatibility
Instrument CIB CRB Firmware
1050 Pump R P REV 3.1
1050 Sampler R P REV 3.1
1050 MWD C R REV 3.1
1050 DAD C R REV 1.0
R recommended configuration
P possible but not neccessary
C only for instrument control
PIN 2 RxD receive data (data input)
PIN 3 TxD transmit data (data output)
PIN 4 GND (Ground)
3
3 Common: Cable Information
This chapter provides information on cables for
the 1050 Modules
Common: Cable Information
Overview
The 1050 Modules provide
Analog Signal Output (Pumps, Detectors)
Remote Control Connector (all)
BCD Connector (Autosampler)
WARNI NG Never use cables other than the ones supplied by Agilent Technologies
to ensure proper functionality and compliance with safety or EMC
regulations.
Overview
Table 14 Cables Overview
Type Description Part Number
Analog
cables
3390/2/3 integrators 01040-60101
3394/6 integrators, 35900A A/D converter 35900-60750
General purpose (spade lugs) 01046-60105
Remote
cables
3390 integrator 01046-60203
3392/3 integrators 01046-60206
3394 integrator 01046-60210
3396A (Series I) integrator 03394-60600
3396 Series II / 3395A integrator, see page 74
3396 Series III / 3395B/96C/97A integrator 03396-61010
1100 / 1050 modules / 1046A FLD / 35900A A/D
converter
5061-3378
1040 DAD / 1090 liquid chromatographs / SDM 01046-60202
BCD
cables
3392/3 integrators obsolete
3396 integrator 03396-60560
General purpose (spade lugs) 18594-60520
GP-IB
cable
1100 module to ChemStation, 1 m 10833A
1100 module to ChemStation, 2 m 10833B
1100 module to ChemStation, 5 m 10833D
Analog Cables
Analog Cables
One end of these cables provides a BNC connector to be connected to 1050
Series modules. The other end depends on the instrument to which
connection is being made.
1050 to 3390/2/3 Integrators
1050 to 3394/6 Integrators
Connector
01040-60101
Pin
3390/2/3
Pin
1050 Signal Name
1 Shield Ground
2 Not connected
3 Center Signal +
4 Connected to pin 6
5 Shield Analog -
6 Connected to pin 4
7 Key
8 Not connected
Connector
35900-60750
Pin
3394/6
Pin
1050 Signal Name
1 Not connected
2 Shield Analog -
3 Center Analog +
Analog Cables
1050 to BNC Connector
1050 to General Purpose
Connector
8120-1840
Pin
BNC
Pin
1050 Signal Name
Shield Shield Analog -
Center Center Analog +
Connector
01046-60105
Pin
3394/6
Pin
1050 Signal Name
1 Not connected
2 Black Analog -
3 Red Analog +
Remote Cables
Remote Cables
One end of these cables provides a Agilent Technologies APG (Analytical
Products Group) remote connector to be connected to 1050 Series modules.
The other end depends on the instrument to be connected to.
1050 to 3390 Integrators
Connector
01046-60203
Pin
3390
Pin
1050 Signal Name
Active
(TTL)
2 1 - White Digital ground
NC 2 - Brown Prepare run Low
7 3 - Gray Start Low
NC 4 - Blue Shut down Low
NC 5 - Pink Not connected
NC 6 - Yellow Power on High
NC 7 - Red Ready High
NC 8 - Green Stop Low
NC 9 - Black Start request Low
Remote Cables
1050 to 3392/3 Integrators
NOTE START and STOP are connected via diodes to pin 3 of the the 3394 connector.
Connector
01046-60206
Pin
3392/3
Pin
1050 Signal Name
Active
(TTL)
9 7 - Red Ready High
1 8 - Green Stop Low
4 - Key
Connector
01046-60210
Pin
3394
Pin
1050 Signal Name
Active
(TTL)
5,14 7 - Red Ready High
1 9 - Black Start request Low
13, 15 Not connected
Remote Cables
1050 to 3396A Integrators
1050 to 3396 Series II / 3395A Integrators
Use the cable 03394-60600 and cut pin #5 on the integrator side. Otherwise
the integrator prints START; not ready.
Connector
03394-60600
Pin
3394
Pin
1050 Signal Name
Active
(TTL)
5,14 7 - Red Ready High
Remote Cables
1050 to 3396 Series III / 3395B Integrators
1050 to 1050, 1046A or 35900 A/D Converters
Connector
03396-61010
Pin
33XX
Pin
1050 Signal Name
Active
(TTL)
Connector
5061-3378
Pin
1050 /
Pin
1050 Signal Name
Active
(TTL)
1 - White 1 - White Digital ground
2 - Brown 2 - Brown Prepare run Low
3 - Gray 3 - Gray Start Low
4 - Blue 4 - Blue Shut down Low
5 - Pink 5 - Pink Not connected
6 - Yellow 6 - Yellow Power on High
7 - Red 7 - Red Ready High
8 - Green 8 - Green Stop Low
9 - Black 9 - Black Start request Low
Remote Cables
1050 to 1090 LC, 1040 DAD or Signal Distribution Module
Connector
01046-60202
Pin
1090
Pin
1050 Signal Name
Active
(TTL)
7 4 - Blue Shut down Low
8 5 - Pink Not connected
5 - Key
Connector
01046-60201
Pin
Universal
Pin
1050 Signal Name
Active
(TTL)
1 - White Digital ground
2 - Brown Prepare run Low
3 - Gray Start Low
4 - Blue Shut down Low
5 - Pink Not connected
6 - Yellow Power on High
7 - Red Ready High
8 - Green Stop Low
9 - Black Start request Low
BCD Cables
BCD Cables
One end of these cables provides a 15-pin BCD connector to be connected to
the 1050 Series modules. The other end depends on the instrument to be
connected to.
1050 to 3392/3 Integrators (Obsolete)
Connector
18584-60510
Pin
3392/3
Pin
1050 Signal Name BCD Digit
10 1 BCD 5 20
11 2 BCD 7 80
3 3 BCD 6 40
9 4 BCD 4 10
7 5 BCD 0 1
5 6 BCD 3 8
12 7 BCD 2 4
4 8 BCD 1 2
1 9 Digital ground
2 15 + 5 V Low
6 - Key
BCD Cables
Connector
03396-60560
Pin
3392/3
Pin
1 1 BCD 5 20
2 2 BCD 7 80
3 3 BCD 6 40
4 4 BCD 4 10
5 5 BCD 0 1
6 6 BCD 3 8
7 7 BCD 2 4
8 8 BCD 1 2
9 9 Digital ground
NC 15 + 5 V Low
Connector
18594-60520 Wire Color
Pin
Green 1 BCD 5 20
Violet 2 BCD 7 80
Blue 3 BCD 6 40
Yellow 4 BCD 4 10
Black 5 BCD 0 1
Orange 6 BCD 3 8
Red 7 BCD 2 4
Brown 8 BCD 1 2
Gray 9 Digital ground
White 15 +5 Vt Low
In This Book
This manual contains technical
information about the Agilent 1050
liquid chromatographs.
This manual is available as electronic
version (Adobe Acrobat Reader file)
only.
1050 Series of HPLC

Modules
Service Handbook -
Pumps (79851A/79852A/B)
76337 Waldbronn
Germany
Copyright Agilent
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
The information
contained in this
this material,
including, but not
warranties or
merchantability and
purpose.
IMPORTANT NOTE
01050-90102 edition 4
(1995) and G1306-90102
information (79854A
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
4
4 Pumps: General Information
the 1050 Pumps
Pumps: General Information
Introduction
This chapter gives general information on
about this pump
repair policy
product structure
capillaries
specifications
About this Manual
This manual provides service information about the 1050 Pumps (isocratic
and quaternary). The following sections give the detailed descriptions of all
electronic and mechanical assemblies. You will find illustrated
part-breakdowns interconnection tables connector configurations as well as
all necessary replacement procedures in this manual. Detailed diagnostic
procedures using firmware resident test methods and error messages are
also given in this manual.
About the Pumps
About the Pumps
The 1050 Pump modules houses the mechanical devices and the electronic
circuitry for either the isocratic or quaternary module which control the
various functions of the flow system. The module is controlled via the user
interface through which the operator defines his requirements
(flow-composition and so on) and which provides the required analytical
information.
Repair Policy
The 1050 Pumps are designed that all components are easy accessible
Customers are able to repair certain parts of the 1050 Pumps see Operators
Handbook.
For details on repair policy refer to Repair Policy on page 38.
Product Structure
Product Structure
The 1050 Series of HPLC modules are available in two versions. In the
standard version most of the parts used are stainless steel.
In the 1050 Ti Series the flow path of the quaternary pump consists solely of
corrosion resistant materials such as titanium, tantalum, quartz, sapphire,
ruby, ceramic and fluorocarbon polymers. It is recommended for use with
mobile phases containing high salt concentrations, extreme pH solutions and
other aggressive mobile phases.
NOTE The isocratic pump was also introduced as Ti - version (79851B) but due to the
insufficient orders it became obsolete end of FY 91.
Isocratic Pump 79851A
Quaternary Pump 79852A
Ti - Quaternary Pump 79852B
Capillaries
Capillaries
In the 1050 Pumps the capillary shipped with the module will have a plastic
color coating for identification in terms of material and internal diameter.
All capillaries before the injector have a internal diameter of 0.25 mm. From
the injector the internal diameter is reduced to 0.17 mm.
NOTE For the Ti pumps the fittings are always titanium with a titanium nitrite
coating and the front and back ferrules are gold plated.
The Ti capillaries have two color coatings. One for identifying the material
covering the main part of the capillary and a small one for the internal
diameter.
Table 15 Capillary Color Code
color Internal Diameter Material
blue 0.25 mm
green 0.17 mm
red 0.12 mm
white tantalum
Specifications
Specifications
Table 16 Specifications of 1050 Pumps
Hydraulic System Dual-pistons in-series with proprietary servo-controlled
variable stroke drive floating pistons and active inlet
valve.
Flow Range Setpoint from 0.001 to 9.999 ml/min in 0.001 ml/min
increments.
Piston Displacement 20 to 100 l, automatic matched to flow rate or
user-selectable.
Flow Precision <0.3% RSD (typically <0.15%) based on retention time at
0.5 ml/min and 2.5 ml/min.
Pressure Operating range from 0-400 bar (5880 psi) up to 5 ml/min;
from 0-200 bar (2950 psi) up to 10 ml/min. Display in bar,
psi or MPa.
Pressure Pulsation <2% amplitude (typically <1%), 1 ml/min isopropanol at
all pressures >10 bar.
Compressibility Compensation User-selectable, based on mobile phase compressibility.
Recommended pH Range 2.3 to 12.5 (stainless steel version). Solvents with pH
below 2.3 should not contain acids which attack stainless
steel. 1.0 to 14 (TI series).
Gradient Formation Low pressure quaternary mixing/gradient capability using
proprietary high-speed proportioning valve. Delay Volume
900 to 1100 l dependent on back pressure.
Composition Range 0 to 100% in 0.1% increments from four independent
channels.
Composition Precision 0.25% absolute (typically 0.15%) peak to peak, binary
mixed water/acetonitrile from 0.5 ml/min to 5.0 ml/min
without mixer.
Solvent Preparation Four 1 liter bottles each with individually-regulated
helium sparger, cap and filter.
Specifications
Oven Temperature Range Ambient +5C to ambient +60C in 0.1C
increments.Display in C, F or K.
Oven Temperature Stability 0.15C
Oven Capacity Two 25-cm or three 20-cm columns.
Control Integrated keyboard with function keys; parameter editing
during run possible; keyboard lock; optional control by PC.
Parameters Flow rate, compressibility, stroke volume, upper and
lower pressure limits, 2 external contacts; %B, %C, %D
(for quaternary pump). Time-programmable Parameters:
Flow rate, upper pressure limit, external contacts; %B,
%C, %D.
Methods Battery-backed storage of up to 10 methods. Automatic
start up and shut down methods. Editing of stored
methods possible in run.
Analog Output For pressure monitoring, 2 mV/bar.
Communications Outputs: ready signal and two external outputs (one 24 V
relay and one 30V (AC/DC) contact closure, both with 0.25
A. In-and outputs: start, stop and shut down signals.
Optional interface for GPIB and RS-232C.
Safety Aids Extensive diagnostics, error detection and display via
front-panel LED's and status logbook. User-definable
shutdown method activated in case of error. Leak
detection and safe leak handling. Low voltages in major
maintenance areas. Column pressure protection with
maximum rate of pressure change of <20 bar/sec after a
setpoint change.
Environment 4C to 55C (constant temperature) with <95% humidity
(non-condensing).
Power Requirements Line voltage: 100-120 or 220-240 VAC 10%
Line frequency: 48-66 Hz
Power consumption: 120 VA max.
Specifications
For complete description of test conditions used to obtain specifications, see
Owners Manual.
Dimensions Height: 208 mm (8.2 in)
Width: 325 mm (12.8 in)
Depth: 560 mm (22.0 in)
5
5 Pumps: Hardware Information
This chapter provides hardware information
about the 1050 Pumps
Pumps: Hardware Information
This chapter gives general and technical information about the hardware
components of the 1050 Pumps.
Solvent Cabinet
Pump Hardware
Multi Channel Gradient Valve (MCGV)
Metering Drive Assembly
Pump Head Assembly
Continuous Seal Wash
Active Inlet Valve
Outlet Ball Valve
Frit Adapter Assembly
Purge Valve
High Pressure Damper
Column Holder
Overview
Overview
The 1050 Pump is based on a dual piston series design which comprises all
essential functions a solvent delivery system has to fulfill. Metering of solvent
and delivery to the high pressure side are performed by one metering
assembly which can generate pressure up to 400 bar.
The basic system (isocratic) comprises the metering assembly including an
active inlet valve, an outlet valve, a frit adapter assembly and a damping unit.
The gradient operation system includes a highs peed proportioning valve
allowing quaternary operation and a solvent cabinet with separate Helium
degassing for each solvent channel.
Since the introduction of the G1303A Online Degasser (December 1,1991) the
Helium degassing might be replaced by the degasser module.
A purge valve is installed on the pump head for convenient priming of the
pump.
An continuous seal wash is available when the pump is used with buffer
solutions. It is mandatory in the Ti - pump and can be ordered as an option
for the standard version.
The solvent cabinet for the 1050 Pumps can be equipped with a manual
injection valve and a column heater.
Overview
Figure 14 Overview Pump System
How does the Pump Work?
How does the Pump Work?
The metering assembly comprises two substantially identical piston pump
units. Both pump units comprise a ball screw drive and a pump head with a
sapphire piston for reciprocating movement in it. The servo controlled
variable reluctance motor drives the two ball drive screws in opposite
direction. The gears for the ball screw drives have different circumferences
(ratio 2:1) allowing the first piston to move double the stroke length of the
second piston. The solvent enters the pump heads close to the bottom limit
and leaves it at its top. The outer diameter of the piston is smaller than the
inner diameter of the pump head chamber allowing the solvent to fill the gap
in between. The first piston has a stroke volume in the range of 20 l to 100 l
depending on the flow rate. The microprocessor controls all flow rates in a
range of 1 l to 10 ml.
The inlet of the first pumping unit is connected to the active inlet valve which
is processor controlled opened or closed allowing solvent to be sucked into
the first pump unit. The outlet of the first pump unit is connected via the
outlet ball valve and the damping unit to the inlet of the second pump unit.
The outlet of the metering assembly is than connected to the following
chromatographic system.
Isocratic Operation
When turned on the pump runs through a initialization procedure to
determine the upper dead center of the first piston. The first piston moves
slowly upwards into the mechanical stop of the pump head and from there it
moves back a predetermined path length. The controller stores this piston
position in memory. After this initialization the pump starts operation with
the set parameters. The active inlet valve is opened and the down moving
piston draws solvent into the first pump head. At the same time the second
piston is moving upwards delivering into the system. After a controller
defined stroke length (depending on the flow rate) the drive motor is stopped
and the active inlet valve is closed. The motor direction is reversed and
moves the first piston up until it reaches the stored upper limit and at the
same time moving the second piston downwards. Then the sequence starts
again moving the pistons up and down between the two limits.
Overview of the Electronics
During the up movement of the first piston the solvent in the pump head is
pressed through the outlet ball valve and the damping unit into the second
pumping unit. The second piston draws in half of the volume displaced by the
first piston and the remaining half volume is directly delivered into the
system.
During the drawing stroke of the first piston the second piston delivers the
drawn volume into the system.
Gradient Operation
For gradient operation the multi channel gradient valve (MCGV) connected
to solvent containers A, B, C and D is required. The controller makes sure
that each intake stroke of the first piston contains the required solvent
composition. The controller divides the length of the intake stroke in certain
fractions in which the MCGV connects the specified solvent channel to the
pump input.
The figure 2-2 shows the block diagram of the 1050 Pumps including all
currently available options.
The common main processor (CMP) controls all functions of the modules.
The controller firmware is attached to the relative A/D converter board
(RAD).
The column heater can be installed into the solvent cabinet. The electronic
control is done via the pump module. Two different boards will be available
for supporting the column heater in either the isocratic pump (79851A) or the
quaternary pump (79852A/B).
For the quaternary pump (79852A/B) the heater quaternary board (HRQ)
controls the column heater and drives the multi channel gradient valve
(MCGV).
For the isocratic pump (79851A) the heater isocratic board (HRI) controls
only the column heater. The HRI board is a subtract of the HRQ Board; the
blank board is identical but the components for the gradient operation are
not mounted.
The communication interface board (CIB) provides an GPIB and RS232C
interface. With the CIB installed the pump can be controlled via the
ChemStation or via the 3396B integrator.
Figure 15 Block Diagram 1050 Pumps
Overview of the Flow Path
Overview of the Flow Path
From the bottle head assembly (tube #1) the solvent moves via the gradient
valve (MCGV), the connection tube #2 and the active inlet valve into the
pump. From the outlet ball valve the capillary #3 is connected to the damper
and from there the solvent streams back to the second piston chamber
(capillary #4). The standard interface capillary #5 (70 cm long 0.25 mm ID)
connects the pump to the next module (for example the autosampler).
In the isocratic pump the solvent sucking tube #2 is directly connected to the
solvent bottle and the interface capillary (#5) is connected to the frit adapter.
In the quaternary pump the interface capillary (#5) is connected to a purge
valve.
The purge valve allows convenient priming of the system. When opened the
flow is directed via tubing (#7) in to the waste.
The typical delay volume for the pump is in the range 900 to 1100 l
(depending on system back pressure).
If the seal wash accessory is installed the wash bottle on top of the
instrument (tube #6) is connected to the two support rings for back flushing
of the piston seals. From the second support ring the wash solvent flows into
the collecting vessel.
Figure 16 Hydraulic Path
Solvent Cabinet
Solvent Cabinet
Repair Level: Component
The solvent cabinet allows storage of 4 four 1 liter solvent bottles. It is
designed to hold the following options:
Helium degassing; later it was replaced by 1050 online degassing
Manual injection valve
Column Heater
Manual injection valve and column heater
Helium Degassing
NOTE For low pressure mixing degassing is a must. Therefore the Helium degassing
or the Online Degasser G1303A is mandatory for the quaternary pump.
If the Helium degassing is selected a internal tubing guides the Helium from
the back of the solvent cabinet to an on/off valve and from there to four
regulators. Each of the regulator supplies helium to one bottle head assembly
for separate sparging of each bottle. The bottle head assembly consists of a
sintered glass sparger, stainless steel or titanium filter and a cap with vent
position. It is designed for the provided standard bottle, but allows also
operation with supply bottles from certain vendors. The bottle head assembly
has also a connection for a fume hood tubing (see also Helium Degassing
Principle on page 269).
Table 17 Product Numbers for Solvent Cabinet
Item Part Number
Solvent Cabinet 79856A
Ti - Solvent Cabinet 79856B
Solvent Cabinet
NOTE The connected helium pressure has to be in the range 2 to 4 bar (30 to 60 psi).
With pressures below 2 bar the helium degassing system may not work
correctly. Pressure above 4 bar might damage the helium regulators.
Manual Injection Valve
If ordered with manual injection valve a Rheodyne 7125 valve with 20 l loop
will be installed in the solvent cabinet. If ordered as a Ti version a Rheodyne
7125 titanium valve with Tefzel rotor seal will be present in the cabinet. A
remote-start output is available at the back of the cabinet.
Column Heater
The column heater fits into the recess of the cabinet. Electronic control is
done via the pump module. The column heater can hold up to 25 cm long
columns. The flow path of the column heater is stainless steel even in the Ti -
version.
The heater uses a heating foil which is attached to a aluminum heating block
where the solvent capillaries are leading through (heat exchanger). The
column rests in the U-shaped heat exchanger. When turned on, the heat
exchanger will heat up the solvent, the column and the surrounding air in the
compartment.
Temperature is monitored on the heating block via a Pt. 100. A multi (3) color
LED shows the actual status of the column heater. The power consumption
of the heater is reduced by heat recycling. Incoming and outgoing capillaries
of the heat exchanger are in close thermal contact allowing radial heat
exchange while the solvent is streaming through.
Solvent Cabinet
Figure 17 Solvent Cabinet including all options
Repair Level: Exchange Assembly
The multi channel gradient valve (MCGV) works like a multi position switch.
Depending on the timing of the control electronic the Heater Quaternary
Board (HRQ) activates one of the four solenoids connecting the selected
channel to the output of the valve.
In the Ti-version of the gradient valve only the materials have been changed.
Figure 18 MCGV
Table 18 Part Numbers MCGV
MCGV 79835-67701 79835-69701
Ti - MCGV 01019-67701
Table 19 Technical Data of MCGV
Switching Time: approximately 2 ms
Solenoid Voltage: +12 V (+36 V Chopper Drive)
Ti Series
Materials in contact with solvent: PFA, PTFE, sapphire, ruby, ceramic, Titanium
Repair Level: Exchange Assembly
The metering drive assembly is identical for the stainless steel and the Ti
version. The metering pump system is driven by a variable reluctance motor
(servo) and electrically controlled by the Pump Drive Control Board (PDC).
Feedback about actual movement is sensed by a shaft encoder mounted on
top of the motor. In order to achieve required flow resolution a gear is used
to transmit motor movement to the two pistons. The gears for the ball screw
drives have different circumferences (ratio 2:1) allowing the first piston a
twice as large stroke volume as the second piston. The second piston
operates with a fixed 180 difference relative to the first piston. A sensor on
the motor surface checks for over temperature conditions (90C).
Figure 19 Metering Drive Assembly
Table 20 Part Numbers Metering Drive Assembly
Metering Drive Assembly 01018-60001 01018-69100
Table 21 Technical Data of Metering Drive
Resolution of mechanical system: 6.6 nl/steps of Encoder
Resolution of Encoder: 0.25 degree
Lowest Frequencies: 2.5 Hz
Highest Frequencies: 25 KHz
Number of steps between piston extension limits: 8191
Pump Head Assembly
Pump Head Assembly
Two identical piston move inside the solvent filled chamber in the pump head
assembly. The piston are ball loaded on the spindles and center itself in the
seal. The built in spring prevents clearances of the plunger affecting flow
accuracy (see also Pump Head Assembly on page 271).
Figure 20 Pump Head Assembly
Table 22 Part Numbers Pump Head Assembly
Item Part Number
Pump Head Assembly 01018-60004
Ti - Pump Head Assembly 01019-60002
Table 23 Technical Data of Pump Head
Maximum displacement volume: 108 l
Ti - Series
Materials in contact with solvents titanium, gold, sapphire, ceramic
Bioscience application do very often use high concentrated buffer solutions.
Therefore the seal wash is installed in each Ti pump. For the stainless steel
version it is available as an option and should be used when buffer solutions
are used in the instrument. If high buffer concentration are used in the pump
the continuous seal wash will maintain the life time of the pump seal. Buffer
solutions below 0.1mol normally do not require the seal wash option.
The option is customer installable.
The option consists of a support ring (1) a secondary seal (2) and a gasket (3)
for both piston sides. A wash bottle filled with water/isopropanol (90/10) will
be placed above the pump module and gravity will maintain a flow through
the pump head removing all possible buffer crystals from the back of the
pump seal.
NOTE Running dry is the worst case for a seal and drastically reduces the life time of
it. Therefore the tubings of the wash option should always be filled with
solvent to maintain the life time of the wash seal. Use always a mixture of
distilled water (90%) and isopropanol (10%) as wash solvent. The mixture
prevents bacteria growth in the wash bottle and reduces also the surface
tension of the water. The flow rate should be regulated to approximately
20 drops/minute (velocity regulator 5062-2486).
Table 24 Part Numbers Seal Wash
Item Part Number
Seal Wash Kit 01018-68722
Velocity regulator 3/pk 5062-2486
Figure 21 Continuous Seal Wash
Active Inlet Valve
Active Inlet Valve
Repair Level: Assembly
The active inlet valve is a solenoid driven check valve. In the Ti version all
parts in contact with solvents are corrosion resistant. The solenoid is
controlled by the Pump Drive Control Board (PDC). A spring loaded ruby ball
sitting in a sapphire seat closes or opens the flow path. If the solenoid is
deactivated the keeper of the magnet presses the ruby ball down opening the
flow path. At the same time the down moving first piston draws solvent into
the pump head. The activated solenoid enables the spring to press the ruby
ball in its seat and the flow path is blocked. Older versions do have a solvent
protection cover installed.
Figure 22 Active Inlet Valve
Table 25 Part Numbers Active Inlet Valve
Item Part Number
Active Inlet Valve 01018-60010
Ti - Active Inlet Valve 01019-60010
Table 26 Ti - Series
Materials in contact with solvents titanium, gold, sapphire, ceramic,
Outlet Ball Valve
Outlet Ball Valve
Repair Level: Assembly
The outlet ball valve is made of corrosion resistant materials and can be used
in both pump versions. The outlet valve cartridge contains two seat / ball
pairs with the necessary seals. A slight weight on top of each ball limits the
movement of the ball and maintains a small delay volume. The cartridge (3) is
fixed with adhesive and the valve will be damaged if opened. The valve
should always be tightened at the housing screw (2) and never at the
cartridge (3) itself.
Figure 23 Outlet Ball Valve
Table 27 Part Numbers Outlet Ball Valve
Item Part Number
Outlet Ball Valve G1311-60012
Materials in contact with solvents titanium, gold, ruby, sapphire
!Repair Level: Component
The housing of the frit adapter assembly is made from titanium and is
suitable for both pump versions. The frit adapter assembly is installed in each
isocratic pump. It is the interface to the following system components (for
example autosampler) and holds a PTFE frit. The capacity of the frit when
installed correctly is large enough to collect all the particles during the
normal life time of the piston seal. It is recommended to replace the frit each
time the seal has to be replaced as part of the normal pump maintenance. The
second criteria for replacing the frit is the pressure across over it. If the
pressure drop is more then approximately 10 bar with 5ml/min H
2
O the frit
should be changed.
Figure 24 Frit Adapter Assembly
Table 29 Part Numbers Seal Wash
Item Part Number
Frit Adapter Assembly 01018-60007
Materials in contact with solvents Titanium, PTFE, gold
Purge Valve
Purge Valve
Repair Level:Assembly except of PTFE frit and gold seal (item 1 to 3)
The purge valve was introduced in November 1990. The purge valve is made
from corrosion resistant materials and is suitable for both pump versions.
The purge valve will be installed on all quaternary pumps and can be ordered
as an option to the isocratic pump. The lower part of the purge valve is
designed like the frit adapter assembly and holds the PTFE frit. A ball seat
combination builds the purge valve. When opened at the thumb screw the
ball is lifted out of its seat allowing the solvent to flow through the waste
outlet. When the thumbscrew is turned down the internal springs press the
ball into the seat. Flow is directed to the following system components.
Figure 25 Purge Valve Assembly
Table 31 Part Numbers Purge Valve
Item Part Number
Purge Valve (replacement) G1311-60009
Purge Valve Update Kit 01018-68723
Materials in contact with solvents Titanium, PTFE, gold, ceramic
Repair Level:Assembly
For the Ti version of the high pressure damper all parts which are in contact
with solvents are gold plated. Two functions are obtained from the High
Pressure Damper. Flow is damped (flow ripple reduction) and the pressure in
the system is measured. The damping function is provided by an aluminum
housing partly filled with water as the compressible medium and a solid steel
block (3) which compensates for different coefficients of expansion of water
and the aluminum housing. A protection plate (2) mounted between cover
and housing prevents membrane (1) damage resulting from pressure excess
or pressure shocks. Pressure is measured with a pressure transducer. The
electrical circuit that outputs a voltage proportional to the pressure
measured is mounted directly to the pressure transducer.
Figure 26 High Pressure Damper
Table 33 Part Numbers High Pressure Damper
Item Part Number
Damper 79835-60005
Ti - Damper 01019-60005
Materials in contact with solvents gold
Column Holder
Column Holder
Repair Level:Assembly
The column holder is standard for the 1050 Ti Pumps. It is designed for use
with any of the 1050 Series modules either separately or in a stack. A 1050
module will fit onto the column holder base (1) and the stand (2) can be used
to attach columns which do not fit into the solvent module compartment
using the clamp (3). Possible leaks will be collected in the groove (5). The
support block (4) maintains the correct height adjustment of the autosampler
foot support (100 vial tray).
WARNI NG The column holder is not intended for use with solvents which are
flammable or toxic. If such solvents are used you must use a leak tray
or equivalent. You must also position the column so that any leaking
solvent is collected by the leak tray.
Figure 27 Column Holder
Table 35 Part Numbers High Pressure Damper
Item Part Number
Column Holder Assembly 5062-2469
6
6 Pumps: Electronic Information
This chapter provides electronic information
Pumps: Electronic Information
This chapter gives information about the electronic of the pumps:
Overview
Pump Drive Control Board (PDC)
Relative A/D Converter Board (RAD)
Firmware Board (SWF)
Heater Isocratic Board (HRI)
Heater Quaternary Board (HRQ)
High Pressure Transducer Board (HPT)
Connector Board (CON)
Pump Motherboard (HPS)
Overview
Overview
All electronic boards (except the FIP, behind the keyboard and the CON,
above the MCGV) are located in the rear part of the module and they are
connected to the Motherboard (HPS). Excess to the boards is from the back
of the instrument. Slot numbers for the boards (as shown in the status
screen) are counted from left to right. The power supply board is located in
slot 1 and the common main processor is located in slot 7.
In the 1050 pumps the following electronic assemblies are available:
NOTE For information about Power Supply, Common Processor and Fluorescent
Interface refer to Common: Electronic Information on page 39.
Table 36 Electronic Boards
Description Part Number Exchange
Power Supply (DPS-B) 5061-3374 01050-69374
Common Main Processor (CMP) 5061-3380 01050-69580
Pump Drive Control (PDC
2
)
01018-66532
Relative A/D Converter (RAD) 01018-66503 01018-69503
Firmware Board (SFW) 01018-66506
Heater Isocratic Board (HRI) 01018-66517
Heater Quaternary Board (HRQ) 01018-66518 01018-69518
Connector Board (CON) 01018-66505
Motherboard (HPS) 01018-66501
Display Interface Board (FIP) 5061-3376
Communication Interface (CIB) 5061-2482
Overview
Figure 28 Rear of 1050 Pumps
Overview
Figure 29 Block Diagram 1050 Pumps
Pump Drive Control Board (PDC2)
Pump Drive Control Board (PDC
2
)
Repair Level: Board, Fuses and U78, U79
The main functions of the PDC board are the control of the pump motor and
the active inlet valve.
For the quaternary system the PDC board has also to generate the control
signals for the gradient valve circuit on the Heater Quaternary Board (HRQ).
The PDC2 board succeeds the PDC board. For standardization and cost
reduction reasons part of the circuit has been implemented in ASIC
(Application Specific Integrated Circuit). The board size was reduced the
board is also used in the other APG products and a stainless steel plate
extends the board to 1050 board size.
Fuses
Fuse F16 (PDC) or F481 (PDC2) (1.5 A) protects the +36 V for servo motor
and active inlet valve for overcurrent conditions on the old PDC board. F891
(PDC) or F113 (PDC2) (500 mA) protects the active inlet valve for
overcurrent conditions while F892 (PDC) or F112 (PDC2) is for future use
(space for additional connector on CON board).
Table 37 Part Numbers for ASC Board
Item Part Number
PDC
2
01018-66532
PDC
replaced by PDC
2
Fuse: F16 (PDC), F481 (PDC2) 1.5 A 2110-0304
Fuse F891, F892 (PDC); F112, F113 (PDC2)
on board 500 mA
2110-0934
U78 (MC78L15ACP) 1826-0274
U79 (MC79L15ACP) 1826-0281
Figure 30 Block Diagram PDC
2
Board
U78, U79
PDC Boards revision A need an replacement of U78 and U79 when the
metering drive (01018-69100) of the instrument has to be changed.
Clock Generator
The clock generator provides the clocks for the different pump boards. The
pump control chip needs the 2 MHz clock and the pump control logic on the
Relative A/D Board (RAD) and the Gradient Valve Driver Board (GVD) need
the 1 MHz clock.
Filter and Logic
The filter and logic circuit disables the operation of the control chip in case
of malfunctions in the system. Input signals for the block is the system OK
(SOK) signal from the common main processor (CMP) which is active when
the processor has locked up. The second signal connected to the circuit
comes from the over temperature sensor on the surface of the pump motor.
The TOK signal is active when the motor temperature exceeds 90C.
12 V Check
The +12 V voltage will be checked for under voltage conditions. In case the
voltages drops below approximately +10 V a proper working of the pump is
no longer possible and the pump control chip will be disabled.
Pump Control Chip
The pump control chip is the brain of the PDC board. It handles all time
critical and time consuming tasks for the digital position control of the
pumping system. The chip works independent from the processor which
supplies only the pump parameters (for example flow, stroke, compensation,
gradient information and so on). All parameter changes will be transferred
directly to the pump control chip. The feedback from the motor comes to the
chip via the shaft encoder and allows accurate control of the motor (speed,
direction and so on).
The control chip sends the signals for the motor driver to energize the
various motor windings. The control chip influences the current through the
motor windings by changing the pulse width and by an amplification factor
(Gain). The actual value of the current is supplied by the current amplifier
and comparator circuit.
The active inlet valve gets its control signals from the control chip. The
optional gradient valve driver board (GVD), which controls the MCGV works
under the supervision of the control chip.
Motor Driver
The motor driver circuit block contains the power stages for the motor. The
motor is a three phase variable reluctance motor.
Current Amplifier and Comparator
One task of this circuit block is to measure the current through all the
windings and to feed this signal into the control chip. From the control chip
the circuit gets the pulse width (PW) and gain (GA) signals. With the pulse
width the current value through the windings is determined. If the gain signal
is active the amplifier multiplies the current with a factor (1.4). This is
necessary to assure a constant torque at all motor positions.
Active Inlet Valve
The control chip provides the signals to activate or deactivate the active inlet
valve. Figure 31 shows the control signal from the control chip and the
current in the solenoid valve. The high current allows fast switching of the
valve while the holding current reduces the heat dissipation of the solenoid.
Figure 31 Inlet Valve Control
Figure 32 Board Layout PDC
Repair Level: Exchange Board or Fuses
The main function of the board is the relative A/D conversion with an analog
pressure output and overpressure measurement for the flow reduction. In
addition the RAD board controls the two external contacts and checks for
the status of active inlet valve and motor temperature. The firmware board
(SFW) which contains the module firmware is attached to the RAD board and
is used by the common main processor (CMP).
Control Logic
The control logic synchronizes the communication between the RAD and the
main processor.
Status Register
The status register sends information about board identification motor
temperature and active inlet valve to the main processor.
Via the board identification the main processor identifies the board in the
card cage. In case of a wrong board position the processor does not allow
signals to the board.
The over temperature sensor on the pump motor surface generates an error
message when the motor temperature exceeds 90C (fan defective?).
If the active inlet valve is not connected an error message is generated (when
pump will be turned on) and the operation of the pump is inhibited.
RAD 01018-66503 01018-69503
Fuse: F12, F22, 250 mA 2110-0004
Figure 33 Block Diagram RAD
Relay Contact Register
The relay contact register activates the two relay contact circuits on request
of the processor. When activated contact 1 provides fused (250 mA) +24 V
while contact 2 provides a fused (250 mA) 30 V (AC/DC) rated contact
closure. For more technical information about the relay contacts see
External Contacts on page 56.
Relative A/D Conversion
The relative A/D conversion consist of a A/D converter a D/A converter with
differential amplifier and a divider and filter. In addition a filter and amplifier
for the pressure signal is needed and a comparator for the overpressure
signal.
The relative A/D converter delivers a binary data word which is independent
from the absolute value of the signal. The output data word shows the %
difference of the actual value compared to a reference value.
The 8 bit D/A converter and the differential amplifier provide the reference
voltage U
Ref
. The dynamic range for the relative measurement represents
6.4% of the absolute value of the signal. The divider and filter stage
determines the Reference signal which is Ref=U
Ref
x 12.8%.
The pressure signal from the high pressure damper is filtered and amplified.
The outlet of this stage is the input voltage (U
In
) for the A/D converter. The
same signal is directly fed to the BNC output which has a resolution of
2 mV/bar for the range between 0 to 440 bar. The output has an offset of
30 mV (typical value) for offset compensation of the damping unit.
The comparator compares reference signal and actual pressure signal. In
case of overpressure conditions the flow will be reduced via the PDC board.
The A/D converter allows different operation modes. Measurements of the
difference between U
Ref
- U
In
in relation to the reference (Ref) value or the
absolute measurement of U
In
- AGND in relation to Ref is possible. The
results will be used by the processor to show the pressure ripple and the
actual pressure on the display. It is also used to reduce the flow in case of
overpressure conditions and for the online diagnostic (for example gas
bubble detector, ball valve check, and so on).
The BNC output is an additional diagnostic tool for checking the
performance of the pump. For normal operation the use of the displayed
pressure ripple is sufficient.
Figure 34 Board Layout RAD
Firmware Board (SFW)
Firmware Board (SFW)
Repair Level: Board
The SFW board is a piggy back board, placed on RAD board (personality
module).
The programmed SFW contains the firmware of the 1050 pump module.
The board is designed for on board programming.
The FIM contains 128K x 8bit EPROMs.
All inputs/outputs are pulled down for electrostatic discharge protection.
Figure 35 Layout of SFW Board
Table 39 Part Numbers for FIM Board
Item Part Number
Firmware Board (SWF) 01018-66506
HRI Board - Heater Isocratic Board
Repair Level: Board or Fuses
The main function of the board is to control the column heater in the solvent
conditioning module of the 1050 Isocratic Pump.
Fuse
Fuse F4 (2.5A) protects the +24V for the heater foil for overcurrent
conditions.
Control Logic
The control logic synchronizes the communication between the HRI and the
main processor.
Status Register
The register provides the main processor with the board identification.
Synchronization
The circuit receives the timing for the D/A converter from the main processor
via the control logic. Synchronization adapts the timing to the needs of the 12
bit D/A converter.
Pulse Width Modulator
When the column heater is turned on the main processor provides control
signals to the pulse width modulator. The output is a TTL signal with a duty
cycle which depends on the temperature difference (error signal) between
actual and setpoint temperature.
Table 40 Part Numbers for HRI Board
Item Part Number
HRI 01018-66517
Fuse: F4, 2.5 A 2110-0083
Figure 36 Block Diagram HRI/HRQ Board
Temperature Measurement
The temperature of the heat exchanger is measured with a Pt. 100
temperature sensor. (Resistance 1000 Ohm; at 0C and approximately
1400 Ohm; at 100C). The temperature converter circuit provides an analog
signal (0V to +5V) correlating to the temperature of the heating block. The
chosen setpoint temperature is converted in a reference voltage via the 12 bit
A/D converter. Actual and setpoint temperature are then compared in the
comparator.
The derived error signal is send via Latch 1 to the main processor which
updates the necessary signals for the heating section. The sensor check
circuit provides information whether the temperature sensor is installed or
not.
Heater Driver
The heater driver circuit contains the power stages for the heater foil. If the
temperature of the heater block exceeds 100C a over-temperature switch on
the heater foil interrupts the connection to the heater driver.
Latch 2
The latch provides the signals to the multi color LED which gives visible
information about the heater status. The LED shines green when the heater is
on and at correct temperature. When maintaining the temperature the LED
flashes yellow indicating the percentage of power used. The LED shines
yellow when the heater is on and is at correct temperature but the not ready
time has not been elapsed. During the heating up phase the LED flashes
yellow. A red LED appears in case of error conditions.
The system ok signal (SOK) of the processor is connected to the latch. In
case of problems Latch 1 and the PWM are disabled and the heating process
is interrupted.
Board Layout
Refer to Board Layout HRI/HRQ on page 133.
Repair Level: Exchange Board or Fuses
The main function of the board is the control of the column heater as well as
the multi channel gradient valve (MCGV). The board comprises the function
of the HRI Board. Therefore only the multi channel gradient control has been
described. The HRQ board replaced the gradient valve driver board (GVD)
which controlled the MCGV.
Block Diagram
Refer to Block Diagram HRI/HRQ Board on page 129.
Fuses
Fuse F16 (1A) protects the +36V for the multi channel gradient valve (MCGV)
for overcurrent conditions. Originally the fuse had 500 mA which was a
incorrect value.
Control Logic
The control logic synchronizes the communication between the HRQ and the
main processor.
Valve Sequence Register
The valve sequence register contains the information about the sequence in
which the solenoids of the MCGV should be activated (for example A, B, C, D
or A, C, D and so on).
Table 41 Part Numbers for HRQ Board
HRQ 01018-66518 01018-69518
Fuse: F4, 2.5 A 2110-0083
Fuse: F16, 1 A 2110-0007
4 Bit Counter
The control chip divides the piston path length for one stroke into four parts.
The length for each part is depending on the flow composition. The four bit
counter gets a pulse each time the portion is changed. The output is a 2 bit
data word for the valve select memory.
Valve Select Memory
The following figure shows an example for the input and output of the valve
select memory circuit. The channel number information comes from the 4 bit
counter. The pump drive control board (PDC) supplies the gradient power
pulse (GPP) and the blank out pulse (BOP). GPP delivers the power
switching signals for the multi channel gradient valve (MCGV). BOP makes
sure that all solenoids of the MCGV are switched off before opening the next
one. Valve sequence register gives the relation between the four piston
portions and the solvent channels. Output of the valve select memory is the
accurate timing for the four solenoids of the MCGV.
Figure 37 Valve Select Memory Signals
Valve Driver
The valve Driver contains the power stages for the multi channel gradient
valve (MCGV).
Common Valve Switch
Fast switching of the four valves without any interference between the
channels is achieved with the common valve switch. One side of all the four
valves is connected together and is opened each time before switching to the
next valve (BOP).
Figure 38 Board Layout HRI/HRQ
Repair Level: Damper
The High Pressure Transducer Board (HPT) is built into the High Pressure
Damper and measures the system pressure on the high pressure side. A
negative going voltage is provided showing a linear characteristic between 0
bar to 440 bar from -1 V to -8 V. The measurement is taken with a strain gauge
bridge. The firmware of the pump allows a interactive offset adjustment for
the damping unit. In certain limits the software compensates the offset of the
high pressure transducer.
NOTE The HPT is installed and preadjusted in the factory. In case of malfunctions the
complete assembly should be replaced in the field.
Figure 39 HPT Pressure Diagram
Figure 40 Block Diagram HPT
Repair Level: Board or Fuse
The connector board (CON) allows easy access to plugs for the multi channel
gradient valve (MCGV) active inlet valve and the leak sensor. The connector
cable transmits the signals to the motherboard and from there it is fed to the
various boards. The fuse protects the active inlet valve circuit for overcurrent
conditions (only on board revisions B and greater).
Figure 41 Board Layout CON
Table 42 Part Numbers for CON Board
Item Part Number
CON (NEW) 01018-66505
Fuse: F2, 375 mA 2110-0421
Table 43 CON Connectors
Connector Function
J1 MCGV
J2 not used
J3 Active Inlet Valve
J4 Leak Sensor
J5 Cable
J1 MCGV
Repair Level: Board
The Motherboard connects the various boards of the pump to each other and
supplies the signals for the front parts like metering drive, damper, MCGV,
fan and keyboard. Figure 42 shows the location of all connectors, Figure 43
to Figure 45 show the main signals of the pump.
Figure 42 Layout of Pump Motherboard
Table 44 Part Numbers for LUM Board
Item Part Number
HPS Board 01018-66501
J1 - Power Supply J6 - Not used J11 - Fan
J2 - PDC Board J7 - CMP J12 - High Pressure Damper
J3 - RAD/SFW Board J8 - FIP Keyboard J13 - Connector Board Cable
J4 - not used yet J9 - Temperature Sensor J14 - Metering Drive Motor
J5 - HRI/HRQ Board J10 J15 - Shaft Encoder
Figure 43 Connection Table HPS (I)
Figure 44 Connection Table LUM (II)
Figure 45 Connection Table LUM (III)
7
7 Pumps: Diagnostic Information
This chapter provides information on error
messages and diagnostic features of the 1050
Pumps
Pumps: Diagnostic Information
This chapter provides information about:
Test Functions
Flow (Pressure) Tests
Pump Pressure Ripple
Normal Pressure Test
Modified Pressure Test
Flow Test Method - Firmware Revision 1.0
Flow Test Method - Firmware Revision 3.0 and above
Gradient Test
Error Messages
Selftest
Common 1050 Messages
Pump Initialization
Normal Operation
Column Heater
Online Monitor
Troubleshooting Hints (Pressure Tests)
Pressure Tests with water and methanol
Pressure Tests when the pump is broken
How to use the Diagnostic Test Functions
How to use the Diagnostic Test Functions
The test function of the firmware is part of the control section. The first test
function is a online monitor of the actual pressure ripple. The two other
programs allow verification of the pump performance. The two test methods
are also used for the final test of the 1050 Pump modules.
Press CTRL and with Next move the cursor to
TEST FUNCTIONS (enter)
After pressing Enter the following TEST FUNCTIONS are accessible.
PUMP PRESSURE RIPPLE YY.Y%
Monitors the actual flow ripple if the diagnosis level (Configuration) is turned
on (1, 2 or 3).
LOAD FLOW TEST METHOD
Loads a special program (pressure test) for performance verification of the
flow system.
LOAD GRADIENT TEST METHOD
Loads a gradient test program (tracer test) for the performance of the
gradient system.
The pressure ripple display shows the actual pressure variation of the solvent
flow. It can be used as a quick check for determination of gas bubbles in the
system. If the online diagnostic is turned on no pressure ripple (--.-%)
indicates either no flow in the system or too many gas bubbles in the system
exceeding the measurement range or a pressure below 30 bar to 50 bar.
Positive pressure ripple values (for example 0.5%) are shown when the pump
is overcompensated. Negative pressure ripple values (for example -0.8%) are
shown in case of an under compensated pump.
Whether the values in the display are either positive or negative is strictly
depending on the solvents in use and the respective pressure compensation
values which are user selectable. Typical pressure ripple readings are in the
range 1%. A higher ripple which can not be reduced by pressure
compensation changes may indicate an air bubble.
NOTE In purge mode the pressure ripple is not measured. The display might show
incorrect values during this time.
The pump has an analog output for the pressure signal for monitoring and
troubleshooting purposes. The tightness and performance of the pump can
be tested with various pressure tests. The outlet of the pump will be blocked
and depending on the chosen pressure test the system pressure rises until it
is stopped either by the program itself or the pressure limit.
The plotted pressure signal provides information about the performance of
the system. In case of system failures it might be possible to combine the
pressure tests for clear identification of the failing part.
Firmware revision 3.0 and above
These firmware provide an additional feature which allows to monitor which
of the two piston is delivering into the system. This is a very helpful tool
when troubleshooting the system. Pressure drops in the pressure tests can be
related to the delivering piston. Conclusions which parts failed are much
easier done.
Press Status and twice Next to get the following display.
currently active piston 1
The display shows whether piston 1 or piston 2 are just delivering into the
system. ** indicates that the change from one piston to the other is to fast to
be monitored (flow >1.2 ml/min).
Prerequisites for the Pressure Tests
1 Place a bottle of isopropanol (HPLC grade) into the solvent cabinet and
connect it to one of the solvent channels (lets take channel B).
2 Switch on the degassing for that channel and establish an appropriate
helium flow rate in the bottle.
3 Connect the signal cable between RAD board and integrator input (for
example a 339X integrator). The pressure signal provides 2 mV/bar.
4 Purge the channel (B). Observe the pressure reading until the value is
stable. The pump pressure ripple display should show a value in the range
0.5% for isopropanol (with default settings).
NOTE If the system is not well primed or degassed incorrect measurements may be
taken resulting in wrong interpretation of the plots.
5 Set Integrator parameters (339X series).
Zero 10
ATT 2
10
CHART SPEED 2 cm/min
Normal Pressure Test
This test is well known for verifying system tightness.
Turn on pump and set FLOW 0.000 ml/min and disconnect the interface
tubing at pump outlet.
Plug pump outlet with a blank nut (01080-83202).
Start the integrator with the plot mode.
Set Flow FLOW 1.000 ml/min to start the pressure test.
Figure 46 Normal Pressure Plot with IPA
Explanations to Plot
The plot shows a typical pressure profile of a normal performing 1050 Pump.
With the flow of 1 ml/min the pressure in the system raises until the pump
stops via the overpressure condition at 400 bar. After one minute wait time
the pressure drop should not exceed 5 bar/min.
The Modified Pressure Test
This test is a slight modification of the previous used normal pressure test.
Turn pump on, set FLOW 0.000ml/min and disconnect the interface
capillary at the outlet of the pump.
Plug pump outlet with a blank nut (01080-83202).
Start the integrator with the plot mode.
Set Flow FLOW 1.000ml/min to start the pressure test.
Observe the pressure display and reduce the flow to FLOW 0.100ml/min
at approximately 200 bar.
Figure 47 Modified Pressure Test with IPA
Explanations to the Modified Pressure Plot
The pressure in the system rises as seen in the previous test. When switched
to the reduced flow rate the pressure increases with a lower slope. During
the time until the system pressure limit will be reached piston I and II deliver
alternately into the system. A straight line as seen indicates that both piston
chambers are leak free. After switched off at 400 bar and one minute wait
time the pressure drop should not exceed 5 bar/min.
Flow Test Method
The firmware of the pump module holds a firmware resident flow test
method which contains the parameters for the pressure test. The parameters
cannot be displayed. During the life time of the instrument the firmware has
been changed (communication update rev. 1.0 to 3.0) and the flow test
method was revised. Therefore firmware revision 1.0 and 3.0 run different
tests when the flow test method will be executed.
Place a bottle of isopropanol (HPLC grade) into the solvent cabinet and
connect it to one of the solvent channels (lets assume its channel B).
Set PRIMARY CHANNEL B
NOTE The Test Method uses exclusively the solvent specified by the primary
channel and ignores the setting of the % display. However for flushing the
system a setting %B 100 is necessary.
Connect the signal cable between RAD board and integrator input.
Flush the system. Observe the pressure reading until the value is stable.
(hint: use pressure ripple display).
Set FLOW 0.000ml/min and disconnect interface tubing at pump outlet.
Load Flow Test Method.
NOTE Loading the flow test method resets the pump an action which moves the
pistons into a predefined position. In addition the instrument sets the actual
flow to zero (FLOW 0.000ml/min) if not already set.
Plug the pump outlet with a blank nut (01080-83202).
Set integrator parameters (339XA)
Attenuation 2
10
Chart Speed 1 cm/min (PLOT mode).
Press START, then ENTER to run the test method.
Flow Test Method - Firmware Rev. 1.0
Figure 48 Pressure Test (Rev. 1.0) with IPA
Explanations to Pressure Plot
Following are some remarks to the various steps in the plot.
NOTE The pump displaces approximately 150 l until the first plateau will be
reached at a pressure of 120 to 130 bar. After pump initialization the 1. piston
is in its upper position which means the 2. piston starts delivering into the
system. With the given stroke length of 70 l strokes of both pistons (II-I-II- I)|
are necessary to reach the 1. plateau. Drastic leaks at active inlet valve outlet
ball valve or seals will disturb the intake stroke of the 1. piston. The result
might be a pressure drop when the 1. piston takes over to deliver into the
system at a pressure between 20 to 40 bar. If the pressure test does not reach
the first plateau the pressure plot cannot give any reliable diagnostic or
troubleshooting hints.
