TDA7267A

3W MONO AMPLIFIER

CAN DELIVER 3W THD 10% 14.5V/8 INTERNAL FIXED GAIN 32dB NO FEEDBACK CAPACITOR NO BOUCHEROT CELL THERMAL PROTECTION AC SHORT CIRCUIT PROTECTION SVR CAPACITOR FOR BETTER RIPPLE REJECTION LOW TURN-ON/OFF POP STAND-BY MODE

PowerDIP 8+8

ORDERING NUMBER: TDA7267A

DESCRIPTION The device TDA7267A is a new technology Mono Audio Amplifier in PowerDIP package specifically designed for TV application. Thanks to the fully complementary output configuBLOCK DIAGRAM

ration the device delivers a rail to rail voltage swing without need of boostrap capacitors.

VS 1

VS=14.5V C4 100F

IN

C1 0.1F IN

+ -

C5 470F OUT 8

SVR

C3 47F S-GND

9 to 16 P-GND
D98AU827

June 1998

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TDA7267A
ABSOLUTE MAXIMUM RATINGS
Symbol VS IO Top Tj Tstg Operating Supply Voltage Output Put Peak Current Operating Temperature Range Junction Temperature Storage Temperature Range Parameter Value 18 1.5 0 to 70 150 -40 to 125 Unit V A C C C

PIN CONNECTION (Top view)

VS OUT SVR IN N.C. S-GND N.C. N.C.

1 2 3 4 5 6 7 8
D98AU829

16 15 14 13 12 11 10 9

P-GND P-GND P-GND P-GND P-GND P-GND P-GND P-GND

Rth with "on Board" Square Heat Sink vs. Copper Area
THERMAL RESISTANCE JUNCTION TO AMBIENT(C/W)
D98AU830

Example of heatsink using PC board copper

54 52 50 48 46 44 42 40 38 36 34 0 2 4 6 8 10 12
ON BOARD HEAT-SINK AREA (sq.cm)

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TDA7267A
THERMAL DATA
Symbol Rth j-amb Rth j-case Parameter Thermal Resistance Junction to ambient Thermal Resistance Junction to case Value 70 15 Unit C/W C/W

ELECTRICAL CHARACTERISTICS (Tamb = 25C; VS = 14.5V; RL = 8; f = 1KHz; unless otherwise specified.)

Symbol VS IS Isb VO AV RIN PO THD SVR EI Vsb Parameter Supply Voltage Range Quiescent Current Stand-By Current Quiescent Output Voltage Voltage Gain Input Impedance Output Power Distortion Supply Voltage Rejection Input Noise Voltage Stand-By Enable Voltage THD = 10% PO = 1W Vripple = 150mVrms; Fripple = 1KHz Rg = 10K; BW = 20Hz to 20KHz 31 50 2.7 100 3 0.1 50 5 10 1 0.3 Pin 3 shorted to GND 7.5 33 Test Condition Min. 5 23 Typ. Max. 18 35 0.3 Unit V mA mA V dB K W % dB V V

Figure 1. Application Circuit

VS 1 C1 0.1F IN SVR 4 2

VS=14.5V C4 100F C5 470F OUT

IN

3 6 9 to 16 S-GND P-GND

STAND-BY

C3 47F

D98AU828

APPLICATION HINTS: For 14.5V supply and 8 speaker application, its maximum power dissipation is about 1.8W. Assumming that max ambient temperature is 70C, the required thermal resistance of the device mounted on the PCB with a dissipating area

must be equal to: (150 - 70)/1.8 = 44.4C/W. Junction to pin thermal resistance of the package is about 15C/W. That means external heat sink of about 30C/W is required. Cu ground plane of PCB can be used as heat dissipating means.

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Figure 2. PCB And Components Layout Of The Application Circuit of Figure 1

Components C2 and C6 must be ignored.

Figure 3. Distortion vs Output Power

10 THD+N(%)

Figure 4. Distortion vs Output Power

10 THD+N(%)

f = 1KHz 0.1

0.1

f = 10KHz

0.010 0.1 Pout(W)

0.010 0.1

Pout(W)

Remark: all the characterization curves refer to the electrical test conditions.

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Figure 5. Distortion vs Output Power
10 THD+N(%)
10

Figure 6. Output Power vs Supply Voltage

Pout (W)

1
1

f = 1KHz THD=10% f = 1KHz THD= 1%

0.1

f = 15KHz

0.010 0.1

0.1 4.000

6.000

8.000

10.00

12.00 Vs(V)

14.00

16.00

18.00

20.00

Pout(W)

Figure 7. Distortion vs Frequency

THD(%) 10

Figure 8. Quiescent current vs Supply Voltage

Iq(mA)

30

25
1

20
Pout = 1W Vs = 14.5V Rl = 8 Ohm 0.1

15

10

0.010 100

5
1k f(Hz) 10k 20k

10 11 12 13 14 15 16 17 18
Vs(V)

Figure 9. Power dissipation vs Output Power

Pd(W)

1.9 1.8 1.7 1.6 1.5 1.4 1.3 Vs = 14.5V Rl = 8 Ohm F = 1KHz

0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Pout(W)

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TDA7267A
POWERDIP 8+8 PACKAGE MECHANICAL DATA
mm MIN. a1 B b b1 D E e e3 F I L Z 3.3 1.27 8.5 2.54 17.78 7.1 5.1 0.130 0.050 0.51 0.77 0.5 0.25 20 0.335 0.100 0.700 0.280 0.201 1.65 TYP. MAX. MIN. 0.020 0.030 0.020 0.010 0.787 0.065 inch TYP. MAX.

DIM.

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TDA7267A

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 1998 STMicroelectronics Printed in Italy All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

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