1 From the predefined position the pistons start moving with a flow of 150 |
and rises the pressure in the pump.
2 At the first plateau the firmware makes sure that the first piston is delivering
into the pump. With the very small flow rate of 2 l the pump pressure should
remain stable. During the 1min at this plateau a maximum pressure drop of
5 bar is allowed (pressure display). At this position the tightness of the whole
system is measured.
3 Pressure is increased until the second piston is delivering.
4 At the second plateau the second piston is delivering into the system with a
flow of 2 l. Again a straight line is expected. A pressure drop of 5 bar during
the 1min is allowed.
5 The pistons move now with a higher speed (flow 500 l/min) increasing the
pressure in the system.
6 While increasing system pressure the pistons move with a stroke volume of
4 l. The system pressure must reach a value of 330 bar 30 bar. This part of
the test checks for the mechanical tolerances from system to system and is of
minor interest for system troubleshooting.
7 The system pressure is increased until the system shows an overpressure
condition (>400 bar) which turns the pump off. 1 min after turning off the
pump pressure drop should not exceed 5 bar/min.
Possible Failure Modes
The most relevant service information are obtained from the plot of the first
(2) and second (4) plateau of the pressure plot. Three major failure modes
are possible. For troubleshooting the system both plateaus should be seen
together and not separately.
The following plots show the different failure modes.
Straight line at first plateau but negative slope at second plateau
Figure 49 Negative Slope at second Plateau
The plot shows a leak free system when the first piston provides the flow.
But during the stroke of the second piston the pressure drops down
indicating a internal leak. The pump seals are definitely ok.
Possible failure:
Contaminated outlet ball valve (backflow).
Negative slope at first plateau and stable plot at second plateau
Figure 50 First Plateau unstable
Plot shows malfunction in the system when the first piston maintains the
pressure in the system. The delivery stroke of the second piston is separated
from the first one via the outlet ball valve and shows no problem.
Possible failure:
leak at first piston seal
leak at active inlet valve
no tight connection at outlet ball valve.
Negative slope at both pistons
Figure 51 Problems at both Plateaus
Plot shows same failure mode on both pistons when maintaining the pressure
in the pump. Under the assumption that the slope has the same angle for both
plateaus it can be said that the problem is probably coming from the second
piston chamber. Different angles indicate more than one leak in the pump.
Possible failure
Blank nut not tight enough
Fittings at frit adapter assembly or damper not tight
Leaking piston seal at second piston.
Flow Test Method - Firmware Rev. 3.0 and above
Figure 52 Pressure Test (Rev. 3.0) with IPA
Explanations to Pressure Plot
NOTE This flow test method is pressure controlled. The actual pressure has to
exceed at least 270 bar for the first step otherwise the test cannot reach the
following steps.
1 Starting with a flow of 500 l/min and a stroke of 20 l the pump starts
delivering into the system. The pressure rises until the damper detects a
system pressure of more than 270 bar. The pump continues to deliver with
the same parameters until piston I reaches its upper limit. At this position
the stroke is changed to 80 l and piston II delivers one stroke with the
larger stroke volume.
2 Now the flow is changed to 100 l/min (stroke 80 l) and piston I continues
with this parameters for about 1/3 of its stroke.
3 At the plateau piston I delivers for approximately 1 minute with a very low
flow rate (4 l) into the system. A straight line or a slight pressure increase
is expected for a normal performing pump. A pressure drop during this
minute indicates a problem in the pump.
4 Piston II delivers into the system. At the end of the first plateau the flow is
increased back to 500 l until piston II reaches approximately 1/3 of its
stroke. At the second plateau piston II delivers with a very low flow rate
(4 l) into the system. A straight line or a slight pressure increase is
expected for a normal performing pump. A pressure drop during this
minute indicates a problem in the pump.
5 The flow is increased to 250 l and the pumps works with this rate until the
damper detects more than 390 bar. The flow is set to zero and the test is
finished. It might happen that the system stops with a pressure slightly
below 400 bar. This allows to restart the pump without reset. In most of the
cases the pressure will exceed the upper pressure limit of 400 bar and will
show the error message. 1 minute after reaching the maximum pressure of
the test the pressure drop should not exceed 5 bar/min.
Possible Failure Modes
The plateaus (3, 4) of the pressure test provide the same information like in
the previous test (Rev. 1.0). The only difference is that the two plateaus are
moved to higher pressure values. The section pressure plots of this manual
will provide additional pressure tests under failure conditions of the pump.
Gradient Test Method
The test measures all the relevant data which have an influence on the pump
performance. The step performance of the MCGV and the gradient linearity
are controlled with this tracer test. The tracer test is a chromatographic test
and therefore requires a UV detector connected (no column installed) to the
1050 Pump module. The gradient test is decided into two parts. The first part
tests the step reproducibility of a gradient and the second part tests the
linearity of a gradient.
Prerequisites for the Gradient Test Method
Place the following solvents (HPLC grade) into the solvent cabinet and degas
them thoroughly.
Running the Gradient Test Method
1 Flush each channel for a couple of minutes.
2 Connect the outlet capillary of the pump to a detector.
3 Set detector parameters Sample Wavelength 267 nm (Bandwidth 4 nm) or
equivalent, Reference Wavelength 550 nm, 100 (if available) or equivalent
or fixed reference.
4 Connect the signal cable between detector and integrator.
Channel A Distilled Water
Channel B Tracer (Isopropanol + 0.5% Acetone)
Channel C Isopropanol
Channel D Isopropanol
5 Set integrator parameters (339X).
Zero = 5
Att 2^ = **
CHT SP = 1.0
PK WD = 0.01
THRSH = 11
AT 12 min Att 2^ = **
AT 12 min CHT SP = 0.5
AT 45 min STOP
** The tracer concentration may vary from mixture to mixture. Therefore
check for the appropriate integrator attenuation. Start the integrator
manually change %B = 7 observe the plot and adjust the attenuation to a
value which gives the highest deflection without exceeding the paper
range.
Proceed in the same way with %B = 100. Set the pump parameters back to
start values (%B = 0).
6 Load gradient test method.
7 Press START, then ENTER to run the test method.
Figure 53 Gradient Test Method (part 1)
Figure 54 Gradient Test Method (part 2)
Explanations to Gradient Test
In the first part of the test the step reproducibility will be tested. The steps
should have all the same height except the last two steps. The last steps
(from 2% to 1% to 0%) will not have the same step height because of a too
small solvent volume versus the switching time at this positions. In addition
the composition precision can be tested. The noise on each of the steps
should not exceed 50% of the step height. Typically values of 30%
representing a composition precision of 0.15% are reached.
In the second part of the test the gradient linearity will be verified. Except of
the bump at the upper end of the gradient the curve should show a straight
line indicating a good linearity of the system. Be aware that the performance
of the detector (linearity, stray light, and so on) will have a significant impact
on the results.
Error Messages
Error Messages
The error messages will help to locate and repair a failure. In case an error
message appears the Error LED will be turned on and the message will be
written into the system logbook. Reset Pump or switching on the pump
again will reset the error. The entry in the logbook remains.
The error messages can be divided into the following blocks:
Selftest
PANIC Error
Pump Initialization
Normal Operation
Column Heater
Online Monitor
Selftest
Selftest
ROM/RAM Test
RAM and display can be tested via the build in selftest. The selftest will be
performed when CRTL will be pressed while the module is turned on at the
LINE~ switch. In case of a failure one of the following messages appears. The
complete test requires approximately two minutes.
ROM test failed ( ROM test failed )
The ROMs on the SFW board are tested. In case of a checksum error the
ROM test fails.
Replace the SFW board.
RAM test failed ( RAM test failed )
The RAMs on the CMP board will be tested. In case of a failure the error
message appears and the CMP has to be replaced.
Replace the CMP board.
Panic Error / Bus Error Address Error
Panic Error / Bus Error Address Error
PANIC: XXXXXXH BUS ERROR
PANIC: XXXXXXH Address ERROR
The panic error messages should not appear under normal operation
conditions. In case of hardware or firmware problems the instrument might
try to access a wrong or not existing address which results in the error
message on the display. The instrument is locked up and has to be switched
off/on.
Reason for the PANIC error message can be any disturbance on the bus lines
due to bad contacts (high resistance) or defective IC on any of the boards.
Check boards for good connections or corrosions at the contacts (clean
contact pins).
Check revision of firmware board (SWF). It should be revision C or higher.
Revision C boards do have a dynamic bus termination for spike
suppression on the bus lines.
Replace one board at a time to identify the faulty one.
If board replacement will not cure the problem replace the motherboard.
Common 1050 Error Messages
The common messages are either event or error messages which may appear
in all the 1050 series modules. The messages are identical or very similar in
the various modules.
E00 : Power Fail E00 HH:MM DDMMM power fail >
This message indicates that the instrument has either been disconnected
from line source or a line power voltage drop has occurred. System clock will
stop and has to be set again after turning on the pump.
E01 : Leak Detected E01 HH:MM DDMMM leak detected >
leak detected in pump
The leak detection system uses a PTC resistor as leak sensing item. Liquid
cooling the PTC results in a decrease of the resistance. The PTC is built in a
resistor divider which is connected to a constant voltage. From the voltage
divider a signal can now be obtained depending on the current through the
PTC and hence depending on the temperature. The leak detection circuit is
located on the CMP board and checks continuously for presence and leak
conditions. If the sensor is missing (defect) or in leak condition the PTC is
cooled down the error message appears (only when pump motor was turned
on beforehand otherwise only a status information is given). When the
module is turned on the leak message will be disabled for a short period of
time (30 seconds) to allow the sensor to warm up and stabilize.
Actions:
Check for leaks in the pump module.
Change leak sensor.
Change CMP board.
Change SFW board.
E02 : Shutdown In
Other Module
E02 HH:MM DDMMM shut down >
error in other module
An external device pulled the shut down line of the remote connector down.
This forces the pump to stop the pump motor inhibiting a flow into the
system. Probably a leak appeared in one of the connected modules.
E03 : Error Method
loaded
E03 HH:MM DDMMM error method >
error method has been loaded
The operator may define a method as a error method. The event message
indicates that the module detected an error and that the error method was
loaded.
E04 : Time Out E04 HH:MM DDMMM time out
The operator may define a time after which the instruments stops all further
actions. Mainly two cases will lead to the time out message. First if a normal
run is finished the pump is turned off after the specified time (only if no new
start command appears during this time). Second a not ready condition in a
sequence mode or in multiple run mode will start the time out timer
eventually leading to the message.
Pump Initialization Error Messages
During the pump initialization the system performs some start up routines to
prepare the motor drive system for normal operation. The system starts the
servo system and measures the upper dead center of the first piston.
Malfunctions during the turn on process will lead to the following error
messages.
E11 : Gradient
feedback failed
E11 HH:MM DDMMM init failed >
gradient feedback failed
In case the gradient valve (MCGV) is installed and recognized during boot up
the system turns on the Primary Channel before it starts with any other
action. The error message indicates that the primary channel could not be
turned on. Reason is an communication problem between the pump drive
control board (PDC) and gradient valve driver board (HRQ).
Check for proper connection of HRQ and PDC boards.
Replace HRQ board.
Replace PDC board.
Work around: Set different primary channels one of them should work. Use
pre mixed solvents and connect the solvent directly to the active inlet valve.
E12 : Servo restart
failed
servo restart failed >
The first action for the servo motor is to switch on the C-phase of the variable
reluctance motor. The rotor will move to one of the C-positions. This action
is called the Servo Restart. From such a rotor stator relation the servo will be
able to take over the phase sequencing with the commutator (on the PDC
board). If the rotor is not able to move or the C-phase cannot be reached the
error message appears.
Check Fuse on the PDC board.
Check cables to pump motor.
Check for mechanical blockage of the drive system.
Change PDC board.
Change drive assembly.
E13 : Pump timeout E13 HH:MM DDMMM init failed >
pump timeout
After restart the pump will move the first piston to its upper position. The
upper position is recognized when the piston touches the mechanical stop
rising drive power for the blocked motor. If the piston will not reach the
upper limit within one minute the initialization will be stopped and the error
message appears.
Check gears of the drive assembly (broken coupler?).
Change PDC board.
Change the drive assembly.
E14 / E15 / E16 The following three error messages use the same measurement principle
with different limits. During the pump initialization the first piston hits the
upper dead center of the pump head and stops there. To make sure that the
piston will not run into this mechanical stop during normal operation the
index hole of the motor shaft encoder wheel is used as the initialization
reference. From the upper center the piston travels back until it reaches the
index hole. There will be no reinitialization during normal operation
(initialization only during pump on procedure or pump reset command). The
Index position is expected in a certain range from the upper dead center. If
the Index does not appear in this range one of the three messages will show
up on the display.
E14 : Home position
not found
home position not found
After the piston has hit the upper limit it will move down to find the first
Index hole of the encoder. If the Index is not found in the maximum allowed
number of steps this error message appears. The communication to the shaft
encoder index hole is missing.
Check cable and connector of the encoder.
Check PDC board connection.
Change PDC board.
Change Drive Assembly.
E15 : Home position
out of limit
home position out of limit
When the motor is stopped for reversing the direction the moment of inertia
of motor and spindle will continue the movement for certain steps until it
finally stops. Therefore an minimum number of steps is necessary until the
Index should be reached. In case the number is to small this error message
appears. Changed adjustment or sticking movement of the system can be the
reason for this.
Check drive system for smooth movement.
Change motor drive assembly.
Change PDC board.
E16 : Pump head
missing
pump head missing
The mechanical tolerances from one system to the other need an offset
compensation to make sure that the piston reverses its direction always at
the same position. If the distance between the upper limit and the first index
exceeds the compensation range but is still below the maximum limit (E14)
the error message will show up. Reason can be that the pump head is missing
or not mounted in the right way.
Mount pump head correctly.
Change PDC board.
E17 : Idle power
exceeded
idle power exceeded
The PDC board measures the actual electrical current. If the motor needs
more then a defined current for a pressure free pump it indicate a failure in
the system. Reason is either an tight mechanical system or a defective motor.
Check PDC board.
E18 : Stroke length
misadjusted
stroke length misadjusted
This error message appears only when the pump is running in DIAGNOSE
LEVEL 3 which is a manufacturing test. The error indicates a incorrect
spindle position adjustment.
Hint: If error message E27 occurs when pump works with 100 l stroke
volume diagnose level 3 allows a quick check of the pump. Set diagnose level
3 and turn on pump. If E18 occurs the metering drive is mis-adjusted and
generates the E27 problem. Metering drive has to be changed.
Normal Operation Error Messages
Operation error messages can be detected at any time of a normal operation.
They are normally independent of the current state of the pump. The ERROR
LED will be ON and the message will be entered in the logbook. Restarting
the pump will reset the error.
E19 : Pressure above
upper limit
E19 HH:MM DDMMM press too high >
pressure above upper limit
The actual pressure in the system is continuously monitored during
operation of the pump. The firmware allows only operation up to the user
defined upper limit, if not in purge mode. If the high pressure damper detects
more than the upper limit the pump is turned off or a specified error method
will be activated and the error message appears. All this measurements are
performed on the RAD board.
Check flow system for blockages.
Check Flow setting.
Change RAD board.
E20 : Pressure above
maximum limit
E20 HH:MM DDMMM press too high >
pressure above maximum limit
The system pressure is normally checked with the upper and lower limit
values. In case of any malfunction (for example pump does not stop at
400 bar rapid fast pressure increase) in the system which allow the pressure
to rise above 420 bar the pump is stopped and the error message appears.
This message shows up when the system is blocked and the pressure shoots
up very fast (pressure test).
Check flow system for blockages.
Check flow setting.
Change RAD board.
Change PDC board.
E21 : Pressure below
lower limit
E21 HH:MM DDMMM press too low >
pressure below lower limit
The lower limit value function is firmware controlled. In case the system
pressure drops once below a user defined value the pump motor will be
turned off or the specified error method will be activated and the error
message appears. The error message allows to check the system for empty
solvent bottles, broken capillaries, fitting leakage and so on.
Check flow value and solvent composition.
Check all seals and fittings in the complete LC system.
E22 : Temperature
sensor failed
E22 HH:MM DDMMM sensor failed >
temperature sensor failed
While the pump is turned on the firmware checks for the presence of the
temperature sensor. In case the sensor is disconnected defective or the
sensor is activated (switch open) by an over temperature condition the error
message appears. The temperature sensor switch opens at 90C and the
pump motor will be turned off.
Check fan.
Check air filters.
Check sensor with meter.
Change metering drive.
Change RAD board.
E23 : Motor
temperature
exceeded limit
E23 HH:MM DDMMM overtemperature>
motor temp exceeded limit
The highest power consumption in the module is inside the variable
reluctance motor. High system back pressure at low flow rates results in
maximum heat dissipation. A fan and a special designed foam part make sure
that the heat of the motor is brought out of the instrument. In case the
airstream of the module is interrupted or the fan fails the motor temperature
will rise above allowed limits. A thermal switch is mounted on the surface of
the motor and turns off the pump when the temperature exceeds 90C.
The error event circuit reacts immediately on the PDC board and turns off
the pump motor power. The same signal line on the PDC board is also used
from the system ok command (SOK). This means that the error also appears
in case of a SOK error. The SOK is set when the processor has locked up
preventing damage of pump or others or one of the boards holds the signal
down.
Check fan.
Check air flow path.
Check temperature of the motor.
Change PDC board.
Check all other boards in the system.
Change CMP board.
E24 : Inlet valve
disconnected
E24 HH:MM DDMMM valve missing >
inlet valve disconnected
If the active inlet valve is disconnected and the first piston is delivering
solvent the valve may be damaged. Therefore the presence of the active inlet
valve is controlled. In case the active inlet valve is not connected during the
initialization of the pump the pump motor is turned off and the message
occurs.
Check Connector of the valve.
Check the connector cable to the motherboard.
Change RAD board.
E25 : Adjust pressure
offset
E25 HH:MM DDMMM pressure offset>
adjust pressure offset
The high pressure damping unit measures the system pressure in the range
from 0 to 400 bar. Thermal drift of the electronic components may cause drift
to negative values. If the pressure offset is below -15 bar the error message
appears on the display. Incorrect adjustment may influence the pump
performance (pressure ripple measurement and so on).
Perform offset adjustment.
Check connector of damping unit.
Change RAD board.
Change damping unit.
E26 : Pump drive lost
init values
E26 HH:MM DDMMM init lost
pump drive lost init values
The reference position for the upper limit of the piston is reached during
each pump cycle. In case the difference of the actual value in relation to the
value of the initialization is too large the system will turn off the pump and
the error message appears.
Check connector and cable of the encoder.
Change PDC board.
E27 : Max motor drive
power exceeded
E27 HH:MM DDMMM power use high>
max motor drive power exceeded
The power consumption of the motor drive will be monitored. In case of
servo failures or blockages of the ball screw drive the motor current will
exceed the maximum limit and the processor will turn off the pump.
Check motor drive for smooth movement.
Check the +12 V on the PDC board.
Change PDC board.
Check outlet ball valve for blockages.
E28 : Secondary
Powerfail
E28 HH:MM DDMMM Sec Powerfail >
+12 V analog supply failed
The +12 V generated on the PDC board will be continuously checked for
under voltage conditions. In case the voltages drops below approximately
+10 V the pump will shut down and the error message will appear. The +12 V
will be also used on the RAD board and the pressure transducer board of the
damping unit.
Change the PDC Board.
Change the RAD Board.
Change the Damping Unit.
Column Heater Error Messages
The following messages may appear as you work with the column heater.
E33 : Column heater
cable disconnected
E33 HH:MM DDMMM column heater >
cable disconnected
The firmware recognizes the column heater option when the cable is correct
installed. If afterwards the cable is disconnected or a wrong cable is
connected to the HRI/HRQ board the error message appears and the red
error LED is turned on.
NOTE When the remote cable is connected to the HRI/HRQ board the error message
will appear and the +24 V of the board is disabled to prevent damage of the
modules which are connected to the remote cable.
If the column heater cable is connected to the remote connector of the pump
module the LED on the heater module will lit yellow/red.
Check for correct cabling of the column heater module.
E34 : Column heater
board failed
board failed
The watch dog circuit on the CMP board (SOK signal) controls the correct
communication between processor and interface boards. If the SOK signal is
activated the error massage appears and the error LED of the pump module
is turned on and the column heater LED shines red. Reason for the error can
be either an electronic component failure or interference on the bus lines.
Reboot the pump module.
Reseat all boards in the card cage.
Change the HRI/HRQ board.
Change the CMP board.
Change the CIB board.
Change the SFW board.
Change the HPS board.
E35 : Column heater
overtemperature
overtemperature
The column temperature is normally checked with the Pt. 100. In case of
malfunctions the temperature may exceed the normal working range. At 90C
the firmware disables the heater circuit, sets the error message and turns on
the red error LED at the pump and the column heater. In case the heater
transistor is defective and still heats up the heat exchanger the over
temperature switch on the heater foil opens at 100C and interrupts heating.
Change the HRI/HRQ board.
E36 : Column heater
fuse blown
fuse blown
With the column heater turned on the firmware checks for the presence of
the +24 V on the HRI/HRQ board. If fuse F4 is blown, the +24 V is missing and
the instrument shows the error message, turns on the red error LED on the
pump and the column heater module. The fuse blows in case of a shortage on
the +24 V line.
Replace fuse F4.
Online Monitor Messages
The online monitor function checks the metering pump during normal
operation and is described in the diagnostic section. Messages may appear
when the chromatographic performance might be influenced or the
instrument is in a special mode (initialization purge).
The messages except of M01 and M11 are related to the Diagnose Level
(0, 1, 2) of the instrument. If the diagnose level is turned off (0) the messages
will be suppressed. Diagnose Level 1 writes the messages into the logbook
with no further action. Diagnose Level 2 writes the messages into the
logbook and the Not Ready LED will be turned ON. For more information
about the online monitor, see the diagnostic chapter.
M01 : Pump reference
initialized
M01 HH:MM DDMMM initialized >
pumps reference initialized
The initialization of the metering drive reference values appears under three
conditions. First after initial turn on of the pump after boot up second with a
reset pump command (Control Function) and third when the pump is turned
on and the reference values have been lost for any reasons. In this case the
message is an indication that a covered problem appeared while the pump
was turned off. Because of its state (off) the pump could not show the
malfunction and the instrument performs a new initialization. During this
initialization the probable error will be cleared and when the error is not
solid the pump will be turned on without problem.
M02 / M03 : Gas
bubble
M02 HH:MM DDMMM gas bubble >
gas problem ripple too high
M03 HH:MM DDMMM bubble solved >
problem solved ripple in range
If the pressure ripple of the pump exceeds a certain range the message M02
appears. In case of a temporary disturbance the ripple might return to its
normal working range and indicates this with message M03.
Check for proper degassing.
Check for appropriate compressibility setting.
M04 / M05 : 1st piston
leak
M04 HH:MM DDMMM 1st piston leak>
check seals or inlet valve
M05 HH:MM DDMMM 1st piston ok >
problem solved leak in range
If the online monitor function detects a leak in the first piston chamber the
above message M4 appears. If the instrument returns to normal operation
(problem solved by user) the message M5 indicates a good working
instrument. The occurrence of M4 is a very good indicator when the seals
should be changed.
Check for leaks a fittings.
Check for tight connection of the active inlet valve.
Change seals.
Change active inlet valve.
M06 / M07 : Valve
backflow
M06 HH:MM DDMMM valve backflow>
check outlet valve
M07 HH:MM DDMMM valve tight >
problem solved no backflow
M06 indicates that the pump detected a backflow in the outlet valve which
indicates that the valve has been closed but is not tight. M07 indicates that
the problem was solved.
Clean outlet valve.
Change outlet ball valve.
M08 / M09 : Outlet
Valve
M08 HH:MM DDMMM outlet valve >
clean outlet valve
M09 HH:MM DDMMM outlet valve ok>
problem solved outlet valve ok
M08 appears when the outlet ball valve shows a time delay before it blocks
the flow path in the correct way. This is an indication that the valve sticks
and need to be cleaned.
Clean outlet ball valve.
Change outlet ball valve.
M11 : Purging mode
activated
M11 HH:MM DDMMM purging >
purge mode activated
This message shows when the instrument was purged the last time.
Troubleshooting Hints
Troubleshooting Hints
This section gives practical hints in troubleshooting the pumps according to
the pressure plots:
Pressure Tests with different Solvents (water methanol)
Pressure Tests when the Pump is broken
Standard Pressure Tests with different Solvents
Standard Pressure Tests with different
Solvents
The factory tests all the 1050 Pumps with isopropanol (IPA). Therefore the
tests should be done with this solvent for comparison reasons. Sometimes
isopropanol is not available at customer side. Following are pressure tests
which are performed with water and methanol.
Modified Pressure Tests
The pressure profile looks very similar to the one with isopropanol. There are
little steps when the piston change there direction. This is due to the
compressibility compensation setting (default 100). It is important that the
slope for both pistons are parallel to each other.
With methanol the pressure drop at 400 bar is larger than with isopropanol
because of the lower viscosity.
Figure 55 Modified Pressure Test with Water
Figure 56 Modified Pressure Test with Methanol
With methanol the pressure drop at 400 bar is larger than with isopropanol
because of the lower viscosity.
Pressure Tests - Firmware Revision 1.0
The results with water and methanol are similar than the one with
isopropanol. The plateaus reach approximately the same height. Also the
step 6 should be in the range 300 bar to 360 bar. The test with water shows
that the step 6 exceeds already the upper pressure limit (400 bar). Reason is
the lower compressibility of water compared to isopropanol.
Figure 57 Pressure Test (Rev. 1.0) with Water
Figure 58 Pressure Test (Rev. 1.0) with Methanol
Pressure Tests - Firmware Revision 3.0 and above
Due to the pressure controlled test the results are very similar as the one with
isopropanol. The pressure drop with methanol is slightly larger.
Figure 59 Pressure Test (Rev. 3.0) with Water
Figure 60 Pressure Test (Rev. 3.0) with Methanol
The pressure plots of the 1050 Pumps are a helpful tool for troubleshooting
the pumping system. Online diagnostic messages and flow related error
messages should be always verified by the previous described pressure plots.
This section shows examples of pressure plots for different in the factory
generated failure modes. They should give indications how a possible failure
looks like. The modified pressure test and the flow test method for firmware
revision 1.0 and 3.0 are shown for the same failure symptom.
The modified test and the flow test method should be always used together to
get a clear information about the problem of the pump.
Pressure Tests - Leak at Piston Seal 1
Figure 61 Modified Pressure Test - Leak at Piston Seal 1
The flow is reduced to 0.1 ml/min at approximately 240 bar. From this point
both piston deliver with a constant value and increase the pressure to
<nobreak|320 bar|. From this point the pressure moves up to 400 bar in an
oscillating curve. This means that one of the two pistons has a leak rate when
delivering into the system. At the upper pressure limit (400 bar) the pressure
is stable. The outlet ball valve is closed in this position and indicates that the
leak is probably on the first piston side. In this case it is a defective piston
seal.
Firmware revision 3.0 allows to identify the leaky piston side via the current
active piston display.
Figure 62 Pressure Test (Rev. 1.0) - Leak at Piston Seal 1
The flow test method shows a quite normal pressure profile. Only on the
slope to reach the upper limit some pressure fluctuations can be seen. The
modified pressure test showed that the seal leaked at more than 320 bar.
Therefore the flow test method cannot detect this defective seal.
The flow test method reduces the flow to 100 l at approximately 320 bar.
The pressure drops and when the piston I delivers with its small flow rate a
continuous pressure drop can be observed at the first plateau. The second
plateau shows a slight pressure increase and the upper limit shows stable
conditions. The pressure drop at the first plateau indicates a leak on the first
piston side. In this case a leaky piston seal.
Pressure Tests - Leak at Piston Seal 2
Figure 64 Modified Pressure Test - Leak at Piston Seal 2
The flow is reduced to 0.1 ml/min at approximately 240 bar. From this point
both piston deliver into the system with a constant rate. At 360 bar to
<nobreak|370 bar| the curve is bent. With both pistons still delivering into the
system the pressure cannot exceed more than 380 bar. The fact that both
piston cannot increase the pressure above a certain value point to a leak on
the second piston side. In this case a leaky piston seal.
The pressure profile shows a pressure drop at the upper limit. The modified
test showed that the leak appears at more than 370 bar. Therefore the two
plateaus cannot show the malfunction. At the upper limit the outlet ball valve
is closed which indicates that the problem is on the second piston side. In
this case the flow test method cannot clearly identify the leaky seal. The
modified test is needed in addition.
Both plateaus for piston 1 and piston 2 and the upper limit of the test show a
certain pressure drop. Here it is very obvious that the problem is on the
second piston side. In this case it is the second piston seal.
Pressure Tests - Defective Piston 1
Figure 67 Modified Pressure Test - Defective Piston 1 (Stroke AUTO)
The pump is working with the default stroke (AUTO) setting. The flow is
reduced to 0.1 ml/min at approximately 260 bar. The pressure moves up to
the upper pressure limit in a oscillating curve. At the upper limit the pressure
remains stable. One of the two pistons generates a small leak when delivering
(pressure drop). The stable pressure line at 400 bar points to a problem on
the first piston side. Firmware revision 3.0 allows to verify that the pressure
drop appears on piston 1.
NOTE When the piston is scratched in a certain part the failure cannot be always
detected when using the default stroke setting. Therefore the test should be
done also with a stroke of 100 l.
Figure 68 Modified Pressure Test - Defective Piston 1 (Stroke 100 l)
Here the pressure test has been done with a stroke of 100 l. The pressure
profile gives additional information to the previous plot. When delivering
with the small flow rate the pressure increases for a long time but drops only
for a relatively short time. With the currently active display of firmware
revision 3.0 it can be seen that the pressure drops while the first piston is in
the middle of its stroke. This indicates that the piston itself is the source of
the problem. The test checks the pressure tightness of the seal over the full
length of the piston.
Figure 69 Pressure Test (Rev. 1.0) - Defective Piston Seal 1
Before the pressure reaches the two plateaus there is always a pressure dip
when the piston change there direction. Before the pressure reaches the
upper limit an oscillating curve can be seen. At the upper limit the pressure is
stable. All this indicates that the pump is not working correctly but it is very
difficult to locate the source of the problem.
Figure 70 Pressure Test (Rev. 3.0) - Defective Piston 1
The pressure increases in an oscillating curve. When exceeding 270 bar
piston 2 delivers with one large stroke into the system and increases the
pressure by more than 40 bar. This points already to a problem on the first
piston side. Now piston 1 delivers into the system increases the pressure for
a short time and then the pressure decreases for the whole plateau. The
second plateau looks quite normal and also the upper value when reached
after some pressure dips is stable. It is quite obvious that the problem is on
the first piston side. In this case the piston is defective.
Pressure Tests - Defective Piston 2
Figure 71 Modified Pressure Test (Stroke AUTO) - Defective Piston 2
Even with the reduced flow of 0.1 ml/min the pistons deliver with constant
rate into the system. After reaching the upper pressure value a continuous
pressure drop occurs. This indicates a problem. Therefore the test was
repeated with a stroke of 100 l.
Figure 72 Modified Pressure Test (Stroke 100 l) - Defective Piston 2
This pressure profile shows a totally different behavior then the previous
one. There are already pressure drops when the flow is 1.0 ml/min and the
piston change there directions. When the flow is reduced to 0.1 ml/min the
pressure drops with each stroke of the pistons until it is zero. With firmware
revision 3.0 it can be checked that the pressure drops appear on both pistons
but that the slight pressure increase is generated by piston 1. The piston is
scratched in its lower part. Delivering with a small stroke volume into the
system generates no problem. With the maximum flow rate of 100 l the
scratched part has to move through the seal and is obviously leaking.
The both pressure plateaus cannot be reached but when switching to the part
where the instrument uses a stroke volume of 4 l the pressure increases up
to its normal value. At the upper limit a slight leak rate is visible. The
scratches in the lower part of the piston are not visible when the pump is
working with its small stroke volume.
The pressure profile looks very strange. In the first part the pressure
increases up to approximately 320 bar and than it drops down to about
100 bar with normal behavior of the two plateaus and afterwards an increase
of the pressure to 400 bar with a slight pressure decrease at the upper limit.
Before reaching the first plateau the second piston performs one large (80 l)
stroke. At this point the pressure drops. When the piston is moving only with
the upper part through the seal no leak can be seen. But when the scratched
part of the piston moves through the seal the system is no longer tight and the
pressure drops. At the low pressure value the system is still tight and
therefore the plateaus show no problem. The pump then reaches the upper
limit with 250 l and a stroke volume of 20 l. Here the piston uses again only
the unscratched part of the piston.
Pressure Tests - Defective Active Inlet Valve
Figure 75 Modified Pressure Test - Defective Active Inlet Valve
With the reduced flow rate of 0.1 ml/min the pressure increases slowly in an
oscillating curve until the upper limit is reached. At the upper limit the
pressure is stable pointing onto a problem on the first piston side. The
actively current piston display of firmware revision 3.0 shows that the
pressure drop is on the first piston side.
Figure 76 Pressure Test (Rev. 1.0) - Defective Active Inlet Valve
The test fails completely. The pressure in the system cannot be increased to
reach the plateaus at a pressure of more than 100 bar. Also the rest of the test
does not reach useful pressure values. Therefore the test provides no
information about the problem in the system.
NOTE In such a case the pump can be troubleshooted in the following way. Move the
solvent inlet tubing out of the bottle and let the pump draw a large air bubble
(for example 5 cm in the tubing). In a normal working pump the bubble will
move during the intake stroke of piston 1 and will stop when the first piston is
delivering into the system. If the active inlet valve is internally leaky the air
bubble will move forwards during the intake stroke and the whole time
backwards when the piston is delivering into the system.
Figure 77 Pressure Test (Rev. 3.0) - Defective Active Inlet Valve
Also the new version of the test fails. The pressure in the system cannot be
increased to the two plateaus (>270 bar). The pressure in the system
stabilizes below that value. The pump can be troubleshooted as described
before.
8
8 Pumps: Maintenance Information
This chapter provides provide procedures for
service and maintenance of the 1050 Pumps
Pumps: Maintenance Information
This section provides information on the procedures used for maintenance
replacement and alignment of assemblies in the pump. You will find
procedures for:
Solvent Cabinet and Column Heater
Heat Exchanger
Solvent Cabinet Cable Assembly
Pump Mainframe
Active Inlet Valve
Outlet Ball Valve
Purge Valve
Pump Head Assembly
Fan
Replacing the Heat Exchanger
Open column heater door and disconnect all capillaries from the heat
exchanger.
Using a flat screw driver loosen the solvent cabinet screws.
Carefully take out the front panel with helium valves and manual injection
valve and place on top of the solvent module.
Move the insulation out of its position and take it out.
Take out the plastic heat shield.
Disconnect the heater flex cable from the zero insertion force connector
on the cable board.
NOTE Pull the outer sleeve of the connector to its front position. This releases the
tension from the cable and it can be removed from the connector without
problem.
The heat exchanger holding screws are accessible from underneath the
solvent module. Therefore move the module above the table and remove
the two screws with the washers.
Take the heat exchanger out of the column heater compartment.
Place the new heat exchanger assembly into the column heater
compartment. Place the washers onto the screws and fix the heat
exchanger assembly in its position.
Insert the flex cable into the zero insertion force connector and push the
sleeve back to fix the cable in its position.
Insert the heat shield into the compartment.
Place the insulation into the heat shield and carefully press it into its
position. Make sure that the parts are inserted underneath the plastic ledge
at the back panel of the compartment.
Slide the front base back into its guiding slits. Assure that the front edge of
the plastic heat shield is guided into the gap between the front panel and
the connected metal panel.
Tighten the two solvent cabinet screws.
Reinstall all capillaries at the column heater assembly.
Replacing the Cable Assembly
Follow the above mentioned steps for replacing the heat exchanger
assembly.
Remove bottle tub and solvent bottles from the cabinet.
Remove the front base by pushing the plastic knobs from underneath the
solvent cabinet and slide it out of the instrument.
Put the solvent cabinet onto the side loosen the cable holding screw at the
back of the module and slide the cable out of the position.
Loosen the screw which fixes the cable connector board in its position and
slide the board out of the recess.
Remove the tape which fixes the multi color LED.
Put the solvent cabinet onto the side and move the cable assembly through
the holes in the back panels to get it out of the solvent cabinet.
Place the new cable assembly into the solvent cabinet that the board is
located in the column heater compartment.
Slide the board into its recess place the end of the cable insulation under
the washer and tighten the holding screw.
NOTE Do not clamp the single wires of the cable.
Fix the multi color LED with a piece of tape in the groove.
Reinsert the base plate and fix it with the two plastic knobs. Make sure that
the LED is positioned correctly and that the cables are not clamped.
NOTE The rear end of the front base must fit into the recess at the back panel of the
compartment.
Reinstall the heat exchanger assembly by following steps described in
section replacing the heat exchanger assembly.
Replacing the Active Inlet Valve
Remove the ESD cover.
Disconnect the solenoid cable from the connector board.
Loosen the screw which holds the shield cable and unplug the spade lug.
Disconnect the active inlet valve inlet tubing.
Using the supplied 12 mm wrench (8710-1841) loosen the valve and
remove it.
NOTE It is recommended to insert a new gold seal into the plastic cap when changing
the active inlet valve.
Place new inlet seal into the plastic cap and fix it onto the valve.
Insert the active valve and screw it hand tight. In this position counter hold
the screw with the wrench. By hand turn the solenoid itself in either
direction until the capillary connection hole is about 60 to 90 away from
its final position.
Figure 78 Valve Final Position (Pump head disassembled)
Using the 12 mm wrench tighten the screw of the valve by turning the
assembly in its final position (should not be more than a quarter turn).
Make sure that the ESD cover and the solvent sucking tube can be installed
with the valve in its position.
Fix the spade lug of the shield cable in its position and reconnect the
solenoid cable to the connector board.
NOTE If the active inlet valve is installed in an instrument without connection for the
shield connector connect the spade lug to the holding screw of the connector
board.
Connect the valve inlet tube to the active inlet valve.
Install the ESD cover
Perform the pressure tests to verify tightness of the system.
Replacing the Outlet Ball Valve
Replacing the Outlet Ball Valve
Using the 14 mm wrench (8710-1924) loosen the valve screw and remove it.
NOTE It is recommended to insert a new gold seal into the seal cap when the same
valve will be used again.
Before inserting a new valve check for correct center position of the cap
with the gold seal.
Insert the valve into the pump head and screw it hand tight. Fix the valve
by turning another quarter turn with the 14 mm wrench.
NOTE The plastic cover should always be installed. This prevents loosing the holding
screw when disassembled and does not allow to damage the outlet ball valve
by tightening at the cartridge itself.
Perform the pressure tests to verify the tightness of the system.
Maintaining the Frit Adapter Assembly
Maintaining the Frit Adapter Assembly
Using the 14 mm wrench (8710-1924) loosen the frit adapter assembly and
remove it.
Remove the cap (6) with the gold seal (5) and take out the dirty frit (4).
Clean the adapter chamber from all particles. Best is to use a degreaser
spray.
Insert the new frit into the adapter. Ensure that the slit of the frit is facing
downwards, otherwise the filter capacity is reduced.
Place cap and gold seal onto adapter.
NOTE It is recommended to use always a new gold seal when the frit adapter
assembly was removed from the pump head.
Insert the frit adapter assembly into the pump head and screw it hand tight.
Fix the assembly by turning another quarter turn with the 14 mm wrench.
Perform the pressure tests to verify the tightness of the pump.
Maintaining the Purge Valve
Maintaining the Purge Valve
Changing the PTFE Frit
Disconnect capillary to injector and waste tube from purge valve outlet.
Using the 14 mm wrench open the purge valve at the hexagonal nut.
For the next steps refer to Maintaining the Frit Adapter Assembly on
page 210.
Cleaning the Purge Valve
NOTE Leaks in the purge valve can be due to particles (for example salt
precipitation) between seat and ball. Therefore the cleaning procedure should
be performed before replacing the whole valve.
Remove the purge valve from the pump head as described before.
Open the purge valve counter clockwise until the had screw (6) is loose.
NOTE Do not open the securing ring on top of the hand screw and do not change the
seat.
Clean the upper and lower part in a ultrasonic bath using methanol or
isopropanol.
Re-assemble the purge valve parts and re-install purge valve.
Figure 80 Purge Valve
Maintaining the Pump Head Assembly
Maintaining the Pump Head Assembly
There are two different versions of the pump head available. In the latest
version the spring is integrated in the plunger housing. The following table
shows the serial number prefix at introduction of the new plunger housing
design.
Table 45 Pump Head Versions
Pump SN Prefix Procedure
79851A 3447 G ..... 2
79852A/B 3447 G ..... 2
79851A 3448 A ..... 2
79852A/B 3448 A ..... 2
Procedure 1: Pump Head with old Plunger Housing
Procedure 1: Pump Head with old Plunger
Housing
NOTE The pump head has two identical channels. When disassembling the pump
head it is advisable not to interchange the parts of each channel for better
failure identification.
NOTE Since introduction of the new plunger housing design the old plunger housing
parts are no longer available. The new parts are fully compatible to all existing
pump heads.
Stage 1: Removing the Pump Head Assembly
Disconnect all four capillaries from the pump head assembly.
Remove the ESD cover and disconnect the cable of the active inlet valve.
Remove the two pump head screws and take out the pump head assembly.
Stage 2: Disassembling the Pump Head assembly
Place the assembly on the head and remove the three holding screws.
Carefully separate the head from the plunger housing.
CAUTI ON Do not twist the parts while separating. This could break the sapphire plunger.
Stage 3: Replacing the Seals
Remove the two seal keeper (8) or the support seal assembly (7a).
Using the three millimeter hexagonal key remove the two seals (9).
Remove the two wear retainer (10).
Clean the pump head chamber from all seal particles. Best is to use a
degreaser spray.
Place new wear retainer (10) into the pump chambers.
Insert new seals (9).
Place the two seal keeper (8) onto the seal. The support seal assembly will
be installed onto the plunger housing.
Figure 81 Pump Head Assembly
Stage 4: Disassembling the Plunger Housing
WARNI NG The very strong spring will catapult the adapter up when released
without holding it down.
Remove the two support rings (1) or the support seal assembly.
Hold the adapter (2) down on a table and loosen the setscrew (3) of one of
the plungers (5). Carefully release the tension of the spring.
Proceed with the second plunger in the same way.
Figure 82 Plunger Housing
Stage 5: Reassembling the Plunger Housing
Place the plunger keeper (6) on a table and insert plunger (5) and spring
(4).
Take the plunger housing (2) and place it on top of the spring (4).
NOTE Make sure that the spring (4) does not stick before the top of the housing (2).
Press the housing (2) down over the plunger keeper (6) and when flat on
the table tighten the setscrew (3).
NOTE The plunger keeper (6) should not stick out of the bottom of the plunger
housing (2).
Proceed in the same way for the second plunger.
Slide the two support rings or the support seal assembly onto the plungers
but do not try to press it in its position.
NOTE If the support ring or the support seal assembly (1) sticks at the housing (2)
carefully push the plunger from the bottom. This will center the plunger and
the support ring slides into its final position.
Check the alignment by lifting the support ring out of its position. Release the
support ring and check that it slides back in its position without sticking.
The support seal assembly should be installed onto the plungers as described
before.
Stage 6: Reassembling the Pump Head Assembly
See Figure 81 on page 214.
Prepare the head and the plunger housing as described beforehand.
NOTE The seal keeper (8) should be installed on the head in front of the seals. In this
position they guide the plunger into the seal and reduce the possibility of
breaking the plunger during the assembling of head and plunger housing.
Mount the plunger housing onto the head. The guiding pins prevent
incorrect mounting.
Grease the three screws with the white Teflon lubricant (79841-65501).
Insert the three screws and tighten them stepwise with increased torque.
Observe the slit between the two parts and make sure that they are in
parallel to each other.
Stage 7: Mounting the Pump Head Assembly
Place the pump head assembly onto the two stay bolts of the metering
drive. Make sure that no capillary sticks between pump head and metering
drive.
Put a light coating of white Teflon grease onto the mounting screws.
Insert the two screws and tighten them crosswise.
Reinstall the capillaries to the valves and the connector screw.
Reconnect the active inlet valve connector and fix the shield to ground.
Procedure 2: Pump Head with new Plunger Housing
Procedure 2: Pump Head with new Plunger
Housing
NOTE The pump head has two identical channels. When disassembling the pump
head it is advisable not to interchange the parts of each channel for better
failure identification.
Stage 1: Removing the Pump Head Assembly
Disconnect all four capillaries from the pump head assembly.
Remove the ESD cover and disconnect the cable of the active inlet valve.
Remove the two pump head screws and take out the pump head assembly.
Stage 2: Disassembling the Pump Head Assembly
Place the assembly on the head and remove the three holding screws.
Pull the block straight up from the head being careful not to put any
sidewards strain on the sapphire pistons since they could shear and break.
Put the plunger housing aside taking care to avoid dropping the pistons
from the plunger housing.
NOTE The pistons are not secured in the plunger housing and will fall out when the
housing is turned upside down.
Remove the pistons from the plunger housing.
Check for scratches and dirt on the piston.
NOTE Dirt can be removed by using a small quantity of tooth paste.
Stage 3: Replacing the Seals
Remove the two support seal assemblies.
Using the three millimeter hexagonal key remove the two seals.
Remove the two wear retainer.
Clean the pump head chamber from all seal particles. Best is to use a
degreaser spray.
Place new wear retainer into the pump chambers.
Insert new seals.
Place the two support seal assemblies onto the seal.
Figure 83 Pump Head Assembly (new plunger housing design)
Stage 4: Reassembling the Pump Head Assembly
Prepare the head as described beforehand.
Place the plunger housing without the pistons onto the head.
Tighten the three socket head screws hand tight.
NOTE Tightening the screws fully will require much more force to insert the pistons
into its position in the seals.
Insert the pistons into the assembly and carefully push it into the seal.
Tighten the three screws stepwise with increasing torque. Make sure that
the head and plunger housing surfaces are in parallel.
Stage 5: Mounting the Pump Head Assembly
Place the pump head assembly onto the two stay bolts of the metering
drive. Make sure that no capillary sticks between pump head and metering
drive.
Put a light coating of white Teflon grease onto the mounting screws.
Insert the two screws and tighten them crosswise.
Reinstall the capillaries to the valves and the connector screw.
Reconnect the active inlet valve connector and fix the shield to ground.
Continuous Seal Wash Option
Continuous Seal Wash Option
NOTE The previous described procedures for the pump heads are also applicable for
the seal wash option. This procedure will only describe the secondary seal
replacement.
Remove the pump head assembly and disassemble it following stage 1 and
stage 2.
Remove the two support rings from the plunger housing.
Remove the gasket from the support ring.
Using the tool from the upgrade kit (01018-23702) remove the wash seal.
Place the new seal onto the tool and insert the new wash seal into the
support ring. Ensure that the wash seal clicks into place in the support
ring.
Figure 84 Pump Head with continuous seal wash
Replacing the Fan
Replacing the Fan
Remove the top cover.
Disconnect the fan cable at the motherboard.
Lift the foam part at the left side of the module and slide it out to the front.
Carefully remove the fan from the foam part (one edge after the other).
NOTE In case it is not possible to get the fan out of the foam cut the foam part at the
back side between the two naps.
With the blade of a screwdriver separate the protection cover from the fan.
Insert the new fan into the foam part. The air stream should be into the
module (arrow pointing down). Cable should show to the back.
Place the fan protection cover onto the new fan.
Place the foam part into its place.
NOTE The foam part must be inserted into the chassis and must be replaced close to
the back panel. Make sure that the upper foam part fits behind the ridge of the
bottom part. It might be more convenient to replace the foam part when the
motor plug is disconnected.
Removing the Metering Drive Assembly
Remove the pump head assembly.
Remove the foam part with the fan.
Disconnect the three cable of the metering drive.
Unscrew the three holding screws of the base of the metering drive.
NOTE The third screw is accessible through the bottom foam part.
Move the motor of the metering drive out of the foam part and take it out.
9
9 Pumps: Parts Information
This chapter provides information on parts of the
1050 Pumps
Pumps: Parts Information
This chapter gives complete parts listings and exploded views for the
HP 1050 (Ti) Pumps.
Electronic Boards
All Ti - Parts
Solvent Cabinet
Overall Diagram
Flow Path
Pump Head Assemblies
Active Inlet Valve
Outlet Ball Valve
Purge Valve Assembly
Special Tools
Electronic Boards
Electronic Boards
For fuses refer to Table 47 on page 228.
# U 78 and U 79 have to be replaced when a new metering device
01018-60001/-69100 (parts included) is installed in a pump with PDC board
revision A.
Item Description Part Number Exchange PN
1 Power Supply Board DPS-B 5061-3374 01050-69374
2 Pump Drive Control 2 Board
PDC
2
01018-66532
# U 78 MC78L15ACP 1826-0274
# U 79 MC79L15ACP 1826-0281
3 Relative A/D Converter RAD 01018-66503 01018-69503
4 Firmware Board SFW 01018-66506
5 Heater Isocratic Board HRI 01018-66517
6 Heater Quaternary Board HRQ 01018-66518 01018-69518
7 Communication Interface Board CIB 5061-3382 01050-69582
8 Common Main Processor Board CMP 5061-3380 01050-69580
9 Fluorescent Indicator Module FIP 5061-3376
10 Connector Board CON 01018-66505
11 Motherboard HPS 01018-66501
Electronic Boards
Table 47 Fuses
Description Board Part Number
Fuse 110V operation (3 A) DPS-B 2110-0003
Fuse F16 (PDC); F481 (PDC
2
) 1.5 A PDC
2
2110-0304
Fuse F891, F892 on board 500 mA
PDC
2110-0934
Fuse F112, F113 on board 500 mA
PDC
2
2110-0934
Fuse F12, F22 250 mA RAD 2110-0004
Fuse F4 2.5 A HRI, HRQ 2110-0083
Fuse F15 1 A HRQ 2110-0007
Fuse ICP1 1 A FIP 2110-0099
Fuse F1 375 mA CON 2110-0421
Complete List of Ti-Parts
Table 48 Complete List of Ti-Parts
Description Part Number Description Part Number
Ti - Pump Head Assembly 01019-60002 Ti - Capillary ID 0.17 35 cm lg 01019-87608
Ti - Pump Chamber Housing 01019-25205
Ti - Active Inlet Valve 01019-60010 Accessories
Ti - Piston Seal 0905-1199 PCTFE - Adapter 5021-1872
Ti - Damping Unit 01019-60005
Ti - MCGV 01019-67701 Ti - Maintenance Kit 01019-68724
Ti - Manual Injection Valve obsolete includes:
Ti - Rotor Seal Tefzel 0101-0620 Ti - Piston Seal (2x) 0905-1199
Ti - Stator 0101-0663 PTFE Frits 5/PK 01018-22707
Ti - Loop Capillary 20 l 0101-0655 Gasket Seal Wash (2x) 6/pk 5062-2484
Ti - Bottle Head Assembly obsolete Seal Wash (2x) 0905-1175
Ti - Bushing 01019-21734 Seal Gold Outlet (5x) 5001-3707
Solvent Glass Filter
Adapter
5041-2168
5062-8517
Cap Outlet (5x) 4/pk 5042-1346
Ti - He - Sparge Assembly 01019-82702
Ti - Screw Tube 01019-23232? Ti - High Pressure Solvent Filter Kit 01019-68709
Ti - Name Plate includes:
Ti - Capillary Piston 1 260 mm lg 01019-67301 Ti - Capillary ID 0.25 13 cm lg 01019-87308
Ti - Capillary Piston 2 210 mm lg 01019-67302 Ti - Fitting Insert (2x) 01019-27601
Ti - Tubing ID 0.25 mm 700 mm lg 01019-67305 Fitting Nut (1x) 79900-25701
Ti - Sucking Tube see item 13 Fitting Screen (1x) 79900-22401
Fitting Insert (1x) 01019-27601
Solvent Cabinet
Solvent Cabinet
Table 49 Solvent Conditioning Module
Item Description Part Number Item Description Part Number
1 Solvent Compartment incl. (2) 01018-60019 11 Holder He-Valves 01018-05501
2 Bottle Tub no PN 12 Washer 5001-3746
3 Front Panel no PN 13 Screw 0624-0045
Cover Cap, no injection valve 6960-0024 14 Injector Tub 01018-44503
Cover Cap, no Helium on/off
valve
6960-0027 15 Screw M3 4 mm lg 0515-1508
Cover Cap, no Helium Regulators 6960-0028 16 Capillary ID 0.17 400 mm lg 79826-87608
4 Front Base 01018-40512 16 Ti - Capillary ID 0.17 35 cm lg 01019-87608
5 Oven Door 01018-60302
6 Bolt 01018-43701 17 Accessory Kit, includes following
items
01018-68704
7 Door Hinge 01018-45101 Angle Injection Position (part of
Sensor Assembly)
01018-00511
8 Name Plate 5041-2170 Sensor Assembly 5062-2432
9 Tubing Flexible ID 4 mm OD 5 mm Screw lock female (2x) 1251-7788
10 Funnel Leak 01018-43211 Washer M4 (2x) 3050-0893
Solvent Cabinet
Figure 85 Solvent Cabinet
Solvent Cabinet with Helium Degassing
Table 50 Solvent Cabinet with Helium Degassing
1 Solvent Compartment, incl. (2) 01018-60019 14 Solvent Bottle, 1 liter 9301-0656
2 Front Panel no PN 15 Bottle Head Assembly,
includes item 16 to 25
01018-60017
3 Holder He-Valves 01018-05501 15 Ti - Bottle Head Assembly,
01019-60017
4 Screw 0624-0045 16 Bottle Head Cap 01018-44111
5 Washer 5001-3746 17 Bottle Head Shaft 01018-43711
6 Regulator Knob A 01018-47413 18 Bottle Head Washer 01018-48811
Regulator Knob B 01018-47414 Helium Sparge Assembly,
includes item 19 and 20
01019-82702
Regulator Knob C 01018-47415 19 Connector Helium Sparger (6/pk) 5062-8515
Regulator Knob D 01018-47416 20 Helium Sparger 10-16 l 5041-8339
7 Knob On/Off 01018-47412 21 Solvent Filter SST 01018-60025
8 Helium Regulator Assembly,
includes item 6 an 7
01018-67001 21 Solvent Glass Filter
Adapter
5041-2168
5062-8517
9 Tubing PTFE ID 1/16 OD 1/8 0890-0746 22 Tube Bushing Teflon 79835-21734
10 Fitting 0100-1430 22 Ti - Bushing 01019-21734
11 Tubing Flexible ID 0,156 0890-0581 23 Tube Screw 5041-2163
12 Fitting 0100-1047 24 Tubing FEP ID 1.5 mm OD 3 mm
5 m
5062-2483
Filter Disc (part of 12) 25 Tubing PTFE ID 1.45 mm
OD 2.5 mm 5 m
5062-2461
13 Air Tubing Flexible 5 m 5021-7127
Figure 86 Solvent Cabinet with Helium Degassing
Solvent Cabinet with Column Heater and Manual Injection Valve
Solvent Cabinet with Column Heater and
Table 51 Solvent Cabinet with Column Heater and Manual Injection Valve
1 Solvent Compartment, incl. (2) 01018-60019 Rheodyne Valve 7125 complete,
0101-0607
2 Front Panel no PN 22 Isolation Seal 1535-4046
3 Plug 01018-44103 23 Rotor Seal Vespel 0101-0623
4 Cable Assembly Heater 01018-61600 23 (Ti) Rotor Seal Tefzel (high pH) 0101-0620
5 Washer 5001-3746 24 Stator Face Assembly no PN
6 Screw M4 6 mm lg 0515-0915 25 Stator (Head) 1535-4044
7 Heater Assembly 01018-66901 25 Ti - Stator (Head) 0101-0663
8 Washer 3050-0893 26 Loop Capillary 20l 0101-0377
9 Screw M3 16 mm lg 0515-0986 26 Ti - Loop Capillary 20 l 0101-0655
10 Insulation 01018-45401 27 Stator Screw 1535-4857
11 Heat Shield 01018-40601 28 Connector Capillary no PN
12 Front Base 01018-40512 29 Valve Transport Protection no PN
13 Oven Door 01018-60302 30 Capillary ID 0.17 400 mm lg 79826-87608
14 Bolt 01018-43701 30 Ti - Capillary ID 0.17 35 cm lg 01019-87608
15 Door Hinge 01018-45101 31 Tubing ID 0.25 mm 700 mm lg 01018-67305
16 Waste Vial 9301-1168 31 Ti - Tubing ID 0.25 mm 700 mm lg 01019-67305
17 Vial Holder 01018-44901 32 Sensor Assembly 5062-2432
18 Holder He-Valves 01018-05501 33 Remote Cable 5061-3378
19 Screw 0624-0045 Syringe 25 l 9301-0633
20 Washer 5001-3746 Needle 10-100 l 9301-0679
21 Angle Injection Position 01018-00511
Solvent Cabinet with Column Heater and Manual Injection Valve
Figure 87 Solvent Cabinet with Column Heater and Manual Injection Valve
Overall Diagram
Overall Diagram
Table 52 Overall Diagram
1 Fan Grill 3160-0544 35 Screw (plastic) for MCGV 0515-1256
2 DC Fan 01048-68500 36 no longer used no PN
3 Cooling Drain 01018-47706 37 no longer used no PN
4 Push Button, white 5041-1203 38 no longer used no PN
5 Power Actuator 5041-2162 39 Leakage Tray right 01018-44502
6 Spring Compression 1460-1510 40 High Pressure Damper 79835-60005
7 Cover Hinge 5041-2147 41 Active Inlet Valve 01018-60010
8 Sheet Metal Kit 01018-68701 42 Frit Adapter Assembly 01018-60007
9 Foot Front 5041-2161 42 Purge Valve G1311-60009
10 Cable to Connector Board 5062-2416 43 Adapter short 01018-23207
11 Connection Tube 150 mm lg G1311-67304 44 Outlet Ball Valve G1311-60008
12 MCGV
Exchange
79835-67701
79835-69701
45 Metering Drive Assembly 01018-60001
13 Connector Board 01018-66505 46 Pump Head Assembly includes
item 41 to 44
01018-60004
14 Front Plate 01018-04106 47 Pump Plate 01018-04704
15 Leakage Tray, left 01018-44501 48 Capillary Piston 1 ID 0.5 27 cm lg 01018-67309
16 Leak Sensor 5061-3356 49 Capillary Piston 2 ID 0.5 21 cm lg 01018-67302
17 Logo Base 5041-2144 50 Power Supply (DPS-B)
Exchange
5061-3374
01050-69374
18 Name Plate 5041-2170 51
PDC
2
Board
01018-66532
19 Front Door 01018-60301 52 SFW Board (Firmware) 01018-66506
20 Power Switch Base 5041-2145 53 RAD Board
Exchange
01018-66503
01018-69503
Overall Diagram
21 ESD Cover 01018-44106 54 HRI Board 01018-66517
22 Cover Keyboard 5001-3736 54 HRQ Board 01018-66518
23 Leak Assembly, includes item 24,
25, 26
5062-8551 56 Motherboard 01018-66501
27 Keyboard Module 01018-60201 57 Cover Plate P/S 5001-3728
28 Fluorescent Interface 5061-3376 58 Top Cover 5001-3724
29 Cable to Display Board 5061-3400 59 Plate Cover, 1.5 inch 5001-3722
30 Screw M3.5 6 mm lg 0515-0889 60 Plate Cover, 1.3 inch 5001-3721
31 Bumper 0403-0427 61 Card Cage no PN
32 Screw M4 6 mm lg 0515-0898 62 Screw M3.5 6 mm lg
also for AIV ground cable
0515-0887
33 Screw M4 20 mm lg (special) 0515-1918 Screw, ESD cover 5021-1862
34 Screw M3 8 mm lg 0515-0912
Overall Diagram
Figure 88 Overall Diagram Part 1
Overall Diagram
Figure 89 Overall Diagram Part 2 (Pars II)
Hydraulic Flow Path
Hydraulic Flow Path
Table 53 Hydraulic Flow Path Quaternary Pump
1 Drawing Tubing consists of no PN Gripper MCGV 0100-1431
Solvent Filter SST 01018-60025 Connector MCGV 0100-1432
Helium Sparger 10-16 l 5041-8339 Ferrule, inlet valve 20/pk 5061-3321
Connector Helium Sparger (6/pk) 5062-8515 Gripper, inlet valve 20/pk 5061-3322
Tubing FEP ID 1.5 mm OD 3 mm
5 m
5062-2483 Male, inlet valve 20/pk 5061-3323
Tube Bushing Teflon 79835-21734 Buffer Disc, inlet valve 40/pk 5061-3324
Screw Tube 5041-2163 3 Capillary Piston 1 ID 0.5 27 cm lg 01018-67309
3 Ti - Capillary Piston 1 260 mm lg 01019-67301
1 Ti - Drawing Tubing, consists of no PN 4 Capillary Piston 2 ID 0.5 21 cm lg 01018-67302
Solvent Glass Filter
Adapter
5041-2168
5062-8517
4 Ti - Capillary Piston 2 210 mm lg 01019-67302
5 m
5062-2483 5 Tubing ID 0.25 mm 700 mm lg 01018-67305
Ti - Bushing 01019-21734 5 Ti - Tubing ID 0.25 mm 700 mm lg 01019-67305
Screw Tube 5041-2163 6 Teflon Tubing ID 1 mm OD 3 mm 0890-1764
2 Connection Tube, consists of G1311-67304 7 Tubing PTFE ID 1.45 mm
OD 2.5 mm 5 m
5062-2461
Flex Tubing PTFE ID 0.7 mm5 m lg 5062-2462
Hydraulic Flow Path
Table 54 Hydraulic Flow Path Isocratic Pump
2 Drawing Tubing, consists of 01018-67303 2 Ti - Drawing Tubing, consists of 01019-67303
Solvent Filter SST 01018-60025 Solvent Glass Filter
Adapter
5041-2168
5062-8517
5 m
5062-2483 Tubing FEP ID 1.5 mm OD 3 mm
5 m
5062-2483
Nut 79835-25731 Nut 79835-25731
Screw Tube 79835-23231 Ti - Screw Tube 01019-23232
Hydraulic Flow Path
Figure 90 Hydraulic Path
Table 55 Metering Drive Assembly
3 Metering Drive Assembly 01018-60001 5 Bumper 5021-1839
Exchange Assembly,
includes item 1, 2, 4, U78 and
U79 for PDC board rev. A
01018-69100 6 Screw M3.5 8 mm lg 0515-0887
1 Cover 01018-44102 7 Pump Plate 01018-04704
2 Screw M2.5 6 mm lg 0515-0894 8 Screw M4 5021-1841
4 Stay Bolt 01018-23704
Pump Head Assembly (old version)
Pump Head Assembly (old version)
Figure 92 Pump Head Assembly (old version
Table 56 Pump Head Assembly (old version)
Complete Assembly 01018-60004 11 Pump Chamber Housing 01018-25203
1 Plunger Keeper 12 Screw M5 50 mm lg 0515-1220
2 Sapphire Plunger 5063-6586 13 Active Inlet Valve 01018-60010
3 Spring Compression 1460-2220 14 Adapter short 01018-23207
4 Screw M4 40 mm lg 0515-0850 15 Outlet Ball Valve G1311-60008
5 Plunger Housing see page 245
6 Set Screw M3 8 mm lg 0515-1917 Tools
7 Support Seal Assembly 5001-3739 Wrench 12 mm 8710-1841
8 Seal Keeper part of (7) Wrench 14 mm 8710-1924
9 Plunger Seal (2/Pk) 5063-6589 Insert Tool Seals 01018-23702
10 Wear Retainer (10/pk) 5064-8249 Teflon Grease 79841-65501
Pump Head Assembly (new version)
Pump Head Assembly (new version)
Figure 93 Pump Head Assembly (new version)
Table 57 Pump Head Assembly (new version)
Complete Assembly 01018-60004 9 Adapter short 01018-23207
1 Sapphire Plunger 5063-6586 10 Active Inlet Valve 01018-60010
2 Screw M4 40 mm lg 0515-0850 11 Screw M5 50 mm lg 0515-1220
3 Plunger Housing 01018-60006 Tools
4 Support Seal Assembly 5001-3739 Wrench 12 mm 8710-1841
5 Plunger Seal (2/Pk) 5063-6589 Wrench 14 mm 8710-1924
6 Wear Retainer (10/pk) 5064-8249 Insert Tool seals 01018-23702
7 Outlet Ball Valve G1311-60008
8 Pump Chamber Housing 01018-25203 Teflon Grease 79841-65501
Pump Head Assembly with Seal Wash
Table 58 Pump Head Assembly with Seal Wash
Complete Assembly 01018-60005 17 Sapphire Plunger 5063-6586
Ti - Complete Assembly 01019-60002 18 Plunger Keeper no PN
1 Screw M5 50 mm lg 0515-1220 19 Plunger Housing 01018-60006
2 Active Inlet Valve 01018-60010
2 Ti - Active Inlet Valve 01019-60010 Tools
3 Adapter short 01018-23207 Wrench 12 mm 8710-1841
4 Pump Chamber Housing 01018-25203 Wrench 14 mm 8710-1924
4 Ti - Pump Chamber Housing 01019-25205 Insert Tool, seals 01018-23702
5 Outlet Ball Valve G1311-60008 Teflon Grease 79841-65501
6 Wear Retainer (10/pk) 5064-8249
7 Plunger Seal (2/Pk) 5063-6589 Accessories
7 Ti - Seal 0905-1199 Seal Wash Option Update Kit
includes tubing, seals (2x),
support ring (2x) and items #
01018-68722
8 Seal Keeper 5001-3743
9 Gasket, seal wash (6/Pk) 5062-2484 # Syringe 9301-0411
10 Seal Wash 0905-1175 # Adapter Luer (3x) 0100-1681
11 Support Ring Seal Wash 5062-2465 # Abrasive Paper TP 240
12 Teflon Tubing ID 1 mm OD 3 mm 0890-1764 # Insert Tool Seal 01018-23702
13 Set Screw M3 8 mm lg 0515-1917 # Seal Keeper (item 8) (2x) 5001-3743
14 Plunger Housing (old version) order 19
15 Screw M4 40 mm lg 0515-0850 Velocity Regulator (3/pk) 5062-2486
16 Spring Compression 1460-2220
Figure 94 Pump Head Assembly with Seal Wash
Active Inlet Valve
Active Inlet Valve
Figure 95 Active Inlet Valve
Table 59 Active Inlet Valve
# Description Part Number
AIV Assembly, complete 01018-60010
Ti - AIV Assembly, complete 01019-60010
1 Cap Inlet Valve 01018-21207
2 Gold Seal 5001-3708
3 Retainer Ring, gold coated 5021-1874
Outlet Ball Valve
Outlet Ball Valve
Figure 96 Outlet Ball Valve
Table 60 Outlet Ball Valve
Outlet Ball Valve Assembly, complete G1311-60008
Ti - Outlet Ball Valve Assembly, complete 01018-60032
1 Socket Cap 5042-1345
2 Housing Screw 01018-22410
3 Outlet Valve Cartridge no PN
4 Gold Seal, Outlet 5001-3707
5 Cap 5062-2485
Table 61 Frit Adapter Assembly
Frit Adapter Assembly, complete 01018-60007
1 O-ring (12/Pk) 5180-4167
2 Housing Screw 01018-22410
3 Adapter 01018-23209
4 PTFE Frit (5/Pk) 01018-22707
5 Gold Seal 5001-3707
6 Cap (4/pk) 5062-2485
Figure 98 Purge Valve Assembly
Table 62 Purge Valve Assembly
Purge Valve Assembly, complete G1311-60009
1 Gold Seal 5001-3707
2 Cap (4/pk) 5062-2485
3 PTFE Frit (5/Pk) 01018-22707
4 Tubing PTFE ID 1.45 mm OD 2.5 mm 5 m 5062-2461
Column Holder Assembly
Column Holder Assembly
Figure 99 Column Holder Assembly
Table 63 Column Holder Assembly
Column Holder Assembly 5062-2469
1 Holder Brass no PN
2 Stand 5001-3738
3 Clamp no PN
4 Support Block no PN
Special Tools
Special Tools
Table 64 Special Tools
Wrench, 12 mm 8710-1841
Wrench, 14 mm 8710-1924
Insert Tool, Seals 01018-23702
Teflon Grease 79841-65501
Special Tools
10
10 Pumps: Additional Information
This chapter provides additional information
Pumps: Additional Information
This section gives information about:
Pumps Prefix History
Pumps Firmware History
Online Monitor
Operational Hints
Helium Degassing Principle
Isocratic Pumps
Pump Head Assembly
PDC Board
HRQ Board
Wear Retainer
Outlet Ball Valve
Flow Test Method
Method Loading
Flow Gradients
Product History
Product History
Since introduction of the 1050 Pumps in 1988 a couple of hardware and
firmware changes have been implemented in production. With most of this
changes the serial number prefix has been changed too. Following is a list of
all prefix changes done in Waldbronn and Little Falls.
Table 65 Product History 79851A and 79852A/B
S/N Prefix Changes
2813 G ..... Introduction of the 1050 Pumps
2913 G ..... ESD cover added to the gradient valve. Hardware
changes of extrusion and holding bracket for the
MCGV.
2949 G ..... 2949 A..... Wear retainer installed in front of each seal.
3010 G ..... 3012 A ..... Introduction of the current pump head version. In the
meantime all old pump heads have been updated.
3016 G ..... 3019 A ..... Introduction of firmware revision 3.0 and introduction
of column heater. Introduction of HRI/HRQ Board
(HRQ replaces GVD board).
3031 G ..... 3034 A ... (51A) or
3032 A ... (52A)
Introduction of firmware revision 3.1
3045 G ..... Purge Valve added to all quaternary pumps
3106 G ..... 3106 A ... (51A) or
3107 A ... (52A)
New voltage regulators on PDC board (rev B),
exchange metering drives require a PDC update.
3117 G ..... 3117 A ... (51A) or
3118 A ... (52A)
Introduction of firmware revision 3.2
3206 G ..... Introduction of dedicated seal and hardware
modifications of pump chamber and seal keeper
3243 G .....3244 A...(51A) or
3145 A...(52A)
Introduction of PDC
2
board.
Product History
3312 G ..... Integrated spindle for metering drive assembly
01018-60001
3334 G ..... Support seal assembly replaces support ring and seal
keeper
3404 G ..... 3404 A ... (51A) or
3405 A ... (52A)
Introduction of Damper with new pressure sensor and
electronic board (Rev. G)
3447 G ..... 3448 A ..... Spring integrated in plunger housing
June 1996 Active Inlet Valve with Exchangeable Valve Cartridge
March 1998 Plunger Housing with new springs available
November 1998 Part Number Change for DC-Fans
September 2001 End of Support of 1050 Isocratic Pump 79851B TI ends
September 30, 2001
Table 66 Product History Solvent Cabinet
S/N Prefix Changes
3019 G ..... Solvent Cabinet 79856A/B serialized
3205 G ..... Improvement of Helium Regulators; better regulation
range and tightening behavior.
3216G... Modification of Bottle Head Shaft of the Bottle Head
Assembly.
Table 65 Product History 79851A and 79852A/B
S/N Prefix Changes
Firmware History
Firmware History
Revision 1.0
Revision 1.0 was the firmware at introduction of the 1050 Pumps.
Known Problems
In purge mode flow values above 5 ml/min will not be shown on the display.
At higher values the display remains at 5 ml/min but the pump is purging with
the set value.
Revision 3.0
Revision 3.0 incorporates:
Communication with the GPIB communication interfaces.
Support of the column heater.
Improved flow test method.
Known Problems
1 If a gradient test method is started directly after running the build in flow
test method the gradient might be distorted. Switching the pump off and
on again after a pressure test solves the problem.
2 For applications with system pressures below 30 to 40 bar the lower
pressure limit is not applicable.
3 Internal tests of the DOS workstation (Phoenix) revealed a couple of bugs
in the communication part of the firmware.
Europe/ICON SN 3016 G.....
US/Canada SN 3019 A .....
Firmware History
Revision 3.1
This firmware revision fixes the bugs encountered with the ChemStation.
Known Problems
Due to an internal timing problem relay contact 1 and 2 may switch
incorrectly when used together in the timetable. Relay contact 2 might be
activated together with contact 1 even when the timetable shows only an
entry for contact 1.
Revision 3.2
This revision fixes the known bug of firmware revision 3.1.
US/Canada SN 3034 A ..... (for 79851A/B)
SN 3033 A ..... (for 79852A/B)
US/Canada SN 3117 A .....
How does the On-line Monitor work
The online monitor is part of the 1050 Pump firmware and checks the
performance of the metering pump. The online Monitor detects appearing
leaks 1st piston leak valve problems valve backflow and checks via
the pressure ripple for gas bubbles in the system gas bubble.
NOTE The online monitor is a user selectable function and can be enabled or
disabled via the diagnose level in the configuration displays. The online
monitor is only active if the pressure in the pump is above 50 bar.
DIAGNOSIS LEVEL 0 disables the online monitor and none of the following
messages will be generated.
DIAGNOSIS LEVEL 1 turns the online monitor on. Any measured deviation
from the normal operation modes will generate an entry in the logbook.
DIAGNOSIS LEVEL 2 comprises the same functions like level 1 and in
addition lids the not ready LED at the keyboard. The remote output shows the
not ready condition and disables further injections when connected to the
1050 Autosampler.
DIAGNOSIS LEVEL 3 is used for factory adjustment of the metering drive.
Normal Operation
The figure below shows the normal pressure profile of the instrument. The
curve is ideal and can only be recorded with a very fast transient recorder. A
normal integrator (339X) is too slow to record the very fast changes of the
curve and shows a smoothed one. However occurring operation problems
can be also seen on a integrator plot. During the delivering strokes of the two
pistons the instrument measures the pressure at the points D1 to D10. Failure
conditions like leaks or gas bubbles influence the pressure curve from which
the processor can determine certain failure modes.
Figure 100 Online Diagnostic: Normal Operation
M2 Gas Bubble
The following figure shows the pressure profile when a gas bubble was
drawn from the bottle. During the delivery phase of piston I the gas bubble
will be compressed first before solvent can be delivered into the second
chamber. This means the pressure will drop during the compression phase of
the air bubble before it returns to normal behavior. The pressure profile of
the second piston shows no deviation. The pressure drop at the beginning of
the stroke generates a higher pressure ripple which is used to determine a
gas bubble problem.
The pressure ripple is depending on various parameters like solvent, flow,
compressibility and so on. For this reasons the pressure ripple has to exceed
a certain range before a gas bubble can be detected. The relation between
pressure ripple and compressibility setting is shown in the respective figure.
NOTE Drastic pressure changes (for example suddenly no more solvent to pump due
to empty bottle) can not be detected under all circumstances. To make sure
that the system will stop in such a case (for example running out of solvent
during an unattended sequence) a lower pressure limit should be set.
Figure 101 Online Diagnostic: Gas Bubble
Figure 102 Online Diagnostic: Compressibility vs. Pressure Ripple
M4 Leak at first Piston
The following figure shows the pressure profile when the system is leaky
either at the inlet valve or at the piston seal. The delivery stroke of piston I
shows a pressure drop while piston II delivers without any problems.
Figure 103 1050 Online Diagnostic: Leak at first piston
M6 Valve Backflow
The following figure shows the pressure profile when the outlet ball valve is
not working correctly. Delivery stroke of piston I shows normal behavior
while during the stroke of piston II the pressure drops because of the
internally leaking ball valve.
Figure 104 Online Diagnostic: Outlet Ball Valve Backflow
M8 Outlet Valve Problem
The following figure shows the pressure profile when the outlet valve sticks
in its position. During the delivery stroke of piston II the pressure drops
because a sticky ruby ball needs longer time to be closed.
Figure 105 Online Diagnostic: Outlet Ball Valve
If You Need Operational Hints
You will find general information about the pumps and certain parts followed
by description of known behaviors of the instrument.
This section gives information about:
Helium Regulators
Isocratic Pumps
Pump Head Assembly
PDC Board
HRQ Board
Wear Retainer
Outlet Ball Valve
Flow Test Method
Method Loading
Flow Gradients
The Helium degassing works in two stages. First, replacing the dissolved gas
in the solvent. Helium streams through the solvent and replaces the air
dissolved. So after some time the solvent is saturated with Helium. Second,
prevent that air diffuses back into the solvent. The compartment above the
solvent will also be filled with Helium. The Helium above the solvent is
absolutely necessary to make sure that no air can be introduced back into the
solvent. So the bottle head has to be in its position otherwise the degassing
will not work or it will require a too high Helium stream through the solvent.
NOTE If the vent position of the bottle head is connected to a fume hood, make sure
that the Helium is not sucked out of the bottle. Best is to install a restriction
(for example change diameter from 1/4" to 1/8") to make sure that the Helium
blanket above the solvent surface remains in its place. Otherwise
performance problems especially with gradient runs or excessive high Helium
consumption might be the result.
Helium Regulators
The helium regulators allow the regulation of the helium flow. The regulator
design does not allow to set the helium stream to zero. A small flow of helium
is still possible.
Bottle Head Assembly
During the lifetime of the solvent cabinet a problem with the bottle head
assembly was encountered.
The helium leaves the bottle head assembly through the vent connector. To
reach this vent the helium has to pass the bottle head shaft. The helium
passes through the gaps between the holes in the shaft and the supply tubings
for helium and solvent. Variations in the tolerances for hole size and tubing
diameter may restrict the helium flow out of the solvent bottle. This may
cause the effect that the solvent gets oversaturated with helium.
Oversaturation may lead to problems in pump and detector.
For that reason the bottle head assemblies have been modified with a
separate vent hole (1 mm to 2 mm in diameter) to the bottle head shaft
(01018-43711). All solvent cabinets 79856A/B with serial number prefix
3216 G... and greater will have the modification installed.
Instruments without the vent hold should be updated. Using a screwdriver
simply punch a hole of 1 mm to 2 mm diameter in the shafts of the bottle head
assemblies (01018-43711).
Isocratic Pumps
Isocratic pumps are often sold without the solvent conditioning module
option. The bottle is then placed beside the instrument. Tests have shown
that best results in regards of pressure ripple stability, air sensitivity and so
on are reached when the solvent bottle is placed on top of the module or even
higher (for example on top of a stack of modules). The slight gravity pressure
reduces the under pressure the pump requires to draw solvent from the
solvent bottle.
Pump Head Assembly
In February 1992, the pump head assembly was improved. The seal, the pump
chamber housing and the seal keeper have been changed. All together the
changes will assure a higher lifetime for the pump seal.
Seal
A dedicated seal was designed for the 1050 Pumps. Compared to the old seal
used in 1050 and in the 1090 the seal is the same material and color, but
slightly different in appearance. Nevertheless the seals are fully backward
compatible. They should be used in all existing 1050 pumps. Lifetime should
be expected the same as always. The wear retainer is still required.
Pump Chamber Housing and Seal Keeper
A groove has been added to the seal surface of the pump chamber and a
cutting edge was added to the seal keeper. These both changes ensure a
better compression of the new seal resulting in a higher lifetime. Part
numbers of the two parts were not changed because of there compatibility.
PDC Board
When exchanging the metering drive assembly 01018-69100 in a pump with
PDC Board revision A installed (see Product History on page 257), the
voltage regulators U78 and U79 on the board have to be replaced. Parts are
included in the exchange metering drive. PDC Board revision B and greater
and the PDC
2
Board do not have the new type voltage regulator already
installed. A short in the active inlet valve cable (for example cable squeezed
between pump head and metering drive) will generate excessive current on
the components of the PDC board. This overcurrent will at least damage
(unsolder) one resistor on the board. The fuse added to the CON board
(introduction approximately January 1992) will prevent damage of the PDC
board.
PDC
2
Board
In a standardization (board will also be used in other APG products) and cost
reduction program part of the circuit was implemented in ASIC (Application
Specific Integrated Circuit) which allowed a reduction in board size. A
stainless steel plate and the cover plate assure compatibility to the 1050
board.
HRQ Board
Originally the fuse F16 on the HRQ board was a 500 mA type. Evaluation of
returned defective exchange boards showed that the fuse was blown in most
of the cases. The fuse was to weak and could be blown without circuit
failure. Therefore the fuse was changed to a 1 A type.
GVD Board
At introduction of the 1050 Pumps the Gradient Valve Driver (GVD) board
controlled the multi channel gradient valve (MCGV). During the design phase
of the column heater option it was decided that the control of the heater
should be also done via the same board. Therefore the GVD was replaced by
the HRQ board for control of column heater and gradient valve (see Product
History on page 257).
Wear Retainer
The abrasion of the seal is a very well known fact. The wear retainer is a
device which keeps the departed particles around the seal instead of allowing
to move immediately into the flow path. The retainer consist of a small
porous Teflon disc placed directly in front of the seal. When installed the
retainer disc deflects and with the piston diameter slightly bigger than the
one of the Teflon disc a recess for the seal material is build.
With the operation time the plunger will widen the diameter of the disc
allowing part of the particles to move into the flow system. Therefore the
wear retainer should always be changed together with the seal. The high
pressure filter in the purge valve will collect all this materials without
problem. When changing the seals also the high pressure filter should be
changed too.
Outlet Ball Valve
The outlet ball valve is a cartridge type and does not need any maintenance.
It is not spring loaded and therefore uses gravity and the back pressure for
closing. To increase the reliability of this type of valve two ceramic seat/ ball
packages are used. The valve is less sensitive to contaminations and does not
require a sieve assembly in front. The cap in front of the valve holds a gold
seal for proper tightening. If the valve fails it is probably contaminated.
Cleaning can be done either in a sonic bath or by flushing using degreaser
spray in flow direction. Disassembling will damage the valve. The outlet ball
valve should only be tightened at the holding screw and not at the cartridge
itself. Under worst case conditions this could damage the cartridge
generating leaks at the seat/ball packages.
Flow Test Method
The flow test method should be always started with the remote mode in
LOCAL.
If set to GLOBAL the test method can be inhibited when a manual injection
valve in inject position is connected via the remote connector.
If the remote mode is set to HPSYSTEM the flow test will not be started at all,
because of the start request which is send out instead of a start.
Method loading
If a method will be loaded while pumping, the pump might be switched off
when there is a lower pressure limit set in the new method.
Flow Gradients
Timetables containing flow gradients with a starting point of 0 ml/min will
not be executed. Gradient parameter changes will always be executed at the
culmination point of the first piston. With a flow set to zero, this point will
never be reached.
Starting a 3390A or 3394A from the remote start of the manual injector
requires a slight modification of the injection sensor. 3390/94 integrators
need a dynamic signal which the manual injector can provide only if position
sensor is installed into an upright position.
Metering Drive Repairs
Evaluation of defective metering drives 01018-69100 showed that the wiper in
the spindle housing was broken or bent. The wiper defines the position of the
spindles to each other. Discussions with CEs revealed that some people try
to check out the metering drive without the pump head installed, especially
when troubleshooting E27 (max motor drive power exceeded) problems.
When the pump head is removed and the pump is initialized the spindle
movement is stopped by the wiper. The pump displays the message
pumphead missing. This is generally no problem for the mechanical
system. The following problems may occur when operating from this point
on.
The pump is turned on again without reinstalling the pump head.
Under this condition the pump will start with normal operation. The
wiper position is used as reference point. The movement of the spindle is
always stopped by hitting the wiper. This operation condition may
damage the wiper or misalign the spindles.
The pump head is reinstalled without initializing the pump.
The pump still uses the previous determined position as the reference
values for the pump. So when started the piston may run with full flow
speed into the mechanical stop. This can crack the pistons.
This problems can be avoided by:
NOT running the pump without pump head installed (also not for test
reasons).
Always do a pump initialization when the pump head is re-installed.
Troubleshooting E27 Errors (Max Motor Drive Power
Exceeded)
The E27 can have two reasons - a problem in the metering drive and also a
blocked outlet ball valve.
Blocked Outlet Ball Valve. It is possible that the valve is blocked (for
example the pin on the ball canted). In such a case the first piston cannot
deliver anything onto the high pressure side. The pressure in the first
chamber rises to values far above 400 bar. This pressure in the first
chamber cannot be detected by the pressure damper as it is located behind
the outlet ball valve. The pump motor working against a too high pressure
will exceed the maximum allowed drive power and gives error E27. This
can also be an intermittent problem.
Troubleshooting Procedure:
Remove outlet ball valve and let the pump run without the valve.
Replace the outlet ball valve and pump at high back pressure
(restriction). Error E27 under this condition verifies metering drive
problems. No error messages identify faulty outlet ball valves.
Problem with Metering Drive. Possible problems on the metering drive are
defective bearings defective motors or misalignment of the wipers.
Troubleshooting Procedure
Proceed in the same way as described before. Intermittent motor
problems might be identified.
Remove pump head and press down spindle by hand. This should be
possible without too much resistance. High resistance indicates a
bearing defect.
Remove metering covers and check for broken or loose wipers.
Piston with Conical Holder
Reports from the field and evaluation of returned parts showed that the
spring in the piston housing can scratch at the piston holder and may
generate a squeaking noise. This will not lead to a malfunction of the pump
but the noise has lead to customer complaints.
The piston holder was changed and now has a conical shape. The spring
should no longer scratch at the piston holder.
Ghost Leak messages
If the pump shows intermittent leak messages without any solvent in the leak
tray you should check the following two points.
Make sure that the leak sensor is not in close proximity of the plastic
funnel. This can cool down the sensor to the trigger level resulting in ghost
error messages.
Check the revision of the CMP board. CMP boards with revision E and
higher do have a improved leak sensor circuit installed. CMP boards with
revision D or below can be modified by soldering two 100nF capacitors
(0160-6623 or 0160-0576) between pin 12 and 11 and pin 12 and 9 of U45.
U45 is the sixth IC in the bottom row of the board (main connector on right
side). There are two fourteen pin IC beside each other. U45 is the right one.
PANIC Errors
Intermittent PANIC errors are mostly generated by spikes (disturbances) on
the bus lines. A dynamic bus termination has been added to the FIM board to
suppress the spikes and to reduce the possibility of this failure mode.
All firmware boards with revision C and higher do have the dynamic bus
termination installed (RC-network instead of a R-network). In case of
intermittent PANIC errors replace FIM boards (rev A or B) with the current
version.
In This Book
only.
1050 Series of HPLC

Modules
Service Handbook -
Sampler (79852A/B)
76337 Waldbronn
Germany
Copyright Agilent
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
The information
contained in this
this material,
including, but not
warranties or
merchantability and
purpose.
IMPORTANT NOTE
01050-90102 edition 4
(1995) and G1306-90102
information (79854A
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
11
11 Sampler: General Information
the 1050 Autosampler
Sampler: General Information
about this autosampler
repair policy
product structure
capillaries
specifications
About this Manual
This manual provides service information about the 1050 Autosamplers. The
following sections give the detailed descriptions of all electronic and
mechanical assemblies. You will find illustrated part-breakdowns
interconnection tables connector configurations as well as all necessary
replacement procedures in this manual. Detailed diagnostic procedures using
firmware resident test methods and error messages are also given in this
manual.
About the Autosampler
The 1050 Autosampler module houses the mechanical devices and the
electronic circuitry for control of the various functions of the injection
system. The module is controlled through the user interface through which
the operator defines his requirements (vial number, injection volume and so
on) and which provides the required information.
Repair Policy
Repair Policy
The 1050 Autosampler is designed that all components are easy accessible.
Customers are able to repair certain parts of the 1050 Autosampler, see
Operators Handbook.
For details on repair policy refer to Repair Policy on page 38.
Product Structure
The 1050 Series of HPLC modules are available in two versions.
In the standard version most of the parts in the flow path are stainless steel.
In the 1050 Ti Series the flow path of the autosampler consists solely of
corrosion resistant materials such, as titanium, tantalum, quartz, sapphire,
ruby and fluorocarbon polymers. It is recommended for use with mobile
phases containing high salt concentrations, extreme pH solutions and other
agressive mobile phases.
Autosampler 79855A
Ti - Autosampler 79855B
Capillaries
Capillaries
In the 1050 Series all capillary shipped with the modules will have a plastic
colour coating for identification in terms of material and internal diameter.
NOTE The capillaries for the 1050 Series will have only one color coating for the
internal diameter.
The capillaries for the 1050 Ti Series have two color coatings. One for
identifying the material, covering the main part of the capillary, and a small
one for the internal diameter. For the 1050 Ti Series the fittings are always
titanium with a titanium nitrite coating and the front and back ferrules are
gold plated.
Table 67 Capillary Color Code
color Internal Diameter Material
blue 0.25 mm
green 0.17 mm
red 0.12 mm
white tantalum
Specifications
Specifications
Table 68 Specifications of 1050 Autosampler
Injection Range Programmable from 0.1 to 100 l in 0.1 l increments
without hardware change required. Up to 1.8 ml with
larger injection valve capillary.
Replicate Injections 1-99 from one vial.
Precision Typically <0.5% RSD of peak areas from 5-100 l and
<1% from 2-5 l
Minimum Sample Volume 1 l can be sampled from 5 l in 100 l micro vial or
10 l in 300 l micro vial.
Carryover <0.1% typically
Wash Cycle None required, sample path flushed continuously with
mobile phase during normal operation.
Sample Viscosity Range 0.2 - 50 cp
Sample Capacity 21 or 34 in standard trays, with additional 100 in
external tray (less two positions for access).
Random Vial Access <4 seconds from standard tray.
Injection Cycle Time 20 seconds typically, depending on injection volume
and drawing speed.
Recommended pH Range
2.3 to 9.5 standard; 1.0 to 12.5 optional (TEFZEL

replaces VESPEL rotor). Solvent with pH below 2.3
should not contain acids which attack stainless steel.
Ti-Series pH 1 to 14.
Control Integrated keyboard with function keys; parameter
editing possible during run; keyboard lock. Optional
control by PC or 3396 Series II integrator.
Method Parameters Injection volume, draw offset, sample draw/eject
speed, 2 external contacts, stop time, post time,
injector program.
Specifications
Methods Battery-backed storage of up to 10 methods.
Automatic startup and shutdown methods. Editing of
stored methods possible during run.
Sequence Parameters Up to 10 parameter sets, each with keyboard setup of:
first- and last sample vial, # of injections per sample
vial, first- and last calibration vial, # of injections per
calibration vial, re-calibration frequency and injection
method. Editing of stored parameter sets possible
during run.
Communications Inputs: start request. Outputs: BCD for bottle number;
start; two external relay contacts (one 24 V relay, one
30 V (AC/DC) contact closure, both 0.25A). In- and
Outputs: stop, ready, shut, down. Optional interface
for GPIB and RS-232C.
front-panel LEDs and status logbook. User-definable
detection, safe leak handling, leak output signal to
shutdown pump. Low voltages in major maintenance
areas.
Environment 4C to 55C (constant temperature) with <95%
humidity (non-condensing)
100-Sample Tray
Temperature Control
1C to 60C using external circulating bath with
thermostat.
Autosampler Dimensions Height: 208 mm (8.2 in)
Width: 325 mm (12.8 in)
Depth: 560 mm (22.0 in)
Weight: 16 kg (35 lb)
Table 68 Specifications of 1050 Autosampler
12
12 Sampler: Hardware Information
about the 1050 Autosampler
Sampler: Hardware Information
components of the 1050 Autosampler.
Overview about the Autosampler
Autosampler hardware
Sampling Unit
Metering Drive
Analytical Head Assembly
High Pressure Switching Valve
Pneumatic Assembly
Additional 100 vial capacity
Overview
Overview
The 79855A/B Autosampler is a fully programmable module and is controlled
via the user interface. The operator sets the parameters at the user interface
which provides also the required analytical information. The processor
controlled electronic drives the mechanic of the 79855A/B Autosampler
consisting of sampling unit metering device and high pressure valve unit. The
pump delivers flow to a six port high pressure valve unit in which a sampling
unit and a metering device take the place of a sample loop. In normal mode
the needle of the sampling unit is held firm in its seat forming a leak free seal.
The valve unit directs the solvent through the metering device and the
sampling unit to the column. During injection the flow is bypassed and the
metering device loads the sample. Needle and metering device are always
flushed and ready for the next injection.
Solvent Flow Path
Solvent Flow Path
Solvent coming from the pump (capillary #1) enters via port 1 of the
switching valve the autosampler. In normal mode (switching valve in main
pass) the flow is guided from port 2 to the analytical head (capillary #2) and
from there via the loop capillary (#3) and the fitting (#4) to the needle (#5).
The needle is pressed into the seat and via the seat capillary #6 the flow
streams back to port 5 of the switching valve. The seat capillary can be
extended for injection volumes above 100 l (multiple injections). From port
6 of the switching valve the solvent will be connected to the column
(capillary #7). During the injection cycle (switching valve in bypass) ports 1
and 6 are connected and flow is directly connected to the column. The
metering device displaces its volume into the waste (capillary #8) before
drawing the injection volume form the vial.
Figure 106 Solvent Flow Path
How Does The Autosampler Work?
The processor controls the injection sequence. To avoid malfunctions the
1050 Autosampler will perform a mechanical reset after initial turn-on of the
module. It can also be reset using the {{CONTROL RESET}} instruction of the
user interface.
First step of the injection sequence is activating the pneumatic valve unit so
that the air pressure can change the position of the high pressure switching
valve (see step 1 on page 292).
The flow is bypassed and sampling unit and metering device are without
pressure. The stepper motor of the metering device is activated moving the
piston to its home position displacing its volume into waste. Next the
electrically driven sampling unit lifts the needle and moves the sampling tray
with a programmed vial under the needle (see step 2 on page 292).
If the additional 100 sample tray (18596L/M) is installed the arm of this tray
moves the vial into the transfer position of the 21 sample tray (vial 16).
The sampling unit lowers the needle into the vial and the programmed
injection volume is then drawn up into the sampling unit by the metering
device. The needle is raised the tray is moved back to home position and the
needle is reseat. The valve unit returns to its normal position reconnecting
the needle loop to the flow system (see step 3 on page 292). All of the sample
is pumped out of the 1050 Autosampler onto the column.
Sampling unit and metering device are always in the main flow path (normal
mode) and therefore an extra flushing procedure is not necessary. In case of
air in the system (metering device) increase flow (for example 5 ml) or use
appropriate solvent (for example isopropanol).
1 Injection Sequence I 2 Injection Sequence II
3 Injection Sequence III
The Injection Sequence
The Injection Sequence
The injection sequence is stored in controller memory. For each step of the
sequence a time for execution is assumed. If execution takes too long
(time-out) or fails, it will result in an aborted injection and an error message.
Each single step of the sequence can be executed solely when the system is
brought into the test functions.
1 Switch Valve Unit to bypass flow.
2 Initialize Metering Device.
# Includes step 1 to 5 of 18596L/M sample tray if installed and selected.
3 Raise needle.
4 Move vial underneath needle.
5 Lower needle into vial.
6 Draw sample up from sample vial.
7 Raise needle out of vial.
8 Move vial back to home position.
9 Lower needle onto seat.
10 Switch Valve Unit to flow through sample loop.
# Executes steps 6 to 9 of 18596L/M sample tray if installed and selected.
NOTE Steps 1 through 5 can be aborted.
What happens when the 18596L/M Sample Tray is connected?
What happens when the 18596L/M Sample
Tray is connected?
If the optional 18596L/M sample tray is connected to the autosampler, the
additional steps of the 100 sample tray will be incorporated into the injection
sequence. The 100 sample tray arm will move each selected vial into the
transfer position 16 of the 21 sample tray. After the injection, the 100 tray arm
moves the vial back to the original position in the 100 vial tray.
1 Initialize 100 vial tray.
2 Move to selected vial position.
3 Pick up vial.
4 Move to 21 sample tray.
5 Insert vial into position 16 of 21 sample tray.
6 Remove vial from 21 sample tray.
7 Move arm to vial position.
8 Insert vial into 100 vial tray.
9 Move the 100 tray arm to home position.
Figure 107 shows the block diagram of the 1050 Autosampler including all
currently available options.
The Common Main Processor (CMP) controls all functions of the module.
The firmware board (FIM) containing the EPROMs with the sampler specific
firmware is attached to the VMD board. Therefore the processor board
(CMP) remains identical for all modules.
The Max Tray Drive (MTD) controls the 18596L/M 100 sample tray when
connected to the autosampler. This expands the vial range from 21 vials to a
total of 119 vials. Two vial positions in the 21 vial tray are needed for access
from the 100 vial tray. The rotor reader option can be connected to the
18596L/M tray. Electronic control is done from the rotor reader board which
is attached to the MTD board.
The communication interface board (CIB) provides an GPIB and RS232C
interface. With the CIB installed the autosampler can be controlled via the LC
ChemStation or via the 3396 Series II integrator.
Figure 107 Block Diagram 1050 Autosampler
Sampling Unit
Sampling Unit
Repair Level: Component (see Parts ID)
The Sampling Unit comprises two functions, control of needle movement and
positioning the respective vial under the needle. The sampling unit is
controlled by the needle mini tray drive board (NMD).
The stepper motor for the needle movement is connected to a lead screw
which moves the needle arm with the needle up and down. Lightswitches at
the needle arm check for upper and lower limit of the needle and also check
the presence of a vial during the injection cycle. The second stepper motor
drives the coupler which holds the sample tray. The home position of the tray
is determined when a little magnet in the tray is located directly above the
home sensor. Standard sample tray with 21 vials or micro tray with 34 vials
are identified by the polarity of the tray magnet (north pole for standard tray
and south pole for the micro tray). A quadrature encoder on the coupler shaft
allows accurate positioning of the tray.
Table 69 Part Numbers Sampling Unit
Item Part Number
Sampling Unit 01078-60001
Ti - Sampling Unit 01079-60001
Sampling Unit
Figure 108 Sampling Unit
Table 70 Technical Data Sampling Unit
Number of spindle motor steps between
upper and lower limit
5867 steps (44 mm)
Number of spindle motor steps between
upper limit and needle in vial position
5334 steps (40 mm)
Needle speed 20 mm/sec
Spindle 200 steps (1.5 mm)/revolution
Number of encoder wheel slits 500
Resolution of the tray 2000 steps/revolution
Reproducibility of tray position 1 mm
Tray speed 2.3 seconds/revolution
Sealing Force 50-55 N
Ti Series
Materials in contact with solvent: tantalum, titanium, Peek, gold
Metering Drive
Metering Drive
Repair Level: Assembly or component level for given parts (see Parts ID)
The Metering Drive is responsible for drawing the sample into the sample
loop. The stepper motor controlled by the Valve Metering Drive Board (VMD)
drives the spindle via a belt. The circular movement of the spindle is
transformed in a linear movement for the piston via a bronze nut. A light
sensor determines the home position of the piston.
Table 71 Part Numbers Metering Drive
Item Part Number
Metering Drive 01078-60002
Table 72 Technical Data Metering Drive
Resolution of mechanical system 7 nl/step of motor
Number of steps between extension limits 15000
The sapphire piston moves up or down the spindle on a bronze nut. The built
in spring prevents clearance affecting drawing accuracy. Piston movement in
the analytical head is guided by a sapphire ring. On the backward stroke the
piston draws sample from the vial.
Figure 110 Analytical Head Assembly
Item Part Number
Analytical Head assembly 01078-60003
Ti - Analytical Head assembly 01079-60003
Table 74 Technical Data Analytical Head
Maximum stroke 100 l
Ti Series
Materials in contact with solvent Filled Teflon, sapphire,
titanium
Repair Level: either Exchange Assembly or component level for given parts
(see Parts ID)
The High Pressure Switching Valve bypasses the flow direct to the column
during the injection cycle. The valve is air driven. The switching positions of
the valve are sensed with a light switch that provides a status signal to the
Valve Metering Drive (VMD) indicating proper execution of any movement.
Figure 111 High Pressure Switching Valve
High Pressure Switching Valve 01078-60004 01078-69004
Ti - High Pressure Switching Valve 01079-60004 01079-69004
Table 76 Technical Data High Pressure Switching Valve
Ti Series
Materials in contact with solvent Tefzel, titanium, ceramic
Pneumatic Assembly
Pneumatic Assembly
Air supply is connected from the rear of the module to a self latching
solenoid valve. Pressure is sensed for an under pressure condition (<5 bar)
with a sensor that provides an electrical status signal. Air pressure is applied
to the SUP connector of the valve. In normal position pressure is connected
to connector CYL1.When the solenoid is activated by a pulse, the air stream is
directed to outlet CYL2 and the air pressure moves the 6 port valve and
forces it to stay there. Air pressure is applied to the SUP connector of the
valve.
In normal position pressure is switched to connector CYL1 and when the
valve is switched it moves to CYL2. Both exhaust outlets (EXH1/EXH2) are
connected together at the rear of the module. The air leaves through a filter
to reduce the noise during the switching. Electrical control of the valve is
from the Valve Metering Drive (VMD).
Figure 112 Valve Connections
Table 77 Part Numbers Pneumatic Assembly
Item Part Number
Pneumatic Assembly 01078-66101
Pneumatic Assembly
For test reasons the actuator air solenoid may be switched manually.
Actuator Air Solenoids
Manual air actuation is done in the following way:
Figure 113 Pneumatic Assembly
Table 78 Switching of Solenoids
Screw A Screw B Cyl #1 Cyl #2 Comment
0 0 SUP EXH Relaxed Position
1 0 SUP EXH
0 0 SUP EXH Solenoid ready for next switch
0 1 EXH SUP
0 0 EXH SUP Solenoid ready for next switch
Additional 100 Sample Capacity
This option for the autosampler comprises the max tray drive board
assembly (MTD), the tray support and the foot support. A new firmware
might be required when updating existing instruments.
With these parts it is possible to adapt the unmodified 18596A/B GC tray to
the 79855A Autosampler (See also Updating to an additional 100 vial tray).
The 100 vial tray has to be ordered separately.
NOTE The 18596A/B tray get a different order suffix when ordered for an 1050
Autosampler. Reason are the different accessories (for example manuals and
so) when ordered for an LC or GC.
For access of the additional vials the firmware adds 100 to each tray position
so that the 100 sample tray holds the positions 101 to 200. The arm of the 100
sample tray moves the selected bottle into position 16 of the 21 sample tray.
Position 15 has to be empty for the undisturbed movement of the tray arm.
After the injection the vial is placed back into its original position in the large
tray. The remaining vial range of the 21 sample tray (1 to 14 and 17 to 21) is
fully accessible. The firmware automatically skips vial 15 and 16.
NOTE Service Information about the 18696A/B can be obtained from the 7673
Service Manual for the A tray and for the B tray.
Table 79 100 Vial Tray
GC LC
18596A 18596L
18596B 18596M
Figure 114 Additional Tray Option
13
13 Sampler: Electronic Information
Sampler: Electronic Information
This chapter gives information about the electronic of the 1050 autosampler:
Overview
Max Tray Drive Board (MTD)
Needle Mini Tray Drive Board (NMD)
Valve Metering Drive Board (VMD)
Autosampler Motherboard (ALM)
Overview
Overview
All electronic boards (except the FIP, behind the keyboard) are located in the
rear part of the module and they are connected to the Motherboard (ALM).
Excess to the boards is from the rear of the instrument. Slot numbers (for
example in the status display) are counted from left to right. The Power
Supply (DPS-B) is located in slot 1 and the common main processor is
located in slot 7. The rear of the autosampler is shown in Figure 115 on page
310.
In the Autosampler the following electronic assemblies are available:
# Optional board
## Optional board, attached to the MTD board (not described in this
manual)
Power Supply (DPS-B) 5061-3374 01050-69374
# Max Tray Drive Assembly (18596A/L) (MTD) 01078-66503 01078-69503
## Max Tray Drive Assembly (18596B/M) (MTD) 01078-66513 01078-69513
# Rotor Reader Drive Assembly (G1926A) (RRC) 01078-66507
Valve Metering Drive (VMD) 01078-66501 01078-69501
Needle Mini Tray Drive (NMD) 01078-66502 01078-69502
Firmware Board (SFW) 01018-66506
Motherboard (ALM) 01078-66504
Communication Interface (CIB) 5061-2482
Overview
NOTE For information about Power Supply, Common Processor and Fluorescent
Interface refer to chapter 1050 Common Information.
Figure 115 Rear of 1050 Autosampler
NOTE The MTD board is optional.
Overview
Figure 116 Block Diagram 1050 Autosampler
Repair Level: Board
NOTE The RRC board will be attached to the MTD board when Rotor Reader Option
(G1926A) for the 100 vial tray is installed.
The function of the board is to control the 18596L/M sample tray and to
provide the electrical interface to the common main processor (CMP). The
18596L/M is part of the 7673A product family.
I/O Control
The I/O control circuit enables the common main processor (CMP) and the
maxi tray drive (MTD) to exchange data. This is done via a bidirectional I/O
buffer. A board identification (a resistor network) allows the processor to
identify the board and to address.
Sensor Status
Via the sensors interface circuit the sensor status is transferred to the sensor
status latch. The sensor status latch transfers the information via the
common bus to the CMP.
Table 81 Part Numbers for MTD Board
MTD Board 18596M 01078-66513 01078-69513
MTD Board 18596L 01078-66503 01078-69503
RRC Board for both versions 01078-66507
Data Conversion
While the common main processor bus has a parallel data structure the Main
Processor Unit (MPU) uses a serial data bus. The data conversion section
performs the parallel to serial and serial to parallel conversion for the
different bus structures.
Figure 117 Block Diagram MTD Board
Clock
The clock circuit provides all necessary frequencies for the main processor
unit (MPU) and the data conversion section. It uses a 4.9152 MHz clock
generator.
Main Processor Unit (MPU)
The MPU is the heart of the MTD board and controls all the functions of the
18596L sample tray. All the necessary memory needed to run the 100 tray
resides inside the MPU chip. The MPU chip provides all the signals for the
motor drivers and sends a tray fault signal out in case of malfunctions.
To control all the steps of the tray the MPU reads the sensor status from the
sensor interface.
Reset and Watchdog
This circuit checks for proper operation of the Main Processor Unit (MPU).
In case of malfunctions (for example timing problems and so on), the reset
and watchdog resets the system preventing any damage of the 18956L tray.
The System OK Signal (SOK) from the Common Main Processor (CMP) is
also fed into the reset and watchdog block. In case of 79855A processor
problems or problems which influence the SOK status, the reset and
watchdog will also reset the MTD board.
Motor Drivers
Three motors control all the movements of the 18596L 100 sample tray. The
radial arm drives (R-Motor) and the gripper drives (Z-Motor) are similar. To
keep the position of the arm or the gripper mechanism when not turning the
motors are powered down to maintain a standby torque. The angular driver
(Theta-Motor) provides a constant standby current in chopper mode and
normal on/off switching of the motor windings at standard speed.
Sensor Interface
Three position sensors are located in the tray to provide feedback as to the
position of the tray arm. An additional sensor in the gripper on the arm to
indicates the presence of a bottle. The bottle sensor is simply a micro switch
which provides a short ground when the bottle is present. The two position
sensors that are used to sense the home positions for radial (R) axis and
gripper (Z) axis are hall sensors that provide a logic low output when they
encounter a suitable magnetic field. Small permanent magnets are placed in
the appropriate positions in the tray. The angular (Theta) axis position
sensor is an optical photo diode transistor pair. The photo diode is turned on
only when the motor is being actuated. The interlock is a sense line which
identifies whether the sample tray (cable) is installed or not.
Figure 118 Board Layout MTD
Repair Level: Board, Capacitor
The main function of the NMD board is the control of needle motor and tray
motor.
Capacitor 100pF
Firmware revision 4.0 and above require a modification of the NMD board.
Otherwise incorrect positioning of the 21 or 34 vial tray may occur. The
100 pF capacitor soldered between pin 5 and 7 of U26 solves the problem.
Instruments with serial number prefix 3117 G ..... or 3121 A ..... do have this
capacitor.
I/O Control
The I/O control circuit enables the common main processor and the needle
mini tray drive (NMD) to exchange data. This is done via a bidirectional I/O
buffer. A board identification circuit allows the processor to identify the
board and to address it.
BCD Output
The circuit codes the bottle number into BCD and provides the signal to the
connector on the back of the NMD board. The BCD code is implemented in
positive true logic. Firmware REV 2.0 and above allow configuration of the
output for either 2 digit BCD coded or 8 bit binary (HEX) coded information.
Table 82 Part Numbers for NMD Board
NMD Board 01078-66502 01078-69502
Capacitor 100 pF (between pin 5 and 7 of U26) 0160-4801
Figure 119 Block Diagram NMD Board
Sensor Status
The hall sensor, the bottle sensor and the needle sensor are connected to this
circuit block. The hall sensor checks the presence of the sample tray and is
used to set the home position. The bottle sensor checks for the presence of a
bottle during injection cycle. The needle sensor checks upper and lower
position of the needle. The status information from the sensors are
transferred directly to the processor.
Control Logic
The control logic provides the motor parameters to the motor driver. The
parameters are the direction, resolution and current for the motors. The
control logic starts the timer and stops it under two conditions. In case a light
sensor detects the home position or the number of steps of the motor have
been elapsed, the timer will be stopped. To increase the life time of the
sensors the control logic activates the light sensors only during the injection
cycle and switches it off afterwards.
Timer
The timer chip of the timer circuit consist of three independent timer/counter
stages from which only two are used. One timer generates the speed (step
frequency) of needle and sample tray motor. The second timer defines the
number of steps the motor has to perform to reach its selected destination
(needle position).
Motor Driver
The motor driver delivers the power to the two motors. A bipolar phase
controller allows a high torque at high frequency for the movement.
Quadrature Decoder
The quadrature encoder on the tray coupler senses the movement of the
sample tray. The derived signals contain information of the direction and the
actual position of the tray motor. The decoder reads the signals and transfers
the information to the processor.
Figure 120 Board Layout NMD
Repair Level: Board, Fuse
The main functions of the board is to control the Metering Drive and the High
Pressure Switching Valve. In addition the VMD board holds also the firmware
for the common main processor (CMP).The firmware is attached to the VMD
board but has no functional connection to the board.
I/O Control
The I/O control circuit enables the common main processor and the Valve
Metering Drive (VMD) to communicate data. This is done via a bidirectional
I/O buffer. A board identification circuit allows the processor to identify the
board and to address it.
Control Logic
The control logic provides the motor parameters to the motor driver circuit.
The parameters are the direction, resolution and current for the metering
drive motor. The control logic starts the timer. It stops it in case the home
position light switch is activated or the motor steps have been elapsed. To
increase the life time of the sensors the control logic activates the light
sensors only during the injection cycle and switches it off afterwards. The
pneumatic valve will be switched via the valve driver circuit to change the
position of the high pressure switching valve.
Table 83 Part Numbers for NMD Board
Valve Metering Drive (VMD) 01078-66501 01078-69501
Fuse F12, F14 250 mA 2110-0004
Figure 121 Block Diagram VMD Board
Relay Contact Control
Two relay contacts are controlled. When activated, contact 1 provides fused
(250 mA) +24 V, while contact 2 provides a fused (250 mA) 30 V maximum
(AC/DC) rated contact closure. For more information about the relay
contacts see External Contacts on page 56 in the chapter 1050 Common
Information.
Timer
The timer chip of the timer circuit consist of three independent timer/counter
stages from which only two are used. One timer generates the speed (step
frequency) of the metering motor. The second timer defines the number of
steps the motor has to perform to reach its selected destination (volume).
Motor Driver
The motor driver delivers the power to the motor. A bipolar phase driver
allows a high torque for the movement.
Sensor Status
The metering home sensor the valve position sensor and the air pressure
switch are connected to the sensor status circuit. The home position sensor
checks whether the piston of the metering unit is in the maximum front
position or not. The valve position sensor checks the switching of the bypass
valve. The air pressure switch senses low air pressure in the system and
inhibits further injections. The metering motion status signal gives the
information whether the metering drive motor is running or not. The signal is
derived from the timer circuit. The switch (S28) is not used so far and is
reserved for future use.
Figure 122 Board Layout VMD
Repair Level: Board
The FIM board is a piggy back board, placed on VMD board (personality
module).
The programmed FIM contains the firmware of the 1050 Autosampler.
The FIM contains 128K x 8bit EPROMs.
Figure 123 Layout of FIM Board
Item Part Number
Firmware Board (New) 01078-66506
Repair Level: Board
The motherboard contains all connectors for the boards and the assemblies
in the front part, like sampling unit, metering drive, high pressure switching
valve, pneumatic valve and keyboard.
Figure 124 on page 326 shows the location of all connectors. A mechanical
Injection Counter displays the actual number of injections counted by
switching valve transitions.
Table 85 Part Numbers for ALM Board
Item Part Number
ALM Board 01078-66504
Figure 124 Layout of Autosampler Motherboard
Figure 125 on page 327 to Figure 127 on page 329 show the main signals and
voltages of the various boards and connectors.
Table 86 ALM Connectors
J1 - Power Supply J9 - DGND J17 - Leak Sensor
J2 - TAR Board J10 - Bottle Sensor J18 - Home Sensor
J3 - VMD/FIM Board J11 - future option J19 - Metering Motor
J4 - NMD Board J12 - Needle Motor J20 - Valve Position
J5 - Not used J13 - Tray Motor J21 - Low Pressure Switch
J6 - Not used J14 - Shaft Encoder J22 - Pneumatic Solenoid Valve
J7 - CMP J15 - Hall Sensor
J8 - FIP Keyboard J16 - Needle Sensor
Figure 125 Connectors ALM (Part I)
Figure 126 Connectors ALM (Part II)
Figure 127 Connectors ALM (Part III)
Extender Test Board (ET)
The extender test board in combination with the cable assembly allows the
operation of sampling unit metering drive and high pressure switching valve
taken out of the autosampler module. The test board contains all the
connectors for the different items and holds some electronic for
troubleshooting and sensor adjustment. Figure 128 shows the circuit diagram
of the test board. The LEDs CR1 to CR7 show the actual status of the
sensors. An LED which is ON indicates that the sensor is either blocked or
deactivated. The sensors are only activated during the injection cycle.
Figure 128 Extender Test Board
Table 87 Part Numbers for Extender Test Board
Item Part Number
Extender Test Board 01078-66509
Cable Assembly 01078-61609
Figure 129 Circuit Diagram ET Board
14
14 Sampler: Diagnostic Information
Autosampler
Sampler: Diagnostic Information
This chapter provides information about
diagnostic steps
error messages
additional information
Single Steps
Single Steps
The autosampler has several test functions which are part of the control
section. The test functions provides access to the single steps of the injection
sequence. If the 18596L/M sample tray (100 sample tray) is installed the
firmware provides also single steps for this tray.
Entering the Test Functions
Press CTRL and with NEXT move the cursor to the TEST FUNCTIONS
display and press ENTER.
With the PREV or NEXT keys all of the single steps are accessible.
NOTE This section describes only the function of the single steps. In case of
malfunctions or error messages refer to the troubleshooting section of this
manual.
Single Steps For The 21 Sample Tray
CAUTI ON Single steps can be performed in any order and the step sequence is under the
control of the operator. In case of incorrect step sequences damage of needle,
seat, sample tray and other parts of the instrument might be possible. Multiple
execution of the steps should be avoided because of occurring error messages
or possible damage of the instrument. The single steps should always be
performed with the inner cabinet installed.
SINGLE STEP 1 SINGLE STEP 1 BYPASS
The high pressure switching valve is activated and the mobile phase is
directed to the column bypassing the metering device and the sampling unit.
The correct switching of the valve is checked via a light sensor. Multiple
execution of this step will create an error condition (E11).
SINGLE STEP 2 SINGLE STEP 2 METERING HOME
Metering device drives in the plunger to its mechanical limit named the home
position. At home position a lever at the spindle system blocks the light path
of a light switch. The metering device motor stops and reverses the direction
until the lever has moved out of the light path. Multiple executions of this
step are possible.
SINGLE STEP 3 SINGLE STEP 3 NEEDLE UP
Sampling unit raises needle. Interrupter sensor detects upper position of the
needle. Multiple execution creates an error message (E13) because of the
missing activation of the sensor.
SINGLE STEP 4 SINGLE STEP 4 POS. MINITRAY
Sample tray moves vial under needle. During the initialization of the
autosampler the home position of the sample tray will be determined (hall
sensor). From this home position the selected vial will be reached by
counting the steps of the encoder, which is mounted to the tray shaft.
Multiple execution of this step are possible.
SINGLE STEP 5 SINGLE STEP 5 NEEDLE INTO VIAL
Sampling unit lowers needle into vial. The stepper motor executes a defined
number of steps to lower the needle. No sensor is involved in this action. Do
not execute this step a second time. Otherwise the needle will be lowered
again by the same number of steps. This means that the needle hits either the
bottom of the vial or the plastic of the sample tray (if no vial is present). No
error message will occur.
SINGLE STEP 6 SINGLE STEP 6 DRAW UP
Metering device withdraws plunger drawing up sample according to selected
injection volume. For each injection volume the metering device motor
performs certain steps to withdraw the plunger. Multiple execution of this
step will withdraw the plunger until it reaches the maximum position. No
error will occur.
SINGLE STEP 7 SINGLE STEP 7 NEEDLE OUT
Sampling unit raises needle out of vial. The needle motor is activated until
stopped by the interrupter sensor, which is activated at upper position.
Multiple execution of the step are possible without any problem (needle
moves always up until it reaches the upper position and is moved back).
SINGLE STEP 8 SINGLE STEP 8 MINITRAY HOME
Sample tray moves back to home position. The number of encoder steps
performed under step 4 will be executed in opposite direction. The home
sensor is not involved in this action. Multiple execution of this step are
possible without any problem (tray remains in home position).
SINGLE STEP 9 SINGLE STEP 9 NEEDLE DOWN
Sampling unit lowers needle into needle seat. Lower position is determined
by the activation of the interrupter sensor. Multiple execution will create an
error message (E19) because light path of sensor is already blocked.
SINGLE STEP 10 SINGLE STEP 10 MAINPASS
Switches switching valve to direct mobile phase through metering device and
sampling unit and then into column. Light switch recognizes the change of
the position. Multiple execution of this step will create an error message
(E20) because the light switch will not be activated again.
Single Steps for the 100 Sample Tray
If the 18596L/M 100 sample tray is connected to the autosampler the
firmware provides also single steps capability for this tray.
Entering the Additional Single Steps
Press CTRL and with NEXT move the cursor to the TEST FUNCTIONS
display and press ENTER.
With the PREV NEXT keys move to the display
SINGLE STEPS 100 vial tray and press ENTER.
NOTE This section describes only the function of the single steps. In case of
occurring malfunctions or error messages refer to the troubleshooting section
of this manual.
CAUTI ON Single steps can be performed in any order and the step sequence is under the
control of the operator. In case of incorrect step sequences damage of gripper
assembly tray arm and other parts of the instrument might be possible.
Multiple execution of the steps should be avoided, because of occurring error
messages or possible damage of the instrument.
SINGLE STEP 1 SINGLE STEP 1 INIT 100 TRAY
100 sample tray performs an initialization. Multiple execution of this step
causes no problem.
SINGLE STEP 2 SINGLE STEP 2 MOVE TO POS 101
From the home position the tray arm moves to the position 1 of the 100
sample tray. The firmware does not support access to other vials. Do not
execute the step a second time. Otherwise the arm performs the same
number of steps again and moves into the mechanical stop.
SINGLE STEP 3 SINGLE STEP 3 PICK UP VIAL
The gripper assembly moves down, picks up the bottle and the gripper moves
up to home position (determined by a hall sensor). Second execution of this
step will lead to incorrect position in step 4.
SINGLE STEP 4 SINGLE STEP 4 MOVE TO 21 TRAY
Tray arm moves vial to the 21 sample tray position and stops above vial
position 16 of the tray. Do not execute this step a second time, because the
arm would move into the mechanical stop.
SINGLE STEP 5 SINGLE STEP 5 INSERT VIAL
Gripper assembly moves down and places the vial into the 21 sample tray and
gripper returns to home position. Down position of the gripper can be
influenced via the teach tray mode. Do not execute the step a second time.
Otherwise incorrect positioning of the tray arm will occur and the following
steps might show incorrect results.
SINGLE STEP 6 SINGLE STEP 6 REMOVE VIAL
Gripper assembly picks up the vial from the 21 tray. Step is similar to step 2.
SINGLE STEP 7 SINGLE STEP 7 MOVE TO POS 101
From the 21 sample tray the arm moves back to the position 1 of the 100
sample tray. Second execution should be avoided, otherwise the tray arm
moves into the mechanical stop.
SINGLE STEP 8 SINGLE STEP 8 INSERT VIAL
The gripper assembly moves down and replaces the vial into its original
position.
SINGLE STEP 9 SINGLE STEP 9 HOME 100 TRAY
The tray arm is moved back to the home position. This step is not identical
with the initialization of the tray arm.
18596L/M Sample Tray Diagnostic Mode
Tray diagnostics mode isolates sample tray motion in each of the Z (gripper
arm), R (radial movement of tray arm) and Theta (angular movement of tray
arm) direction.
Entering Diagnostic Mode
Turn off power at the 79855A autosampler.
Take out the MTD board and put the RUN-TEST jumper J13 into TEST
position.
Replace the board.
Take the sample quadrants out of the 18596L/M sample tray, if not taken
out interference in Z direction will occur.
Turn on line power and the 18596L/M will go automatically into the Z test.
Z Test (Gripper Assembly)
First the tray will home itself to the Z sensor at the top of travel.
The tray will then drive the gripper down in Z back up to the sensor and up
further to the mechanical stop.
If the test passed (for example no problem in Z direction), the tray will pause
two seconds and then it will repeat the test.
If the bottle switch is pressed after passing the test, the sample tray will
advance to the R test.
NOTE If the Z sensor was not found (due to shorted motor, board problem, bad flex
circuit, bad sensor, and so on), the test will abort. Turn off the autosampler
and turn on again to restart the test. Pressing the bottle switch when in this
error condition will advance the sample tray to the R test.
R Test (radial arm movement)
First the arm will drive to the hard stop in R and locate the R sensor.
The arm will then be driven out to full extension in R, back to the R sensor
and back to the hard stop.
If the test was passed, the sample tray will pause two seconds and then it will
repeat the R test.
advance to the Theta test.
NOTE If the R sensor was not found, the test will abort. Turn off the autosampler and
on again to restart the test. Pressing the bottle switch when in this error
condition will advance the sample tray to the Theta test.
Theta Test (angular movement)
First the sample tray will home itself in R and Theta direction. The R axis is
homed so that the Theta motion can be made with R in its normal operating
position. Failure of the R axis to home will not prevent the Theta test from
running.
The Theta test drives both R and Theta motors.
After homing R and Theta, the arm will rotate 180 counter-clockwise, 360
clockwise and 180 counter-clockwise and check for the Theta sensor.
If the test was passed, the tray will pause for two seconds and then it will
repeat the test.
advance to the Z test.
NOTE If motor steps are lost, the test will abort. Turn off the autosampler and on
again to restart the Z and R test.
Error Messages
Error Messages
The error messages will help to locate and repair a possible failure. In case an
error message appears the Error LED will be turned on and the message will
be written into the system logbook. RESET INJECTOR clears the error
message. The entry in the logbook remains.
The error messages are divided into the following blocks:
Selftest
PANIC Error
Error Messages for Firmware Revision 4.0 and greater
Injector Program
Error Messages for Firmware Revision 3.1 and below
Events
18596L/M vial tray
Error Messages
Selftest
performed when CTRL will be pressed while the module is turned on at the
LINE ~ switch. In case of a failure one of the following messages appears.
The complete test requires approximately two minutes.
The ROMs on the FIM board are tested. In case of a checksum error the ROM
test fails. Replacement of the FIM board will probably fix the problem.
Panic Error
Bus Error Address
Error
PANIC: XXXXXXH BUS ERROR
PANIC: XXXXXXH Address ERROR
The panic error messages should not appear under normal operation
conditions. In case of hardware or firmware problems the instrument might
try to access a wrong or not existing address which results in the error
message on the display. The instrument is locked up and has to be switched
off/on.
Reason for the PANIC error message can be any disturbance on the bus lines
due to bad contacts (high resistance) or defective IC on any of the boards.
Check boards for good connections or corrosions at the contacts (clean
contact pins).
Check firmware revision of the firmware board (SWF). It should be
revision C or higher. Boards with revision C do have a dynamic bus
termination for spike suppression on the bus lines.
Replace one board at a time to identify the faulty one.
If board replacement will not cure the problem, replace the motherboard.
E00 : Power Fail E00 HH:MM DDMMM power fail
This event message indicates that the instrument has either been turned off
or disconnected from line source or a line power voltage drop has occurred.
The system clock will stop and has to be set after turning on the module.
E01 : Leak Detected In
Detector
E01 HH:MM DDMMM leak detected >
leak detected > in injector
The leak detection system uses a PTC resistor as leak sensing item. Liquid
cooling the PTC results in a decrease of the resistance. The PTC is built in a
resistor divider which is connected to a constant voltage. From the voltage
divider a signal can now be obtained depending on the current through the
PTC and hence depending on the temperature. The leak detection circuit is
located on the CMP board and checks continuously for presence and leak
conditions. If the sensor is missing (defect) or in leak condition the PTC is
cooled down the error message appears. When the module is turned on the
leak message will be disabled for some time (30 seconds) to allow the sensor
to reach its working range.
Actions:
Check for leaks in autosampler.
Change leak sensor.
Change CMP board.
Change FIM board.
E02 : Shut down E02 HH:MM DDMMM shut down >
error in other module
An external device pulled the shut down line of the remote connector down.
This forces the autosampler to stop all further injections.
E03 : Error Method
loaded
The operator may define an method as a error method. The event message
gives the information that the instrument detected an error and that the error
message has been loaded.
E04 : Time Out E04 HH:MM DDMMM time out >
The operator may define a time period after which the instruments stops all
further actions. In case the instrument is in a sequence and a not ready has
been detected in one of the other modules the instrument will stop the
sequence after time out time has been elapsed.
Error Messages for Firmware Revision 4.0
and greater
NOTE Firmware revision 4.0 and greater incorporates the injector program for the
autosampler. The injector program required a restructure of the internal code
of the injection cycle. Therefore some of the error messages had to be
removed. This section shows the error messages for the current firmware
revision 4.0 and greater. Nevertheless the same messages appear also in all the
previous firmware versions. The additional error messages for firmware
version 3.1 and below are described in section Normal Operation Messages
for Firmware Revision 3.1 and below on page 351.
The following messages might appear during the initialization, the injection
cycle and a reset of the injector.
At initialization and reset the system sets all components (sampling unit,
metering device and high pressure switching valve) to home position. Missing
or low air pressure will not result in an error condition.
When started, the injection cycle will perform all the steps which are
necessary to introduce the sample into the flow path.
E11 : Valve not moved
to bypass
E11 HH:MM DDMMM inject failed >
valve not moved to bypass
A light switch controls the movement of the high pressure switching valve. In
case the sensor does not see a dynamic signal change the error message
appears. Reason might be missing air (air pressure message?), a misadjusted
lights witch or failures in the electronic circuit.
Check air supply.
Check sensor adjustment.
Check wether the solenoid is activated.
Change the VMD board.
Change the sensor.
E13 : Needle has not
been raised
needle has not been raised
The motor is activated and moves the needle arm out of the seat or vial. In
the upper position the interrupter pin blocks the light path of the interrupter
sensor. The motor is stopped and the interrupter pin is moved out of the
lights witch. Both positions upper limit and lower limit are determined by the
same lights witch (interrupter sensor).
Check for blockages of the sensor.
Check for proper connection of motor and sensor.
Check for smooth movement of the spindle system.
Check for smooth movement of the bottle vane (bottle sensor).
Check drive nut.
Change NMD board.
Change interrupter sensor.
E14 : Vial position not
found
vial position not found
During the initialization, the sample tray determines its home position
(magnet above home sensor). The shaft encoder mounted onto the tray
coupler provides the information to reach the various vial positions of the
tray. If the selected position cannot be reached the error message will appear.
Possible failure modes are blockages of the mechanical system, defective
encoder or a electronic problem.
Check for mechanical blockages of the mechanical system (sample tray,
tray coupler, belt and so on).
Check all cable connections.
Change NMD board.
Change encoder.
E18 : Home position of
tray not found
E18 HH:MMDDMMM inject failed >
home position of tray not found
After moving the requested vial to the injection position the sample tray
moves back to its home position. The encoder checks the movement of the
tray. If the tray cannot be moved the error message will appear. Failure
modes might be mechanical blockages of the tray or problems from the
encoder.
Check for blockages of the system.
Check Encoder signal.
Check Home sensor signal.
Change NMD board.
been lowered
needle has not been lowered
From the upper position the needle gets the command to move down into the
seat or vial. In case of malfunctions the error appears. A defective bottle in
place sensor might also generate the error.
Check the needle motor and sensor connection.
Check for blockages of the mechanical system.
Check sensor signal.
Lubricate bottle vane.
Change NMD board.
Check bottle in place sensor.
E20 : Valve not moved
to mainpass
valve not moved to mainpass
Last step in the injection sequence is to turn back the high pressure switching
valve into its main pass position. Problems in the air supply, sensor or board
problems may cause the error message to appear.
Check the pneumatic assembly.
Check cable connections.
Check sensor adjustment.
Change VMD board.
E22 : Plunger home
position not found
plunger home pos not found
The plunger of the metering device is moved forward until the home position
sensor indicates the maximum allowed front position. In case the home
sensor cannot be recognized the plunger moves into the mechanical stop.
The motor will be stopped after the programmed time out has been elapsed.
Second possibility is that the motor does not start and the plunger will not
move at all. After time out the error message appears. Possible failure modes
are a misadjusted or defective sensor or a defective motor.
Change VMD board.
Check alignment of sensor.
Change sensor.
E24 : Tray home
position not found
tray home pos not found
During the initialization the sample tray determines its home position
(magnet above home sensor). If the home position could not be recognized
the error appears (for example sample tray not installed). At the begin of an
injection the system checks for the presence of the home sensor. If this
cannot be recognized the tray will be positioned incorrectly and the error will
show up.
Check the magnet of the sample tray.
Check for mechanical blockages of the mechanical system (sample tray,
tray coupler and so on).
Check tray motor.
Change encoder.
Change NMD board.
Injector Program Error Messages
Injector Program Error Messages
The injector program introduced with the firmware revision 4.0 and greater
comprises the programmable functions such as draw eject and mix sample.
This allows to program particular injections for the autosampler. The injector
program will be part of the method when stored.
E16 : Plunger failed to
draw/mix/eject
sample
inject failed to draw/mix/eject sample
The program line cannot be performed because a lack of draw, eject or mix
volume is left in the syringe. Use the verify function to identify the faulty
program line and correct the volume.
E97 : Program wait
time elapsed
program wait time elapsed
The utility functions allow to wait for remote line changes. If a remote line
change has not occurred before the time-out has elapsed, the error occurs.
E98 : no device for vial E98 HH:MM DDMMM inject failed >
no device for vial
The vial number used exceeds the limit of the vial range. This is possible
when using the SAMPLE+ command (adding a number to the actual vial
number) in the injector program. This function cannot be tested with the
verify function.
E98 : Volume exceeds
limit
volume exceeds limit
Incorrect setting of draw/eject commands may lead to a limit violation for the
injection volume. This function cannot be tested with the verify if the volume
was determined via the def command.
Normal Operation Messages for Firmware Revision 3.1 and below
Normal Operation Messages for Firmware
Revision 3.1 and below
NOTE Following error messages describe the failure modes for instruments with
firmware revision 3.1 and below. The error messages will appear in addition
to the errors described before for revision 4.0 and greater.
E12 : Plunger home
position not found
plunger home pos not found
The plunger of the metering device is moved forward until the home position
sensor indicates the maximum allowed front position. In case the home
sensor cannot be recognized, the plunger moves into the mechanical stop.
The motor will be stopped after the programmed time out has been elapsed.
Second possibility is that the motor does not start and the plunger will not
move at all. After time out the error message appears. Possible failure modes
are a misadjusted or defective sensor or a defective motor.
Change VMD board.
Check alignment of sensor.
Change sensor.
E15 : Needle did not
move into vial
needle did not move into vial
The system assumes that the needle is in its upper position. From this
position the needle will be lowered into the vial. The processor determines
how many steps the motor has to perform. This information will be send to
the NMD board. In case the needle will not be lowered a electrical
malfunction should be the failure mode.
Check connection of the needle motor.
Change NMD board.
E16 : Plunger failed to
draw sample
plunger failed to draw sample
From the home position the plunger is moved back a certain number of steps
to draw the requested volume. Failure mode is the electronics of the VMD
board.
Check connections of metering motor.
Change VMD board.
E17 : Needle did not
move out of vial
needle did not move out of vial
The needle motor is activated to move the needle in its upper position. If this
action fails the error appears. Possible failure mode is the interrupter sensor,
spindle motor or the NMD board.
Check interrupter sensor.
Change NMD board.
been raised
needle has not been raised
During this step the needle is raised from any position. In case this step fails
the error message appears.
Check for blockages of the sensor.
Check for smooth movement of the spindle system.
Check drive nut.
Change NMD board.
Change interrupter sensor.
been lowered
needle has not been lowered
From the upper position the needle driver gets the command to move the
needle down into the seat. In case of malfunctions the error appears.
Firmware revision 2.0 and above connect the functioning of the needle
sensor and the bottle in place sensor. If the bottle in place sensor is defective
the error will also appear.
Check the needle motor and sensor connection.
Check for blockages of the mechanical system.
Lubricate bottle vane.
Check sensor signal of interrupter and bottle in place sensor.
Change NMD board.
Events Messages
Events Messages
Event messages give the operator informations about the performed action
of the instrument. Messages will appear in the logbook.
E26 : No vial in
sam[ple tray
E26 HH:MM DDMMM missing vial >
no vial in sample tray
During the injection sequence the bottle in place sensor checks for the
presence of a vial. If no vial is in the tray the message appears in the logbook.
Depending on the system configuration (stop/cont/skip at missing vial), the
message is interpreted as an error or a event message. If the vial sensor is not
connected or defective error message E19 will appear.
Place a bottle into vial position.
Check bottle in place sensor.
Check cabling of sensor board.
Change sensor.
Change NMD board.
E29 : Sequence done E29 HH:MM DDMMM sequ done >
sequ exec finished
Sequence finished is an event message. It records the correct termination of
an automated operation.
E30 : Sequence
aborted
E30 HH:MM DDMMM sequ aborted >
sequ exec aborted
Sequence either stopped by operator or error occurred during operation. In
case of an error the Error lamp will be on. Check next logbook line for more
information.
18596L/M Vial Tray
18596L/M Vial Tray
The following error messages may occur when the 100 sample tray is
connected to the autosampler.
E31 : Vial in claw E31 HH:MM DDMMM init failed >
vial in claw remove vial!
After turning on the autosampler or the reset command the 18596L/M
performs an initialization. The initialization fails when there is a bottle in the
claw. If the initialization fails the Error lamp is on and the message appears in
the logbook.
Remove vial from the claw and reset system.
Check bottle sensor.
E32 : Cannot remove
vial from device
cannot remove vial from device
The 18596L/M sample arm tried to take a vial out of its own tray or the 21
sample tray and failed.
Check claw position in teach tray mode.
E33 : Cannot insert
vial in device
cannot insert vial in device
The 18596L/M sample arm tried to place a vial either in the transfer position
of the 21 sample tray or the 100 sample tray and failed. Most common reason
is the presence of a vial in this position. It is also possible that the claw
position was not correctly set in the tray teach mode.
Remove vial from selected position.
Check claw position in teach tray mode.
18596L/M Vial Tray
E34 : Failed to home
axis
serious error in 100 vialtray
Error appears when the tray arm is not able to move to its selected position.
Reset autosampler.
Check cable connection.
Change MTD board.
Check tray arm.
E35 : Teach of 100 vial
tray done
E35 HH:MM DDMMM teach done >
teach of 100 vialtray done
Event message indicating use of the teach tray function.
E36 : Vial number for
unknown device
E35 HH:MM DDMMM teach done >
teach of 100 vialtray done
This error appears when an incorrect vial range has been set. Example: The
vial range was specified 1 to 30 for the 34 vial tray. When the 21 vial tray is
installed the autosampler will show error E36 when reading 22 or greater.
E38 : Barcode
verification failed
E38 HH:MM:DDMMM verified failed
barcode verification failed
The error can only be seen when the DOS workstation is connected to the
autosampler with 100 vial tray and barcode reader. The label from the vial
will be verified with the setting for the analyzed vial position. A mismatch
will generate the error message.
Check vial label and computer information for correctness.
Check/replace barcode reader and driver board.
E39 : Error state of 100
vial tray
E39 HH:MM:DDMMM injector aborted >
error state of 100 vial tray
The error appears when a previous error on the 100 vial tray is still present
(error LED blinking) and a new action for the 100 vial tray has been started.
15
15 Sampler: Maintenance
Information
service and maintenance of the 1050
Autosampler
Sampler: Maintenance Information
This chapter describes the procedures that have to be performed during
servicing and maintenance of the 1050 Autosampler.
You will find procedures for:
Sampling Unit
Metering Device
Analytical Head
Sensor Adjustments
Sampling Unit
Sampling Unit
NOTE Needle and needle seat changes can be performed without removing the
sampling unit. For stage 2 it is necessary that the needle is in the needle
change position.
Stage 1: Removing the Sampling Unit
Remove front door.
Remove the Sample Tray.
Remove the Inner Cabinet.
Remove the Leak Tub.
Disconnect the loop capillary either at the needle or at the switching valve.
Disconnect the seat capillary at the switching valve.
Disconnect all cables of the sampling unit from the motherboard.
Remove the holding screw of the sampling unit.
Slide the unit backwards and then to the right to remove it from its place.
Take out the sampling unit.
Sampling Unit
Stage 2: Removing the Needle
Move the needle in the needle change position (Control Configuration).
With the Pozidrive# 2 loosen the clamp screw.
Turn the needle with the ZDV fitting out of its recess and lift the needle to
get it out of the clamp screw.
Disconnect the needle from the ZDV fitting.
Needle with laser welded fitting: Disconnect the loop capillary from the
needle fitting
Figure 130 Needle Change
Sampling Unit
Stage 3: Installation of the Needle
NOTE If a new needle will be installed the needle seat should be changed too
otherwise leaks might be possible.
Needle with laser welded fitting: Connect the loop to the needle fitting and
tighten it.
Connect the new needle to the ZDV fitting and screw it hand tight.
Insert the needle into the groove behind the clamp plate and swing the ZDV
fitting back to the recess.
Tighten the connection at the ZDV fitting (only old version).
Tighten the clamp screw.
NOTE No further needle adjustment necessary. In case the needle is not straight
carefully bend the needle for proper alignment.
Stage 4: Removing the Seat Capillary
NOTE To avoid possible leaks, it is recommended to install a new needle seat when
the seat capillary will be changed.
Raise the needle (Control Test Functions).
With a wrench 5/16 unscrew the seat and remove it.
Remove the seat capillary from the socket.
Disconnect the seat capillary at the High Pressure Switching Valve.
Sampling Unit
Stage 5: Disassembling the Needle Arm
NOTE Follow the steps of this procedure when replacing either guide rod, spindle,
needle arm or drive nut.
Remove needle (make sure that the needle is in its change position or turn
the motor coupler to reach it) and interrupter sensor (only in case of
sensor or needle arm change readjustment necessary).
Loosen the set screw for the guide rod and remove it from the sampling
unit. It might be necessary to use a mallet and a punch pin to get the guide
rod out.
Remove the retainer on top of the spindle and save retainer and spring
disc.
Loosen the screw of the motor coupler which holds the spindle.
Move the needle arm up to move the spindle out of its ball bearing (some
force is required).
Remove the brass bearing sleeve from the top shaft of the spindle and
carefully take out the assembly.
Stage 6: Reassembling the Needle Arm
Insert the spindle into the top hole and then insert the small shaft into the
ball bearing.
Push the motor coupler as close as possible to the bearing and fix it in this
position.
Insert the guide rod and fix it with the set screw.
Insert the spindle bearing sleeve and the spring disc at the top of the unit
and mount the retainer.
Reinstall needle and interrupter sensor and perform required adjustments
(see Adjustment of Interrupter Sensor with test board on page 377).
Sampling Unit
Stage 7: Disassembling the Tray Mechanic
NOTE Follow this instructions when either changing Tray Motor, Gear, Belt, Tray
Coupler, toothed wheel or Quadrature Encoder, see Figure 131 on page 364.
Remove bottom cover of the sampling unit.
Remove the tray Motor.
NOTE The Tray Motor is fixed from the bottom. Loosening the four screws on top of
the motor will damage the tray motor.
Remove the belt
NOTE The belt roller will be pressed to the belt to stretch it. But the pretension of the
belt should not affect the smooth movement of the tray coupler.
Remove the black cap in the sample unit housing to get access to the two
set screws of the coupler toothed wheel.
Loosen the set screws and remove the coupler from the unit.
Carefully slide the toothed wheel out of its place, see Figure 131 on page
364.
NOTE The toothed wheel is coupled with the encoder slit wheel which is running in
the quadrature encoder. Take care not to damage the slit wheel while lifting
the assembly.
Disconnect the cable of the encoder unscrew it and take it out.
NOTE The encoder cable is not keyed. Make sure that position 1 of the cable is
connected to position 1 of the encode, see Figure 131 on page 364. If the cable
is positioned in the wrong direction the system cannot initialize the tray. The
behavior is like with a defective home sensor.
Sampling Unit
Figure 131 Bottom View of the Sampling Unit
Metering Device
Metering Device
NOTE Move the plunger into the plunger change position before removing the
metering device from the instrument.
Removing the Metering Device
Remove Top Cover.
Disconnect the two capillaries to the head of the Metering Device.
Disconnect motor and sensor cable.
Remove the transport securing screw.
Remove the screw which fixes the Metering Device on the High Pressure
Switching Valve.
Take out the Metering Device.
Removing the Gear Belt
Remove the cover of the gear box.
Remove the stepper motor.
Take out the gear belt.
Metering Device
There are two different versions of the analytical head available. In the latest
version the spring is integrated in the adapter housing. The following table
shows the serial number prefix at introduction of the new adapter housing
design.
NOTE Follow this instruction when either changing Plunger Seal or Plunger. Do not
forget to use the plunger change position in the control section before
removing the analytical head assembly. The numbers in brackets refer to
Figure 132 on page 367.
Procedure 1: Analytical Head Assembly with old Adapter
Housing
Stage 1: Disassembling the Analytical Head Assembly
Unscrew the Analytical Head Assembly and remove it from the Metering
Drive.
Place the Assembly on its round head (13) and remove the two screws
(14).
Carefully pull the head (13) to separate it from the body (9).
NOTE Do not twist the head while pulling. This could break the plunger.
Table 88 New Analytical Head Assembly
Autosampler SN Prefix Version
79855A/B 3404 G ..... new; Procedure2
79855A/B 3406 A ..... new; Procedure 2
Metering Device
Stage 2: Changing the Seal
Remove the seal keeper (11) from the head (13).
Using the three millimeter hexagonal key remove the seal (12).
Clean the head chamber (13) from all seal particles. Best is to use a
degreaser spray (for example 8500-0232).
Insert a new seal (12).
Stage 3: Disassembling the Body
Remove the support ring (10) or the support seal assembly.
Hold the body down on a flat surface loosen the setscrew (15) and
carefully release the tension of the spring.
WARNI NG The spring will catapult the body up if released without holding it.
Figure 132 Analytical Pump Head Assembly (old)
Metering Device
Stage 4: Reassembling the Analytical Head Assembly
Place sapphire plunger (7) and spring (8) into the spring support (6).
Place the adapter (9) on a flat surface and insert the parts from the
previous step.
Hold the adapter (9) from one side with the thumb and press the spring
support (9) with plunger and spring with the fingers into the body.
Hold the spring support (6) with one hand in place and fix the setscrew.
Slide the support ring (10) or the support seal assembly onto the plunger.
NOTE If the support ring (10) or the support seal assembly sticks at the body when
sliding down the plunger push the plunger (7) slightly from the bottom. This
will center the plunger and the ring keeper slides into its position.
Place the seal keeper (11) on the seal (12) of the head.
NOTE In this position the seal keeper guides the plunger into the seal and reduces
the possibility to break the plunger.
Carefully place the head (13) onto the adapter (9).
Turn the assembly upside-down insert the screws (14) and fix them
stepwise with increased torque.
NOTE It is important that the surface of head and adapter are parallel to each other
to obtain a good seal.
Metering Device
Procedure 2: Analytical Head with new Adapter Housing
Stage 1: Disassembling the Analytical Head Assembly
Unscrew the Analytical Head Assembly and remove it from the Metering
Drive.
Place the Assembly on its round head (6) and remove the two screws (2).
Pull the adapter (3) straight up from the head (6) being careful not to put
any sidewards strain on the sapphire piston (1), since it could shear and
break.
Put the adapter housing (3) aside taking care to avoid dropping the piston
(1) from the housing.
NOTE The piston is not secured in the adapter housing and will fall out when the
housing is turned upside down.
Remove the piston (1) from the adapter (3).
Check for scratches and dirt on the piston.
NOTE Dirt on the piston surface can be removed by using a small quantity of
toothpaste.
Stage 2: Changing the Seal
Remove the support seal assembly 4) from the head (6).
Using the three millimeter hexagonal key remove the seal (5).
Clean the head chamber (6) from all seal particles. Best is to use a
degreaser spray.
Insert a new seal (5).
Place the support seal assembly (4) onto the seal (5).
Metering Device
Figure 133 Analytical Pump Head Assembly (new)
Stage 3: Reassembling the Analytical Head Assembly
Prepare the head (6) as described beforehand.
Place the adapter housing (3) without the piston (1) onto the head (6).
Insert the two screws (2) and tighten until hand tight.
NOTE Tightening the screws fully will require much more force to push the piston
into its position in the seal.
Insert the piston (1) into the adapter housing (3) and carefully push it into
the seal.
Tighten the two screws (2) stepwise with increasing torque. Make sure
that head and adapter surfaces are in parallel.
Metering Device
Reassembling the Metering Device
Put the Analytical Head Assembly onto the metering drive and insert the
two screws.
NOTE The Head Assembly should be installed like shown in Figure 132 on page 367
or Figure 133 on page 370. The capillary from the high pressure switching
valve is connected to the bottom of the head assembly.
Tight the screws stepwise with increasing torque.
Stage 1: Removing
Disconnect the air supply at the rear of the module.
Remove front door and inner cabinet.
Remove the leak tub.
Remove the metering device.
Disconnect all capillaries from the valve.
Unscrew the holding screw at the base.
Slide the unit out of its holder.
Disconnect the air tubings.
Take out the High Pressure Switching Unit.
Stage 2: Disassembling
Loosen and remove the three socket head stator screws (4).
Remove the stator (2) from the top of the valve.
Remove the stator ring from the valve. Take special care not to lose the
stop pins in the stator ring.
Using the blade of a screwdriver, release the rotor seal from the valve.
Adjust the Sensors
Adjust the Sensors
Adjusting of the sensors inside the instrument is very difficult. For that
reason the extender test board (see chapter Electronics) has been designed.
It allows to operate the assemblies outside of the instrument with easy
access to the sensors.
The firmware of the autosampler itself includes a service level which allows
to verify the sensor positions and to perform the sensor adjustment.
This section describes:
Service Only Level
Sensor adjustment Sampling Unit
Sensor adjustment Metering Device
Sensor adjustment High Pressure Switching Valve
Service Only Level
The service only will be accessed with a password to avoid accidental
changes of parameters.
NOTE Do not enter or change any numbers in this part which are not described in the
following sections. Accidental change of system parameters could damage the
instrument.
Entering Service Only
Press CTRL and with NEXT move the cursor to the < end of list >.
Enter password (79855) and SERVICE ONLY will be displayed.
With PREV or NEXT the following displays are accessible.
EXECUTE STEP 1
INSTR# 1 VAL 1 ; 0
Read the notes on next page first.
Adjust the Sensors
NOTE EXECUTE STEP allows the performance of the step commands (Test
Functions) by entering the step number.
#1 Switch Valve Unit to bypass.
#2 Initialize Metering Device.
#3 Raise needle.
#4 Move vial underneath needle.
#5 Lower needle.
#6 Draw sample up from sample vial.
#7 Raise needle.
#8 Move vial to home position.
#9 Lower needle.
#10 Switch Valve Unit to flow through sample loop.
INSTR# allows to read the position of the various sensors and can be used for
adjustment of sensors. An negative number (for example -2) writes the actual
value into the processor memory for adjustment calculations. For more
information see chapter sensor adjustment.
#1 Reads the position of the shaft encoder.
for example INSTR# 1 VAL 1 ; 0
#2 Reads the left stop of the sample tray.
for example INSTR# 2 VAL -56 ; -56
#3 Reads the right stop of the sample tray.
#4 Calculate correction value for measurement performed under #2 and #3.
The result is shown in m.
#5 Reads the data which represents the actual sensor status for the complete
sampling unit (interrupter home and bottle sensor).
for example INSTR# 5 VAL 227 ; 227 after initialization. Depending on
the sensor which is activated or not the value changes in increments of 1, 4, 8.
8 for the sample tray
4 for the bottle in place sensor
1 for interrupter sensor.
Adjust the Sensors
NOTE #6 Reads the data which represents the actual sensor status for the metering
home sensor and the valve position sensor. Readings can be used for sensor
adjustment or troubleshooting.
for example INSTR# 6 VAL 240 ; 240 after initialization. Depending on
the sensor which is activated or not the value changes in increments of 1 or 8.
8 for the metering device home sensor.
1 for the valve position sensor.
Sensors of the Sampling Unit
NOTE Four sensors are controlling the various functions of the sampling unit.
NOTE Interrupter Sensor:
Initializes a signal to stop the needle motor at upper and lower limit. The
adjustment ensures a defined force for the needle into the seat and determines
the position of the needle in the sample vial during the injection cycle.
Home Sensor:
Determines the home position of the sample tray. The processor counts the
selected vial number relative to the home position. Adjustment ensures that
the needle hits the septa of the sample vial in each vial position.
Bottle in Place Sensor
Checks for presence of a vial during the injection cycle. No adjustment
required.
Quadrature Decoder
Checks the actual position of the 21 sample tray for adjustment of the 21 vial
tray. If the 34 vial tray is installed the more precise procedure should be
selected. No adjustment required.
The home sensor will be adjusted with the build in service level test features.
For the interrupter sensor there are two adjustment procedures available.
Adjustment can be done via the extender test board which is the easiest way
because of the accessibility of the sensor. If the test board is not available the
features of the service level also allow adjustment of the sensor.
Adjust the Sensors
Adjustment of Interrupter Sensor with test board
With the test functions commands move the needle into upper position.
By turning the motor coupler move the needle arm downwards until the
interrupter pin just touches the upper plate.
Now move the needle arm upwards 1 mm.
NOTE One revolution of the spindle moves the needle arm 1.5 mm up. Therefore 240
represent 1 mm.
Position the sensor that the LED on the extender board just changes its
state from on to off (should remain off) and fix it in this position.
Adjustment of Interrupter Sensor via Service Only Level
Follow steps 1 to 3 of the previous described procedure.
Enter SERVICE ONLY level.
Move to the Instr# and enter #5 to get the following display.
INSTR# 5 VAL 239 ; 239 (without sample tray)
Position the interrupter sensor that the value just changes to 238. Move it
back until you reach 239 and fix it in this position.
Adjustment of Home Sensor - procedure for 21/34 vial tray
NOTE During RESET of the autosampler the processor finds the home position of
the sample tray and stores the actual dehydrator encoder reading as zero
position.
The position of vial #1 is used as reference for the adjustment. With
INSTR# 1 the processor reads the steps from the home position to the actual
position. If the tray is aligned correctly the encoder should read the following
values for the position of vial #1:
21 vial tray: VAL 0;-200 tolerance 1
34 vial tray: VAL 0;-191 tolerance 1
The above values can be obtained from the SERVICE ONLY level.
Adjust the Sensors
Adjustment Procedure
Remove door, inner cabinet and the top cover from the autosampler.
Make sure that the tray is installed correctly and that the vial is in position
#1.
Using the CTRL functions of the instrument RESET the autosampler.
Enter the TEST FUNCTIONS.
Use single steps 3 to raise the needle.
In the display SINGLE STEP 4 POS. TRAY AT 10 change the vial
position to 1 (use > ) and press 1 ENTER. They tray moves to position #1.
The needle should point to the center of the vial. If not, turn the tray
manually until the position is correct.
*Enter the service only level and select the following display
INSTR# 1 VAL 0; -XXX.
NOTE XXX is the value for the actual position of the tray. If the home sensor is
adjusted correctly, the value should be -191 1 for the 34 vial tray or -200 1
for the 21 vial tray. If XXX differs from the above values the sensor has to be
adjusted.
6 counts represent approximately 1mm.
Remove the tray, loosen the sensor screws and move the sensor
Towards the front of the autosampler (ccw) when the actual values of
XXX are larger then the nominal (for example -199 for 34 vial tray; or
-205 for 21 vial tray).
Towards the back of the autosampler (cw) when the actual value of XXX
is smaller then the nominal (for example -185 for 34 vial tray; or -195 for
the 21 vial tray).
Verify the correct position. Insert the tray, RESET the injector and repeat
step 4 to 8 of this procedure.
Adjust the Sensors
Sensor of the High Pressure Switching Valve
The sensor at the back side of the high pressure switching valve controls the
correct movement of the valve.
Take the high pressure unit out of the instrument and make connection to
the extender test board for operation outside of the instrument.
Make sure that the valve is in one of its end positions.
Connect the sensor to the holding arm and move it until the LED on the test
board becomes on. Then move it downwards until the LED just turns off
and fix the board in this position.
* Verify the proper operation of the high pressure switching valve.
Adjustment of Valve Sensor via Service Only
Follow step 1 to 2.
Enter SERVICE ONLY level and move to the Instr# and enter #6 to get the
following display.
INSTR# 6 VAL 248 ; 248 (metering device in home position).
Position the sensor that the display value just changes to 249. Move the
sensor back until the value changes back to 248 and fix it in this position.
Verify proper operation of the switching valve.
Adjust the Sensors
Metering Device Home Sensor
The metering drive home sensor determines the maximum allowed front
position of the plunger. A lever mounted to an spindle mechanism moves into
the light switch to stop the motor. Adjustment is necessary that the plunger
can not run into the mechanical stop of the analytical head and to be
compatible with future options.
The adjustment for the metering home sensor is not critical. Therefore a
rough alignment without firmware support is sufficient.
The sensor housing has a slot for the adjustment. Mount the sensor into a
middle position of the sensor housing.
Use the test functions to move the piston to home position. The plunger
should stop before the mechanical stop. If the plunger moves into the stop
adjust the sensor slightly back and try again.
16
16 Sampler: Parts Information
1050 Autosampler
Sampler: Parts Information
This chapter gives diagrams for parts identification and the complete parts
listings respectively for the 1050 (Ti) Autosampler.
Electronic Boards
Ti - Parts
Overall Diagram
Solvent Flow Path
Sampling Unit
Metering Drive and Analytical Head
Pneumatic Valve Assembly
Electronic Boards and Fuses
Electronic Boards and Fuses
Electronic Boards
Fuses
Item Description Part Number Exchange
1 Power Supply Board DPS-B 5061-3374 01050-69374
2 Maxi Tray Drive Board for 18596A/L MTD 01078-66503 01078-69503
3 Maxi Tray Drive Board for 18596B/M MTD 01078-66513 01078-69513
4 Rotor Reader Drive Board RRC 01078-66507
5 Valve Metering Drive Board VMD 01078-66501 01078-69501
6 Firmware Board FIM 01078-66506
7 Needle Mini Tray Drive Board NMD 01078-66502 01078-69502
8 Communication Interface Board CIB 5061-3382 01050-69582
9 Common Main Processor Board CMP 50613380 01050-69580
10 Fluorescent Indicator Module FIP 5061-3376
11 Motherboard ALM 01078-66504
Table 90 Fuses
Description Board Part Number
Fuse F12, 250 mA VMD 2110-0004
Fuse: ICP1 1 A FIP 2110-0099
Following is a complete list of all special Ti parts. For the assemblies and
accessories kits only the Ti parts are mentioned.
Table 91 Complete List of Ti-Parts
Description Part Number Description Part Number
Ti - Needle 01079-67201 High Pressure Switching Valve
Exchange
01079-60004
01079-69004
Ti - ZDV Fitting 5021-1871 Ti - Rotor Seal TEFZEL pH 12.5 0101-0627
Ti - Loop Capillary 100 l
ID 0.5 1.08 m lg
01079-87302 Ti - Pump Capillary ID 0.25 70 cm lg 01079-87306
Ti - Valve Metering Capillary
ID 0.25 140 mm lg
01079-87301 Ti - Sampling Unit 01079-60001
Ti - Seat Capillary
ID 0.17 180 mm lg
01079-87303 Ti - Needle Seat (Peek) 01079-67101
Ti - Capillary 500 l Volume
ID 0.5 2.8 m lg
01079-87307
Ti - Capillary 2 ml Volume
ID 0.94 2.8 m lg
01079-87308
Ti - Flush Union 01079-23203 Analytical Head Assembly, includes 01079-60003
Ti - Column Capillary ID 0.17 70 cm lg 01079-87305 Ti- Piston Seal 0905-1199
Ti - Head Body 01079-27710
Overall Diagram 79855A/B
1 Foot Support 01078-21001 21 Flexible Tubing (12ft) 5021-7127
2 100 Sample Tray 18596L/M 22 Press Switching Cable 01078-61601
3 Tray Support Assembly 01078-64701 23 Nut M4 0535-0056
4 Screw M3.5 6 mm lg 0515-0889 24 Pneumatic Assembly 01078-66101
5 Cover Hinge 01078-44112 25 Screw M4 35 mm lg 0515-1666
6 Screw M3.5 6 mm lg 0515-0889 26 Name Plate 5041-2170
7 Fan Holder 01078-02302 27 Logo Base 5041-2144
8 Fan Assembly 3160-0862 28 Front Panel 01078-60301
Fan Upgrade Kit (for ALS without
fan)
01078-68720 29 Inner Cabinet 01078-64401
9 Screw M4 20 mm lg (special) 0515-1918 30 Screw M3.5 8 mm lg 5021-1862
10 Sheet Metal Kit 01078-68701 31 Power Switch Base 5041-2145
11 Screw M3.5 6 mm lg 0515-0889 32 Leak Assembly, includes 33, 34,
35
5062-8551
12 Bumper 0403-0427 36 Sample Tray 01078-44501
13 Foot Front 5041-2161 37 Sample Tray 34 vials 01078-44511
14 Push bottom, white 5041-1203 38 Sampling Unit 01078-60001
15 Actuator 5041-2162 39 Screw M3.5 6 mm lg 0515-0887
16 Spring Compression 1460-1510 40 Flexible Tubing (12ft) 5021-7127
17 Front Plate 5001-3725 41 Connector 0100-1175
18 Leak Sensor 5061-3356 42 Muffler 0100-1176
19 Screw M3 10 mm lg 0515-1105 43 Adapter 79846-23202
20 Leak Tub 01078-44502 44 Connector, long 0100-1047
45 Valve Metering Capillary
ID 0.25 140 mm lg
01078-87301 59 Screw M4 6 mm lg 0515-0898
46 Top Cover 01078-04110 60 Analytical Head Assembly 01078-60003
47 Loop Capillary 100 l
ID 0.5 1.08 m lg
01078-87302 61 Metering Drive 01078-60002
48 DPS-B 5061-3374 62 Cable; FIP to ALM 5061-3400
49 Plate Cover P/S 5001-3728 63 HPS Valve
Exchange
01078-60004
01078-69004
50 MTD Board (18596A/L)
Exchange
01078-66503
01078-69503
64 Valve Waste Capillary
ID 0.5 130 mm lg
01078-87304
50 MTD Board (18596B/M)
Exchange
01078-66513
01078-69513
65 Screw M4 6 mm lg 0515-1963
51 Cover large (3 inch) 01078-04115 66 Screw M5 6 mm lg 0515-1117
52 FIM Board 01078-66506 67 Valve Base Plate part of (10)
53 Screw M3 6 mm lg 0515-0912 68 Valve Holder Plate 01078-02310
54 VMD Board
Exchange
01078-66501
01078-69501
69 Card Cage part of (10)
55 NMD Board
Exchange
01078-66502
01078-69502
70 Keyboard Module 01078-60201
56 Cover small (1.3 inch) 5001-3721 71 Fluorescent Interface 5061-3376
57 CMP Board
Exchange
5061-3380
01050-69580
72 ALM 01078-66504
58 Screw M5 10 mm lg 0515-1117
Hydraulic Flow Path
Hydraulic Flow Path
Table 93 Hydraulic Flow Path Autosampler
Item Description Part Nmber Item Description Part Nmber
1 Pump Capillary ID 0.25 70 cm lg 01078-87306 6 Multi Draw Kit, includes 01078-68704
1 Ti - Pump Capillary
ID 0.25 70 cm lg
01079-87306 500 l Volume
ID 0.5 2.8 m lg
01078-87307
2 Valve Metering Capillary
ID 0.25 140 mm lg
01078-87301 2 ml Volume
ID 0.94 3.1 m lg
01078-87308
2 Ti - Valve Metering Capillary
ID 0.25 140 mm lg
01079-87301 Flush Union 79846-23203
3 Loop Capillary 100 l
ID 0.5 1.08 m lg
01078-87302 6 Ti - Multi Draw Kit, incudes 01079-68704
3 Ti - Loop Capillary 100 l
ID 0.5 1.08 m lg
01079-87302 Ti - Capillary 500 l Volume
ID 0.5 2.8 m lg
01079-87307
4 ZDV Fitting 0100-0900 Ti - Capillary 2 ml Volume
ID 0.94 2.8 m lg
01079-87308
4 Ti - ZDV Fitting 5021-1871 Ti - Flush Union 01079-23203
5 Needle (fitting laser welded) 01078-67200
5 Ti - Needle 01079-67201 7 Column Capillary
ID 0.17 80 cm lg
01078-87305
5 Needle Grooved 01078-67202 7 Ti - Column Capillary
ID 0.17 70 cm lg
01079-87305
6 Seat Capillary
ID 0.17 180 mm lg
01078-87303 8 Valve Waste Capillary
ID 0.5 130 mm lg
01078-87304
6 Ti - Seat Capillary
ID 0.17 180 mm lg
01079-87303
Hydraulic Flow Path
Figure 137 Solvent Flow Path
Sampling Unit
Sampling Unit
Table 94 Sampling Unit
Complete Assembly 01078-60001 18 Lubrication Ring 5001-3749
Complete Ti - Assembly 01079-60001 19 Coupler Assembly 01078-63201
1 Tray Motor Assembly 01078-64702 20 Plug Hole 6960-0076
2 Screw M3 12 mm lg 0515-1110 21 Motor Coupler 1500-0796
3 Washer 3050-0890 22 Set Screw M5 10 mm lg 0515-1741
4 Screw M2.5 6 mm lg 0515-0894 23 Belt 1500-0698
5 BOS Board 01078-66505 24 Belt Roller 01078-22501
6 Screw M3.5 6 mm lg (older
version)
0515-0887 25 Bearing Sleeve 1410-1253
6 Screw M3.0 6 mm lg 0515-0886 26 Washer 3050-0891
7 Washer 3050-0892 27 Screw M3 25 mm lg 0515-1060
8 Cable Clamp 1400-0082 28 Needle Seat 79846-67101
9 Retaining Ring 0510-1310 28 Ti - Needle Seat (Peek) 01079-67101
10 Washer Spring 3050-1299 29 Seat Capillary
ID 0.17 180 mm lg
01078-87303
11 Bearing Sleeve 1410-1261 29 Ti - Seat Capillary
ID 0.17 180 mm lg
01079-87303
12 Sampler Body no PN 30 Socket 01078-25201
13 Screw M2.5 6 mm lg 0515-0894 31 Shock Mount 1520-0260
14 Washer 3050-0890 32 Screw M3 6 mm lg 0515-0886
15 Home Sensor 5180-0861 33 Spindle Motor Assembly 01078-64703
16 Traction Relief 5001-3752 34 Spring 1460-2365
17 Tray Coupler 01078-43201 35 Needle Arm Assembly 01078-60000
Sampling Unit
36 Washer 3050-0890 43 Ti - ZDV-Fitting 5021-1871
37 Screw M2.5 6 mm lg 0515-0894 44 Needle (fitting laser welded) 01078-67200
38 Interrupter Sensor 5041-2142 45 Connector Cable 01078-61602
39 Cable Clamp 1400-0082 46 Traction Relief 5001-3752
40 Washer 3050-0892 47 Quadrature Encoder 1990-1265
41 Screw M3.5 6 mm lg (old version) 0515-0887 48 Screw M2.5 25 mm lg 0515-1640
41 Screw M3.0 6 mm lg 0515-0886 49 Screw M3.5 6 mm lg
(older version)
0515-0887
42 Needle (old design) 49 Screw M3.0 6 mm lg 0515-0886
42 Ti - Needle 01079-67201 50 Gear Cover 01078-04101
43 ZDV-Fitting 0100-0900 51 Bumper Foott 0403-0282
Table 94 Sampling Unit
Sampling Unit
Figure 138 Sampling Unit I
Sampling Unit
Figure 139 Sampling Unit II
Sampling Unit
Arm Assembly Spare Parts
Figure 140 Arm Assembly Spare Parts
Table 95 Arm Assembly Spare Parts
Arm Spare Part Kit 01078-68706 3 Bottle Vane no PN
1 Bottle Vane Screw no PN 4 Clamp Plate no PN
2 Screw M3.5 10 mm lg no PN
Metering Drive
Analytical Head (Old Version)
Table 96 Metering Drive
Metering Drive Assembly 01078-60002 3 Interrupter Sensor 5041-2142
1 Metering Motor no PN 4 Screw M2.5 6 mm lg 0515-0894
2 Belt 1500-0697 5 Washer 3050-0890
Table 97 Analytical Head (old version)
Analytical Head Assembly 01078-60003 11 Seal Keeper order (10a)
Ti - Analytical Head Assembly 01079-60003 12 Seal (2/pk) 5062-8516
6 Spring Support no PN 12 Ti-Seal 0905-1199
7 Sapphire Plunger 5063-6586 13 Head Body 01078-27710
8 Spring 1460-2220 13 Ti - Head Body 01079-27710
9 Adapter see new
version
14 Screw M4 40 mm lg 0515-0850
10 Support Ring order (10a) 15 Set Screw M3 5 mm lg 0515-1039
10a Support Seal Assembly 5001-3739 16 Screw M5 60 mm lg 0515-2118
Figure 141 Metering Drive and Analytical Head (old version)
Analytical Head (New Version)
Figure 142 Analytical Head (new version)
Table 98 Analytical Head (new version)
Analytical Head Assembly 01078-60003 5 Seal (2/pk) 5062-8516
Ti - Analytical Head Assembly 01079-60003 5 Ti-Seal 0905-1199
1 Sapphire Plunger 5063-6586 6 Head Body 01078-27710
2 Screw M4 40 mm lg 0515-0850 6 Ti - Head Body 01079-27710
3 Adapter with spring 01078-23202 7 Screw M5 60 mm lg 0515-2118
4 Support Seal Assembly 5001-3739
Table 99 High Pressure Switching Valve
Assembly
01078-60004 7 Valve Sensor Board 79846-66504
Exchange Assembly excluding
items 11 to 17
01078-69004 8 Bracket Actuator 79846-01206
Ti - New Assembly 01079-60004 9 Screw M5 6 mm lg 0515-1510
Exchange Assembly excluding
items 11 to 17
01079-69004 10 Elbow Fitting 0100-1408
1 Rotor Seal VESPEL 0101-0626 11 Valve Waste Capillary
ID 0.5 130 mm lg
01078-87304
Ti - Rotor Seal TEFZEL pH 12.5 0101-0627 12 Valve Holder Plate 01078-02310
2 Stator 1535-4044 13 Valve Base Plate part of
01078-68701
3 Isolation Seal 1535-4046 14 Screw M5 6 mm lg 0515-1510
4 Stator Screw 1535-4857 15 Screw M4 6 mm lg (flat head) 0515-1963
5 Stator Set Screw no PN 16 Screw M3.5 8 mm lg 0515-1105
6 Bearing Ring 1535-4045 17 Screw M2.5 6 mm lg 0515-0894
Figure 144 Pneumatic Valve Assembly
Table 100 Pneumatic Assembly
Complete Assembly excluding
items 5, 6 and 7
01078-66101 4 Elbow Fitting 0100-1408
1 Solenoid Valve 0101-0559 5 Screw M4 35 mm lg 0515-1666
2 Low Air Pressure Switch 1/8 3107-0019 6 Nut M4 0535-0056
3 Push-in Fitting Male 0100-1410 7 Pressure Switch Cable 01078-61601
17
17 Sampler: Additional Information
Sampler: Additional Information
This section gives the following informations:
Autosampler Prefix History
Autosampler Firmware History
Update to Firmware Revision 4.0
Adding the 100 vial tray
Intermittant E17
Update the autosampler with a fan
Product History
Product History
Since introduction of the 1050 Autosampler in 1988 a couple of hardware and
firmware changes have been implemented into the production. With most of
this changes the serial number prefix has been changed too. Following is a
list of all prefix changes done in Waldbronn and Little Falls.
Table 101 Product History 79855A/B
S/N Prefix Changes
2813 G ... 28XX A ... Introduction of the 1050 Autosampler
2848 G ... 2902 A ... Introduction of firmware revision 2.0
2944 G ... 2950 A ... #024 (add 100 vial capacity) for support of 18596B/M tray
3020 G ... 30XX A ... Fan Assembly added to the autosampler
3031 G ... 30XX A ... Introduction of 1050 Ti Autosampler
3130 G ... 3130 A ... Support Ring for Analytical Head with Ceramic Insert
3313 G ... 3315 A ... New Revision of High Pressure Switching Valve
3313 G 02712 or 3315 A 02247 Modification of ALM board to increase fan voltage
3334 G ... Introduction of support seal assembly
3338 G ... Introduction of firmware rev. 4.2
3404 G ... 3406 A ... Analytical Head - Spring integrated in the adapter
May 1995 Needle with integrated Fitting
October 1998 Adapter (Analytical Head) with new spring
3442 G ... 3443 A ... Sampling Unit - ZDV Fitting Laser welded to the Needle
Firmware Revisions
Firmware Revisions
Firmware Revision 1.0
Rev 1.0 was the firmware at introduction of the 79855A Autosampler.
Known Problem: Time table execution
Problem is in the timetable execution, if there is more then one entry in the
timetable. Manually stop of the run (before elapsing the stoptime) may lead
to wrong behavior of the relay contacts in the next run.
Workaround/Solution
1 To stop a run manually reduce the stoptime to a value lower then the
actual run time.
2 Other 1050 modules do not show this problem and can be used as an
alternative to control the relay contacts.
Firmware revision 2.0 incorporates:
Support of 18596A/L sample tray.
Configuration of BCD output (either 2 digit BCD or 8 bit binary coded)
Draw Offset Position for the needle.
Fix of revision 1.0 bug.
Europe/ICON 2848 G .....
US/Canada 2902 A .....
Firmware Revisions
Support of 18596B/M sample tray (Killer Bee).
NOTE The 18596B/M sample tray is not compatible to the 18596A/L tray. It does
requires a change in firmware and hardware (MTD board). Nevertheless
firmware revision 2.1 support both versions of the tray.
Known Problem: Intermittant BUS ADDRESS ERRORS
Intermittant BUS ADDRESS ERRORS or similar lock ups of the autosampler
may occur when the 100 vial tray is connected.
A firmware bug in combination with a weak air supply genereates the
problem. During the injection cycle a underpressure condition may be
detected. This condition might be misinterpreted and then leads to the error.
Firmware Revisions
Communication with the HPIB communication interfaces.
Support of the Roto Reader of the 18596A/B tray.
Support of the 34 vial tray in the autosampler.
Introduces the AUTO-ON feature.
Known Problems
Serious Problem with 21 vial tray.
If the 21 vial tray is not in home position at the begin of an injection, the
tray will be recognized as 34 vial tray and positioned accordingly. Damage
of the needle can be the result.
Any time the 21 vial tray has been moved or replaced, perform a RESET
INJECTOR prior to starting an injection.
Reset during injection Break.
If the injection cycle is interrupted (injection break-stop during injection)
and followed by a RESET INJECTOR hardware crashes may appear. It
was observed that either the syringe piston was forced into the
mechanical stop or the tray was moved against the needle arm. Swtching
off and on the autosampler will cure the problem.
Do not use the RESET INJECTOR during injection break.
Teach Mode
If one of the possible teach modes (tray or bar code reader) is done
without a vial in position 101 the autosampler is forced into an error
mode. The error LED is blinking and the display shows the value 3000.
ESCAPE and RESET INJECTOR brings the autosampler back into the
normal operation mode.
Firmware Revisions
The final tests for the DOS workstation revealed some firmware bugs in the
autosampler firmware. Revision 3.1 fixes these communication bugs.
Known Problems
Problems with Relay Contact 2.
Relay Contact 2 generates a double pulse each time it is turned on or off.
Intermittant E26, E32, E33 or E34: 100 vial tray arm moves two vials into
position #16 of the 21 vial tray.
A firmware bug in the synchronization between the autosampler and the
100 vial tray generates the problem. The firmware expects that the
metering syringe is already in home position before the 100 vial tray
places its vial into the 21 vial tray. With large injection volumes (for
example100 l) and lower eject speed (for example <200 l) the
initialization of the syringe takes longer then the movement of the tray
arm.
Set the EJECT SPEED to at least 300 when using larger injection volumes.
Firmware Revisions
Support of Injector Program.
Introduction of additional displays.
Changes in tray movement.
Addition of error messages.
Fixes of known bugs.
NOTE Autosamplers with serial number prefix below 3117 G ..... and 3121 A ..... need
a modification of the NMD board when updated to revision 4.0. A capacitor
(100 pF part number 0160-4801) has to be soldered between pin 5 and 7 of U26
on the NMD board.
Known Problems
Incorrect BCD output for vials in 100 vial tray.
When working from the 100 vial tray the transfer position is always used
as output for the BCD output. Therefore the bottle number displayed on
the integrator is always 16 for BCD, or 10 for BIN, if the bottle number is
transfered via a BCD cable. PHOENIX and LC APPAC do not show the
problem.
Using the injector program feature allows a work around for the problem.
{{ 10 DRAW def l from SMPL SPEED def l/min OFFSET def mm}}
{{ 20 UTILITY OUTPUT SMPL }}
Intermittant hang-up of a sequence that uses overlap and return mode for
the 100 vial tray.
Adjustment of the sampling unit home (hall) sensor via the service only is
not possible. INSTR# 4 gives incorrect values.
Firmware Revisions
Revision 4.1 incooperates:
Fix of the three known bugs of revision 4.0
The default transfer position is redifined (better position).
The utility tray move command of the injector program allows to use the
sample vial option now.
The wait after a post time represents a seperate event (for future
workstation only).
Keep/Return configuration changes during the injection are possible now.
The following two bugs in the revison 4.1 firmware have been fixed with
revision 4.2.
The LC ChemStation could not access all Injector Program features. The
bar code reader did not function in this mode.
Autosampler with 100 vial tray in KEEP mode show a malfunction when a
injection >1 is interrupted (STOP during the injection cycle) and then
aborted. The inject LED remains on and a new START command will result
in a "Not Ready Wait 0.00" display and no injection will take place.
Firmware Revisions
If you update the firmware to revision 4.0 and greater
Firmware revision 4.0 requires a modification of the NMD board otherwise
incorrect positioning of the 21/34 vial tray may appear.
The new firmware revealed an already existing problem of the NMD board.
Noise on a signal line which is used more often then in previous firmware
versions might lead to incorrect data words for the 21/34 vial tray.
A 100 pF capacitor (part number 0160-4801) soldered between pin 5 and 7 of
U26 on the NMD board cures the problem. All autosampler with serial
number prefix 3117 G ... and 3121 A ... do have the capacitor already installed.
If you add a 100 vial tray to the autosampler
The update for the additional 100 vial tray comprises an option or upgrade kit
for the autosampler, which consists of bracket, electronic controler board
and firmware (if required) and the unmodified GC tray 18596.
Currently there are two 100 vial trays in the field, the 18596A and the
HP 18596B. Looking the same from the outside they differ and are not
compatible. Different electronic boards (MTD) are neccessary to control the
two trays. The basic difference is the controller firmware on the MTD board.
Table 102 Compatibility Table
18596A/L 18596B/M
Firmware 2.0 or higher 2.1 or higher
SN Prefix 2848 G / 2902A 2944 G / 2950 A
MTD Board 01078-66503 / -69503 01078-66513 / -69513
MTD firmware (U33) 18594-80295
Firmware Revisions
If you have Intermittant E17: Needle cannot move out of
vial
Variations in the size of the vial ground might be the source of the problem. If
the needle touches the ground during the injection cycle the error might
appear.
If the down movement of the needle is stopped by the vial ground it may
happen that the interrupter sensor gets activated. This indicates that the
needle is in the home position (seat). The up movement of the needle is
prohibited when the interrupter sensor is activated and results in the error
message.
Using the draw offset command for the needle will solve the problem.
All firmware revisions 3.1 and below may show this problem. Revision 4.0
and greater do not show the problem because of the changes done for the
injector program.
If you have to update the autosampler with a fan
In August 1990 a fan was added to the autosampler (see also Product
History on page 405). It cools down the electronic boards and prevents an
increase of the electronical failure rate when the card cage is equipped with
one or more additional option boards (for example MTD board, RRC board
or CIB board).
All autosampler equipped with the 100 vial tray (MTD RRC) or/and the HPIB
board (CIB) should be updated with the fan.
The fan upgrade kit 01078-68720 allows to retrofit autosampler without fan.
If the fan in the autosampler does not work properly
There is a possible problem with the fan in the 1050 Autosampler. It has been
realized that the fan does not start in all cases when the autosampler is
switched on. Measurements showed that the voltage at the fan can drop
below the needed +12V during the turn on cycle of the fan. Depending on the
quality of the fan (batch related) it will not start in any case.
All autosampler with serial number prefix 3313 G 02712 or 3315 A 02247 have
the voltage for the fan increased by changing R1 on the motherboard (ALM)
from 100 Ohm 2 Watt to 33.2 Ohm 0.5 Watt (0757-0995).
NOTE The noise of the fan will be slightly increased by this modification.
Firmware Revisions
Update of existing Autosampler
Check wether the fan of the autosampler is running or not. Make also sure
that the fan will start at turn on of the module. If not, replace R1 on the
motherboard with the 33.2 Ohm resistor.
Identify R1 which is located next to the connector J8 for the keyboard
cable.
Cut the wires of the 100 Ohm resistor close to its body. This allows you to
solder the new 33.2 Ohm resistor (0757-0995) to the existing wires without
removing the ALM board from the card cage.
If the needle lifts the vial out of the tray
When the needle is raised out of the vial during an injection, cycle it may
happen that the vial is lifted out of its position (but finally drops back into the
tray). The reason might be a too weak spring in the bottle in place sensor
assembly. This happens only, if the septa is very tight. All autosamplers with
serial number prefix 3313 G... have a stronger spring 1460-2365 installed.
The new spring is much stronger then the old one and will keep the vial in
place also with tight septa.
If the injections are not reproducible (grooved needle)
It has been reported that a couple of customers had reproducibilty problems
when injecting larger volumes from vials that have been crimped very tight.
For such cases a grooved needle has been set up.
In This Book
only.
1050 Series of HPLC

Modules
Service Handbook -
Diode Array Detector
(G1306A) and Multiple
Wavelength Detector
(79854A)
76337 Waldbronn
Germany
Copyright Agilent
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
The information
contained in this
this material,
including, but not
warranties or
merchantability and
purpose.
IMPORTANT NOTE
01050-90102 edition 4
(1995) and G1306-90102
information (79854A
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
18
18 DAD/MWD: General Information
the 1050 Diode Array and Multiple Wavelength
Detectors
DAD/MWD: General Information
about this detector
repair policy
features
user-interfaces
specifications
About the Detector
General
The 1050 Diode Array Detector (G1306A DAD) and Multiple Wavelength
Detector (79854A MWD) module houses the optical system and the
electronic circuitry which acquire and process absorbance data. Control of
optics (radiation source shutter photo diode array etc.) is an integral part of
the electronics. The module is controlled through the user interface through
which the operator defines his requirements (detection parameters etc.) and
through which the system presents the required analytical information.
Repair Policy
The 1050 DAD/MWD is designed that you can access all components easily.
Customers are able to repair certain parts of the 1050 DAD/MWD described
in the User Handbooks.
For details on repair policy refer to Repair Policy on page 38 in chapter
1050 Common Information.
About the Detector
Identification
The module is identified by a 5 digit product number (G1306A or 79854A) and
a 10 unit serial number on a label attached to the wall inside the module. The
first four digits of the serial number are the serial prefix. The letter identifies
the country of origin. The last five digits are an identification number unique
to each module.
Any changes to the modules will be covered initially by Service Notes. They
will be sent out to all Service personnel prior to implementation of the
change to the instrument. With every reprint these changes will be
incorporated into the service documentation.
Compatibility
The replacement parts of the 1050 MWD are usable in the 1050 DAD and vice
versa. The 1050 MWD can be upgraded to a 1050 DAD.
DAD Differences
DAD Differences
The G1306A Diode Array Detector (DAD) is basically the 1050 Multiple
Wavelength Detector (MWD). The DAD has the same hardware as the 1050
MWD with two exceptions: keyboard and firmware are different.
The 1050 DAD is NO replacement for the 1050 MWD.
The 1050 DAD adds spectra capabilities to the existing 1050 MWD,
necessary for workstation controlled 3D detection systems.
The 1050 DAD needs control by the HPLC DOS ChemStation (PHOENIX
3D-PLUS) to become operable.
Upgrade from 1050 MWD to 1050 DAD will need new firmware and a new
user interface (keyboard).
Added features
The following features are new (compared to the 1050 MWD):
up to five independent signals (sample and reference wavelength each)
up to 5 spectra/second (time programmed, periodically or peak controlled)
temporary storage of up to 90 spectra in internal run buffer
up to 1 spectrum/second for monitor output
lamp-on time information
Removed features from local keyboard
The following features are removed from local keyboard access (compared
to the 1050 MWD). The functionality is covered by the workstation:
reduced run buffer size for signal data (shared between signal and spectra)
no local spectra evaluation (e.g. spectra plot to analog output and
spectrum maximum calculations). This also affects the diagnostic
functions holmium test and intensity profile plots.
No signal arithmetic for the analog outputs.
Signal A is analog output 1 and signal B is analog output 2.
DAD Differences
The signal multiplication factor has been removed from signal parameter
set points.
no max monitor screen.
Restrictions of user interface
The user interface does have the following restrictions:
no access to method parameter including the time table (e.g. signal
settings, external contacts).
no method storage functionality (includes on error method).
no access to time-out or auto-on function.
DATE&TIME will be monitored but cannot be set locally.
no parameter lock on/off.
no settings of the analog output functions and offsets.
Compatibility
The replacement parts of the 1050 MWD are usable in the 1050 DAD and vice
versa. The 1050 MWD can be upgraded to a 1050 DAD. An upgrade kit will
contain the necessary hardware and instructions (see section Parts
Identification).
The 1050 DAD cannot be operated properly in an integrator based system.
The LC APPACK software will not recognize the 1050 DAD as a module to
control.
DAD Differences
Local User Interface
The keyboard of the user interface has been changed. A different keypad foil
shows a limited number of available keys (see Figure 145 on page 424).
Figure 145 Local User Interface
DAD Differences
The following functions remain the same as for the 79854A MWD (same
keys):
LAMP ON/OFF
Pressing NEXT LAMP ON FOR n hours and
RESET LAMPHOURS (enter)are displayed.
BALANCE
START and STOP
Status line including signal A monitor, not ready conditions, logbook,
installed options and firmware revisions.
The following functions are hidden behind the STATUS key for maintenance
purpose):
DATE&TIME
REVISION
CONFIGURATION
remote configuration.
set GPIB address.
autobalance on/off.
lamp current setting.
set wavelength calibration factor.
set analog output voltage.
TEST FUNCTIONS
measure intensity.
Holmium spectrum.
lamp intensity.
gain (ASC).
D/A converter.
electronics noise.
shutter position.
wavelength calibration check.
DAD Differences
Workstation Interface
The 1050 DAD must be operated with the LC ChemStation.
Rawdata File
The run buffer within the detector is shared by signal and spectra data. In
case the run buffer is going to overflow, the signal data will have the higher
priority: the last stored spectrum is removed from the run buffer. This will
guarantee useful signal data but may cause loss of interesting spectral data.
The run buffer can hold up to 30000 signal data points or about 90 spectra.
Peak Detector
The peak detector (PD) always uses signal A as the pilot signal. The PD is
adjusted by means of the two set points peak width and threshold. Both
setpoint are time programmable. Whereas the PD-threshold is a method
parameter of its own, the PD-peak width parameter is derived from the
general peak width (PKWD) parameter. At start of the run the value for the
PD-peak width is set equal to the PKWD setpoint. During the run the PD-peak
width parameter can be changed by time programming.
Spectra Acquisition Modes
The spectra acquisition mode allows automatic storage of spectra during a
run. The mode can be changed during the run by time programming.
Compared to the 1040 DAD the 1050 DAD will have two new features
storing spectra at the baseline before the begin of a peak
periodically store spectra during a peak and at a reduced data rate.
The modes in detail are:
DAD Differences
Table 103 Spectra Acquisition Modes
Mode Details
none no spectra is stored
apex top of peak spectra is stored
apex + baselines last baseline spectrum before peak, top of peak
spectrum and first baseline spectrum after peak is
stored.
apex + slopes spectrum in peak upslope, at top of peak and in peak
downslope is stored.
apex + slopes + baselines combined apex + slopes and apex + baselines.
all in peak compared to storing all spectra periodically, only
stores spectra within a peak at doubled period. Starts
with last baseline spectrum before peak and ends
with first baseline spectrum after peak. If baseline
spectra are not detected, the spectrum before the first
spectrum in peak or the spectrum after the last
spectrum within the peak is stored instead.
all periodically all spectra are stored. The period depends
on the peak width setting. For peak width setting=0
(narrowest peak), the spectrum data rate would be
20 Hz
DAD Differences
Test Functions
The 1050 DAD has a reduced user interface and no analog output (DAC board
is optional). It has no means to display (plot) the spectra (or intensity scans)
of some of the built-in tests. These plots can be retrieved with the
Workstation.
Options
Because the 1050 DAD is only operable together with the workstation, the
Communication Interface Board (CRB) is mandatory.
Because the 1050 DAD typically needs no analog output signals, the Digital to
Analog Conversion Board (DAC) is optional.
Owners manual.
Specifications DAD/MWD
Table 104 Specification of the 1050 DAD/MWD (Series II Optical)
Detection Type Double beam photometer
Signals Up to 3 (MWD) or 5 (DAD), each defined by a sample
wavelength and bandwidth and an optional reference
wavelength and bandwidth.
Signal Combinations Sum of two signals; difference of two signals; ratio of
two signals, with definable range and threshold;
window plot with definable ratio, range and
threshold.
Noise
< 2.0 x 10
-5
AU peak-to-peak, at 254 nm with 4 nm
bandwidth, flowing water at 1 ml/min, 1 second
response time (10-90%).
Drift
< 2 x 10
-3
AU/hour, at 254 nm, after warm-up.
Wavelength Range 190-600 nm, selectable in 1 nm increments.
Bandwidth Range 2-400 nm, selectable in 1 nm increments.
Wavelength Accuracy 1 nm.
Linear Absorbance Range Better than 1% up to 1.5 AU, using acetone at
265 nm.
Response Time 8 choices, ranging from 0.1 to 20 seconds (10-90%).
Spectra Storage of at least 8 spectra, with definable
wavelength range from 190-600 nm (total number of
spectra depends on range defined). Post-run plotting
of original or subtracted spectra possible.
Spectra Resolution depends on slit width.
Absorbance Resolution
< 5 x 10
-6
AU
Spectra Acquisition 12.5 ms from 190 to 600 nm; according to the
response time settings scans are accumulated for one
data point for improved sensitivity.
Light Source Deuterium lamp.
Flow Cell (Series II) SST cell, 8 l volume with 6 mm path length or 13 l
volume with 10 mm path length and 120 bar (1760 psi)
maximum pressure. Optional high-pressure cells
(400 bar).
Display 2 line by 16 character fluorescent display with
real-time display of operating parameters or
absorbance and wavelength of maximum absorbance.
editing during run possible; keyboard lock. External
control via GPIB with ChemStation or RS-232.
Integrated keyboard with function keys; limited
functionality and control on DAD.
Parameters Signal definitions (wavelengths/bandwidths),
attenuation, response time, zero offset, balance;
spectra definitions; external contacts; analog outputs.
Time-programmable
Parameters
Wavelengths/bandwidths, attenuation, spectra
acquisition, external contacts.
Methods Battery-backed storage of up to ten methods (depends
on length of method), including initial and
time-programmed parameters. Automatic startup and
shutdown methods. Editing of stored methods
possible during run.
Analog Outputs Two analog outputs are available (on DAD optional)
for output of signals and/or signal combinations; both
1 V/2 AU or 100 mV/2 AU, user-selectable.
Communications START (in- and output), STOP (in- and output), READY
(output), SHUTDOWN (output) for synchronization
with other LC modules; two external contacts
including: 1 relay with 24 V and 250 mA; 1 contact
closure with maximum 30 V and 250 mA.
Owners manual.
front-panel LEDs and status logbook. User-definable
detection, safe leak handling, leak output signal to
shutdown the pump.
Environment Temperature range: 5 to 55 C
Humidity: < 85% (non-condensing)
Dimensions Height: 208 mm (8.2 inch)
Width: 325 mm (12.8 inch)
Depth: 560 mm (22.0 inch)
Weight: 16 kg (35 lb.)
19
19 DAD/MWD: Hardware
Information
about the 050 Diode Array and Multiple
Wavelength Detectors
DAD/MWD: Hardware Information
components of the 1050 Diode Array and Multiple Wavelength Detectors.
overview about the optical system
overview about the electronics
detector hardware
optical units
flow cells
heat exchanger
lamp
shutter assembly
leak sensor
fans
NOTE This chapter describes the Series II optical unit hardware only.
Overview: Optical System
Overview: Optical System
The light from the deuterium lamp is passing an achromat lens system and is
focussed first on the exit of the flow cell. Then it passes a lens and is
focussed again on the slit assembly. Due to this separation of flow cell and
slit and the availability of flow cells with different path lengths (6 and 10 mm)
and slit assemblies with different optical slit width (2, 4, 8 nm), it is now
possible to optimize the signal-to-noise and the spectral resolution. The
optical unit is optimized for the flow cell with 6 mm path length together with
the 4 nm slit assembly.
Figure 146 Optical System
1 - deuterium lamp
2 - windows
3 - shutter
4 - achromat
5 - flow cell
6 - slit assembly
7 - lens
8 - grating
9 - array
Overview: Electronics
Figure 147 shows a block diagram of the 1050 DAD/MWD.
The Common Main Processor (CMP) controls all functions of the module.
The CMP communicates with the AQB, controls directly the shutter of the
optical unit and the power supply. If a leak is detected inside the optical unit,
this leak message is connected to the CMP. The CMP also provides the I/O
Remote connections.
To the CMP the common main processor BUS is connected which allows the
communication with the user interface (keyboard), Digital to Analog
Converter (DAC) and GPIB/RS232 interface.
The Digital to Analog Converter interface is optional.
Because of the structure of the 1050 Series the module specific controller
firmware is piggy-back loaded to the Data Acquisition Board (AQB). The
AQB controls the Analog to Digital Conversion Board (ASC) and the Photo
Diode Array (PDA).
Figure 147 Block Diagram 1050 DAD/MWD
Optical Unit
Optical Unit
The main areas of the optical unit are:
Due to this separation of flow cell and slit and the availability of flow cells
with different path lengths and slit assemblies with different optical slit
width, it is now possible to optimize the signal-to-noise and the spectral
resolution. The optical unit is optimized for the flow cell with 6 mm path
length together with the 4 nm slit assembly.
Figure 148 Optical Unit
Optical housing same for use in 1050 MWD and 1040/90 DAD
(different flow cell, cover and slit).
flow cell available as stainless steel (SST) with different path
lengths (6/10 mm, 8/13 l) for high pressure use (120
bar). Additional high-pressure cells (400 bar) are also
available.
Slit assembly available with optical slit width of 2, 4 and 8 nm slit.
LPC board interface between leak sensor/shutter assembly and
main electronics.
Optical Unit
Flow Cell Assemblies
The new flow cell design allows the work up to higher pressure and the
possibility of maintaining and replacing parts. The flow cells can be
disassembled, cleaned or repaired.
Figure 149 Flow Cell
CAUTI ON Because the very small inner diameter (0.17 or 0.12 mm) of the inlet capillary
only very clean solvents should be used.
Table 105 Flow Cell Data
STD HP-STD HP-Micro
Volume 8 or 13 13 1.7 l
Path length 6 or 10 10 6 mm
Maximum pressure in the cell 120 400 400 bar
Inlet capillary id 0.17 0.17 0.12 mm
Outlet capillary id 0.17 0.17 0.12 mm
recommended pH range >2.3 to 9.5
STD Standard Flow Cell
HP-STD High Pressure Cell with 13 l volume
HP-Micro High Pressure Cell with 1.7 l volume
Optical Unit
Additional Information of High Pressure Cells
Typical applications of the high-pressure flow cells are:
Hyphenated systems (LC-MS)
Super Critical Fluid Chromatography (SFC)
Multi-detector systems
Narrow-bore column applications
The main difference between the standard and high-pressure flow cells is the
design of the window assemblies. The high-pressure flow cells have a
different window screw, window and seal ring, washer, and a different
number and orientation of conical disk (bevelled) springs, see Figure 150.
The seal rings support and hold the window and at the same time form the
high-pressure seal.
Figure 150 Cross-section of Window Assembly
The following materials are in contact with solvents:
Stainless steel (AISI 316)
Quartz
Vespel
(polyamide) Vespel is a registered trademark of DuPont.

Conical Disk Springs (see
below)
Windows
Detail of Conical Disk
Springs Showing
Orientation
Window Screw
Washer
Washer
Optical Unit
Under standard conditions (1 ml/min water flow, 254 nm detection
wavelength, 4 nm bandwidth, 1 s response time) the noise of the
high-pressure micro flow cell might increase.
The high-pressure micro flow cell is supplied with an additional 0.12 mm i.d.
capillary, allowing you to bypass the heat exchanger.
Slit Assembly
The separation of the slit from the flow cell allows to change the slits
according the needs to optimize signal-to-noise and spectral resolution.
Available slit sizes are 2, 4 and 8 nm.
Figure 151 Slit Assembly
Optical Unit
Deuterium Lamp Assembly
The deuterium lamp used in the 1050 DAD is the known lamp from the 1040
Diode Array Detector, the 1050 DAD/MWD and the 1050 Variable Wavelength
Detector (79853C).
The reduction of energy emission of the lamp (Figure 153 on page 443) is
time and wavelength dependent and is significantly higher within the first
days and for wavelengths in the ultra violet range compared to the visible
range (change in transmission of lamp glass).
Usually, the response maximum of the lamp is near 230 nm, but can be
shifted to a higher wavelength for an aged lamp. It has no relevance for
intensity degradation at other wavelengths.
Figure 152 Deuterium Lamp Assembly
Two versions were used:
79880-60002 was the original lamp
79883-60002 with 20% higher initial energy
Optical Unit
Figure 153 Intensity Degradation of Lamp (79883-60002)
Measured wavelength is 230 nm
initial intensity about 20% higher than 79880-60002
should be used with 2 nm slit initially top prevent overload of photo diodes
(if intensity is to high).
decrease in intensity is less with use
NOTE The lamp should be replaced only if the following two criteria are both
fulfilled:
Baseline Noise (with test cell) has increased significantly.
Amount of counts of the lamp (with test cell) has decreased to less than 50%
of the count record of this same lamp when newly installed).
The decision to replace the lamp due to criteria 2 alone is not relevant,
because the signal/noise may be still within instrument specifications.
Optical Unit
Heat Exchanger Assembly
The MWD may exhibit severe noise under certain solvent and LC conditions.
This is most noticeable when Acetonitrile is the mobile phase. Therefore a
heat exchanger assembly is installed underneath the optical unit. The outlet
capillary of the heat exchanger is mounted at the flow cell and is led then into
the inlet of the flow cell connected by a union.
The heat exchanger contains 60 cm capillary of 0.17 mm i.d. Pressure drop
with water at 1 ml/min approximately 25 bar.
Figure 154 Heat Exchanger and Flow Cell
Optical Unit
Shutter Assembly
The Shutter Assembly is located in the cell compartment of the optical unit.
The stepper motor is responsible for moving the shutter into one of three
possible positions:
3 Shutter not in light path (normal operation)
4 Shutter in filter mode (a holmium filter is moved into the light), refer to
TEST FUNCTIONS, see Shutter Position on page 506.
5 Shutter in dark position (no light is coming through the cell; this is
necessary for dark current measurements carried out for calibration
purposes).
Figure 155 Shutter Assembly
Optical Unit
Leak Sensor Assembly
A leak sensor is located just under the cell. Should the cell leak, solvent
would cool the leak sensor (self-heating thermistor). The resulting change in
resistance, measured by comparators on the CMP board would generate an
error message on the CMP board and switch the instrument to STANDBY. A
drain is located at the bottom of the cell compartment and is led to the
module waste system.
Damage to the array compartment is prevented by a window which separates
the cell from the array compartment.
NOTE In a 1050 System (using remote connections) the leak message will switch off
the pump.
To switch off non-1050 Modules refer to operating manual.
Figure 156 Leak Sensor Assembly
Fans
Fans
Two DC-fans are located between the optical unit and the motherboard,
inserted in a set of foam. The left one provides air for the lamp housing and
power supply and the right one provides air for the electronics in the rear.
For replacement refer to section Procedures.
In May 1994, a protection cover for the left fan (close to the lamp connector)
was introduced for safety reasons (not shown in Figure 157).
Figure 157 Fans
Fan cover not shown
Fans
20
20 DAD/MWD: Electronic
Information
DAD/MWD: Electronic Information
This chapter gives information about the electronic of the 1050 Diode Array
and Multiple Wavelength Detectors:
Overview
Array Signal Conversion Board (ASC)
Data Acquisition Board (AQB)
Communication Interface Board (CRB)
Motherboard (LUM)
LPC Board
Power Supply (DPS-A)
Digital to Analog Conversion Board (DAC)
NOTE For additional details of the assemblies you may refer to the 1050 Service
Handbook, Chapter Common Information.
Overview
Overview
All electronic boards (except the FIP, behind the keyboard and the LPC, in
the optical unit) are located in the rear part of the module and they are
connected to the Motherboard (LUM). The rear of the detector is shown in
Figure 158 on page 452.
In the 1050 DAD the following electronic assemblies are available:
Power Supply (DPS-A) 5061-3375 01050-69375
Array Signal Conversion (ASC) 01048-66501
Digital/Analog Conversion (DAC) (optional) 01048-66502
Data Acquisition (AQB) 01048-66543
Firmware Board (FIM) for DAD G1306-66524
Firmware Board (FIM) for MWD 01048-66504
Leak/Shutter Interface (LPC) 79883-66509
Motherboard (LUM) 01048-66510
Communication Interface (CRB) 5062-2482
Overview
Figure 158 Rear of 1050 DAD/MWD
NOTE The DAC board is optional in the 1050 DAD.
Overview
The system consists of the Photo Diode Array (PDA) with 211 elements, the
Array Front End Board (AFE), the Analog Signal Conversion Board (ASC)
and the Acquisition Processor Board (AQB).
The PDA detects a spectrum of incident light in the wavelength from
190...600 nm with 2 nm increments.
The AFE Board consists of a Readout Amplifier, which transfers the
accumulated charge from the diodes and generates the PDA signal.
The ASC Board consists of a variable gain amplifier, a 16-bit A/D converter, a
microprocessor interface and a control logic to control the PDA, the
amplifier and the microprocessor interface.
Figure 159 Block Diagram of Electronics
Repair Level: Board
The two main functions of the ASC board are:
providing of control signals for the readout routine of the photo diode
array;
analog to digital conversion of the array signal.
Photo Diode Array Readout Routine
The readout cycle (12.5 ms) is divided into 225 time slots each 55.55 s.
Item Part Number
ASC board 01048-66501
Time Slot Function
0 not used
1 dummy diode, not used
2 Bit 1 of shift register, not used
3...211 information of intensity
212 Bit 213 of shift register, not used
213 dummy diode, not used
214 not used
215 Offset value, Gain = 1
218...224 not used
Figure 160 Block Diagram ASC Board
The analog ARRAY SIGNAL coming from the AFE board is in the range of
-5 V to - 10 V depending on the intensity of the light falling on to the photo
diodes.
Analog/Digital Conversion
The principle of conversion is based on the Triple-Slope technique see Figure
161.
During the TRACK phase the integration capacitor is loaded by a constant
voltage U
c
. This voltage is proportional to the ARRAY SIGNAL voltage. The
voltage U
c
is in the range of 0...10 V and is present for 12.37 s.
Figure 161 Triple Slope Integration
During the HOLD phase (the ARRAY Signal voltage is disconnected). U
c
is
discharged by two constant bipolar currents I
1
and I
2
and the discharge time
is measured. U
c
is discharged with I
1
until the zero passage is reached. The
time used for this down slope is counted with the clock (18.432 MHz) and will
represent the upper 9 bits of the 16 bit data word.
After the zero passage I
1
is switched off with the next active clock and the
negative residual charge is discharged with I
2
until the zero passage is
reached the second time. The time between both zero passages represent the
lower 7 bits of the 16 bit data word.
In reality only I
1
is switched and I
2
is on permanent to avoid failures due to
multiple switching.
The cycle for the conversion takes 55.55 s (18 kHz) and is divided into 1024
steps of 54.2 ns (18.432 MHz) which is the internal clock on the board.
During steps 0...227 the amplified input voltage (ARRAY SIGNAL) is switched
through and the integration capacitor is charged. The gain level can be 1, 2 or
4 depending on the instrument characteristic of the light source. These
amplification factors are measured for each diode at the begin of a
chromatographic run when a BALANCE is made. The values are put as a
table into memory on the AQB Board.
Starting with step 228 the input voltage is disconnected from the capacitor
and a RESET pulse resets all flip-flops and counters. Current I
1
is switched
on. The conversion starts.
Up to this point the described timing sequence is independent of the input
voltage. The following processes are controlled by the zero passages.
The 9-bit counter counts the clock pulses until the comparator sees a zero
passage of the integrator voltage. Then I
1
and the 9-bit counter are switched
off. I
2
and a 8-bit counter are now active discharging the negative integrator
voltage until the next zero passage. The 8-bit counter stops.
During steps 1012...1016 the 16 bit data word is build. The 16 bit word is
moved into the output registers from where the AQB Board takes the
information. Because of the long availability of the data word (55.55 s) the
AQB processor has enough time to get the data.
Input Amplifier and Integrator
The ARRAY SIGNAL coming from the AFE Board is in the range of +0.1 V
(dark) and -5.1 V (bright). A input amplifier transfers this voltage into the
range of -0.7 V to -11.1 V which is the input of an amplification switch. This
switch changes the amplification factor of the integrator stage (gain factor 1,
2 or 4). The adjustment of the separate photo diodes is done by the AQB
Board.
Ramp Amplifier and Comparator
The ramp amplifier is used to increase the slope speed of the integrator
voltage.
The comparator looks for the zero passage and provides the signals COMP
and COMP- for the time and control logic.
DC-Voltages
The internal reference voltages +10 V and -10 V are derived from the +15 V.
Digital Sections
This section provides all timing and control signals used on the ASC Board.
The timing is done with a Programmable Array Logic (PAL) that gets 8
synchronous input signals in the range of 2.304 MHz and 18 KHz all derived
out of the 18.432 MHz main clock.
A SYNC signal is used for synchronization of the switching power supply.
The comparator signals COMP and COMP- (generated in the analog part)
control the 9-bit and 8-bit counter.
The 16-bit data word is transferred to the Data Acquisition Board (AQB) via
the 16-bit Data Register.
Status information is transferred to the Data Acquisition Board (AQB) via the
Status Register.
Input voltages: +19 V, -19 V, AGND
+5 V, DGND
Output Voltages: +15 V, -15 V, AGND
+5 V, DGND
Repair Level: Board and Fuse F11, F12 and Firmware
The Data Acquisition Board (AQB) is the personality module. It contains the
firmware for the main processor system.
Firmware including address decoder will be located piggy back on the FIM
board. But the main purpose of this board is to hold special hardware only
necessary for the DAD/MWD. This is frontend control hardware and a data
reduction processor system including dual port RAM for data transfer to
main processor.
Main Functions
max. four EPROM main firmware on FIM board
FIM board piggy back on AQB board
lamp control hardware
stepper motor driver hardware for shutter
2 external contacts
2 connectors on rear panel
1 contact without supply (only contact closure) max. 30 V (fused with
250 mA)
1 contact with internal 24 V supply (fused with 250 mA)
Table 108 Part Numbers for AQB Board
Item Part Number also used for
AQB Board 01048-66543/-69543 G1600A CE
Firmware Board DAD/CE G1306-66524 G1600A CE
Firmware Board MWD 01048-66504
Fuse F11, F12 (250 mA) 2110-0004
Figure 162 Block diagram of AQB Board
Frontend Processor Area
6809 running at 2 MHz
A/D converter interface
frontend firmware 512 byte
8 Kilobyte dual port RAM including interrupt register
Main Processor Area
max. four EPROM main firmware on FIM board
FIM board piggy back on AQB board
lamp control hardware
lamp on/off (anode voltage)
heater on/off
lamp start (600 V ignition)
2 lines for lamp current select status
stepper motor driver hardware for light shutter
motor on/off
4 bit step pattern lines
bus buffer for backplane bus connection
2 external contacts
Input / Output
2 external contacts
2 connectors on rear panel
1 contact without supply (only contact closure) max. 30 V/250 mA
1 contact with internal 24 V supply (max. 250 mA output with fuse)
via motherboard
stepper motor lines to optical unit
lamp control to power supply
connection to ASC board
backplane bus
Figure 163 Layout of AQB Board
Repair Level: Board
The FIM board is a piggy back board, placed on AQB board (personality
module).
The programmed FIM contains the firmware of the 1050 DAD module.
The FIM contains up to four 128K x 8bit EPROM (U4 to U7).
Figure 164 Layout of FIM Board
Firmware Board DAD/CE G1306-66524/-69524 G1600A CE
Firmware Board MWD 01048-66504
Repair Level: Board
Common 1050 functions for the main processor are:
display handling
keyboard polling
remote control input and output
leak sensing
option interfacing
time programming
method storage
module configuration
memory switching
32 kilobyte RAM with battery back-up for parameter storage.
Firmware is not part of this board, because parts of the main processors
software are module specific. The main processor firmware will be located
on the personality module (AQB Board) or on an optional board.
Table 110 Part Numbers for CMP Board
CMP Board 5061-3380/01050-69580 G1600A CE
Figure 165 Block diagram CMP
Remote Control
The CMP board provides two remote connectors.
Remote Signals
Remote Configuration
The 1050 Series provides three remote configurations:
The signal level are defined as standard TTL levels
(0 V is logic true, + 5 V is logic false).
The remote lines can be input or output (wired or technique).
Fan-out is 10
Input Load 2 kOhm against + 5 V
Table 111
Pin Signal Active Color
1 Digital ground white
2 Prepare run LOW brown
3 Start LOW gray
4 Shut down LOW blue
5 Reserved pink
6 Power ON HIGH yellow
7 Ready HIGH red
8 Stop LOW green
9 Start request LOW black
HPsystem Start of automatic operation from any modules start key.
Start request is outputted.
GLOBAL Synchronized start of several modules for a single run.
Start / Stop is outputted.
LOCAL Single modules start. No pulses outputted.
Communication Interface (CRB)
Communication Interface (CRB)
Repair Level: Board
The communication interface board is necessary for the control by a
Personal Computer and to connect printer or plotter devices. The
communication interface board provides one GPIB and one RS232 interface.
The CRB for the 1050 DAD has a 96 kilobyte run buffer for the data/spectrum
operation with the Multiple Wavelength Detector. The interface is located in
Slot #2 of the module.
The board contains a baud rate generator. The baud rate is selectable up to
19200 baud from the keyboard. The transmitter and receiver baud rate are
independent adjustable.
The implemented serial interface is a subset of the RS232 standard only. It
contains at
The 1050 modules are designed as DCE (data communication equipment)
without hardware handshake.
Table 112 Part Numbers for CRB Board
CRB Board 5062-2482 G1600A CE
PIN 2 RxD receive data (data input)
PIN 3 TxD transmit data (data output)
PIN 4 GND (Ground)
Repair Level: Board
The main functions of the DAC board are:
conversion of digital data into analog signals compatible with external
integrators;
provide two independent analog outputs.
The DAC board comprises two independent pulse-width modulated 16 bit
D/A converters with noise <1/4 LSB (peak to peak). The repetition rate for
the data per channel is 90 Hz. The two analog outputs can be used for
integrators and recorders. The rise time and the offset voltage is selectable
per software.
Table 113 Part Numbers for DAC Board
DAC Board 01048-66502 G1600A CE
Output voltage: -4 ... 996 mV (1 V) or
-0.4 mV ... 99.6 mV (100 mV)
Scale factor: 0.5 V/AU or 0.05 V/AU
(for multiplication factor =1)
Rise Time (10/90%): 0.1/0.3/1/3 s
Noise (0.1 s rise time): < 4 V (< 0.008 mAU)
Figure 166 Block diagram of DAC Board
Address Decoder and Data Storage
The digital signal prepared for conversion is sent from AQB through LUM
data bus in 8 bit portions. The appropriate address is available on LUM
address bus. This address is decoded by the address decoder and the data
storage circuit is activated and the digital word is stored. The two channels
are separated only through the appropriate address recognized by the
address decoder.
Timers
Three 16 bit timers are available on the DAC. One is fixed as a divider
(6.555 MHz/90 Hz) and provides the 90 Hz clock for the control logic. The
other two timers work as Pulse width Modulator for channel 1 and 2. They
are loaded with the digital word stored in the data storage and activated with
a 90 Hz clock. Starting with the loaded word each counter will count
downwards with the 6.555 MHz cycle.
Pulse Width Modulator
The pulses generated in the counter section are fed to diode switches that are
responsible to switch the constant current source on or off to the low pass
filter section.
Low Pass Filter
All low pass filters should suppress the 90 Hz cycle. The cutoff frequency is
<4 Hz and suppresses the 90 Hz with >100 dB. The second low pass filter is a
variable low pass filter dependent on the rise time (0.1/0.3/1/3 s). The third
low pass filter has a variable gain which allows a scale factor for the analog
output voltage at 50 mV/AU or 0.5 V/AU.
Rise time
The rise time is software selectable to 0.1 s, 0.3 s, 1 s, or 3 s. This rise time is
varied in combination with the peak width setting. The default setting is 1 s.
Refer to Operating Manual for more details.
Power Supply
The 19 V from the Power Supply is used to generate 15 V and + 10 V as a
reference voltage for the constant current source.
Board Diagnostics
There are two possibilities to troubleshoot the DAC board:
output voltage check, see User Manual
D/A converter test, see D/A Converter Test on page 500
Both of these tests can be done on both output channels.
Figure 167 Layout of DAC Board
Repair Level: Board or Fuse ICP1
The FIP module is located behind the keyboard module of pump, autos
ampler and multiple wavelength detector.
The function of the FIP module is to provide an interface between a host
system and the user. Messages can be displayed with up to 32 characters
(2 lines x 16 characters/line). A matrix keyboard is scanned for numeric or
special function input and status information is displayed through 4 LEDs.
The characters are displayed in a 5 x 7 dot matrix.
In case of a dark display, check the on board fuse ICP1 which is soldered in
close to the connector P1/P2.
Figure 168 Board Layout FIP
Table 114 Part Numbers for FIP Board
Item Part Number
FIP Board 5061-3376
Fuse 1 A 2110-0099
Motherboard (LUM)
Motherboard (LUM)
Repair Level: Board
The Motherboard contains all connectors for the boards and the assemblies
in the front part, like fans, optical unit and keyboard.
Figure 169 shows the location of all connectors.
Figure 169 Layout of Motherboard
Table 115 Part Numbers for LUM Board
Item Part Number
LUM Board 01048-66510
J1 - DPS J6 - Not used J10 - Shutter/Leak
J2 - ASC J7 - CMP J11 - Lamp
J3 - AQB J8 - FIP J12 - not used
J4 - DAC J9 - PDA J13 - Fan (left)
J5 - not used J14 - Fan (right)
Motherboard (LUM)
Figure 170 Connection Table LUM (I)
Motherboard (LUM)
Figure 171 Connection Table LUM (II)
Motherboard (LUM)
Figure 172 Connection Table LUM (III)
LPC Board
LPC Board
Repair Level: Board
The board routes the signals from the leak sensor and signals to the shutter
assembly. Via J3 it is connected to J10 of the LUM board (Motherboard).
Figure 173 LPC Board Assembly
LPC Board 79883-66509 G1600A CE
Repair Level: Fuses and DPS-A
For detailed information refer to the 1050 Service Handbook, Chapter
Common Information.
General Description
The power supply is a primary switching regulated type. It consists of two
parts. the Base Supply and the Lamp Supply. The Base Supply provides
outputs of +5 V, 19 V, +24 V and +36 V. In addition the Lamp Supply
provides all circuits necessary for the operation of a deuterium lamp.
Lamp Ignition
always. After ignition the heater voltage is switched off (DAD/MWD).
Figure 174 Deuterium Lamp Ignition
DPS-A 5061-3375/01050-69375 G1600A CE
Figure 175 Block Diagram DPS-A (Base Supply)
Figure 176 Block Diagram DPS-A (Lamp Supply I)
Figure 177 Block Diagram DPS-A (Lamp Supply II)
21
21 DAD/MWD: Diagnostic &
Troubleshooting Information
Diode Array and Multiple Wavelength Detectors
DAD/MWD: Diagnostic &
The 1050 DAD/MWD provides
STATUS information during the normal operation (e.g. conditions errors);
ERROR MESSAGES that identify the problem;
DIAGNOSTIC features on special request to allow troubleshooting of the
module.
DAD/MWD: Diagnostic & Troubleshooting Information
STATUS Information
STATUS Information
Status Modes
Status Modes
Status LEDs
Warnings
SYSTEM INIT initializing .....
After turning on the module runs through an initialization.
STANDBY 1050 STANDBY 01:A 0.00mAU
All LEDs and the deuterium lamp are off. Edit of all parameters is possible (if
PARAMETER LOCK is off).
LAMP IGNITION LAMP ON <lamp is off> ENTER
LAMP IGNITION 01:A 0.00mAU
During the ignition process the NOT READY LED is on.
PRERUN PRERUN 01:A 0.00mAU
The same as in STANDBY mode except that the deuterium lamp is on now.
Transition to RUN only possibly by pressing START (LOCAL) or via
REMOTE.
RUN timeprogram starting
is displayed for 2 seconds. Then actual display shows
RUN 01:A 0.00mAU.
The RUN LED is on and the timetable commands are executed. The
deuterium lamp cannot be switched to off.
timeprogram stopped
POSTRUN POSTRUN 01:A 0.00mAU
The RUN LED is blinking. If post time has elapsed or STOP occurs the
instrument switches to BALANCE mode (calibration) if auto calibration
parameter is ON else to PRERUN mode.
STATUS Information
BALANCE balancing
A calibration in performed and the NOT READY LED is on.
SYSTEM TEST This mode is normally skipped and has to be called up through the TEST
functions or during power on by pressing
STATUS and LINE~ switch. Then ROM- RAM- and DISPLAY Test is
performed. For details see ROM/RAM/DISPLAY Tests on page 507.
Status LEDs
ERROR LED ON This state indicates an error condition and requires an interaction of the user.
A message will be written into the system logbook. The display will be
overwritten with a messages:
NOT READY LED ON This state indicates a NOT READY condition (action not yet finished
see also mode description). A logbook entry is made. The following reasons
may be reported on display for 2 seconds:
lamp ignition in progress
amp test in progress
balancing
LAMP LED ON Deuterium lamp on.
RUN LED ON Instrument in RUN mode. If instrument is in POSTRUN mode the RUN LED
is blinking.
Warnings
A warning is written into the logbook if a problem occurs which doesnt
cause the user to stop analysis. A message is written to the display for
2 seconds. Possible warnings can be:
lamp below intensity test limit;
excessive leakage current of one of the photo diodes (non-linear);
intensity too high (wrong calibration at gradient run);
temporary memory overflow.
Error Messages
Error Messages
This section describes the troubleshooting of the 1050 DAD/MWD according
to the error messages. The error messages will help to locate and repair a
failure. In case an error message appears the Error LED will be turned on and
the message will be written into the system logbook.
Selftest
ROM
performed when STATUS will be pressed while the module is turned on at
the LINE~ switch. In case of a failure one of the following messages appears.
The complete test requires approximately two minutes.
The ROMs on the FIM board are tested. In case of a checksum error the ROM
test fails. Replacement of the FIM board will probably fix the problem.
E00: Power Fail E00 HH:MM DDMMM power fail >
clock stopped set time&date
This message indicates that the instrument has either been disconnected
from line source or a line power voltage drop occurred.
E01: Leak Detected In
Detector
E01 HH:MM DDMMM leak detected >
leak detected > in detector
The leak detection circuit is located on the CMP board and checks
continuously for presence and leak conditions. If the sensor is missing
(defect) or in leak condition the PTC is cooled down the error message
appears. When the module is turned on the leak message is disabled for some
time to allow the sensor to reach its working range. The deuterium lamp is
switched OFF.
Actions:
Change leak sensor.
Change CMP board.
Change FIM board.
E02: Error In Other
Module
E02 HH:MM DDMMM shut down >
serious error in other module
An external device pulled the shut down line down (pins 1 and 4 of REMOTE
connector), for example when a leak is detected.
E03: Error Method
loaded
An error has come up in the DAD and this caused to load an error method (if
specified) and turned off the lamp.
E04: Time Out E04 HH:MM DDMMM time out >
lamp turned off automatically
If the time after finishing the last run or a not ready condition exceed the
value of set time-out time the deuterium lamp is turned off automatically. A
time out occurs (pin 1 and 7 of REMOTE connector).
E05: Turn On Lamp
Automatically
E05 HH:MM DDMMM lamp has been >
turned on automatically
If the lamp was programmed to be turned on automatically this message is
displayed.
1050 DAD/WMD Error Messages
The following error messages are 1050 DAD/MWD specific.
E11/12: WL
Calibration out of
range
E11 HH:MM DDMMM WLcalibration >
WLcal factor more than +12
E12 HH:MM DDMMM WLcalibration >
WLcal factor more than -12
This message occurs when the wavelength calibration test failed.
Actions:
Check whether the cell is inserted properly.
Check for air bubbles in cell.
Perform WL-Calibration Test.
E13: Spectra buffer
full
E13 HH:MM DDMMM spectramem.full>
not all ttbl spectra stored
Too many spectra were taken during time program.
Actions:
Reduce number of spectra or time programmed spectra.
E14: No lamp current E14 HH:MM DDMMM lamp failed >
no lamp current lamp is off
Actions:
Check lamp.
Change lamp current.
Check connections.
Replace power supply.
Replace AQB board.
E15: Lamp ignition
failed
E15 HH:MM DDMMM ignition failed>
lamp failed during ignition
Actions:
Turn lamp on.
Check lamp connector.
Perform lamp test.
Change lamp.
Replace AQB.
Replace power supply.
E16: Low intensity E16 HH:MM DDMMM intensity test>
low intensity make lamptest
Actions:
Perform lamp test.
Change lamp.
Change flow cell.
E17: Data overflow E17 HH:MM DDMMM data overflow >
intensity too high
Actions:
Check whether cell is inserted correctly.
Reduce lamp current.
Change lamp.
E18: Data underflow E18 HH:MM DDMMM data underflow>
ASC data too low
Actions:
Check whether cell is inserted correctly.
Increase lamp current.
Change lamp.
Change ASC, cable, AFE.
E19: Lamp turned on
automatically
E19 HH:MM DDMMM lamp turned on>
lamp turned on automatically
The lamp has been switched on per time program.
Diagnostic Features
Diagnostic Features
The instrument offers several built-in test features. Some are limited to
ChemStation operation (for details see descriptions of tests):
intensity test
holmium oxide test
lamp intensity test
ASC test
D/A-Converter test
electronic noise test
close/open shutter
check wavelength calibration
RAM test
ROM test
Display test
NOTE When using these test functions the 1050 DAD/MWD must not be in RUN
MODE.
Press BALANCE prior to perform the test.
When test cell is mentioned, remove cell and insert 4 nm slit for Series II
optical
Entering the Test Functions
You are entering the TEST FUNCTIONS by pressing STATUS followed by
PREV (4x). TEST FUNCTIONS <enter> ENTER.
Measure Intensity Profile
NOTE This function is available from local keyboard only!
An intensity profile of the optical unit is measured. No calibration is made
before the measurement and the actual gain values are used. Perform this
test after the flow cell is flushed or removed with 4 nm slit installed.
MEASURE INTENSITYPROFILE
Taking the Profile
After pressing ENTER the message scanning ... is displayed for a second
and an intensity measurement between 190...600 nm is taken and stored like
a spectrum. The wavelength and the count number at maximum are
displayed max at max 17805cts at 234nm ; 0.00min.
Plotting the Profile (MWD only)
Press SPECTR and RIGHT to display
PLOT 01 REF -- ;ints 0.00min.
You can change now the wavelength range (190...600 nm) and the output
channel (out 1) if necessary.
Press ENTER.
START INTEGR. AT SPEED=30 (enter)
Start the integrator with the PLOT key and the spectrum of the intensity
profile is plotted after pressing ENTER.
When the plot has finished max 17805cts at 234nm ; 0.00min is
displayed.
Press ESC to return to beginning of line.
Find Maximum of Spectrum (MWD only)
Press SPECTR, DOWN and RIGHT.
MAX. 01 REF -- ;ints 0.00min
channel if necessary.
The maximum is shown after pressing ENTER.
max 17805cts at 234nm ; 0.00min
Figure 178 Intensity Profile with Test Cell
Lamp Intensity Test
Lamp Intensity Test
NOTE This function is available from local keyboard and from ChemStation!
An integral measurement of the lamp intensity is made in the range of 210 to
350 nm and the average counts are displayed (test is performed with
minimum gain = 0).
Now you can retrieve the plots or the maximum information. The plotted
curve should be within 3% deviation from the intensity profile. Otherwise
the gain switching on the ASC board may not work properly.
NOTE The characteristics vary from instrument to instrument depending on optics
lamp and array characteristics.
Figure 179 DAD/MWD Test: Lamp Intensity
Lamp Intensity Test
On local keyboard
If performed locally the display shows:
LAMP INTENSITY TEST ; 0
ENTER
LAMP INTENSITY TEST ; 14296
On ChemStation
If performed on the ChemStation this test is part of the DAD Test, see Figure
179 on page 496. The profile (190 to 600 nm) is stored on the ChemStation.
Select Instrument, More DAD, DAD Tests...
Press Measure and the instrument will perform the Lamp Intensity Test
and the Holmium Test automatically.
Press Save to store both profiles.
To print the profile refer to How to print the DAD Profiles, page 5-29.
Measure Holmium Spectrum
NOTE This function is available from ChemStation only!
The shutter is moved to holmium filter position and a spectrum is measured
and plotted (full scale set to 4 AU).
Perform a BALANCE before entering this function.
The scan (190 to 600 nm) is stored.
NOTE The characteristics vary from instrument to instrument depending on optics
lamp and array characteristics.
Figure 180 DAD/MWD Test: Holmium Spectrum
NOTE At least one point should be >3000 mAU in the range of 190...300 nm.
On ChemStation
On the ChemStation this test is part of the DAD Test, see Figure 180. The
profile (190 to 600 nm) is stored on the ChemStation.
Select Instrument, More DAD, DAD Tests...
Press Measure and the instrument will perform the Lamp Intensity Test
and the Holmium Test automatically.
Press Save to store both profiles.
To print the profile refer to How to print the DAD Profiles, page 5-29.
On local keyboard
MAX. 01 REF -- ;holm 0.00min
ENTER
max 3912mAU at 228nm ; 0.00min
D/A Converter Test
D/A Converter Test
NOTE This function is available from local keyboard only and is used to test the DAC
board (DAD optional)!
D/A CONVERTER TEST OFF
D/A CONVERTER TEST ON
The DAC board is tested by generation of a test pattern as DAC input. The
output voltages (out 1 and out 2) should show a constant value
corresponding to the ZERO OFFSET value. On top of this constant voltage is
a switched voltage with a duration of 12 seconds and a height of 15 V, see
Figure 181.
Figure 181 D/A Converter Test
If the D/A converter and the plotting device are in specification then the noise
is depending on the peak width (5 V are equal to 1 x 10
-5
AU).
D/A Converter Test
When the function is switched on start the plotter (ATTN -5, ZERO=50) and
zero it.
Table 118 Limits of D/A Converter Test
Peak widths Noise (pp) / Step height
< 0.01 / > 0.01 / > 0.02 1.3
> 0.05 / > 0.1 / > 0.2 0.5
> 0.4 / > 0.8 0.3
Electronic Noise Test
ELECTRONIC NOISE TEST OFF
ELECTRONIC NOISE TEST ON
The optical unit and its electronic is tested with the possibility of changing
the parameters wavelength bandwidth peak width (before entering this
function).
The shutter is closed and the gain is fixed to minimum=0.
You can leave this function ONLY by switching to OFF.
Figure 182 Electronic Noise Test
With this test non-logarithmic intensity is measured. Result of test must not
exceed a given limit. If test fails the ASC DAC or optical unit may be
defective. If DAC test is OK then ASC or optical unit may be the problem.
Measurement conditions
Any sample wavelength, bandwidth 4 nm, reference is switched off
automatically, 1 V full scale.
Table 119 Limits of Electronic Noise Test
Peak width Rise time Vpp
Limit
3390/2/3 Limit 3394/96 ATTN
< 0.01 0.1 s 90 13.5 mm 27 mm - 1
> 0.01 0.2 s 90 13.5 mm 27 mm - 1
> 0.03 0.3 s 50 15.0 mm 30 mm - 2
> 0.05 1.0 s 30 18.0 mm 36 mm - 3
> 0.10 1.3 s 30 18.0 mm 36 mm - 3
> 0.20 2.6 s 20 12.0 mm 24 mm - 3
> 0.40 5.2 s 20 12.0 mm 24 mm - 3
> 0.85 10.0 s 20 12.0 mm 24 mm - 3
NOISE 1: Test as described.
NOISE 2: Test as described under NOISE 1 but with PDA/LUM cable
disconnected
Table 120 Noise Test Results
Result Explanation
System OK If NOISE 1 > NOISE 2 and in specification.
Electrical Problem If NOISE 1 > limit and NOISE 2 >= limit.
Optical Problem If NOISE 1 > limit and NOISE 2 < NOISE 1
Check of Wavelength Calibration
Check of Wavelength Calibration
NOTE This function is available from local keyboard and from ChemStation.
The maximum absorbance of the Holmium filter is measured at 361 nm and
compared with a stored value. The difference in wavelength is displayed.
On local keyboard
CHECK WL CALIBRATION
IT SHOULD BE 2 AND IT IS 0
The value of 2 corresponds to 1 nm.
To change/correct the setting use function SET WL CALIB.
On ChemStation
Select Instrument, More DAD, Wavelength Calibration.
The wavelength calibration is started automatically (if lamp is on) see
Figure 183.
If the value of Current and Should be is not equal then use Adjust to
correct.
Press OK to store the new values and to add them to the Calibration
history.
To print the profiles refer to How to print the DAD Profiles page 5-29.
Figure 183 Wavelength Calibration
ASC Test
ASC Test
ASC TEST WITH GAIN 0 ; 0
The ASC board is tested by closing the shutter and measuring the dark
current of the photo diodes with three possible gains (0, 1, 2). Start test with
minimum gain first. High values may reflect in a non-linearity. (Default is
minimum gain = 0). The value that is shown is the average dark current
counts of a all photo diodes.
A value between 2500...5500 is the limit measured with gain 0. The value in
gain 1 and 2 may have a difference of 1500 compared to the value from
gain 0.
NOTE High values may reflect in a non-linearity.
The scan (190 to 600 nm) is stored.
channel if necessary.
Now you can retrieve the plots or the maximum information.
MAX. 01 REF -- ;tasc 0.00min
ENTER
max 3885cts at 475nm ; 0.00min
NOTE If the difference between average and maximum is >100 then the array has a
problem at this particular wavelength. This might be no problem if the
customer is using a different wavelength.
Shutter Position
Shutter Position
SHUTTERPOSITION OPEN
SHUTTERPOSITION HOLMIUM/CLOSED
The shutter can be positioned manually to OPEN, HOLMIUM and CLOSED
(dark current).
Leave this function by switching to OPEN.
ROM/RAM/DISPLAY Tests
ROM/RAM/DISPLAY Tests
The following functions are also performed during power on when both
STATUS and the LINE~ switch are pressed.
ROM TEST (enter)
The ROM checksum is compared with a stored value and the firmware
revision is displayed.
ROM TEST <executing>
( ROM test failed )
Action: Replace the FIM board.
RAM TEST (enter)
The RAM is tested.
RAM TEST <executing>
( RAM test failed )
Action: Replace CMP board.
DISPLAY TEST (enter)
The 32 characters of the display and the LEDs are tested. This test is the
same as performed during power on.
DISPLAY TEST <executing>
Action: If the display shows nothing, check first the soldered in on-board
fuse, see Fluorescent Indicator Module (FIP) on page 472.
Using the Built-in Test Chromatogram
NOTE This function is available from ChemStation only!
The 1050 DAD has a built-in Test Chromatogram that can be used to check
the signal path from the detector to the ChemStation and the data analysis.
See Figure 184 and Figure 185 on page 509. The chromatogram is repeated
continuously until a stop is performed per stop time or manually.
To use the function proceed as follows:
Set peak width to >0.05 minutes and run time to 4.5 minutes.
For a peak width of <0.01 the stop time can be set to 0.6 minutes.
Type into the command line LoadSignal1050DAD INTERNAL.
The detector status goes to Prerun (Test) / Ready.
Start a run.
The results are calculated like a normal chromatogram and the results
can be printed.
The peak height is always the same but the area and the retention time is
depending on the set peak width.
Figure 184 Test Chromatogram: Peak width <0.05
Figure 185 Test Chromatogram: Peak width <0.01
How to print the DAD Profiles
Figure 186 shows the ChemStation screen when having performed the DAD
Test.
Figure 186 DAD Test
Using Paintbrush
Press ALT and Print Screen keys to make screen capture.
Leave the DAD Test and enter Paintbrush from the Program Manager.
Select View and click Zoom Out.
Select Edit and Paste (2x).
Select View and click Zoom In.
Select File, Print and [[OK]].
Using the Data Editor
Select View, Data Analyses.
Select View, Review DAD Test...
Select from the table the spectrum of interest see Figure 187 or Figure 188.
Press [[Show Selected Spectrum]] and select the window. At this point you
may zoom a certain part of the profile.
Select File, Print, Selected Window for print.
Figure 187 DAD Test: Lamp Intensity
Figure 188 DAD Test: Holmium
22
22 DAD/MWD: Maintenance
Information
service and maintenance of the 1050 Diode Array
and Multiple Wavelength Detectors
DAD/MWD: Maintenance
Information
This chapter describes the following procedures that have to be performed
during servicing and maintenance of the 1050 DAD.
removing the optical unit;
flow cell maintenance;
cleaning the quartz window;
replacing fans;
replacing shutter assembly or LUC/LPC board;
replacing the leak sensor;
upgrade to new optical unit;
performance verification.
Tools Needed
Screw driver flat 6 mm
Hex wrench 6 mm
Hex wrench 4 mm and length of 200 mm
Pozidriv small
cleaning tissue
DAD/MWD: Maintenance Information
Warnings and Notes
WARNI NG Dangerous voltages capable of causing serious personal injury are
present in this instrument. Use extreme caution when handling testing
and adjusting.
NOTE DO NOT
open the screws of the large cover of the optical unit. This may result in
misalignments of the optical path.
exchange lamp housing. They are matched to the optical and replacement may
result in a misalignment of the optical path.
return defective exchange optical without information about the problem (use
attached info-note).
return flooded optical without information about the last used solvents (this
is needed for recycling).
NOTE The lamp housing may be hot when you have to work at the optical unit.
Removing the Optical Unit
Turn OFF the instrument and unplug the power.
Remove top cover.
Disconnect flow cell at union holder [2], remove cell from optical unit and
place it in front of the heat exchanger.
Disconnect PDA [6] and Shutter [5] cable at optical unit and the Display
cable at the motherboard (LUM).
Disconnect lamp connector [1].
Disconnect the waste tube [3].
Loosen the three bolts [4] that hold the optical unit (4 mm hex key
> 100 mm long) and take out the optical unit.
1 - deuterium lamp
2 - union holder
3 - waste tube
4 - bolts
5 - connector shutter
6 - connector PDA
Flow Cell Maintenance
Flushing Procedure
To cleaning the flow cell (by using a glass syringe!) perform as described
below:
6 Flush with iso-Propanol.
7 Flush with bi-distilled water.
8 Flush with nitric acid : water (5 : 95).
9 Flush with bi-distilled water.
10 Flush with iso-Propanol
CAUTI ON This concentration of nitric acid is dangerous and proper attention to safety
should be given. Also the nitric acid flushing procedure is not a certain cure
for a dirty cell. It is to be used as a last attempt to salvage the cell before cell
replacement. Note that the cell is essentially a consumable item.
Replacements on Standard Flow Cells
Replacing the Gaskets
Take out the flow cell.
Take a flat screwdriver (6 mm width) or a 6 mm hex wrench and turn out
the flow cell window assembly [1].
In case of an leakage replace the gasket [2].
Fix the flow cell window assembly.
Figure 190 Disassembled Flow Cell
Replacing Window Assembly Parts
Take out the flow cell window assembly (Figure 190, item 1).
Take out the quartz window carefully by pressing it out of the window
holder.
NOTE If the washers have fallen out of the assembly they have to be inserted in the
correct order. Otherwise the window may break or will be leaky see.
Clean or replace the window.
Fix the window assembly.
1 Flow cell window assembly. 2 Window assembly schematic.
3 Assembling of the washers. 4 Assembling of Teflon ring and window
assembly.
1 - window screw
2 - spring washers
3 - compression washers
4 - window holder
5 - quartz window
6 - gasket
Replacements on High Pressure Flow Cells
For cleaning the flow cell windows you will need
a 4 mm hexagonal key (supplied with flow cell)
a 20 mm open-ended wrench
tweezers and
a toothpick.
Figure 191 Cross-section of Window Assembly
5 Replacing flow cell window in window
assembly.
Conical Disk Springs (see
below)
Windows
Detail of Conical Disk
Springs Showing
Orientation
Window Screw
Washer
Washer
Stage 1: Disassembling the Window Assembly
Take flow cell out of optical unit.
Unscrew window assembly (see Figure 191) using a 4 mm hexagonal
key--use a 20 mm open-ended wrench to hold the flow cell.
Carefully take out window using a toothpick or a 4 mm hexagonal key.
Take out the conical disk springs and discard them.
Clean window in ultrasonic bath filled with methanol or ethanol.
Stage 2: Assembling the Window Assembly
Put conical disk springs in window screw see Figure 191. Always use new
conical disk springs.
Press window and seal rings together using tweezers.
Put window and seal rings in window screw. Keep window facing upwards
to prevent it falling out.
Screw window assembly into flow cell until finger tight.
Tighten window assembly using a 4 mm hexagonal key, use a 20 mm
open-ended wrench to hold flow cell.
Check flow cell for leaks.
If you have an 1050 Series pumping system use flow test method
described in Installing and Maintaining Your Pumping System.
Connect inlet capillary of flow cell to pump outlet. Connect blank nut to
outlet capillary of flow cell.
If flow cell leaks tighten window screw and check again for leaks.
Put flow cell in optical unit.
Lamp House Window Maintenance
This procedure can to be performed in case the intensity gets low and lamp
exchange does not increase the light trough put.
Between the lamp housing and the achromat lens system a quartz window is
located to protect the achromat against contaminations.
Removing the Quartz Window
Refer to Figure 192 on page 523.
Take optical unit out of the instrument.
Remove the lamp housing (2 screws).
Remove the securing ring (1) with a pliers.
Take out the spring (2) the aperture (3) and the window (4).
Clean or replace the window.
NOTE Use ethanol or methanol and lens paper to clean the window. DO NOT touch
or scratch the surface of the window. This will result in loss of intensity.
Replace all parts in correct order. Watch for correct direction of the
aperture!
Figure 192 Removing Lamp House Parts
1 = Securing Ring, 2 = Spring, 3 = Aperture, 4 = Window
1 Removing of lamp housing. 2 Removing the quartz window.
Replacing the Achromat
Replacing the Achromat
To replace the achromat assembly proceed as follows:
Switch off the power from the instrument.
Take the optical unit out of the instrument.
Remove the cover plate above the flow cell/shutter compartment.
CAUTI ON Do not touch the AFE connector board!
Unscrew the achromat assembly (hex key) and remove it.
Insert the new achromat assembly completely and fix it.
Replace the optical cover and reconnect the cables.
Reinstall the optical unit and turn on the power.
Perform a WL CALIBRATION TEST and correct the is and should be
values if required (should be within 3 steps from the original value from
step 1). If not within the range, rotate the achromat and repeat this step.
Figure 193 Location of Achromat Assembly
Setscrew
Achromat Assembly
AFE Connector
Replacing Fans
Replacing Fans
Remove top cover and disconnect ALL cables from Motherboard.
Figure 194 Removing Fans
Take out the foam part which contains the fans completely.
NOTE Take care that no connector on the Motherboard breaks when removing or
inserting the foam part.
Note the position of the fan and replace it (arrow on the fan).
Replace foam part carefully into the module.
Connect ALL cables at the Motherboard and replace top cover.
Fan cover not shown
Replacement of Shutter or LPC Board
Replacement of Shutter or LPC Board
In case the shutter assembly or the LPC board shows a malfunction it can be
replaced.
Figure 195 Shutter Assembly
Remove the main cover to have access to optical unit.
Disconnect flow cell and remove it.
Remove slit assembly.
Remove the cover of the optical compartment (5 screws).
Disconnect LPC board from shutter assembly.
Replace shutter assembly or LPC board.
Replace all parts in correct order.
Replacement of Leak Sensor
Replacement of Leak Sensor
In case the leak sensor assembly shows a malfunction it can be replaced.
Remove the main cover to have access to optical unit.
Disconnect flow cell and remove it.
Remove slit assembly.
Remove the cover of the optical compartment (5 screws).
Disconnect leak sensor from LPC board using a pliers.
Replace leak sensor.
Replace all parts in correct order.
Upgrade to from 79854A MWD to G1306A DAD
Upgrade to from 79854A MWD to G1306A
DAD
When upgrading 79854A MWD to DAD capabilities the keyboard and the
firmware board has to be exchanged. For parts list refer to Upgrade Parts
MWD to DAD on page 546.
CAUTI ON Electronic boards are sensitive for electrostatic discharge. Use ESD
protection when replacing electronic boards.
Remove the AQB board.
Update the firmware board (FIM) to DAD version.
Install the AQB board.
Disconnect cable from keyboard electronics (FIP) to LUM (motherboard).
Remove keyboard module from instrument.
Remove metal cover at the rear.
Remove FIP from MWD keyboard module.
Install FIP into DAD keyboard module.
Install keyboard module in the instrument.
Reconnect cables.
Upgrade MWD with Series II Optical
Upgrade MWD with Series II Optical
NOTE For required parts refer to Upgrade Parts MWD to Series II Optical on
page 547.
1 If an AQB board 01048-66543 (latest version) is installed skip step 2 and 3.
2 Check the AQB board for presence of 220 Ohm resistor that is located
between fuse F22 and the rear connector J1 (SN 01050-016). If not exist,
replace.
3 Q1C should be cut out only if the resistor on the AQB, mentioned in
SN 01050-016, has a value of 220 ohms and the firmware has revision 3.
Otherwise the current will be too low to move the shutter correctly
(SN 01050-021A).
4 Install new FIM board (3.10) if required.
5 Install series II optical unit.
6 Install series II flow cell.
7 Reconnect capillaries.
8 Check for leaks.
Verifying the Performance
Specifications
The noise and drift specifications of your detector are 4 x 10
-5
AU and
2 x 10
-3
AU/h respectively at 254 nm, 4 nm bandwidth, 1 second response
time and 1 ml/min flow of water after warm-up.
What You Need
To check these specifications you need:
A pump that can deliver bi-distilled water at a rate of up to 1 ml/min against
a back-pressure of about 200 bar;
A column: we recommend a 100 x 4.6 mm i.d. 5 m Hypersil ODS column.
A recording device that can accept the output signal from your detector
and that has attenuation set to about 35 cm/mV.
Preparations
Prime the pump and ensure there are no air bubbles in the system.
Thoroughly degas about 300 ml of bi-distilled water.
Set pump to deliver bi-distilled water at a flow rate of 1 ml/min.
Set the attenuation of the recording device to about 35 cm/mV.
Set run time to 6.0 minutes.
Turn ON detector and allow intensity of emitted radiation from radiation
source to stabilize.
Set detection wavelength to 254 nm and bandwidth to 4 nm. Set reference
wavelength to 450 nm and bandwidth to 100 nm.
Set peak width to >0.05 minutes.
Set output signal so that 1 AU is equivalent to 0.5V.
Start a run, press [[START]] [[ENTER]].
The baseline noise should not exceed 20 V (4 x 10
-5
AU) equivalent to 12 mm
at attenuation - 3 on a3390/2/3 integrator and equivalent to 24 mm at
attenuation - 3 on a 3394/6 integrator.
Figure 197 Example of Noise Plot
Scaling Factors
The table below shows the scaling factors for the 339XA family of
integrators. The 3390A, 3392A and 3393A have a full scale deflection of
75 mm. The 3394A and the 3396A have a full scale deflection of 150 mm, they
also have an attenuation range between -8 and 36.
Table 121 Scaling Factors on 339X integrators
ATTN mV full scale mAU full scale
-3 0.125 0.25
-2 0.25 0.5
-1 0.5 1
0 1 2
1 2 4
2 4 8
3 8 16
4 16 32
5 32 64
6 64 128
7 128 256
8 256 512
9 512 1024
10 1024 2048
23
23 DAD/MWD: Parts Information
1050 Diode Array and Multiple Wavelength
Detectors
DAD/MWD: Parts Information
listings respectively.
Overall Diagram
Optical Unit
Heat Exchanger and Flow Cell
Flow Cell Kits
Upgrade Parts MWD to DAD
Accessory Kit
Overall Diagram
Overall Diagram
1 Fan Base (set of two) 01048-47701 24 Keyboard Module (DAD) 01048-60202
2 Fan DC Axial 01048-68500 Keyboard Module (MWD) 01048-60201
Fan Cover 3160-0544 25 FIP Board 5061-3376
# 3 Mainframe 26 Cable FIP/LUM 5061-3400
4 Screw M4 20 mm lg 0515-0175 27 Optical Unit see page 538
5 Screw M3.5 8 mm lg 0515-0889 28 Cable PDA/SHUTTER-LUM 5062-2410
6 Foot Rear 0403-0427 29 Heat Exchanger/Flow Cell see page 540
7 Foot Front 5041-2161 30 Cable Lamp/LUM 01048-61603
8 Cover Hinge 5041-2147 # 31 Cover Power Supply 01048-04104
9 PWR Switch Actuator 5041-2162 32 Power Supply Assembly 01050-69375
10 PWR Switch Spring 1460-1510 33 ASC Board Assembly 01048-66501
11 PWR Switch Push Button G1600-47400 34 AQB Board Assembly 01048-69543
#12 Frame + Cover Keyboard (42) 35 FIM Board Assembly (DAD) G1306-66524
13 Filter Part of 16 FIM Board Assembly (MWD) 01048-66504
14 Ring Filter Part of 16 Screw M3 6 mm lg 0515-0886
15 Logo Base/Name Plate 5041-2144/n.a. 36 DAC Board Assembly 01048-66502
16 Front Panel (incl. 13, 14) 01048-60301 37 Plate Cover (33 mm width) 5001-3721
17 Power Switch Base 5041-2145 38 CMP Board Assembly 01050-69580
18 Leak Interface TOP 5062-8551 39 Top Cover 5001-3724
19 Leak Interface BOTTOM Part of 18 # 40 Card Cage Assembly 01048-84501
20 Leak Interface Adapter Part of 18 41 LUM Mother Board Assembly 01048-66510
21 Tube Flexible 6.5 mm i.d. (5 m) 5062-2463 43 Communication Interface Board CRB 5062-2482
22 Tube Flexible 0.7 mm i.d. (5 m) 5062-2462 # These items are part of Sheet Metal Kit 01048-68701
23 Bolt 5041-2164
Overall Diagram
Figure 198 Overall Diagram Part 1 (Series II)
Overall Diagram
Figure 199 Overall Diagram Part 2 (Series II)
Optical Unit
Optical Unit
# These parts are not interchangeable with the previous optical unit design
(Series I).
Table 123 Optical Unit
# Optical Unit - New 01048-60024 # 15 Flow Cell Assembly STD see page 541
# Optical Unit - Exchange 01048-69024 Flow Cell Assembly HP-STD see page 542
# 1 Shutter Assembly 79883-61901 Flow Cell Assembly HP-Micro see page 543
2 Screw M3 6mm lg 0515-0886 Cell Clamp Assembly 79883-85001
# 3 LPC Board Assembly 79883-66509 Screw M2.5 6mm lg 0515-1056
4 Screw M2.5 6mm lg 0515-0894 # 16 Capillary IN 0.17 79883-87303
5 Bolt 5021-1853 # 17 Capillary OUT 0.17 79883-87304
6 RFI Strip 01048-09101 18 Union 0100-0900
7 Damper 5041-2165 19 Clamp Union 79883-00502
8 Deuterium Lamp Assembly 79883-60002 # 20 Screw 0515-0922
9 Screw M3 10mm lg 0515-0757 21 Heat Exchanger Assembly 01048-87305
10 Union Holder 01048-02321 22 Screw M3 8mm lg 0515-0897
11 Screw M3 8mm lg 0515-1430 23 Tubing Flexible 80mm lg 0890-0581
12 Set Screw M3 6mm lg 0515-0031 24 Elbow Fitting (Plastic) 0100-1428
13 Union 0100-0900 25 Leak Sensor Assembly 5061-3356
# 14 Slit Assembly 2 nm 79883-80002 26 Nut M3 0535-0004
Slit Assembly 4 nm 79883-80004 27 Screw M3 8mm lg 0515-1430
Slit Assembly 8 nm 79883-80008 # 28 Cover Illum Compartment 79883-04101
# 29 Achromat Assembly 79883-60000
Optical Unit
29
Figure 201 Heat Exchanger and Flow Cell
Table 124 Heat Exchanger and Flow Cell
1 Heat Exchanger 01048-87305 5 Capillary OUT see flow cell
2 Screw M3 8mm lg 0515-0897 6 Union 0100-0900
3 Flow Cell STD see page 541 7 Clamp Union 79883-00502
Flow Cell High Pressure STD see page 542 8 Screw M2.5 8mm lg 0515-0922
Flow Cell High Pressure Micro see page 543 Capillary Column/MWD (60 cm lg
0.17 mm i.d.)
01048-87302
4 Capillary IN see flow cell
Since 1992 with two
welded ZDV
Flow Cell Parts (STD-SST)
Flow Cell Parts (STD-SST)
Figure 202 Flow Cell Parts (STD-SST)
Table 125 Standard Flow Cell
Flow cell SST 6 mm, 8 l 79883-60051 5 Compression Washer 79883-28801
Flow cell SST 10 mm, 13 l 79883-60052 6 Washer (pack of 10) 5062-8553
Cell Repair Kits see page 544 7 Window Screw 79883-22402
Capillary IN 0.17, 100 mm lg 79883-87303 8 Cell Clamp Assembly 79883-85001
Capillary OUT 0.17, 150 mm lg 79883-87304 Screw M2.5 x 4 mm lg (cell body) 0515-1056
1 Window Assembly
consists of 3, 4, 5, 6, 7
Clamp Union 79883-00502
Screw M2.5 x 8 mm lg (clamp) 0515-0922
2 Cell Gasket see page 544 Wrench 4 mm for fittings 8710-1534
3 Window Quartz 1000-0488 Hex Key 6 mm for cell screw 8710-2023
4 Window Holder 79883-22301
High Pressure Flow Cell Parts (HP-STD-SST)
High Pressure Flow Cell Parts
(HP-STD-SST)
Figure 203 High Pressure Flow Cell (HP-STD-SST)
Table 126 High Pressure Flow Cell
High Pressure Flow Cell 79883-60054 5 Washer (pack of 10) 5062-8553
Cell Repair Kits see page 544 6 Window Screw SST 79883-22404
1 Window Assembly
Cell IN 50 .17, 100 mm lg 79883-87303
Cell OUT 50 .17, 150 mm lg 79883-87304
2 Seal ring HP 79883-27101 Hex Key 6 mm for cell screw 8710-2023
3 Window Quartz HP 1000-0953 Wrench 4 mm for fittings 8710-1534
4 Compression Washer HP 79883-28802
High Pressure Flow Cell Parts (HP-Micro-SST)
High Pressure Flow Cell Parts
(HP-Micro-SST)
Figure 204 High Pressure Flow Cell (HP-Micro-SST))
Table 127 High Pressure Flow Cell
Micro Flow Cell 1.7 l 79883-60055 5 Washer (pack of 10) 5062-8553
Cell Repair Kits see page 544 6 Window Screw SST 79883-22404
1 Window Assembly
Cell IN 50 .17, 100 mm lg 79883-87303
Cell IN .12, 100 mm lg 79883-87305
2 Seal ring HP 79883-27101 Cell OUT 50 .12, 370 mm lg 79883-87306
3 Window Quartz 1000-0953 Hex Key 6 mm for cell screw 8710-2023
4 Compression Washers HP 79883-28802 Wrench 4 mm for fittings 8710-1534
Cell Repair Kits
Cell Repair Kits
Table 128 Cell Repair Kits
Description contains (Qty) Part Number
Cell Repair Kit 79883-68701
Seal Kit 79883-68702
Cell Screw Kit 79883-68703
Seal Kit Cell Gasket (12) 79883-68702
Cell Screw Kit 79883-68703
Window Quartz (2) 1000-0488
Compression Washers (2) 79883-28801
Window Holder (2) 79883-22301
Window Screw (1) 79883-22402
Spring Washers (10) 5062-8553
Cell Kit High Pressure 79883-68700
Window Quartz HP (1) 1000-0953
Spring Washers (10) 5062-8553
Seal ring HP (2) 79883-27101
Lamp Housing
Lamp Housing
Figure 205 Lamp Housing
Table 129 Lamp Housing
1 Retaining Ring 0510-1219
2 Spring Compression 1460-2254
3 Aperture 79883-24601
4 Window 79880-28111
The following parts are required to upgrade a 1050 MWD (79854A) to 1050
DAD (G1306A).
Table 130 1050 Upgrade Parts MWD to DAD
Description Part Number
Firmware Board FIM G1306-66524
Keyboard (plastics) 01048-60202
Installation Note see Upgrade to from 79854A MWD
to G1306A DAD on page 528
Upgrade Parts MWD to Series II Optical
Upgrade Parts MWD to Series II Optical
The following parts are required to upgrade a 1050 MWD (79854A) to 1050
MWD Series II optical.
Table 131 Upgrade Parts MWD to Series II Optical
Optical Unit 79883-60024
Firmware Board FIM
01048-66504
*
Slit assemblies as required see Optical Unit on page 538
Flow cell as required see Flow Cells
Resistor for AQB board modification
220 Ohm 5% 2W
0698-3628
**
or
AQB board (latest version) 01048-69543
*
Only required, if firmware revision is < 3.1.
**
Only required if AQB board does not have the resistor that is located between fuse F22 and the rear
connector J1 (SN 01050-016).
List of Accessories
List of Accessories
The following list shows parts that were part of the STD Accessory Kit.
Please order by item if required.
Table 132 Accessories
Hex Key for flow cell 8710-2023
Capillary Column/MWD 0.17 mm i.d. 800 mm lg 01048-87302
Crimp Terminals 0362-0321
Screw M3 6 mm lg 0515-0886
Tube Flexible 0.7 mm i.d. (re-order 5 m) 5062-2462
CONT CONN UTIL F 1251-3911
CONN UTIL 2PIN F 1251-4782
Fuse 2 A 250 V NTD 2110-0002
Fuse 3 A 2110-0003
Fuse 250 V 0.25 A NB 2110-0004
Ferrule 5041-2121
Gripper 5041-2122
Male 5041-2123
Buffer Disc 5041-2124
Wrench 5/16-1/4 8710-0510
Screwdriver POZI 1 PT 3 8710-0899
Hex Key 3 mm 8710-0911
Hex Key 6 mm for cell screw 8710-2023
24
24 DAD/MWD: Additional
Information
DAD/MWD: Additional
Information
This section gives the following informations:
Hardware changes
Firmware changes
Known Problems
DAD/MWD: Additional Information
Product History
Product History
The introduction of the 79854A Multiple Wavelength Detector was in 1988.
The introduction of the G1306A Diode Array Detector was in 1993.
The following hardware and firmware changes have been implemented.
Hardware Changes
Table 133 Hardware Changes
Date Serial Number Change
1990 3016G.... Introduction of Series II optical
Jul 1992 Introduction of new cell screw design for
Series II flow cells. 6 mm hexagonal key
instead of screw with slit.
Nov 1992 Introduction of High Pressure Cell with 13 l
and 1.7 l for 400 bar operation (for Series II).
Oct 1993 3343G00938 New AQB board, same for 79854A MWD,
G1306A DAD and G1600A CE.
Apr 1994 Introduction of Fan Cover and new part
number for fans
Apr 1994 3414G00321 New Firmware 1.10 (see Firmware Changes
on page 552).
May 1994 3423G../3423A... Introduction of n-MOS optical units.
Jul 1994 Change on ASC board (delay time of
amplifier), revision D-3444.
Dec 1995 DAD New Firmware 1.20 (see Firmware Changes
on page 552).
May 1997 DAD New Firmware 1.30 (see Firmware Changes
on page 552).
Firmware Changes
Firmware Changes
Table 134 DAD Firmware Revisions
Revision Major Changes Comments
1.00 First official release for G1306A
1.10 Instrument checks for lamp overflow
before WL calibration and returns an
error message (RE3001) if lamp
overflow occurs.
Essential for optical used in Capillary
Electrophoresis instruments.
FIM board same in G1306A and
G1600A (CE)
1.20 added fraction collection for G1600A
(CE)
same in G1306A and G1600A (CE)
1.30 for use with new ChemStation
Software
same in G1306A and G1600A (CE)
Table 135 MWD Firmware Revisions
1.00 No GPIB communication First official release for 79854A
3.00 GPIB communication for HPLC
ChemStation.
Showed some GPIB communication
problems. Should be replaced
with revision 3.1 (01048-66504).
3.10 GPIB communication problems solved Replaced version 3.00 (01048-66504).
Known Problems
Known Problems
Panic Errors
Intermittent PANIC errors are mostly generated by spikes (disturbances) on
the bus lines. A dynamic bus termination has been added to the FIM board to
suppress the spikes and to reduce the possibility of this failure mode.
All FIM boards with revision C and higher do have the dynamic bus
termination installed (RC-network instead of R-network).
In case of intermittent PANIC errors replace FIM boards (revision A or B)
with the current version.
Known Problems
In This Book
only.
1050 Series of HPLC

Modules
Service Handbook -
Variable Wavelength
Detector (79853C)
76337 Waldbronn
Germany
Copyright Agilent
Technologies 2001
allowed under the
copyright laws.
Part No. NONE
11/2001
Printed in Germany
Warranty
The information
contained in this
this material,
including, but not
warranties or
merchantability and
purpose.
IMPORTANT NOTE
01050-90102 edition 4
(1995).
information (79854A
MWD) and the 79853A
VWD information has
been removed (products
went out of support
during 2000).
Contact your local
case of part number
issues or upgrades.
web page
www.agilent.com.
25
25 VWD: General Information
the 1050 Variable Wavelength Detectors
VWD: General Information
about this detector
repair policy
specifications
About the Detector
About the Detector
The 1050 Variable Wavelength Detector (VWD) is a detector of the modular
type liquid chromatograph 1050 Series. This is a standalone
grating/photodiode type general purpose detector. The performance and
features match the requirements of the routine analysis and QC/QA analysis.
The 1050 VWD is a standard size detector of 1050 modular type LC series and
can be build up with other LC modules, such as pump and automatic sampler.
Since it is standalone type, it can be also used as an ordinary LC detector. It
has a functional keyboard and 16-character fluorescent display which
provides you easy operation.
Versions vs. Support Periods (EOS)
79853A
The 79853A VWD was shipped between May 1988 and January 1992. The
support with parts ended November 1, 2000.
79853C
The 79853C VWD replaced the model 79853A VWD in January 1992. The
end of support (EOS) will be August 1, 2006 with all 1050 series HPLC
modules.
The 79853C VWD got a redesigned optical unit (D enhanced optical, see
VWD: Enhanced Optical Unit Information on page 705) that replaced the
original C optical unit in June 1995. The end of support (EOS) for the C
optical unit parts will be August 1, 2006 with all 1050 series HPLC modules.
Repair Policy
Repair Policy
The 1050 VWD is designed that you can access all components easily. You can
recalibrate wavelength using control functions. Customers are able to
maintain certain parts of the 1050 VWD see Operators Handbook.
For details on repair policy refer to Repair Policy on page 38 in chapter
1050 Common Information.
Specifications
Specifications
Table 136 Specifications of 79853C VWD
Detection Type Double beam photometer.
Noise
< 1.5 x 10
-5
AU peak-to-peak at 254 nm, flowing
water at 1 ml/min, 1 second response time (10-90%),
standard flow cell.
Drift
< 5 x 10
-4
AU/hour at 254 nm after warm-up.
Wavelength Range 190 - 600 nm, settable in 1 nm increments.
Wavelength Accuracy 2 nm.
Wavelength Reproducibility 0.3 nm.
Bandwidth 6.5 nm.
Linear Absorbance Range Better than 1% up to 1.2 AU using acetone at 265 nm.
Response Time 0.25, 1 or 4 seconds (10-90%); user-selectable.
Spectra Storage of 1 spectrum during run; scan rate
10 nm/sec; range from 190 to 600 nm, selectable.
Post-run plotting speed from 1 to 50 nm/sec
selectable; plotting of background-corrected
spectrum.
Light Source Deuterium lamp from 1090/40/50 DAD.
Flow Cells Standard 14 l volume, 8 mm pathlength cell with
40 bar (588 psi) pressure maximum. Optional micro,
preparative, high-pressure cells are available.
Display Single line, 16 character fluorescent display with real
time display of operating parameters and/or
absorbance.
editing during run possible; keyboard lock; optional
control by computer or 3396 Series II integrator.
Specifications
Parameters Wavelength, output range, response time, zero,
offset, balance, spectrum acquisition.
Diagnostic Aids Wavelength calibration check with Holmium oxide
filter.
Time-programs Time-programmable wavelength and output range;
storage of up to 5 time-programs.
Analog Output One output user-configurable as recorder or
integrator. For recorder: 100 mV or 1 V output range
from 0.001 to 4 AU, user-selectable; for integrator:
100 mV/2 AU full scale or 1 V/2 AU full scale,
user-selectable.
Communications START (input/output), STOP (input/output), READY
(output), SHUTDOWN (output) for synchronization
with other LC modules.
front-panel LEDs. Leak detection, safe leak handling,
leak output signal for shutdown pumping system. Low
voltages in major maintenance areas.
Environment Temperature range: 5 to 55C
Humidity: < 95% (non-condensing)
Dimensions Height: 133 mm ( 5.2 inch)
Width: 325 mm (12.8 inch)
Depth: 545 mm (21.5 inch)
Weight: 14 kg ( 31 lb)
Table 136 Specifications of 79853C VWD
26
26 VWD: Hardware Information
about the 1050 Variable Wavelength Detectors
VWD: Hardware Information
Overview
NOTE The information in this chapter is based on the original optical unit (version
C). In June 1995 this optical was replaced by the enhanced version D to
overcome baseline stability problems in unstable environments.
For details on this D version refer to section Enhanced Optical Unit
Information VWD: Enhanced Optical Unit Information on page 705.
Figure 206 on page 567 shows the block diagrams of the 1050 VWD 79853C.
The main components are:
Table 137 Main Components Overview
Component Purpose
Power Supply (DPS-A) provides all voltages within the instruments
Detector Controller Board
(DCB)
controls power supply, grating stepper motor,
cutoff filter, keyboard, display and GPIB
interface. It processes the signals coming
from the pre-amplifier boards (sample and
reference), the information from the grating
and filter position sensor, leak sensor, remote
control lines and the GPIB interface.
Optical Unit contains all optical parts
Keyboard/Display entry and display of parameter
GPIB Interface communication with external controllers via
GPIB
Overview
Figure 206 Block Diagram of VWD
Optical System Overview
Optical System Overview
Figure 207 shows the optical diagram of the 79853C VWD. The radiation from
the deuterium lamp is focused on a spherical mirror (M1). The light beam
passes then a plane mirror (M2) the cutoff filter, the entrance slit, a spherical
mirror (M3), the grating, again a spherical mirror (M4), a beam splitter and
the flow cell to the sample diode. The beam through the flow cell is absorbed
depending on the solutions in the cell, where UV absorption takes place. The
intensity is converted to an electrical signal by means of the sample
photodiode. Part of the light is directed to the reference photodiode by the
beam splitter to obtain reference signal for compensation of intensity
fluctuation of the light source. A slit in front of the reference photodiode
focusses the light. Wavelength selection is made by rotating the grating,
which is driven directly by a stepper motor. This configuration allows fast
change of the wavelength. The cutoff filter is moved into the lightpath above
370 nm to reduce higher order light.
Figure 207 Light Path of Detector
Leak Interface Assembly
Leak Interface Assembly
To route waste from a module standing above the 1050 VWD to a module
below a leak interface can be installed at the detector. It is part of the
accessory kit.
Figure 208 Leak Interface
A drain is located at the bottom of the cell compartment and can be led to the
waste container or the 1050 waste handling system (the VWD has to stand on
top of another module when the leak interface is not used).
A leak sensor is located behind the front panel assembly (Figure 209).
Solvent would cool the leak sensor (self heating thermistor). The resulting
change in resistance, measured by comparators on the Detector Controller
Board (DCB), would generate an error message and switch the deuterium
lamp OFF.
NOTE In the 1050 System remote mode the leak message will turn off the pump.
Fan Assemblies
Fan Assemblies
The instrument is equipped with two fans.
On the 79853C VWD, the fans are of different type:
The fans are connected to +24 VDC on the DCB Board.
HIGH type this fan is located close to the lamp housing and runs
with a higher speed
LOW type this fan is located at the rear under the GPIB interface
and runs with a lower speed
Optical Unit
Optical Unit
The Optical Unit houses all parts, from the deuterium lamp to the photodiode
pre-amplifiers.
NOTE The repair level is component.
The optical unit is also available as assembly.
Optical Unit
Flow Cells
There are several flow cells available as stainless steel or as titanium version,
see Table 138 on page 574. The flow cell (Figure 211) can be exchanged
easily. No adjustments are necessary. After disassembling of the flow cell,
gaskets and windows can be replaced (refer to section Flow Cell
Maintenance on page 655).
There are several kits set up with replacement parts like gaskets and
windows, see Standard Flow Cell C (SST/Ti) on page 693 and the
following pages.
Figure 211 STD Flow Cell
NOTE At the outlet of the flow cell a defined peek capillary (from the accessories
must be connected to build up a certain back pressure (noise reduction). See
Standard Flow Cell C (SST/Ti) on page 693 and the following pages for
parts.
Optical Unit
NOTE The gaskets, windows and rings are not compatible with the high pressure
Cell (79853-60009 - OBSOLETE) that has been replaced by the ultra high
pressure Cellflow cell (79853-60013). See Ultra High Pressure Flow Cell
(SST) on page 697 for details.
Table 138 Flow Cell Data
STD
(SST)
UHP
(SST)
MICRO
(SST)
STD
(TI)
PREP
(TI)
Maximum Pressure 40 400 40 40 40 bar
Pathlength 8 8 5 8 VAR mm
Volume 14 14 1 14 VAR l
Inlet i.d. 0.25 0.25 0.10 0.25 0.80 mm
Inlet length 555 555 555 555 67 mm
Outlet i.d. 0.25 0.25 0.25 0.25 0.80 mm
Outlet length 67 67 67 67 100 mm
Outer diameter 1/16 1/16 1/16 1/16 1/16 inch
Used materials for SST flow cells: SST, quartz and PTFE or Polyimide HP cell
Used materials for TI flow cells: TI, quartz and PTFE
STD Standard Flow Cell
HP High Pressure Flow Cell (replaced by UHP early 1993)
UHP Ultra High-Pressure Flow Cell (replaces HP early
1993), see details on Ultra High-Pressure Flow Cell
on page 575.
PREP Variable Preparative Flow Cell with volume of 0.9, 1.8,
4.4 or 8.8 l depending on which gasket is used.
MICRO Semi Micro Flow Cell
Optical Unit
Ultra High-Pressure Flow Cell
Typical applications of the high-pressure flow cells are:
Hyphenated systems (LC-MS)
Supercritical Fluid Chromatography (SFC)
Multidetector systems
Narrow-bore column applications
The main difference between the standard and high-pressure flow cells is the
design of the window assemblies. The high-pressure flow cells have different
windows, seal ring and gaskets, see Figure 212. The seal rings support and
hold the window and at the same time form the high-pressure seal.
NOTE The gaskets, windows and rings are not compatible with the high pressure
Cell (79853-60009 - OBSOLETE) that has been replaced by the ultra high
pressure Cellflow cell (79853-60013). See Ultra High Pressure Flow Cell
(SST) on page 697 for details.
The following materials are in contact with solvents: Stainless steel
(AISI 316), Quartz, Kapton
polyimide (Kapton is a registered trademark of

DuPont).
Recommended pH range: 2.3 to 9.5
Table 139 Correction factors for 79853C flow cells
Flow cell type Cell volume Part number
Path length
(nominal)
Path length
(actual)
Correction
factor
Standard flow cell 14 l 79853-60000 8 mm 8.00 0.19 mm 8/8.05
Standard flow cell TI 14 l 79853-60011 8 mm 8.00 0.19 mm 8/8.00
Micro flow cell 1 l 79853-60010 5 mm 5.00 0.19 mm 5/5.00
Ultra High pressure flow cell 14 l 79853-60013 8 mm 8.00 0.19 mm 8/8.00
Optical Unit
Figure 212 Exploded Diagram of High-Pressure Flow Cell
Deuterium Lamp
On the 79853C VWD, the deuterium lamp (Figure 213) is the high intensity
lamp (79883-60002), which is same as in the 1040/90/50 series Diode Array
Detectors.
The reduction of energy emission of the lamp (Figure 214 on page 577) is
time and wavelength dependent and is significantly higher within the first
days and for wavelengths in the ultra violet range compared to the visible
range (change in transmission of lamp glass).
Usually, the response maximum of the lamp is near 230 nm, but can be
shifted to a higher wavelength for an aged lamp. It has no relevance for
intensity degradation at other wavelengths.
The deuterium lamp filament is heated only during the ignition phase. The
deuterium lamp can be exchanged easily. The lamp needs no adjustments.
Optical Unit
Figure 213 Deuterium Lamp
Figure 214 Intensity Degradation of Lamp (79883-60002)
Measured wavelength is 230 nm
initial intensity about 20% higer than 79880-60002
decrease in intensity is less with use
Optical Unit
NOTE The lamp should be replaced only if the following two criterias are both
fulfilled:
Baseline Noise (with test cell) has increased significantly.
Amount of counts of the lamp (with test cell) has decreased to less than 50%
of the count record of this same lamp when newly installed).
The decision to replace the lamp due to criterium 2 alone is not relevant,
because the signal/noise may be still within instrument specifications.
Optical Unit
Photodiodes Assemblies
Two photodiode assemblies (Figure 215) are installed in the optical unit. The
sample diode assembly is located at the right side of the optical unit. The
reference diode assembly is located in the front of the optical unit.
NOTE Neither, the diodes nor the pre-amplifier boards are interchangeable.
NOTE Refer to Replacing Pre-amplifiers or Photodiodes on page 667 for cleaning.
Figure 215 Photodiode Assemblies
sample diode reference diode
Optical Unit
Filter Assembly
On the 79853C VWD (Figure 216), the Filter Assembly has a three filters [1]
installed and is processor controlled. It can move into four positions:
A photo sensor [3] determines the correct position.
NOTE Refer to Replacing Filter Assembly Parts on page 670 for cleaning.
Figure 216 Filter Assembly
OPEN nothing in lightpath at wavelength < 370 nm
CUTOFF cut off filter in lightpath at wavelength > 370 nm
DARK 0 order calibration filter to reduce the light throughput to the
photodiode during grating calibration at 0 order light
HOLMIUM holmium filter for grating motor alignment
Optical Unit
Grating Assembly and Motor
The Grating has 1200 lines/mm and is directly rotated by the Grating Drive
Stepper Motor, depending on the wavelength entry. The whole range
(190...600 nm) is equal to 1238 steps (15.5). The step angle of the stepper
motor rotation is 3.75 and is reduced to 1/300 by a gear mounted directly to
the motor shaft. The stepper motor is controlled and driven by the Detector
Controller Board (DCB). The stepper motor reference position is determined
by a plate fitted on the motor shaft interrupting a beam of a photo sensor.
The wavelength calibration of the grating is done at the 0 order light position
and at at 656 nm, which is the emission line of the deuterium lamp.
If the motor assembly has to be exchanged it is necessary to do a
compensation of motor tolerances. Refer to Replacing Grating Assembly
Parts on page 668.
Figure 217 Grating Asembly
NOTE The grating is coated with magnesium fluoride. The grating surface should not
be touched or cleaned (see also Replacing Grating Assembly Parts on
page 668). This will destroy the surface and reduce the light reflection.
Optical Unit
Mirrors
The instrument contains four mirrors (M1, M2, M3, M4). Three of them are
spherical type, one plane. On M2, M3 and M4 the beam height is adjustable.
Mirror M3 and M4 are identical.
NOTE The mirrors are coated with magnesium fluoride. They should not be touched
or cleaned (see also Replacing Mirrors, Beamsplitter and Slits on
page 670). This will destroy the surface and reduce the light reflection.
Slit Assemblies
The instrument has two slit assemblies. The first slit is located at the light
entry into the main optical compartment and focused the light on mirror M3.
The second slit is in front of the reference diode.
Beam Splitter
The beam splitter splits the light beam. One part goes directly to the sample
diode. The reference diode gets the other part. The height of the light beam is
adjustable.
Refer to Replacing Mirrors, Beamsplitter and Slits on page 670 for
cleaning.
Enhanced Optical Unit (D)
In June 1995 this original optical unit was replaced by the enhanced version
D to overcome baseline stability problems in unstable environments.
27
27 VWD: Electronic Information
VWD: Electronic Information
This chapter gives information about the electronic of the 1050 Variable
Wavelength Detector:
Overview
Interconnection Diagram
Detector Controller Board (DCB)
Keyboard/-electronics
Pre-amplifier Boards
Power Supply Connection Board (PSC)
GPIB Communication Interface
Location of Electronic Assemblies
In the 1050 VWD, the following electronic assemblies are available (for item
numbers refer to Figure 218 on page 588):
Table 140 Electronic Assemblies
Item Description
1 GPIB Interface
Firmware ROM GPIB
2 Fan Assembly (LOW)
3 Fan Assembly (HIGH)
4 Connection Board (PSC)
5 Deuterium Lamp Assembly
6 Sample Diode Assembly (SDA)
6 Pre-Amplifier Board SAMP
7 Display Interface Board (KDI)
7 Display Module (VFD)
8 Leak Sensor Assembly
9 Reference Diode Assembly (RDA)
9 Pre-Amplifier Board REF
10 Controller Board (DCB)
11 Firmware ROM DCB
12 Power Supply Assembly (DPS-A)
Figure 218 Location of Electronic
Figure 219 Interconnection Diagram
Repair Level: EPROM and Board
NOTE If the DCB board is replaced by 79853-66511 version, the PSC board MUST be
changed to 79853-66512.
Main Functions The main functions of the Detector Controller Board (DCB) are:
Table 141 Part Numbers for DCB
tem Part Number Comment
DCB (Exchange) 79853-69511 for use with PSC -66512
DCB 79853-66511 for use with PSC -66512
DCB 79853-66506 (OBSOLETE) for use with PSC -66509 (OBSOLETE)
Firmware ROM DCB 79853-13005
CPU
signal processing display
analog output
digital input/output
A/D conversion
D/A conversion
control of Optical Unit deuterium lamp ignition
grating movement
filter movement
leak detector
remote control
Figure 220 Block Diagram DCB
Digital Section
CPU A 8-bit 1-chip Microprocessor 7810 is used as CPU. The 7810 includes
256 byte-RAM, 8 channel 8-bit A/D Converter, 16-bit timer/event counter,
2-channel 8-bit timer and two 8-bit I/O Ports. The Data Bus is 8-bit
multiplexed with the address.
ROM/RAM/EEPROM The ROM contains the firmware of the the detector and can be exchanged
separately. In addition to the built-in functions, the 7810 has 64 Kbyte| of
external memory address and 32 Kbyte-ROM, 8 Kbyte-SRAM and 2
Kbyte-EEPROM are added.
The EEPROM contains:
the time program;
the grating calibration constant;
D/A converter calibration constant;
parameters set by key input (wavelength, range, response time, mode).
Clock The main clock (24 MHz) is divided and distributed to:
After the power turns on, for about 100 ms the RESET signal is supplied to
CPU, GPIB Controller and Key/Display controller. Also, anytime when power
voltage becomes less than 4.7 V, the RESET signal is generated. The CPU
controls directly the Buzzer and the Stepper Motor Driver to move the filters
on the filter assembly.
The stepper motor for the grating, the input and the output port are
connected to the internal BUS (DATA ADDRESS and CONTROL) and are
controlled by the CPU. The grating motor and the filter motor are driven by a
motor controller IC and phase pattern are coming from CPU.
24 MHz A/D Converter Count Pulse
12 MHz CPU Clock
6 MHz D/A Converter Count Pulse
3 MHz GPIB Controller, Key/Display
Controller Clock
1.2 KHz A/D Converter Integration
period
Figure 221 Block Diagram DCB - Digital
Analog Sections
Signal Processing The light beam from the SAMPLE and REFERENCE enters the photodiode
respectively. Its current output is converted into a voltage by pre-amplifier.
The gain of the pre-amplifier can be changed into four stages with CPU
control.
The voltage signal from the pre-amplifiers are multiplexed and converted into
digital form by a 18-bit A/D Converter. The conversion time of A/D Converter
is 25 ms and is performed cyclically in the order of
Zero Sample-Reference
(Zero=GNDA)
Electrically zero calibration is done while balancing.
Digital data is transmitted to the CPU, digitally filtered based on response
time and converted into the absorbance unit using the equation shown
below:
The input voltage range of the integrator is -0.5..+9.5 V.
AU
10
REF ( ) log
10
SAMP ( ) log =
Figure 222 Block Diagram DCB - A/D Conversion
A/D Converter Method for the A/D conversion is feedback type Pulse Width Modulation
(PWM).
Figure 223 A/D Converter
Positive or negative reference voltage is alternately added to the integrator.
Duty cycles of each reference voltage is controlled by the output of a
comparator connected to the output of integrator. Input voltage (U1) is
converted to pulse width so that sum of both reference voltages is balanced
with the U1. Clock voltage and ES control this system and determines the
period. The sum of clock voltage in one cycle is set to zero.
Pulse width, which is proportional to input voltage U1, is counted and is
converted into a digital output.
The A/D converter has 18 bits resolution with 25 ms conversion time.
D/A Converter D/A converter combines a Pulse Width Modulator (PWM) and a 12-bit DAC.
The lower 4 bits of the DAC pulse width modulated with 12 bit resolution is
added to the upper 8 bits of the DAC. The upper 8 bits are also modulated by
fixed pulse width so that the lower 4 bits balances to LSB of the upper 8 bits
(pulse width is 15/16). The lower 4 bits are scaled to each bit of the upper 8
bits when using 44:DAC CALIBRATION. The output of the 12-bit DAC is
passed through a low-pass filter and 20-bit resolution analog signal is
outputted to the BNC Connector. The cutoff frequency of a low-pass filter is
set at 17 Hz while conversion frequency is 183 Hz.
Figure 224 D/A Conversion
Signal Output The signal output is classified into three types: Display Out, Analog Out,
Digital In/Out.
Display Out The display module receives ASCII codes via Keyboard Interface Board via
the Data Bus. On the Display Module, the ASCII code is converted to display
code and gives output on fluorescent display with 5 x 7 dots and 16
characters.
Signal (Analog) Out The Signal (Analog) Out is available at a BNC connector at the rear of the
instrument. It is generated by 20-bit D/A converter. The conversion cycle of
the D/A converter is about 5.5 ms. The output of the D/A converter is filtered
by a low-pass filter. The output can be switched to:
Digital In/Out The digital signal is delivered to the GPIB Interface (option) via the Data Bus
and is converted into an GPIB signal.
Control of Deuterium
Lamp
The deuterium lamp is ignited using Anode Current, Trigger Voltage and
Heater Voltage supplied from the Power Supply Unit. The ignition
procedures are controlled by the CPU signal. The heater voltage is switched
from 2.5 V during ignition to 0 V after ignition.
Full Scale Output Impedance
1 V 1000 Ohm
0.1 V 100 Ohm
Control of Grating
Assembly
The wavelength is set by rotating the grating with a 2-phase stepper motor.
The step angle of the stepper motor rotation (1 step angle 3.75) and is
reduced to 1/300 by a gear. The stepper motor is controlled and driven by
DCB. The CPU contrls the motor controller IC that drives the motor. Stepper
Motor reference position is determined by a plate fitted on the swing arm
interrupting a beam of photo interrupter. The output signal of the photo
interrupter is read by a 8-bit ADC of the CPU.
Control of Filter
Assembly
The rotation of stepper motor controls the insertion of a diffterent filters into
the light path (cutoff, holmium, light reduction).
The stepper motor is controlled and driven by DCB. The CPU controls the
motor controller IC that drives the motor.
Remote Control The REMOTE connectors communicate start or stop, error and not ready
signal inputs and outputs.
For detailed description of remote control refer to the 1050 Service
Handbook, chapter Common Information.
NOTE When the 79853C VWD is used in a system which is connected via remote, the
VWD should be switched on as first module. Otherwise it may influence other
modules at power on.
Leak Detection The leakage from a flow cell is detected by change of Thermal Radiation
Constant of NTC thermistor. Wheatstone bridge is constructed from NTC
thermistor and resistors on the DCB. Its supply voltage is varied by
controlling 24 V-power with Switching Regulator controller. The supply
voltage is controlled to keep the thermistor at about 150 Ohm (150C)
constantly. If leakage occurs and the thermistor is soaked in the leaked
liquid, the thermal radiation constant are changed and gives higher supply
voltage at both ends of wheatstone bridge. This change is read by the CPU
and compensated with ambient temperature.
Error condition is when LS > LL. The values are visable with
33:LEAK TEST.
Figure 225 Block Diagram - Leak Detection
Change in Thermal Radiation Constant with surrounding temperature change
is compensated by second NTC thermistor having same characteristics.
Figure 226 Board Layout DCB
Table 142 Test Connector J16
Pin Purpose Pin Purpose Pin Purpose Pin Purpose Pin Purpose
1 Photocurrent
REF
2 Photocurrent
SAMP
3 +15 V 4 -15 V 5 Digital GND
6 +5 V 7 A/D Clock
1.2 kHz
8 Ref Voltage
+10 V
9 Analog GND 10
Repair Level: Fuses and Exchange DPS-A
For detailed information on the power supply refer the 1050 Service
Handbook, chapter 1050 Common Information.
Lamp Ignition
always. After ignition a different output voltage is selected depending on the
lamp type used: In the 79853C VWD the heater is switched off after ignition.
Table 143 Part Numbers for DPS-A
Item Part Number
DPS-A (Exchange) 01050-69375
DPS-A (New) 5061-3375
Keyboard
Keyboard
The flat keys at the front panel is composed of 6 x 4 matrix. Data is read by
scanning at Key/Display Controller on the Keyboard Display Interface Board.
Key entry is checked by reading the status of the controller by the CPU at
every 10 ms. The Key/Display Controller also controls LED lamp lighting.
Figure 227 Keyboard
Keyboard
Keyboard Electronics (KDI / VFD)
Repair Level: Board
Behind the frontpanel two electronic boards are located: Keyboard Interface
Board (KDI) and the Display Module Board (VFD).
Keyboard Display
Interface
The Keyboard Interface Board (KDI) is connected to the DCB board and
contains:
interface between key-matrix (6 x 4) and DATA bus
LED driver for the status messages ERROR, NOT READY, LAMP and RUN
buzzer.
Display Module The Display Module Board (VFD) is connected to the KDI and contains:
CPU for control of latch driver
latch driver for the Vacuum Fluorescence Display (FLD)
DC/DC converter to provide the voltages for the FLD.
Refer to Replacing Display Boards on page 662, when replacing this
board.
Table 144 Part Numbers for Keyboard Electronics
Item Part Number
Keyboard Display Interface (KDI) 79853-66502
Display Module Board (VFD) 79853-66503
Keyboard
Figure 228 Block Diagram of Keyboard Electronics
Pre-Amplifier Boards
Pre-Amplifier Boards
Repair Level: Board
The light (absorbtion) from the deuterium lamp (flow cell) is detected by the
sample and the reference photodiode. Its current is then amplified by the
pre-amplifiers. The signal then is routed to the DCB.
The wires from the photodiodes are soldered onto the board.
Figure 229 Photodiode Assemblies
Table 145 Part Numbers for Pre-Amplifiers
Item Part Number
Pre-Amplifier Board Sample 79853-66507
Pre-Amplifier Board Reference 79853-66508
Sensor Sample 79853-61109
Sensor Reference 79853-61110
Sample Reference
Repair Level: Board
NOTE If the DCB board is replaced by 79853-66511 version, the PSC board MUST be
changed to 79853-66512.
This board connects the Power Supply DPS-A with the DCB and the
Deuterium Lamp Assembly. The wires of the lamp cable are soldered in.
Figure 230 Board Layout PSC
Table 146 Part Numbers for PSC Board
Item Part Number
PSC Board (for DCB -66511) 79853-66512
PSC Board (for DCB -66506 OBSOLETE) 79853-66509 OBSOLETE
Repair Level: Board, Firmware
Parallel Interface Dual direction transceiver for data bus between master and slave CPUs. 8 bit
aux code from DCB to GPIB board. 3 bit control code from GPIB board to
DCB
Microprocessor Single chip microprocessor with 1 Mbyte address capability, 512 byte internal
RAM and 32 I/O ports.
Memories 32 Kbyte of ROM for program memory and 128 Kbyte RAM for the run buffer.
Firmware Description The GPIB board performs all interruption processing from the GPIB
controller. DCB and GPIB board communicate with hardware interrupts.
Receiving GPIB commands the GPIB board passes them to the DCB with 3
bit control code. This control code shows the kind of bus data such as GPIB
commands, error codes or requesting data code and whether the data ended
or not. During run or monitor mode the DCB send chromatogram data
immediately to the GPIB board with 8 bit aux code. This aux code shows the
kind of bus data such as chromatogram data, parameters, time tables, remote
line status or GPIB board control code and whether the data ended or not.
The GPIB board writes the received data into the run buffer. The GPIB sends
out the formatted data adding the start and the end record.
GPIB Address Setting The GPIB address setting is done with a switch (1) at the rear of the GPIB
board. The factory setting is 10 (position A).
Table 147 Part Numbers for GPIB Interface Board
Item Part Number
GPIB Board (with cable) 79853-68711
GPIB Cable to DCB Board
Firmware ROM GPIB 79853-13004
Figure 231 Location of GPIB board
GPIB Firmware Revisions
Refer to GPIB ROM Firmware Revisions on page 733 for information on
firmware revisions.
28
28 VWD: Diagnostic &
Variable Wavelength Detectors
VWD: Diagnostic &
This section provides information on the
diagnostic routines
error messages
user contol functions
service control functions
VWD: Diagnostic & Troubleshooting Information
Self Diagnosis
Self Diagnosis
At power on and after lamp ignition the instrument checks itself for correct
operation. In case of malfunctions, error messages will inform the operator
on the fault.
During Power On
The following tests are done automatically during power on. They are
descibed on the next pages together with the error message:
Vaccuum Fluorescent display
ROM and RAM
Display
Leak sensor
Voltages
A/D Converter
EEROM Data
Grating Drive
During Normal Operation
The following tests are done automatically during normal operation:
for light intensity
for filter movement
for leaks
Error Messages Before Lamp Ignition
Error messages may come up during the power on state or the normal
operation.
At Power ON
During power on the instrument run automatically through different selftest
routines.
If all test are passed, the display shows HP 1050 VWD.
While initializing the CPU checks the response of the Vaccuum Fluorescent
Display (VFD) module.
If there is no problem, SELF DIAGNOSIS IN PROGRESS is displayed.
If there is no response from the VFD, the ERROR lamp will light, the buzzer is
heard for 2 seconds and is halted.
Check connection DCB/KDI and KDI/VFD module.
Replace VFD Module.
Replace KDI Board.
Replace DCB Board.
Replace DPS.
ROM TEST FAILED The ROM Test calculates the checksum and compares it with a stored value.
If a differrence is found, ERROR LED lights, ROM TEST FAILED is displayed
and the CPU is halted. Otherwise ROM TEST OK is displayed.
Replace EPROM.
Replace DCB.
RAM TEST FAILED During RAM Test, firstly every RAM address is uniformly written. Then in
ascending order, each address is tested for contents and then the data is
inverted and written. Then the same procedure is repeated in decending
order with the inverted data. This cycle is repeated twice. If an error is found,
RAM TEST FAILED is displayed and further operation is prohibited.
Otherwise, RAM TEST OK is displayed.
Replace DCB.
Display Test During Display Test every dot on the VFD module is set and you have to
confirm it by yourself. If display is black or shows missing dots
Check connection of flat ribbon cable DCB to KDI.
Replace KDI.
L.SENSOR TROUBLE The Leak Sensor Test checks the leak sensor and the leak sensor circuit, but
not for a leak resulting from the cell. The voltage applied is measured using
built-in 8 bit ADC (A/D Converter) of the CPU as well as temperature
compensation voltage from a second thermistor.
If the LS > LL, L.SENSOR TROUBLE is displayed.
The range during turn on should be: LS:0.63..4.06 V and LL:2.82..4.00 V.
Use 33:LEAK S.VOLT to verify the values, (see message
LEAK DETECTED.
Check connection of leak sensor to DCB.
Replace leak sensor.
Replace DCB.
POWER FAILURE During Voltage Test this message is displayed if the voltages exceeds the
tolerance. If a voltage is not correct, it is displayed for a short moment, for
example +24V TROUBLE.
Check voltages using function 34:VOLTAGE TEST:
Replace DCB.
Replace Power Supply.
Table 148 DC Voltages
Voltages Used for
+ 12 V (1 V) filter and grating motor
- 15 V, + 15 V (1 V) analog circuits
+ 24 V ( 4.8V) leak sensor, fans
ADC TROUBLE During the A/D Converter Test the 18 bit ADC for photocurrent acquisition is
tested with multiplexer channel fixed at analog ground. Pulse count for
ground input is measured 20 times and calculate the average and the
fluctuations. If the value exceeds the pre-determined value ADC TROUBLE is
displayed.
Replace DCB.
EEROM DATA LOST During EEROM Data Test various parameters such as monochrometer
parameter and time table are stored in EEROM (Electrically Erasable Read
Only Memory) in order to save the value in absence of power. At initializing
those values are checked using checksum. If an error is found,
EEROM DATA LOST is displayed and default values are set.
Different types of EEROM DATA LOST messages are possible:
EEROM DATA LOST0 The key settable parameters (wavelength, responsetime, and so on) or time
time tables are lost. They are replaced by default values.
Re-enter the values.
Replace DCB.
EEROM DATA LOST1 Wavelength parameter (zero order) are lost. They are replaced by default
values. The monochromater parameters are differrent for each instrument.
Execute 20:0th CALIB. or enter the 0th order parameter directly using
31:SET WL PARAM.
Execute 45:WL COMPENSATE.
EEROM DATA LOST2 The DAC parameters are lost. The parameters are the scaling factors for each
DAC bit and ZERO SPAN factors. The lost parameters are recoverable.
Execute 44:DAC CALIB.
EEROM DATA LOST3 The DAC parameters are lost. The parameters are the offset parameter of the
ADC reading for the output of each DAC bit (used for DAC calibration).
NOTE These parameters can be re-written at the factory only.
Perform 41:DAC TEST.
If OK, then leave it as it is.
If NOT OK, then continue.
Perform 44:DAC CALIB. The default values of the offset parameters are
taken now.
Perform 41:DAC TEST.
If OK, then leave it as it is.
If NOT OK, then replace DCB board.
WL SET TROUBLE During the initialization of the grating motor position, the motor moves
backward to the home position where position sensor detects the limit. If it is
not able to detect the limit, WL SET TROUBLE is displayed.
Check connection of position sensor and grating drive motor.
Switch OFF lamp, remove top cover of optical unit to observe movement
of grating mirror (changing wavelength).
If grating will not rotate after changing the wavelength, replace DCB or
the Grating Driver Assy.
Using 36:GRATING P.S. you can move the grating shaft automatically
or stepwise by pressing the down/up key. Normally in the position of about
-200 steps, the output voltage of the position sensor will change from LOW
to HIGH, detecting the limit position. If the output voltage will never
change, the position sensor is defective or the grating drive assembly has
a problem and has to be replaced.
Error Messages After Lamp Ignition
Error Messages After Lamp Ignition
LAMP ERROR Check connections of lamp connector, PSC board and DPS to DCB.
Replace lamp, DPS, DCB.
LOW ILLUMINATION Light intensity of deuterium lamp is checked after lamp ignition at the
wavelength of 250 nm. If the reference voltage at 250 nm is < 0.6 V, the
detector will check the reference voltage at 500 nm and if < 0.12 V,
LOW ILLUMINATION will be displayed. In this case the detector will never
return to the original wavelength. It will remain at 500 nm.
This test is skipped if WL SET TROUBLE is displayed and unable to set the
wavelength.
Check the lamp image on the entrance slit.
If the image does not cover the slit properly, adjust mirror M1.
Check connection to pre-amplifiers.
Replace the lamp for deterioration of lamp.
Replace the mirrors M1 and M2 for deterioration of mirrors.
FILTER ERROR During Filter Test the second order light cutoff filter is tested by inserting it
at the wavelength of > 370 nm and measuring the change of light intensity. If
an error is found FILTER ERROR is displayed.
This message comes up if
The reference current at 220 nm is more than 2.00 and at 500 nm more than
1/16 of the value at 220 nm. Then the filter is always off.
The photocurrent at 220 nm is less than 2.00 and at 500 nm more than 0.04.
Then the filter is always ON.
The reference light beam is focussed far from the reference diode.
Flow cell should be clean and bubble free.
Check connection of filter motor.
Check correct operation of filter with 39:FILTER TEST and photo sensor
of filter with 37:FILTER P.S.
Check beam splitter alignment.
Error Messages During Normal Operation
LEAK DETECTED Enter service mode function 33:LEAK S. VOLT and check leak sensor
voltages.
Error condition is when LS > LL. The normal range should be:
If there is no leakage, check the connection leak sensor to DCB.
Replace Leak Detector board.
Replace Leak Sensor.
DATA UNDERFLOW This message may come up only during BALANCING when the sample or
referrence voltage is lower than 1 mV.
Check, whether the flow cell is in correct position and the screws are
tightened.
Check the connection of pre-amplifier sample to DCB.
Clean cell windows.
Replace photo diode assembly.
Replace DCB.
DATA OVERFLOW This message may come up only during BALANCING when the sample or
referrence voltage exceeds 9.4 V.
tightened.
Replace DCB.
Table 149 Working Ranges for LS and LL
LS signal LL signal
2.35..2.85 V 2.95..3.45 V
ADC OVERFLOW Execute BALANCE, so that the proper pre-amplifier gain is selected.
tightened.
Is apature gasket installed in flow cell?
Replace DCB.
No response for HPIB set address switch correct.
check connection to DCB and GPIB cable.
change GPIB board.
Error Messages During Use of Control Functions
Error Messages During Use of Control
Functions
CALIB FAILURE When using 20:0th CALIB. this message may come up because the
lamp is turned OFF or to much light reaches the sample diode.
Turn On the lamp.
Reduce light to sample diode.
When using 21:WL CALIBRATION this message may come up under the
following reasons:
If during scan the measured voltage of each step
is the same (Figure 232-a), or
is on an upslope (Figure 232-b) or
is on a downslope (Figure 232-c).
Use other wavelength setting to get a different range,
31:SET WL PARAM.
Recalibrate grating with 21:WL CALIBRATION.
Figure 232 Calibration Failure
User Control Functions
These functions are accessable for every instrument user. They are used for
parameter settings and special operating functions during normal work.
Table 150 User Control Functions
# Display Used for
1 1:SAMPLE SCAN takes a sample scan
2 2:REF. SCAN takes a reference scan
3 3:SPECTRUM OUT plots the spectrum
4 4:SCAN FROM defines scan range from
5 5:SCAN TO defines scan range to
6 6:ZERO OFFSET zero offset in %
7 7:RESPONSETIME choices 0.25, 1 and 4 s
8 8:AUTO LAMPOFF automatic lamp off
9 9:AUTO LAMP ON automatic lamp on
10 10:OUTP. DEVICE integrator or recorder
11 11:OUTPUT VOLT 1 V or 100 mV
12 12:STATUS FW revision, errors or status
13 13:START MODE local, remote, hpsystem
14 14:OUTPUT CHECK checks the output voltage
15 15:RESET reset to default
16 16:PHOTOCURRENT sample and reference diodes current
17 17:PARAM. LOCK locks certain parameters
18 18:WL SHIFT WL change on display
19 19:POLARITY polarity of signal (analog/GPIB)
20 20:0th CALIB. 0th order calibration
Functions 1 to 21 are described in detail in the User Documentation.
21 21:WL CALIBRATION 656 nm calibration
22 22:HOLMIUMCHECK WL Calibration check
Table 150 User Control Functions
# Display Used for
Service Control Functions
NOTE These functions are secured by a PASSWORD, because they are normally used
by trained Service Engineers. Misuse of certain function may result in a
misalignment of the optical path or electronical values.
If the VWD is in service mode, the ERROR status lamp blinks.
If the instrument enters into this mode accidentally, the easiest way to abort
from this mode is: TURN OFF the power off the instrument.
Entering the Service Mode
1 Press [CTRL] [3] [0] [ENTER]
2 {30:SERVICE MODE} [ENTER]
3 {Pass Word} [1] [0] [5] [0] [ENTER]
This control function is the entry point for all service control functions. You
can enter service control function only through this control function. Select
your desired control function using [DOWN] or [UP]. Once you abort from this
mode, you have to execute this function again. However if power has not
switched off since last entry, you can skip password by just pressing
[ENTER].
It is adviced that you will turn-off the power, after you finished using service
control functions to avoid the accidental entry to service control mode.
In Table 151 on page 623 all service related functions are listed. Due to
different firmware versions and improvements on 79853C VWD, the order of
the functions is different.
The functions 20, 21 and 22 are part of the User Functions, but they are
described in this section.
CAUTI ON Important parameters might be lost. DO NOT use control functions 31 through
45 until you have read this paragraph and fully understand the functions and
result of operation. Some functions may change the monochrometer
parameters and misuse of these functions leads to inaccurate wavelength
setting.
Table 151 Service Control Functions
# Display Used for
20 20:0th CALIB. Zero Order calibration
21 21:WL CALIBRATION 656 nm calibration
22 22:HOLMIUMCHECK Wavelength Calibration check
31 31:SET WL PARAM. Parameter Set for Zero Order and 656 nm
32 32:FIX SIGNAL Fixed voltage to sample or reference path
33 33:LEAK S. VOLT Shows leak sensor voltages
34 34:VOLTAGE TEST Shows DC Voltages
35 35:ADC NOISE Check of ADC noise
36 36:GRATING P.S. Check of Grating Sensor
37 37:FILTER P.S. Check of Filter Sensor
38 38:REMOTE TEST Check of Remote lines-
39 39:FILTER CHECK Checks movement of Filter
40 40:0TH TEST OFF Positions the Zero Order Beam
41 41:DAC TEST Checks DAC
42 42:PREAMP GAIN Checks linearity of gains
43 43:EEROM TEST Checks EEROM data
44 44:DAC CALIB . Calibrates the DAC
45 45:WL COMPENSATE Compensates non-lineraties of grating
Zero Order Calibration
20:0th CALIB. This control function is used for the electrical calibration of the zero order
beam of the monochrometer. The step number corresponds to the number in
31:SET WL PARAM.
The grating is driven by the stepper motor through steps 150 to 250 searching
for a maximum. The step number with the maximum voltage is displayed,
and if accepted, written into the EEROM.
The intensity of the zero order light is reduced by inserting a filter in the
calibration position automatically.
Prior to the use of this function, the grating assembly should be pre-aligned
on the zero order light, using control function 40:0TH TEST OFF.
Table 152 Control Function: Zero Order Calibration
Key Operation Display Description
20:0th CALIB. Select function.
ENTER nn step CHANGE? display current parameter or
change to 200.
ENTER or to continue calibration or
CLEAR to abort.
wait appr. 20 seconds.
nn step x.xxxV starts the calibration scan
from 150 step to 250step
No key entry is allowed here.
Possible error message at this
point may be:
CALIB. FAILURE Indicates that the lamp is
OFF.
DATA OVERFLOW Indicates that too much light
reaches the sample photo
diode. Reduce light and insert
paper between cell and
sample diode
DATA UNDERFLOW Indicates that not enough
light reaches the sample
photo diode. Check light path.
The next line will be shown, if
no error message occured.
nn step y.yyyV Displays the step that gave
the maximum light intensity.
ENTER nnn step OK ? Promps for confirmation, to
change the parameter.
ENTER Takes the displayed step
number.
CLEAR Rejects the displayed step
number.
ENTER nnn step New parameter is written in
EEROM and monochrometer
is reset with new parameter.
20:0th CALIB. End of Zero order beam
calibration. You may repeat
the procedure again.
Table 152 Control Function: Zero Order Calibration
Wavelength Calibration
21:WL CALIBRATION This control function is used for the calibration of the monochrometer using
the 656 nm line emission from the deuterium lamp. The step number
appeared in this control function is the number of steps of stepper motor
from the 0 order beam to the 656 nm emission line. Maximum light intensity
is searched between 50 steps of 656 nm value. If the maximum peak is
found, the step number is written into EEROM and corresponds to the value
in 31:SET WL PARAM.
Table 153 Control Function: WL Calibration
21:WL CALIBRATION Select function.
ENTER 656nm xxxx step Displays the wavelength for
calibration and steps based
on present PARAM.WL 656.
ENTER or To continue calibration or
CLEAR to abort.
Wait appr. 30 seconds.
xxxxstep y.yyyV Starts the calibration scan
from 656 nm 50 steps and
seeks for maximum light
intensity.
No key entry is allowed here.
Possible error message at this
point may be:
CALIB. FAILURE Indicates that there was no
maximum found (see CALIB
FAILURE on page 619).
DATA UNDERFLOW Indicates that not enough
light reaches the sample
photodiode (<30 mV).
The next line will be shown, if
no error message occured.
xxxxstep y.yyyV Displays the step that gave
the maximum light intensity.
ENTER 656nm xxxx step Displays the wavelength and
step that gave the maximum
light intensity.
after 2 seconds 656nm xxxxstep Displays the new parameter
at 546 nm and prompts the
confirmation.
ENTER Takes the displayed step
number.
CLEAR Rejects the displayed step
ENTER 656 yyyystepOK New parameter is written in
EEROM and monochrometer
is reset with new parameter.
after 2 seconds 21:WL CALIBRATION End of calibration. You can
repeat the procedure again.
Table 153 Control Function: WL Calibration
Wavelength Calibration Check
22:HOLMIUMCHECK
This control function is used for the automatic check of the instruments WL
calibrations using the some specific lines on the Holmium oxide filter which
is moved into the light path.
If this test was not successful, perform 20:0th CALIB. and
21:WL CALIBRATION.
Table 154 Control Function: HOLMIUMCHECK
22:HOLMIUMCHECK Select function.
ENTER CHECK?
CLEAR to leave function.
ENTER to start the calibration check.
360.8nm automatic verification
HOLMIUM CHECK OK if within specification
CLEAR to leave function.
DOWN 360.8nm 360.7nm displays measured value
CLEAR 22:HOLMIUMCHECK to leave function.
SET WL Parameter
31:SET WL PARAM. This control function is used for the confirmation of monochrometer
parameters or for changing them directly. PARM.WL0 is the number of steps
of stepper motor from the position sensor, while PARM.WL656 is the number
of steps from 0 order beam. As these values changes slightly from instrument
to instrument, they are originally calibrated and written into EEROM.
The parameter 360.8 nm, 418.5 nm, 486 nm and 536.4 nm cannot be changed.
These four parameters set with 45:COMPENSATE are used to compensate
non-linearity of the grating drive.
If PARM.WL656 is changed, these four parameters are automatically shifted.
Table 155 Control Function: SET WL PARAM.
31:SET WL PARAM. Select function.
ENTER Parm.WL0 200 Displays the 0 order light
parameter (same
value found with
20:0th CALIB. .
UP Select the parameter WL656
nm.
Parm. 656yyyy Displays the step number at
656 nm (same value found
with 21:WL CALIBRATION.
Enter the parameter using
numeric keys.
UP Parm.360.8yyyy Displays the step number at
360.8 nm.
418.5 nm.
UP Parm. 486 yyyy Displays the step number at
486 nm.
536.4 nm.
In order to change both parameters you have to repeat the above procedure
for both wavelengths.
ENTER 31:SET WL PARAM. Control function is displayed
again.
CLEAR On WL0 or WL656 parameter,
reenters the displyed value.
Table 155 Control Function: SET WL PARAM.
Fix Signal
32:FIX SIGNAL If the 1050 VWD shows noise or drift problems, this function can help to
isolate the cause. The reference or the sample diode can be set to an fixed
electrical value to remove influences from the light path.
This function can also be used to retrieve the instrument profile of the
instrument.
NOTE If either channel is fixed, the ERROR status lamp is blinking even after
returning to analysis mode from service control mode. This is an alarm to
show that the instrument is abnormal condition. You can return to normal
condition by executing NORMAL-NOT FIXED or switching off the power.
Table 156 Control Function: FIX SIGNAL
32:FIX SIGNAL Select function.
ENTER REF. CH. FIXED The photocurrent of reference
photo diode is a fixed
electrical value.
DOWN or UP Select the parameter.
NORMAL-NOT FIXED Return to normal condition
(neither photocurrrent is
fixed.)
SMP. CH. FIXED The photocurrent of sample
photo diode is a fixed value.
ENTER 32:FIX SIGNAL Control function is displayed
again.
Use of FIX SIGNAL Use this function for
checking the noise of both sides separately;
taking the instrument profile of both sides separately.
With fixed signal, either the reference or the sample side is supplied with a
constant current. So influences from the lamp effects only that side which is
not fixed. Influence due to a drifting or defective photo diode effects both, a
scan and the signal (noise). Small wavelength variations between fixed
sample and reference scans are caused by the characteristics of the photo
diodes.
Noise with Reference Signal Fixed: If the noise is large, the problem may
be caused by light path, flow cell or sample diode/pre-amplifier.
Noise with Sample Signal Fixed: If the noise is large, the problem may be
caused by light path, lamp or reference diode/pre-amplifier.
To take an instrument profile proceed as follows:
Enter 32:FIX SIGNAL and set SMP. CH. FIXED .
Press [ENTER] and leave function.
Press [BALANCE].
Take a reference scan 2:REF SCAN .
Take a sample scan 1:SAMPLE SCAN .
Set integrator to ATTN9, CS10 and Zero10%.
Press [BALANCE].
Enter 3:SPECTRUM OUT , press [ENTER] [ENTER].
Start plot on integrator and press [ENTER]. The intensity profile is now
plotted on the integrator.
Perform above steps with REF. CH. FIXED to check the light through
put of the cell. Figure 233 on page 633 shows both plots.
Figure 233 Example of Intensity Profiles
Leak Sensor Voltage
33:LEAK S.VOLT You can check the leak sensor with this contol function in case of trouble.
Table 157 Control Function: Leak Sensor Voltage
33:LEAK S.VOLT Select function.
ENTER LS:2.70 LL:3.30 Displays LS (Leak Sensor
Voltage) and LL (Temperature
compensation voltage).
Error condition is when
LS > LL.
The normal ranges are:
LS signal 2.35..2.85 V,
LL signal 2.95..3.45 V
CLEAR 33:LEAK S.VOLT Leaves function.
Voltage Test
34:VOLTAGE TEST
You can check some (but not all) voltages with this contol function.
Table 158 Control Function: Voltage Test
34:VOLTAGE TEST Select function.
ENTER 15.0 22.9 Displays first set of voltages.
DOWN or UP 12.1 -15.0 Displays second set of
voltages.
CLEAR 34:VOLTAGE TEST Leaves function.
Table 159 DC Voltages
Voltages Used for
+ 12 V (1 V) filter and grating motor
- 15 V, + 15 V (1 V) analog circuits
+ 24 V ( 4.8V) leak sensor, fans
ADC Noise
35:ADC NOISE The output signal of the ADC noise corresponds to 196 AD counts at the
Analog Output with 1 V full scale setting. The ADC noise must be within
10 counts (50 mV) over a time of 10 minutes (Figure 234).
Figure 234 ADC Noise
Table 160 Control Function: ADC Noise
35:ADC NOISE Select function.
ENTER TESTING ADC ADC noise is outputted.
Start plotter in ATTN 7,
ZERO 50, Chartspeed 1 (on
HP 339X)
CLEAR 35:ADC NOISE Leaves function.
Grating Photo Sensor
36:GRATING P.S. This control function can be used to check the function of the photo sensor
and the drive mechanism of the grating. The movement of the grating can be
done automatically or step for step. It will provide the step number and the
voltage of photo sensor which detects the backward limit when the drive
mechanism moves into the photo sensor. The photo sensor voltage exceeds
3 V when the photo sensor reaches at backward limit position.
A normal step value for change from LOW to HIGH is around -200 steps.
Table 161 Control Function: Grating Photo Sensor
36:GRATING P.S. Select function.
ENTER STPxxx PS0.11 Present step of stepper motor
and photo sensor voltage is
displayed.
DOWN or UP STPxxx PSy.yy You can move the stepper
motor and observe the
voltage.
ENTER STP-nnn PS3.90 Starts automatically the
search for the home position
and displays the step number
(nnn) and the corresponding
voltage.
CLEAR 36:GRATING P.S. Leaves function.
Filter Photo Sensor
37:FILTER P.S. This control function can be used to check the function of the photosensor
and the filter motor. The movement is done step for step. It will provide the
step number and the voltage of photo sensor when the drive mechanism
moves into the photo sensor.
Pressing
Table 162 Control Function: Filter Photo Sensor
37:FILTER P.S. Select function.
ENTER STP0 PS4.98 Move to home position and
shows steps and photo
sensor voltage.
DOWN or UP STPxxx PSy.yy You can move the stepper
motor and observe the
voltage. When the motor
leaves the photo sensor, then
PS changes to 0.01.
CLEAR 37:FILTER P.S. Leaves function.
UP once rotates the filter 1 step (7.5) to the left.
DOWN once rotates the filter 1 step (7.5 to the right.
Remote Test
38:REMOTE TEST This control function is to test the remote control line. Disconnect the
remote cables to avoid interferrence to and from other instruments.
Remote lines tested are: START, SHUT DOWN, POWER DOWN, READY and
STOP. PREPARE and START REQUEST are not tested.
Table 163 Control Function: REMOTE Test
38:REMOTE TEST Select function.
ENTER Disconnect REMOTE Cable and Press START
START REMOTE LINE TEST The REMOTE LINE TEST
starts.
REMOTE LINE OK When test is passed.
REMOTE FAILURE Theres a trouble.
CLEAR 38:REMOTE TEST Leaves function.
Filter Check
39:FILTER CHECK This control function is used to check the motion of second order cutoff
filter. The cutoff filter returns to original position at the end of this control
function.
Table 164 Control Function: Filter Test
39:FILTER CHECK Select function.
ENTER CUT FILTER OFF Displays present filter status.
DOWN or UP CUT FILTER ON Cutoff Filter moves in or out.
CLEAR 39:FILTER CHECK Leaves function.
Zero Order Test
40:0TH TEST OFF This control function is used to move the stepper motor into the zero order
position and has to be performed during the alignment of the grating.
Table 165 Control Function: Zero Order Test
40:0TH TEST OFF Select function.
The test is still off and the
grating is on set parameter
wavelength.
ENTER 0th STEP NOnnn Take the number of steps
from 31:SET WL PARM. ,
(default) or use 200 steps.
ENTER 0TH TEST ON The stepper motor is moved
to zero order position.
CLEAR 40:0TH TEST OFF Leaves function and grating is
turned to set wavelength.
DAC Test
41:DAC TEST This control function is used to check the D/A converter by setting different
bits. An AC voltage is added to the DC output and should be < 0.8 x 10
-5
AU.
If you do not see a linear response, replace the DCB board.
Table 166 Control Function: DAC Test
41:DAC TEST Select function.
ENTER TESTING BIT 0 Bit 0 is tested.
UP TESTING BIT 1 Bit 1 is tested.
CLEAR 41:DAC TEST Leaves function.
Table 167 DAC DC Values
Bit mV Decription
0 27
1 32 jump of 5 mV
2 42 jump of 10 mV
3 62 jump of 20 mV
4 104 jump of 40 mV
5 22 GND plus offset voltage
6 185 jump of 80 mV
7 511 about half of maximum output voltage
An AC voltage is added to the DC output and should be < 0.8 x 10
-5
AU.
Figure 235 DAC Test Bit 0 (AC)
Figure 236 DAC Test Bit 7 (AC)
If one or more tested bits are out of limit, then perform 44:DAC CALIB.
Pre-amplifier Gain
42:PREAMP GAIN This control function allows the check of gain switching on the DCB.
The gain can be switched to 1, 2, 4 and 8.
Table 168 Control Function: Pre-Amplifier Gain
Change wavelength to 500
nm to reduce intensity of
light.
42:PREAMP GAIN Select function.
ENTER G1 R0.115 S0.045 Shows the photocurrent of
reference and sample side
with gain 1.
DOWN G2 R0.227 S0.089 Shows the photocurrent of
with gain 2.
with gain 4.
with gain 8.
The displayed values should
double each time.
If not, change wavelength to
500 nm or change DCB.
CLEAR 42:PREAMP GAIN Leaves function.
EEROM Test
43:EEROM TEST This control function checks the EEROM and is used as factory test.
Table 169 Control Function: EEROM Test
43:EEROM TEST Select function.
ENTER EEROM TEST****** The blinking * indicates the
checked section.
EEROM TEST OK Test was successful. If test
failes, replace DCB.
CLEAR 43:EEROM TEST Leaves function.
DAC Calibration
44:DAC CALIB. This control function does a scaling between lower 12 bits and upper 8 bits of
DAC and an automatic recalibration of the DAC internal voltages. It should
be performed when the noise is higher than expected and a DAC
non-linearity is found. The test runs automatically.
The initial calibration is done at the factory.
The lamp can be off, but the instrument should be on for some time for
stabilizing the instrument to reduce drift.
Table 170 Control Function: DAC Calibration
44:DAC CALIB. Select function.
ENTER Disconnect SIGNAL Cable
and Press START
START DAC SCALING Scaling starts.
SCALING 0 Step 0 of 7 is displayed.
f0 yyyy pre-scaling done for step 0.
Now you steps 1 to 7 are
done.
DAC CALIB. OK Calibration was successful.
ENTER 44:DAC CALIB. Takes new factors and leaves
function.
DAC CALIB.FAILED Calibration was not
successful.
CLEAR 44:DAC CALIB. Keeps previous factors when
calibratio failed and leaves
function.
Wavelength Compensation
45:WL COMPENSATE This control function is used to compensate non-lineratity of the grating
drive.
NOTE If the grating motor or the grating has been replaced or moved, this function
MUST be executed.
During this test, the flow cell should be empty (no windows) or clean filled
with water or methanol (no air bubbles). Absorption in the flow cell causes
an error.
First step is to search for the 656 nm line emission of the deuterium lamp
within a window of 50 steps.
Then the processor sets the ideal (linear) steps for four interpolative
points, 360.8 nm, 418.5 nm, 486 nm and 536.4 nm.
360.8 nm and 418.5 nm are absorption points of the holmium oxide
spectra. 536.4 nm is a line emission from the deuterium lamp.
Next, it scans each ideal interpolative point (25 steps) as reference.
Then the holmium oxide filter is inserted and it scans again for the three
absorption points of holmium oxide spectra (25 steps).
If all found values are in limit, then the parameters are written into EEROM
(visable with 31:SET WL PARAM.).
Table 171 Control Function: WL Compenstation
45:WL COMPENSATE Select function.
ENTER PARAM. CHANGE ?
ENTER to continue calibration
CLEAR to abort calibration
XXXstep y.yyyV displays steps and voltage
during calibration
CALIB. FINISHED new parameter, written into
EEROM.
ENTER 45:WL COMPENSATE Takes new factors and leaves
function.
WL CALIB. FAILURE one or more peaks could not
be found with 25 steps.
Parameters are set to
previous values.
CLEAR 45:WL COMPENSATE Keeps previous factors when
calibration failed and leaves
function.
Table 171 Control Function: WL Compenstation
29
29 VWD: Maintenance Information
service and maintenance of the 1050 Variable
VWD: Maintenance Information
Warnings
WARNI NG Dangerous voltage is present in the cabinet, though it is covered and
insulated. DO NOT TOUCH PARTS unless they are specified in the
procedure.
Be careful when you have to work in the optical unit. The lamp housing
is hot.
Be sure to wear a pair of safety or sun glasses. Since the deuterium
lamp emits intensive ultraviolet light, it is dangerous to perform
optical alignment without eye protection. Be careful not to expose
your eyes directly to the light coming from the lamp.
Securing for Transport
Securing for Transport
Figure 237 Securing for Transport
Replacement of Deuterium Lamp
If the Deuterium lamp no longer ignites or the lamp emission has become too
low and noisy, the lamp has to be replaced.
The deuterium lamp is exchangeable by the user. No adjustment is necessary.
For accurate wavelength setting excute user control function
20:0th CALIB. and 21:WLCalibration after exchanging the lamp.
Step 1: Replacement
Turn the lamp off.
Loosen the two screws at the rear of the instrument which fix the cover
and remove them.
Remove top cover.
Unplug the lamp and remove it.
Exchange the lamp (no adjustment is required).
Reconnect the lamp.
Replace top cover.
Turn the lamp on.
Step 2: 0th Order Calibration
The instrument scans for the maximum of the zero-order light.
During 0th order calibration a filter for reducing light intensity to prevent
ADC data overflow will be inserted automatically.
Select control function 20:0th CALIB.
If CALIB. FAILURE occurs, press [CLEAR] to keep the old value and to
leave function.
[ENTER] enters function
200step CHANGE? displays the current parameter
[ENTER] or [CLEAR] to continue or to abort
150step 0.000V instrument scans now for maximum from step
150 to 250
201step X.XXXV maximum when calibration successfully
finished, press [ENTER]
201 step OK ? press [ENTER] to keep the new value and to
leave function
Step 3: WL CALIBRATION
The instrument scans for maximum light intensity of 656 nm line spectrum of
deuterium lamp.
Enter control function 21:WL CALIBRATION.
If CALIB. FAILURE occurs, press [CLEAR] to keep the old value and to
leave function.
[ENTER] enters function
656nm 1900step displays the current parameter.
[ENTER] or [CLEAR] to continue or to abort
1875step 0.000V the instrument scans now for for maximum for
100 steps
1902step X.XXXV maximum when calibration successfully
finished, press [ENTER]
656 1902stepOK? press [ENTER] to keep the new value and to
leave function.
To replace or clean certain parts of the flow cell you should have a clean
working area.
Refer to Standard Flow Cell C (SST/Ti) on page 693 and the following
pages for detailed flow cell schematics.
Flow Cell Maintenance Kits
There are several maintenance kits available with replacement parts for the
flow cells.
For details seeStandard Flow Cell C (SST/Ti) on page 693 and the
following pages.
Replacing Cell Parts
For the detailed procedures refer to the Operating Manual.
Remove flow cell.
Unscrew the cell screw using a 6 mm hexagon wrench, see Figure 238 on
page 656, item 1.
Remove inner parts carefully and place them in the correct order in front
of you.
Replace window, gaskets or other parts as needed.
NOTE Once a gasket has been compressed or spoiled on the surface, DO NOT use it
again. A used gasket may cause leakage.
Insert all parts in the correct order.
Tighten the cell screw.
Perform a Leak Test on page 657.
Figure 238 Standard Flow Cell
Flushing Procedure
Cleaning the cell (by using a glass syringe!)
Flush with iso-Propanol.
Flush with bidistilled water.
Flush with nitric acid : water (5 : 95).
Flush with bidistilled water.
Flush with iso-Propanol
CAUTI ON This concentration of nitric acide is dangerous and proper attention to safety
should be given. Also, the nitric acid flushing procedure is not a certain cure
for a dirty cell. It is to be used as a last attempt to salvage the cell before
certain cell parts have to be replaced.
Leak Test
Remove the flow cell and connect the outlet tubing of the flow cell directly to
the pump. Then flow an appropriate solvent (for example Isopropanol) at
10 ml/min. After several minutes check the cell visually. If it is necessary to
check it for higher pressure, put an appropriate stainless steel tubing which
can build up a back-pressure.
CAUTI ON DO NOT apply higher back pressure to the flow cell than maximum pressure
of the flow cell.
Table 172 Pressure Rating on Flow Cells
Type Pressure
Standard Flow Cell 40 bar
Ultra High-Pressure Cell 400 bar
Preparative Flow Cell 40 bar
Semi-Micro Flow Cell 40 bar
Using the Cuvette Holder
This cuvette holder can be placed instead of a flow cell in the variable
wavelength detector. Standard cuvettes with standards in it, for example,
National Institute of Standards & Technology (NIST) holmium oxide solution
standard, can be fixed in it.
This can be used for wavelength verifications.
Figure 239 Cuvette Holder
When required: If your own standard should be used to checkout the instrument.
Tools required: None
Parts required: Cuvette Holder 79853-60016
Cuvette with the standard, e.g. NIST certified holmium oxide sample
Preparation for this procedure are:
Remove the normal flow cell.
Install the cuvette holder in the instrument
and perform a wavelength calibration.
Have cuvette with standard available.
1 Locate the cuvette holder on the desk.
2 Unscrew the bracket. 3 Insert the cuvette with the sample into the
holder.
Light path
Clear side
4 Replace the bracket and fix the cuvette. 5 Install the cuvette holder in the instrument.
6 Perform your verification.
Replacing DCB Board and Firmware
Replacing DCB Board and Firmware
When performing one of these tasks, take care for electrostatic discharge
protection to keep the electronics alive.
DCB Board
Note the parameters from 31:SET WL PARAM.
Disconnect the power from the instrument.
Remove main cover and disconnect all connectors from DCB.
Replace DCB after loosening the 3 fixing screws.
Fix all screws and reconnect all connectors to the DCB.
Carefully remove the firmware ROM from removed DCB and insert it on
new DCB.
Replace main cover and turn the instrument ON.
Turn lamp on and wait some minutes to stabilize the lamp.
Perform functions 20:0th CALIB., 21:WL CALIBRATION,
44:DAC CALIB. and 45:COMPENSATE to input the detector specific
parameters into the EEROM.
DCB Firmware
Disconnect the power from the instrument.
Remove main cover.
Carefully replace the firmware ROM.
Replace main cover and turn the instrument ON.
Turn lamp on and wait some minutes to stabilize the lamp.
Replacing Display Boards
Replacing Display Boards
Remove front panel assembly and disconnect cables between front panel
and DCB.
Unscrew the six screws which hold the plastic part at the metal frame
(except the two screws that fix the leak assembly).
Disconnect the grounding cable and the cable between the two display
boards.
Replace the defective board.
To loosen the flat cable [3] from the keyboard, press a flat screwdriver
onto the two noses on each side of the connector [1] to release the upper
part [2] of the connector.
Figure 240 Release of connector
Replacing the Leak Interface
Remove the flow cell.
Remove top cover.
Disconnect leak cable from DCB and the flat ribbon cable from DCB to
keyboard at the KDI board.
Unscrew the screws that fix the front panel.
Remove front panel.
Replace sensor board or complete assembly.
Leak Interface
Carefully remove the leak interface.
Replace the defective item. All three parts (top, bottom and tubing are
coming together as kit).
Install the leak interface.
Replacements in the Optical Unit
The repair level of optical unit parts is component level.
Refer to section Optical Unit C on page 688 for additional parts.
WARNI NG Be sure to wear a pair of safety or sun glasses. Since the deuterium
Disconnect power from instrument.
Remove flow cell.
Remove top cover.
Disconnect all cables that go from the optical to the Detector Controller
Board (DCB).
Place the instrument on its left or right side.
Remove all nuts that fix the optical unit.
Take out the optical unit.
Replacing the PSC Board
Refer to Removing the Optical Unit on page 666.
Remove the PSC protection cover (2 screws).
Loosen the PSC board (3 screws).
Remove the lamp supply connector from the fan assembly.
Fed the wire carefully between fan cover and power supply cabinet. If not
possible, loosen the fan cover.
Replace the PSC board and reuse the old cable to the DCB board.
When replacing the PSC protection cover, take care for correct routing of
the wire at the right side.
Replacing Pre-amplifiers or Photodiodes
Remove the top cover and the front panel assembly.
Refer to Figure 244 for next steps.
Remove the cover that protects the pre-amplifier.
To replace the pre-amplifier boards
disconnect cable from pre-amplifier board
unscrew the board
unsolder the wire from the photodiode
replace the board.
To replace the photodiode
remove cover plate of photodiode
unsolder photodiode
unscrew photodiode
replace photodiode.
Figure 244 Location of Photodiodes
Replacing Grating Assembly Parts
Photo Sensor
Remove the bottom plate of the optical unit.
Unscrew the photo sensor and replace it.
Grating
For [ ] items refer to Figure 245 on page 669.
Remove the top cover of the optical unit.
Use a hex key (2.5 mm) to loosen the grating screw [2].
Replace the grating [1].
Refer to Optical Alignment Procedures on page 671.
Sample Reference
Grating Motor
Refer to Replacing Grating Assembly Parts on page 668 and take grating
out.
Remove the two springs.
Unscrew the three screws [6] that fix the motor assembly [5] and take it
out. Keep spring [3] and gasket [4].
Replace the spring [3], gasket [4] and complete motor assembly [5].
Reinstall the grating [1].
Figure 245 Grating Assembly
Replacing Filter Assembly Parts
Refer to Refer to Removing the Optical Unit on page 666.
Unscrew the 2 screws that fix the filter assembly.
Take out the complete assembly.
Replace the complete filter assembly, sensor lever or the sensor.
Replacing Mirrors, Beamsplitter and Slits
Open the optical untit's top cover.
Replace the item that need to be replaced.
NOTE DO NOT touch the surface of the mirrors, beam splitter and the grating.
Optical Alignment Procedures
WARNI NG Be sure to wear a pair of safety or sun glasses. Since the deuterium
Procedure 1: Simple Alignment
When replacing just a single part in the light path other than grating parts, M4
and beam splitter, this procedure can be performed.
Execute 40:0th TEST which shows the step number from
31: SET WL PARM. and watch the location of the images on the slit
assemblies (entrance and reference slit) and the cell center.
Exchange the part Refer to Replacing ... for more information.
Position the part so that the image centers on entrance and reference slit.
Fix the part.
If image on exit slit is too high or low, follow procedure Procedure 2:
Sample Beam Alignment on page 672.
If image on reference slit is too high or low, follow procedure Procedure
3: Reference Beam Alignment on page 674.
Excute the 20:0th CALIB. and 21:WL CALIBRATION.
Refer to Replacement of Deuterium Lamp on page 652, Step 2 and 3.
Procedure 1: alignment after exchange of a specific part
Procedure 2: alignment of complete optical (sample path)
Procedure 3: alignment of complete optical (reference path)
Procedure 2: Sample Beam Alignment
For [ ] items refer to Figure 247.
M1, M2, Entrance Slit,
M3
Remove the entrance slit [3].
Turn the deuterium lamp [1] on.
Make sure the light spot covers over mirror M1 [4].
Adjust the direction of mirror M1 [4] so that the light beam covers over
mirror M2 [5].
Adjust the angle and direction of mirror M2 [5] so that the light beam
covers over mirror M3 [6].
Install the entrance slit [3] where the light beam illuminates the center of
the slit.
Adjust the angle and direction of the mirror M3 [6] so that the light beam
covers over the grating mirror [7].
Figure 247 Optical Unit Parts
Grating, M4, Beam
Splitter
Excute control function 40:0TH TEST OFF to set the grating motor
position to 200 steps (center step number).
Adjust the direction of the grating mirror [7] so that the light beam covers
over the mirror M4 [6].
Remove the beam splitter [8] now so that you can see the center of the flow
cell.
Adjust the angle and direction of the mirror M4 [6] so that the light beam
illuminates the center of the flow cell.
Leave control function 40:0TH TEST OFF and return to normal display.
Excute the 20:0th CALIB. and 21:WL CALIBRATION. Refer to
Replacement of Deuterium Lamp on page 652, Step 2 and 3.
If grating has been moved, use 45:COMPENSATE to compensate
non-linearity of the grating motor.
Set wavelength to 254nm.
Place cover on optical unit (do not fix the screws at this time).
M4 fine tuning Excute control function 16:PHOTOCURRENT.
Remove the blank screw for mirror M4 adjustment (Figure 243 on page
666) on the top cover (leave the blank screw for beam splitter adjustment
in).
Adjust the angle of the mirror M4 with inserting a hexagon wrench
(1.5 mm) through the top cover screw hole to get maximum photocurrent
for the sample. Turn right to move image down and left for up.
Replace the blank screw in the top cover.
Excute the 20:0th CALIB. and 21:WL CALIBRATION. Refer to
Install the beam splitter [8].
Procedure 3: Reference Beam Alignment
Excute 40:0TH TEST ON with calibrated step value displayed.
Open the top cover and adjust the angle and direction of the beam splitter
[8], so that the light beam illuminates the center of the reference slit [12].
Place the cover on the optical unit.
Leave 40:0TH TEST ON and set wavelength to 254 nm.-
Remove the blank screw for beam splitter adjustment (Figure 243 on page
666) in the top cover.
Excute 16:PHOTOCURRENT.
Adjust the angle of the beam splitter inserting a hexagon wrench through
the top cover screw hole to get maximum photocurrent for the reference.
Turn right to move image down and left for up.
Replace the blank screw in the top cover.
Repeat the 20:0TH CALIB. and 21:WL CALIBRATION. Refer to
Use 45:COMPENSATE to compensate non-linearity of the grating motor.
Cleaning of Optical Unit Parts
Cleaning of Optical Unit Parts
There are only a few parts within the optical unit that can be cleaned.
Table 173 Cleanable Optical Parts
NOT CLEANABLE grating and all mirrors
Touching or cleaning will result in decrease of
reflaction/intensity
CLEANABLE filters (holmium, cutoff and 0 order calibration), beam
splitter, photo diodes
You can wipe the surface with ethanol. In case you
cannot remove stains, the part has to be replaced.
Upgrade to GPIB
Upgrade to GPIB
Note the values for WL, 0 and 656 nm using 31:SET WL PARAM., just in
case the EEROM looses the values.
Turn off the instrument.
Remove top cover of the instrument.
Remove plate at the rear panel above the fan.
Install the GPIB board in that location using the screws that hold the plate.
Connect the GPIB cable to J12 of the DCB board.
GPIB Address Setting
The GPIB address setting is done with a switch (1) at the rear of the GPIB
board. The factory setting is 10 (position A).
Figure 248 Location of GPIB board
Performance Verification
What you need
a pump that can deliver bidistilled water, at a rate of up to 1 ml/min against
a back-pressure of about 200 bar.
a column: we recommend our 100 x 4.6 mm i.d., 5 m Hypersil ODS
column.
a recording device that can accept the output signal from your detector
and that has attenuation set to about 35 cm/mV.
Preparations
Prime the pump and ensure there are no air bubbles in the system.
Thoroughly degas about 300 ml of bidistilled water.
Set pump to deliver bidstilled water at a flow rate of 1 ml/min.
Set the attenuation to about 35 cm/mV.
Set run time on recorder to 6.0 min.
Turn-ON line power and deuterium lamp.
Set wavelength to 254 nm, response time to 1 second and output voltage to
1 V.
Table 174 Noise and Drift Specifications
Noise
1.5 x 10
-5
AU
Drift
5.0 x 10
-4
AU/h
Starting a run
Give the optical unit time to warm-up and stabilize.
Start a run.
The baseline noise should not exceed 7.5 V (1.5 x 10
-5
AU|) equivalent to
4.5 mm at attenuation - 3 on a 3390/2/3 integrator and equivalent to 9 mm
at attenuation - 3 on a 3394/6 integrator.
Figure 249 Example of Noise Plot
This plot was taken with
a 79853C VWD
an 35900C A/D converter
a LC DOS workstation
flow cell windows removed, but gasket #2 installed.
It shows, that the drift on this example is < 1 x 10
-4
AU/hr and the noise at
about < 1 x 10
-5
AU.
Scaling Factors
The table below shows the scaling factors for the 339XA family of
integrators. The 3390A, 3392A and 3393A have a full scale deflection of
75 mm. The 3394A and the 3396A have a full scale deflection of 150 mm, they
also have an attenuation range between -8 and 36.
Table 175 Scaling Factors on 339X integrators
ATTN mV full scale mAU full scale
-3 0.125 0.25
-2 0.25 0.5
-1 0.5 1
0 1 2
1 2 4
2 4 8
3 8 16
4 16 32
5 32 64
6 64 128
7 128 256
8 256 512
9 512 1024
10 1024 2048
30
30 VWD: Parts Information
1050 Variable Wavelength Detectors
VWD: Parts Information
listings respectively.
Overall Diagram
Optical Unit
Flowcell
Flow Cell Kits
Accessory Kit
Overall Diagram
Overall Diagram
1 Power Supply (5061-3375) 01050-69375 15 Cover Assembly 79853-64101
2
DCB Board Assembly, see
*
*
If installed in instruments with PSC -66509, then PSC must be updated to
79853-66512.
79853-69511 16 GPIB Board Assembly 79853-68711
2 ROM DCB Firmware C only 79853-13005 16 ROM GPIB Firmware 79853-13004
2 ROM DCB Firmware D only 79853-13000 Cable DCB-GPIB 79853-61610
3 PSC Board for DCB 79853-66511 79853-66512 17 Fan Assembly (LOW) 79853-68503
4 Cable PSC-DCB 79853-61605 18 Cover Fan 79853-04102
5 Cover PSC N.A. 19 Sheet Fan N.A.
6 Leak Sensor Board see page 687 20 Fan Assembly (HIGH) 79853-68502
7 Leak Sensor Assembly see page 687 21 Switch Bearing 79853-61903
8 Sheet Front Panel see page 687 22 Switch Bracket N.A.
9 Front Panel Assembly see page 687 23 Switch Shaft 79853-61901
10 Display Interface (KDI) 79853-66502 24 Switch Top 79853-61902
11 Display Module (VFD) 79853-66503 25 Cable DCB-KDI 79853-61609
12 Cable KDI-VFD 79853-61602 26 Optical Unit see page 688
13 STD Flow Cell Assembly see page 693
13 Semi-micro Flow Cell Assembly see page 695 Transport Screw Kit, contains 3
screws with washer and spacer
79853-68700
13 Ultra High Pressure Flow Cell
Assembly
see page 697 PEEK Inlet Tubing Kit 5062-8522
13 Prep Flow Cell Assembly TI see page 698 PEEK Waste Tubing Kit 5062-8535
14 Bracket DPS N.A.
Overall Diagram
Overall Diagram
Front Panel Parts
Front Panel Parts
Leak Interface
Table 177 Leak Interface
Description Part number
Leak Interface Kit, contains 79853-68731
Top, Bottom and Tubing
Top
Tubing
Bottom
Front Panel Parts
Font Panel
Figure 253 Front Panel
Table 178 Front Panel
# Description Part number
Front Panel Complete 79853-60203
Front Panel 79853-60202
1 Leak Sensor Board 79853-66510
2 Leak Sensor Assembly 79853-66111
3 Display Module Board (VFD) 79853-66503
4 Cable KDI-VFD 79853-61602
5 Display Interface (KDI) 79853-66502
6 Cable DCB-KDI 79853-61609
O-ring, Leak Assembly 79853-82501
Optical Unit C
Optical Unit C
The parts identification of the optical unit is splitted into four sections:
Optical Unit Inner Parts (Top)
Optical Unit Inner Parts (Bottom)
Grating Assembly
Filter Assembly
Flow Cell Assemblies
For complete optical unit C replacements use part number 79853-60015.
This upgrades to D version, see Part Numbers for Enhanced D Optical
Unit on page 709
Optical Unit C
Optical Unit C Inner Parts Top
Figure 254 Optical Unit C Inner Parts TOP
Table 179 Optical Unit C Inner Parts TOP
Optical Unit (complete assembly) 79853-69015 7 Grating Assembly see page 691
Plate Optical Top 79853-04108 8 Beam Splitter 79853-20402
1 Deuterium Lamp Assembly 79883-60002 9 Pre-Amplifier Board, SAMPLE 79853-66507
Lamp housing 79853-22006 10 Sensor, Sample 79853-61109
2 Filter Assembly see page 692 11 Pre-Amplifier Board, REF 79853-66508
3 Entrance Slit Assembly 79853-23103 12 Sensor, Reference 79853-61110
4 Mirror #1 79853-68107 Reference Slit 79853-23104
5 Mirror #2 79853-68108 Spacer Reference Sensor 79853-24702
6 Mirror #3 or #4 79853-68109 PTFE Ring 53C 79853-24500
Optical Unit C
Optical Unit C Inner Parts Bottom
Figure 255 Optical Unit C Inner Parts Bottom
Table 180 Optical Unit C Inner Parts Bottom
Optical Unit (comple assembly) 79853-60015 7 Filter Assembly see page 692
Plate Optical Base 79853-04109 7 Position Sensor Assembly, Filter 79853-61107
1 Optical Body N/A 8 Cable Assembly, Sample 79853-61607
2 Plate Sample Sensor 79853-04110 9 Cable Assembly, Reference 79853-61608
3 Position Sensor Assembly,
Grating
79853-61106 Spacer, Optical (metal foot) 79853-24701
4 Plate Reference Sensor 79853-04111 Insulator, Optical (rubber foot) 79853-85401
5 Spring #1, Grating 79853-29102 Foot Kit Optical 79853-22005
6 Grating Assembly see page 691
Grating Assembly
Grating Assembly
Figure 256 Grating Assembly
Table 181 Grating Assembly
1 Grating 79853-64605
Hex Screw M3 14 mm lg
2 Spring #2, Grating 79853-29103
3 Gasket
4 Grating Motor Assembly 79853-64606
5 Screws M3 6 mm long
Photo Sensor 79853-61106
Filter Assembly
Filter Assembly
Table 182 Filter Assembly
1 Filter Assembly 79853-67903
2 Lever Position Sensor
3 Position Sensor Filter 79853-61107
4 Screws M3 6 mm long
Standard Flow Cell C (SST/Ti)
NOTE The original STD flow cell 79853-60008 was replaced in June 1995 by the D
version 79853-60000. For parts ID refer to Standard Flow Cell D Repair
Parts on page 710.
Table 183 Standard Flow Cell C (SST/Ti)
Item Description Part Nmber Qty
1 Cell Screw 79853-27201
2 Conical Spring 10/pk 79853-27203 10
3 Ring 2/pk 79853-27202 2
4 Gasket #1 PTFE
5 Window Quartz
6 Gasket #2 PTFE
7 Gasket #3 PTFE
STD Flow Cell 8 mm SST see Note below
STD Flow Cell 8 mm Ti 79853-60011
PEEK Inlet Tubing Kit 5062-8522
Cell Kit STD, includes items 4 (2x), 5 (2x), 6
(1x) and 7 (1x)
79853-68718
5 Window Quartz Kit 79853-68719 2
4 Gasket #1 PTFE Kit STD 10/pk 79853-68720 10
Figure 258 Standard Flow Cell C (SST/Ti)
Semi-Micro Flow Cell (SST)
Semi-Micro Flow Cell (SST)
Figure 259 Semi-Micro Flow Cell (SST)
Table 184 Semi-Micro Flow Cell (SST/Ti)
1 Cell Screw (same as STD) 79853-27201
2 Conical Spring (same as STD) 79853-27203 10/pk
3 Ring (same as STD) 79853-27202 2/pk
4 Gasket #1 PTFE (same as STD) 10/pk 79853-68720 10/pk
5 Window Quartz (same as STD) 79853-68719 2/pk
6 Gasket #2 PTFE Micro 79853-68724 10/pk
Semi-Micro Flow Cell (complete) 79853-60010
PEEK Capillary 400 mm lg ID 0.12 mm 5021-1823
Fitting for PEEK capillary 0100-1516 2/pk
Cell Kit Micro, includes items 4 (2x), 5 (2x) and
6 (2x)
79853-68723
High Pressure Flow Cell (SST)
High Pressure Flow Cell (SST)
NOTE The gaskets, windows and rings are not compatible with the Ultra High
Pressure Cell (79853-600013) that replaced the high pressure flow cell
(79853-60009). For parts identification refer to Ultra High Pressure Flow Cell
(SST) on page 697.
Table 185 High Pressure Flow Cell (SST)
2 Ring POLYIMIDE
3 Window Quartz 79853-68740 2/pk
4 Gasket #1 POLYIMIDE 79853-68729 10/pk
5 Gasket #2 POLYIMIDE 79853-68730 5/pk
High Pressure Flow Cell SST replaced by UHP Cell,
see Ultra High
Pressure Flow Cell
(SST) on page 697
PEEK Tubing Assembly 5062-8522
Cell Kit HP, includes items 2 (2x), 3 (2x), 4 (2x)
and 5 (1x)
79853-68728
Ultra High Pressure Flow Cell (SST)
Ultra High Pressure Flow Cell (SST)
Figure 260 Ultra High Pressure Flow Cell (SST)
Table 186 Ultra High Pressure Flow Cell (SST)
1 Cell Screw 79853-27200
2 Ring PEEK UHP
3 Window Quartz Kit, UHP 79853-68734 2/pk
4 Gasket #1 POLYIMIDE Kit UHP 79853-68737 2/pk
5 Gasket #2 POLYIMIDE Kit UHP 79853-68738 2/pk
Ultra High Pressure Flow Cell SST 79853-60013
Cell Kit UHP, includes items 2 (1x), 3 (2x), 4
(2x) and 5 (2x)
79853-68733
Preparative Flow Cell (Ti)
Table 187 Preparative Flow Cell (Titanium)
2 Conical Spring (same as STD) 79853-27203 10/pk
3 Ring (same as STD) 79853-27202 2/pk
4 Gasket #1 PTFE (same as STD) 79853-68720 10/pk
5 Window #1 Quartz (same as STD) 79853-68719 2/pk
6 Gasket #2 PTFE (0.1) for 0.9 l
7 Window #2 Quartz
8 Gasket #3 PTFE
Preparative Flow Cell (complete) 79853-60012
Cell Kit PREP, includes items 4 (1x), 5 (1x),
6 (1 of each size), 7 (1x) and 8 (1x)
79853-68725
Window Quartz Kit PREP includes items 5 (1x),
7 (1x)
79853-68726
Gasket Kit PREP includes one of each size of
gasket #2
79853-68727
Figure 261 Preparative Flow Cell (Ti)
Cuvette Holder
Cuvette Holder
For informationon the use of the cuvette holder, refer to Using the Cuvette
Holder on page 658.
Figure 262 Cuvette Holder
Table 188 Control Module Parts
Item Description Part Number
Cuvette Holder 79853-60016
Accessories
Accessories
These parts are shipped with the 79853C VWD
Table 189 Accessories
Description Part number QTY
Manual Getting Ready 01050-90211 1
Cable Remote 5061-3378 1
PEEK Waste Accessory Kit 5062-8535 1
Standard Accessory Kit 79853-68701 1
includes
Fitting 0100-1516 1
Fuse 250 V 2A 2110-0002 3
Fuse 250 V 3A 2110-0003 3
Wrench 1/4-5/16 inch 8710-0510 1
Screwdriver POZI 1 PT 3 8710-0899 1
Leak Interface Kit 79853-68731 1
Manual SOP 79853-90009 1
Screws
Screws
Below table lists all screws within the instrument. They can be bought
locally, if needed.
Table 190 Screws
Location Size Length Type
filter motor M 2.3 4 mm lg hexagon socket set
screw with cup point
grating motor M 3 3 mm lg hexagon socket set
screw with cup point
mirror adjustment M 3 8 mm lg hexagon socket set
screw with dog point
grating adjustment M 3 14 mm lg hexagon socket cap
screw
grating motor M 3 4 mm lg countersink screw
to fix assemblies on the optical body; cover on
the DCB board; plate of lamp house; KDI and
VFD board; mirrors, filter and grating;
M 3 6 mm lg screw
position sensor M 3 6 mm lg screw with smaller
head
REF sensor plate M 3 10 mm lg screw
SAMP and REF amplifier boards M 3 18 mm lg screw
cover assembly; optical unit top cover; DCB
and GPIB boards from rear panel;
M 4 6 mm lg screw with lock
washer
to fix assemblies on the base; DCB abd GPIB
board; leak detector assembly; front panel
bracket; SAMP and REF covers; optical unit
bottom cover; blank screws of optical unit top
cover; plate for cell on the optical body;
M 4 5 mm lg screw
blank plate of cell; lock screws M 4 12 mm lg screw
Screws
All screws are plus-shaped type.
lamp house M 4 14 mm lg screw
fan assemblies M 4 35 mm lg screw
cell M 5 10 mm lg screw
Table 190 Screws
Location Size Length Type
Screws
31
31 VWD: Enhanced Optical Unit
Information
This chapter provides information about the
enhanced optical unit D
VWD: Enhanced Optical Unit
Information
Since June 1995, the design of the optical unit for the 79853C Variable
Wavelength Detector (VWD) was changed to improve its performance under
unstable temperature conditions.
Together with the enhanced optical unit (D), the standard flow cell was
changed (79853-60000).
NOTE In this document the term D is used for the new enhanced optical design and
C for the original optical design.
Compatibility
This new enhanced optical unit (D) is fully backward compatible with all
79853C VWDs shipped since January 1992.
The new standard flow cell (79853-60000) is backward compatible with the
C optical unit.
Some of the parts for the enhanced optical unit (D) are not usable in the C
version.
In case of replacing a C optical unit with an enhanced D optical unit, the
new standard flow cell is required.
Support of Previous Optical Units
The parts for the C optical unit will continue to be available as a repair part
as long as the 79853C is supported (08/2006). In case the complete C optical
must be replaced, use the D upgrade mentioned on Part Numbers for
Enhanced D Optical Unit on page 709.
VWD: Enhanced Optical Unit Information
Introduction
Introduction
To overcome wander problems due to temperature variations of the lab
environment, the optical unit of the 79853C Variable Wavelength Detector
(VWD) has been modified.
Following hardware modifications were implemented in June 1995:
different coupling of the lamp housing (lens between lamp housing and
optical casting).
area around mirror M1 and M2 has been redesigned to eliminate one
mirror - result is a mirror #1 assembly with a plane mirror.
redesigned entrance slit holder. Slits are changeable (standard/test).
beam splitter assembly no longer vertically adjustable.
reference slit assembly redesigned for better optimization.
new standard flow cell with different aperture material and different inlet
capillary.
Figure 263 Optical Path of Enhanced Optical Unit
new mirror #1
assembly
new lens assembly
new beam splitter
assembly
new reference slit
new entrance slit
assembly
new standard flow cell
Support Considerations
Support Considerations
Prefix Change
The enhanced Optical Unit (D version) was introduced in production units
in June 1995. Since the detector appears to look the same as before, a prefix
change was made. All units with prefix 3522 J 04305 and above have the
new optical installed.
NOTE Some units with a prefix lower than 3522 J 04305 have been installed on
customer sites prior to the official shipments.
Identification
Following identifications for the enhanced D version are available:
Prefix and serial number 3522 J 04305 and above (rear of instrument)
firmware revision 4.31 (press CTRL 12 ENTER ENTER DOWN)
label on the optical unit ENHANCED ILLUMINATION SYSTEM
handle of new reference slit looking out of the opticals cover plate (see
Figure 266 on page 715).
Compatibility Matrix
Due to a redesign, several components are usable in the enhanced D
version only. Refer to Table 191 on page 709 for details.
NOTE Both optical unit versions (C and D) can be operated with firmware
revision 4.24 (79853-13005). Due to the modifications, the photocurrent
readings are about 50% of those of the original C opticals. To make them
comparable the firmware for the enhanced D version got a new revision and
part number.
Part Numbers for Enhanced D Optical Unit
Part Numbers for Enhanced D Optical
Unit
NOTE The part numbers 79853-68110, -68111, -68112, -68113 and -64605 include
beside the test slit in addition a seal to close the hole for Mirror 4 adjustment
setscrew. Close the hole with this seal during replacements (see Figure 266 on
page 715 for the location).
Table 191 Enhanced D Version Part Numbers
Part Number Description Comments
79853-60000 Standard Flow Cell
backward compatible
*
, for details see Table 192 on page
710.
*
with C version optical units
79853-69014 Exchange D Optical
includes firmware 79853-13000
when D optical should be replaced,
needs Standard Flow Cell 79853-60000
79853-69015 Exchange D Optical
includes a Standard Flow Cell
79853-60000 and firmware 79853-13000
when C optical should be replaced
79853-68110 D Mirror 1 Assembly for D only, includes test slit
79853-68111 D Mirror 3/4 Assembly
backward compatible
**
, includes test slit
**
with C version optical units; part number 79853-68109 should only be used for 79853C optical until stock has expired.
79853-68112 D Beam Splitter for D only, includes test slit
79853-68113 D Lens Assembly for D only, includes test slit
79853-66508 Pre-amplifier Board REF from C used for SAMPLE and REFERENCE on D
79853-61109 Diode Sample from C used for SAMPLE and REFERENCE on D
79853-64605 Grating Assembly same part number as before, but test slit added
79853-13000 Firmware D rev 4.31 for D only, added also to
79853-69014/15 and 79853-69511 (DCB)
79853-68746 Slit Kit D Test slit plus STD slit
Standard Flow Cell D Repair Parts
Standard Flow Cell D Repair Parts
Figure 264 Standard Flow Cell D Repair Parts
Table 192 Standard Flow Cell D Repair Parts
Item Description Part Number
STD Flow Cell D, complete assembly 79853-60000
1 Cell Screw 79853-27200
Kits:
Cell Kit STD D, consists of: two windows, two gaskets #1,
one gasket #2 and one gasket #3.
79853-68741
2 Conical Spring D, Qty=10 79853-29100
3 Ring SST D, Qty=2 79853-22500
5 Window Quartz D, Qty=2 79853-68742
4 Gasket #1 D, PTFE, Qty=10 79853-68743
6 Gasket #2 D, Aperture, gold, Qty=5 79853-68744
7 Gasket #3 D, PTFE, Qty=5 79853-68745
5
1
2
3
4
5
6
7
1
2
3
4
Repair and Mainenance
Repair and Mainenance
WARNI NG These procedures need special knowledge on servicing the 79853C
VWD and should be done by trained Service Engineers only.
These procedures should be carried out in a room where the light can
be reduced.
Since the deuterium lamp emits intensive ultraviolet light, it is
dangerous to perform optical alignment without eye protection.
Tools required:
Test Slit (supplied with mirror or grating assembly)
Pozi Driv PT1
hexagonal wrench (1.5 mm)
hexagonal wrench (2.5 mm)
pair of tweezers (not too sharp points)
Pre-requisites:
Assure that the flow cell is clean, flushed with water and bubble free.
Remove detector from system.
Place the detector on a bench.
Remove the main cover.
Additional Information
Additional Information
For additional information about replacements and the use of the Service
control Functions refer to VWD: Maintenance Information on page 649
and Service Control Functions on page 622.
Replacements and Calibrations
The following procedures describe the replacements of parts separately.
NOTE It is important that only one assembly (mirror, grating, beam splitter, ...) is
changed and calibrated at a time. Otherwise you will lose correct optical
assembly alignment during the calibration process.
WARNI NG Do not remove the Entrance Slit Holder nor loosen it. Otherwise the
optical unit has to be exchanged completely.
NOTE The photocurrent readings with test slit installed are much lower than with
the standard slit.
Installing the Test Slit
The small diameter of the test slit allows a straight forward alignment of the
optical path. It enables the lamp image to be positioned optimally. This
ensures correct illumination of the Entrance Slit and the Reference Slit.
NOTE This procedure has to be carried out at the beginning of all replacement
procedures.
1 Turn on the detector and the lamp.
2 Set the wavelength to 250 nm.
3 Carefully remove the cover of the optical unit. Take care for the reference
aperture handle, see Figure 266 on page 715.
4 Remove the standard slit from the entrance slit holder using a pair of tweezers
and place it safe.
Figure 265 Replacing the Entrance Slit
entrance slit
assembly
entrance slit
mirror #1
assembly
test slit
5 Carefully insert the test slit (with round hole) into the entrance slit holder. The
slit must sit flat on the holder with the white side towards the incoming light.
Replacing Mirror #1 Assembly
Replacing Mirror #1 Assembly
1 Install the Test Slit, see Installing the Test Slit on page 713.
2 Remove mirror #1 assembly.
3 Install new Mirror #1 assembly.
NOTE DO NOT remove or change its position of adapter plate underneath the
mirror #1 assembly.
4 Position the lamp image onto the test slit hole:
- horizontally by rotating the mirror,
- vertically using the setscrew on the mirror.
5 Fix the mirror.
6 Install the Standard Slit and perform grating calibrations, see Installing the
Standard Slit on page 726.
7 Carefully replace the cover of the optical unit. Take care for the reference
aperture handle.
8 Reassemble the detector.
Figure 266 Handle of the Reference Aperture
handle of reference
aperture
hole / seal of Mirror #4 for
alignment
cover of optical unit
Replacing Mirror #3 or #4 Assembly
NOTE Replace and calibrate one mirror at a time.
1 Install the test slit, see Installing the Test Slit on page 713.
3 Execute CTRL 20: 0th CALIB.
4 Activate service function CTRL 40: 0TH TEST ON.
6 Unlock the reference aperture, Unlocking the Reference Aperture on page
723.
7 Center the reference slit on the white image by moving the aperture up or
down, see Figure 267. The image diameter is nearly equal to the reference slit
diameter.
Figure 267 Algning the Reference Slit
handle of reference
aperture
reference image
8 Install new mirror #3 or #4 assembly.
9 Position the white image precisely onto the reference slit:
- horizontally by rotating the mirror,
- vertically using the setscrew of the mirror
aperture handle.
11 De-activate CTRL 40: 0TH TEST OFF, press CLEAR, CLEAR and BALANCE.
12 Set =250 nm.
13 Activate CTRL 16: PHOTOCURRENT.
14 Optimize the sample readings using the setscrew of mirror #4 through the hole
in the optical unit cover, see Figure 266 on page 715.
15 Optimize the reference readings with the reference aperture, see Optimizing
the Reference Readings on page 725.
16 Install the standard slit and perform electronic calibrations, see Installing the
Replacing the Grating or Grating Motor
NOTE To replace the Grating and/or the Grating Motor refer to Replacing Grating
Assembly Parts on page 668 and continue with the Alignment Procedure
below.
6 Unlock the reference aperture, see Unlocking the Reference Aperture on
page 723.
7 De-activate CTRL 40: 0TH TEST OFF.
down. The image diameter is nearly equal to the reference slit diameter.
9 Remove the grating and reassemble new grating.
NOTE Assure that the grating is not fixed on the shaft with the setscrew.
10 Set the Param. =200, using service function CTRL 31: SET PARAM.
12 Turn the grating so that the center of the image is on the reference slit (a small
horizontal and vertical deviation can be accepted).
13 Fix the grating with the setscrew.
14 De-activate and re-activate CTRL 40: 0TH TEST and check the position of
the image on the reference slit.
If not correct, loosen the grating and repeat steps 12 to 14.
15 Do a vertical adjustment with Mirror #4 for precise vertical fit of image on
reference slit, using the setscrew of mirror #4 through the hole in the optical
unit cover, see Figure 266 on page 715.
aperture handle.
17 De-activate CTRL 40: 0TH TEST OFF, press [CLEAR], [CLEAR] and
[BALANCE].
19 Activate CTRL 40: 0TH TEST ON and readjust the Beam Splitter for ideal
horizontal fit.
20 De-activate CTRL 40: 0TH TEST OFF.
21 Set =250 nm.
23 Optimize the sample readings, using the setscrew of mirror #4 through the
hole in the optical unit cover, see Figure 266 on page 715.
page 723.
25 Optimize the reference readings with the reference slit, see Optimizing the
Reference Readings on page 725.
Replacing the Beam Splitter
Replacing the Beam Splitter
page 723.
down. The image diameter is nearly equal to the reference slit diameter.
7 Install the new beam splitter assembly.
8 Position horizontally the white image center of the beam splitter onto the
reference slit.
9 Fix the beam splitter after precise image fit.
10 Correct new vertical position with reference slit.
aperture handle.
12 De-activate CTRL 40: 0TH TEST OFF, press [CLEAR], [CLEAR] and
[BALANCE].
13 Set =250 nm.
15 Optimize the sample readings using the setscrew of mirror #4, using the
setscrew of mirror #4 through the hole in the optical unit cover, see Figure 266
on page 715.
16 Optimize the reference readings, see Optimizing the Reference Readings on
page 725.
Cleaning or Replacing the Lens
The lens is located between lamp housing and casting and can be cleaned or
replaced.
1 Turn the detector off.
2 Disconnect the lamp connector and all other connectors to the DCB board.
3 Remove the optical unit completely from the instrument.
4 Unscrew the four screws of the lamp housing and remove lamp housing.
Figure 268 Lens Assembly Location
NOTE For easier repositioning the lens ring is marked with color paint, see Figure
269 on page 722. The position of the marker could differ from instrument to
instrument and may be different to the position shown in the figure.
5 Remove, clean or replace the lens. If reusing old lens use markings for
repositioning.
location of lens assembly
casting of optical unit
lamp housing
with lamp
spring washer
lens assembly
Figure 269 Lens Position
NOTE The more plane lens side with smaller aperture faces towards the lamp.
NOTE If a new lens is installed, mirror #1 assembly has to be realigned after this
procedure, see Replacing Mirror #1 Assembly on page 715.
6 Reassemble the flat spring.
7 Replace the Lamp housing and tighten it.
marker
lens assembly
Unlocking the Reference Aperture
NOTE Only necessary, if required during a replacement procedure.
For performance reasons, the reference aperture is fixed by one screw only
and has to be unlocked prior to any replacement/calibration within the
optical unit.
1 Unscrew the front panel and place it in front of the detector to have access to
the reference pre-amplifier area.
NOTE When moving the front panel, assure that the keyboard cable is not partially
disconnected - damage to the electronics is possible.
2 Unscrew the right screw of the reference pre-amplifier cover and loosen the
left screw.
3 Turn the cover counter-clockwise until you can loosen the top screw of the
photo diode holder sheet.
Figure 270 Unlocking the Reference Slit
handle of reference
aperture
lock screw
reference diode assembly
4 Replace the reference pre-amplifier cover (to prevent stray light).
5 Fit the front panel with one screw at the right of the mainframe.
6 Turn on the detector and the lamp
7 Set wavelength to 250 nm.
8 Return to your replacement procedure.
Optimizing the Reference Readings
Optimizing the Reference Readings
aperture handle.
3 Shift reference aperture vertically for maximum reference readings.
4 Fix the reference slit with the top lock screw of the photo diode assembly.
5 Replace the reference photodiode cover.
6 Continue with the next step of the procedure of the assembly you are
replacing.
Figure 271 Optimizing the Reference Readings
handle of reference
aperture
lock screw
reference diode assembly
Installing the Standard Slit
Installing the Standard Slit
NOTE This procedure has to be carried out at the end of all replacement procedures.
2 Remove the test slit from the entrance slit holder using a pair of tweezers and
place it safe.
Figure 272 Replacing the Entrance Slit
3 Carefully insert the standard slit into the entrance slit holder. The slit must sit
plane on the holder.
6 Execute CTRL 21: l CALIBRATION.
entrance slit
assembly
test slit
mirror #1
assembly
standard slit
32
32 VWD: Additional Information
VWD: Additional Information
Since the introduction of the 79853C Variable Wavelength Detector in 1991,
the following hardware and firmware changes have been implemented.
Product History
Product History
Since introduction of the 79853C Variable Wavelength Detector in January
1992 following changes have been implemented.
Prefix Changes
Table 193 Prefix Changes
Serial Number Changes Additional Information
3145 J 00101 Start of customer shipments ∅
3152 J 00263 New amplification factor of reference
side due to high output of new DAD
lamps.
See Modified
Pre-Amplifier Gain on
page 734.
3152 J 00489 Introduction of DCB firmware revision
4.22
See SN 01050-055 on
page 734.
4.23
See SN 01050-055 on
page 734.
4.24
See SN 01050-055 on
page 734.
3225 J 01801 Introduction of PTFE ring in optical
unit
See SN 01050-068 on
page 734.
Volume changes on Preparative Flow
Cell in September 1992
See Table 138 on page
574 and Table 187 on
page 698.
3225 J 02011 Introduction of new DCB/PSC boards See SN 01050-072 on
page 734.
3323 J 03117 Introduction of new lamp housing
3334 J 03255 Change of manufacturing process for
photo diodes mounting
to improve stability
against humidity
Ultra High Pressure cell replaced High
Pressure Cell in 1993
Product History
3522 J 04305 Enhanced optical unit D with STD
flow cell D in June 1995
to improve temperature
stability, see VWD:
Enhanced Optical Unit
Information on page 705
Table 193 Prefix Changes
Serial Number Changes Additional Information
DCB ROM Firmware Revisions
Table 194 DCB ROM Firmware Revisions
4.08 Used for first internal
Waldbronn/Avondale units and some
demo units.
4.09 PHOENIX problem: wont stop when
running with A/D Concerter (for
example ABORT).
Not released.Used for internal
Waldbronn/Avondale tests.
4.21 CTRL 45 COMPENSATE bug fix,
calibrated wavelength deviation
might exceed the specification.
CTRL 22 HOLMIUMCHECK for GLP
reasons added.
Released for 79853C in January 1992.
For replacements use part number
79853-13005 (4.24).
NEEDS GPIB ROM version 0.20 or
above (79853-13004)
4.22 New algorithm for CTRL 45
COMPENSATE and CTRL 22
HOLMIUMCHECK.
Released for 79853C in March 1992.
Started with serial number
3152J00489.
79853-13005 (4.24).
above (79853-13004)
4.23 Removed bug: Incorrect wavelength
setting during stepper motor
intialisation bewteen 536.4 nm and
600 nm.
Released for 79853C in April 1992.
3217J00603.
79853-13005 (4.24).
above (79853-13004)
4.24 Removed bug : EEROM DATA LOST1
Removed bug : Wavelength accuracy
between 360 nm and 486 nm
Released for 79853C in June 1992.
3225J00773.
79853-13005 (4.24).
above (79853-13004)
4.31 For Enhanced Optical Unit D only Released for 79853C in June 1995.
3522J04305.
79853-13000 (4.31).
above (79853-13004)
Table 194 DCB ROM Firmware Revisions
GPIB ROM Firmware Revisions
GPIB ROM Firmware Revisions
The table below lists all GPIB ROM firmware revisions for the 79853A/C.
Table 195 GPIB ROM Revisions
0.04 First official realease for 79853A.
0.05 LC APPACK problem: BUFFER
OVERFLOW message preventing run
buffer overflow.
Released for 79853A.
0.08 Also useable for 79853C. PHOENIX
problem: prevents hang-ups at power
on (if VWD is switched on after
PHOENIX has been switched on).
Released for 79853A and 79853C.
79853-13004 (0.2X)
0.09 PHOENIX problem: prevents VECTRA
486 hang-ups.
NOT officially released.
0.20 additional changes for future
PHOENIX enhancements.
Released for 79853A and 79853C in
January 1992.
Required for 79853C firmware
revision 4.21 and above.
79853-13004 (0.2X)
Hardware Changes and Service Notes
Hardware Changes and Service Notes
Modified Pre-Amplifier Gain
First instruments where shipped with a pre-amplifier gain of 100% on the
reference side. The new deuterium lamps (79883-60002) showed sometimes
very high energies which gave very high numbers on the reference side
16:PHOTOCURRENT. To prevent an overload the amplification factor was
changed to 75%. The feedback resistors on the reference side changed from
200 MOhm to 150 MOhm and on the sample side from 100 MOhm to
75 MOhm.
NOTE No revision change was made. The modified pre-amplifiers started with serial
number 3145J00263.
Important Service Note
SN 01050-055 Service Note 1050-055 describes the introduction of the DCB firmware
revision 4.24 and the problems with previous revisions in more detail.
SN 01050-068 This note describes problems with POM ring between lamp housing and
optical casting. Exchange POM ring against PTFE Ring 53C (79853-24500).
SN 01050-072 This note describes problems with negative baseline jumps on analog output
signal. New DCB (79853-66511) and PSC (79853-66512) Boards have been
introduced.
SN 01050-085 This note describes the optimization for drift problems.
SN 01050-104 Introduction of Enhanced Optical Unit, see VWD: Enhanced Optical Unit
Information on page 705.
SN 01050-107 Cuvette Holder for Wavelength Verification with Certified Standard Solutions
available see Cuvette Holder on page 700.
SN 01050-112 Check of photometric accuracy - information on path lengths of flow cells,
see Correction factors for 79853C flow cells on page 575.
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